LS E63B · 2020. 11. 16. · LS E63B 4 Version 1.2 | 2018-09-26 Characteristics I F = 50 mA; T S =...
Transcript of LS E63B · 2020. 11. 16. · LS E63B 4 Version 1.2 | 2018-09-26 Characteristics I F = 50 mA; T S =...
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LS E63B
1 Version 1.2 | 2018-09-26
Produktdatenblatt | Version 1.1 www.osram-os.com
LS E63B
Power TOPLED® Lens PowerTOPLED with lens, a powerful member of the TOPLED family. Thanks to their high luminous efficacy, the LEDs are ideal for rear light clusters and indicators on vehicles and for display panels for traffic control systems.
Applications — Interior Illumination (e.g. Ambient Map) — Signalling
— Traffic Lights
Features: — Package: white PLCC-4 package, colorless clear resin
— Chip technology: InGaAlP
— Typ. Radiation: 30°
— Color: λdom = 633 nm (● super red)
— Corrosion Robustness Class: 3B
— ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
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LS E63B
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Ordering Information Type Partial Flux 1) Ordering Code
IF = 50 mAEv
LS E63B-BBCB-1-1 2240 ... 4500 lx Q65110A2336
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LS E63B
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Maximum RatingsParameter Symbol Values
Operating Temperature Top min. max.
-40 °C 100 °C
Storage Temperature Tstg min. max.
-40 °C 100 °C
Junction Temperature Tj max. 125 °C
Forward current TS = 25 °C
IF max. 70 mA
Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C
IFS max. 100 mA
Reverse voltage 2) TS = 25 °C
VR max. 12 V
ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD 2 kV
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LS E63B
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CharacteristicsIF = 50 mA; TS = 25 °C
Parameter Symbol Values
Peak Wavelength 3) λpeak typ. 645 nm
Dominant Wavelength 3) IF = 50 mA
λdom min. typ. max.
627 nm 633 nm 639 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 15 nm
Viewing angle at 50 % IV 2φ typ. 30 °
Forward Voltage 4) IF = 50 mA
VF min. typ. max.
1.90 V 2.20 V 2.50 V
Reverse current 2) VR = 12 V
IR typ. max.
0.01 µA 10 µA
Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C
TCλpeak typ. 0.15 nm / K
Temperature Coefficient of Dominant Wavelength -10°C ≤ T ≤ 100°C
TCλdom typ. 0.05 nm / K
Temperature Coefficient of Forward Voltage -10°C ≤ T ≤ 100°C
TCVF typ. -3.4 mV / K
Real thermal resistance junction/solderpoint 5) RthJS real typ. max.
110 K / W 130 K / W
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LS E63B
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Brightness Groups Group Partial Flux 1) Partial Flux 1) Luminous Flux 6)
IF = 50 mA IF = 50 mA IF = 50 mAmin. max. typ.Ev Ev ΦV
BB 2240 lx 2800 lx 1180 mlm
CA 2800 lx 3550 lx 1490 mlm
CB 3550 lx 4500 lx 1890 mlm
Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4)
IF = 50 mA IF = 50 mAmin. max.VF VF
3 1.90 V 2.20 V
4 2.20 V 2.50 V
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LS E63B
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Group Name on Label Example: BB-1-3Brightness Wavelength Forward Voltage
BB 1 3
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LS E63B
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LS E63B
350 400 450 500 550 600 650 700 750 800
λ /
0,0
0,2
0,4
0,6
0,8
1,0E
: Vλ: super red
Relative Spectral Emission 6) Erel = f (λ); IF = 50 mA; TS = 25 °C
LS E63B
-100°
-90°
-80°
-70°
-60°
-50°
-40°
-30°
-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
ϕ /
0,0
0,2
0,4
0,6
0,8
1,0I
Radiation Characteristics 6) Irel = f (ϕ); TS = 25 °C
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LS E63B
1 701 2 3 4 5 10 20 30 40 50
IF / mA
0,01
0,05
0,1
0,5
1
EVEV(50mA)
Relative Illuminance 6), 7)Ev/Ev(50 mA) = f(IF); TS = 25 °C
LS E63B
1,6 1,8 2,0 2,2 2,4
VF / V
1
2
3
4
5
10
20
30
40
50
IF / mA
Forward current 6), 7)IF = f(VF); TS = 25 °C
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LS E63B
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LS E63B
-40 -20 0 20 40 60 80 100
Tj / °C
0,0
0,5
1,0
1,5
2,0EvEv(25°C)
Relative Illuminance 6)Ev/Ev(25 °C) = f(Tj); IF = 50 mA
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LS E63B
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OHL01413
00 20 40 60 80 ˚C 100
T
IF
20
40
60
80mA
AT ST
temp. ambienttemp. solder point
A
SΤΤ
10
30
70
50
Max. Permissible Forward CurrentIF = f(T)
OHL01506
FI
0
0.02
0.04
0.06
0.08
0.10
0.12
A
pt-510 -410 -310 -210 -110 010 110 210
0.0050.050.5
s
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 85 °C
OHL01505
FI
0
0.02
0.04
0.06
0.08
0.1
0.12
A
pt-510 -410 -310 -210 -110 010 110 210
0.0050.050.5
s
Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 25 °C
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LS E63B
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Dimensional Drawing 8)
3.8 (0.150) max.
ø2.5
5 (0
.100
)
0.13 (0.005)
0.18 (0.007)
0.1 (0.004) typ
markingPackage
1.1
(0.0
43)
0.5
(0.0
20)
2.6 (0.102)
3.4
(0.1
34)
3.0
(0.1
18)
2.1 (0.083)
2.3 (0.091)
3.0 (0.118)
3.7
(0.1
46)
3.3
(0.1
30) 4
˚±1
GPLY6023
0.4 (0.016)
0.6 (0.024)
0.9 (0.035)
0.7 (0.028)
1.7 (0.067)2.1 (0.083)
0.6 (0.024)
0.8 (0.031)
A C
CC
ø2.6
0 (0
.102
)
CC
CA
Approximate Weight: 38.0 mg
Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)
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LS E63B
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For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning.
Recommended Solder Pad 8)
OHLPY440
Padgeometrie fürverbesserte Wärmeableitung
improved heat dissipationPaddesign for
LötstoplackSolder resist
0.8 (0.031)
3.7
(0.1
46)
1.1
(0.0
43)
2.3 (0.091)
3.3 (0.130)
1.5
(0.0
59)
11.1
(0.4
37)
Cu Fläche / 16 mm per pad2Cu-area
_<
3.3 (0.130)
Kathode/Cathode
Anode
0.7 (0.028)
Fläche darf bei Verwendung von TOPLED®
For TOPLED® assembly do not use
elektrisch nicht beschaltet werden.
this area for electrical contact
Fläche darf bei Verwendung von TOPLED®
For TOPLED® assembly do not use
elektrisch nicht beschaltet werden.
this area for electrical contact
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LS E63B
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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E
00
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300t
T
˚C
St
t
Pt
Tp240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum
Ramp-up rate to preheat*)25 °C to 150 °C
2 3 K/s
Time tSTSmin to TSmax
tS 60 100 120 s
Ramp-up rate to peak*)TSmax to TP
2 3 K/s
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 250 °C
Time within 5 °C of the specified peaktemperature TP - 5 K
tP 10 20 30 s
Ramp-down rate*TP to 100 °C
3 4 K/s
Time25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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LS E63B
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Taping 8)
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LS E63B
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Tape and Reel 9)
Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU
330 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2000
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LS E63B
16 Version 1.2 | 2018-09-26
Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 8)
OHA00539
OSRA
M
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately afterbag opening.
Discard if circles overrun.Avoid metal contact.
WET
Do not eat.
Comparatorcheck dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%bake units
bake units
If wet,
change desiccant
If wet,
Humidity IndicatorMIL-I-8835
If wet,
Moi
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168
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Moi
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umid
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10%
whe
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reflo
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uiva
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dev
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This
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Flo
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72
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Flo
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LS E63B
17 Version 1.2 | 2018-09-26
Transportation Packing and Materials 8)
OHA02044
PACK
VAR:
R077Ad
ditiona
l TEXT
P-1+Q
-1
Multi T
OPLE
D
Muste
r
OSRA
M Opto
Semic
ondu
ctors
(6P) B
ATCH
NO:
(X) PR
OD NO
:
10
(9D) D
/C:
11(1T) LOT
NO:
21002199
8
123GH
1234
024 5
(Q)QT
Y:200
0
0144
(G) GR
OUP:
260 C
RT240
C R
3
220 C
R
MLBin
3:Bin2: Q
-1-20
Bin1: P
-1-20
LSY T
6762
2a
Temp
ST
R18
DEMY
PACK
VAR:
R077Ad
ditiona
l TEXT
P-1+Q
-1
Multi T
OPLE
D
Muste
r
OSRA
M Opto
Semic
ondu
ctors
(6P) B
ATCH
NO:
(X) PR
OD NO
:
10
(9D) D
/C:
11(1T) LOT
NO:
21002199
8
123GH
1234
024 5
(Q)QT
Y:200
0
0144
(G) GR
OUP:
260 C
RT240
C R
3
220 C
R
MLBin
3:Bin2: Q
-1-20
Bin1: P
-1-20
LSY T
6762
2a
Temp S
T
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
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Moi
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Flo
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6
Hou
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a) H
umid
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dica
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is >
10%
whe
n re
ad a
t 23
˚C ±
5 ˚C
, or
reflo
w, v
apor
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se ref
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, or e
quiv
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cess
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at w
ill b
e su
bjec
ted
to in
frar
ed
1. S
helf
life
in s
eale
d ba
g: 2
4 m
onth
s at
< 4
0 ˚C
and
< 9
0% rel
ativ
e hu
mid
ity (R
H).
Moi
stur
e Le
vel 5
a
at fa
ctor
y co
nditi
ons
of
(if b
lank
, sea
l dat
e is
iden
tical
with
dat
e co
de).
a) M
ount
ed w
ithin
b) S
tore
d at
body
tem
p.
3. D
evic
es req
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bak
ing,
bef
ore
mou
ntin
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:
Bag
sea
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Barcode label
Dimensions of transportation box in mmWidth Length Height
349 ± 5 mm 349 ± 5 mm 33 ± 5 mm
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LS E63B
18 Version 1.2 | 2018-09-26
Schematic test method for partial flux measurement
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LS E63B
19 Version 1.2 | 2018-09-26
Chip Technology: 5: HOP 2000 B: HOP 2000 C: ATON D: Low cost ThinGaN/ Thinfilm (e.g. 6mil) F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire)
´ Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion
(resin encapsulation) S: Silicone (with or without diffuser) 3: lens 30° … 70° 5: lens 40° .. 80°
Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: A: 617 nm amber W: white S: 633 nm super red UW: ultra white T: 528 nm true green CW: warm white Y: 587 nm yellow CB: color on demand blue O: 606 nm orange CR: crystal pink CP/P: 560 nm pure green R: 625 nm red B: 470 nm blue
L: Light emitting diode
Package Type E: PowerTOPLED
Lead / Package Properties 6: folded leads T: folded leads, improved corrosion stability
(Au-LF), w/o TiO2 jetting
Type Designation System
L A E 6 7 6
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LS E63B
20 Version 1.2 | 2018-09-26
NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
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LS E63B
21 Version 1.2 | 2018-09-26
Disclaimer
DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.
Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS webside.
PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.
Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.
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LS E63B
22 Version 1.2 | 2018-09-26
Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).
2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-tion is not allowed.
3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).
4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).
5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.
8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.
9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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LS E63B
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Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.