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Transcript of Manual Workshop
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 1
Jawahar Education Societys
A C Patil College of Engineering, Kharghar
Electronics Department
Electronics Workshop I
Lab Manual for SEM IV
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 2
Jawahar Education societys
A C Patil College of Engineering, Kharghar, Navi Mumbai
Electronics Department
ELECTRONICS WORKSHOP I
LIST OF EXPERIMENTS
Class: SE Sem: IV
1) Study of soldering techniques
2) Study of PCB techniques
3) Hardware project
a. Experiment based (BEC, ECAD, LICD, ENAS)
b. Application based (IC 741 Op-Amp, IC 555 Timer etc)
4) Software based project
a. Experiments/Application based DSD I & DSD II.
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 3
Experiment No 1
Aim :
To study the soldering techniques.
Objective :
To understand soldering techniques, components used for soldering.
Theory :
Soldering is a process in which two or more metal items are joined together by melting and
flowing a filler metal (solder) into the joint, the filler metal having a lower melting point than the
workpiece. Soldering differs from welding in that soldering does not involve melting the work
pieces. In brazing, the filler metal melts at a higher temperature, but the workpiece metal does
not melt. Formerly nearly all solders contained lead, but environmental concerns have
increasingly dictated use of lead-free alloys for electronics and plumbing purposes.
Origin:
There is evidence that soldering was employed up to 5000 years ago in MesopotamiaSoldering
and brazing are thought to have arisen very early in the history of metal-working, probably
before 4000 BCE. Sumerian swords from ~3000 BCE were assembled using hard soldering.
Soldering was historically used to make jewelry items, cooking ware and tools, as well as other
uses such as in assembling stained glass.
Applications:
Soldering is used in plumbing, in electronics and metalwork from flashing to jewelry.
Soldering provides reasonably permanent but reversible connections between copper pipes
in plumbing systems as well as joints in sheet metal objects such as food cans, roof flashing, rain
gutters and automobile radiators.
Jewelry components, machine tools and some refrigeration and plumbing components are often
assembled and repaired by the higher temperature silver soldering process. Small mechanical
parts are often soldered or brazed as well. Soldering is also used to join lead came and copper
foil in stained glass work. It can also be used as a semi-permanent patch for a leak in a container
or cooking vessel.
Electronic soldering connects electrical wiring and electronic components to printed circuit
boards (PCBs).
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 4
Components used for Soldering:
1. Solder
2. Solder gun
3. Flux
1. Solder
Solder is a fusible metal alloyused to join together metal workpieces and having a melting point
below that of the workpiece
Soft solder is typically thought of when solder or soldering is mentioned, with a typical melting
range of 90 to 450 C (190 to 840 F It is commonly used inelectronics and plumbing, and when
manually applied is often done so using a soldering ironor soldering gun. Alloys that melt
between 180 and 190 C (360 and 370 F) are the most commonly used. Soldering performed
using alloys with melting point above 450 C (840 F)is called 'hard soldering', 'silver soldering',
or brazing.
For certain proportions an alloy becomes eutectic and melts at a single temperature; non-eutectic
alloys have markedly different solidus and liquidus temperature, and within that range they exist
as a paste of solid particles in a melt of the lower-melting phase. In electrical work, if the joint is
disturbed in the pasty state before it has solidified totally, a poor electrical connection may result;
use of eutectic solder reduces this problem. The pasty state of a non-eutectic solder can be
exploited in plumbing as it allows molding of the solder during cooling, e.g. for ensuring
watertight joint of pipes, resulting in a so-called 'wiped joint'.
For electrical and electronics work solder wire is available in a range of thicknesses for hand-
soldering, and with cores containing flux. It is also available as a paste or as a preformed foil
shaped to match the workpiece, more suitable for mechanized mass-production. Alloys of lead
and tin were universally used in the past, and are still available; they are particularly convenient
for hand-soldering. Lead-free solder, somewhat less convenient for hand-soldering, is often used
to avoid the environmental effect of lead.
Plumbers often use bars of solder, much thicker than the wire used for electrical
applications. Jewelers often use solder in thin sheets which they cut into snippets.
With the reduction of the size of circuit board features, the size of interconnects shrinks as well.
Current densities above 104 A/cm
2 are often achieved and electromigration becomes a concern.
At such current densities the Sn63Pb37 solder balls form hillocks on the anode side and voids on
the cathode side; the increased content of lead on the anode side suggests lead is the primary
migrating species.
Types of Solders
1.1 Lead Solder:
1.2 Lead free solder
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 5
1.3 Flux core solder
1.4 Hard Solder
1.1 Lead solder :
Tin/lead solders, also called soft solders, are commercially available with tin concentrations
between 5% and 70% by weight.
solder
The greater the tin concentration, the greater the solderstensile and shear strengths. Alloys
commonly used for electrical soldering are 60/40 Tin/lead (Sn/Pb) which melts at 370 F or
188 C and 63/37 Sn/Pb used principally in electrical/electronic work. The 63/37 is
a eutectic alloy, which:
1. has the lowest melting point (183 C or 361.4 F) of all the tin/lead alloys; and
2. the melting point is truly a point not a range.
In plumbing, a higher proportion of lead was used, commonly 50/50. This had the advantage of
making the alloy solidify more slowly, so that it could be wiped over the joint to ensure
watertightness, the pipes being physically fitted together before soldering. Although lead water
pipes were displaced by copper when the significance of lead poisoning began to be fully
appreciated, lead solder was still used until the 1980s because it was thought that the amount of
lead that could leach into water from the solder was negligible from a properly soldered joint.
The electrochemical couple of copper and lead promotes corrosion of the lead and tin, however
tin is protected by insoluble oxide. Since even small amounts of lead have been found
detrimental to health,Lead in plumbing solder was replaced by silver (food grade applications)
or antimony, with copper often added, and the proportion of tin was increased The addition of
tinmore expensive than leadimproves wetting properties of the alloy; lead itself has poor
wetting characteristics. High-tin tin-lead alloys have limited use as the workability range can be
provided by a cheaper high-lead alloy.
In electronics, components on printed circuit boards (PCBs) are connected to the printed circuit,
and hence to other components, by soldered joints. For miniaturized PCB joints with surface
mount components, solder paste has largely replaced solid solder.
Lead-tin solders readily dissolve gold plating and form brittle intermetallics
Sn60Pb40 solder oxidizes on the surface, forming a complex 4-layer structure: tin(IV) oxide on
the surface, below it a layer of tin(II) oxide with finely dispersed lead, followed by a layer of
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 6
tin(II) oxide with finely dispersed tin and lead, and the solder alloy itself underneath. Lead, and
to some degree tin, as used in solder contains small but significant amounts
of radioisotope impurities. Radioisotopes undergoing alpha decay are a concern due to their
tendency to cause soft errors. Polonium-210 is especially problematic; lead-210beta
decays to bismuth-210 which then beta decays to polonium-210, an intense emitter of alpha
particles. Uranium-238 and thorium-232 are other significant contaminants of alloys of lead
1.2 Lead Free Solder:
Pure tin solder wire
Soldering copper pipes using a propane torch and lead-free solder
. Lead-free solders in commercial use may contain tin, copper, silver, bismuth,indium, zinc,
antimony, and traces of other metals. Most lead-free replacements for conventional Sn60/Pb40
and Sn63/Pb37 solder have melting points from 5 to 20 C higher, though solders with much
lower melting points are available.
Drop-in replacements for silkscreen with solder paste soldering operations are available. Minor
modification to the solder pots (e.g. titanium liners or impellers) used in wave-soldering
operations may be desired to reduce maintenance costs associated with the increased tin-
scavenging effects of high tin solders. Since the properties of lead-free solders are not as
thoroughly known, they may therefore be considered less desirable for critical applications, like
certain aerospace or medical projects. "Tin whiskers" were a problem with early electronic
solders, and lead was initially added to the alloy in part to eliminate them.
(Tin-Silver-Copper) solders are used by two thirds of Japanese manufacturers for reflow
and wave soldering, and by about 75% of companies for hand soldering. The widespread use of
this popular lead-free solder alloy family is based on the reduced melting point of the Sn-Ag-Cu
ternary eutectic behavior (217 C), which is below the Sn-3.5Ag (wt.%) eutectic of 221 C and
the Sn-0.7Cu eutectic of 227 C (recently revised by P. Snugovsky to Sn-0.9Cu). The ternary
eutectic behavior of Sn-Ag-Cu and its application for electronics assembly was discovered (and
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 7
patented) by a team of researchers from Ames Laboratory, Iowa State University, and
from Sandia National Laboratories-Albuquerque.
Tin-based solders readily dissolve gold, forming brittle intermetallics; for Sn-Pb alloys the
critical concentration of gold to embrittle the joint is about 4%. Indium-rich solders (usually
indium-lead) are more suitable for soldering thicker gold layer as the dissolution rate of gold in
indium is much slower. Tin-rich solders also readily dissolve silver; for soldering silver
metallization or surfaces, alloys with addition of silvers are suitable; tin-free alloys are also a
choice, though their wettability is poorer. If the soldering time is long enough to form the
intermetallics, the tin surface of a joint soldered to gold is very dull.
1.3 Flux Core Solder:
Electrical solder with an integrated rosin core, visible as a dark spot in the cut end of the solder
wire.
Flux is a reducing agent designed to help reduce (return oxidized metals to their metallic state)
metal oxides at the points of contact to improve the electrical connection and mechanical
strength. The two principal types of flux are acid flux, used for metal mending and plumbing,
and rosin flux, used in electronics, where the corrosiveness of acid flux and vapors released
when solder is heated would risk damaging delicate circuitry.
Due to concerns over atmospheric pollution and hazardous waste disposal, the electronics
industry has been gradually shifting from rosin flux to water-soluble flux, which can be removed
with deionized water and detergent, instead of hydrocarbon solvents.
In contrast to using traditional bars or coiled wires of all-metal solder and manually applying
flux to the parts being joined, some light hand soldering since the mid-20th century has used
flux-core solder. This is manufactured as a coiled wire of solder, with one or more continuous
bodies of non-acid flux embedded lengthwise inside it. As the solder melts onto the joint, it frees
the flux and releases that on it as well.
1.4 Hard Solder:
Hard solders are used for brazing, and melt at higher temperatures. Alloys of copper with
either zinc or silver are the most common.
In silversmithing or jewelry making, special hard solders are used that will pass away assay.
They contain a high proportion of the metal being soldered and lead is not used in these alloys.
These solders vary in hardness, designated as "enameling", "hard", "medium" and
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 8
"easy". Enameling solder has a high melting point, close to that of the material itself, to prevent
the joint desolderingduring firing in the enameling process. The remaining solder types are used
in decreasing order of hardness during the process of making an item, to prevent a previously
soldered seam or joint desoldering while additional sites are soldered. Easy solder is also often
used for repair work for the same reason. Flux or rouge is also used to prevent joints from
desoldering.
Silver solder is also used in manufacturing to join metal parts that cannot be welded. The alloys
used for these purposes contain a high proportion of silver (up to 40%), and may also
contain cadmium.
2. Soldering iron
A soldering iron is a hand tool used in soldering. It supplies heat to melt the solder so that it can
flow into the joint between two workpieces.
A soldering iron is composed of a heated metal tip and an insulated handle. Heating is often
achieved electrically, by passing an electric current (supplied through an electrical cord or
battery cables) through a resistive heating element. Portable irons can be heated by combustion
of gas stored in a small tank, often using a catalytic heater rather than a flame. Simple irons less
commonly used than in the past were simply a large copper bit on a handle, heated in a flame.
Soldering irons are most often used for installation, repairs, and limited production work in
electronics assembly. High-volume production lines use other soldering methods.[1]
Large irons
may be used for soldering joints in sheet metal objects. Less common uses
includepyrography (burning designs into wood) and plastic welding.
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 9
Types
Soldering iron in use
2.1 Simple iron
For electrical and electronics work, a low-power iron, a power rating between 15 and 35 watts, is
used. Higher ratings are available, but do not run at higher temperature; instead there is more
heat available for making soldered connections to things with large thermal capacity, for
example, a metal chassis. Some irons are temperature-controlled, running at a fixed temperature
in the same way as a soldering station, with higher power available for joints with large heat
capacity. Simple irons run at an uncontrolled temperature determined by thermal equilibrium;
when heating something large their temperature drops a little, possibly too much to melt solder.
2.2 Portable iron
Small irons heated by a battery, or by combustion of a gas such as butane in a small self-
contained tank, can be used when electricity is unavailable or cordless operation is required. The
operating temperature of these irons is not regulated directly; gas irons may change power by
adjusting gas flow.
2.3 Temperature-controlled soldering iron
Simple irons reach a temperature determined by thermal equilibrium, dependent upon power
input and cooling by the environment and the materials it comes into contact with. The iron
temperature will drop when in contact with a large mass of metal such as a chassis; a small iron
will lose too much temperature to solder a large connection. More advanced irons for use in
electronics have a mechanism with a temperature sensor and method of temperature control to
keep the tip temperature steady; more power is available if a connection is large. Temperature-
controlled irons may be free-standing, or may comprise a head with heating element and tip,
controlled by a base called a soldering station, with control circuitry and temperature adjustment
and sometimes display.
A variety of means are used to control temperature. The simplest of these is a variable power
control, much like a light dimmer, which changes the equilibrium temperature of the iron without
automatically measuring or regulating the temperature. Another type of system uses a thermostat,
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 10
often inside the iron's tip, which automatically switches power on and off to the element. A
thermal sensor such as a thermocouple may be used in conjunction with circuitry to monitor the
temperature of the tip and adjust power delivered to the heating element to maintain a desired
temperature.
Another approach is to use magnetized soldering tips which lose their magnetic properties at a
specific temperature, the Curie point. As long as the tip is magnetic, it closes a switch to supply
power to the heating element. When it exceeds the design temperature it opens the contacts,
cooling until the temperature drops enough to restore magnetisation. More complex Curie-point
irons circulate a high-frequency AC current through the tip, using magnetic physics to direct
heating only where the surface of the tip drops below the Curie point
3. Soldering Gun
A soldering gun is an approximately pistol-shaped tool for soldering metals using tin-
based solder to achieve a strong mechanical bond with good electrical contact. The tool has a
trigger-style switch so it can be easily operated with one hand. The body of the tool contains a
transformer with a primary winding connected to mains electricity when the trigger is pressed,
and a single-turn secondary winding of thick copper with very low resistance. A soldering tip,
made of a loop of thinner copper wire, is secured to the end of the transformer secondary by
screws, completing the secondary circuit. When the primary of the transformer is energized,
several hundred amperes of current flow through the secondary and very rapidly heat the copper
tip. Since the tip has a much higher resistance than the rest of the tubular copper winding, the tip
gets very hot while the remainder of the secondary warms much less. A tap on the primary
winding is often used to light a pilot lamp which also lights the workpiece.
The soldering gun is useful when soldered joints must be made intermittently. A constant-heat
device has to be set in a safe place when powered but not actually in use, to prevent damage or
injury. The fast-switching gun cools quickly enough to be set down a few seconds after use.
4. Flux:
Rosin Used As Flux For Soldering
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 11
The purpose of flux is to facilitate the soldering process. One of the obstacles to a successful
solder joint is an impurity at the site of the joint, for example, dirt, oil or oxidation. The
impurities can be removed by mechanical cleaning or by chemical means, but the elevated
temperatures required to melt the filler metal (the solder) encourages the work piece (and the
solder) to re-oxidize. This effect is accelerated as the soldering temperatures increase and can
completely prevent the solder from joining to the workpiece. One of the earliest forms of flux
was charcoal, which acts as a reducing agent and helps prevent oxidation during the soldering
process. Some fluxes go beyond the simple prevention of oxidation and also provide some form
of chemical cleaning (corrosion).
For many years, the most common type of flux used in electronics (soft soldering) was rosin-
based, using the rosin from selected pine trees. It was ideal in that it was non-corrosive and non-
conductive at normal temperatures but became mildly reactive (corrosive) at the elevated
soldering temperatures. Plumbing and automotive applications, among others, typically use an
acid-based (muriatic acid) flux which provides cleaning of the joint. These fluxes cannot be used
in electronics because they are conductive and because they will eventually dissolve the small
diameter wires. Many fluxes also act as a wetting agent in the soldering process, reducing
the surface tension of the molten solder and causing it to flow and wet the workpieces more
easily.
Fluxes for soft solder are currently available in three basic formulations:
1. Water-soluble fluxes - higher activity fluxes designed to be removed with water after
soldering (no VOCs required for removal).
2. No-clean fluxes - mild enough to not "require" removal due to their non-conductive and
non-corrosive residue. These fluxes are called "no-clean" because the residue left after
the solder operation is non-conductive and won't cause electrical shorts; nevertheless
they leave a plainly visible white residue that resembles diluted bird-droppings. Because
discernible flux residue on circuit boards is a defect for all three classes of electronic
circuit boards (ranging from cheap consumer electronics to high-reliability, mission
critical applications), this application requires cleaning of these fluxes as well. (Typically
brushing with 99% isopropyl alcohol as the solvent and wiping with lint-free non-
synthetic (e.g., cotton) wipes.)
3. Traditional rosin fluxes - available in non-activated (R), mildly activated (RMA) and
activated (RA) formulations. RA and RMA fluxes contain rosin combined with an
activating agent, typically an acid, which increases the wettability of metals to which it is
applied by removing existing oxides. The residue resulting from the use of RA flux
is corrosive and must be cleaned. RMA flux is formulated to result in a residue which is
not significantly corrosive, with cleaning being preferred but optional.
Flux performance needs to be carefully evaluated; a very mild 'no-clean' flux might be perfectly
acceptable for production equipment, but not give adequate performance for a poorly controlled
hand-soldering operation.
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 12
Experiment No 2
Aim :
Study of PCB techniques.
Objective :
To understand different type of techniques and how to make PCB
Theory:
A printed circuit board, or PCB, is used to mechanically support and electrically
connect electronic components using conductive pathways, tracks or signal
traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to
as printed wiring board(PWB) or etched wiring board. Printed circuit boards are used in virtually
all but the simplest commercially produced electronic devices.
A PCB populated with electronic components is called a printed circuit assembly (PCA), printed
circuit board assembly or PCB Assembly(PCBA)
Types of Printed Circuit Boards
Single Sided Board
This is the least complex of the Printed Circuit Boards, since there is only a single layer of
substrate. All electrical parts and components are fixed on one side and copper traces are on the
other side. Single-sided PCB means that wiring is available only on one side of the insulating
substrate. The side which contains the circuit pattern is called the solder side whereas the other
side is called the component side. These types of boards are mostly used in case of simple
circuitry and where the manufacturing costs are to be kept at a minimum. Nevertheless, they
represent a large volume of printed boards currently produced for professional and non-
professional grades.
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 13
The single-sided boards are manufactured mostly by the print and etch method or by the diecut
technique by using a die that carries an image of the wiring pattern; and the die is either
photoengraved or machine-engraved. Normally, components are used to jump over conductor
tracks, but if this is not possible, jumper wires are used. The number of jumper wires on a board
cannot be accepted beyond a small number because of economic reasons, resulting in the
requirement for double-sided boards.
Double Sided Board
This is the most common type of board, where parts and components are attached to both sides
of the substrate. In such cases, double-sided PCBs that have connecting traces on both the sides
are used. Double-sided Printed Circuit Boards usually use through-hole construction for
assembly of components.
With two-sided boards, traces can now cross over each other, increasing density without point-
to-point soldering.
The Double Sided Printed Circuit Board that we offer are individual PCB that are stepped up
onto a bigger panel, tooled with fiducial marks to assist assembly and and are bridged (using
break out pips) or scored so boards can be freed from the panel. It allows many PCB to be
manufactured at once and also means many PCB can be assembled together that reduces the
process time
The double sided printed circuit boards are available in various technical specifications and some
of them are:
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 14
Hot air solder leveling tin lead
Companies exempt from rohs regulations
Electro less nickel
Immersion gold
Immersion tin
Surface coatings
Photo image able solder resist in various colors (green, red, blue)
Various colors (white, black, yellow)
Component notation (silk screen legend) two pack epoxy ink
Multi Layered Board
Multi layered PCB consists of several layers of substrate separated by insulation. Most common
multilayer boards are: 4 layers, 6 layers, 8 layers, and 10 layers. However, the total number of
layers that can be manufactured can exceed over 42 layers. These types of boards are used in
extremely complex electronic circuits.
To increase the area available for the wiring even more these boards have one or more conductor
pattern inside the board. This is achieved by gluing (laminating) several double-sided boards
together with insulating layers in between. The number of layers is referred to as the number of
separate conductor patterns. It is usually even and includes the two outer layers. Most main
boards have between 4 and 8 layers, but PCBs with almost 100 layers can be made. Large super
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 15
computers often contain boards with extremely many layers, but since it is becoming more
efficient to replace such computers with clusters of ordinary PCs, PCBs with a very high layer
count are less and less used. Since the layers in a PCB are laminated together it is often difficult
to actually tell how many there are, but if you inspect the side of the board closely you might be
able count them.
The vias described in the section about double-sided PCBs always penetrate the whole board.
When there are multiple layers of conductor patterns, and you only want to connect some of
them, such vias waste space that could be used to route other wires. 'Buried ' and 'Blind ' vias
avoid this problem because they only penetrate as many layers as necessary. Blind vias connect
one or more of the inner layers with one of the surface layers without penetrating the whole
board. Buried vias only connect inner layers. It is therefore not possible so see such vias by just
looking at the surface of the PCB.In multi-layer PCBs whole layers are almost always dedicated
to Ground and Power. We therefore classify the layers as Signal, Power or Ground planes.
Sometimes there is more than one of both Power and Ground planes, especially if the different
components on the PCB require different supply voltages.
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 16
PCB MANUFACTURING PROCESS:
INSTRUCTION:
Use clamper for handling PCB in the lab as etching solution is dangerous to skin.
1) Get the printout of the artwork on transparent sheet that is artwork film.
2) Clean the copper side of the PCB uing steel wool.
3) Use dip coationg machine:
a. Place the PCB in the clamper attached to the machine and dip the PCB in
photoresist using up/down switch.
4) Use of Oven:
a. Place the PCB in the oven at 50oC for 5 minutes to dry.
5) Use of ultraviolet exposure unit:
a. Place the artwork film inside (front side downward) and copper side of PCB
downward above the film.
b. Expose PCB to UV exposure for 2.5 minutes.
6) Using the clamper place the PCB in the developer for 1.25 minutes and wash the PCB
with water.
7) Dip the PCB into the photoresist dye solution to get the coloured tracks.
8) Wash the PCB with water and and clean the PCB using steel wool.
9) Use of shearing machine:
a. Use the shearing machine to cut the unwanted PCB
10) Use of drilling:
a. PCB is ready for drilling.(1mm for components)
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 17
PCB Making Procedure
Students are required to follow steps for making PCB layout.
Step 1) Make neat and complete circuit diagram of the project .
Use any circuit maker otherwise use LiveWire .
For example
Inverting Amplifier :
Figure shows the circuit diagram of Inverting Amplifier using 741op-amp.
Step 2) To get the print of layout on PCB follow the steps given below:
a. Open your complete circuit diagram in Livewire software which helps us to get the layout for
PCB.
b. Then on the GUI(front panel) of Live wire software go to Tools then click on the option
convert to Design to Printed Circuit Board. As shown in the figure below.
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Electronics Workshop I/ Lab Manual/ SEM IV Page 18
C. Here Click on option as shown in above figure and then click on Next button.
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A C Patil College of Engineering, Kharghar, Electronics Department
Electronics Workshop I/ Lab Manual/ SEM IV Page 19
d. After doing above procedure the other software called PCB Wizard will get open
automatically
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Electronics Workshop I/ Lab Manual/ SEM IV Page 20
If you are able to get above message on PCB Wizard software , then circuit layout is completed and
correct.
Real World
Unpopulated
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Electronics Workshop I/ Lab Manual/ SEM IV Page 21
Solder Side Artwork
Finally after making PCB mount your components and solder it carefully.
Then do testing and see the result.
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