Lite-On Semiconductor Corp.( 敦南科技 )

LITE-ON GROUP

LITE-ON GROUPSINCE 1975

Chairman : Raymond Soong

INVESTMENT BUSINESS & CULTURAL FOUNDATION

PC/ INTERNET PLATFORM,COMM & SEMI BUSINESS

LITE-ON IT. CORP.

LITE-ON AUTO. CORP.

LITE-ON ENCLOSURE INC

LITE-ON JAPAN

LITE-ON INC.

SILPORT INVEST. CORP.

LITE-ON CULTURAL FOUNDATION.

DYNA INVEST. CO., LTD.

LITE-ON e Segment

LITE-ON TECH CORP.(LITE-ON ELEC. INC.)

(SILITEK CORP.)(GVC CORP.)

LITE-ON SEMICONDUCTOR CORP.

DIODE INC.

敦南科技LITE-ON Semiconductor Corp.

TO BE A WORLD CLASS EXCELLENT COMPANY.

OUR MISSION

TO OFFER BEST QUALITY PRODUCTSAND SERVICES TO MAINTAIN CORPORATE

GROWTH AND PROFITABILITY.

OUR VISION

Brief of LITE-ON Semiconductor

Capital : US$ 88.6M資本額Revenue : US$ 194M (Y2003 consolidated)營業額Employee : 3,919 人 (up to Jul. 31, 2003)Main Products : CIS,Cmos Camera Module, Diodes, Rectifiers, Thyristors, Transistors主要產品 接觸式影像感測器、 Cmos 照相模組 , 二極體、整流器、閘流體、 電晶體

Facility : Hisn-Tien, Taiwan (Image)Cavite, Philippines (Image)

Wuxi,China(Image) Keelung, Taiwan (Discrete)

Shanghai, China (SSEC & KaiHong, Discrete)

Human Resource of

LITE-ON Semi. Shanghai - Seefull (1073 人 ) - Kai Hong (605 人 )

Missouri - Fabtech (186 人 )

Wuxi - LSC (650 人 )

Taipei - LSC (697 人 ) - DII (47 人 )

Philippines - Dyna Image (586 人 )

French - DIC Sales Office (2 人 )

Westlake - DIC (73 人 )

TOT EMPLOYEE 3,919 人

JAPAN

• SHARP

• KME (PANASONIC)

• MGCS(PANASONIC)

• SANYO

• RICOH

• BROTHER

• KYOCERA MITA

• OKI

• MURATA

• RISO

Europe/AmericaEurope/America

• PHILIPS (AUSTRIA)

• SAGEM (FRANCE)

• HP

• ESSNET (SWEDEN)

• REINER (GERMANY)

• ANATECH (America)

• PAN (ITALY)

• VISIONEER

(America)

• DOCUPORT

(Canada)

TAIWAN

BENQ

KIMPO ( 金寶 )

LITEON TECH (SIL

ITEK 旭麗 )

TECO ( 東友 )

MUSTEK ( 鴻友 )

PLUSTEK ( 精益 )

UMAX (CMOS)

QUANTA (CMOS)

• SAMSUNG

• SINDO RICOH

• KBT (CMOS)

• MAXON (CMOS)

• VOXSON(CMOS)

KOREAKOREA

MAIN CUSTOMER LIST

LITE-ON SEMICONDUCTOR CORP.敦南科技股份有限公司

LITE-ON SEMICONDUCTOR CORP.敦南科技股份有限公司

Discrete SBU分離式元件事業部Discrete SBU分離式元件事業部

IMAGE SBG影像事業群

IMAGE SBG影像事業群

LITE-ON SemiconductorOrganization Chart

CIS SBUCIS 事業部CIS SBU

CIS 事業部CCM SBU

CCM 事業部CCM SBU

CCM 事業部

Wuxi Plant

( 無錫廠 )

Wuxi Plant

( 無錫廠 )

Phili. Plant

( 菲律賓廠 )

Phili. Plant

( 菲律賓廠 )

Hsin-TienPlant

( 新店廠 )

Hsin-TienPlant

( 新店廠 )

Wuxi Plant

( 無錫廠 )

Wuxi Plant

( 無錫廠 )

Phili. Plant

( 菲律賓廠 )

Phili. Plant

( 菲律賓廠 )

Hsin-TienPlant

( 新店廠 )

Hsin-TienPlant

( 新店廠 )

上海旭福廠上海旭福廠 基隆廠基隆廠

CMOS SBUJ.M. Lin

G.M.

CMOS SBUJ.M. Lin

G.M.

LITE-ON SemiconductorOrganization Chart

Project ENG.Meadi JengProject ENG.Meadi Jeng

Process/TestENG.

Vincent Hsiao

Process/TestENG.

Vincent Hsiao

Sales & MKTSteven ChengSales & MKT

Steven ChengProcurementS. F. ChangProcurementS. F. Chang

QRAFumio Chin

QRAFumio Chin

Project ManagementJacky Tsai

Project ManagementJacky Tsai

LITE-ON Semi. Corp., Phils. , China

Phils. China

Founded December 1995 December 2002

Location Lot 1&2, Block 24, Phase 4, Peza Ecozone, Rosario, Cavite Phils.

No. 2, Chang Jiang S Rd., New District, Wuxi CityJiangsu, PRC.

Lot Area 10,000 sq. meters 227,600 sq. meters

Employees Around 586 Around 650

Inside the Factory & the Clean Room (100)

Roadmap of CMOS Camera Module

1.3 / 2.1 MRGB/YUV

Interface: SPI / MMC

USB1.1

SD interface

CameraModule forMobile Phone

PC Camera USB 2.0

03 04 05

Camera Module for PDA

USB interface

VGA module/YUV output.35u; 1/4

”;8.0X8.0X6.0mm(2003-2004).25u; 1/4.5 “;

7.5X7.5X5.0mm(2004-2005)

1.3 M moduleRGB output

.18u; 1/4“; 9X9X7mm

06

2.1 M moduleRGB output.18u; 1/2“;

10.5X10.5X7.77mm

Structure of CMOS Camera Module

Target thickness:

<6mm for VGA

<6mm for CIF

0.25mm

0.50mm

SensorIR Filter

FPCPCB

Lens

Components

Holder

COB TYPE:

Patent Number : 92118123

Patent Date : 07/02/2003

LSC total solution of CCM

Size Structure

CIFPixelplus

PO2010N1/7"

DS-050NEWMAX 1/7" 1P 7.5*7.5*5.3 Bayer/YUV/RGB

DVDD : 2.5V

AVDD : 2.5V

Digital IO : 1.8V - 2.8V

Pixelplus

PO3030N1/6" 907A LARGAN 1/6" 2P 6*6*4.5 Bayer/YUV/RGB

DVDD : 1.8V

AVDD : 1.8V

Digital IO : 1.8V - 3.3V

socket type

available

OV 7660 1/5" 923B LARGAN 1/5" 3P 6.5*6.5*5 Bayer/YUV/RGB

DVDD : 1.8V

AVDD : 2.5V

Digtial IO : 2.5V - 3.3V

Hynix

HV7131GP1/4"

DS055BNEWMAX 1/4" 2P 8*8*5.3 Bayer/YUV/RGB

DVDD : 2.8V

AVDD : 2.8V

Hynix

HV7131RP1/4.5"

DS055BNEWMAX 1/4" 2P 8*8*5.3 Bayer/YUV/RGB

DVDD : 2.8V

AVDD : 2.8V

Mircon 1/4"GS8228AGENIUS 1/4" 1G2P 8*10*5.75 Bayer/YUV/RGB

DVDD : 2.8V

AVDD : 2.8V

Pixelplus

PO3130K1/3.2"

KT30370CJLKANTO 1/4" 3P 9*9*6.6 Bayer/YUV/RGB

DVDD : 1.8V

AVDD : 1.8V

Digital IO : 1.8V - 3.3V

OV 9650 1/4"KT30370CJL

KANTO 1/4" 3P 9*9*6.6 Bayer/YUV/RGB

DVDD : 1.8V

AVDD : 2.5V

Digital IO : 2.5V - 3.3V

9*9*6.9socket type

available

Mircon

MT9M0111/3" 924B LARGAN 1/3" 1G2P 9.5*9.5.6.6 Bayer

DVDD : 2.8V

AVDD : 2.8V

Digital IO : 1.8V - 2.8V

Mircon

MT9M1111/3" 924B LARGAN 1/3" 1G2P 9.5*9.5*6.6 Bayer/YUV/RGB

DVDD : 2.8V

AVDD : 2.8V

Digital IO : 1.8V - 2.8V

10*10*6.9

MarcoLensSize

Remark

VGA

Resolutuon SensorChipSize

ModuleSize(Min)

Lens Detail

supplierLens Spec

SXGA(1.3M)

VoltData Format

LSC total solution of CCM

Size StructureZoran

ZR323161/2.7" DSL951 SUNEX 1/2.7" 3P 10.5*10.5*7.8 Bayer

DVDD : 3.3V

AVDD : 3.3V

Pixelplus 1/3" SHOWIN 1/3" 1G2P 9*9*7.7 Bayer/YUV/RGBDVDD :

AVDD :

Siliconfile

noon200pc101/3" SHOWIN 1/3" 1G2P 9*9*7.7 Bayer/YUV/RGB

DVDD : 1.8V

AVDD : 2.8V

Digital IO : 2.8V

UXGA(2.0M)

Resolutuon SensorChipSize

MarcoLensSize

Remarksupplier

Lens Spec

Lens DetailModule

Size(Min)Data Format Volt

COB vs. CSP

COST Comparison

COB in LSC CSPCSP Fabrication X OCOB O XSMT X OChip Test X OPCB + FPC Holder O OIR Filter O

(Blue Glass)

O

Testing Labor O/H O OLens O O

Benefit of Socket solution

Shortening the Lead time of Camera module Reducing the cost (w/o FPC, higher Yield rate) Simplifying the production process of Module maker and

customer (easier replace and test ) Standardizing the connector spec of camera module