MAF Communication Specification
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Transcript of MAF Communication Specification
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
Specification number:
MAF(AC)-C02
The date: April 4, 2006
Communication specifications
At the
deliverydestinationDevicename
Aligner
Modelname
MAF-AMAF-C
This document was accepted.
Date of acceptance Receipt stamp
Date
Please send back a part of this specifications after it stamps it at once after it accepts.
Tatsmo Ltd.
System equipment
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
Specification number:
MAF(AC)-C02
Approval
Examination
Making Business
A.RS-485 communication command content explanation1.Link communication specification
(1)Interface RS485(2)Connected method Half duplex multi-drop connection(16 or
less)(3)Synchronize system Start-stop synchronization
(4)Transmission rate9600bps 19200bps 38400bps 57600bps
(5)Data form One start bitEight data bitNo parityOne stop bit
(6)Communication code ASCII 7 bit code(7)Body number(address) 0 F(The hexadecimal number and the 0th are thecontrol stations. )
2.Transmission control character(1)EOT(End of Transmission) Transmission end(04H)
A (2)ENQ(Enquiry) Inquiry(05H)
(3)ACK(Acknowledge) Positive response(06H)
B (4)NAK(Negative Acknowledge) Negative response(15H)
(5)STX(Start of Text) Text beginning(02H)
C (6)ETX(End of Text) Text conclusion(03H)
3.Communication protocol1 Data transmission control procedure(phase)
Phase 1 Connection of data transmission line(regulations and off
the subject)Phase 2 Establishment of data linkPhase 3 Transmission of informationPhase 4 ConclusionPhase 5 Cutting of line(regulations and off the subject)
(2)Polling procedurePolling is operation that the control station regularly solicits the transmission ofthe message to the tributary station by one game to prevent the right tobecome a master station being fought.(procedure 1) Data link initialization(procedure 2) The polling sequence is transmitted. (phase 2)
(procedure 3) Data transfer(phase 3)(procedure 4) End of data transmission
Transmission of all data end
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
Mistake of data form etc.(procedure 5) No response of master station
After time of the time-out, the control station is a conclusion of the datalink.(procedure 6) Conclusion of data link(phase 4)
When it wants to discontinue communicating or you want to concludethe data link
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
Figure 1. Polling procedure
(3)Selecting procedureSelecting means Control station..plural..bureau..informationmessage..receive..solicit..operation.Farstoserecting is adopted for Selecting.
(procedure 1) Initialization of data link(procedure 2) Transmission of selecting sequence(phase 2)(procedure 3) Data transmission(procedure 4) Positive response(phase 3)(procedure 5) Negative response
Abnormality of data form etc.
(procedure 6) No responseAfter time of the time-out, the master station is a conclusion of the data
link.(procedure 7) Conclusion of data link(phase 4)
Figure 2. Selecting procedure
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ADD : CMD :
( 2 )( 1 )
< ADD> [ ENQ ][ EO T ] [ EO T ] ( 5 )
( 6 )
[E O T ]
( 4 )
[ S T X ]< CMD>< D A T A> [ E T X ]
( 3 )
( )
( 1 )
[ EO T ]
ADD : CMD :
[ S T X ]< CMD> [ E T X ]
( 3 )
( 7 )
[ EO T ]( 6 )
( 5 )
( 4 )[ AC K ]
[N AK ]
( 2 )
< A D D >
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
4.Command listNo. Comm
andSummary
1 CPI Reset of CPU2 RST Initialization of Aligner3 PAU Temporary stop4 CNT Temporary stop release5 VVN Aligner chuck vacuum ON6 VVF Aligner chuck vacuum OFF7 NYG It moves to the wafer specification position.8 ALG Alignment execution(After it samples it, move to a
specified position and a specified angle. )9 OCH The wafer is moved to a specified position and a specified
angle. (It is effective only after alignment is executed. )10 DEF Set of default data value11 ERF Release of error12 STS Demand of status
13 WCH Reading of wafer existence(Electromagnetic valveoperation and exist. )14 VCH Reading of wafer existence(There is no electromagnetic
valve operation. )15 RWF Reading of wafer size(It is effective only after the ALG
command is executed. )16 VER Reading of soft version17 RRG Reading of motor control IC and lead register18 DWL Setting of parameter setting value19 UPL Reading of parameter setting value20 RER Reading of error log21 CER Clearness of error log
22 REV Setting of alignment correction value (offset value)23 RRE Reading of alignment correction value (offset value)24 PNO Reading of Aligner software product No.25 TRN Low speed one-wafer rotation26 ADM Reading of alignment execution frequency27 ALS Alignment execution(It is movement, and vacuum OFF in
vacuum ON, sampling, and a specified position and aspecified angle. )
28 RXY Chuck XY positional reading29 SLM Setting of wafer eccentric amount limit value30 RLM Reading of wafer eccentric amount limit value
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5.Command details explanation
D (1)CPI
Sum
mary
CPU is reset.
Example
(host) (Aligner)[STX]CPI[ETX]
[ACK]
Rema
rks
After ACK is transmitted, CPU is reset.
Please do not transmit the command between 1(sec) after receiving ACK.
E (2)RST
Sum
mary
Aligner is initialized.
Exam
ple
(host) (Aligner)
[STX]RST[ETX][ACK]
Rema
rks
After ACK is transmitted, Aligner is initialized.
(3)PAU
Sum
mary
Aligner is put into the state of the temporary stop.
Exam
ple
(host) (Aligner)
[STX]PAU[ETX][ACK]
Rema
rks
It enters the state of the temporary stop after ACK is transmitted.
(4)CNT
Sum
mary
The temporary stop of Aligner is released.
Exam
ple
(host) (Aligner)
[STX]CNT[ETX][ACK]
Rema
rks
After ACK is transmitted, the temporary stop is released.
(5)VVN
Sum
mary
The vacuum of Aligner chuck is turned on.
Exam
ple
(host) (Aligner)
[STX]VVN[ETX][ACK]
Rema After ACK is transmitted, the vacuum of Aligner chuck is pulled.
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rks
(6)VVF
Sum
mary
The vacuum of Aligner chuck is turned off.
Exam
ple
(host) (Aligner)
[STX]VVF[ETX]
[ACK]
Rema
rks
After ACK is transmitted, the vacuum of Aligner chuck is stopped.
(7)NYG
Sum
mary
Aligner chuck is moved to a specified position.
Exam
ple
(host) (Aligner)
[STX]NYG,*[ETX]
[ACK]
Rema
rks
After ACK is transmitted, Aligner chuck is moved to a specified position.
RST" After the command is executed, the command is accepted.
* :Specified number(18)
(8)ALG
Summary
Alignment is executed. (After it samples it, move to a specified position and aspecified angle. )
Exam
ple
(host) (Aligner)
[STX]ALG,*[ETX]
[ACK]
Rema
rks
After ACK is transmitted, alignment is executed.
RST" After the command is executed, the command is accepted.
* :Specified number(18)
(9)OCH
Sum
mary
The wafer is moved to a specified position and a specified angle.
Exam
ple
(host) (Aligner)
[STX]OCH,*[ETX]
[ACK]
Rema
rks
After ACK is transmitted, the wafer is rotated to a specified angle.
ALG" After the command is executed, the command is accepted.
* :Specified number(18)
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(10)DEF
Sum
mary
Each parameter is set to the default data.
Exam
ple
(host) (Aligner)
[STX]DEF[ETX]
[ACK]
Rema
rks
After ACK is transmitted, it sets it to the default data.
The stop position data, the speed data, and the axis rotation correction data
are initialized.
(11)ERF
Sum
mary
Aligner error is released.
Exam
ple
(host) (Aligner)
[STX]ERF[ETX] [ACK]
Rema
rks
After ACK is transmitted, Aligner error is released.
(12)STS
Sum
mary
The status of Aligner is read.
Exam
ple
(host) (Aligner)
STS[ENQ]
[STX]STS,***[ETX]
Rema
rks
***:The state of operation and refer to the status following table.
(13)WCH
Sum
mary
The presence of the wafer is read. (Electromagnetic valve operation and exist. )
Exam
ple
(host) (Aligner)
WCH[ENQ]
[STX]WCH,*[ETX]
Rema
rks
*:Wafer existence information(1: wafer having 0: There is no wafer. )
The electromagnetic valve operation is accompanied.
(14)VCH
Sum
mary
The presence of the wafer is read. (There is no electromagnetic valve operation.
)
Exam
ple
(host) (Aligner)
VCH[ENQ]
[STX]VCH,*[ETX]
Rema *:Wafer existence information(1: wafer having 0: There is no wafer. )The electromagnetic valve operation is not accompanied.
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rks
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(15)RWF
Sum
mary
The wafer size is read.
Exam
ple
(host) (Aligner)
RWF[ENQ]
[STX]RWF,*[ETX]
Rema
rks
*:Wafer kind(09)(0)300mm NOTCHE
(1)200mmFLATTED
(2)200mmNOTCHE
(3)150mmFLATTED(SEMI)
(4)150mmFLATTED(JEIDA)
(5)150mmNOTCHE
(6)125mmFLATTED
(7)100mmFLATTED
(8) 76mmFLATTED
(9)Uncertainty
ALG" The wafer type is undecided before it executes it.
SEMI/JEIDA is identified based on the following numerical valueswith main orientation flat.
SEMI: Main orientation flat length 57.52.5 (mm)JEIDA: Main orientation flat length 47.52.5 (mm)
The identification of SEMI/JEIDA does only six-inch wafer.
(16)VER
Sum
mary
The version of Aligner software is read.
Exam
ple
(host) (Aligner)
VER[ENQ]
[STX]VER,***[ETX]
Rema
rks
***:The version of Aligner software is shown.
Ver1.23 is shown for VER,123".
(17)RRG
Sum
mary
Reading of lead register of motor control IC
Exam
ple
(host) (Aligner)
RRG,*,#,$[ENQ]
[STX]RRG,*,#,$,%%%%[ETX]
Rema
rks
*:LSI number is specified. (12)
# :The axis number is specified. (1 4)
$ :Specification of register number(0 5)
%%%% :Register information(0000 FFFF)
Refer to the content of the motor control register of the postscript for the
content of each register.
Reading each register is done in two bytes, and replies after it converts it into
ASCII code.(18)DWL
Sum Each parameter is set.
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mary
Exam
ple
(host) (Aligner)
[STX]DWL,*,####,$$$[ETX]
[ACK]
Rema
rks
*:Specification and position numbers
#### :Every 1/10 degrees in the angle(0000 3599)$$$ :1/10mm at position(000 550)
After ACK is transmitted, the parameter is set.
(19)UPL
Sum
mary
A set value of each parameter is read.
Exam
ple
(host) (Aligner)
UPL,*[ENQ]
[STX]UPL,*,####,$$$[ETX]
Rema
rks
*:Specification and position numbers #### :Every 1/10 degrees in the angle(0000 3599)
$$$ :1/10mm at position(000 550)
(20)RER
Sum
mary
The error log is read.
Exam
ple
(host) (Aligner)
RER,****[ENQ]
[STX]RER,****,##[ETX]
Rema
rks
****:History number(00001000)
## :Error code(00 FF)
It becomes the latest error as the figure of the history number grows (1-1000).
When the error code exceeds 1000, it is deleted from the oldest one.
The latest error can be referred to by specifying history number 0.
Refer to the error following code table for the error code.
(21)CER
Sum
mary
The error log is cleared.
Exam
ple
(host) (Aligner)
[STX]CER[ETX]
[ACK]
Rema
rks
After ACK is transmitted, the error log is cleared.
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(22)REV
Sum
mary
The axis rotation correction value (offset value) is set.
Exam
ple
(host) (Aligner)
[STX]REV,****[ETX]
[ACK]
Rema
rks
****:Aligner correction value 1/10 degrees(00003599)On Aligner, it corrects it in the direction of CW (clockwise).
Each stop position and each wafer size is common to the correction value.
After ACK is transmitted, the axis rotation correction value is set.
(23)RRE
Sum
mary
The axis rotation correction value (offset value) is read.
Exam
ple
(host) (Aligner)
RRE[ENQ]
[STX]RRE,****[ETX]
Rema
rks
****:Aligner correction value 1/10 degrees(00003599)
Each stop position and each wafer size is common to the correction value.
(24)PNO
Sum
mary
Aligner software product No. is read.
Exam
ple
(host) (Aligner)
PNO[ENQ]
[STX]PNO,*********[ETX]
Rema
rks
*********:
Product No.(000000000 999999999)
(25)TRN
Sum
mary
The wafer is made by low speed one rotation.
Exam
ple
(host) (Aligner)
[STX]TRN[ETX]
[ACK]
Rema
rks
After ACK is transmitted, one wafer low-speed gyration is executed.
RST" After the command is executed, the command is accepted.
(note)360 is rotated around the chuck.
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(26)ADM
Sum
mary
The alignment execution frequency is read.
Exam
ple
(host) (Aligner)
ADM[ENQ]
[STX]ADM,**********[ETX]
Rema
rks
**********:Alignment execution frequency
(27)ALS
Sum
mary
Alignment is executed. (It is movement, and vacuum OFF in vacuum ON,
sampling, and a specified position and a specified angle. )
Exam
ple
(host) (Aligner)
[STX]ALS,*[ETX]
[ACK]
Rema
rks
After ACK is transmitted, alignment is executed.
RST" After the command is executed, the command is accepted.
* :Specified number(18)
(28)RXY
Sum
mary
XY positional reading of the chuck is done.
Exam
ple
(host) (Aligner)
RXY[ENQ]
[STX]RXY,*****,#####[ETX]
Rema
rks
*****:Chuck X position(1/100mm unit)
##### :Chuck Y position(1/100mm unit)
Chuck position based on initialization position
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(29)SLM
Sum
mary
The wafer eccentric amount limit value is set.
Exam
ple
(host) (Aligner)
[STX]SLM,****,####,$$$$[ETX]
[ACK]
Rema
rks
****:Eccentric amount limit (0000-0700)1/100mm unit #### :Eccentric amount X element axially limit (0000-0700)1/100mm
unit
$$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit
After ACK is transmitted, the parameter is set.
Limit setting according to amount of wafer of calculating eccentric. It is invalid
by 0000 settings.
(30)RLM
Sum
mary
A set value of the wafer eccentric amount limit value is read.
Exam
ple
(host) (Aligner)
RLM[ENQ]
[STX]RLM,****,####,$$$$[ETX]
Rema
rks
****:Eccentric amount limit (0000-0700)1/100mm unit
#### :Eccentric amount X element axially limit (0000-0700)1/100mm
unit
$$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit
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B.RS-232C communication command content explanation
1.Link communication specification(1)Interface RS-232C(2)Communication connection method Full duplex serial
communications(crossing cable connection)
(3)Synchronize system Asynchronous (Step synchronization)method
(4)Transmission rate9600bps 19200bps 38400bps 57600bps
(5)Data form One start bitEight data bitNo parityOne stop bit
(6)Communication code ASCII 7 bit code
2.Transmission control character(1)ENQ Telecommunication line confirmation(05H)
(2)ACK Positive response(06H)(3)NAK Negative response(15H)(4)BUSY It is operating. (11H)
3.Error generation report
Sum
mary
When the error occurs, the error-reporting is compulsorily done.
Exam
ple
(host) (Aligner)
Operation command CR
[ACK]
[ACK]
when is operatingERR,***[CR]
Rema
rks
***When the error occurs, status is returned.
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
3.Command listNo. Com
mandSummary
1 CPI Reset of CPU2 RST Initialization of Aligner3 PAU Temporary stop4 CNT Temporary stop release5 VVN Aligner chuck vacuum ON6 VVF Aligner chuck vacuum OFF7 NYG It moves to the wafer specification position.8 ALG Alignment execution (After it samples it, move to a
specified position and a specified angle.)9 OCH The wafer is moved to a specified position and a specified
angle. (It is effective only after alignment is executed.)10 DEF Set of default data value11 ERF Release of error12 STS Demand of status13 WCH Reading of wafer existence (Electromagnetic valve
operation and exist.)14 VCH Reading of vacuum valve existence (There is noelectromagnetic valve operation.)
15 RWF Reading of wafer size (It is effective only after the ALGcommand is executed.)
16 VER Reading of soft version17 RRG Reading of motor control IC and lead register18 DWL Setting of parameter setting value19 UPL Reading of parameter setting value20 RER Reading of error log21 CER Clearing of error log22 REV Setting of alignment correction value (offset value)
23 RRE Reading of alignment correction value (offset value)24 PNO Reading of Aligner software product No.25 TRN Low speed one-wafer rotation26 ADM Reading of alignment execution frequency27 ALS Alignment execution (It is movement, and vacuum OFF in
vacuum ON, sampling, and a specified position and aspecified angle. )
28 RXY Chuck XY positional reading29 SLM Setting of wafer eccentric amount limit value30 RLM Reading of wafer eccentric amount limit value
4.Command details explanation
F (1)CPI
Sum
mary
CPU is reset.
Exam
ple
(host) (Aligner)
CPI[CR]
[ACK]
Rema
rks
After ACK is transmitted, CPI is reset.
Please do not transmit the command within 1(sec) after receiving ACK.
(2)RST
Sum
mary
Aligner is initialized.
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Exam
ple
(host) (Aligner)
RST[CR]
[ACK]
[ACK]
when is operating
RST[CR](operation completion response)
Rema
rks
After ACK is transmitted, Aligner is initialized.
After operation is completed, the completion response is transmitted.
(3)PAU
Sum
mary
Aligner is put into the state of the temporary stop.
Exam
ple
(host) (Aligner)
PAU[CR]
[ACK]
Rema
rks
It enters the state of the temporary stop after ACK is transmitted.
(4)CNT
Sum
mary
The temporary stop of Aligner is released.
Exam
ple
(host) (Aligner)
CNT[CR]
[ACK]
Rema
rks
After ACK is transmitted, the temporary stop is released.
(5)VVN
Sum
mary
The vacuum of Aligner chuck is turned on.
Exam
ple
(host) (Aligner)
VVN[CR]
[ACK]
[ACK]
when is operatingVVN[CR](operation completion response)
Rema
rks
After ACK is transmitted, the vacuum of Aligner chuck is pulled.
After operation is completed, the completion response is transmitted.
(6)VVF
Sum
mary
The vacuum of Aligner chuck is turned off.
Exam (host) (Aligner)
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
ple VVF[CR]
[ACK]
[ACK]
when is operating
VVF[CR](operation completion response)
Rema
rks
After ACK is transmitted, the vacuum of Aligner chuck is stopped.
After operation is completed, the completion response is transmitted.
(7)NYG
Sum
mary
Aligner chuck is moved to a specified position.
Exam
ple
(host) (Aligner)
NYG,*[CR]
[ACK]
[ACK]
when is operating
NYG[CR](operation completion response)
Rema
rks
*:Specified number(18)
After the command RST" is executed, the command is accepted.
After ACK is transmitted, Aligner chuck is moved to a specified position.
After operation is completed, the completion response is transmitted.
(8)ALG
Sum
mary
Alignment is executed. (After it samples it, move to a specified position and a
specified angle.) have to turn on and off vacuum valve manually
Exam
ple
(host) (Aligner)
ALG,*[CR]
[ACK]
[ACK]
when is operating
ALG[CR](operation completion response)
Rema
rks
*:Specified number(18)
After the commandRST" is executed, the command is accepted.
After ACK is transmitted, alignment is executed.
After operation is completed, the completion response is transmitted.
(9)OCH
Sum
mary
It is moved to a wafer specification position and a specified angle.
Exam
ple
(host) (Aligner)
OCH,*[CR]
[ACK]
[ACK]
when is operating
OCH[CR](operation completion response)
Rema
rks
*:Specified number(18)
Only after the commandALG" is executed, it accepts.After ACK is transmitted, the wafer is rotated to a specified angle.
After operation is completed, the completion response is transmitted.
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(10)DEF
Sum
mary
Each parameter is set to the default data.
Exam
ple
(host) (Aligner)
DEF[CR]
[ACK]
[ACK]
when is being set
DEF[CR](completion response)
Rema
rks
After ACK is transmitted, it sets it to the default data.
After the setting is completed, the completion response is transmitted.
(11)ERF
Sum
mary
Aligner error is released.
Exam
ple
(host) (Aligner)
ERF[CR]
[ACK]
Rema
rks
After ACK is transmitted, Aligner error is released.
(12)STS
Sum
mary
The status of Aligner is read.
Exam
ple
(host) (Aligner)
STS[CR]
STS,***[CR]
Rema
rks
***:The state of operation and refer to the postscript status table.
(13)WCH
Sum
mary
The presence of the wafer is read.
Exam
ple
(host) (Aligner)
WCH[CR]
WCH,*[CR]
Rema
rks
*:Wafer existence information(1: wafer having 0: There is no wafer. )
Vacuum ON OFF operation is accompanied.
(14)VCH
Sum
mary
The presence of the vacuum sensor is read.
Exam (host) (Aligner)
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
ple VCH[CR]
VCH,*[CR]
Rema
rks
*: vacuum sensor existence information(1: wafer having 0: There is no wafer.
)
Vacuum ON OFF operation is not accompanied.
(15)RWF
Sum
mary
The wafer size is read.
Exam
ple
(host) (Aligner)
RWF[CR]
RWF,*[CR]
Rema
rks
*:Wafer kind(09)(0)300mm NOTCHE
(1)200mmFLATTED
(2)200mmNOTCHE(3)150mmFLATTED(SEMI)
(4)150mmFLATTED(JEIDA)
(5)150mmNOTCHE
(6)125mmFLATTED
(7)100mmFLATTED
(8) 76mmFLATTED
(9)Uncertainty
ALG" The wafer type is undecided before it executes it.SEMI/JEIDA is identified based on the following numerical valueswith main orientation flat.
SEMI: Main orientation flat length 57.52.5 (mm)
JEIDA: Main orientation flat length 47.52.5 (mm)The identification of SEMI/JEIDA does only six-inch wafer.
(16)VER
Sum
mary
The version of Aligner software is read.
Exam
ple
(host) (Aligner)
VER[CR]
VER,***[CR]
Rema
rks
***:The version of Aligner software is shown.Ver1.23 is shown for VER,123".
(17)RRG
Sum
mary
Reading of lead register of motor control IC
Exam
ple
(host) (Aligner)
RRG,*,#,$[CR]
RRG,*,#,$,%%%%[CR]
Rema
rks
*:LSI number is specified. (12)
# :The axis number is specified. (1 4)
$ :Specification of register number(0 5)
%%%% :Register information(0000 FFFF)
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
Refer to the content of the motor control register of the postscript for the
content of each register.
Reading each register is done in two bytes, and replies after it converts it into
ASCII code.
(18)DWL
Sum
mary
Each parameter is set.
Exam
ple
(host) (Aligner)
DWL,*,####,$$$[CR]
[ACK]
Remarks
*:Specification and position numbers #### :Every 1/10 degrees in the angle(0000 3599)
$$$ :1/10mm at position(000 550)
After ACK is transmitted, the parameter is set.
(19)UPL
Sum
mary
A set value of each parameter is read.
Exam
ple
(host) (Aligner)
UPL,*[CR]
UPL,*,####,$$$[CR]
Rema
rks
*:Specification and position numbers
#### :Every 1/10 degrees in the angle(0000 3599)
$$$ :1/10mm at position(000 550)
(20)RER
Sum
mary
The error log is read.
Exam
ple
(host) (Aligner)
RER,****[CR]
RER,****,##[CR]
Rema
rks
****:History number(00001000)
## :Error code(00 FF)
It is the latest error (1-1000). grow the figure of the history number
When the error code exceeds 1000, it is deleted from the oldest one.
The latest error can be referred to by specifying history number 0.
Refer to the postscript error code for the error code.
(21)CER
Sum
mary
The error log is cleared.
Exam (host) (Aligner)
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
ple CER[CR]
[ACK]
Rema
rks
After ACK is transmitted, the error log is cleared.
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
(22)REV
Sum
mary
The axis rotation correction value (offset value) is set.
Exam
ple
(host) (Aligner)
REV,****[CR][ACK]
Rema
rks
****:Aligner correction value 1/10 degrees(00003599)On Aligner, it corrects it in the direction of CW (clockwise).
Each stop position and each wafer size is common to the correction value.
After ACK is transmitted, the axis rotation correction value is set.
(23)RRE
Sum
mary
The axis rotation correction value (offset value) is read.
Exam
ple
(host) (Aligner)
RRE[CR]
RRE,****[CR]
Rema
rks
****:Aligner correction value 1/10 degrees(00003599)
Each stop position and each wafer size is common to the correction value.
(24)PNO
Sum
mary
Reading of Aligner software product No.
Exam
ple
(host) (Aligner)
PNO[CR]
PNO,*********[CR]
Rema
rks
*********:Product No.(000000000 999999999)
(25)TRN
Sum
mary
The wafer is made by low speed one rotation.
Exam
ple
(host) (Aligner)
TRN[CR]
[ACK]
[ACK]
when is operating
TRN[CR](operation completion response)
Rema
rks
After ACK is transmitted, one wafer low-speed gyration is executed.
After the command ALG" is executed, the command is accepted.
After operation is completed, the completion response is transmitted.
(note)360 is rotated around the chuck.
26)ADM
Sum The alignment execution frequency of operation is read.
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
mary
Exam
ple
(host) (Aligner)
ADM[CR]
ADM,**********[CR]
Remarks
**********:Alignment effect frequency
(27)ALS
Sum
mary
Alignment is executed. (It is movement, and vacuum OFF in vacuum ON,
sampling, and a specified position and a specified angle.). Vacuum valve is turn
on/off automatically.
Exam
ple
(host) (Aligner)
ALS,*[CR]
[ACK]
[ACK]
when is operating
ALS[CR](operation completion response)
Rema
rks
*:Specified number(18)After the command RST" is executed, the command is accepted.
After ACK is transmitted, alignment is executed.
After operation is completed, the completion response is transmitted.
ALS = VVN + ALG + VVF
(28)RXY
Sum
mary
XY positional reading of the chuck is done.
Exam
ple
(host) (Aligner)
RXY[CR]
RXY,*****,#####[CR]
Rema
rks
*****:Chuck X position(1/100mm unit)
##### :Chuck Y position(1/100mm unit)
Chuck position based on initialization position
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
(29)SLM
Sum
mary
The wafer eccentric amount limit value is set.
Exam
ple
(host) (Aligner)
SLM,****,####,$$$$[CR]
[ACK]
Rema
rks
****:Eccentric amount limit (0000-0700)1/100mm unit #### :Eccentric amount X element axially limit (0000-0700)1/100mm
unit
$$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit
After ACK is transmitted, the parameter is set.
Limit setting according to amount of wafer of calculating eccentric. It is invalid
by 0000 settings.
(30)RLM
Sum
mary
A set value of the wafer eccentric amount limit value is read.
Exam
ple
(host) (Aligner)
RLM[CR]
RLM,****,####,$$$$[CR]
Rema
rks
****:Eccentric amount limit (0000-0700)1/100mm unit
#### :Eccentric amount X element axially limit (0000-0700)1/100mm
unit
$$$$ :Eccentric amount Y element axially limit (0000-0700)1/100mm unit
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
C. Parallel signal command content explanation1.Input signal table- Command input (input)
Nu
mbe
r
1 2 4 8 16 32 Content of operation
0 0 0 0 0 0 0
1 1 0 0 0 0 0 CPU reset
2 0 1 0 0 0 0 Initialization operation(The power supply is
turned on or the error occurs. )
3 1 1 0 0 0 0 Chuck vacuum ON
4 0 0 1 0 0 0 Chuck vacuum OFF
5 1 0 1 0 0 0 (laser sensor ON)
6 0 1 1 0 0 0 (laser sensor OFF)
7 1 1 1 0 0 0
8 0 0 0 1 0 0 Wafer rotation position fine-tuning value
clearing
9 1 0 0 1 0 0 Error release
10 0 1 0 1 0 0 Temporary stop
11 1 1 0 1 0 0 Temporary stop release
12 0 0 1 1 0 0 Wafer rotation position fine-tuning value set
+0.1
13 1 0 1 1 0 0 Wafer rotation position fine-tuning value set
0.1
14 0 1 1 1 0 0 Start of calibration
15 1 1 1 1 0 0 Default set of parameter value and speed
value
16 0 0 0 0 1 0 After alignment is executed, it moves a
specified position and angling. (..setting.. 1)17 1 0 0 0 1 0 (..setting.. 2)
18 0 1 0 0 1 0 (..setting.. 3)
19 1 1 0 0 1 0 (..setting.. 4)
20 0 0 1 0 1 0 (..setting.. 5)
21 1 0 1 0 1 0 (..setting.. 6)
22 0 1 1 0 1 0 (..setting.. 7)
23 1 1 1 0 1 0 (..setting.. 8)
24 0 0 0 1 1 0 The wafer or the chuck is moved a specified
position and angling. (..setting.. 1)
25 1 0 0 1 1 0 (..setting.. 2)
26 0 1 0 1 1 0 (..setting.. 3)27 1 1 0 1 1 0 (..setting.. 4)
28 0 0 1 1 1 0 (..setting.. 5)
29 1 0 1 1 1 0 (..setting.. 6)
30 0 1 1 1 1 0 (..setting.. 7)
31 1 1 1 1 1 0 (..setting.. 8)
- When the vacuum sensor is turning off, note 24-31 moves the chuck.
- The note operation beginning strobe signal is input with 20mS or more and turnedoff at once.
The following command cannot be received the repetition of reset as it is turningon.
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
2.Output signal table- Command reception lady (output)
Numb
er
1 Content of operation
0 0 It is operating.
1 1 The command can be received.
- Error generation report (output)Numb
er
1 Content of operation
0 0 It is operating normally.
1 1 Error generation stop- Wafer existence (output)
Numb
er
1 Content of operation
0 0 There is no wafer.
1 1 Wafer having- Size of wafer (output)
Numb
er
1 2 4 Content of operation
0 0 0 0
1 1 0 0 76mm
2 0 1 0 100mm
3 1 1 0 125mm
4 0 0 1 150mm
5 1 0 1 200mm
6 0 1 1 300mm
7 1 1 1- Notch identification orientation flat/(output)
Numb
er
1 Content of operation
0 0 Flat
1 1 Notch- SEMI/JEIDA identification (output)
Numb
er
1 Content of operation
0 0 SEMI
1 1 JEIDA
Note SEMI/JEIDA is identified based on the following numerical values with main
orientation flat.SEMI :Main orientation flat length 57.52.5 (mm)JEIDA :Main orientation flat length 47.52.5 (mm)The identification of SEMI/JEIDA does only six-inch wafer.
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
- Error signal (output)
Numb
er
1 2 4 8 Content of operation
0 0 0 0 0
1 1 0 0 0 The wafer disappeared in alignment.
2 0 1 0 0 Alignment is not completed exaggeratedly at
time.3 1 1 0 0
4 0 0 1 0 The size of the wafer cannot be judged.
5 1 0 1 0 The wafer is not set in Aligner.
6 0 1 1 0
7 1 1 1 0 It exceeded it to the range of detection of the line
sensor.
8 0 0 0 1 The sampling operation unprocesses it.
9 1 0 0 1 It is impracticability as for alignment. (It is not
possible to judge with Kiz etc.)
10 0 1 0 1 Execution command reception of initialization
of Aligner while unprocessed11 1 1 0 1 Reception error of D-I/O command
12 0 0 1 1
13 1 0 1 1 Command execution error(other error)
14 0 1 1 1 The input value of the line sensor is abnormal.
15 1 1 1 1 Aligner cannot be initialized. Operation stops to
interlock.The note error signal is cleared by executing the reset command.
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
D. Status list
Code Content Remarks
100 It is standing by.
101 It is standing by.
102 The alignment normality ended.
103 Aligner is operating.
104
105
106 The calibration is being executed.
107 It is stopping temporarily.
108 It is interlocking.
109 Initialization is operating.
10A
10B
10C
10D
10E
10F
110 It is standing by by the initialization not processed.
111 The wafer disappeared while alignment was operating. Error112 The alignment operation is not completed exaggeratedly at
time.
Error
113
114 The wafer size cannot be judged. Error
115 The wafer is not set in Aligner. Error
116
117 It exceeded it to the range of detection of the line sensor. Error
118 The sampling operation is not processed. Error
119 Alignment cannot be executed. Error
11A Aligner has not been initialized. Error
11B It is a reception of D-I/O command error. Error
11C
11D It is a command execution error (other errors). Error
11E The input value of the line sensor is abnormal. Error
11F The initialization operation of Aligner cannot be normally done.
Operation stopped to interlock.
Error
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
E. Error code list
Code Content of error
00 There is no error.
31 The wafer disappeared while alignment was operating.
32 The alignment operation is not completed exaggeratedly at time.
33
34 The wafer size cannot be judged.
35 The wafer is not set in Aligner.
36
37 It exceeded it to the range of detection of the line sensor.
38 The sampling operation is not processed.
39 Alignment cannot be executed.
3A Aligner has not been initialized.
3B It is a reception of D-I/O command error.
3C
3D It is a command execution error (other errors).
3E The input value of the line sensor is abnormal.
3F The initialization operation of Aligner cannot be normally done. Operation
stopped to interlock.
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
F. Motor control IC lead register allocation
It is done with the following cracks by each LSI and axis, register (RG), and bit (BIT) of MA Aligner.
LSI Axis RG BIT With crack
1 1 4 0
1 1 4 1 X axis and starting point sensor(0" at HI level)
1 1 4 2 X axis and limit sensor(0" at HI level)
1 1 4 3
1 1 4 4
1 1 4 5
1 1 4 6
1 1 4 7
1 1 4 8
1 1 4 9 Y axis and sensor of ..-.. limit(0" at HI level)
1 1 4 10 Y axis and starting point positional sensor(0" at HI level)
1 1 4 11 Y axis and + limit sensor(0" at HI level)
1 1 4 12
1 1 4 13 Aligner vacuum pressure(0" at HI level)
1 1 4 14
1 1 4 15 Driving power supply ON(0" at HI level)
2 1 4 0
2 1 4 1 Laser comparison output(0" at HI level)2 1 4 2 Laser power supply ON(0" at HI level)
2 1 4 3
2 1 4 4
2 1 4 5
2 1 4 6
2 1 4 7
2 1 4 8
2 1 4 9 I/O control and command 1(0" at HI level)2 1 4 10 I/O control and command 2(0" at HI level)
2 1 4 11 I/O control and command 4(0" at HI level)
2 1 4 12 I/O control and command 8(0" at HI level)
2 1 4 13 I/O control and command 32(0" at HI level)
2 1 4 14 I/O control and command 16(0" at HI level)
2 1 4 15 I/O control and start signal(0" at HI level)
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Specification number: MAF(AC) - C02 Design Div.System Equipment Dept.
G. Default fact sheet
- Rotation angle and Y bearing delivery position of alignment end
No. angle(unit: 1/10
degrees)Rotation angle when
alignment ends
Y bearing delivery position(unit:
1/10mm)Distance from starting point position
1 0000 0000
2 0450 0000
3 0900 0000
4 1350 0000
5 1800 0000
6 2250 0000
7 2700 0000
8 3150 0000- The line sensor position can be angling specified up to 359.9 clockwise by 0.
- Y bearing delivery position is specified by the number of movement millis of chucks from the
starting point position.
Setting of amount of orientation flat angle fine-tuning correction (offset value)
Amount of angle fine-tuning(unit:
1/10 degrees)
0000
Setting of eccentric amount limit value
Eccentric amount limit(unit:
1/100mm)
0500
X eccentric axially limit(unit:
1/100mm)
0000
Y eccentric axially limit(unit:
1/100mm)
0000