Listing 823. GPON/EPON the next generation of broadband optoelectronics system on a chip.
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Listing 823. GPON/EPON the next generation of broadband optoelectronics system on a chip
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Transcript of Listing 823. GPON/EPON the next generation of broadband optoelectronics system on a chip.
Listing 823.GPON/EPON the next generation of broadband
optoelectronics system on a chip
GPON on a Chip
GPON/EPON the next generation of broadband optoelectronics system on a chip
Optical networking. Use of proven
semiconductor fabrication technology to build a low cost, integrated electrical and optical system on the same IC chip (GPON).
Market
Primary market is manufacturing of electrical and/or optical network communication components.
This is a global opportunity as high-speed networks are being installed all over the world.
Market Growth
Significant global growth for the PON technology is predicted in the next five years.
Worldwide market for GPON electronics -- optical network terminals (ONTs) and optical line terminals (OLTs) -- will be worth $4.7 billion in 2011, up from about $1.3 billion this year.
Major players
Verizon Ericsson AB Alcatel-Lucent France Telecom Nokia Siemens Networks Cisco Intel PacketFront
Problem Solved by the Technology
Integration between optical and electronics-based systems by using a single device.
Today the connectivity is made through specially made couplers and components that have relatively higher losses, more expensive to manufacture, and are less reliable.
How the Technology Solves the Problem
A proven semiconductor manufacturing processes and methodologies, which are very precise, reliable, and at a lowest cost of manufacturing.
Technology Deployment
Delivered to the manufactures via systems and processes used by semiconductor manufacturing companies.
The products will be sold to the network content providers.
Competitive Advantage
Significant cost savings. Lower cost resulting from
fewer components.
Development Platform
Manufactured with semiconductor processing tools.
Development Status
Near prototype stage. Optical coupler is ready for
production, detectors and filters are off the shelf, the laser diode needs to be reconfigured, gratings on the silicon substrate need optimization.
Intellectual Property Ownership
The I.P. belongs to the seller, a large U.S. semiconductor manufacturing materials company.
There are no known liens or encumbrances.
Patent Status
U.S. Patents Pending: 1. Patterning 3-D
Features in a Substrate. 2. Optical Coupling to IC Chip.
3. Multiplexed Optical Sub-Assembly.
4. Wafer Level Alignment of Optical Elements.
Patent information provided upon request.
Productization
The existing development team is in Silicon Valley, USA.
Some engineering resources would be required to complete the development.
The team and know-how are available from the U.S.
Deal Structure Sought
The deal structure envisaged is the sale of this technology asset.
Acquisition in 3 parts: Initial acquisition. Payment triggered when
patents are issued. Royalties on product
sales3-5% Royalties
Frequently Asked Questions And Answers
Why is the developer of this technology listing this technology? Although the developer
is a Fortune 500 company, it supplies semiconductor manufacturers and does not have existing channels to bring this product to market.
Follow Up
Please refer to Tynax listing number: 823 with regard to this opportunity.
Inquiries should be directed to: Moshe Sarfaty [email protected]
Thank You
