1. LTCC Passive Integration Status and challenges Steve Dai, Motorola Labs, Tempe, Arizona Channel/ cavity Embedded Capacitor

2. Outline Introduction LTCC (Low Temperature Cofired Ceramics) LTCC materials LTCC Passive integration LTCC feature forming Zero shrink tape: ideal way for integration? LTCC Applications Wireless Automotive, energy and others Summary Steve Dai, SICCAS LTCC Seminar 7_16_2007

3. Introduction Why Passive Integration? Device miniaturization Greater component density for increased functionality High speed signal process requires Lower equivalent series inductors Tighter control of parasitic R, C and L Higher assembly yield Lower system cost Better reliability * Robert Heistand, ED Online #2718, Feb 2, 2003 Steve Dai, SICCAS LTCC Seminar 7_16_2007

4. Introduction Paths to Passive Integration technologies Characteristics PCB (Printing LTCC Thin film on Circuit Board, (MCM-C) Si/glass MCM-L) (MCM-D) Substrates FR-4, BT, FR-5 Ceramic Si, Glass, Sapphire Dielectric Constant (r) 4.9 / 3.9 / 4.7 7 -12 12 / 5 / 10 Loss Tangent (1 GHz) .015 /.009/.010 .0003 -.003 .005/ .003 / .0001 Thermal (W / m-K) .2 -.4 2.5 100 / 1.7 / 42 CTE (ppm) 15 / 15 / 13 6 2.6 / 1 / 8 # of Layers 8 30 6 Conductors Cu Ag, Ag/Pd, Au, Pt, Cu Al, Cu, Au Electrical (10-8 -m) 1.7 1.2~1.7 2.6 / 1.7 / 2.1 Thermal (W/m-K) 398 398~428 247~398 Line Width (m) 100 75 5 Process Variation 10 -15 % 2 4 % 2 4 % RF Frequency < 10 GHz