M. Szelezniak1PXL Sensor and RDO review – 06/23/2010 STAR Hardware Prototyping Status.

M. Szelezniak 1PXL Sensor and RDO review – 06/23/2010

STAR

Hardware Prototyping Status


STARTalk Outline

• Development plan• LVDS data path at 160 MHz• Mass Termination Board • RDO Motherboard• Flex Cable

• Development• Preliminary Design• Alternative Approach• Infrastructure Test Board

• Interfaces to STAR• Prototype Telescope System in STAR

• Probe tests• Summary


STARDevelopment Plan

PXL RDO Basic Unit

2 m (42 AWG TP)6 m (24 AWG TP)

100 m (fiber optic)

4 ladders per sector 1 Mass Termination Board (MTB) per sector 1 sector per RDO board 10 RDO boards in the PIXEL system

RDO motherboard + Xilinx Virtex-5 Dev Board

RDO PC with DDL link to RDO board

Mass termination board + latch up protected power daughtercard

← Front Back ↓


STARLVDS Data Path at 160 MHz

2 ns eye patternopening for 1 m 42 AWG cables at 200 MHz

Ladder mock-up with 1-to-4 LVDS fanout buffers

Mass termination board + LU monitoring

42 AWG wires

24 AWG wires

Virtex-5 based RDO system with DDL link to PC

Status• Data Path Architecture Validated• Measured BER (bit error rate) of < 10-14


STARMass Termination Board

Status• Prototype in hand.• Testing in

progress.

LU protection

LU protected power supply VDA,VDD

PLL

ADC

Mass Termination BoardLU protected power regulation board

• I2C ADC for sensor temperature monitoring

• PLL for CLK distribution with 50% duty cycle

• JTAG buffers LVDS LVCMOS

LVDS buffers JTAG buffers


STARReadout Board

Status• 3 Prototypes in hand. • Firmware, hardware

and software are working for individual sensor testing.

Xilinx VIRTEX-5 development board

USB interface

DDL

LVDS buffers

50 MHz ADC

Custom readout board.

• fast ADC for sensor testing

• DDL for data acquisition

• USB for data acquisition / system monitoring

SRAM


STAR

7

http://rnc.lbl.gov/hft/hardware/docs/Phase1/cable_power_gnd_trace_optimization.doc

Signal # of traces type Width (0.005” t&s)

Sensor output 10 x 4 x 2 = 80 LVDS 0.800” (20.32 mm)

CLK 2 LVDS 0.020” (0.51 mm)

CLK_RETURN 2 LVDS 0.020” (0.51 mm)

Marker 1 CMOS 0.010” (0.25 mm)

START 1 CMOS 0.010” (0.25 mm)

SPEAK 1 CMOS 0.010” (0.25 mm)

JTAG + RSTB 5 CMOS 0.050” (1.27 mm)

TEMP 2 analog 0.020” (0.51 mm)

Total 94 0.940” (23.88 mm)

Number of traces and required width to route (without vias) using industry standard 0.005” (125 µm) traces and spaces and with 17.5 µm Cu trace equivalent thickness.

Signal

7

Flex Cable Development

Power trace Width at thickest part

Analog power 0.220” (5.588 mm)

Digital power 0.098” (2.489 mm)

Ground 0.318” (8.077 mm)

Total 0.636” (16.154 mm)

Power

Analog power traces

Digital power traces

Ground return traces

wW = 23.08 mm


STARFlex Cable – Preliminary Design

Hybrid Copper / Aluminum conductor flex cable

Low mass Sensor regionDriver region

Side view (exaggerated vertical scale)

Top View

• 2 layer Al conductor cable in low mass region• 0.004” (100 µm) traces and 0.004” (100 µm) spaces• 70% fill factor• Conductor thickness in low mass region is 21 µm (Cu) or 32 µm (Al)• Minimum required conductor trace width 1.325” (33.65 mm) of 46.16 mm available. • Bond wire connection between Al and Cu cable sections.

Low mass region calculated X/X0 for Cu conductor = 0.232 %Low mass region calculated X/X0 for Al conductor = 0.073 %


STARFlex Cable – Preliminary Design (cont.)

Compared to the standard 4 layer Al conductor cable construction;

Advantages• One 2-layer Al conductor cable – less reliance on Al conductor

flex PCB fabrication process and less complex Al structure.• Lower radiation length than previous (not as well justified)

estimate.• More layers and thus more complex structures in the driver

region are possible (this may be needed).

Disadvantages• Wire bonding (or other high density connection technique)

required for inter cable connection.• Cable will not be the same thickness everywhere – may

complicate fixturing.• Non homogeneous CTE in cable.


STARFlex Cable – Alternative Approach

Multi-layer single sided with aluminum conductor with cable on top of sensor • addresses aluminum via manufacturing issue • minimizes the cable X width • cable located on the top of the sensors partially obstructs the sensors for both

view and touch probe location measurements

X = 3.67 mm – exceeds the existing envelope by 0.77 mmX = 2.88 mm if Clock return and RSTB are neglected (production runs) – within the current mechanical envelope

VDD, VAA, GND, clock, temp, SPEAK (bonded to power) - ΔX not relevant

Sensor 120 µm + no stiffener

signal outputs, Clock return, marker, start, JTAG, RSTB – ΔX = 0.105” (2.67 mm)


STARAluminum Flex Cable

• A single sided test cable design has been produced for fabrication at Datex to assess capability and quality.

• Some delay due to material issues. It is difficult to find anyone willing to fabricate kapton/Al.

• We have located some 1 mil Al on 1 mil mylar and shipped it to Datex. They are evaluating the suitability.

• Datex is about to start first attempt at fabrication.

• Other vendors (SE SRTIIE, Kharkov,Ukraine and CERN?) will be contacted.

• A detailed description of the challenge is available here http://rnc.lbl.gov/hft/hardware/docs/PXL_RDO_cable_options_1.doc

http://rnc.lbl.gov/hft/hardware/docs/PXL_RDO_cable_options_1.doc


STARFlex Cable Status

PIXEL Cable development stages:

1. Infrastructure testing board

2. Prototype detector cable FR-4 with Cu traces

3. Prototype detector cable Kapton with Cu traces

4. Prototype detector cable Kapton with Al traces

Status• Preliminary FR-4 test version in hand

• Testing in progress

Infrastructure testing board with extended sensor testing capabilities


STARInfrastructure Test Board

Coupling mechanism is under investigation. Next board with 50 μm Phase-2 prototypes is being assembled.

The first test of the complete RDO chain:

• 10-sensor ladder• MTB• RDO• long cables Ladder-like layout except for Power and GND

Very preliminary results with full thickness Phase-1 prototypes:

Status• Multidrop clock working• JTAG daisy chain working (with caveats)

• Testing in progress

Noise

One sensor at a time 100 %

All sensors on (high discriminator threshold → low switching/output activity) – expected running configuration

Up to 125 %(122 % on average)

All sensors on (low discriminator threshold → high switching/output activity)

Up to 145 %(138 % on average)


STARPrototype Telescope System in STAR

Status• 3 Sensor (MimoSTAR2) telescope

used at STAR in 2007 RHIC run.• Clean noise environment at STAR• Successful tracking • No latch-up events were observed

during the run • Interfaces to Trigger and slow

controls worked well


STARProbe Tests

Initial testing with ~75 μm travel past touchdown

30 μm additional lowering of probe pins

Phase-1 discriminator transfer functions ƒ(threshold voltage) observed on two of the probed sensors :

Sensors designed with dedicated probe pads in the sensor pad ring.

13 full-thickness, diced sensors probe tested.

Up to 3 probe tests on a sensor.

We will begin testing thinned sensors within the next few days

Status• Automated and scripted system

for sensor testing is in place.• Vacuum chuck for handling up to

twenty 50 μm thick sensors is being tested

• Ongoing sensor testing


STARSummary

• RDO basic unit has been prototyped and successfully tested

• Development of the low mass flex cable has started

• The first FR4 ladder prototype is under test

• Interface to the STAR trigger and slow control systems successfully tested

• Automated probe test setup ready for testing thinned sensors

M. Szelezniak1PXL Sensor and RDO review – 06/23/2010 STAR Hardware Prototyping Status.

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