LS E63B · 2020. 11. 16. · LS E63B 4 Version 1.2 | 2018-09-26 Characteristics I F = 50 mA; T S =...

23
LS E63B 1 Version 1.2 | 2018-09-26 www.osram-os.com LS E63B Power TOPLED ® Lens PowerTOPLED with lens, a powerful member of the TOPLED family. Thanks to their high luminous efficacy, the LEDs are ideal for rear light clusters and indicators on vehicles and for display panels for traffic control systems. Applications Interior Illumination (e.g. Ambient Map) Signalling Traffic Lights Features: Package: white PLCC-4 package, colorless clear resin Chip technology: InGaAlP Typ. Radiation: 30° Color: λ dom = 633 nm ( super red) Corrosion Robustness Class: 3B ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

Transcript of LS E63B · 2020. 11. 16. · LS E63B 4 Version 1.2 | 2018-09-26 Characteristics I F = 50 mA; T S =...

  • LS E63B

    1 Version 1.2 | 2018-09-26

    Produktdatenblatt | Version 1.1 www.osram-os.com

    LS E63B

    Power TOPLED® Lens PowerTOPLED with lens, a powerful member of the TOPLED family. Thanks to their high luminous efficacy, the LEDs are ideal for rear light clusters and indicators on vehicles and for display panels for traffic control systems.

    Applications — Interior Illumination (e.g. Ambient Map) — Signalling

    — Traffic Lights

    Features: — Package: white PLCC-4 package, colorless clear resin

    — Chip technology: InGaAlP

    — Typ. Radiation: 30°

    — Color: λdom = 633 nm (● super red)

    — Corrosion Robustness Class: 3B

    — ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

  • LS E63B

    2 Version 1.2 | 2018-09-26

    Ordering Information Type Partial Flux 1) Ordering Code

    IF = 50 mAEv

    LS E63B-BBCB-1-1 2240 ... 4500 lx Q65110A2336

  • LS E63B

    3 Version 1.2 | 2018-09-26

    Maximum RatingsParameter Symbol Values

    Operating Temperature Top min. max.

    -40 °C 100 °C

    Storage Temperature Tstg min. max.

    -40 °C 100 °C

    Junction Temperature Tj max. 125 °C

    Forward current TS = 25 °C

    IF max. 70 mA

    Surge Current t ≤ 10 µs; D = 0.005 ; TS = 25 °C

    IFS max. 100 mA

    Reverse voltage 2) TS = 25 °C

    VR max. 12 V

    ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

    VESD 2 kV

  • LS E63B

    4 Version 1.2 | 2018-09-26

    CharacteristicsIF = 50 mA; TS = 25 °C

    Parameter Symbol Values

    Peak Wavelength 3) λpeak typ. 645 nm

    Dominant Wavelength 3) IF = 50 mA

    λdom min. typ. max.

    627 nm 633 nm 639 nm

    Spectral Bandwidth at 50% Irel,max ∆λ typ. 15 nm

    Viewing angle at 50 % IV 2φ typ. 30 °

    Forward Voltage 4) IF = 50 mA

    VF min. typ. max.

    1.90 V 2.20 V 2.50 V

    Reverse current 2) VR = 12 V

    IR typ. max.

    0.01 µA 10 µA

    Temperature Coefficient of Peak Wavelength -10°C ≤ T ≤ 100°C

    TCλpeak typ. 0.15 nm / K

    Temperature Coefficient of Dominant Wavelength -10°C ≤ T ≤ 100°C

    TCλdom typ. 0.05 nm / K

    Temperature Coefficient of Forward Voltage -10°C ≤ T ≤ 100°C

    TCVF typ. -3.4 mV / K

    Real thermal resistance junction/solderpoint 5) RthJS real typ. max.

    110 K / W 130 K / W

  • LS E63B

    5 Version 1.2 | 2018-09-26

    Brightness Groups Group Partial Flux 1) Partial Flux 1) Luminous Flux 6)

    IF = 50 mA IF = 50 mA IF = 50 mAmin. max. typ.Ev Ev ΦV

    BB 2240 lx 2800 lx 1180 mlm

    CA 2800 lx 3550 lx 1490 mlm

    CB 3550 lx 4500 lx 1890 mlm

    Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4)

    IF = 50 mA IF = 50 mAmin. max.VF VF

    3 1.90 V 2.20 V

    4 2.20 V 2.50 V

  • LS E63B

    6 Version 1.2 | 2018-09-26

    Group Name on Label Example: BB-1-3Brightness Wavelength Forward Voltage

    BB 1 3

  • LS E63B

    7 Version 1.2 | 2018-09-26

    LS E63B

    350 400 450 500 550 600 650 700 750 800

    λ /

    0,0

    0,2

    0,4

    0,6

    0,8

    1,0E

    : Vλ: super red

    Relative Spectral Emission 6) Erel = f (λ); IF = 50 mA; TS = 25 °C

    LS E63B

    -100°

    -90°

    -80°

    -70°

    -60°

    -50°

    -40°

    -30°

    -20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°

    ϕ /

    0,0

    0,2

    0,4

    0,6

    0,8

    1,0I

    Radiation Characteristics 6) Irel = f (ϕ); TS = 25 °C

  • LS E63B

    8 Version 1.2 | 2018-09-26

    LS E63B

    1 701 2 3 4 5 10 20 30 40 50

    IF / mA

    0,01

    0,05

    0,1

    0,5

    1

    EVEV(50mA)

    Relative Illuminance 6), 7)Ev/Ev(50 mA) = f(IF); TS = 25 °C

    LS E63B

    1,6 1,8 2,0 2,2 2,4

    VF / V

    1

    2

    3

    4

    5

    10

    20

    30

    40

    50

    IF / mA

    Forward current 6), 7)IF = f(VF); TS = 25 °C

  • LS E63B

    9 Version 1.2 | 2018-09-26

    LS E63B

    -40 -20 0 20 40 60 80 100

    Tj / °C

    0,0

    0,5

    1,0

    1,5

    2,0EvEv(25°C)

    Relative Illuminance 6)Ev/Ev(25 °C) = f(Tj); IF = 50 mA

  • LS E63B

    10 Version 1.2 | 2018-09-26

    OHL01413

    00 20 40 60 80 ˚C 100

    T

    IF

    20

    40

    60

    80mA

    AT ST

    temp. ambienttemp. solder point

    A

    SΤΤ

    10

    30

    70

    50

    Max. Permissible Forward CurrentIF = f(T)

    OHL01506

    FI

    0

    0.02

    0.04

    0.06

    0.08

    0.10

    0.12

    A

    pt-510 -410 -310 -210 -110 010 110 210

    0.0050.050.5

    s

    Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 85 °C

    OHL01505

    FI

    0

    0.02

    0.04

    0.06

    0.08

    0.1

    0.12

    A

    pt-510 -410 -310 -210 -110 010 110 210

    0.0050.050.5

    s

    Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 25 °C

  • LS E63B

    11 Version 1.2 | 2018-09-26

    Dimensional Drawing 8)

    3.8 (0.150) max.

    ø2.5

    5 (0

    .100

    )

    0.13 (0.005)

    0.18 (0.007)

    0.1 (0.004) typ

    markingPackage

    1.1

    (0.0

    43)

    0.5

    (0.0

    20)

    2.6 (0.102)

    3.4

    (0.1

    34)

    3.0

    (0.1

    18)

    2.1 (0.083)

    2.3 (0.091)

    3.0 (0.118)

    3.7

    (0.1

    46)

    3.3

    (0.1

    30) 4

    ˚±1

    GPLY6023

    0.4 (0.016)

    0.6 (0.024)

    0.9 (0.035)

    0.7 (0.028)

    1.7 (0.067)2.1 (0.083)

    0.6 (0.024)

    0.8 (0.031)

    A C

    CC

    ø2.6

    0 (0

    .102

    )

    CC

    CA

    Approximate Weight: 38.0 mg

    Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)

  • LS E63B

    12 Version 1.2 | 2018-09-26

    For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning.

    Recommended Solder Pad 8)

    OHLPY440

    Padgeometrie fürverbesserte Wärmeableitung

    improved heat dissipationPaddesign for

    LötstoplackSolder resist

    0.8 (0.031)

    3.7

    (0.1

    46)

    1.1

    (0.0

    43)

    2.3 (0.091)

    3.3 (0.130)

    1.5

    (0.0

    59)

    11.1

    (0.4

    37)

    Cu Fläche / 16 mm per pad2Cu-area

    _<

    3.3 (0.130)

    Kathode/Cathode

    Anode

    0.7 (0.028)

    Fläche darf bei Verwendung von TOPLED®

    For TOPLED® assembly do not use

    elektrisch nicht beschaltet werden.

    this area for electrical contact

    Fläche darf bei Verwendung von TOPLED®

    For TOPLED® assembly do not use

    elektrisch nicht beschaltet werden.

    this area for electrical contact

  • LS E63B

    13 Version 1.2 | 2018-09-26

    Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

    00

    s

    OHA04525

    50

    100

    150

    200

    250

    300

    50 100 150 200 250 300t

    T

    ˚C

    St

    t

    Pt

    Tp240 ˚C

    217 ˚C

    245 ˚C

    25 ˚C

    L

    Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

    Ramp-up rate to preheat*)25 °C to 150 °C

    2 3 K/s

    Time tSTSmin to TSmax

    tS 60 100 120 s

    Ramp-up rate to peak*)TSmax to TP

    2 3 K/s

    Liquidus temperature TL 217 °C

    Time above liquidus temperature tL 80 100 s

    Peak temperature TP 245 250 °C

    Time within 5 °C of the specified peaktemperature TP - 5 K

    tP 10 20 30 s

    Ramp-down rate*TP to 100 °C

    3 4 K/s

    Time25 °C to TP

    480 s

    All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

  • LS E63B

    14 Version 1.2 | 2018-09-26

    Taping 8)

  • LS E63B

    15 Version 1.2 | 2018-09-26

    Tape and Reel 9)

    Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU

    330 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2000

  • LS E63B

    16 Version 1.2 | 2018-09-26

    Barcode-Product-Label (BPL)

    Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

    Dry Packing Process and Materials 8)

    OHA00539

    OSRA

    M

    Moisture-sensitive label or print

    Barcode label

    Desiccant

    Humidity indicator

    Barcode label

    OSRAM

    Please check the HIC immidiately afterbag opening.

    Discard if circles overrun.Avoid metal contact.

    WET

    Do not eat.

    Comparatorcheck dot

    parts still adequately dry.

    examine units, if necessary

    examine units, if necessary

    5%

    15%

    10%bake units

    bake units

    If wet,

    change desiccant

    If wet,

    Humidity IndicatorMIL-I-8835

    If wet,

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  • LS E63B

    17 Version 1.2 | 2018-09-26

    Transportation Packing and Materials 8)

    OHA02044

    PACK

    VAR:

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    Dimensions of transportation box in mmWidth Length Height

    349 ± 5 mm 349 ± 5 mm 33 ± 5 mm

  • LS E63B

    18 Version 1.2 | 2018-09-26

    Schematic test method for partial flux measurement

  • LS E63B

    19 Version 1.2 | 2018-09-26

    Chip Technology: 5: HOP 2000 B: HOP 2000 C: ATON D: Low cost ThinGaN/ Thinfilm (e.g. 6mil) F: Thinfilm InGaAlP G: ThinGaN(Thinfilm InGaN) (Subcon:Sapphire)

    ´ Encapsulant Type / Lens Properties 7: Colorless clear or white volume conversion

    (resin encapsulation) S: Silicone (with or without diffuser) 3: lens 30° … 70° 5: lens 40° .. 80°

    Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: A: 617 nm amber W: white S: 633 nm super red UW: ultra white T: 528 nm true green CW: warm white Y: 587 nm yellow CB: color on demand blue O: 606 nm orange CR: crystal pink CP/P: 560 nm pure green R: 625 nm red B: 470 nm blue

    L: Light emitting diode

    Package Type E: PowerTOPLED

    Lead / Package Properties 6: folded leads T: folded leads, improved corrosion stability

    (Au-LF), w/o TiO2 jetting

    Type Designation System

    L A E 6 7 6

  • LS E63B

    20 Version 1.2 | 2018-09-26

    NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

    Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

    For further application related informations please visit www.osram-os.com/appnotes

  • LS E63B

    21 Version 1.2 | 2018-09-26

    Disclaimer

    DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.

    Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS webside.

    PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

    Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.

    In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.

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    Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal

    reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).

    2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-tion is not allowed.

    3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3).

    4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).

    5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

    es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

    7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.

    8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

    9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

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    Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.