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LM 118-N , L M 218 -N , L M 318 -N

www.ti.com SNOSBS8C MARCH 1998 REVISED MARCH 2013

LM 118-N /lm 21 8-N /LM 31 8-N O p era tion al A m plifiersCheck for Samples: LM118-N , LM218-N , LM318-N

1FEATURES DESCRIPTIONThe LM118 series are precision high speed2 15 MHz Small Signal Bandwidthoperational amplifiers designed for applications

Ensured 50V/ s Slew Rate requiring wide bandwidth and high slew rate. They Maximum Bias Current of 250 nA feature a factor of ten increase in speed over general

purpose devices without sacrificing DC performance. Operates from Supplies of 5V to 20V Internal Frequency Compensation The LM118 series has internal unity gain frequency

compensation. This considerably simplifies its Input and Output Overload Protectedapplication since no external components are

Pin Compatible with General Purpose Op necessary for operation. However, unlike mostAmps internally compensated amplifiers, external frequency

compensation may be added for optimumperformance. For inverting applications, feedforwardcompensation will boost the slew rate to over

150V/ s and almost double the bandwidth.Overcompensation can be used with the amplifier forgreater stability when maximum bandwidth is notneeded. Further, a single capacitor can be added toreduce the 0.1% settling time to under 1 s.

The high speed and fast settling time of these opamps make them useful in A/D converters, oscillators,active filters, sample and hold circuits, or generalpurpose amplifiers. These devices are easy to applyand offer an order of magnitude better ACperformance than industry standards such as theLM709.

The LM218-N is identical to the LM118 except that

the LM218-N has its performance specified over a25C to +85C temperature range. The LM318-N isspecified from 0C to +70C.

Fast Voltage Follower

Do not hard-wire as voltage follower (R1 5 k)1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date. Copyright 19982013, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does not

necessarily include testing of all parameters.
http://www.ti.com/product/lm118-n?qgpn=lm118-nhttp://www.ti.com/product/lm218-n?qgpn=lm218-nhttp://www.ti.com/product/lm318-n?qgpn=lm318-nhttp://www.ti.com/http://www.ti.com/product/lm118-n#sampleshttp://www.ti.com/product/lm218-n#sampleshttp://www.ti.com/product/lm318-n#sampleshttp://www.ti.com/product/lm318-n#sampleshttp://www.ti.com/product/lm218-n#sampleshttp://www.ti.com/product/lm118-n#sampleshttp://www.ti.com/http://www.ti.com/product/lm318-n?qgpn=lm318-nhttp://www.ti.com/product/lm218-n?qgpn=lm218-nhttp://www.ti.com/product/lm118-n?qgpn=lm118-n

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LM 118-N , L M 218 -N , L M 318 -N

SNOSBS8C MARCH 1998REVISED MARCH 2013 www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings (1)(2)

Supply Voltage 20V

Power Dissipation (3) 500 mW

Differential Input Current (4) 10 mA

Input Voltage (5) 15V

Output Short-Circuit Duration Continuous

Operating Temperature Range

lm118-n 55C to +125C

LM218-N 25C to +85C

LM318-N 0C to +70C

Storage Temperature Range 65C to +150C

Lead Temperature (Soldering, 10 sec.)

TO-99 Package 300C

PDIP Package 260C

Soldering InformationDual-In-Line Package

Soldering (10 sec.) 260C

SOIC Package

Vapor Phase (60 sec.) 215C

Infrared (15 sec.) 220C

ESD Tolerance (6) 2000V

(1) Refer to RETS118X for LM118H and LM118J military specifications.(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.(3) The maximum junction temperature of the lm118-n is 150C, the LM218-N is 110C, and the LM318-N is 110C. For operating at

elevated temperatures, devices in the LMC package must be derated based on a thermal resistance of 160C/W, junction to ambient, or20C/W, junction to case. The thermal resistance of the dual-in-line package is 100C/W, junction to ambient.

(4) The inputs are shunted with back-to-back diodes for overvoltage protection. Therefore, excessive current will flow if a differential input

voltage in excess of 1V is applied between the inputs unless some limiting resistance is used.(5) For supply voltages less than 15V, the absolute maximum input voltage is equal to the supply voltage.(6) Human body model, 1.5 k in series with 100 pF.

Electrical Characteristics (1)

Parameter Conditions LM118-N/LM218-N LM318-N Units

Min Typ Max Min Typ Max

Input Offset Voltage T A = 25C 2 4 4 10 mV

Input Offset Current T A = 25C 6 50 30 200 nA

Input Bias Current T A = 25C 120 250 150 500 nA

Input Resistance T A = 25C 1 3 0.5 3 M

Supply Current T A = 25C 5 8 5 10 mA

Large Signal Voltage Gain T A = 25C, V S = 15V 50 200 25 200 V/mV

VOUT = 10V, R L 2 k

Slew Rate T A = 25C, V S = 15V, A V = 1 50 70 50 70 V/ s(2)

Small Signal Bandwidth T A = 25C, V S = 15V 15 15 MHz

Input Offset Voltage 6 15 mV

Input Offset Current 100 300 nA

(1) These specifications apply for 5V VS 20V and 55C TA +125C (lm118-n), 25C TA +85C (LM218-N), and 0C TA +70C (LM318-N). Also, power supplies must be bypassed with 0.1 F disc capacitors.

(2) Slew rate is tested with V S = 15V. The lm118-n is in a unity-gain non-inverting configuration. V IN is stepped from 7.5V to +7.5V andvice versa. The slew rates between 5.0V and +5.0V and vice versa are tested and specified to exceed 50V/ s.

2 Submit Documentation Feedback Copyright 19982013, Texas Instruments Incorporated

Product Folder Links: LM118-N LM218-N LM318-N
http://www.ti.com/product/lm118-n?qgpn=lm118-nhttp://www.ti.com/product/lm218-n?qgpn=lm218-nhttp://www.ti.com/product/lm318-n?qgpn=lm318-nhttp://www.ti.com/http://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SNOSBS8C&partnum=LM118-Nhttp://www.ti.com/product/lm118-n?qgpn=lm118-nhttp://www.ti.com/product/lm218-n?qgpn=lm218-nhttp://www.ti.com/product/lm318-n?qgpn=lm318-nhttp://www.ti.com/product/lm318-n?qgpn=lm318-nhttp://www.ti.com/product/lm218-n?qgpn=lm218-nhttp://www.ti.com/product/lm118-n?qgpn=lm118-nhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SNOSBS8C&partnum=LM118-Nhttp://www.ti.com/http://www.ti.com/product/lm318-n?qgpn=lm318-nhttp://www.ti.com/product/lm218-n?qgpn=lm218-nhttp://www.ti.com/product/lm118-n?qgpn=lm118-n

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LM 118-N , L M 218 -N , L M 318 -N


TYPICAL PERFORMANCE CHARACTERISTICSLM118-N, LM218-N

Input Current Voltage Gain

Figure 1. Figure 2.

Power Supply Rejection Input Noise Voltage

Figure 3. Figure 4.

Common Mode Rejection Supply Current

Figure 5. Figure 6.



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LM 118-N , L M 218 -N , L M 318 -N


TYPICAL PERFORMANCE CHARACTERISTICS (continued)LM118-N, LM218-N

Closed Loop OutputImpedance Current Limiting

Figure 7. Figure 8.

Input Current Unity Gain Bandwidth

Figure 9. Figure 10.

Voltage Follower Slew Rate Inverter Settling Time


Copyright 19982013, Texas Instruments Incorporated Submit Documentation Feedback 5


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TYPICAL PERFORMANCE CHARACTERISTICS (continued)LM118-N, LM218-N

Large Signal Frequency Response Open Loop Frequency Response


Voltage Follower Pulse Response Large Signal Frequency Response


Open Loop Frequency Response Inverter Pulse Response




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LM 118-N , L M 218 -N , L M 318 -N


Typical Performance CharacteristicsLM318-N

Input Current Voltage Gain


Power Supply Rejection Input Noise Voltage


Common Mode Rejection Supply Current




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LM 118-N , L M 218 -N , L M 318 -N


Typical Performance Characteristics (continued)LM318-N

Large Signal Frequency Response Open Loop Frequency Response


Voltage Follower Pulse Response Large Signal Frequency Response


Open Loop Frequency Response Inverter Pulse Response




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AUXILIARY CIRCUITS

Figure 39. Offset Balancing

*Balance circuit necessary for increasedslew.

Slew rate typically 150V/ s.

Figure 37. Feedforward Compensationfor Greater Inverting Slew Rate

Figure 40. Isolating Large Capacitive Loads

Figure 41. OvercompensationSlew and settling time to 0.1% for a 10Vstep change is 800 ns.

Figure 38. Compensation for Minimum SettlingTime



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TYPICAL APPLICATIONS

Do not hard-wire as voltage follower (R1 5 k)

Figure 42. Fast Voltage Follower

CF = Large(CF 50 pF)*Do not hard-wire as integrator or slow inverter; insert a 10k-5 pF network in series with the input, to preventoscillation.

Do not hard-wire as voltage follower (R1 5 k)

Figure 43.

Figure 45. Differential AmplifieFigure 44. Fast Summing Amplifier



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LM 118-N , L M 218 -N , L M 318 -N


Figure 50. Fast Summing Amplifier with Low Input Current

Figure 51. Wein Bridge Sine Wave Oscillator

Figure 52. Instrumentation Amplifier



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LM 118-N , L M 218 -N , L M 318 -N


Schematic Diagram



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LM 118-N , L M 218 -N , L M 318 -N


Pin Diagram

Available per JM38510/10107.

Available per JM38510/10107.Dual-In-Line Package(Top View) Dual-In-Line Package

See Package Number J (R-GDIP-T14) (Top View)See Package Number NAB008A, D (R-PDSO-G8),

or P (R-PDIP-T8)

Pin connections shown on schematic diagram and typical applications are for TO-99 package.

TO-99 Package(Top View)

See Package Number LMC (O-MBCY-W8)



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REVISION HISTORY

Changes from Revision B (March 2013) to Revision C Page

Changed layout of National Data Sheet to TI format .......................................................................................................... 16



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PACKAGE OPTION ADDENDUM

www.ti.com 12-Jul-2014

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (C) Device Marking(4/5)

LM118H ACTIVE TO-99 LMC 8 500 TBD Call TI Call TI -55 to 125 LM118H

LM118H/NOPB ACTIVE TO-99 LMC 8 500 Green (RoHS& no Sb/Br)

POST-PLATE Level-1-NA-UNLIM -55 to 125 LM118H

LM318M NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM318M

LM318M/NOPB ACTIVE SOIC D 8 95 Green (RoHS& no Sb/Br)

CU SN Level-1-260C-UNLIM 0 to 70 LM318M

LM318MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)

CU SN Level-1-260C-UNLIM 0 to 70 LM318M

LM318N LIFEBUY PDIP P 8 40 TBD Call TI Call TI 0 to 70 LM318N

LM318N/NOPB ACTIVE PDIP P 8 40 Green (RoHS& no Sb/Br)

CU SN Level-1-NA-UNLIM 0 to 70 LM318N

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
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PACKAGE OPTION ADDENDUM

www.ti.com 12-Jul-2014

Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

LM318MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 1

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*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM318MX/NOPB SOIC D 8 2500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 23-Sep-2013

Pack Materials-Page 2

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as components) are sold subject to TIs terms and conditions of salesupplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TIs termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.

TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provideadequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright 2014, Texas Instruments Incorporated
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