LVAD System Review
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Transcript of LVAD System Review
LVAD System Review
System OverviewSmiha Sayal
System Overview
Left Ventricular Assist Device (LVAD) Mechanical device that
helps pump blood from the heart to the rest of the body.
Implanted in patients with heart diseases or poor heart function.
System Goal
Miniaturize the existing LVAD system to achieve portability while retaining its safety and reliability.
Engineering ProcessAll team members
Customer Needs
Safe Robust Affordable Easy to wear and use Interactive with user Controllable by skilled technician Comparable performance Compatible with existing pump
Other LVAD Technologies
CorAide (NASA)
Other LVAD Technologies
Original System
“Black box” architecture used during development
Large, not portable Runs on AC power
P10021’s System
Has both internal / external components Equivalent to our “Option 2” Unfinished implementation
Concepts: Option 1
All electronics external
Concepts: Option 2
ADC internal only
Concepts: Option 3
Pump and motor control internal
Concepts: Option 4
All electronics and battery internal
Concept Generation
Selection Criteria Weight Rating Notes Score Rating Notes Score Rating Notes Score Rating NotesSmall Internal Volume 9 5 45 4 36 2 18 1Small External Volume 4 2 8 3 12 4 16 4Low internal weight 8 5 40 4 32 2 16 1Feasible within timeline 9 5 45 3 27 2 18 1Low Probibility of Failure 10 3 30 3 30 3 30 3Easy to maintain 8 5 40 4 32 2 16 1Low number of wires thru body 4 1 20 wires 4 2 10 wires 8 4 3 wires 16 4 3 wiresLow signal noise 2 4 8 1 high bandwidth 2 4 8 4Low heat dissipation to body 8 5 40 4 32 2 16 1Debug signals avalible externally 8 5 40 4 32 2 16 2Additional Processes (biocompatibility/waterproofing)5 5 25 3 15 3 15 3Affordability 5 5 1 enclosure 25 3 2 enclosures 15 3 2 enclosures 15 2 2 enclosuresNet Score 350 273 200Rank 1 2 3
Concepts"Option 1" "Option 2" "Option 3" "Option 4"
Concept Generation Highlights
Best Option
350
273
200
153
Enclosure DesignNicole Varble and Jason Walzer
Material and Processing Selection Needs
The external package should be lightweight/ robust/ water resistant
The devices should be competitive with current devices The device should fit into a small pouch and be comfortable for
user Specification
Optimum weight of 5 lbs Optimum dimensions of ~6” x 2” x 2”
Risks Housing for the electronics is too heavy/large/uncomfortable
Preventative measures Eliminate heavy weight materials Eliminate weak, flexible materials Material is ideally machinable
Material and Processing Comparison
Rapid Prototyping
Dimension System ABSplus
Industrial thermoplastic Typically used for product development Machinable
Material can be dilled (carefully) and tapped Accepts CAD drawings
Obscure geometries can be created easily Ideal for proposed ergonomic shape
Lightweight Specific gravity of 1.04
Porous Does not address water resistant need
0.007” material/layer Capable of building thin geometries
Builds with support layer Models can be built with working/moving
hinges without having to worry about pins
http://www.dimensionprinting.com/
ABS Plastic
Mechanical Property
Test Method
Imperial Metric
Tensile Strength ASTM D638
5,300 psi 37 MPa
Tensile Modulus ASTM D638
330,000 psi 2,320 MPa
Tensile Elongation
ASTM D638
3% 3%
Heat Deflection ASTM D648
204°F 96°C
Glass Transition DMA (SSYS)
226°F 108°C
Specific Gravity ASTM D792
1.04 1.04
Coefficient of Thermal Expansion
ASTM E831
4.90E-5 in/in/F
• Important Notes• Relatively high tensile strength• Glass Transition well above body temperature• Specific Gravity indicates lightweight material
Water Resistant Testing
Need: The external package should resist minor splashing
Specification: Water Ingress Tests Once model is constructed, (user interface,
connectors sealed, lid in place) exclude internal electronics and perform test
Monitor flow rate (length of time and volume) of water
Asses the quality to which water is prevented from entering case
Risk: Water can enter the external package and harm the electronics
Preventative measures: Spray on Rubber Coating or adhesive O-rings around each screw well and around the lid Loctite at connectorshttp://scoutparts.com/products/?
view=product&product_id=14074
Robustness Testing
Need: The device should survive a fall from the hip Specification: Drop Test
Drop external housing 3-5 times from hip height, device should remain fully intact Specify and build internal electrical components Identify the “most venerable” electrical component(s) which may be susceptible
to breaking upon a drop Mimic those components using comparable (but inexpensive and replaceable)
electrical components Goal
Show the housing will not fail Show electronics package will not fail, when subjected to multiple drop tests
Risks The housing fails before the electronic components in drop tests The electronic components can not survive multiple drop tests
Preventative Measures Eliminate snap hinges from housing (screw wells to secure lid) Test the housing first Take careful consideration when developing a thickness of the geometry Design a “tight” electronics package
Heat Dissipation to the Body Need: Internal Enclosure
dissipates a safe amount of heat to the body
Risk: Internal electronics emit unsafe amounts of heat to body
Benchmarking: Series of tests studied
constant power density heat sources related to artificial hearts
60-mW sources altered surface temperatures 4.5, 3.4, 1.8 °C above normal at 2, 4, 7 weeks
40mW/cm2 source increased to upper limit of 1.8 °C
Specifications: Internal devices must not increase surrounding tissue by more than 2°C
•
Wolf, Patrick D. "Thermal Considerations for the Design of an Implanted Cortical Brain–Machine Interface (BMI)." Ncib.gov. National Center for Biotechnology Information, 2008. Web. 30 Sept. 2010. <http://www.ncbi.nlm.nih.gov/bookshelf/br.fcgi?book=frimp∂=ch3>.
Ergonomics
Need: Device should be comfortable for user
ANSUR Database Exhaustive military database
outlining body dimensions Waist Circumference (114)
Males: 137.3 mm Females: 126.0 mm
Waist Depth (115) Males: 113.1 mm Females: 102 mm
Calculated average radius of hip Males: 125.2 mm Females: 114.0 mm
Acceptable Avg. Radius of hip ~120 mm
Enclosure Concept
CAD model is can be easily resized Removable top panel for electronics access
Embedded Control SystemAndrew Hoag and Zack Shivers
Control System
Requirements Selecting suitable embedded control
system Designing port of control logic to
embedded system architectureCustomer Needs
Device is compatible with current LVAD Device is portable/small Allows debug access
Impeller Levitation
Impeller must be levitating or “floating” Electromagnets control force exerted on impeller Keeps impeller stabilized in the center Position error measured by Hall Effect sensors
Levitation Algorithm
Algorithm complexity influences microcontroller choice Electronics choices affect volume / weight
Proportional – Integral – Derivative (PID) Very common, low complexity control scheme
http://en.wikipedia.org/wiki/PID_controller
Embedded System Selection
Requirements: Can handle PID
calculations Has at least 8x 12-bit
ADC for sensors at 2000 samples/sec
Multiple PWM outputs to motor controller(s)
Same control logic as current LVAD system
Reprogrammable
Embedded System Selection
Custom Embedded dsPIC
Microcontroller▪ Blocks for Simulink▪ Small▪ Inexpensive (<$10 a
piece) TI MSP430▪ Inexpensive (<$8 a
piece)▪ Small, low power
COTS Embedded National
Instruments Embedded▪ Uses LabVIEW▪ Manufacturer of current
test and data acquisition system in “Big Black Box”
▪ Large to very large▪ Very expensive (>$2000)
Control Logic/Software
Closed-loop feedback control using PID – currently modeled in Simulink for use with the in “Big Black Box”
Additional microcontroller-specific software will be required to configure and use A/D, interrupts, timers.
Life Critical System
Not at subsystem level detail yet.Life-critical operations would run
on main microcontroller.User-interface operations run on
separate microcontroller. Possible LRU (Least Replaceable
Unit) scheme
Questions / CommentsHelp us improve our design!