LG P999 P999DW T-Mobile G2x Service Manual
Transcript of LG P999 P999DW T-Mobile G2x Service Manual
Internal Use Only
Service ManualLG-P999DW
Date: March, 2011 / Issue 1.0
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Table Of Contents
1. INTRODUCTION ..................................................................... 31.1 Purpose ........................................................................................................31.2 Regulatory Information .........................................................................31.3 Abbreviations.............................................................................................5
2. PERFORMANCE ...................................................................... 72.1 Product Name ............................................................................................72.2 Supporting Standard ..............................................................................72.3 Main Parts : GSM Solution .....................................................................72.4 HW Features ...............................................................................................82.5 SW Features ............................................................................................. 102.6 HW SPEC. ................................................................................................. 13
3. TECHNICAL BRIEF ................................................................ 213.1 GENERAL DESCRIPTION ...................................................................... 213.2 GSM MODE .............................................................................................. 233.3 UMTS MODE ............................................................................................ 263.4 GPS RECEIVER.......................................................................................... 283.5 LO GENERATION and DISTRIBUTION CIRCUIT............................ 293.6 OFF-CHIP RF COMPONENTS ............................................................. 313.7 Digital Baseband(AP20H) ................................................................... 353.8 Hardware Architecture ........................................................................ 373.9 Subsystem ................................................................................................ 38 3.10 Power Block ........................................................................................... 433.11 External memory interface ............................................................. 493.12 H/W Sub System .................................................................................. 503.13 Audio and sound ................................................................................ 513.14 Main (8M pixels) & Sub (1.3M pixels) Cameray ....................... 543.15 Display ..................................................................................................... 563.16 Vibrator ................................................................................................... 583.17 HDMl ........................................................................................................ 593.18 Compass Sensor .................................................................................. 603.19 Motion Sensor ...................................................................................... 613. 20 Gyro Sensor .......................................................................................... 623. 21 Proximity Sensor ................................................................................ 63 3. 22 Illumination Sensor ........................................................................... 643. 23 Touch Module .................................................................................... 653. 24 Main Features ..................................................................................... 66
4. TROUBLE SHOOTING .......................................................... 674.1 RF Component ....................................................................................... 674.2 SIGNAL PATH ........................................................................................... 694.3 Checking TCXO Block ........................................................................... 72
4.4 Checking GSM Tx (FEM) Block .......................................................... 744.5 Checking WCDMA Block .................................................................... 774.6 Checking GSM Block ............................................................................ 914.7 GPS/WIFI/BT RF Component ............................................................ 914.8 GPS/WIFI/BT SIGNAL PATH ................................................................ 934.9 Power ON Troubleshooting ............................................................... 954.10 Charger Troubleshooting ................................................................ 984.11 USB Troubleshooting ......................................................................1014.12 Audio troubleshooting ...................................................................1064.13 Sub 1.3M Camera troubleshooting ...........................................1204.14 Main LCD trouble ..............................................................................1234.15 SIM detect Trouble shooting ........................................................1254.16 Side Key Trouble shooing ..............................................................1284.17 Vibrator trouble .................................................................................1304.18 HDMI trouble ......................................................................................1324.19 Motion sensor troubleshooting ..................................................1344. 20 Gyro/Compass sensor troubleshooting .................................1364. 21 Proximity Sensor on/off trouble ................................................1394. 22 Illumination Sensor on/off trouble ...........................................1414. 23 Touch trouble ....................................................................................143
5. DOWNLOAD ....................................................................... 145
6. BLOCK DIAGRAM ............................................................... 164
7. CIRCUIT DIAGRAM ............................................................ 169
8. BGA Pin Map ...................................................................... 186
9. PCB LAYOUT ....................................................................... 196
10. CALIBRATION ................................................................... 20310.1 Calibration & RF Auto Test Program (Tachyon) .....................20310.2 How to use Tachyon .........................................................................207
11. STAND ALONE TEST ........................................................ 211
12. EXPLODED VIEW & REPLACEMENT PART LIST ............. 22512.1 EXPLODED VIEW ................................................................................22512.2 Replacement Parts ...........................................................................22812.3 Accessory .............................................................................................264
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1. INTRODUCTION
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1.1 PurposeThis manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory InformationA. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the this phone or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION1. INTRODUCTION
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1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION
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1. INTRODUCTION
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1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION
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Wireless Application ProtocolWAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION
2. PERFORMANCE
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2.1 Product Name P999 : WCDM1700/2100+EGSM/GSM850/DCS/PCS
(HSUPA 5.7Mbps/HSDPA 14.4Mbps / GPRS Class 10 / EDGE Class 10)
2.2 Supporting Standard
Item Feature Comment Supporting Standard WCDMA(FDD1,4)/EGSM/GSM850/DCS1800/PCS1900
with seamless handover Phase 2+(include AMR) SIM Toolkit : Class 1, 2, 3, C-E
Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHzWCDMA(FDD1) RX : 2110 – 2170 MHz WCDMA(FDD4) TX : 1710 – 1755 MHz WCDMA(FDD4) RX : 2110 – 2155 MHz EGSM TX: 880 – 915 MHz EGSM RX: 925 – 960 MHz GSM850 TX: 824 – 849 MHz GSM850 RX: 869 – 894 MHz DCS1800 TX : 1710 – 1785 MHz DCS1800 RX : 1805 – 1880 MHz PCS1900 TX: 1850 – 1910 MHz PCS1900 RX: 1930 – 1990 MHz
Application Standard
2.3 Main Parts : GSM Solution
Item Part Name Comment Digital Baseband MDM6200: QualcommAnalog Baseband MDM6200: QualcommRF Chip MDM6200: Qualcomm One chip
2. PERFORMANCE
2. PERFORMANCE
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2.4 HW Features
Item Feature Comment Form Factor DOP type Battery 1) Capacity
Standard : Li-Ion Polymer, 1500mAh
2) Packing Type : Soft PackSize Standard : 123.9 x 63.2 x 10.9mm
Weight 139g With Battery Volume TBD PCB L1B1 type, 10 Layers , 0.8tStand by time 2G Up to 410 hrs
3G Up to 330 hrs @ Paging Period 9 (2G) @ DRX 7 (3G)
Charging time 3 hrs @ Power Off / 1500mAh Talk time 2G Up to 340mins
3G Up to 410 mins @ Tx=Max(2G) @ Tx = 12dBm (3G)
RX sensitivity WCDMA(FDD1) : -106.7 dBmWCDMA(FDD4) : -106.7 dBm EGSM : -105 dBm GSM850 : -105 dBm DCS 1800 : -105 dBm PCS 1900 : -105 dBm
TX output power
WCDMA/ GSM/ GPRS
WCDMA : 24dBm/3.84MHz,+1/-3dBmEGSM : 33dBm GSM850 : 33 dBm DCS 1800 : 30 dBm PCS 1900 : 30 dBm
Class3(WCDMA) Class4 (EGSM) Class4 (GSM850) Class1 (PCS) Class1 (DCS)
EDGE GSM 900 : 27 dBmDCS 1800 : 26 dBm PCS 1900 : 26 dBm
E2 (GSM900) E2 (PCS) E2 (DCS)
GPRS compatibility GPRS Class 10EDGE compatibility EDGE Class 10SIM card type Plug-In SIM
2.85V /1.8V Display Main LCD(WVGA)
TFT Main LCD(4.0”, 480X800) Built-in Camera 8M CMOS Camera, 1.3M secondary Status Indicator No Keypad Function Key : 4
Side Key : 3 Function Key : Home,Back, menu, serach Side Key : Volume up,down, power key
ANT Main : LDS(Laser Direct Structure) typeSub : DPA type(Directed Print Antenna)
System connector 5 Pin Micro USBEar Phone Jack 3.5Phi, 4 Pole, Stereo
2. PERFORMANCE
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PC synchronization Yes Memory(AP) eMMC : 8GB
LP-DDR2 : 512MB Speech coding FR, EFR, HR, AMRData & Fax Built in Data & Fax supportVibrator Built in VibratorBlueTooth V2.1 + EDR MIDI(for Buzzer
Function) SW Decoded 72Poly
Music Player MP3/ WMA/AAC/HE-AAC/eAAC+Video Player MPEG4, H.263, H.264, WMV9/VC-1, DiVX
Camcorder MPEG4, H.264, H.263
Voice Recording Yes Speaker Phone mode Support
Yes
Travel Adapter Yes CDROM No Stereo Headset Yes Data Cable Yes T-Flash (External Memory)
Yes Upto 32GB
2. PERFORMANCE
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2.5 SW Features
Item Feature Comment RSSI 0 ~ 4 LevelsBattery Charging 0 ~ 6 LevelsKey Volume 0 ~ 7 LevelAudio Volume 1 ~ 15 LevelTime / Date Display Yes Multi-Language Yes CZECH,DUTCH,FRENCH, GERMAN ,
GREEK,ITALIAN,PORTUGUESE,SPANISH,ARABIC, HEBREW , T CHINESE TW,SCHINESE,ROMANIAN,HUNGARIAN,SLOVAK,CROATIAN,BULGARIAN , MACEDONIAN , ICELANDIC
Quick Access Mode Phone / Contacts / Messaging / Menu
PC Sync Yes Speed Dial Yes Voice mail center -> 1 key Profile Yes not same with feature phone
setting CLIP / CLIR Yes Phone Book Name/Number/Email/ChatId/Websi
te/Postaladdresses/Organizations/Groups/BirthdayNotes/Ringtone
There is no limitation on the number of items. It depends on available memory amount.
Last Dial Number Yes There is no limitation on the number of items. It depends on available memory amount.
Last Received Number
Yes There is no limitation on the number of items. It depends on available memory amount.
Last Missed Number Yes There is no limitation on the number of items. It depends on available memory amount.
Search by Number / Name
Name / N
Group Yes There is no limitation on the number of items. It depends on available memory amount.
Fixed Dial Number Yes Service Dial Number No Own Number Yes Read only
(add/edit/delete are not supported)
Voice Memo Yes Support voice recorder Call Reminder Yes Missed call popup
2. PERFORMANCE
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Network Selection Automatic
Mute Yes Call Divert Yes Call Barring Yes Call Charge (AoC) Yes Call Duration Yes SMS (EMS) There is no limitation on the
number of items. It depends on available memory amount.
EMS does not support.
SMS Over GPRS No EMS Melody / Picture Send / Receive / Save
No No
MMS MPEG4 Send / Receive / Save
Yes Yes
Long Message MAX 459 characters SMS 3pages
Cell Broadcast Yes Download Over the WebGame Yes Calendar Yes Memo Yes There is no limitation on the
number of items. It depends on available memory amount.
World Clock Yes Unit Convert No Stop Watch Yes Wall Paper Yes WAP Browser No Support only web browser based
on webkit. WAP stack and wml are not supported.
Download Melody / Wallpaper
Yes Over web browser
SIM Lock Yes Operator Dependent SIM Toolkit Class 1, 2, 3, C, DMMS Yes EONS Yes CPHS Yes V4.2ENS Yes Camera Yes 8M AF / Digital Zoom : x8 JAVA No Android do not support JAVA Voice Dial No IrDa No Bluetooth Yes Ver. 2.1+EDR
(GAP, A2DP, AVRCP, DUN, FTP, GAVDP, GOEP, HFP, HSP, OPP, SDAP, SPP)
FM radio No
GPRS Yes Class 10
2. PERFORMANCE
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EDGE Yes Class 10Hold / Retrieve Yes Conference Call Yes Max. 6DTMF Yes Memo pad No TTY No AMR Yes SyncML Yes IM Yes GtalkEmail Yes
2. PERFORMANCE
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2.6 HW SPEC. 2.6.1) GSM transceiver specification
Item Specification
Phase Error Rms : 5° Peak : 20 °
Frequency Error GSM : 0.1 ppm DCS/PCS : 0.1 ppm
EMC(RadiatedSpurious Emission Disturbance) GSM/DCS : < -28dBm
Transmitter Output power and Burst Timing
GSM : 5dBm – 33dBm ± 3dB DCS/PCS : 0dBm – 30dBm ± 3dB
Burst Timing <3.69usSpectrum due to modulation out to lessthan 1800kHz offset
200kHz : -36dBm 600kHz : -51dBm/-56dBm
Spectrum due to modulation out to larger than 1800kHz offset to the edge of the transmit band
GSM : 1800-3000kHz :< -63dBc(-46dBm) 3000kHz-6000kHz : <-65dBc(-46dBm) 6000kHz < : < -71dBc(-46dBm) DCS :1800-3000kHz :< -65dBc(-51dBm) 6000kHz < : < -73dBc(-51dBm)
Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm
600kHz : -21dBm/-24dBm(5/0), -26dBm Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)Usable receiver input level range 0.012(-15 - -40dBm)Intermodulation rejection – Speech channels
± 800kHz, ± 1600kHz : -98dBm/-96dBm (2.439%)
AM Suppression GSM : -31dBm
- DCS : -29dBm -98dBm/-96dBm (2.439%)
Timing Advance ± 0.5T
2.6.2) WCDMA transmitter specification Item Specification
Transmit Frequency BD1: 1920MHz ~ 1980 MHzBD4: 1710~1755 MHz
Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB
Frequency Error within ±0.1 PPMOpen Loop Power Control Normal Conditions : within ±9 dB,
Extreme Conditions : within ±12 dB Minimum Transmit Power < -50 dBm /3.84 MHz
Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)Adjacent Channel Leakage Power Ratio (ACLR)
> 33 dB @ ±5 MHz,> 43 dB @ ±10 MHz
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Spurious Emissions |f-fc| > 12.5 MHz
< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz < -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz < -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz < -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz < -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz < -60 dBm / 3.84 MHz RW @ 1930 MHz ≤ f ≤ 1900 MHz < -60 dBm / 3.84 MHz RW @ 2110 MHz ≤ f ≤ 2155 MHz < -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz < -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz < -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz < -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz
Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz
when Interference CW Signal Level = -40 dBc Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBmPeak Code Domain Error < -15 dB at Pout -20 dBm
2.6.3) WCDMA receiver specification Item Specification
Receive Frequency BD1: 2110 MHz ~2170 MHzBD4: 2110~2155 MHz
Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz Band4 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz
Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz Adjacent Channel Selectivity (ACS)
ACS > 33 dB where BER < 0.001 when Îor = -92.7 dBm / 3.84 MHz & Ioac = –52 dBm / 3.84 MHz @ ±5 MHz
Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz
Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz & Iblocking = -44 dBm
Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz & Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz & Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz
Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz
Inner Loop Power Control In Uplink
Adjust output(TPC command)cmd 1dB 2dB 3dB +1 +0.5/1.5 +1/3 +1.5/4
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -1 -0.5/-1.5 -1/-3 -1.5/-4 group(10equal command group) +1 +8/+12 +16/+24
2. PERFORMANCE
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2.6.4) HSDPA transmitter specification
Item Specification
Transmit Frequency BD1: 1920MHz ~ 1980 MHzBD4: 1710~1755 MHz
Maximum Output Power
Sub-Test 1=1/15, 2=12/15 21~25dBm / 3.84 MHz 3=13/15 4=15/8 20~25dBm / 3.84 MHz 5=15/7 6=15/0 19~25dBm / 3.84 MHz
HS-DPCCH
Sub-test in table C.10.1.4
Power step Power step slot boundary
Power step size, P [dB]
Transmitter power step tolerance [dB]
5
1 Start of Ack/Nack 6 +/- 2.3
2 Start of CQI 1 +/- 0.6
3 Middle of CQI 0 +/- 0.6
4 End of CQI 5 +/- 2.3
Spectrum Emission Mask
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0
Frequency offset from carrier f
Minimum requirement Measurement Bandwidth
2.5 ~ 3.5 MHz -35-15×( f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1×( f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10×( f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Leakage Power Ratio (ACLR)
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 > 33 dB @ ±5 MHz > 43 dB @ ±10 MHz
Error Vector Magnitude
< 17.5 %, when Pout ≥ -20 dBm
2. PERFORMANCE
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2.6.5) HSDPA receiver specification
Item Specification
Receive Frequency
BD1: 2110 MHz ~2170 MHzBD4: 2110~2155 MHz
Maximum Input Level (BLER or R), 16QAM Only
Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0 BLER < 10% or R >= 700kbps
2.6.6) HSUPA Tx, Rx specification
Item Specification
Maximum Output Power
Sub-Test1=11/15 21~24dBm / 3.84 MHz 2=6/15 19~22dBm / 3.84 MHz 3=15/9 20~23dBm / 3.84 MHz 4=2/15 20~25dBm / 3.84 MHz 5=15/15 19~25dBm / 3.84 MHz
Spectrum Emission Mask
Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15
Frequency offset from carrier f
Minimum requirement Measurement Bandwidth
2.5 ~ 3.5 MHz -35-15×( f-2.5)dBc 30 kHz
3.5 ~ 7.5 MHz -35-1×( f-3.5)dBc 1 MHz
7.5 ~ 8.5 MHz -35-10×( f-7.5)dBc 1 MHz
8.5 ~ 12.5 MHz -49dBc 1 MHz
Adjacent Channel Leakage Power Ratio (ACLR)
Sub-Test : 1=11/15, 2=6/15, 3=15/9, 4=2/15, 5=15/15> 33 dB @ ±5 MHz > 43 dB @ ±10 MHz
2.6.7) WLAN 802.11b transceiver specification Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPMChip clock Frequency Tolerance
within ±25 PPM
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Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz ≤ -50 @ f < fc-22MHz and f > fc+22MHz
Power ramp on/off time ≤ 2us
Carrier Suppression ≤ -15dB Modulation Accuracy (Peak EVM)
≤ 35%
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz < -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%
Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8% Rx Adjacent Channel Rejection
≥ 35dB @FER ≤ 8%,interference input signal -70dBm@fc±25MHz(11Mbps)
2.6.8) WLAN 802.11g transceiver specification Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPMChip clock Frequency Tolerance
within ±25 PPM
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz) ≤ -40 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error (rms EVM)
≤ -5dB@6Mbps, ≤ -8dB@9Mbps, ≤ -10dB@12Mbps, ≤ -13dB@18Mbps, ≤ -16dB@24Mbps, ≤ -19dB@36Mbps, ≤ -22dB@48Mbps, ≤ -25dB@54Mbps
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz< -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10%-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps -77dBm@18Mbps, -74dBm@24Mbps, -70dBm@36Mbps -66dBm@48Mbps, -65dBm@54Mbps
Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10% Rx Adjacent Channel Rejection
PER ≤ 10%, ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps
ACR shall be measured by setting the desired signal's strength 3
dB above the rate-dependent sensitivity specified in min input sensitivity
2. PERFORMANCE
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2.6.9) WLAN 802.11n transceiver specification Item Specification
Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )
Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)
Frequency Tolerance within ±25 PPMChip clock Frequency Tolerance
within ±25 PPM
Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz) ≤ -45 @ ±30MHz offset (20MHz ~ 30Mhz)
Transmitter constellation error (rms EVM)
≤ [email protected], ≤ -10dB@13Mbps, ≤ [email protected], ≤ -16dB@26Mbps, ≤ -19dB@39Mbps, ≤ -22dB@52Mbps, ≤ [email protected], ≤ -28dB@65Mbps
Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz< -30 dBm above @ 1GHz ~ 12.75GHz < -47 dBm @ 1.8GHz ~ 1.9GHz < -47 dBm @ 5.15GHz ~ 5.3GHz
Rx Min input Sensitivity PER ≤ 10%[email protected], -79dBm@13Mbps, [email protected] -74dBm@26Mbps, -70dBm@39Mbps, -66dBm@52Mbps [email protected], -64dBm@65Mbps
Rx Max input Sensitivity ≥ -20dBm(6.5,13,19.5,26,39,52,58.5,65Mbps) @ PER ≤ 10% Rx Adjacent Channel Rejection
PER ≤ 10%, ACR ≥ [email protected], ACR ≥ 13dB@13Mbps, ACR ≥ [email protected], ACR ≥ 8dB@26Mbps, ACR ≥ 4dB@39Mbps, ACR ≥ 0dB@52Mbps ACR ≥ [email protected], ACR ≥ -2dB@65Mbps
ACR shall be measured by setting the desired signal's strength 3
dB above the rate-dependent sensitivity specified in min input sensitivity
2.6.10) GPS receiver specification Item SpecificationReceive Frequency 1574.42 MHz ~ 1576.42 MHzMinimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding
2.6.11) Current consumption Stand by
Voice Call VT Bluetooth Off Bluetooth Connected
WCDMA Only
4.5 mA under (DRX=1.28)
7 mA under(DRX=1.28)
230 mA under(Tx=12dBm)
WCDMAOnly
GSM Only
4.5 mA under (Paging=5 period)
7 mA under(Paging=5 period)
270 mA under(Tx=Max)
GSM Only
2. PERFORMANCE
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13
2.6.12) Battery life time Stand by Voice Call VT
WCDMA 350 hours over (DRX = 1.28)
410 min over(TX = 12dBm, Low Pwr mode)
NA
GSM 410 hours over (Paging Period = 9)
340 min over (TX Level = Max) NA
2.6.13) Charging hour 3.5hour under ( 1500mAh battery, 1A TA)
2.6.14) RSSI indicator (Based on Cell power) BAR WCDMA GSM/DCS/PCS
4 Over -90±2dBm Over -90 ±2dBm
43 -90 ±2dBm -90 ±2dBm
32 -96 ±2dBm -97 ±2dBm
21 -102 ±2dBm -103 ±2dBm
10 -110 ±2dBm -107 ±2dBm
2. PERFORMANCE
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14
2.6.15) Battery indicator Battery Bar Specification BAR 6 (Full) 90% over
remain%
BAR 6 --> 5 90% 89% BAR 5 --> 4 70% 69% BAR 4 --> 3 50% 49% BAR 3 --> 2 30% 29% BAR 2 --> 1 15% 14% BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup (No call)
Critical Low Battery Pop-up 0% ~ 3% : Every Level change popup (No call)
POWER OFF 0%
2.6.16) P999 Figures
3. TECHNICAL BRIEF
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3.1 GENERAL DESCRIPTION
The LG-P999 supports UMTS-2100, UMTS-1700, GSM-850, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/EDGE/UMTS. The RF transceiver converts received signals directly from RF to baseband and transmit signals directly from baseband to RF (also known as direct conversion or zero intermediate frequency [ZIF] processing). The LO sources and distribution circuits are also integrated on-chip. Very high peak data rates are supported up to 14.4 Mbps on the WCDMA downlink and 5.76 Mbps on the uplink. Such high data rates enable network operators to provide an even broader range of wireless multimedia and other data services for consumers. Data-only (DO), HSDPA, HSUPA, and HSPA+ are optimized for packet data service.
FEM
D5024
WBand1-PAM
ACPM-5201W2100
DuplexerWCDMA TX SAW
W1700Duplexer
WCDMA TX SAW
WBand4-PAM
SKY77703
MDM6600
RX SAWPRX_HB_INMPRX_HB_IMPPRX_MB1_INMPRX_MB1_INPPRX_LB1_INMPRX_LB1_INPDRX_LB2_INMDRX_LB2_INPDRX_MB1_INMDRX_MB1_INP
G900
G1800/1900
PA_DET_IN
TX_MB4
TX_MB2
GRFC_2/WDOG_DISABLE/GPIO_94CTRL1CTRL2
G850/EGSM
DCS/PCN
TX_LB4
WCDMA2
W2100RX SAW
RX SAW
GSM PAM
ACPM-7868 TX_MB1
GSM850/EGSM TX
PCN/PCS TX
WCDMA1
W1700
G850
ANT_SEL0,1,2,3
CTRL3CTRL4
GRFC_3/BOOT_FROM_ROM/GPIO_95GRFC_4/FAILED_BOOT/GPIO_96GRFC_5/GPIO_97
GPS LNA
ALM-2506RX SAW GNSS_INP
GNSS_INM
RX SAWDRX_HB_INMDRX_HB_INP
[Figure 1-1] Block diagram of RF part
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
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A single analog baseband Tx input is shared by all the MDM transmit paths. Two quadrature upconverters, one dedicated for each band category (low band and high band), translate the Tx waveform directly to the desired RF band. The RF signal is then routed to the appropriate driver amplifier output.
There are eleven RF input ports, all using a differential configuration to maximize common-mode rejection, Tx isolation, out-of-band suppression, and second-order intermodulation performance, thereby eliminating the need for inter-stage SAW filters. There are three quadrature downconverters and three separate interfaces to the baseband circuits – primary, diversity, and GNSS. Although GSM signals can use DRx paths, the PRx LO is used and the diversity baseband signals are routed to the PRx output port to allow the primary baseband Rx circuits to process the GSM signals even when using DRx paths. A dedicated signal path is provided for GNSS, but its downconverter shares a PLL with the DRx downconverter; this means SHDR and GNSS operation cannot occur simultaneously.
The MDM6200 device is powered by PM8028 power management IC. The power source is selected from either the battery, external charger, adaptor, or USB device, and then the IC generates all the regulated voltages needed to power the handset electronics.
The MDM device supports a variety of consumer electronics with its connectivity ports:
- Full-speed universal serial bus (only via HS-USB)
- High-speed USB on-the-go (USB-OTG) with built-in physical layer (PHY)
- USB universal integrated circuit card (USB-UICC)
- Universal asynchronous receiver transmitter (UART) serial ports
- UMTS subscriber identity module (USIM); 1.8 V support (3.3 V support with PMIC-level translators)
- Three integrated secure digital (SD) controllers (two at 1.8 V, one at 2.85 V)
- Pulse-coded modulation (PCM) interface
- Inter-integrated circuit (I2C) interface for peripheral devices
- Inter-IC sound (I2S) interface for digital audio
3. TECHNICAL BRIEF
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Serial peripheral interface (SPI)
3.2 GSM MODE
3.2.1 GSM RECEIVER
The GSM-850/GSM-1800, receiver inputs of PMB5703 are connected directly to the transceiver front-end Module. The GSM-900/GSM-1900 receiver inputs are using the Rx path with WCDMA1900 and WCDMA900 bands. The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance.
Figure 3-1 shows the line-up for the 2G receiver chain for bands serving only GSM. The RX digital front-end (DFE) contains all digital signal processing. Blue arrows show gain switching inputs of the signal processing stages. The signal path splits at the mixer input into an in-phase and an identical quadrature path. For simplicity the 2nd path is not shown in the figure. The quadrature downconverter translates the useful signal directly to baseband (zero-IF).
[Figure 3-1] 2G Receiver Line Up-GSM Single Mode Setup
Figure3-2 shows the 2G receiver line-up in a multimode band. Note the gain step given for the external LNA may vary from the given value. The chain is basically identical to the 3G line-up but many stages in analog and digital domain are switched into a different operation mode.
switch RF filter LNA mixer analogbaseband filter buffer
20 dBgain step
17 dBgain step
6 dBgain step
35 dBgain range(1 dB step)
RX_2G_LINEUP_A
3. TECHNICAL BRIEF
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[Figure 3-2] 2G Receiver Line Up-GSM Multi Mode Setup
Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers – this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900 receive signals are routed to the PMB5703 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. The PMB5703 input uses a differential configuration to improve second-order intermodulation and common mode rejection performance.
The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections.
switch duplexer LNA1interstage
filter
16/-7dB17 dB
gain step6 dB
gain step
35 dBgain range(1 dB steps)
LNA2 mixer analogbaseband filter buffer
RX_2G_LINEUP_MULTI_A
3. TECHNICAL BRIEF
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3.2.2 GSM TRANSMITTER
The transmitter takes the modulating symbols sent from baseband via DigRF Interface and converts them into a RF signal. It is based on a polar modulator architecture where amplitude and phase (or alternatively frequency) are first handled separately and afterwards are merged in the RF domain.
The signal flow can be understood when you look at Figure 3-3. The digital symbol stream enters either a 8PSK or a GMSK modulator, depending on the desired mode. The GMSK signal is thereby differentially encoded as postulated by GSM specification 45.004. If a generator runs out of symbols, it behaves as if an input series of repeating dummy symbols has been applied. To simplify mode switching between 8PSK and GMSK, the two generators are synchronized. In 8PSK mode, the output of the internal 8PSK signal generator is given in Cartesian (I/Q) coordinates. The desired conversion into polar coordinates (amplitude and phase) is executed by a CORDIC algorithm. For GMSK mode the CORDIC algorithm is not involved - the incoming GMSK symbols directly determine the modulation frequency of the sigma-delta modulation loop.
In the phase path the phase signal is differentiated to obtain a frequency signal, which is fed into a preemphasis filter to compensate for narrow PLL bandwidth. Afterwards it is applied to the Sigma-Delta modulation loop. In this way the Sigma-Delta PLL shifts the phase information into RF domain.
The digital amplitude signal is multiplied with the ramping waveform, converted into an analog voltage and filtered. After that it is mixed with the purely phase modulated RF carrier to gain an amplitude and phase modulated output signal. The output power can be influenced directly by a PGA (programmable gain amplifier), if no power control loop is needed, or by specifying a target output level, if a closed power loop for enhanced output power accuracyis desired.
[Figure 3-2] 2G Transmitter Line Up
DIG RF
FIFO
GMSK
8-PSK CORDIC dIY-adj.
ACOC
MUX
rampingpow-contr.
RAMP DATA
interpNZsh
DC offset comp
frac-Nmodulation loop
AM-Modulator
RAMP DATA
vco
REF
TX2G_LINUP _EXT
÷N
AD
DA
3. TECHNICAL BRIEF
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3.3 UMTS MODE
3.3.1 UMTS RECEIVER
Figure 3-4 shows the line-up for the 3G receiver chain. Note that the high gain / low gain figures for external
LNA1 are given as an example. The blue arrows indicate the gain control inputs for the AGC
[Figure 3-3] 3G Receiver Line Up
After quadrature downconversion to baseband(Zero-IF) the signal is fed to the analog baseband filter. The range and gain step of the following buffer amplifier is actually determined by the needs of the AGC in 3G mode.
12 dBgain step
35 dBgain range (1 dB steps)
For band l:SMARTIUE
other bands:extemal LNA1
16 / -7 dB
switch duplexer inter stagefilterLNA1 LNA2 mixer bufferanalog
baseband filter
RX_3G_LINEUP_A
3. TECHNICAL BRIEF
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3.3.2 UMTS TRANSMITTER
Figure 3-4 shows a functional overview of the 3G transmitter chain implemented for RF signal processing. The IQ-chips, which are transferred via the digital interface, are stored in a FIFO. Then it depends on the setting of three signals how samples are consumed from the FIFO Buffer.
Then the samples are fed into a CORDIC, which is used to shift the phase of the complex signal. The root-raisedcosine (RRC) filter performs the pulse shaping according to 3GPP. As the system clock is no integer multiple of the UMTS chip rate a fractional sample rate conversion (FSRC) is necessary. In the amplitude correction / offset correction (AC/OC) block the amplitude and the offset of the IQ-signal are modified. The final sample rate at the output of the digital front end is achieved in the interpolation / noise shaping block, where also the word length is reduced in order to fit to the D/A-converter resolution. After the DAC a post-filter reduces the level of the repetition spectrum and the analog noise in order to supply a clean signal to the IQ-modulator. The frequency conversion to the wanted TX-channel is done in a direct-up conversion IQ-modulator which is followed by a gain stage with a single ended high power output.
[Figure 3-4] 3G Transmitter Line Up
Interface Digital Front End (DFE) DAC Postfilter RF
DIG RF 3G FIFO
CORD
IC
RRC FSRC time adj.
AC / OCinterpNZsh
AD / RET
CORDICWord REQ
EN
ICMP
12 bhsign
QCMP
12 bhsign
DC offset comp
LO ÷N
TX3G_LINEUP
3. TECHNICAL BRIEF
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3.4 GPS RECEIVER
The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the
GPS antenna switch, through saw filter, external LNA and then an impedance optimally matches the
impedance looking into the GPS LNA. The GPS Input Network topology is shown in Figure 1-6.
LNA
SAW filter1565~1606 MHz
Antenna1565~1606 MHz
LNA
SAW filter1565~1606 MHz
Antenna1565~1606 MHz
[Figure 1.6] GPS Input Network Topology
3. TECHNICAL BRIEF
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3.5 LO GENERATION and DISTRIBUTION CIRCUIT
The PMB 5703 contains two synthesizer blocks (see Figure3-6). Depending on UMTS or GMSK/8-PSK mode different VCOs, LF and CPs settings are used. In GMSK/8-PSK mode only the TRX PLL loop with the 2G TRX VCO is working, which is available in the TX synthesizer block (left). In UMTS TX/RX mode, two separate synthesizer blocks are available. The TX synthesizer is in the UMTS TX block (left), where the loop is working with the 3G TX VCO. The RX synthesizer is in UMTS RX block working with the 3G RX VCO
[Figure 3-6] RF Synthesizer (GMSK/8-PSK and UMTS)
In the PMB 5703 the receiver and the transmitter contain each a complete fractional-N sigma-delta synthesizer with fast locking. For GMSK/8-PSK RX operation mode a fractional-N sigma-delta synthesizer for the frequency synthesis is used. For GMSK/8-PSK TX operation mode the fractional-N sigma-delta synthesizer is used as a Sigma-Delta modulation loop to process the phase/frequency signal. A 26 MHz reference signal (provided by an internal clock generation block) serves as comparison frequency of the phase detector. In GMSK/8-PSK mode the divider in the feedback path of the synthesizer is carried out as a multi-modulus divider (MMD). The GMSK/8-PSK loop filter is fully integrated and the loop bandwidth is about 100 kHz to allow the transfer of the phase modulation during GMSK/8-PSK operation. The open loop gain is automatically adjusted prior to each GMSK/8-PSK slot . To overcome the statistical spread of the loopfilter element values an automatic loopfilter adjustment is performed before each GMSK/8-PSK synthesizer startup.
3. TECHNICAL BRIEF
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The fully integrated GMSK/8-PSK quad-band VCO is designed for the four GMSK/8-PSK bands (850, 900, 1800,1900 MHz) and operates at double (for GSM1800 and GSM1900 band) or four times (for GSM850 and GSM900 band) of the transmit or receive frequency. To cover the wide frequency range the VCO is automatically aligned by a binary automatic band selection before the settling process of the synthesizer starts. In UMTS TX and RX mode a fractional-N sigma-delta synthesizer for the frequency synthesis is used. The implemented divider in the feedback path of the synthesizer is carried out as a multi-modulus divider (MMD). Also the 26 MHz reference signal serves as comparison frequency of the phase detector. The UMTS loop filter is fully integrated and the loop bandwidth is about 180 kHz. The open loop gain is automatically adjusted prior each UMTS channel programming.
The two fully integrated UMTS VCOs are designed for the UMTS bands (I, II, III, IV, V, VI, VIII, IX and X) and operates at double (for bands I, II, III, IV, IX and X) or four times (for bands V, VI and VIII) of the transmit or receive frequency. To cover the wide frequency range the VCOs are automatically aligned by a binary automatic band selection before the settling process of the synthesizer starts.
3. TECHNICAL BRIEF
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3.6 OFF-CHIP RF COMPONENTS
3.6.1. UMTS PAM
3.6.1.1 W2100,W900 (U105, ACPM-5281), W1900(U103, ACPM-5202)
The ACPM-5281 is a dual-band PAM (Power Amplifier Module) designed for UMTS Band1 and Band8. The ACPM-5281 meets stringent UMTS linearity requirements. The 4mmx5mm form factor 14-pin surface mount package is self contained, incorporating 50ohm input and output matching networks.
The ACPM-5202 is a fully matched 10-pin surface mount module developed for UMTS Band2. This power amplifier module operates in the 1850-1910MHz bandwidth. The ACPM-5202 meets stringent UMTS linearity requirements up to 28dBm output power (Rel99). The 3mmx3mm form factor package is self contained, incorporating 50ohm input and output matching networks
The ACPM-5281 and ACPM-5202 feature 5th generation of CoolPAM circuit technology which supports 3 modes – bypass, mid and high power modes. The CoolPAM is stage bypass technology which enables power amplifier to lower power consumption. Active bypass feature is added to 5th generation to enhance power added efficiency at low output range and this technology extends talk time of mobiles more by further saving power amplifier’s current consumption. The power amplifier is manufactured on an advanced InGaP HBT (hetero-junction Bipolar Transistor) MMIC (microwave monolithic integrated circuit) technology offering state-of-the-art reliability, temperature stability and ruggedness.
[Figure 3-7] ACPM5281 (W2100,W900)
[Figure 3-8] ACPM-5202(W1900)
3. TECHNICAL BRIEF
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3.6.2 26MHz VCTCXO (X101, DSA221SCL)
The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the PMB5703 IC. The oscillator frequency is controlled by the PMB5703 ICs.
TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.
The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM7227 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 μF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.
26MHz VCTCXO (X101, DSA221SCL)
3. TECHNICAL BRIEF
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3.6.3 FEM + GSM PAM (U104, SKY77529)
The SKY77529 Tx Front End Module (FEM) is designed in a compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, PCS1900, supporting GMSK and linear EDGE modulation. Class 12 General Packet Radio Service (GPRS) multi-slot operation is also supported.
The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block, a printed directional coupler for each block impedance-matching circuitry for 50 Ω input and output impedances, a multifunction power amplifier control (MFC) block, low pass harmonic rejection filters, and an SP8T Antenna T/R switch. Two separate Hetero junction Bipolar Transistor (HBT) PA blocks are fabricated onto an InGaP die; one supports the GSM850/900 bands, the other supports the DCS1800 and PCS1900 bands. The InGaP PA die, the silicon MFC die, PHEMT switch die, and the passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.
The FEM incorporates full support for a Serial Peripheral Interface (SPI) bus function. The SPI controller shall accept SPI telegrams with data fields that support PA and switchplexer-related functions. All FEM operating modes and switch states shall be determined by the SPI telegram. The Multi-function Control (MFC) provides pin out for interoperation with a specified transceiver that will establish a closed loop power control mechanism. The external circuit uses the Linear Detector output to set a fixed bias point for 8PSK (EDGE) mode and a variable bias point for GMSK (GSM) mode.
The power control loop together with the MFC will reduce sensitivity to antenna load, input drive, temperature, power supply, and process variation. The combined circuit configures the PA for fixed gain in 8PSK mode while providing the ability to optimize the PA bias at different power levels to maximize efficiency.
[Figure 3-10] SKY77529 Block Diagram
VCMOS
Tx_HB
VSPI
CLK
DRW
SSVDET
VRAMP
Tx_LB
V-Q3_HB
RxTx-H
Rx-M3
Rx-M2
ANTENNA
RxTx-M1
Rx-L1
RxTx-L2
Match
BICMOSMFCSERIAL
PERIPHERAL
INTERFACECONTROL
LINEAR RFDETECTOR
POWERAMP
CONTROL
Match
BattV-Q3_LB
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[Figure 3-11] SPI Write Programming Truth Table
3.6.4 GPS LNA (U1004, RF2815)
The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along with high gain, achieved by the RF2815 makes it ideal for GPS recievers requiring high sensitivity. This module builds upon RFMD’s leading edge pHEMT process and integrates input matching and low loss high rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of implementation simplifies the reciever design.
The RF2185 is packaged in a compact 3.3 mm x 2.1 mm x 1.0 mm package with low external component count required to achieve the best-in-class performance.
3. TECHNICAL BRIEF
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3.7 Digital Baseband(AP20H)
NVIDIA® Tegra™ 200 Series Mobile web Processor (MWP) is a complete applications and digital media system
built around the following processing elements:
AP20H Block Diagram(Typical Connections Shown)
3. TECHNICAL BRIEF
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Dual-core ARM® Cortex-A9 MPCore™ processor
HD AVP (2.0) High-definition Audio-video processor
The HD AVP Processor handles audio-video processing and supports H.264, VC-1, and MPEG-4 video
standards.High definition video playback and capture are accelerated with dedicated hardware. Baseline JPEG
encoding and decoding are also supported.
Ultra Low-power NVIDIA® GeForce® Graphics Processing
The ULP GeForce GPU handles 2D graphics rendering and 3D pixel and vertex shading.
Imaging System
Accepts still images in Bayer and YUV formats, converts the various input formats, and writes the data to
memory as indicated by software.
Display Controller Complex
The Display Controller Complex contains dual display controllers with various external interface options for LCD
panels, CRTs, and televisions, including HDMI output at 1080p.
In addition to its processing elements, an extensive set of peripheral interfaces enables communication with all
necessary external devices. This high level of integration minimizes system BOM and enables compact form
factor design.
3. TECHNICAL BRIEF
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3.8 Hardware Architecture
<System HW Block>
Figure. Block Diagram
SDIO1BT Wi-FiFM
Star LGP999 Block Diagram38.4M C
ame
8M / A
CSI
LCD 4.0”WVGA (800X480)
CPU I/F
UART3SDIO1
FEM
GSM SWB-B25 Mod.
BT Wi FiFM
DSI
eraA
F
VI
CAM_I2C
VT Cam
1.3M
FM Ant
GPS LNAGSMPAM
GPS
QualcommMDM6200R
F I/F
Touch Driver
LCD Backlight
( )
Touch Screen
LCD C/P (w/ ALC)
Light sensor
Touch moduleGEN1_I2C
GEN1_I2C
4Gb LPDDR2 SDRAM
POP
SDRC
M t d
X32GNSS
GPIOGPIO
FM I2SUART
PAM
Filter
FilterWCDMAPAM
MEM
I/F
Motor
AU
X PC
M
Light sensor
MCP(MP)
PWM
AP20H
Mounted on AP20H Sample
WCDMA
USI
M I/
F
SP SPI1
GPIOGPIO
I2C
AMP
USBF/S
3 axis accelerometerGEN2_I2C
UART UART1
C
GyroSPI2SPI2
SSBIDUPLEXER Filter
X16512Mb DDR
SDRAM
1Gb NAND X16uUSB
connector
MCP(MP)
SDIO3
SW USB
Proximity sensorModem PCM(DAP3)
BT PCM(DAP4) GEN2_I2C Compass
32.768K
Key Input(PWR, Vol, …)
HSMMC I/F
GPIO
USIMSW
MU
ICUART2USBUARTChargerHS USB
HDMIDDC
X8
GEN1_I2C
8GB User memoryeMMC MAX17040G
12M
MicReceiver
Fuel gaugeRT9524
PMICEN
GEN2_I2CPWR_I2C DAP1
Charger IC
WM8994
DAP2Thermal Sensor
(NCT1008)
32.768K
connector
CPU Power(MAX8952)
PMIC(PM8028)
3.5 pi earjack
SpeakerPMIC
(MAX8907C)V_POWERRAILWM8994
1500mAhFM Ant
3. TECHNICAL BRIEF
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3.9.2. Architecture Introduction
3.9.3. Air Interface – WCDMA
3.9 Subsystem
3.9.1. Processors
Industry standard ARM1136JS™-embedded microprocessor subsystem
L1 instruction and data cache memories (32 KB each)
L2 cache (256 KB)
Instruction set compatible with ARM1136JS processor
Higher performance 8-stage pipeline, Harvard cached architecture
Higher internal CPU clock rate with on-chip cache
Java® hardware acceleration through ARM1136JS Jazelle™ core
Two QDSP4™ cores for modem and application DSP
3.9 Subsystem
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3.9.2. Architecture Introduction
3.9.3. Air Interface – WCDMA
3.9.4. Air Interface – GSM
3.9.5. Air Interface – GNSS Position Location and Navigation System
Gen8 (GPS L1 + GPS L1 wide + GLONASS) is supported.
Satellite and network information is merged to provide a high-availability solution with industry-
leading accuracy and performance.
High-sensitivity solution that works in all terrains: indoor, outdoor, urban, and rural.
Supported modes:
Mobile-assisted
Mobile-based
Standalone (autonomous)
Next-generation gpsOne® solution with an enhanced GPS engine:
Enhanced filtering software optimizes GPS accuracy and availability
gpsOneXTRA™ assistance for enhanced standalone GPS performance
Wideband processing of GPS signals helps resolve multipath interference, promoting I mproved
measurement accuracy.
Support for CDMA/UMTS control plane, GSM control plane, and OMA SUPL 1.0 user plane assisted-GPS
protocols
GLONASS standalone mode:
GLONASS capability increases the number of satellites available to the positioning engine,
resulting in an expanded area of coverage over traditional GPS receivers.
3. TECHNICAL BRIEF
- 40 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.9.4. Air Interface – GSM
3.9.5. Air Interface – GNSS Position Location and Navigation System
Gen8 (GPS L1 + GPS L1 wide + GLONASS) is supported.
Satellite and network information is merged to provide a high-availability solution with industry-
leading accuracy and performance.
High-sensitivity solution that works in all terrains: indoor, outdoor, urban, and rural.
Supported modes:
Mobile-assisted
Mobile-based
Standalone (autonomous)
Next-generation gpsOne® solution with an enhanced GPS engine:
Enhanced filtering software optimizes GPS accuracy and availability
gpsOneXTRA™ assistance for enhanced standalone GPS performance
Wideband processing of GPS signals helps resolve multipath interference, promoting I mproved
measurement accuracy.
Support for CDMA/UMTS control plane, GSM control plane, and OMA SUPL 1.0 user plane assisted-GPS
protocols
GLONASS standalone mode:
GLONASS capability increases the number of satellites available to the positioning engine,
resulting in an expanded area of coverage over traditional GPS receivers.
3. TECHNICAL BRIEF
- 41 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.9.6. Audio function
Audio Processing on ARM Core The ARM™1176 core is mainly in charge of “audio application” tasks, including audio playback, audio streaming and audio recording if required. This implies the usage of codec algorithms such as MP3, WMA, AAC etc., which must be implemented as decoder and/or encoder software on the ARM core. Decoded audio streams are transmitted as PCM samples to the DSP core via a shared memory. Audio streams to be encoded are transmitted by the DSP to the ARM core via a shared memory. The ARM can also generate ring tones and service tones to notify an incoming call, an incoming message or any audio notification of a phone´s event (warning, error, confirmation, battery low, etc.). Another activity on the audio side for the ARM is the streaming of compressed audio data over the UART interface to the Bluetooth chip for A2DP usage (Advanced Audio Distribution Profile: audio playback over Bluetooth). Via the same interface it communicates with the Bluetooth chip (this is not restricted to audio activities). The ARM core is managing the configuration of the AFE by sending commands to
the DSP over shared memory to activate various configurations of the AFE. Note that the activities of the ARM
remain purely digital audio processing.
Audio Processing on DSP Core The DSP core is in charge of “speech audio” and mixing tasks and its activities remain - as the ARM - purely digital audio. The DSP can also execute some “audio application” tasks. It ensures the simultaneous encoding and decoding of speech audio frames during telephone conversation. It uses different sets of vocoders as specified by the applicable standards for the ongoing telephone conversation. On the audio out path (i.e. towards the speaker) it mixes “audio application” received over shared memory with decoded speech audio. On this path it can also mix some audio samples coming from the microphone to enable the feedback loop to the speaker (Sidetone generation, as specified in 3GPP/ TS 43.050, chapter 3.10). On the audio in path (i.e. from the microphone to the transmission of the encoded audio samples over the air) the DSP can also mix speech audio samples with any other digital audio source and analogue FM radio as well. The mixing capabilities are extremely broad as the cases mentioned above are only examples. These mixing capabilities also include the ability to execute a sample rate conversion to bring all samples to the same rate before mixing. The DSP also can execute some audio application tasks such as PCM, ADPCM, SB-ADPCM audio playback and recording. Simple Tone (sine tones, DTMF, key click) can be generated as well. The next activity of the DSP is transferring data to and from the hardware peripherals (AFE, I2S0 and I2S1). When receiving a command from the ARM the DSP directly configures the different modes of the AFE. The DSP also manages the I2S interfaces I2S0 and I2S1. I2S0 interface, configured as master interface, is used to exchange speech audio samples at a rate of 8 or 16 kHz mono on both directions with the Bluetooth chip in the case of a speech call using a Bluetooth headset. The I2S1 interface can be used as slave or master interface, enabling the exchange of audio stereo samples at any common rate between 8 and 48 kHz, potentially asymmetrically between RX and TX. This is to act as an audio bridge with an external audio chip (application processor, audio processor,etc.). Note that the activities of the DSP - like the ARM - remain purely digital audio processing. Refer to the document “system requirements specification” for more details on the different audio application features supported by the chip.
3. TECHNICAL BRIEF
- 42 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Audio Processing on Audio Front End The AFE is used as a playback and capture device, i.e. exchanging digital audio stereo samples on both
directions (from microphone to DSP and from ARM/DSP to speaker). On audio-in path analog to digital
conversion and amplification is executed. On the audio-out path digital to analog conversion and power
amplification is performed. Additionally, the AFE physically selects the correct audio analog paths and is directly
managing the analog inputs and outputs.
3.9.7. Vocoder Subsystem
FR, HR, EFR speech channels (TCH/FS, TCH/HS, TCH/EFS)
• NAMR/WAMR speech channels over GMSK and 8PSK
• Mandatory sub-functions for speech channels:
– Discontinous transmission (DTX)
– Voice activity detection (VAD)
– Background noise calculation
• Fullrate and halfrate data channels (F14.4, F9.6, F4.8, F2.4, H4.8, H2.4)
3. TECHNICAL BRIEF
- 43 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10. Power Block
3.10.1. General
Since P999DW uses two individual chips, MDM6200 (Qualcomm Modem) uses PM8028 and AP20H uses
MAX8907C as a main PMIC.
3.10.2 PM8028
The PM8028 device (Figure 1-1) integrates all wireless handset power-management, general-housekeeping, and
user-interface support functions into a single mixed-signal IC. Its versatile design is suitable for CDMA, UMTS,
and/or GSM phones, and other wireless products such as data cards and PDAs.
This mixed-signal BiCMOS device is available in the 136-pin nano-scale package (136 NSP) that includes several
ground pins for electrical ground and thermal relief.
Since the PM8028 IC includes so many diverse functions, its operation is more easily understood by considering
major functional blocks individually
Figure. LGP999DW Modem Power Block Diagram
otherPMIC
circuits
BatteryPMIC
UIM/UICC
L8LDO
L2LDO
L15LDO
L19LDO
L4LDO
L3LDO
L7LDOL1
LDOL11LDO
L6LDO
L10LDO
L18LDO
S1buck
S2buck
S3buck
DDRSDRAM
NAND
digitalI/Os
VDD_CORE1.1V
VDD_A0
VDD_P1 & VDD_P21.3V
1.8V
VDD_P4
VDD_MPLL1.2V
1.1VVDD_A2
VDD_A12.05V
1.8VVDD_P3
2.65VVDD_P63.075V
VDD_P51.8V
SDIO
OSC Basebanddigitalcore
GPSADC
EBI 1 EBI 2Pads &
ext I/OS
Reserved
digitalPLLs
BB Rx DACs
ANA1ckts
SDIOPads
USB3P3
USB1P8 O_Fuse
requiredsupbregufation
3. TECHNICAL BRIEF
- 44 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.3 MAX8907C
The MAX8907C is a complete power management IC (PMIC) for mobile devices that use the nVidia’s application
processors (AP), or other similar application processors. The MAX8907C includes three high efficiency step-down
regulators and 22 LDOs to power the application processor, internal Logic, I/O, memory, and system accessories.
An additional step-up converter drives up to 14 white LED with controlled current for display backlighting. All
power and WLED outputs are set via an I2C interface.
Figure. MAX8907 functional block diagram
LGE Internal Use OnlyPower Block Diagram - AP
VCC IO 1V8 (1.8V/1000mA)SUPERCAP- +
VCC_IO_1V2(1.2V/1200mA)
V2V3
V1VCC_CORE_1V2 (1.2V/1000mA)
RTC_OUT LPDDR0
VCC_MIPI_1V2 (1.2V/150mA)
VCC_PLL_1V1 (1.1V/150mA)
VCC_IO_1V8 (1.8V/1000mA)VCC_DDRx_3V3(3.3V/150mA)
AP20H
V3LDO1
LDO2
LDO4
LDO6
LDO12VCC_HDMI_3V3(2.8V/300mA)
VCC_USB_3V3(3.3V/150mA)
LDO11
VCC_CPU_1V0 (1.0V/2200mA)
SCLK
SDAT
nINT
PWREN
RST
PWR_I2C_SCL
PWR_I2C_SDA
PWR_INT_N
CORE_PWR_REQ
SYS_RESET_N_AP20
POWER
VCC_HDMIPLL_1V8(1.8V/150mA)
VCC_SDIO_2V8(2.8V/300mA)LDO17
AP_PWR_ON
VREG_RFRX1(2.7V/150mA)
5Pin u-USBConnector MAX8907C
eMMC
V POWERRAILLDO15
VCC_eMMC_2V8(2.8V/150mA)LDO5
VCC_APTEMP_3V3 (2.8V/150mA) NCT1008AP TEMP SENSOR
NONKEYPWR_ON_SW
TCLKAPPMU_32K_CLK
POWERONKEY
LDO16 DNIVCC_eMMC_2V8(2.8V/300mA)
VCC_VI_1V2 (1.2V/300mA)LDO18
VCC_RTC (1.1V/mA)SDBY
TCLK2GPS_32K_CLK
V_CHG
Connector
RT9524Charger
V POWERRAIL
MAX8907C V_POWERRAIL
DC/DC (1.2V) MAX8952
AP TEMP SENSOR
V_POWERRAILVBAT
TOUCHVCC_TOUCH_3V1(3.0V/150mA)
LDO10
LDO8VCC_SENSOR_1V8(2.8V/150mA)
COMPASSAMI304
CPU_PWR_REQ
WLAN/BT/FMBCM4329
Proximity CTRL IC
Motion SensorKXTF9
Battery1500mA
V_POWERRAIL
VBAT
GYROMPU3050LDO7
VCC_SENSOR_3V0(2.8V/150mA)
A-GPS /BCM4751LDO(1.8V)BU12TD2
LDO8
LCD
AK8973BVCC_LCD_1V8(1.8V/150mA)
1500mA
Fuel Gauge ICMAX17040
LCD BLT Charge PumpAAT2870 VCC_LCD_2V8(2.8V/150mA)
CAM_VIO_1V8(1.8V/300mA)
CAMERA FLASHAAT1207
LDO14 DNIVCC_GPS_2V8(3.3V/500mA)
LDO19VCC_LCD_1V8(1.8V/150mA)
VCC_LCD_2V8(3.3V/150mA)
DNILDO3
DNI
Micro SD
8MCamera
VGACamera
VGA_IO_1V8(1.8V/300mA)
CAMERA SUB PMICLP8720
CAM_AF_2V8(2.8V/300mA)
CAM_AVDD_2V8(1.8V/300mA)
VGA_AVDD_2V8(2.8V/300mA)
CAM_VDIG_1V2(1.2V/400mA)
DC/DCAAT1217
LDO13LDO20
Challenge 1213The People Company 1/2WCDMA/GSM
ModuleMotor
Audio CodecWM8994
HDMI
BEADV_BAT_CP
VCC_VGA_HDMI_5V0 (5.0V/1200mA)
Motor DriverSM100
AAT1217
VCC_MOTOR_3V0 (3.3V/300mA)
3. TECHNICAL BRIEF
- 45 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.3 Charging control
P970 uses individual Charger IC which is RT9524.
Features � 28V Maximum Rating for DC Adapter � Internal Integrated Power MOSFETs � Support 4.2V/2.3A Factory Mode � 50mA Low Dropout Voltage Regulator � Status Pin Indicator � Programmed Charging Current � Under Voltage Lockout � Over Voltage Protection � Thermal Feedback Optimized Charge Rate � RoHS Compliant and Halogen Free
P999
4
3.10.4.1 P999 uses individual Charger IC which is RT9524.
30
3. TECHNICAL BRIEF
- 46 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.3.2 Constant Current Charging
Battery Pre-Charge Current
During a charge cycle, if the battery voltage is below the pre-charge threshold, the RT9524 enters the Pre-charge
mode. This feature revives deeply discharged cells and protects battery. Under USB100 Mode, the pre-charge
current is internally set to 95mA. When the RT9524 is under USB500 and ISET Mode, the pre-charge current is
20% of fast-charge current set by external resistor RISET.
Battery Fast-Charge Current
ISET Mode
The RT9524 offers ISET pin to program the charge current. The resistor RISET is connected to ISET and GND. The
parameter KISET is specified in the specification table.
4
530
3. TECHNICAL BRIEF
- 47 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Battery Voltage Regulation (CV Mode)The battery voltage regulation feedback is through BATT pin. The RT9524 monitors the battery valrage vetween BATT and GND pins. When the battery voltage closes to battery regulation voltage threshold, the voltage regulation phase begins and the charging current falls below the programmed end-of-charge current threshold, the CHG_S pin gose high to indicate the termination of charge cycle.The end-of-charge cyrrent threshold is set by the IEOC pin. The resistor Rieoc is connected to IEOC and GND.The parameters Kieoc and IEOC are specified in the specification table.
IEOC(%) =
The current threshold of IEOC (%) is defined as the percentage of fast-charge current set by Riset. After the CHGSB pin pulled to high, the RT9524 still monitors the vattery voltage. Charge current is resymed when the battery voltagr goes to lower then the battery regulation voltage threshold.
RIEOC200
3. TECHNICAL BRIEF
- 48 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.10.4.3. Constant Voltage Charging
Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected around 240mA from Travel adaptor.
3.10.4.4. LGP999DW Charging Specification
-Charging Method : CC & CV (Constant Current & Constant Voltage)
-Maximum Charging Voltage : 4.2V
-Maximum Charging Current : 948mA
-Nominal Battery Capacity : 1500mAh
-Charging time : Max. 3h 30m
- Full charge indication current (icon stop current) : 248mA
3.10.4.5. LGP999 battery bar icon display
Battery Bar Number Specification
BAR 6 (Full) 90% over
Remain %
BAR 6 --> 5 90% 89%
BAR 5 --> 4 70% 69%
BAR 4 --> 3 50% 49%
BAR 3 --> 2 30% 29%
BAR 2 --> 1 15% 14%
BAR 1 --> 0 5% 4%
Low Battery Pop-up 4% ~ 15% : One Time popup
Critical Low Battery Pop-up 0% ~ 3% : Popup at every level change
POWER OFF 0%
Table. LGP999DW battery bar specification
3. TECHNICAL BRIEF
- 49 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.11. External memory interface
3.11.1. Introduction
Since LGP999DW contains communication and application processor, memory is dedicated only for each
processor. MDM6200 (Qualcomm modem) uses MCP (Multi Chip Package) 1Gb nand / 512Mb DDR and AP20H
uses POP (Package on Package) 512MB LPDDR2 and 8GB eMMC nand memory.
3.11.2.LGP999DW MDM6200 (Qualcomm Modem) memory Interface
-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package -512Mbit Mobile DDR SDRAM / 1Gbit NAND Flash
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
H8BCS0QG0MMR-
46M
NAND Hynix 1.8V 45ns
SDRAM 1.8V 166MHz
3.11.3.LGP999Dw AP20H memory Interface
- Package on Package on AP20H: LPDDR2 SDRAM - 8GB eMMC 4.4 version
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
H8TBR00U0MLR-0DM SDRAM Hynix 1.8V/1.2/1.2/1.2 DDR2 800
(400MHz)
Interface Spec
Part Name Product Gr Maker Operation Voltage Speed
THGBM2G6D2FBAI9 NAND Toshiba 2.8V 31MB/s for read
20MB/s for write
3.11.4. External SD card memory Interface
AP20H supports external SD card which supports up to 32GB (SDHC compatible)
3. TECHNICAL BRIEF
- 50 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.12. HW Subsystem
Five general serial bus interface (GSBI) ports, each up to 4-bits wide; configuration optionsinclude:
UART
UIM
I2C
I2S
SPI
PCM
General-purpose I/O (GPIO) bits
High-speed USB-OTG port with built-in PHY (configured as host or peripheral)
USB 2.0 specification-compliant as a peripheral or embedded host
Compliant with the OTG supplement to USB specification Rev 1.2
Full-speed USB port
UICC (SIM)
UART: high-speed, up to 4 Mbps
UICC (SIM)
USIM controller
USIM, SIM, and large capacity (USB-UICC) support
Data rates up to 4 MHz
1.8 V support; 3.3 V support with PMIC level translators
Three, 4-bit, secure digital card controller (SDCC) ports
1.8 V on SDCC2 and SDCC3 ports; 2.85 V on SDCC1 port
MMC and SD cards
Up to 52 MHz
I2C compatible interface (1.8 V only)
Near field communicator (NFC)
Sensors
I2S
For external audio codec
Serial peripheral interface (SPI)
Master and slave modes are supported
SPI master supports up to a 26 MHz output clock
SPI slave supports up to a 15 MHz input clock
Sensors PCM
3. TECHNICAL BRIEF
- 51 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.13. Audio and sound
3.13.1. Overview of Audio path
Figure. Block diagram of Audio & Sound path
3.13.2. Audio codec(Wolfson_wm8994)
The WM8994is a highly integrated ultra-low power hi-fi CODEC designed for smart phones and other portable
devices rich in multimedia features.
An integrated stereo class D/AB speaker driver and class W headphone driver minimize power consumption
during audio playback.
The device requires only two voltage supplies, with all other internal supply rails generated from integrated LDOs.
Stereo full duplex asynchronous sample rate conversion and multi-channel digital mixing combined with
powerful analogue mixing allow the device to support a huge range of different architectures and use cases.
A fully programmable parametric EQ provides speaker compensation and a dynamic range controller
used in the ADC or DAC paths for maintaining a constant signal level, maximizing loudness and protecting
speakers against overloading and clipping.
A smart digital microphone interface provides power regulation, a low jitter clock output and decimation filters
for up to four digital microphones. A MIC activity detect with interrupt is available.
Active ground loop noise rejection and DC offset correction help prevent pop noise and suppress ground noise
on the headphone outputs.
AUDIO
AP20BT PCM SYNC
SLEEP_CLKCLK_32K_OUT
BCM4329
DAP3_PCM_FS
BT_PCM_SYNC
DAP3_PCM_DOUTDAP3 PCM DIN
BT_PCM_DOUTBT_PCM_DIN
BT_PCM_CLK
DAP4_FS
DAP4_DIN
DAP4_DOUT
DAP4_SCLK
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLKDAP3_FS
DAP3_DIN
DAP3 DOUT UART3 TXDBT_UART_TXD BT UART RXD
MDM6200I2S1_WA0
I2S1_TX
BCM4329DAP3_PCM_DINDAP3_PCM_SCLK
PCM
DAP3_DOUT
DAP3_SCLK
UART3_TXD
UART3_RXD
UART3_RTS_N
UART3_CTS_N
BT_UART_RXDBT_UART_RTS_NBT_UART_CTS_N
BT_UART_RXD
BT_UART_TXD
BT_UART_CTS_NBT_UART_RTS_N
I2S1_RX
I2S1_CLK0
I2SPCM
AU
D_O
UT_
L
AU
D_O
UT_
R
UT
LK NUT
LKK LK2
A L
GEN2_I2C_SDA
GEN2_I2C_SDA
38.4 MHz
DIN
DO
UT
FS SCLK
DIN
DO
UT
FS SCLK
MC
LK
MC
LK2
8MH
z
SEN
SE
DC
AA
DAP
2_D
IN
DAP
2_D
OU
DAP
2_FS
DAP
2_SC
L
DAP
1_D
IN
DAP
1_D
OU
DAP
1_FS
DAP
1_SC
L
DAP
_MC
L
DAP
_MC
L
GEN
2_I2
C_S
DA
GEN
2_I2
C_S
CL
MAXIMADC
DAP
1_D
DAP
1_D
DAP
1_F
DAP
1_S
DAP
2_D
DAP
2_D
DAP
2_F
DAP
2_S
AUD
IO_M
AUD
IO_M
12.2
8
RC
LK2
CD
AT2
CD
AT2
BC
LK2
RC
LK1
CD
AT1
CD
AT1
BC
LK1
MC
LK1
MC
LK2
EAR
_S
HO
OK
_AIN2RN
EAR_MICSDA
SCLK
PMIC
AIF_3
GPI
O4/
LG
PIO
5/D
AC
GPI
O7/
AD
CG
PIO
3/B LR
DA
CA
DC BM M
Digital Mixer Receiver
HPOUT1LHPOUT1R
MICBIAS1 MICBIAS_23.5 Earjack
IN1RPIN1LP
IN1LN HPOUT2NHPOUT2P
WM8994Digital Mixer Receiver
SpeakerIN1RN HPOUT2P
SPKOUTLNSPKOUTLP
3. TECHNICAL BRIEF
- 52 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
- 53 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
FB1202
0.1u
C1208
C1216
DNI DNI
C1217
R12120
R1205 0
1uC1218
1uC1223
U1201
G7
H7
H8
G8
B3
C3
A2
B1
A6
B4
C4
B5
C5
H6
G6
G5
F8
F9
E8
E7
C9
B6
A7
A5
A3
E1
D3
A4
G2
H1
F3
F7
E2
H9
C1
A1
D6
A8
A9
C7
B7
B8
B9
C8
D7
F5
H4
H5
F6
G4
E5
H3
F4
H2
G3
F2
E4
E3
G1
C6
E6
D5
D4
D1
D2
F1
G9
D8
C2
B2
D9
E9LDO1VDDAVDD1SPKVDD1SPKVDD2AVDD2CPVDDDCVDDDBVDDLDO2VDD
LDO1ENALDO2ENAVREFC
DMICCLCK
BCLK1LRCLK1DACDAT1ADCDAT1ADCLGCLK/GPIO1
GPIO3/BCLK2GPIO4/LRCLK2GPIO5/DACDAT2GPIO7/ADCDAT2GPIO6/ADCDLRCLK2
GPIO11/BCLK3GPIO10/LRCLK3GPIO8/DACDAT3GPIO9/ADCDAT3
IN1LNIN1LP
IN2LN/DMICDAT1IN2LP/VRXN
IN1RN1N1RP
IN2RN/DMICDAT2IN2RP/VRXP
AGND1SPKGND1SPKGND2CPGNDDGND
HP2GND
SDASCLK
CS/ADDRCIFMODE
MCLK1GPIO2/MCLK2
SPKMODEREFFGND
MICBIAS1MICBIAS2
VMIDC
AGND2AGND3
HPOUT2NHPOUT2P
HPOUT1FBHPOUT1RHPOUT1L
LINEOUT1NLINEOUT1PLINEOUT2NLINEOUT2PLINEOUTFB
SPKOUTLNSPKOUTLP
SPKOUTRNSPKOUTRP
CPCACPCB
CPVOUTNCPVOUTP
VCC_AUDIO_1V8
C1207
1u
V_POWERRAIL
C1206
1u
C1213 0.1u 20R1214
100KR1203
C1205
4.7u
2.2uC1225
2.2uC1224
C1220 2.2u
C1211 4.7u
4.7u
C1209
1uC1214
R1213 20
100KR1204
TP1201
VCC_AUDIO_1V8
TP1203
C1210
4.7u
R1218 10K
R1217 10K
C1212 0.1u
AUDIO_MCLK
DAP1_SCLKDAP1_FSDAP1_DOUTDAP1_DIN
DAP2_SCLKDAP2_FS
AUDIO_INT_N
GEN2_I2C_SCLGEN2_I2C_SDA
DAP2_DOUT
AUDIO_MCLK2
DAP2_DIN
WM_LDO_EN
MIC1P
50PIN_EAR_L
50PIN_EJ_MIC
MICBIAS
50PIN_EAR_R
SPK_PSPK_N
RCV_N
RCV_P
EAR_GND
EJ_MICBIAS
MIC2P
EJ_MICBIAS Added
RCV Path Added
Wolfson WM89941M
R12
19
VCC_IO_1V8
R12
2347
K
0R1221
C1227
0.1u
Q1201
43
52
61
D1
D4
D2
D3
GS
EARJACK_SENSE
50PIN_EAR_SENSE
3.5Phi EARJACK Detect
0 R1220
1u
C1222C1221
47p
R12
16
2.2K
120pC1226
R12220
HOOK_ADC
50PIN_EJ_MIC
EJ_MICBIAS
HOOK_DET
3.5Phi MIC Detect
3. TECHNICAL BRIEF
- 54 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.14 Main (8M pixels) & Sub (1.3M pixels) Camera
LG-P999DW supports two cameras. One is 8M pixels, main camera, the other is 1.3M pixels, sub camera used VT & self camera scene.
Figure. Main 8M Camera Schematic
Figure. Sub 1.3M Camera Schematic
FL1009
1
42
5
6
3P2 P4
P1 P3
P6
P5
C1005
1u
FB10
02
FB10
03
FL1001
109
84736251
P1 P5P2 P6P3 P7P4 P8
G1
G2
ZD1002
1u
C10100.1u
C1006
CN1002
1312
1411
1510
169
178
187
196
205
214
223
232
241
CAM_VIO_1V8 CAM_AF_2V8
CAM_AVDD_2V8
CAM_VDIG_1V2
0.1u
C1007 C1008
0.1u
ZD1003
0.1u
C1011C1009
1u
FB10
01
GND
8M_MIPI_DATA0_N8M_MIPI_DATA0_P
8M_MIPI_DATA1_P8M_MIPI_DATA1_N
CAM_I2C_SDA
CAM_I2C_SCL
CAM_MCLK8M_MIPI_CLK_P
8M_RESET_N
8M_MIPI_CLK_N
8M_CAM_VCM_EN
8M_MIPI_CAMERA
0.1u
C10
16
C10
130.
1u
CN1001
1312
1411
1510
169
178
187
196
205
214
223
232
241
VT_AVDD_2V8
C10
151u1u
C10
14
VT_IO_DVDD_1V8
VT_CAM_PWDN
VT_HSYNC
VT_VSYNC
VT_RESET_N
CAM_I2C_SDA
CAM_I2C_SCL
CAM_MCLK
VT_CAM_DATA[0]
VT_CAM_DATA[1]
VT_CAM_DATA[4]
VT_CAM_DATA[5]
VT_CAM_DATA[2]
VT_CAM_DATA[3]
VT_CAM_DATA[6]
VT_CAM_DATA[7]
VT_PCLK
1.3M_VT CAMERA
3. TECHNICAL BRIEF
- 55 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Figure. Camera Sub PMIC Schematic
Figure. Camera Block diagramFigure. Camera Block diagram
CAM_AF_2V8
VT_AVDD_2V8
VT_IO_DVDD_1V8
V_POWERRAIL
CAM_VDIG_1V2
L1001 2.2u
CAM_VIO_1V8
U1001
B1
E1C2
B2
C1
E2
D3
C3
A1C4
B3
A3
D4
E3
D2
B4E4
A2
D1
A4
VB
ATT
VIN
2
VIN
1VINB LDO1
FB
SW
GNDB
LDO2
IRQ_N
SDA LDO3
SCL
DVS
EN
LDO4
DEFSEL
IDSEL LDO5
GN
D
CAM_AVDD_2V8
R10030
2.2u
C1003
C1019
2.2u 1u
C1020
1u
C1021C1018
2.2u
C1017
1u
10u
C1012
10u
C1001C1004
2.2u 2.2u
C1002
CAM_I2C_SDACAM_I2C_SCL
CAM_SUBPM_EN
SUB PMIC-CAM POWER
CAMERA
VT IO DVDD 1V8
VT_PCLK
VT_HSYNC
VT VSYNC
CAM_MCLK
EMI/ESD Filter
VT_IO_DVDD_1V8
VT_AVDD_2V8
`
1.3M Camera
VT_VSYNC
VT_DATA[7:0]
VT_RESET_N
VT CAM PWDNVT_CAM_PWDN
CAM_I2C_SCL
CAM_I2C_SDA CAM_SUBPM_EN
LP8720SUB PMIC
LP8720SUB PMIC
AP20
8M MIPI CLK NCAM_VDIG_1V2Common mode filter
8M
Camera
(LGIT)
8M_MIPI_CLK_N
8M_MIPI_DATA0_N
8M_MIPI_CLK_P
8M_MIPI_DATA0_P
CAM_AVDD_2V8
CAM_VIO_1V8
CAM_AF_2V8 8M MIPI DATA1 N(LGIT) 8M_MIPI_DATA1_N
8M_MIPI_DATA1_P
8M_RESET_N
CAM_MCLK
8M CAM VCM EN8M_CAM_VCM_EN
CAM_VIO_1V8
3. TECHNICAL BRIEF
- 56 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.15 Display
LCD module is connected to Main PCB with 50-pin connector.
The LCD is controlled by CPU Interface in AP20.
Table. Interface between LCD Module and MAIN Board
Pin No. Signal I/O Function
1 LED_A - Power Supply for LED
2 LED_A - Power Supply for LED
3 LEDC_2 - Ground for LED
4 LEDC_4 - Ground for LED
5 LEDC_5 - Ground for LED
6 LEDC_6 - Ground for LED
7 AVCI(2.8V) I Power Supply for Analog circuit
8 PWM0 O Back Light Control of LED Driver
9 DB0 I/O Data Bus (Instruction & Display Data)
10 DB2 I/O Data Bus (Instruction & Display Data)
11 DB4 I/O Data Bus (Instruction & Display Data)
12 DB6 I/O Data Bus (Instruction & Display Data)
13 DB8 I/O Data Bus (Instruction & Display Data)
14 DB10 I/O Data Bus (Instruction & Display Data)
15 DB12 I/O Data Bus (Instruction & Display Data)
16 DB14 I/O Data Bus (Instruction & Display Data)
17 DB16 I/O Data Bus (Instruction & Display Data)
18 DB18 I/O Data Bus (Instruction & Display Data)
19 DB20 I/O Data Bus (Instruction & Display Data)
20 DB22 I/O Data Bus (Instruction & Display Data)
21 GND - Ground
22 RDX I Read Enable
23 CSX I Chip Select
24 RESB I Reset
25 MAKER_ID(Low) O Maker ID(Low; GND level)
Pin No. Signal I/O Function
26 GND - Ground
27 SVCI(2.8V) I Power Supply for Analog circuit
28 IFSEL_1 I Interface mode Select (24-bit: GND)
29 WRX I Write Enable
30 DCX I Data command
31 DB23 I/O Data Bus (Instruction & Display Data)
32 DB21 I/O Data Bus (Instruction & Display Data)
33 DB19 I/O Data Bus (Instruction & Display Data)
34 DB17 I/O Data Bus (Instruction & Display Data)
35 DB15 I/O Data Bus (Instruction & Display Data)
36 DB13 I/O Data Bus (Instruction & Display Data)
37 DB11 I/O Data Bus (Instruction & Display Data)
38 DB9 I/O Data Bus (Instruction & Display Data)
39 DB7 I/O Data Bus (Instruction & Display Data)
40 DB5 I/O Data Bus (Instruction & Display Data)
41 DB3 I/O Data Bus (Instruction & Display Data)
42 DB1 I/O Data Bus (Instruction & Display Data)
43 TE O VSYNC-OUT
44 IOVCC I Interface I/O Power
45 NC - No connection (VPP)
46 IEDC_7 - Ground for LED
47 IEDC_5 - Ground for LED
48 IEDC_3 - Ground for LED
49 IEDC_1 - Ground for LED
50 GND - Ground
Table. Interface between LCD Module and MAIN Board
3. TECHNICAL BRIEF
- 57 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Figure. LCD Block Diagram
Figure. Schematic of LCD connector (Main Board)
R1016
100
C1029
15pVA1003
2.2u
C1031
VCC_LCD_1V8
V_POWERRAIL
R10
11
4.7K
VCC_LCD_1V8
VCC_LCD_2V8
C1030
2.2u
CN1003
2625
2724
2823
2922
3021
3120
3219
3318
3417
3516
3615
3714
3813
3912
4011
4110
429
438
447
456
465
474
483
492
501
FB1004
LCD_RESET_N
LCD_MAKER_ID
LCD_BL_OUT1LCD_BL_OUT2 LCD_BL_OUT3
LCD_BL_OUT5LCD_BL_OUT6 LCD_BL_OUT7LCD_BL_OUT4
LCD_BL_OUT8
LCD_PWM
LCD_CSX
LCD_TE_BF
LCD_WRXLCD_DCX
LCD_R6LCD_R4LCD_R2LCD_R0LCD_G6LCD_G4LCD_G2LCD_G0LCD_B6LCD_B4LCD_B2LCD_B0
LCD_R7LCD_R5LCD_R3LCD_R1LCD_G7LCD_G5LCD_G3LCD_G1LCD_B7LCD_B5LCD_B3LCD_B1
LCD
LCD DCDC
Converter
Luminance
Sensor
(BH1621)
LSENSOR_SBIASLSENSOR_SENSV_POWERRAIL
LCD_BL_OUT1:8
LCD PWM (AAT2870) BL_DCDC_RST_NBL_DCDC_SCLBL_DCDC_SDA
KB_ROW3GEN1_I2C_SCLGEN1_I2C_SDA
LCD_PWM
VCC_LCD_1V8
VCC_LCD_2V8
AP20LCD_MAKER_ID4.0” WVGA
LCDLCD_CS
LCD_TE EMI FILTERSFEY0010501
LCD_CS0_NLCD_DE
UART_CTS_N
LCD_D[0:23]
LCD_RESET_N
WRX
DCX
LCD_DC1LCD_D[0:23]
LCD_PCLK
LCD_DC0
_ _
3. TECHNICAL BRIEF
- 58 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.16 Vibrator
The ERM motor, also distinguished as ‘Q-coin Motor’ creates a certain kind of vibration controlled and defined uniquely by LG Electronics. The followings are the certain examples of conditions that the users may feel the vibration from the phone: Incoming Call (in Silence Mode), Google Keys Pressed, Turn-on / -off, Dialing, and Text Messaging.
Figure 1 Vibrator Schematic
Figure 2 Vibrator Block Digram
CN1301
2
1
1u
C1312
VCC_MOTOR_3V0
U1304
91011
54
63
72
81EN VDP
PWM GND
MODE VDD
GAIN VDN
NC
3
NC
2
NC
1
C1315
10n
C1314
1u
TP1302
L1302 100n
L1301 100n
TP1301
VIBE_ENVIBE_PWM
3. TECHNICAL BRIEF
- 59 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.17 HDMI
When the users desire to output video signals onto the outer display, they are supposed to open the cap first and connect the suitable cable, which has to be HDMI type-D compatible, to the socket placed at the upper center of the phone. It will automatically display the video contents on the desired display
Figure 1 HDMI Type D Connector Schematic
Figure 2 HDMI Type D Connector Pin Assignments
CN1301
2
1
1u
C1312
VCC_MOTOR_3V0
U1304
91011
54
63
72
81EN VDP
PWM GND
MODE VDD
GAIN VDN
NC
3
NC
2
NC
1
C1315
10n
C1314
1u
TP1302
L1302 100n
L1301 100n
TP1301
VIBE_ENVIBE_PWM
100K
R911
VCC_VGA_HDMI_5V0
D901
HDMI_INT_N
HDMI Connector
3. TECHNICAL BRIEF
- 60 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.18 Compass Sensor
If a customer buy the application SW, The Sensor provides user with a Electric Compass function.
U1107 (AMI305) IC is interfaced to AP20(U601) using I2C interface.
Figure. Compass Sensor Schematic
Figure. Compass Sensor Block Diagram
R1332 0
VCC_SENSOR_3V0
R1331 0
VCC_SENSOR_1V8
C1310
0.1u
C1311
0.1u
U1305
12
11
10
9
5
4
6
37
28
1D
VD
D
VR
EG
GN
DA
GN
DS
AV
DD
ADDR
SCL
NC1
INT
VPP
DRDY
SDAGEN2_I2C_SCL GEN2_I2C_SDACOM_INT
3. TECHNICAL BRIEF
- 61 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.19 Motion Sensor
The motion sensor can sense gravity & accelerated motion. Therefore according to the direction of cell phone, the phone screen is rotated automatically. And the motion sensor is connected with a gyro sensor to supplement each data.
U1105 : KXTF9(U1307) IC is interfaced to AP20(U601) using I2C interface.
Figure. Motion Sensor Schematic
Figure. Motion Sensor Block Diagram
R13
270
C1317
1u
0.1u
C13
18
C1321
0.1u
VCC_SENSOR_3V0
0 R1329
C1320
1u
U1307
4
3
2
1
510
6
7
8
9SCL
DNC4
INT
DNC3
SD
AV
DD
IO_VDD
DNC1
DNC2
GND
R1330DNI
VCC_SENSOR_1V8 DN
IR
1326
MOTION_INT
GEN2_I2C_SCL
GEN
2_I2
C_S
DA
IME_
DA
IME_CL
3. TECHNICAL BRIEF
- 62 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.20 Gyro Sensor
The gyro sensor(MPU3050) can sense angular velocity not gravity and accelerated motion. The gyro sensor applied in LG- P990 can detect 3-axis rotation force sensing X,Y and Z angular velocity. And the gyro sensor data is supplemented by the motion sensor data. It make possible user to development application SW using gyro sensor data like that motion games.
U1: MPU3050 IC(U1306), Gyro sensor, is interfaced to AP20(U601) using I2C interface.
Figure. Gyro Sensor Schematic
Figure. Gyro Sensor Block Diagram
U1306
25 21 2022 192324
18
17
98 107 11
6
12
5
13
4
14
3
15
2
16
1CLKIN
NC7
NC1
NC6
NC2
NC5
NC3
VDD
NC4
INT
IME_DA
FSY
NC
IME
_CL
RE
GO
UT
VLO
GIC
AD
0
NC8
GND
SD
A
SC
L
RE
SV
1
CLK
OU
T
CP
OU
T
RE
SV
2
NC
9
0.1u
C1323
VCC_SENSOR_1V8 VCC_SENSOR_3V0
0.1u
C1322
0.1u
C13
19
C1316
2.2n
R13
240
R13
250
GYR
O_I
NT_
N
GEN
2_I2
C_S
CL
GEN
2_I2
C_S
DA
IME_DA
IME_
CL
3. TECHNICAL BRIEF
- 63 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.21 Proximity Sensor
When the call is connected and the object close to the proximity sensor,
LCD backlight and Touch screen are disable operation automatically.
U101 : GP2AP002S00F IC used I2C interface to AP20H
Figure. Proximity Sensor Schematic
Figure. Proximity Sensor Block Diagram
R101
20
U101
54
63
72
81LEDA SCL
LEDC SDA
VCC VIO
VOUT GND
VCC_SENSOR_1V8
VCC_SENSOR_3V0
10
R10210u
C101
1u
C105
0.1u
C104
4.7u
C103
PROXI_OUT
GEN2_I2C_SCL
GEN2_I2C_SDA
Proximity Sensor
3. TECHNICAL BRIEF
- 64 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.22 Illumination Sensor
Illumination Sensor adjusts LCD backlight current by detecting the surrounding brightness.
If user checks the automatic brightness menu, LCD backlight current adjusting is to be enable automatically.
U102 : BH1621 IC interface to AAT2870
Figure. Illumination Sensor Schematic
Figure. Illumination Sensor Block Diagram
U102
6
4 3
2
5 1VCCIOUT
GND1
GC1GC2
GN
D2
1uC102
LSENSOR_BIASLSENSOR_SENS
Ambient Light Sensor
3. TECHNICAL BRIEF
- 65 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.23 Touch Module
Touch module is connected to Main PCB with 10-pin connector.
The Touch module is controlled by I2C Interface in AP20.
Figure. Schematic of Touch connector (Main Board)
Table. Interface between Touch Module and MAIN Board
VCC_TOUCH_1V8
C1113
0.1u
CN1104
65
74
83
92
101
VCC_TOUCH_3V1
C11121u
R11
0310
K
VCC_TOUCH_1V8
TOUCH_MAKER_ID
TOUCH_INT
GEN1_I2C_SDA
GEN1_I2C_SCL
3. TECHNICAL BRIEF
- 66 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
3.24 Main Features
3.24.1. LG-P999 Main Features
- DOP Type design
- UMTS 2100 + UMTS 1900 + UMTS900+ GSM 900 + DCS 1800 + PCS 1900 + GSM850 based
GSM/GPRS/EDGE/UMTS
- HSDPA 7.2Mbps, HSUPA 5.7Mbps
- Main LCD(HVGA)TFT Main LCD(4.0”, 480X800)
- Capacitive/Electrostatic Touch Window
- 8M AF Camera, 1.3M secondary camera
- 3.5Phi Stereo Headset & Speaker phone
- Mobile XMF –Mobile DLS / Scaleable Polyphony
- MP3/AMR/AAC/AAC/WAV/WMA decoder and play
- MPEG4 encoder/decoder and play/save
- JPEG en/decoder
- Supports Bluetooth and HS-USB
- Supports WLAN(802.11b, 802.11g, 802.11n)
- 1500 mAh (Li-Ion)
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.1 RF Component
RF component (WCDMA / GSM)
U302MDM6200
FL202 WCDMA Tx (BC1)
Saw Filter
FL204 WCDMA Tx (BC4)
Saw Filter
U201 WCDMA(BC1) PAM
U202 WCDMA(BC4) PAM
U2042-Input AND GATE
FL205 GSM850 Rx Saw Filter
FL206WCDMA(BC4) Rx
Saw Filter
FL101 FEM
FL203WCDMA(BC4)
Duplxer
FL201WCDMA(BC1)
Duplxer
U203WCDMA(BC4) Rx LNA
U101 GSM PAM
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
- 68 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Reference Description Reference Description
U101 GSM PAM FL202 WCDMA(I) Tx SAW Filter
U201 WCDMA Single(I) PAM FL203 WCDMA ( ) Duplexer
U202 WCDMA Single(IV) PAM FL204 W C D M A ( I V ) T x S A W F I T L E R
U203 WCDMA (IV) Rx LNA FL205 GSM850 Rx SAW FITLER
U204 2-INPUT AND Gate FL206 W C D M A ( I V ) R x S A W F I L T E R
FL101 FEM X501 TC-VCXO(19.2MHz)
FL201 WCDMA (I) Duplexer
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.2 SIGNAL PATH
WCDMA I, IV TX Signal PATH
A. WCDMA 2100 TX PATH
B. WCDMA 1700 TX PATH
C. COMMON TX/RX PATH
4. TROUBLE SHOOTING
- 70 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
\
WCDMA BAND I and IV RX Signal PATH
A. WCDMA 2100 RX PATH
B. WCDMA 1900 RX PATH
C. COMMON TX/RX PATH
4. TROUBLE SHOOTING
- 71 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
GSM850/GSM900/DCS/PCS’s RX/TX Signal PATH
A. GSM850/GSM900/DCS1800/PCS1900 RX PATH
B. GSM850/GSM900/DCS1800/PCS1900 TX PATH
C. COMMON TX/RX PATH
4. TROUBLE SHOOTING
- 72 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.3 Checking TCXO Block
The output frequency (19.2MHz) of TCXO (X502) is used as the reference one of MDM6200
Schematic of the Crystal Part (26MHz)
TP1
TP2
TP2
TP1
X501 DSX321G-19.2M
19.2MHz
21
34
TP1
TP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.4 Checking GSM Tx (FEM) Block
TP1
4. TROUBLE SHOOTING
- 75 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Schematic of the Front End module(FEM) Block
Checking Switch Control Logic
TP1
SW101
G1
ANTG2
L107
22n
SW102
43
2
1ANT COMMON
G3 G4
VDD_RF_SW
100n
L106
100p C106
1u
C102
33p
C103
15n
L103
FL101
20
222
21
24
923
1116
17
1813
1912
10
148
151
65437V
DD
CTR
L1
CTR
L2
CTR
L3
CTR
L4
GND1 GSM850_RX_EGSM_RX2
GND2 GSM850_RX_EGSM_RX1
GND3
GND4 PCN_RX_PCS_RX2
GND5 PCN_RX_PCS_RX1
GND6
GND7 GSM850_EGSM_TX
GND8 PCN_PCS_TX
GND9
WCDMA1
ANT WCDMA2
WCDMA3
R101 1K
R103 1K
R104 1K
R102 1K
ANT_SEL0
ANT_SEL1
ANT_SEL2
ANT_SEL3
TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.5 Checking WCDMA Block
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.5.1Checking TCXO Block
Refer to 1.3
4.5.2. Checking FEM Block
Refer to 1.4
4.5.3. Checking RF TX Level (GSM)
Test Point (TX Level)
TP1
TP3
TP2
4. TROUBLE SHOOTING
- 79 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP1
TP3 TP2
L107
22n
VDD_RF_SW
100n
L106
100p C106
1u
C102
33p
C103
15n
L103
FL101
20
222
21
24
923
1116
17
1813
1912
10
148
151
65437V
DD
CTR
L1
CTR
L2
CTR
L3
CTR
L4
GND1 GSM850_RX_EGSM_RX2
GND2 GSM850_RX_EGSM_RX1
GND3
GND4 PCN_RX_PCS_RX2
GND5 PCN_RX_PCS_RX1
GND6
GND7 GSM850_EGSM_TX
GND8 PCN_PCS_TX
GND9
WCDMA1
ANT WCDMA2
WCDMA3
R104 1KANT_SEL0
TP1
C11147u
L128 3.9n
15p
C11
6
2.2p
C11
78.
2pC
119
3n
L108
5.6n
L110
5.1n
L109
15p
C11
533
p
C11
8
C147
0.5p
DN
I
R10
9
DN
I
R10
6 C146
1p
V_POWERRAIL
100p
C150
100p
C149
U101
12
13
14
15
16
17
6
5
7
4
8
3
9
2
10
1
11GND3
RFIN_HB
GND2
VBATT
RFOUT_LB
VEN_HB
RFIN_LB
VMODE0
GND1
VMODE1
VEN_LB
PGND
RFOUT_HB
GND6
GND5
VCC
GND4
100p
C120
100p
C121
L127 1n
2.2n
C112
100p
C108
47p
C109
8p
C110
PA_R0
GSM_TX
DCS_PCS_TX
PA_R1
GSM_PA_HB_EN
GSM_PA_LB_ENTP2
TP2
TP3
TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1 TP2 TP3 TP4
TP5
4. TROUBLE SHOOTING
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LGE Internal Use Only
For testing, Max power output is needed
TP2 TP3 TP4 TP5
TP1
L107
22n
VDD_RF_SW
100n
L106
100p C106
1u
C102
33p
C103
15n
L103
FL101
20
222
21
24
923
1116
17
1813
1912
10
148
151
65437V
DD
CTR
L1
CTR
L2
CTR
L3
CTR
L4
GND1 GSM850_RX_EGSM_RX2
GND2 GSM850_RX_EGSM_RX1
GND3
GND4 PCN_RX_PCS_RX2
GND5 PCN_RX_PCS_RX1
GND6
GND7 GSM850_EGSM_TX
GND8 PCN_PCS_TX
GND9
WCDMA1
ANT WCDMA2
WCDMA3
R104 1KANT_SEL0
TP1
VCC_IO_1V8
2.7nL225
C216 22p
100p
C241
U202
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
10pC240
U201
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VBPISO
VMODEGND
VENCPLL202
DNI
FL203
1732.5MHz,2132.5MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6
FL206 2140MHz
52
4
31IN OUT
_OUTG1 G3R207
27K
C247
10n
U203
7
43
52
61RFIN RFOUT
EN RREF
GS VCC
PG
ND
L219 2.7nC204 8.2pL220
1.5n
L221
12n
U204
2
3
4
15
VCC
GND
FL202
1950MHz
5 2
4 1
3G3
INOUTG1G2
L205
10n
L217
2n
C244
DNI
C243
47p
C246 8.2p
C245 8.2p
C242
47p
L218
5.6n
DNIL213
L212DNI
L2266.8n
C227 12p
2.2u
C221
V_POWERRAIL
L210
12nC229DNI
L211
2.2n
C223
33p
C233
100p
C232
100p
1732.5MHz
FL204
53 2
4 1INOUT
G1G2G3
C228 33p
C220
1n
100p
C231
2.2u
C222
L204
3.9n
R204
130
R203
130
C234 100pR202
43
49.9
R201
FL201
1950 MHz,2140 MHz
95
74
1
2
8
36ANT TX_IN
RX_OUT2
GND1
RX_OUT1
GND2 GND4
GND3 GND5
C218 22pC217 10p
C203
2.2u
1nC212
330pC202
V_POWERRAIL
C2131n
330pC201
1nC214
C209
1p
L201
1.8n
DNIC211
C207
33p
10pC215
2.7n
L203
2.7pC208
+2.8V_LNA
L223
DN
I
C248
100p
L224
1n
PA_R0
PA_R0
PWR_DET_IN
ANT_SEL1
TRX_U_AWS
ANT_SEL3
TRX_U_2100
PA_ON_U2100
PRX_U_2100_INM
PRX_U_2100_INP
U_AWS_TX
PA_ON_AWS
TX_U_2100
PRX_U_AWS_INP
PRX_U_AWS_INM
AWSAWS Tx (1710-1755MHz)
As close as possible to MDM6600
U2100 TX
U2100 RX
UMTS2100
TP2 TP3 TP4 TP5
TP2 TP3 TP4 TP5
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.5.4. Checking PAM Block
PAM control signal
W_1700_PA_EN(C233) , W_2100_PA_EN(C214) : PAM Enable
W_PA_VMODE, W_PA_VMODE_0: PAM Gain Control
W_PA_EN must be HIGH (over 3.2V)
4. TROUBLE SHOOTING
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LGE Internal Use Only
PAM IN/OUT Signal : When PAM is under the operation of high power mode
(WCDW_PA_Mode(C212): Low, WCDMA_PA_Mode_0(C232):Low),
PAM OUT power must be over 23 dBm
PAM IN power must be under 10 dBm
TP2
TP1
TP2 TP3
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1
TP2
TP1 TP2 TP3
C11147u
L128 3.9n
15p
C11
6
2.2p
C11
78.
2pC
119
3n
L108
5.6n
L110
5.1n
L109
15p
C11
533
p
C11
8
C147
0.5p
DN
I
R10
9
DN
I
R10
6 C146
1p
V_POWERRAIL
100p
C150
100p
C149
U101
12
13
14
15
16
17
6
5
7
4
8
3
9
2
10
1
11GND3
RFIN_HB
GND2
VBATT
RFOUT_LB
VEN_HB
RFIN_LB
VMODE0
GND1
VMODE1
VEN_LB
PGND
RFOUT_HB
GND6
GND5
VCC
GND4
100p
C120
100p
C121
L127 1n
2.2n
C112
100p
C108
47p
C109
8p
C110
PA_R0
GSM_TX
DCS_PCS_TX
PA_R1
GSM_PA_HB_EN
GSM_PA_LB_EN
TP2
TP2
TP1
TP1
VCC_IO_1V8
2.7nL225
C216 22p
100p
C241
U202
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
10pC240
U201
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VBPISO
VMODEGND
VENCPLL202
DNI
FL203
1732.5MHz,2132.5MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6
FL206 2140MHz
52
4
31IN OUT
_OUTG1 G3R207
27K
C247
10n
U203
7
43
52
61RFIN RFOUT
EN RREF
GS VCC
PG
ND
L219 2.7nC204 8.2pL220
1.5n
L221
12n
U204
2
3
4
15
VCC
GND
FL202
1950MHz
5 2
4 1
3G3
INOUTG1G2
L205
10n
L217
2n
C244
DNI
C243
47p
C246 8.2p
C245 8.2p
C242
47p
L218
5.6n
DNIL213
L212DNI
L2266.8n
C227 12p
2.2u
C221
V_POWERRAIL
L210
12nC229DNI
L211
2.2n
C223
33p
C233
100p
C232
100p
1732.5MHz
FL204
53 2
4 1INOUT
G1G2G3
C228 33p
C220
1n
100p
C231
2.2u
C222
L204
3.9n
R204
130
R203
130
C234 100pR202
43
49.9
R201
FL201
1950 MHz,2140 MHz
95
74
1
2
8
36ANT TX_IN
RX_OUT2
GND1
RX_OUT1
GND2 GND4
GND3 GND5
C218 22pC217 10p
C203
2.2u
1nC212
330pC202
V_POWERRAIL
C2131n
330pC201
1nC214
C209
1p
L201
1.8n
DNIC211
C207
33p
10pC215
2.7n
L203
2.7pC208
+2.8V_LNA
L223
DN
I
C248
100p
L224
1n
PA_R0
PA_R0
PWR_DET_IN
ANT_SEL1
TRX_U_AWS
ANT_SEL3
TRX_U_2100
PA_ON_U2100
PRX_U_2100_INM
PRX_U_2100_INP
U_AWS_TX
PA_ON_AWS
TX_U_2100
PRX_U_AWS_INP
PRX_U_AWS_INM
AWSAWS Tx (1710-1755MHz)
As close as possible to MDM6600
U2100 TX
U2100 RX
UMTS2100
TP3 TP2 TP1
TP3 TP2 TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.5.5. Checking RF Rx Level
Test Point (RF Rx Level)
TP2
TP4
TP3 TP5
TP1
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1
TP2
Bias
SW101
G1
ANTG2
L107
22n
SW102
43
2
1ANT COMMON
G3 G4
VDD_RF_SW
100n
L106
100p C106
1u
C102
33p
C103
15n
L103
FL101
20
222
21
24
923
1116
17
1813
1912
10
148
151
65437V
DD
CTR
L1
CTR
L2
CTR
L3
CTR
L4
GND1 GSM850_RX_EGSM_RX2
GND2 GSM850_RX_EGSM_RX1
GND3
GND4 PCN_RX_PCS_RX2
GND5 PCN_RX_PCS_RX1
GND6
GND7 GSM850_EGSM_TX
GND8 PCN_PCS_TX
GND9
WCDMA1
ANT WCDMA2
WCDMA3
R101 1K
R103 1K
R104 1K
R102 1K
ANT_SEL0
ANT_SEL1
ANT_SEL2
ANT_SEL3
Bias
TP1
L104
DNI
10n
L102
2.2pC104
12n
L101
2.2pC101
C107 100p
C105 100p
L129
2.2nL105
15n18
19
14
15 RX_G_1800_1900_M
RX_G_900_P
RX_G_900_M
RX_G_1800_1900_P
GSM1800/1900 RX
GSM 900_ RXTP2
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP2 TP3
TP4 TP5
TP2 TP3
C216 22p
L202
DNI
L219 2.7nC204 8.2pL220
1.5n
L221
12n
L205
10n
L204
3.9n
FL201
1950 MHz,2140 MHz
95
74
1
2
8
36ANT TX_IN
RX_OUT2
GND1
RX_OUT1
GND2 GND4
GND3 GND5
C218 22pC217 10p
C209
1p
10pC215
TRX_U_2100
PRX_U_2100_INM
PRX_U_2100_INP
As close as possible to MDM6600
U2100 RX
UMTS2100
TP2
TP3
VCC_IO_1V8
2.7nL225
100p
C241
10pC240
FL203
1732.5MHz,2132.5MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6
FL206 2140MHz
52
4
31IN OUT
_OUTG1 G3R207
27K
C247
10n
U203
7
43
52
61RFIN RFOUT
EN RREF
GS VCC
PG
ND
U204
2
3
4
15
VCC
GND
L217
2n
C244
DNI
C24
3
47p
C246 8.2p
C245 8.2p
C24
2
47p
L218
5.6n
DNIL213
L210
12nC229DNI
+2.8V_LNA
L223
DN
I
C248
100p
L224
1n
ANT_SEL1
TRX_U_AWS
ANT_SEL3
PRX_U_AWS_INP
PRX_U_AWS_INM
AWS
TP2
TP3
TP4TP5
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.6. Checking GSM Block
Refer to 5.3, 5.5
4.7 GPS/ WIFI/ BT RF Component
GPS Module
The GPS module is included MDM6200 Chip
Reference Description
ANT103 ANTENNA PAD
connected to DPA type antenna
FL104 SAW Filter
U102 External LNA
FL103 SAW Filter
U302 MDM6200 is included
GPS Module
U302
U102
FL104
ANT103
FL103
4. TROUBLE SHOOTING
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LGE Internal Use Only
Wifi/BT Module
SWB-B25 is Wifi/BT/FM integrated chip
Reference Description
ANT1401 ANTENNA PAD
connected to DPA type antenna
U1401 SWB-B25
WIFI/BT/FM Module
U1402 150mA LDO for TCXO
X1401 TCXO 38.4MHz
U1204
U1401
ANT1401
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.8 GPS/ WIFI/ BT SIGNAL PATH
GPS Signal Path
4. TROUBLE SHOOTING
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LGE Internal Use Only
Wifi/BT/FM Signal Path
Wifi SDIO to AP20
BT PCM & UART to AP20
Wifi Signal
BT Signal
U1401
4. TROUBLE SHOOTING
- 95 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.9 Power ON TroubleshootingThe main power source of LGP990 is provided by 3 chips which are MAX8907C, MAX8252 and PM8028 (Communication processor). Since PM8028 only powers up normally when AP20H is properly powered therefore, MAX8907C and MAX8252 are the actual ones to take look at.Power ON sequence of LGP999DW is, PWR key press → PM_ON_SW go to low (R825, MAX8907C ONKEY_ pin(H6)) → MAX8907C Power Up → MAX 8252 Power Up (U802, L804) → VCC_RTC(C847) → VCC_CORE_1V2 (L802), VCC_IO_1V2(L801) → VCC_IO_1V8(L801) → VCC_LCD_1V8(C866) → VCC_DDRx_3V3(C868) → USB_OUT_5V(C819) → SYS_RESET_N_AP20 goes high
MAX8907C_DS_Rev 1.0 6/29/2010 MAXIM CONFIDENTIAL
Page 52 of 159
Figure 12 ON/OFF Controller Circuitry
4. TROUBLE SHOOTING
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LGE Internal Use Only
START
Battery voltage higher than 3.5V? Change or charging the BatteryNo
Yes
Change the main board
Check the Upper FPCBNo
Yes
Power Key is damaged? Change Upper FPCBNo
Yes
Change the TCXO and X-talNo
Yes
VCC_CPU_1V0,VCC_IO_1V2,
VCC_CORE_1V2,VCC_IO_1V8,
VCC_DDRX_3V3 Power up?
Change the Main board
Yes
No
Press PWR Key R825 high to low
is clock OK?X801:32.768Khz
4. TROUBLE SHOOTING
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LGE Internal Use Only
BOTTOM view of LGP999DW
OP view of LGP999DW
L801
L802
L803
L804
X801
R825
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.10 Charger Troubleshooting
Since LGP999 micro USB is located at the bottom of the terminal set, charging current flows via Lower FPCB. The charger IC accepts the current and maximum charging current is set around 945mA
Charging Procedure- Connect TA or uUSB Cable- Control the charging current by RT9524 IC- Charging current flows into the battery
Troubleshooting Setup- Connect TA and battery to the phone
Troubleshooting Procedure- Check the charger (TA or USB Cable) connector
Check P int- Connection of TA or USB Cable - Charging current path(RT9524) - Battery
VA105
CN104
11
10
9
5
4
3
2
1
8
7
6
FL101
5
6
31
42P2 P4
P1 P3
P6
P5
FL102
INOUT
GND1GND2
C10
31u
C10
40.
1u
V_CHG
USB_ID
USB_DM
USB_DP
MicroUSB
R13
1310
0K
1u
C1304
R13
0110
0K
1uC
1305
C13
062.
2u
V_POWERRAIL
VBUS_OUT V_CHG
560
R13
11
U1302
65
74
83
92
101
11PGND
VIN BATT
ISET PGB
GND1 CHGSB
LDO GND2
IEOC EN_SET
VCC_IO_1V8R
1312
5.1K
R13
0210
0K
CHG_EN_SET_N_AP20
CHG_STATUS_N_AP20CHG_PGB_N
1%
2mm
1%
Close to batt. connectorCHARGER IC
Main Battery
C1304 C1306
LOWER FPCB
4. TROUBLE SHOOTING
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LGE Internal Use Only
Check the pin and battery Connect terminals of I/O connector
Connection OK?No
Yes
Is the u- USB Cable)voltage 4.8V (or 5.0V)?
No
Yes
Is it charging properlyAfter turning on?
START
Check PMIC SMT status by X-ray Exchange PMIC or Change the
main board and Retest
Change I/O connector
Change TA (or u-USB cable)
ENDYes
No
4. TROUBLE SHOOTING
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LGE Internal Use Only
TOP view of LGP990
C1306
U1302
C1304
4. TROUBLE SHOOTING
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LGE Internal Use Only
4.11 USB TroubleshootingThe sequence of LGP999USB is, USB connected to LGP999DW →USB_OUT_5V(C819) goes to 5V →USB_D+ go to 3.3V→ USB_DATA is triggered →USB workBlock Diagram of USB & UART connection is shown below
4. TROUBLE SHOOTING
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LGE Internal Use Only
Cable is inserted? Insert cableNo
Yes
Change the main board
Check Lower FPCB connectorNo
Yes
Change Lower FPCBYes
No
USB_D+is 3.3V? Check U865No
Yes
START
C819 is 5V?
Lower FPCB damaged?
4. TROUBLE SHOOTING
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LGE Internal Use Only
Lower FPCB
AP20
TP609
Y4
P6
P8
W5
P4
N3
P10USB1_VBUSUSB1_DNUSB1_DPUSB1_IDUSB3_DNUSB3_DPUSB_REXT
1K
R622
USB_OUT_5VUSB_AP20_DNUSB_AP20_DP AVDD_USB
VCC_USB_3V3
90ohm matching !!
D11
01
CN1103
1312
1411
1510
169
178
187
196
205
214
223
232
241
1uC
1111
10K
R11
06
VCC_IO_1V8
R11
0510
K
47p
C1114
10p
C1115 C1116
33p
V_CHG
D11
00
VOL_KEY_UP
BLED_IN
BLED_OUT
MIC1P
USB_ID
MICBIAS
USB_DM
USB_DP
SPK_P
SPK_N
VOL_KEY_DOWN
25V
Main to Lower_FPCB connector
10K
R1314
4.7K
R13
15
R13
16
4.7K
C1301
0.1u
VCC_IO_1V8
2.2u
C1307
R1310
2.2K
V_CHG
V_POWERRAIL
C13
02
1u
U1301
B2
C1
C2
C3 A2
C4
D3
D1 D4
A1
B1
A3
B4 B3
B5 A5
C5 A4
D5 D2BATVB
DN1COMN1
DP2COMP2
U1UID
U2
RES
MIC
AUD1CAP
AUD2
GND
ISETIC
SC
L
SD
A
INT
USB_AP20_DNUSB_AP20_DP
INT_N_MUIC
MUIC_SDAMUIC_SCL
USB_ID
USB_DMUSB_DP
UART_TXUART_RX
90ohm matching !!90ohm matching !!
MUIC
4. TROUBLE SHOOTING
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LGE Internal Use Only
C819 (USB_OUT_5V)
LOWER FPCB Connector (CN1103)
4. TROUBLE SHOOTING
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LGE Internal Use Only
Check if FPCB is cut or damagedU1302(MUIC – MAXIM14526)
LOWER FPCB
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. 12 Audio troubleshooting
4.12.1 Speaker troubleshooting
Speaker control signals are generated by WM8994(U1001), and Power is supplied by MAX8907C(U602).
Check the spealer sound and reconnect the main ANT module
Spker sound is OK?
No
ENDYes
START
No
Check the waveform of TP1.Waveform is OK?
No
Change the Audio codec IC
Change the Lower FPCBYes
Change the main ANT module sound is OK? END
Yes
Spker sound is OK? ENDYes
4. TROUBLE SHOOTING
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LGE Internal Use Only
TP1 (C1216)
C1216
DNI DNI
C1217
G7
H7
H8
G8
B3
C3
A2
B1SPKOUTLNSPKOUTLP
SPKOUTRNSPKOUTRP
CPCACPCB
CPVOUTNCPVOUTP
2.2uC1225
2.2uC1224
C1220 2.2u
R1218 10K
R1217 10K
SPK_PSPK_N
TP1 (C1216)
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. 12.2 Receiver troubleshooting
Receiver control signals are generated by WM8994(U1001), and Power is supplied by MAX8907C(U602).
Check the spealer sound and reconnect the Upper FPCB
Receiver sound is OK?
No
ENDYes
START
No
Check the waveform of TP1.Waveform is OK?
No
Change the Audio codec IC
Change the Upper FPCBYes
Change the receiver sound is OK? ENDYes
Spker sound is OK? ENDYes
4. TROUBLE SHOOTING
- 109 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP1(FB1015)D
NI
C11
08C1109
0.1uC1110
0.1u
FB1101 1800
VA1101
FB1102 1800
1800FB1103
FB1104 1800
FB1105 1800
VCC_SENSOR_1V8 VCC_SENSOR_3V0
CN1102
1312
1411
1510
169
178
187
196
205
214
223
232
241
VA1102
50PIN_EAR_L
50PIN_EAR_SENSE
50PIN_EJ_MIC
50PIN_EAR_R
RCV_N
RCV_P
EAR_GND
TP1 (FB1215)
4. TROUBLE SHOOTING
- 110 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. 12. 3 Main MIC troubleshooting
Main MIC control signals are generated by WM8994(U1001), and Power is supplied by MAX8907C(U602).
Check the main MIC and reconnect the Lower FPCB
Voice recording is OK?
No
ENDYes
START
MICBIAS voltage is 2V?
No
Change the Audio codec IC
Change the Lower FPCBYes
Check the MICBIAS(TP1)
Voice recording is OK? ENDYes
4. TROUBLE SHOOTING
- 111 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP1 (C1114)
D11
01
CN1103
1312
1411
1510
169
178
187
196
205
214
223
232
241
1uC
1111
10K
R11
06VCC_IO_1V8
R11
0510
K
47p
C1114
10p
C1115 C1116
33p
D11
00VOL_KEY_UP
BLED_IN
BLED_OUT
MIC1P
USB_ID
MICBIAS
USB_DM
USB_DP
SPK_P
SPK_N
VOL_KEY_DOWN
25V
TP1 (C1216)
4. TROUBLE SHOOTING
- 112 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. 12. 4 SUB MIC troubleshooting
SUB MIC control signals are generated by WM8994(U1001), and Power is supplied by MAX8907C(U602).
Check the SUB MIC and main board
Speaker phone call is OK?
No
ENDYes
START
MICBIAS voltage is 2V?
No
Change the Audio codec IC
Change the SUB MICYes
Check the MICBIAS(TP1)
Speaker phone call is OK? ENDYes
4. TROUBLE SHOOTING
- 113 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP1 (C1101)
MIC1101
4
3
2
1P
G1
G2
O
47p
C1101
10p
C1102 C1103
33p
MICBIAS
MIC2P
SUB MICTP1 (C1101)
4. TROUBLE SHOOTING
- 114 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. 12. 5 Ear-MIC troubleshooting
Ear MIC control signals are generated by WM8994(U1001), and Power is supplied by MAX8907C(U602).
Check the main ear-jack and recomect the lower FPCB
No
ENDYes
START
Check the waveform of TP1.Waveform is OK?
No
Change the upper FPCBYes
Sound or MIC is OK?
END
Yes
Ear sound is OK? Ear MIC is OK?
No
Check the EJ_MICBIAS(TP2)Voltage is 2.2V?
No
ENDYes
Change the codec IC or main PCB
ENDYes
4. TROUBLE SHOOTING
- 115 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
TP1 (FB1102)
TP2 (R1216)
DN
IC
1108
C1109
0.1uC1110
0.1u
FB1101 1800
VA1101
FB1102 1800
1800FB1103
FB1104 1800
FB1105 1800
CN1102
1312
1411
1510
169
178
187
196
205
214
223
232
241
VA1102
50PIN_EAR_L
50PIN_EAR_SENSE
50PIN_EJ_MIC
50PIN_EAR_R
RCV_N
RCV_P
EAR_GND
TP1 (FB1102)
0 R1220
1u
C1222C1221
47p
R12
16
2.2K
120pC1226
R12220
HOOK_ADC
50PIN_EJ_MIC
EJ_MICBIAS
HOOK_DET
3.5Phi MIC Detect
TP2 (R1216)
4. TROUBLE SHOOTING
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LGE Internal Use Only
FB1102
C1101
R1216
C1114
C1216
FB1015
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. 12 Main 8M AF Camera troubleshooting
8M camera control signals are generated by AP20(U601), and Power is supplied by LP8720(U1001)
4. 12.6 Main 8M AF Camera troubleshooting
Check the camera conn. and revonnect thr camera
Camera is OK?
No
ENDYes
START
Yes
Check the camera signals MCLK(TP4), MIPI_CLK(TP5), MIPI_DATA(TP6)
Yes
Change the camera
Change the main boardNo
Check IOVDD(TP1),DVDD(TP2), AVDD(TP3)
Camera is OK? ENDYes
No
4. TROUBLE SHOOTING
- 118 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
FL1009
1
42
5
6
3P2 P4
P1 P3
P6
P5
C1005
1u
FB10
02
FB10
03
FL1001
109
84736251
P1 P5P2 P6P3 P7P4 P8
G1
G2
ZD1002
1u
C10100.1u
C1006
CN1002
1312
1411
1510
169
178
187
196
205
214
223
232
241
CAM_VIO_1V8 CAM_AF_2V8
CAM_AVDD_2V8
CAM_VDIG_1V2
0.1u
C1007 C1008
0.1u
ZD1003
0.1u
C1011C1009
1u
FB10
01
GND
8M_MIPI_DATA0_N8M_MIPI_DATA0_P
8M_MIPI_DATA1_P8M_MIPI_DATA1_N
CAM_I2C_SDA
CAM_I2C_SCL
CAM_MCLK8M_MIPI_CLK_P
8M_RESET_N
8M_MIPI_CLK_N
8M_CAM_VCM_EN
TP5 (FL1009)
TP6 (FL1001)
TP2 (C1005)
TP1 (FB1002)TP3 (FB1001)
R658 10
R659 10
4.7K
R629R628
4.7K
AA25
AH30
AA29
AC25
AG31
AA23
AB26
AH26
AJ27
AC29
AA27
AD28
AK28
AF28
Y26
Y24
Y22
AC27
AB24
AC31
AE29
AE27
AG29
AB18
AJ5
AG11
AH6
AD16
AL5
AB14LCD_D21LCD_D22LCD_D23
HDMI_INT_NDDC_SCLDDC_SDA
CRT_HSYNCCRT_VSYNC
VI_PCLKVI_MCLKVI_D0VI_D1VI_D2VI_D3VI_D4VI_D5VI_D6VI_D7VI_D8VI_D9VI_D10VI_D11
VI_VSYNCVI_HSYNC
CAM_I2C_SCLCAM_I2C_SDA
VI_GP0VI_GP3VI_GP4VI_GP5VI_GP6
1.8K
R624
C603 DNI
C604 DNI
VCC_VI_1V8
1.8K
R623
VT_DATA[0]VT_DATA[1]
VT_DATA[4]VT_DATA[5]
VT_CAM_PWDN
VT_HSYNCVT_VSYNC
VT_RESET_NCAM_I2C_SDACAM_I2C_SCL
CAM_MCLK
8M_RESET_N
FLASH_LED_EN
FLASH_LED_INHFLASH_LED_TORCH
DDC_SCLDDC_SDA
VT_DATA[2]VT_DATA[3]
VT_DATA[6]VT_DATA[7]
8M_CAM_VCM_EN
LCD_D23
LCD_D21LCD_D22
HDMI_INT_N
VT_PCLK
8M & 2M cam
GPIO_PT4
GPIO_PD5
GPIO_PT2
VCC_IO_1V8
AVDD_OSC
VDDIO_VI
VCC_VI_1V8
BT_DAP4
TP4 (R659)
U601AP20
4. TROUBLE SHOOTING
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LGE Internal Use Only
4. TROUBLE SHOOTING
- 120 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. 13 Sub 1.3M Camera troubleshooting
8M camera control signals are generated by AP20(U601), and Power is supplied by LP8720(U1001)
Check the camera conn. and revonnect thr camera
No
ENDYes
START
Yes
Yes
Change the sub camera
Change the main boardNo
ENDYes
No
Sub Camera is OK?
Check AVDD(TP1),IO_DVDD(TP2)
Check the camera signals MCLK(TP3), PCLK(TP4)
Sub Camera is OK?
4. TROUBLE SHOOTING
- 121 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
0.1u
C10
16
C10
130.
1u
CN1001
1312
1411
1510
169
178
187
196
205
214
223
232
241
VT_AVDD_2V8
C10
151u1u
C10
14
VT_IO_DVDD_1V8
VT_CAM_PWDN
VT_HSYNC
VT_VSYNC
VT_RESET_N
CAM_I2C_SDA
CAM_I2C_SCL
CAM_MCLK
VT_CAM_DATA[0]
VT_CAM_DATA[1]
VT_CAM_DATA[4]
VT_CAM_DATA[5]
VT_CAM_DATA[2]
VT_CAM_DATA[3]
VT_CAM_DATA[6]
VT_CAM_DATA[7]
VT_PCLK
TP2 (C1015)
TP1 (C1013)
R658 10
R659 10
4.7K
R629R628
4.7K
AA25
AH30
AA29
AC25
AG31
AA23
AB26
AH26
AJ27
AC29
AA27
AD28
AK28
AF28
Y26
Y24
Y22
AC27
AB24
AC31
AE29
AE27
AG29
AB18
AJ5
AG11
AH6
AD16
AL5
AB14LCD_D21LCD_D22LCD_D23
HDMI_INT_NDDC_SCLDDC_SDA
CRT_HSYNCCRT_VSYNC
VI_PCLKVI_MCLK
VI_D0VI_D1VI_D2VI_D3VI_D4VI_D5VI_D6VI_D7VI_D8VI_D9
VI_D10VI_D11
VI_VSYNCVI_HSYNC
CAM_I2C_SCLCAM_I2C_SDA
VI_GP0VI_GP3VI_GP4VI_GP5VI_GP6
1.8K
R624
C603 DNI
C604 DNI
VCC_VI_1V8
1.8K
R623
VT_DATA[0]VT_DATA[1]
VT_DATA[4]VT_DATA[5]
VT_CAM_PWDN
VT_HSYNCVT_VSYNC
VT_RESET_NCAM_I2C_SDACAM_I2C_SCL
CAM_MCLK
8M_RESET_N
FLASH_LED_EN
FLASH_LED_INHFLASH_LED_TORCH
DDC_SCLDDC_SDA
VT_DATA[2]VT_DATA[3]
VT_DATA[6]VT_DATA[7]
8M_CAM_VCM_EN
LCD_D23
LCD_D21LCD_D22
HDMI_INT_N
VT_PCLK
8M & 2M cam
GPIO_PT4
GPIO_PD5
GPIO_PT2
VCC_IO_1V8
AVDD_OSC
VDDIO_VI
VCC_VI_1V8
BT_DAP4 TP4 (R659)
U601AP20
4. TROUBLE SHOOTING
- 122 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
- 123 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.14. Main LCD trouble
Main LCD control signals are generated by AP20. Those signal’s path are : AP20 -> LCD Module
Press PWR key turn the power On
Is the circuit powered?
Yes
END
Follow the Power ON trouble shooting
No
LCD display OK?
START
No
Check Power VCC_LCD_1V8VCC_LCD_2V8V_POWERALL
No
Change the Main board
Disconnect and reconnect LCD connector
Change the LCD module
The LCD works
Yes
Yes
Yes
4. TROUBLE SHOOTING
- 124 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
R1016
100
C1029
15pVA1003
2.2u
C1031
VCC_LCD_1V8
V_POWERRAILR
1011
4.7K
VCC_LCD_1V8
VCC_LCD_2V8
C1030
2.2u
CN1003
2625
2724
2823
2922
3021
3120
3219
3318
3417
3516
3615
3714
3813
3912
4011
4110
429
438
447
456
465
474
483
492
501
FB1004
LCD_RESET_N
LCD_MAKER_ID
LCD_BL_OUT1LCD_BL_OUT2 LCD_BL_OUT3
LCD_BL_OUT5LCD_BL_OUT6 LCD_BL_OUT7LCD_BL_OUT4
LCD_BL_OUT8
LCD_PWM
LCD_CSX
LCD_TE_BF
LCD_WRXLCD_DCX
LCD_R6LCD_R4LCD_R2LCD_R0LCD_G6LCD_G4LCD_G2LCD_G0LCD_B6LCD_B4LCD_B2LCD_B0
LCD_R7LCD_R5LCD_R3LCD_R1LCD_G7LCD_G5LCD_G3LCD_G1LCD_B7LCD_B5LCD_B3LCD_B1
TP2 TP3
TP1
4. TROUBLE SHOOTING
- 125 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.15 SIM detect Trouble shooting
The sequence of detecting LGP999 SIM is,
SIM inserted to LGP999 2.85V_SIM(C540) goes to 2.85V Triggers SIM clock, reset and data.
Block Diagram of USB & UART connection is shown below
I_O
RST CLK
USIM
SIM_CLK SIM_RST
SIM_IO PM8028UIM_RST
UIM_CLK
UIM_DATA
Re-insert the SIM card
Work well? ENDYes
No
Change Main bord
Change the main boardNo
Yes
Work well? ENDYes
START
Change SUB FBCB
Work well? ENDYes
No
Change SIM card
No
2.85V_SIM(C540)runs?
4. TROUBLE SHOOTING
- 126 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
C540
2.85V_SIM
+2.8V_LNA
C548
4.7u
H2
M10
N8
P10
R11
H11
H10
B1
C1
K2
J2
F1
B8
H1
D2
J1
E1
B5
B10
A3
R10
A4
E2
G2VREG_L1VREG_L2VREG_L3VREG_L4VREG_L5VREG_L6VREG_L7VREG_L8VREG_L9VREG_L10VREG_L11VREG_L12VREG_L13VREG_L14VREG_L15VREG_L16VREG_L17VREG_L18VREG_L19
NCP_CTC1NCP_CTC2
NCP_FBVREG_NCP
REF_BYP
+2.2V_XOADC_REF
C543
4.7u 4.7u
C544
C54
50.
1u
+2.05V_MDM_A2
C537
4.7u
VDD_RF_SW
C541
4.7u4.7u
C540
+3.0V_MDM_USB
2.2u
C542
+1.2V_MDM_P4
C538
4.7u
C535
2.2u 2.2u
C536
VDD_MDM_MPLL
C534
4.7u
VDD_MDM_SDCC1
C539
4.7u
+1.8V_MDM_P5
+2.6V,50mA+2.8V,50mA
4. TROUBLE SHOOTING
- 127 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
P999 SUB FPCB
Check if SUB FPCB is damaged
C102
C104
C101
R10
2
4.7K
C103
0.1u
C104
22pDNI
C102
2.85V_SIM
C101
22p
J101
9 8
10 7
6 3
5 2
4 1VCCGND1
RSTVPP
CLKIO
GND2GND5
GND3GND4
D10
1
43
52
61
SIM_CLKSIM_IOSIM_RST
4. TROUBLE SHOOTING
- 128 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.16 Side Key Trouble shooing
The sequence of detecting LGP990 Side key is,
Side key pressed on LGP990 VOL_KEY_UP, VOL_KEY_DOWN goes low
Block Diagram of Side key connection is shown below
Press the key
Side key works? ENDYes
No
Change the Main board
D901, D902 goes low when the key is pressed? END
No
Lower FPCB damaged? Change Lower FPCBYes
START
No
4. TROUBLE SHOOTING
- 129 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
D901
D902
4. TROUBLE SHOOTING
- 130 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.17 Vibrator trouble
Check out the setting menu on the phone. If not, check Test points shown on the pictures.
Turn on the phone
Yes
Follow the power-on trouble shooting
No
START
Check TP1, 2,3
No
Change the main board
Change the vibratorYes
Vibrator works
END
YesVibration OK?
Check Haotic FeedBack on thesetting menu
Is the circuit powered?
No
4. TROUBLE SHOOTING
- 131 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
CN1301
2
1
1u
C1312
VCC_MOTOR_3V0
U1304
91011
54
63
72
81EN VDP
PWM GND
MODE VDD
GAIN VDN
NC
3
NC
2
NC
1
C1315
10n
C1314
1u
TP1302
L1302 100n
L1301 100n
TP1301
VIBE_ENVIBE_PWM
TP2
TP3
TP1
4. TROUBLE SHOOTING
- 132 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.18 HDMI trouble
Check out the setting menu on the phone and then set the proper resolution for the outer display as shown below
Turn on the phone
Is the circuit powered?
Yes
Follow the power-on trouble shooting
No
START
Check the setting on menu
No
Change the main board
Set the resolution suitable for the display
Yes
Video ouput OK?
HDMI works
END
Yes
Connect the HDMI cable
No
4. TROUBLE SHOOTING
- 133 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
- 134 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. 19 Motion sensor troubleshooting
When the motion sensor does not work, the reason is chip problem. If the motion sensor IC is damaged, it will do not work even thought power is supplied and AP20 controls normally. Therefore if the motion sensor is damaged, change the motion sensor IC or main borad.
Moeion sensor function check (Screen rotation function is working or not?)
Function is OK? ENDYes
START
Change the IC(U1307)
Function is OK? ENDYes
Change the main board
Fnction is OK? ENDYes
4. TROUBLE SHOOTING
- 135 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
R13
270
C1317
1u
0.1u
C13
18
C1321
0.1u
VCC_SENSOR_3V0
0 R1329
C1320
1u
U1307
4
3
2
1
510
6
7
8
9SCL
DNC4
INT
DNC3
SD
AV
DD
IO_VDD
DNC1
DNC2
GND
R1330DNI
VCC_SENSOR_1V8 DN
IR
1326
MOTION_INT
GEN2_I2C_SCL
GEN
2_I2
C_S
DA
IME_
DA
IME_CL
4. TROUBLE SHOOTING
- 136 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. 20 Gyro/Compass sensor troubleshooting
The compass sensor is calibrated by the gyro sensor data using SW algorithm. Therefore Gyro sensor error makes the compass sensor malfunction.
Gyro & compass sensor function check
Gyro & compass function is OK?
No
ENDYes
START
Change the Gyro sensor IC(U1306)
Yes
END
Gyro-NG compass-OK?
Gyro-OK compass-NG?
No
ENDYes
Change the compass sensor IC(U1305)
Function is OK?
No
ENDYes
Change the Gyro sensor IC(U1306)
Function is OK?
No
ENDYes
Change the main board
Function is OK?
No
No
4. TROUBLE SHOOTING
- 137 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U1306
25 21 2022 192324
18
17
98 107 116
12
5
13
4
14
3
15
2
16
1CLKIN
NC7
NC1
NC6
NC2
NC5
NC3
VDD
NC4
INT
IME_DAFS
YN
C
IME
_CL
RE
GO
UT
VLO
GIC
AD
0
NC8
GND
SD
A
SC
L
RE
SV
1
CLK
OU
T
CP
OU
T
RE
SV
2
NC
9
0.1u
C1323
VCC_SENSOR_1V8 VCC_SENSOR_3V0
0.1u
C1322
0.1u
C13
19
C1316
2.2n
R13
240
R13
250
GYR
O_I
NT_
N
GEN
2_I2
C_S
CL
GEN
2_I2
C_S
DA
IME_DA
IME_
CL
R1332 0
VCC_SENSOR_3V0
R1331 0
VCC_SENSOR_1V8
C1310
0.1u
C1311
0.1u
U1305
12
11
10
9
5
4
6
37
28
1D
VD
D
VR
EG
GN
DA
GN
DS
AV
DD
ADDR
SCL
NC1
INT
VPP
DRDY
SDAGEN2_I2C_SCL GEN2_I2C_SDACOM_INT
4. TROUBLE SHOOTING
- 138 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4. TROUBLE SHOOTING
- 139 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.21 Proximity Sensor on/off trouble
Proximity Sensor is worked as below:
Send Key click Phone number click Call connected Object moved at the sensor
Control the screen’s on/off operation automatically
Measurement
VCC_SENSOR_3V0
VCC_SENSOR_1V8
PROX_OUT
GEN2_I2C_SCL
GEN2_I2C_SDA
Object moved at the Proximity Sensor
LCD off?
No
Check PROXI_SDA / SCL output & Prox_out
No
Yes
Work well?
START
END
No
Yes
Send Key click & call connected
Yes
Change the upper FPCB
Change the main board
4. TROUBLE SHOOTING
- 140 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
R101
20
U101
54
63
72
81LEDA SCL
LEDC SDA
VCC VIO
VOUT GND
VCC_SENSOR_1V8
VCC_SENSOR_3V0
10
R10210u
C101
1u
C105
0.1u
C104
4.7u
C103
PROXI_OUT
GEN2_I2C_SCL
GEN2_I2C_SDA
Proximity Sensor
TP1TP2
TP3
4. TROUBLE SHOOTING
- 141 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.22 Illumination Sensor on/off trouble
Illumination Sensor is worked as below:
Menu Key click Settings click Display click Brightness click
Automatic brightness click
Measurement
LSENSOR_BIAS
LSENSOR_SENS
Hide Illumination sensor by hand
LCD brightness change?
No
Check LSENSOR_BIAS/SENS No
Yes
Work well?
START
END
No
Yes
Automatic brightness click
Yes
Change the upper FPCB
Change the main board
4. TROUBLE SHOOTING
- 142 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U102
6
4 3
2
5 1VCCIOUT
GND1
GC1GC2
GN
D2
1uC102
LSENSOR_BIASLSENSOR_SENS
Ambient Light Sensor
TP2
TP1
4. TROUBLE SHOOTING
- 143 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
4.23 Touch trouble
Touch control signals are generated by AP20. Those signal’s path are : AP20 -> Touch Module
Measurement
VCC_TOUCH_3V1(TP1)
VCC_TOUCH_1V8(TP2)
Touch is OK?
No
No
Yes
Work well?
START
END
No
Yes
Check the touck connector and reconnect the touck connector
Change the main board
Change the touch module
YesEND
Check power VCC_TOUCH_3V1(TP1)VCC_TOUCH_1V8(TP2)
4. TROUBLE SHOOTING
- 144 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
VCC_TOUCH_1V8
C1113
0.1u
CN1104
65
74
83
92
101
VCC_TOUCH_3V1
C11121u
R11
0310
K
VCC_TOUCH_1V8
TOUCH_MAKER_ID
TOUCH_INT
GEN1_I2C_SDA
GEN1_I2C_SCL
TP2
TP1
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
5. DOWNLOAD
- 146 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LGV999DW
LGV999DWLGV999DW
LGV999DW
LGV999DW
LGV999DW
LGV999DW
5. DOWNLOAD
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LGE Internal Use Only
LGV999DW
LGV999DW
5. DOWNLOAD
- 148 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LGV999DW
LGV999DW
5. DOWNLOAD
- 149 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LGV999DW
LGV999DW
LGV999DW
LGV999DW
LGV999DW
LGP999
5. DOWNLOAD
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LGE Internal Use Only
LGV999DW
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
- 152 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
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LGE Internal Use Only
5. DOWNLOAD
- 155 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 156 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 157 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 158 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
5. DOWNLOAD
- 159 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LGV999DWLGV999DW
LGV999DWLGV999DW
LGV999DW
LGV999DW LGV999DW
LGV999DW
LGV999DWLGV999DWLGV999DW
5. DOWNLOAD
- 160 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LGV999DW
LGV999DW
LGV999DW
5. DOWNLOAD
- 161 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LGV999DW
LGV999DW
5. DOWNLOAD
- 162 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LGV999DW LGV999DW
LGV999DW LGV999DW
LGV999DW
5. DOWNLOAD
- 163 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
LGV999DW
LGV999DW
6. BLOCK DIAGRAM
- 164 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
SDIO1BT Wi-FiFM
Star LGP999 Block Diagram38.4M C
ame
8M / A
CSI
LCD 4.0”WVGA (800X480)
CPU I/F
UART3SDIO1
FEM
GSM SWB-B25 Mod.
BT Wi FiFM
DSI
eraA
F
VI
CAM_I2C
VT Cam
1.3M
FM Ant
GPS LNAGSMPAM
GPS
QualcommMDM6200R
F I/F
Touch Driver
LCD Backlight
( )
Touch Screen
LCD C/P (w/ ALC)
Light sensor
Touch moduleGEN1_I2C
GEN1_I2C
4Gb LPDDR2 SDRAM
POP
SDRC
M t d
X32GNSS
GPIOGPIO
FM I2SUART
PAM
Filter
FilterWCDMAPAM
MEM
I/F
Motor
AU
X PC
M
Light sensor
MCP(MP)
PWM
AP20H
Mounted on AP20H Sample
WCDMA
USI
M I/
F
SP SPI1
GPIOGPIO
I2C
AMP
USBF/S
3 axis accelerometerGEN2_I2C
UART UART1
C
GyroSPI2SPI2
SSBIDUPLEXER Filter
X16512Mb DDR
SDRAM
1Gb NAND X16uUSB
connector
MCP(MP)
SDIO3
SW USB
Proximity sensorModem PCM(DAP3)
BT PCM(DAP4) GEN2_I2C Compass
32.768K
Key Input(PWR, Vol, …)
HSMMC I/F
GPIO
USIMSW
MU
ICUART2USBUARTChargerHS USB
HDMIDDC
X8
GEN1_I2C
8GB User memoryeMMC MAX17040G
12M
MicReceiver
Fuel gaugeRT9524
PMICEN
GEN2_I2CPWR_I2C DAP1
Charger IC
WM8994
DAP2Thermal Sensor
(NCT1008)
32.768K
connector
CPU Power(MAX8952)
PMIC(PM8028)
3.5 pi earjack
SpeakerPMIC
(MAX8907C)V_POWERRAILWM8994
1500mAhFM Ant
6.Block diagram
6. BLOCK DIAGRAM
- 165 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
RF
RX SAWDRX_HB_INMDRX_HB_INP
G850/EGSM TX_LB4GSM PAMGSM850/EGSM TX
GPS LNA
ALM-2506RX SAW
GNSS_INPGNSS_INM
WBand1-PAMW2100D l
WCDMA TX SAW
TX_MB4
DCS/PCN
WCDMA2
ACPM-7868 TX_MB1PCN/PCS TX
ACPM-5201Duplexer TX SAW
W1700 WCDMA WBand4-PAM
MDM6200
TX MB2WCDMA1
FEM
D5024
W1700Duplexer TX SAW
SKY77703
RX SAWPRX_HB_INMPRX_HB_IMPPRX MB1 INM
PA_DET_IN
TX_MB2
W2100
WCDMA1
W1700
PRX_MB1_INMPRX_MB1_INPPRX_LB1_INMPRX_LB1_INPDRX_LB2_INMDRX_LB2_INPDRX_MB1_INMDRX_MB1_INP
G900
G1800/1900
CTRL1
W2100RX SAW
RX SAWG850
GRFC_2/WDOG_DISABLE/GPIO_94CTRL1CTRL2
ANT_SEL0,1,2,3
CTRL3CTRL4
GRFC_3/BOOT_FROM_ROM/GPIO_95GRFC_4/FAILED_BOOT/GPIO_96GRFC_5/GPIO_97
6. BLOCK DIAGRAM
- 166 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
RF <Control signals and Clocks>
MDM6200
W-PAM
ACPM-5201
VEN PA_0N1/GPIO_86PA_ON_U2100
PA_R0PA_R0VMODE
CPL
W-PAM
SKY77703VEN
VMODE_0PA_ON_AWS
PA_RO
PA_ON0/GPIO_85PWR_DET_IN
PDET IN
CPL_IN
CPL OUT_ _
PDET_IN
VEN_HB PA_ON2GSM_PA_HB_EN
VEN_LB PA_ON1GSM_PA_LB_EN
GSM PAM
CPL_OUT
FEM CTRL1 ANT_SEL0
PA_R0VMODE_0
VMODE_1 PA_R1 PA_R1ACPM-7868
GRFC_2/WDOG_DISABLE/GPIO_94
D5024 CTRL2 ANT_SEL1
CTRL3ANT_SEL2
CTRL4ANT_SEL3
GRFC_3/BOOT_FROM_ROM/GPIO_95
GRFC_4/FAILED_BOOT/GPIO_96
GRFC_5/GPIO_97
6. BLOCK DIAGRAM
- 167 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
AP20 , PMB9801
ULPI_DATA0
ULPI_DATA1
ULPI_DATA2
ULPI_DATA3
UART1_IPC_TXDUART1_IPC_RXD
UART1__IPC_CTS_NUART1__IPC_RTS_N
GSBI3_3
GSBI3_2
GSBI3_1
GSBI3_0
UART2_RTS_N
GPIO_PU6
IPC_SRDY1
IPC_MRDY1
SPI1 IPC MOSI
GPIO_99
GPIO_98SPI1_IPC_CS_N
ULPI_STP GSBI0_0
AP20
ULPI_CLK
ULPI_DIR
ULPI_NXT
SPI1_IPC_MOSI
SPI1_IPC_MISO
SPI1_IPC_SCK
MDM6200
GSBI0_3
GSBI0_2
GSBI0_1
MDM6200ULPI_DATA4
ULPI_DATA7
IPC_SRDY2
IPC_MRDY2GPIO_51
GPIO_52SPI2_IPC_CS_N
SPI2 CS0 N GSBI2 0
SPI2_MOSI
SPI2_MISO
SPI12_IPC_MOSI
SPI2_IPC_MISO
SPI2_IPC_SCK
GSBI2_3
GSBI2_2
SPI2_CS0_N _
GSBI2_1SPI2_SCK
GPIO_PV0
GPIO_PV1
MDM_RESET_1.8VMDM_PWRON_1.8V PM8028
PON_RESET_N RESIN_N
GPIO_PV3MDM_RESET_FLAG
RESET2_N
6. BLOCK DIAGRAM
- 168 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
BLUETOOTH & WIFI & FM RX
BCM4329AP20 CLK 32K
FILTERWLAN_EN
WLAN_HOST_WAKEUPWL_HOST_WAKEUP
WL RST N
WLAN_WAKEUP WL_WAKE_B
BCM4329
KB_ROW8
GMI_DPD
LCD M1
BT/ WLAN ANT
AP20SLEEP_CLK
WLAN
32KCLKOUT CLK_32K
2G4_ANT
WLAN_SDIO_CMD
WLAN_SDIO_CLK
WLAN_SDIO[3:0]
SDIO_CMD
SDIO_CLK
WL_RST_N
SDIO[3:0]
SDIO1_CMD
SDIO1_CLK
LCD_M1
SDIO1_DAT[3:0]
WLAN
SDIO1 SDIO
LNA
WLANRF_Tx
BT/WLAN
SP3TSwitch 2.8V LDO
BT_UART_CTS
BT_UART_RTS
BT_UART_RXDBT_UART_TXD
BT_UART_RXD
BT_UART_TXD
BT_UART_RTS_N
BT_UART_CTS_N
UART3_TXD
UART3_RXD
UART3_CTS
UART3_RTSBT EN
UART3 UARTOSC_IN
LNARF_Rx
BTRF_Tx
TCXO38.4MHz
(KT3225L38400UCW28TA0)
CLK_REQ
BLUETOOTH
BT_EN
BT_WAKEUPBT_HOST_WAKEUP
BT_RST_N
BT_GPIO_0
BT_GPIO_1
LCD_SDIN
SPI1_MOSI
GMI_WP_NBT_PCM_SYNC
BT PCM INBT_PCM_SYNCDAP4_FS
SWB-B25
DAP4
BT_PCM_IN
BT_PCM_OUT
BT_PCM_CLK
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
DAP4_DIN
DAP4_DOUT
DAP4_SCLK
PCM
I2S_CK
I2S_DI
I2S_DO
I2S_WS
FMI2S
_
AUDIO_OUT_R
AUDIO_OUT_LAudio Analog Out
- 169 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
OJ1303
C11147u
ZD102ZD100
U103
743
52
61RFIN RFOUT
EN RREF
GS VCCP
GN
DDNI
C125
SW101
G1
ANTG2
+2.8V_LNA
R112
27K
C142 47p
ZD101
C122 100p
L107
22n
4.3nL112
DNI
L113
L128 3.9n
C151
100p
2140MHz
FL102
45
1
32G1 O1
ING2 O2
ANT103
1
DNI
C124
33pC123
15p
C11
6
2.2p
C11
78.
2pC
119
3n
L108
5.6n
L110
5.1n
L109
15p
C11
533
p
C11
8
C147
0.5p
DN
I
R10
9
DN
I
R10
6 C146
1p
V_POWERRAIL
100p
C150
100p
C149
U101
12
13
14
15
16
17
6
5
7
4
8
3
9
2
10
1
11GND3
RFIN_HB
GND2
VBATT
RFOUT_LB
VEN_HB
RFIN_LB
VMODE0
GND1
VMODE1
VEN_LB
PGND
RFOUT_HB
GND6
GND5
VCC
GND4
100p
C120
100p
C121
L104
DNISW102
43
2
1ANT COMMON
G3 G4
L127 1n
10n
L102
2.2pC104
12n
L101
2.2pC101
C141
10n
C140
100p
L126
2n
C107 100p
C105 100p
C139 10p
L129
2.2nL105
15n
C14
3
100pFL104
1575.42MHz5 2
4 1
3G3
OUTING1G2 C148 100p
C14
5
2.2p
2.2n
C112
100p
C108
47p
C109
8p
C110
C127
10p
VDD_RF_SW
100n
L106
100p C106
1u
C102
33p
C103
1575.42MHz
FL103
45
1
32G1 O1
ING2 O2
DNI
L121
U102
4
3
5
2
6
1
7PGND
NC1
VDD
RF_IN
RF_OUT
NC2
VSD
12n
L125
C14
4
2.2p
22p
C13
5
4.7n
L117
5.6n
L119
15n
L103
FL101
20
222
21
24
923
1116
17
1813
1912
10
148
151
65437V
DD
CTR
L1
CTR
L2
CTR
L3
CTR
L4
GND1 GSM850_RX_EGSM_RX2
GND2 GSM850_RX_EGSM_RX1
GND3
GND4 PCN_RX_PCS_RX2
GND5 PCN_RX_PCS_RX1
GND6
GND7 GSM850_EGSM_TX
GND8 PCN_PCS_TX
GND9
WCDMA1
ANT WCDMA2
WCDMA3
VDD_RF_SW
12n
L118
DNI
L123
1p
C130100p
C13
3
22p
C12
9
6.8p
C136
C128
0.1u
L124
4.7n
100pC131
DNI
C134
R101 1K
R103 1K
R104 1K
R102 1K
ANT101
1
C13
2
100p
PA_R0
GPS_LNA_EN
GPS_INP
GPS_INM
GSM_TX
DCS_PCS_TX
RX_G_1800_1900_M
RX_G_900_PANT_SEL0
ANT_SEL1
ANT_SEL2
TRX_U_AWS
PA_R1
GSM_PA_HB_EN
GSM_PA_LB_EN
ANT_SEL3
RX_G_900_M
RX_G_1800_1900_P
TRX_UCG_850
DRX_U_AWS_INM
DRX_U_AWS_INP
TRX_U_2100
DIV_LNA_EN
MAIN ANT / GSMLOW
GPSNear to ANT101
HIGH
HIGH
HIGH HIGH
HIGH
LOWHIGH
LOW
LOW
HIGH
LOW
LOW
LOW
LOW
HIGH
LOW
LOW
LOW
LOW
LOW LOW
LOW
ANTENNA SWITCH MODULE LOGIC
DCS/PCS TX
LOW
LOW
ANT_SEL0 ANT_SEL2
LOW
LOW
LOW
Pin 20
LOW
GSM850/EGSM TX HIGH
DCS1800 RX
Pin 22
GSM850 RX
HIGH
HIGHHIGH
LOW
Pin 21
LOW
LOW
ANT_SEL3ANT_SEL1
PCS1900 RX
EGSM RX
GSM1800/1900 RX
GSM 900_ RX
Div.
GPS LNA
7. CIRCUIT DIAGRAM
- 170 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
VCC_IO_1V8
2.7nL225
C216 22p
100p
C241
U202
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VMODE_1CPL_IN
VMODE_0GND
VENCPL_OUT
10pC240
U201
6 5
7 4
8 3
9 2
10 1
11PGND
VCC1VCC2
RFINRFOUT
VBPISO
VMODEGND
VENCPLL202
DNI
FL203
1732.5MHz,2132.5MHz
958472
3
6 1RXANT
TX
GND1 GND4GND2 GND5GND3 GND6
FL206 2140MHz
52
4
31IN OUT
_OUTG1 G3R207
27K
C247
10n
U203
7
43
52
61RFIN RFOUT
EN RREF
GS VCC
PG
ND
L219 2.7nC204 8.2pL220
1.5n
L221
12n
U204
2
3
4
15
VCC
GND
FL202
1950MHz
5 2
4 1
3G3
INOUTG1G2
L215
12n
L214 6.8n
L205
10n
L217
2n
C244
DNI
C24
3
47p
C246 8.2p
C245 8.2p
C24
2
47p
L218
5.6n
DNIL213
L212DNI
L2266.8n
C227 12p
2.2u
C221
V_POWERRAIL
L210
12nC229DNI
L211
2.2n
C223
33p
C233
100p
C232
100p
1732.5MHz
FL204
53 2
4 1INOUT
G1G2G3
C228 33p
C220
1n
100p
C231
2.2u
C222
881.5MHzFL205
45
1
32G1 O1
ING2 O2
L204
3.9n
R20
4
130
C235 5.6p
C238DNI
L216 6.8n
33p
C236
C239 5.6p
R20
3
130
C234 100pR202
43
49.9
R20
1
FL201
1950 MHz,2140 MHz
95
74
1
2
8
36ANT TX_IN
RX_OUT2
GND1
RX_OUT1
GND2 GND4
GND3 GND5
C218 22pC217 10p
C203
2.2u
1nC212
330pC202
V_POWERRAIL
C2131n
330pC201
1nC214
C209
1p
L222 2.7n
L201
1.8n
DNIC211
C207
33p
10pC215
2.7n
L203
2.7pC208
+2.8V_LNA
L223
DN
I
C248
100p
L224
1n
PA_R0
PA_R0
PWR_DET_IN
ANT_SEL1
TRX_U_AWS
ANT_SEL3
TRX_UCG_850
TRX_U_2100
PA_ON_U2100
PRX_U_2100_INM
PRX_U_2100_INP
PRX_UCG_850_P
U_AWS_TX
PA_ON_AWS
PRX_UCG_850_M
TX_U_2100
PRX_U_AWS_INP
PRX_U_AWS_INM
AWSAWS Tx (1710-1755MHz)
G850 RX(869 - 894 MHz)
GSM850_RX
As close as possible to MDM6600
U2100 TX
DCN/US-PCS/WCDMA
U2100 RX
UMTS2100
- 171 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
R318
0
R31
5
47K
VDD_MDM_MSME
R31
4
10K
R306
10K
R31
72.
2K
TP308TP307
R31
20
TP31
9TP
320
TP31
8
TP32
1
TP31
5TP
316
TP31
4R
316
2.2K
TP31
7
VDD_MDM_MSME
U302
Y26
T17
W17
T14
AB26
T13
B4
D6
B5
A4
A3
V4
W2
L1
T2
K5
T5
L4
L5
E6
G1
H4
H2
L2
K4
N1
N5
R4
P4
P2
T1
U4
V2
V1
R5
N2
N4
C1
W4
V5
P1
T4
P5
H5
K1
F4
K2
G4
G5
G2
H1
E1
E2
D4
F5
C2
D5
AB22
U10
AC22
U11
AC19
T9
AC20
T10
AC21
AC18
AB5
W1
AA2
Y7
W7
AC5
Y4
W6
W14
Y12
Y20
AC12
AC11
Y6
AA1
AC14
AB10
AC10
AB9
AC9
AB11
AC8
Y10
AB8
AC7
W10
AB7
Y8
AC4
AB4
W8
AC3
N7
AB12
AB13
N8
AC13
AB14
P8
U13
AB27
Y28
AB17
AC17
AB16
AC16
U8
P7
AC24
A10
G11
G12
B6
H12
D17
D14
D16
B18
B17
D15
A18
G16
H15
G14
W19
W18
W24
Y24
AB19
AB18
AB20
AB21
U25
N29
P29
R29
T29
U29
V29
V28
U28
D29
E29
F28
E28
F29
G29
J28
H28
H29
J29
E20
A20
A19
A24
A25
B27
B26
A26
A27
B24
B23
A22
A23
N20
C29
Y18
H9
AC15
U15
U9
M8
L8
K8
J8
H11
H10
Y19
U14
AC27
Y25
T15
AA29
Y16
AC26
W16
W12
Y14
Y29
Y17
AA28
G13
A16
E16
A17
AC23
AB23
T11
AB24
D13
E10
E12
A14
L7
E7
K7
J7
G18
E18
D18
A13
B13
E8
A12
E9
B12
D10
B10
B9
D11
D9
A7
B14
RESOUT_N
SDCC1_CLK/GPIO_53
SDCC1_CMD/GPIO_58
SDCC1_DATA_0/GPIO_54
SDCC1_DATA_1/GPIO_55
SDCC1_DATA_2/GPIO_56
SDCC1_DATA_3/GPIO_57
SDCC3_CLK/GPIO_69
SDCC3_CMD/GPIO_74
SDCC3_DATA_0/GPIO_70
SDCC3_DATA_1/GPIO_71
SDCC3_DATA_2/GPIO_72
SDCC3_DATA_3/GPIO_73
GRFC_2/WDOG_DISABLE/GPIO_94
GRFC_3/BOOT_FROM_ROM/GPIO_95
GRFC_4/FAILED_BOOT/GPIO_96
GSBI0_0/GPIO_28
GSBI0_1/GPIO_29
GSBI0_2/EXT_FM_INT/GPIO_30
GSBI0_3/GPIO_31
GSBI1_0/GPIO_32
GSBI1_1/GPIO_33
GSBI1_2/NFC_IRQ/GPIO_34
GSBI1_3/NFC_SHUTDOWN/GPIO_35
GSBI2_0/GPIO_36
GSBI2_1/GPIO_37
GSBI2_2/GPIO_38
GSBI2_3/GPIO_39
GSBI4_0/GPIO_44
GSBI4_1/GPIO_45
GSBI4_2/GPIO_46
GSBI4_3/GPIO_47
ETM_TRACECLK/GPIO_13
ETM_TRACECTL/GPIO_1
ETM_TRACEDATA_0/GPIO_2
ETM_TRACEDATA_1/GPIO_3
ETM_TRACEDATA_10/GPIO_12
ETM_TRACEDATA_11/GPIO_0
ETM_TRACEDATA_12/GPIO_14
ETM_TRACEDATA_2/GPIO_4
ETM_TRACEDATA_9/GPIO_11
UICC_DM/GPIO_52
UICC_DP/GPIO_51
USIM_CLK/GPIO_49
USIM_DATA/GPIO_48
USIM_RESET/GPIO_50
RTCK
TCK
TDO
TDI
TRST_N
TMS
GPIO_27
GPIO_59
GPIO_60
GPIO_68
GPIO_75
RF_RBIASXO_RFPRX_LB1_INMPRX_LB1_INPPRX_LB2_INMPRX_LB2_INPPRX_MB1_INMPRX_MB1_INPPRX_MB2_INMPRX_MB2_INPPRX_HB_INMPRX_HB_INPGNSS_INPGNSS_INMVTUNE_SHDRDRX_LB1_INMDRX_LB1_INPDRX_LB2_INMDRX_LB2_INPDRX_MB1_INMDRX_MB1_INPDRX_MB2_INMDRX_MB2_INPDRX_HB_INMDRX_HB_INPTX_LB1TX_LB2TX_LB3TX_LB4TX_MB1TX_MB2TX_MB3TX_MB4PDET_INPMIC_SSBIPS_HOLDPMIC_INT_NXO_OUT_D1_ENXO_OUT_D0_EN/GPIO_99XO_OUT_A0_EN/GPIO_98PA_R0PA_R1PA_ON0/GPIO_85PA_ON1/GPIO_86PA_ON2/GRFC_8/GPIO_87RF_SWITCH_0/BOOT_SCUR/GPIO_88RF_SWITCH_1/GPIO_89RF_SWITCH_2/GRFC_0/GPIO_90GRFC_14/GPIO_93GRFC_13/GPIO_92GRFC_12/GPIO_91GRFC_5/GPIO_97SLEEP_CLKSYS_CLKMODE_2MODE_1MODE_0RESIN_N
EBI2_A0/GSBI3_0/GPIO_40EBI2_A1/GSBI3_1/GPIO_41EBI2_A2/GSBI3_2/GPIO_42EBI2_A3/GSBI3_3/GPIO_43
EBI2_A4/GPIO_79EBI2_A5/EBI2_SEC_BUSY_N/GPIO_80EBI2_A6/ETM_TRACEDATA_6/GPIO_8EBI2_A7/ETM_TRACEDATA_7/GPIO_9
EBI2_A8/ETM_TRACEDATA_8/GPIO_10EBI2_A9/SDCC2_CLK/GPIO_62
EBI2_A10/SDCC2_DATA_0/GPIO_63EBI2_A11/SDCC2_DATA_1/GPIO_64EBI2_A12/SDCC2_DATA_2/GPIO_65EBI2_A13/SDCC2_DATA_3/GPIO_66
EBI2_A14/SDCC2_CMD/GPIO_67EBI2_A15/HEADSET_DET_N/GPIO_78
EBI2_AD0EBI2_AD1EBI2_AD2EBI2_AD3EBI2_AD4EBI2_AD5EBI2_AD6EBI2_AD7EBI2_AD8EBI2_AD9EBI2_AD10EBI2_AD11EBI2_AD12EBI2_AD13EBI2_AD14EBI2_AD15
EBI2_ASYNC_WAIT_N/GPIO_61EBI2_CS0_NEBI2_CS1_N
EBI2_CS2_N/EBI2_BUSY_N/GPIO_81EBI2_CS3_N/GPIO_82
EBI2_CS4_N/ETM_TRACEDATA_3/GPIO_5EBI2_CS5_N/ETM_TRACEDATA_4/GPIO_6EBI2_CS6_N/ETM_TRACEDATA_5/GPIO_7
EBI2_LB_NEBI2_LCD_CS_N
EBI2_LCDEN_WAIT_NEBI2_LCDRS_ADV_N
EBI2_MEM_CLKEBI2_OE_NEBI2_UB_NEBI2_WE_N
GP_PDM/GPIO_83GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26
EBI1_A0
EBI1_A1
EBI1_A2
EBI1_A3
EBI1_A4
EBI1_A5
EBI1_A6
EBI1_A7
EBI1_A8
EBI1_A9
EBI1_A10
EBI1_A11
EBI1_A12
EBI1_A13
EBI1_A14
EBI1_A15
EBI1_CAL
EBI1_CAS_N
EBI1_CKE0
EBI1_CKE1
EBI1_CS0_N
EBI1_CS1_N
EBI1_D0
EBI1_D1
EBI1_D2
EBI1_D3
EBI1_D4
EBI1_D5
EBI1_D6
EBI1_D7
EBI1_D8
EBI1_D9
EBI1_D10
EBI1_D11
EBI1_D12
EBI1_D13
EBI1_D14
EBI1_D15
EBI1_DCLK
EBI1_DCLKB
EBI1_DQM0
EBI1_DQM1
EBI1_DQS0
EBI1_DQS1
EBI1_RAS_N
EBI1_WE_N
USBPHY_DN
USBPHY_DP
USBPHY_ID
USBPHY_REXT
USBPHY_VBUS
FS_USB_DATA/ETM_TRACEDATA_14/GPIO_16
FS_USB_OE_N/GP_CLK/ETM_TRACEDATA_15/GPIO_17
FS_USB_SE0/ETM_TRACEDATA_13/GPIO_15
GPIO_76
GPIO_77
GPIO_84
TP31
3
2pC306
49.9
R30
2
R30
80
VDD_MDM_MSME
MDM_USB_VBUS
TP31
0
TP31
1
VDD_MDM_MSME
CN301
65
74
83
92
101
R31
0D
NI
0.1uC305
C304 0.1u
C302 0.1u
C307
0.1u
TP31
2
R304 4.7K
4020
R30
3
U301
B6
B3
B4
A4
A7
A3
A6
M8
L7
M7
N5
N4
M4
N3
N2
L8
M6
L6
N7
L5
M3
M2
M1
H7
D5
H8
D7
J1
G2
F2
H2
D3
F8
G8
B7
B8
C7
C8
C6
D8
C5
E6
J5
J7
K8
J8
K7
K6
K5
K4
J2
H3
E1
E2
J3
C4
D2
C3
D1
C2
B2
K3
K2
K1
J4
N9
N6
M10
L9
L2
K10
J10
H9
H1
G9
F10
E9
D10
C9
B10
B5
B1
A9
M5
A5
L4
L3
J6
H6
H5
H4
G7
G6
G5
G4
G3
F7
F6
F5
F4
F3
F1
E8
E7
E5
E4
E3
D6
D4
A2
M9
L10
K9
J9
H10
F9
E10
D9
C10
B9
N8
L1
G10
G1
C1
A8
N10
N1
A10
A1
NC1
NC26
NC28
NC29
VDD1VDD2VDD3VDD5VDD4VDD6
VDDQ1VDDQ6VDDQ5VDDQ4VDDQ10VDDQ9VDDQ2VDDQ8VDDQ7VDDQ3
NC27NC20NC21NC9NC19NC8NC11NC12NC17NC18NC7NC16NC25NC6NC10NC5NC13NC14NC4NC2NC24NC22NC23NC15NC3
VCC1VCC2
VSS1VSS4VSS8VSSQ5VSSQ4VSSQ9VSSQ8VSSQ3VSS2VSS3VSSQ10VSSQ1VSSQ2VSS5VSSQ6VSSQ7VSS6VSS7
A0A1A2A3A4A5A6A7A8A9
A10A11A12BA0BA1
DQ0DQ1DQ2DQ3DQ4DQ5DQ6DQ7DQ8DQ9
DQ10DQ11DQ12DQ13DQ14DQ15
/CKCK
CKE/CS
/RAS/CAS/WEDUDQMLDQMUDQSLDQS
IO0IO1IO2IO3IO4IO5IO6IO7IO8IO9
IO10IO11IO12IO13IO14IO15
/CE/RE/WECLEALE/WPR/B
TP304
0.1u
C308
TP303
TP306
TP302
VDD_MDM_MSME
VDD_MDM_MSME
TP305
C303 0.1u
2.2uC301
R305
51K
R307
10K
VBUS_OUT
100K
R30
1
Q301
43
52
61 S1 D1
G1 G2
D2 S2
TP301
MDM_USB_VBUS
DAP3_PCM_SCLK
SPI1_IPC_MOSI
SPI1_IPC_MISO
SPI1_IPC_SCK
UART1_IPC_CTS_NUART1_IPC_RTS_N
UART1_IPC_TXDUART1_IPC_RXD
DAP3_PCM_FS
DAP3_PCM_DOUT
MDM_RESET_FLAG
DAP3_PCM_DIN
IPC
_SR
DY2
IPC
_MR
DY2
TEST_GPIO1
TEST_GPIO2
SPI2_IPC_SCK
SPI2_IPC_CS_N
SPI2_IPC_MISO
SPI2_IPC_MOSI
SPI1_IPC_CS_N
IPC_SRDY1IPC_MRDY1
GSM_TXON_IND
USB_DN_MDM
UART_RX_MDM
UART_TX_MDM
I2C_FUEL_SDA
I2C_FUEL_SCL
USB_DP_MDM
PA_R0
PWR_DET_IN
GPS_LNA_EN
GPS_INPGPS_INM
PS_HOLD
TCXO_EN
PMIC_SSBI
PMIC_MDM_IRQ/
MDM_TCXOMDM_SLEEP_CLK
EBI2_OE/
EBI2_OE/
EBI2_WE/
EBI2_WE/
EBI2_UB/
EBI2_UB/
EBI2_LB/
EBI2_LB/
EBI1_A[0]
EBI1_A[0]
EBI1_A[1]
EBI1_A[1]
EBI1_A[2]
EBI1_A[2]
EBI1_A[3]
EBI1_A[3]
EBI1_A[4]
EBI1_A[4]
EBI1_A[5]
EBI1_A[5]
EBI1_A[6]
EBI1_A[6]
EBI1_A[7]
EBI1_A[7]
EBI1_A[8]
EBI1_A[8] EBI1_A[9]
EBI1_A[9]
EBI1_A[10]
EBI1_A[10]
EBI1_A[11]
EBI1_A[11]
EBI1_A[12]
EBI1_A[12]
EBI1_D[0]
EBI1_D[0]
EBI1_D[1]
EBI1_D[1]
EBI1_D[2]
EBI1_D[2]
EBI1_D[3]
EBI1_D[3]
EBI1_D[4]
EBI1_D[4]
EBI1_D[5]
EBI1_D[5]
EBI1_D[6]
EBI1_D[6]
EBI1_D[7]
EBI1_D[7]
EBI1_D[8]
EBI1_D[8]
EBI1_D[9]
EBI1_D[9]
EBI1_D[10]
EBI1_D[10]
EBI1_D[11]
EBI1_D[11]
EBI1_D[12]
EBI1_D[12]
EBI1_D[13]
EBI1_D[13]
EBI1_D[14]
EBI1_D[14]
EBI1_D[15]
EBI1_D[15]
EBI1_WE/
EBI1_WE/
EBI1_RAS/
EBI1_RAS/
EBI1_DQM[0]
EBI1_DQM[0]
EBI1_DQM[1]
EBI1_DQM[1]
EBI2_A_D[0]
EBI2_A_D[0]
EBI1_MCLK
EBI1_MCLK
EBI1_MCLK/
EBI1_MCLK/
EBI1_CLK_EN
EBI1_CLK_EN
EBI2_BUSY/
EBI2_BUSY/
EBI2_CS1/
EBI2_CS1/
EBI1_BANK_A[1]EBI1_BANK_A[1]
EBI1_BANK_A[0]
EBI1_BANK_A[0]
EBI2_A_D[1]
EBI2_A_D[1]
EBI2_A_D[2]
EBI2_A_D[2]
EBI2_A_D[3]
EBI2_A_D[3]
EBI2_A_D[4]
EBI2_A_D[4]
EBI2_A_D[5]
EBI2_A_D[5]
EBI2_A_D[6]
EBI2_A_D[6]
EBI2_A_D[7]
EBI2_A_D[7]
EBI2_A_D[8]
EBI2_A_D[8]
EBI2_A_D[9]
EBI2_A_D[9]
EBI2_A_D[10]
EBI2_A_D[10]
EBI2_A_D[11]
EBI2_A_D[11]
EBI2_A_D[12]
EBI2_A_D[12]
EBI2_A_D[13]
EBI2_A_D[13]
EBI2_A_D[14]
EBI2_A_D[14]
EBI2_A_D[15]
EBI2_A_D[15]
MDM_TCK
MDM_TCK
MDM_RTCK
MDM_RTCK
MDM_TDO
MDM_TDO
MDM_TDI
MDM_TDI
MDM_TMS
MDM_TMS
MDM_TRST/
MDM_TRST/
EBI1_DQS[0]
EBI1_DQS[0]
EBI1_DQS[1]
EBI1_DQS[1]
EBI1_CAS/
EBI1_CAS/
EBI2_WP/
EBI2_WP/
MODE1
MODE1
MDM_RESET_N
MDM_RESET_N
JTAG_PS_HOLD
MDM_RF_TCXO
EBI1_CS0_NEBI1_CS0_N
PON_RESET_N
USIM_MDM_RST_N
USIM_MDM_DATA
USIM_MDM_CLK
GSM_TX
DCS_PCS_TX
RX_G_1800_1900_MRX_G_900_P
ANT_SEL0
ANT_SEL1
ANT_SEL2
PA_R1
ANT_SEL3
RX_G_900_M
RX_G_1800_1900_P
DRX_U_AWS_INM
DRX_U_AWS_INP
PA_ON_U2100
PRX_U_2100_INMPRX_U_2100_INP
PRX_UCG_850_P
U_AWS_TX
PA_ON_AWS
PRX_UCG_850_M
TX_U_2100
MDM_USB_VBUS_EN
DIV_LNA_EN
PRX_U_AWS_INPPRX_U_AWS_INM
ON BOARD JTAG(CP)
JTAG MODE Selection
(1%)
MEMORY
ARM11 NO
JTAG ETMMODE[2:0]
010
000
ARM11 YES
USAGE
ETM
Native mode
(Active high connected to default pull down GPIO of AP20H)
- 172 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
0.1u
C41
0
L409 4.7n
L405 47n
47u
C448
C44
4D
NI
C44
5D
NI
C419 4.7u
C418 220n
C447
220p
FB401 33
C405
47u
U302
V26
U26
U23
U22
U21
U19
U18
T28
T26
T23
T22
T21
T18
R25
R23
R22
P19
N28
N26
N25
N19
M28
M26
M22
L26
L23
L22
L20
L19
K29
K28
K26
K20
J26
J25
J23
J22
H26
H25
H23
H21
G28
G25
G22
G21
G19
F25
E25
E21
E19
D28
D26
D25
D22
D20
C28
B29
B28
B25
B22
B19
A29
A28
A21
W29
W28
Y15
Y13
Y11
Y9
Y2
W21
W5
U16
U12
U7
U2
P15
M29
G17
E15
E14
A9
Y22
Y21
P23
P22
N23
N22
L25
K23
H14
H13
D19
V25
T20
L28
K25
K22
E24
E23
U20
T25
T19
R28
R26
P28
P26
P25
M25
M23
M20
L29
K19
H22
H20
G26
G23
G20
F26
E26
E22
D24
D23
D21
B21
B20
W26
W25
M19
H19
K14
B7
P20
A8
E13
D7
W20
W15
W11
R8
H18
B8
AB6
AB3
AB25
A15
Y1
U1
R1
M1
J1
F1
D1
H7
G9
Y5
W9
W13
U5
T7
T16
T12
P12
P11
P10
N11
N10
M7
M4
M12
M11
M10
L11
L10
K12
K11
J4
G8
E4
D12
B16
AB15
A11
A5
W23
Y23
U17
H17
H16
W22
E17
T8
R7
R2
P18
P17
P16
P14
P13
N18
N17
N16
N15
N14
N13
N12
M18
M17
M16
M15
M14
M13
M5
M2
L18
L17
L16
L15
L14
L13
L12
K18
K17
K16
K15
K13
J5
J2
H8
G15
G10
G7
F2
E11
E5
D8
D2
B15
B11
B3
B2
B1
AC6
AC2
AC1
AC29
AC28
AC25
AB29
AB28
AB2
AB1
A6
A2
A1
GND_DIG14
GND_DIG15
GND_DIG16
GND_DIG17
GND_DIG18
GND_DIG19
GND_DIG20
GND_DIG21
GND_DIG22
GND_DIG23
GND_DIG24
GND_DIG25
GND_DIG26
GND_DIG27
GND_DIG28
GND_DIG29
GND_DIG30
GND_DIG31
GND_DIG32
GND_DIG33
GND_DIG34
GND_DIG35
GND_DIG36
GND_DIG37
GND_DIG38
GND_DIG39
GND_DIG40
GND_DIG41
GND_DIG42
GND_DIG43
GND_DIG44
GND_DIG45
GND_DIG46
GND_DIG47
GND_DIG48
GND_DIG49
GND_DIG50
GND_DIG51
GND_DIG52
GND_DIG53
GND_DIG54
GND_DIG55
GND_DIG56
GND_DIG57
GND_DIG58
GND_DIG59
GND_DIG60
GND_DIG61
GND_DIG62
GND_DIG63
GND_DIG64
GND_DIG65
GND_DIG66
GND_DIG67
GND_DIG68
GND_DIG69
GND_DIG70
GND_DIG71
GND_DIG72
GND_DIG73
GND_DIG74
GND_DIG75
GND_DIG76
GND_DIG77
VDD_A0VDD_A1VDD_A2_1VDD_A2_2VDD_A2_3VDD_A2_4VDD_A2_5VDD_CORE1VDD_CORE2VDD_CORE3VDD_CORE4VDD_CORE5VDD_CORE6VDD_CORE7VDD_CORE8VDD_CORE9VDD_CORE10VDD_CORE11VDD_CORE12VDD_CORE13VDD_CORE14VDD_CORE15VDD_CORE16VDD_CORE17VDD_CORE18VDD_CORE19VDD_CORE20VDD_CORE21VDD_CORE22VDD_CORE23VDD_CORE24VDD_CORE25VDD_CORE26VDD_CORE27VDD_CORE28VDD_CORE29VDD_MPLLVDD_MDDIVDD_P1_1VDD_P1_2VDD_P1_3VDD_P1_4VDD_P1_5VDD_P1_6VDD_P1_7VDD_P2_1VDD_P2_2VDD_P2_3VDD_P2_4VDD_P2_5VDD_P2_6VDD_P2_7VDD_P2_8VDD_P2_9VDD_P2_10VDD_P3VDD_P4VDD_P5_1VDD_P5_2VDD_P6VDD_QFUSEVDD_RF_DIG_1VDD_RF_DIG_2GND_RF_1
GND_RF_2VDD_RF1_1VDD_RF1_2VDD_RF1_3VDD_RF1_4VDD_RF1_5VDD_RF1_6VDD_RF1_7VDD_RF1_8VDD_RF1_9
VDD_RF1_10VDD_RF1_11VDD_RF1_12VDD_RF1_13VDD_RF1_14VDD_RF1_15VDD_RF1_16VDD_RF1_17VDD_RF1_18VDD_RF1_19VDD_RF1_20VDD_RF1_21VDD_RF1_22VDD_RF1_23VDD_RF1_24VDD_RF1_25VDD_RF1_26VDD_RF2_1VDD_RF2_2VDD_RF2_3VDD_RF2_4VDD_RF2_5VDD_RF2_6VDD_RF2_7
DNC1DNC2DNC3DNC4DNC5DNC6DNC7DNC8DNC9
DNC10DNC11RSVD1RSVD2RSVD3RSVD4RSVD5RSVD6
GND_DIG1GND_DIG2GND_DIG3GND_DIG4GND_DIG5GND_DIG6GND_DIG7GND_DIG8GND_DIG9
GND_DIG10GND_DIG11GND_DIG12GND_DIG13
GND_RF1
GND_RF2
GND_RF3
GND_RF4
GND_RF5
GND_RF6
GND_RF7
GND_RF8
GND_RF9
GND_RF10
GND_RF11
GND_RF12
GND_RF13
GND_RF14
GND_RF15
GND_RF16
GND_RF17
GND_RF18
GND_RF19
GND_RF20
GND_RF21
GND_RF22
GND_RF23
GND_RF24
GND_RF25
GND_RF26
GND_RF27
GND_RF28
GND_RF29
GND_RF30
GND_RF31
GND_RF32
GND_RF33
GND_RF34
GND_RF35
GND_RF36
GND_RF37
GND_RF38
GND_RF39
GND_RF40
GND_RF41
GND_RF42
GND_RF43
GND_RF44
GND_RF45
GND_RF46
GND_RF47
GND_RF48
GND_RF49
GND_RF50
GND_RF51
GND_RF52
GND_RF53
GND_RF54
GND_RF55
GND_RF56
GND_RF57
GND_RF58
GND_RF59
GND_RF60
GND_RF61
GND_RF62
GND_RF63
GND_RF64
+1.3V_MDM_RF1+1.8V_MDM_P5
+1.8V_MDM_P5
C43
010
0p
C43
210
0p
+2.05V_MDM_A2
C44
00.
1u
+2.05V_MDM_A2
C44
10.
1u
VDD_MDM_MSMC
C44
20.
1u
C416 47n
C406 47n
C43
70.
1u
VDD_MDM_MPLL
C43
80.
1u
VDD_MDM_MSME
C43
90.
1u
C43
60.
1u
C43
30.
1u
C43
50.
1u
C42
30.
1u
C42
40.
1u
VDD_MDM_SDCC1
C41
20.
1u
+1.2V_MDM_P4
C41
30.
1u
+3.0V_MDM_USB
C41
10.
1u
VDD_MDM_MSME
1uC401
+2.2V_MDM_RF2
C425 220p
C43
110
0p 2.2u
C42
8
2.2u
C42
9
+1.3V_MDM_RF1
1uC
404
1uC
403
C408 220p
C446
1.5n
68nL401
C426 0.1u
L404 4.7n
C417 220p
L408 4.7n
1uC
402
C420 220p
L406 4.7n
C427 220p
4.7nL407
C407 22n
C409 47n
L402 4.7n
1uC4221uC421
L403
10n
C41
50.
1u
R40
20
C41
40.
1u
C43
40.
1u
C44
30.
1u
As close as possible to MDM
As close as possible to MDM
As close as possible to MDM
- 173 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
22u
C55
0
TP501
C530
10p
R523 100K
C502 0.1u
C506 0.1u
C551
22p
R524 100K
R503
68K
C507 0.1u
C508 0.1u
C509 0.1u
2.85V_SIM
VCC_BBAT
C531
10p
+2.8V_LNA
R521
10K
R525 470
C548
4.7u
C54
922
u
TP513
FC-135_32.768KA-AC3X502
32.768KHz21
V_BAT_CP
10K
R522Q502
D
G
S
U501
T7
T5
T2
B7
J10
G10
K1
A8
T11
A5
D1
G1
C10
D11
P11
G11
L11
H2
M10
N8
P10
R11
H11
H10
B1
C1
K2
J2
F1
B8
H1
D2
J1
E1
B5
B10
A3
R10
A4
E2
G2
E10
C11
L10
N11
F10
F11
K10
K11
M7
N6
M8
D10
N7
R9
N5
M6
N4
M5
M4
L4
J4
K4
H4
H8
A9
D8
A11
A10
B9
E8
L8
J8
E4
R2
E5
N1
D5
G4
D6
E7
D7
T9
T10
T4
T3
R7
R8
R6
R5
F8
R1
G8
A7
A6
F4
B6
D4
C2
B2
B4
B3
A1
A2
E6
F2
R3
T1
R4
P2
P1
M2
M1
N2
L2
L1
K6
G6
G5
J5
T8
T6
N10
B11
M11
E11
J11
K8
K7
J7
J6
H7
H6
H5
G7
K5
GND_0
GND_1
GND_2
GND_3
GND_4
GND_5
GND_6
GND_7
GND_8
GND_S1
GND_S2
GND_S3
GND_S4
GND_NCP
GND_SPKR_L
GND_SPKR_R
GND_XO
GND_XOADC
GND_XOBUF
REF_GND
OVP_CLAMPOVP_SNSOVP_CTL
VCHG_0VCHG_1
VPH_PWR_0VPH_PWR_1
BAT_FET_NVREF_THERMVBATVCOIN
XOADC_REF
XTAL_19M_INXTAL_19M_OUT
XO_OUT_A0_ENXO_OUT_A0XO_OUT_A1_ENXO_OUT_A1XO_OUT_D0XO_OUT_D1_EN/PA_ONXO_OUT_D1
XTAL_32K_INXTAL_32K_OUT
SLEEP_CLK0
LED_ATC
VIB_DRV_N
SPKR_IN_LMSPKR_IN_LPSPKR_IN_RMSPKR_IN_RPSPKR_OUT_LMSPKR_OUT_LPSPKR_OUT_RMSPKR_OUT_RP
HSED_BIAS0HSED_BIAS1HSED_BIAS2
NFC_EXT_EN
RESIN_NKPD_PWR_NOPT_1PS_HOLDPON_RESET_N
SSBIPM_INT_N
PA_ON1PA_ON2PA_ON3PA_ON4PA_ON5
VOUT_PA_CTL
GPIO_01/SLEEP_CLK1GPIO_02/MP3_CLK
GPIO_03/EXT_SMPS_ENGPIO_04/PWM_OUT
MPP_01/UIM_M_DATAMPP_02/UIM_DATAMPP_03/UIM_M_CLK
MPP_04/UIM_CLKMPP_05/UIM_M_RST
MPP_06/UIM_RSTMPP_07/BATT_THERM
MPP_08/VREF_OUT/CHG2_DET/BATT_IDMPP_09/XO_THERMMPP_10/PA_THERMMPP_11/CBLPWR0_NMPP_12/CBLPWR1_N
VSW_S1VREG_S1VSW_S2
VREG_S2VSW_S3
VREG_S3VSW_S4
VREG_S4
VREG_L1VREG_L2VREG_L3VREG_L4VREG_L5VREG_L6VREG_L7VREG_L8VREG_L9VREG_L10VREG_L11VREG_L12VREG_L13VREG_L14VREG_L15VREG_L16VREG_L17VREG_L18VREG_L19
NCP_CTC1NCP_CTC2
NCP_FBVREG_NCP
REF_BYP
VDD_S1
VDD_S2
VDD_S3
VDD_S4
VDD_SMPS
VDD_L1_L11_L13
VDD_L2_L8_L10_L16_L17
VDD_L3_L5_L7
VDD_L4_NCP
VDD_L6_L12
VDD_L9_L14_L15
VDD_L18
VDD_L19
VDD_MSM_IO
VDD_SPKR_DRV
VDD_SPKR_L
VDD_SPKR_R
C514 1u
C516 10u
C517 10u
C518 10u
+2.2V_XOADC_REF
C519 100p
X501 DSX321G-19.2M
19.2MHz
21
34
VDD_MDM_MSME
DNIR504
+2.2V_XOADC_REF
C543
4.7u 4.7u
C544
TP512
R515
51K
C532 DNI
TP511
2.2u
C546
L501 4.7u
C54
50.
1u
+2.05V_MDM_A2
DNIC533
C537
4.7u
1n
C521
+2.2V_XOADC_REF
0.1u
C520
PT50
1
100K
100p
C52
8
VDD_RF_SW
C541
4.7u4.7u
C540
+3.0V_MDM_USB
2.2u
C542
+1.2V_MDM_P4
C538
4.7u
C535
2.2u 2.2u
C536
VDD_MDM_MPLL
C534
4.7u
VDD_MDM_SDCC1
C539
4.7u
+1.8V_MDM_P5
V_BAT_CP
C515 10u
C501 2.2u
V_BAT_CP
0.1uC503
C505 0.1u
C510 10u
C511 10u
C512 10u
0.1u
C50
4
V_BAT_CP
VD
D_M
DM
_MS
ME
VD
D_M
DM
_MS
ME
C52
322
u
100p
C52
6
VDD_MDM_MSMC
+1.3V_MDM_RF1L502 4.7u
L503 4.7uVDD_MDM_MSME
4.7uL504+2.2V_MDM_RF2
C52
410
0p
C52
210
0p 22u
C52
7
V_BAT_CP
Q501
D
G
S
+2.2V_XOADC_REF
33n
C54
7
R52
0
150K
R519
51K
PT50268K
TP510
R501
DNI
VDD_MDM_MSME
D501
D502
R514 10K
22u
C52
9
C52
522
u
TP502
TP503
C513 10u
120FB501
V_BAT_CPV_POWERRAIL
R516 200K
MDM_RESET_1.8VMDM_PWRON_1.8V
PS_HOLD
TCXO_EN
PMIC_SSBIPMIC_MDM_IRQ/
MDM_TCXO
MDM_SLEEP_CLK
JTAG_PS_HOLD
MDM_RF_TCXO
PCB_THM_ADC
PCB_THM_ADC
HARDWARE_RESET_N
HARDWARE_RESET_N
MDM_PWRON_N
MDM_PWRON_N
PON_RESET_N
USIM_MDM_RST_N
USIM_MDM_DATA
USIM_MDM_CLK
SIM_RST
SIM_IO
SIM_CLK
GSM_PA_HB_ENGSM_PA_LB_EN
MODEM POWER ON
+2.6V,50mA
S1&S2 sense point near MDM node
+2.8V,50mA
MODEM RESET (For LOCK-UP)
S3 sense point near branch of MDM and DDR
[ Temp Check ]
As close as possible to 19.2MHz crystal.
- 174 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
VCC_TOUCH_1V8
R658 10
R659 10
100K
R60
4
VCC_IO_1V8
R65
510
K
VCC_IO_1V8
R63
610
K
TP609
4.7K
R629R628
4.7K
U601
H12
H14
C15
E15
J13
C13
E13
G15
D14
F14
J15
AH24
AJ21
AC19
AH20
AF20
AJ23
AG25
AG19
AD20
AG23
AF24
AD22
AL23
AB20
AL21
AE21
AG21
AF22
AE23
AJ25
AJ19
AL27
V28
U29
Y28
W29
W23
V26
N27
R29
P26
Y30
L25
N23
U27
M26
W27
L27
L29
U23
V24
M24
V22
J29
M28
N29
R27
J27
K26
U25
P24
P28
T26
T24
R25
R23
AA25
AH30
AA29
AC25
AG31
AA23
AB26
AH26
AJ27
AC29
AA27
AD28
AK28
AF28
Y26
Y24
Y22
AC27
AB24
AC31
AE29
AE27
AG29
AB18
AJ5
AG11
AH6
AD16
AL5
AB14
AC11
AJ7
AG7
AG13
AE17
AC15
AA15
AF10
AD10
AJ13
AH12
AJ9
AF16
AJ11
AD18
AH14
AF18
AL9
AG15
AK4
AF14
AG9
AB12
AJ15
AF12
AJ17
AE15
AE11
AD12
AC13
AH8
AC17
AG17
AA13
AH18
AD14
AL17
AE9
Y10
W9
AA5
Y6
AB8
AB6
AD4
AE3
Y8
AA7
AE5
AF4
AG3
AH2
AC7
AD6
AC5
AC3
T6
U5
R7
R9
V8
V10
V4
W3
AA3
T8
U9
W11
U7
V6
N5
M6
M4
U3
R5
R3
Y4
P6
P8
W5
P4
N3
P10
E17
H16
F16
C17
G21
J21
A21
C23
C21
F20
J19
F22
L21
K20
D18
F18
E19
C19
H18
G17
E21
K18
A23
D20
J17
H20
D30
E29
L23
F28
G27
H26
F24
F26
E27
E25
B28
K24
J23
E23
D24
H24
A27
G23
C25
D26
C27
J25
H22
M8
J9
F10
L11
M10
L9
L3
E7
K8
H10
H8
K6
J11
F8
G11
E9
G9
E11
F6
J1
J5
G5
E3
D6
A9
C11
D12
J3
H4
G3
D2
C5
C7
C9
A11
L7
D8
F12
L5
H6
J7
B4
N9
E5
F4
GMI_IORDY
GMI_WAIT
GMI_ADV_N
GMI_CLK
GMI_CS0_N
GMI_CS1_N
GMI_CS2_N
GMI_CS3_N
GMI_CS4_N
GMI_CS5_N
GMI_AD0
GMI_AD1
GMI_AD2
GMI_AD3
GMI_AD4
GMI_AD5
GMI_AD6
GMI_AD7
GMI_AD8
GMI_AD9
GMI_AD10
GMI_AD11
GMI_AD12
GMI_AD13
GMI_AD14
GMI_AD15
GMI_AD16
GMI_AD17
GMI_AD18
GMI_AD19
GMI_AD20
GMI_AD21
GMI_AD22
GMI_AD23
GMI_AD24
GMI_AD25
GMI_AD26
GMI_AD27
GMI_WR_N
GMI_OE_N
GMI_RST_N
GEN2_I2C_SCL
GEN2_I2C_SDA
GMI_DPD
GMI_WP_N
UART2_TXD
UART2_RXD
UART2_RTS_N
UART2_CTS_N
UART3_TXD
UART3_RXD
UART3_RTS_N
UART3_CTS_N
GPIO_PU0
GPIO_PU1
GPIO_PU2
GPIO_PU3
GPIO_PU4
GPIO_PU5
GPIO_PU6
GEN1_I2C_SDA
GEN1_I2C_SCL
DAP4_FS
DAP4_DIN
DAP4_DOUT
DAP4_SCLK
XTAL_IN
XTAL_OUT
ULPI_DATA0ULPI_DATA1ULPI_DATA2ULPI_DATA3ULPI_DATA4ULPI_DATA5ULPI_DATA6ULPI_DATA7ULPI_CLKULPI_DIRULPI_NXTULPI_STPDAP3_FSDAP3_DINDAP3_DOUTDAP3_SCLKSDIO1_CLKSDIO1_CMDSDIO1_DAT0SDIO1_DAT1SDIO1_DAT2SDIO1_DAT3GPIO_PV0GPIO_PV1GPIO_PV2GPIO_PV3
USB1_VBUSUSB1_DNUSB1_DPUSB1_IDUSB3_DNUSB3_DPUSB_REXT
HSIC_DATAHSIC_STROBEHSIC_REXT
IC_DPIC_DNIC_REXT
VDAC_RVDAC_GVDAC_BVDAC_RSETVDAC_VREF
HDMI_RSETHDMI_TXD0PHDMI_TXD0NHDMI_TXD1PHDMI_TXD1NHDMI_TXD2PHDMI_TXD2NHDMI_TXCPHDMI_TXCN
DSI_CSI_RDNDSI_CSI_RUPCSI_CLKAPCSI_CLKANCSI_CLKBPCSI_CLKBNCSI_D1APCSI_D1ANCSI_D2APCSI_D2ANCSI_D1BPCSI_D1BNDSI_CLKANDSI_CLKAPDSI_D1ANDSI_D1APDSI_D2ANDSI_D2AP
LCD_PWR0LCD_PWR1LCD_PWR2LCD_SDIN
LCD_SDOUTLCD_CS0_N
LCD_DC0LCD_SCK
LCD_CS1_NLCD_DC1
LCD_WR_NLCD_M1LCD_DE
LCD_PCLKLCD_HSYNCLCD_VSYNC
LCD_D0LCD_D1LCD_D2LCD_D3LCD_D4LCD_D5LCD_D6LCD_D7LCD_D8LCD_D9
LCD_D10LCD_D11LCD_D12LCD_D13LCD_D14LCD_D15LCD_D16LCD_D17LCD_D18LCD_D19LCD_D20LCD_D21LCD_D22LCD_D23
HDMI_INT_NDDC_SCLDDC_SDA
CRT_HSYNCCRT_VSYNC
VI_PCLKVI_MCLKVI_D0VI_D1VI_D2VI_D3VI_D4VI_D5VI_D6VI_D7VI_D8VI_D9VI_D10VI_D11
VI_VSYNCVI_HSYNC
CAM_I2C_SCLCAM_I2C_SDA
VI_GP0VI_GP3VI_GP4VI_GP5VI_GP6
KB_ROW0
KB_ROW1
KB_ROW2
KB_ROW3
KB_ROW4
KB_ROW5
KB_ROW6
KB_ROW7
KB_ROW8
KB_ROW9
KB_ROW10
KB_COL0
KB_COL1
KB_COL2
KB_COL3
KB_COL4
KB_COL5
CLK_32K_OUT
SYS_CLK_REQ
CORE_PWR_REQ
CPU_PWR_REQ
PWR_INT_N
OWR
CLK_32K_IN
TEST_MODE_EN
SYS_RESET_N
PWR_I2C_SCL
PWR_I2C_SDA
JTAG_RTCK
JTAG_TRST_N
JTAG_TDO
JTAG_TMS
JTAG_TCK
JTAG_TDI
DAP1_FS
DAP1_DIN
DAP1_DOUT
DAP1_SCLK
DAP_MCLK1
SPDIF_OUT
SPDIF_IN
DAP_MCLK2
DAP2_FS
DAP2_SCLK
DAP2_DIN
DAP2_DOUT
SPI2_MOSI
SPI2_MISO
SPI2_SCK
SPI2_CS0_N
SPI1_MOSI
SPI1_SCK
SPI1_CS0_N
SPI1_MISO
SPI2_CS1_N
SPI2_CS2_N
SDIO3_CLK
SDIO3_CMD
SDIO3_DAT0
SDIO3_DAT1
SDIO3_DAT2
SDIO3_DAT3
SDIO3_DAT4
SDIO3_DAT5
SDIO3_DAT6
SDIO3_DAT7
GPIO_PV6
1.8K
R624
2.2K
R60
5
100K
R60
7
2.2K
R60
6
100KR644
R63
910
0K
R64
010
0K
100K
R64
1
R64
210
0K
R63
710
K
10K
R63
8
4.7K
R65
4
R649
4.7K
CN601
65
74
83
92
101
47K
R61
5
C603 DNI
C604 DNI
47K
R61
6
R61
747
K
47K
R61
8
R64
6 DNI
R65
110
0K
R61
947
K
VCC_VGA_HDMI_5V0
453
R627
TP606
TP608
TP605
TP607
12MHzDSX321G(12MHz,8PF)
X601
21
34
1K
R622
VCC_IO_1V8
VCC_IO_1V8
C6017p
C6027p
100K
R602
VCC_IO_1V8
R63
210
K
100KR634
R63
110
K
VCC_IO_1V8
R621
4.7K
R656
DNI
R657
DNI
R63
5D
NI
V_CHG
UAT601
12
11
10
9
8
7
6
5
4
3
2
1GND
RX
TX
NC1
ON_SW
VBAT
NC2
NC3
NC4
DSR
RTS
CTS
GND
RX
TX
VCHAR
ON_SW
VBAT
PWR
URXD
UTXD
3G2.5G
V_POWERRAIL
R65
34.
7K
VCC_IO_1V8
VCC_IO_1V8
USB_OUT_5V
4.7K
R650
VCC_IO_1V8
2M
R643
1KR625
VCC_MIPI_1V2
R626
49.9
VCC_VI_1V8
1.8K
R623
U602
43
52
61B VCC
A NC
GND Y
R645100K
R64
710
VA601
R60
310
0K
MDM_RESET_1.8VMDM_PWRON_1.8V
USB_AP20_DNUSB_AP20_DP
DAP3_PCM_SCLK
BT_
PCM
_DIN
BT_
PCM
_SYN
C
BT_
PCM
_DO
UT
BT_
PCM
_CLK
WLAN_EN
MIC
RO
SD_C
MD
MIC
RO
SD_C
LK
BT_
UA
RT_
CTS
_NB
T_U
AR
T_R
TS_N
BT_
UA
RT_
RXD
BT_
UA
RT_
TXD
CLK
32K
WLA
N_H
OST
_WA
KEU
P
PWR_ON_SW
MM
C_C
MD
MM
C_D
AT1
MM
C_D
AT2
MM
C_D
AT3
AP2
0_U
AR
T_SW
TOU
CH
_MA
KER
_ID
TOU
CH
_IN
T
GYR
O_I
NT_
N
MO
TIO
N_I
NT
VT_DATA[0]VT_DATA[1]
VT_DATA[4]VT_DATA[5]
VT_CAM_PWDN
VT_HSYNCVT_VSYNC
VT_RESET_N
PWR
_I2C
_SC
LPW
R_I
2C_S
DA
MM
C_C
LK
MIC
RO
SD_D
ET_N
MIC
RO
SD_D
AT1
MIC
RO
SD_D
AT2
MIC
RO
SD_D
AT3
AU
DIO
_MC
LKD
AP1
_SC
LK
DA
P1_F
S
DA
P1_D
OU
TD
AP1
_DIN
DA
P2_S
CLK
DA
P2_F
S
AU
DIO
_IN
T_N
GEN
2_I2
C_S
CL
GEN
2_I2
C_S
DA
8M_MIPI_DATA0_N8M_MIPI_DATA0_P
8M_MIPI_DATA1_P8M_MIPI_DATA1_N
CAM_I2C_SDACAM_I2C_SCL
CAM_MCLK
PWR
_IN
T_N
WLAN_SDIO[0]
MIC
RO
SD_D
AT0
WLAN_SDIO[2]WLAN_SDIO[1]
WLAN_CMDWLAN_CLK
INT_
N_M
UIC
SPI1_IPC_MOSISPI1_IPC_MISO
SPI1_IPC_SCK
LCD_RESET_N
8M_MIPI_CLK_P
8M_RESET_N
BL_
DC
DC
_RST
_N
UART1_IPC_CTS_NUART1_IPC_RTS_N
UART1_IPC_TXDUART1_IPC_RXD
8M_MIPI_CLK_N
UART2_RX_AP20
UA
RT2
_RX_
AP2
0
UART2_TX_AP20
UA
RT2
_TX_
AP2
0
JTAG_TDO_AP20
JTA
G_T
DO
_AP2
0
JTA
G_T
DI_
AP2
0
JTAG_TDI_AP20
JTA
G_T
MS_
AP2
0
JTAG_TMS_AP20
JTA
G_T
CK
_AP2
0
JTAG_TCK_AP20
JTA
G_R
TCK
_AP2
0
JTAG_RTCK_AP20
MM
C_D
AT4
MM
C_D
AT5
MM
C_D
AT6
MM
C_D
AT7
GEN
1_I2
C_S
DA
GEN
1_I2
C_S
CL
SYS_RESET_N_AP20
SYS_
RES
ET_N
_AP2
0
CA
M_S
UB
PM_E
N
CO
M_I
NT
PRO
XI_O
UT
FLASH_LED_EN
FLASH_LED_INHFLASH_LED_TORCH
CH
G_E
N_S
ET_N
_AP2
0C
HG
_STA
TUS_
N_A
P20
GMI_ADV_N
GMI_ADV_N
HDMI_TXD0N
DDC_SCLDDC_SDA
HD
MI_
REG
_EN
THER
MA
L_IR
Q
DAP3_PCM_FSDAP3_PCM_DOUT
DA
P2_D
OU
T
WLAN_SDIO[3]
HDMI_TXD2PHDMI_TXD2N
HDMI_TXD1PHDMI_TXD1N
HDMI_TXD0P
HDMI_TXCPHDMI_TXCN
AU
DIO
_MC
LK2
MDM_RESET_FLAG
DA
P2_D
IN
MD
M_U
AR
T_SW
BT_
WA
KEU
P
WLA
N_W
AK
EUP
BT_
HO
ST_W
AK
EUP
VT_DATA[2]VT_DATA[3]
VT_DATA[6]VT_DATA[7]
8M_CAM_VCM_EN
DAP3_PCM_DIN
GMI_OE_N
GM
I_O
E_N
VIBE_EN
VIB
E_PW
M
PMU
_32K
_CLK
LCD
_MA
KER
_ID
LCD_CS
VOL_KEY_UP
VOL_
KEY
_UP
MM
C_D
AT0
BA
TT_L
OW
_IN
T
AP_PWR_ON
EAR
JAC
K_S
ENSE
HALL_INT
BL_
DC
DC
_SD
AB
L_D
CD
C_S
CL
BT_EN
MU
IC_S
DA
MU
IC_S
CL
WM
_LD
O_E
N
IPC_SRDY2
IPC_MRDY2
TEST_GPIO1
TEST_GPIO2
SPI2_IPC_SCK
SPI2_IPC_CS_N
SPI2_IPC_MISO
SPI2_IPC_MOSI
SPI1_IPC_CS_N
IPC_SRDY1
IPC_MRDY1
CO
RE_
PWR
_EN
CPU_PWR_EN
LCD_D23
LCD_D21
LCD_D19
LCD_D17
LCD_D15
LCD_D13
LCD_D11
LCD_D9
LCD_D7
LCD_D5
LCD_D3
LCD_D1
LCD_D22
LCD_D20
LCD_D18
LCD_D16
LCD_D14
LCD_D12
LCD_D10
LCD_D8
LCD_D6
LCD_D4
LCD_D2
LCD_D0
DCX
WRXLCD_TE
UART_RX_MDMUART_TX_MDM
HO
OK
_DET
HDMI_INT_N
MD
M_U
SB_V
BU
S_EN
CHG_PGB_N
APTEMP_PWROFF_N
VOL_KEY_DOWN
VOL_
KEY
_DO
WN
VT_PCLK
Port
AP20 SIGNAL
8M & 2M cam
IPC
IPCUART1
SPI port usageSPI1
SPI2
Usage
SPI3
SPI4
UART4
UART2
UART3
Port
IPC
DAP port usageDAP1
DAP2
Usage
DAP3
DAP4
AP20
BT
BT
UART port usagePort Usage
WM8994
WM8994
GPIO_PJ4
FM
GPIO_PT4
GPIO_PD5
GPIO_PT2
GPIO
GPIO_
GPIO_
GPS
ON BOARD ARM11 JTAG INTERFACE
Maxim PMIC, Thermal Sensor
JTAG
Camera(8M,1.3M), CAM SubPMIC
TOUCH, LCD BL DCDC, MUIC
VDDIO_BB
GEN2_I2C
GEN1_I2C
Usage
PWR_I2C
LCD I/F
CAM_I2C
I2C port usage
IFX_I2C (IFX)FUEL gauge, GPS
VCC_IO_1V8
Motion, Gyro, Compass, Proximity, Wolfson, FUEL gauge
Port
AVDD_USB
VCC_USB_3V3
VDDIO_HSIC
AVDD_IC_USB
AVDD_VDAC
GPIO_PR7
VCC_HDMI_3V3
MICROSD
WLAN SDIO
AVDD_HDMI
AVDD_DSI_CSI Nominal 1.2V
VCC_MIPI_1V2
GPIO_PX5
VDDIO_NAND
VCC_IO_1V8
VDDIO_UART
VCC_IO_1V8 VCC_IO_1V8
MMC
AVDD_OSC
VDDIO_VI
SPI1
VCC_VI_1V8
VDDIO_LCD
MCSPI1
VCC_IO_1V8
VCC_SDIO_2V8
VDDIO_SDIO
VCC_IO_1V8
AUDIO_DAP1 AUDIO_DAP2
VDDIO_AUDIO
BT_DAP4
DAP3_IPC
VCC_IO_1V8
VDDIO_SYS
GPIO
UART1_IPC
UART3BT_UART
GPIO_PW3
GPIO_PR4
GPIO_PR5
GPIO_PR6
GPIO_PS0
GPIO_PS1
GPIO_PS2
GPIO_PQ3
GPIO_PQ4
GPIO_PQ5
GPIO_PZ5
GPIO_PU5
GPIO_PU4
GPIO_PU3
GPIO_PU2
GPIO_PU1
GPIO_PU0
Array TP
Usage(GMI_CLK : ARM_JTAG1 / GMI_AVD_N : ARM_JTAG0)ARM_JTAG[1:0]
ARM7 only JTAG
Coresight DAP only JTAG
2'b10
2'b01
2'b11
2'b00 SERIAL JTAG CHAIN CPU (ARM7) and COP (Coresight DAP)
Bypass ARM JTAG disabled
DAP5
USB_RECOVERYGMI_OE_N
0
Boot from secondary device
USB Recovery Mode
1
GPIO_PJ5
PMFM_PWM3
BOOT CONFIGURATION
90ohm matching !!
Filters & ESD for VDACs (Ref.14 page)
1% 453ohm
- 175 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
SC712
1
SC711
1
SC710
1
SC709
1
SC708
1
SC707
1
SC703
1
SC704
1
SC706
1
SC702
1
SC701
1
U702
1Fiducial1
R718 100K
VCC_IO_1V8
U601
U21
U19
U17
U15
U13
U11
T30
T28
T22
T10
T4
T2
R21
R19
R17
R15
R13
R11
N31
N25
N21
N19
N17
N15
N13
N11
N7
N1
L19
L13
K30
K28
K22
K16
K10
K4
K2
G31
G25
G19
G13
G7
G1
D28
D22
D16
D10
D4
C29
C3
B30
B22
B16
B10
B2
A31
A25
A19
A13
A7
A1
R1
R31
AG1
AC1
E31
J31
P22
H28
G29
Y16
AL15
H2
B8
AL29
AL11
AL3
AJ31
AJ1
V30
E1
B24
A15
AK24
AK8
AA1
C31
B14
A29
A5
M22
Y2
L1
M2
B20
P2
L31
P30
F30
P12
U1
V2
AD2
AK20
B26
U31
B12
F2
C1
B6
A3
AK14
AK12
M12
AK26
AK6
AF30
AF2
AD30
AA31
M30
H30
B18
A17
AK18
K12
K14
V12
T12
P18
P16
M18
M16
L17
L15
Y18
Y14
V20
V18
V16
V14
T20
T18
T16
T14
P20
P14
M20
M14
AL31
AL25
AL19
AL13
AL7
AL1
AK30
AK22
AK16
AK10
AK2
AJ29
AJ3
AH28
AH22
AH16
AH10
AH4
AG27
AG5
AF26
AF8
AF6
AE31
AE25
AE19
AE13
AE7
AE1
AD26
AD24
AD8
AC23
AC21
AC9
AB30
AB28
AB22
AB16
AB10
AB4
AB2
AA21
AA19
AA17
AA11
AA9
Y20
Y12
W31
W25
W21
W19
W17
W15
W13
W7
W1
GND62
GND63
GND64
GND65
GND66
GND67
GND68
GND69
GND70
GND71
GND72
GND73
GND74
GND75
GND76
GND77
GND78
GND79
GND80
GND81
GND82
GND83
GND84
GND85
GND86
GND87
GND88
GND89
GND90
GND91
GND92
GND93
GND94
GND95
GND96
GND97
GND98
GND99
GND100
GND101
GND102
GND103
GND104
GND105
GND106
GND107
GND108
GND109
GND110
GND111
GND112
GND113
GND114
GND115
GND116
GND117
GND118
GND119
VDD_CORE1VDD_CORE2VDD_CORE3VDD_CORE4VDD_CORE5VDD_CORE6VDD_CORE7VDD_CORE8VDD_CORE9VDD_CORE10VDD_CORE11VDD_CORE12VDD_CORE13VDD_CORE14
VDD_CPU1VDD_CPU2VDD_CPU3VDD_CPU4VDD_CPU5VDD_CPU6
VDD_RTC1VDD_RTC2
VPP_FUSEVPP_KFUSE
VDDIO_AUDIOVDDIO_BBVDDIO_DDR1VDDIO_DDR2VDDIO_DDR3VDDIO_DDR4VDDIO_DDR5VDDIO_DDR6VDDIO_DDR7VDDIO_DDR8VDDIO_DDR9
VDDIO_HSICVDDIO_LCD1VDDIO_LCD2VDDIO_NAND1VDDIO_NAND2VDDIO_NAND3VDDIO_NAND4VDDIO_SDIOVDDIO_SYS_DDR_1VDDIO_UARTVDDIO_VI
AVDD_DSI_CSIAVDD_HDMI
AVDD_HDMI_PLLAVDD_IC_USB
AVDD_OSCAVDD_PLLA_P_C
AVDD_PLLMAVDD_PLLUAVDD_PLLXAVDD_USB
AVDD_USB_PLLAVDD_VDAC
PLL_S_PLL_LF
VDD_DDR_1_1VDD_DDR_1_2VDD_DDR_1_3VDD_DDR_1_4VDD_DDR_1_5VDD_DDR_1_6VDD_DDR_1_7VDD_DDR_2_1VDD_DDR_2_2VDD_DDR_2_3VDD_DDR_2_4VDD_DDR_2_5VDD_DDR_2_6VDD_DDR_2_7VDD_DDR_2_8VDD_DDR_2_9
VDD_CORE_NAND1VDD_CORE_NAND2VDD_CORE_NAND3
VDD_CORE_SENSETHERMD_NTHERMD_P
VDD_DDR_RXDDR_COMP_PDDDR_COMP_PU
ZQVREF_CAVREF_DQ
DNC
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
GND10
GND11
GND12
GND13
GND14
GND15
GND16
GND17
GND18
GND19
GND20
GND21
GND22
GND23
GND24
GND25
GND26
GND27
GND28
GND29
GND30
GND31
GND32
GND33
GND34
GND35
GND36
GND37
GND38
GND39
GND40
GND41
GND42
GND43
GND44
GND45
GND46
GND47
GND48
GND49
GND50
GND51
GND52
GND53
GND54
GND55
GND56
GND57
GND58
GND59
GND60
GND61
R712
100
R713
100
0.1u
C71
3
VCC_HDMI_PLL_1V8
C76
80.
1u
VCC_VI_1V8
0.1u
C76
4
0.1u
C70
6
VCC_HDMI_3V3
4.7u
C74
3
VCC_APTEMP_3V3
C767
1n
R71
015
0
VCC_APTEMP_3V3
4.7u
C73
7
VCC_VI_1V8
VCC_MIPI_1V2
0.1u
C72
5
VCC_PLL_1V1
0.1u
C71
1
VCC_FUSE_3V3
C77
10.
1u
0.1u
C74
9
0.1u
C75
0
C75
10.
1u
VCC_DDRx_3V3
0.1u
C77
2
VCC_IO_1V8
0.1u
C71
6
VCC_PLL_1V1
0.1u
C71
2
C71
54.
7u
TP701
VCC_CPU_1V0
C70
74.
7u
4.7u
C70
8
C71
04.
7u
4.7u
C70
9
VCC_RTC
C72
20.
1u
VCC_CORE_1V2
C70
54.
7u
C70
44.
7u
0.1u
C72
3
VCC_HDMI_3V3
R701 10K
VCC_IO_1V8 VCC_IO_1V8
VCC_SDIO_2V8
4.7u
C73
5
VCC_IO_1V249.9R706
Q703 7
8
4 3
5 2
6 1
D1D4
D2D3
GS1 S2
D5
R705 49.9
R707 240
VCC_DDRx_3V3 VCC_IO_1V2
C74
80.
1u
VCC_IO_1V2
C76
60.
1u
C77
02.
2u
VCC_IO_1V8
4.7u
C76
5
C72
64.
7u
C72
14.
7u
4.7u
C74
4
VCC_IO_1V2
C73
80.
1u
C74
50.
1u
C72
74.
7u
4.7u
C74
2
C76
92.
2u
0.1uC719
VCC_USB_3V3
4.7u
C76
0
VCC_IO_1V8
VCC_IO_1V8
C71
40.
1u
C71
80.
1u
0.1u
C71
7
0.1u
C74
0
0.1u
C76
3
C76
20.
1u
0.1u
C73
6
C76
10.
1u
C74
10.
1u
0.1u
C74
7
FB701 40
C74
60.
1u
VCC_IO_1V8
0.1u
C73
9
C72
84.
7u
VCC_IO_1V8
VCC_IO_1V2
C70
30.
1u
0.1u
C75
8
C70
20.
1u
C72
00.
1u
10KR702
0.1uC724
VCC_USB_3V3
0.1u
C70
1
VCC_IO_1V2
0.1u
C75
9
C73
40.
1u
C73
30.
1u
C75
20.
1u
0.1u
C75
3
4.7u
C75
4
100KR716
C73
00.
1u
C72
90.
1u
4.7u
C73
1
U703
54
63
72
81VCC SCLK
D+ SDATA
D- ALERT/THERM2
THERM GND
R717 DNI
C73
24.
7u
Q702
2
3
1G
DS
SC713
1
Q701
D
G
S
Q704
D
G
S
CN701
HJ-ICT-03Y
FEED
R71
1
47K
R71
5
180K
R719 1M
R70
3
5.1K
5.1K
R70
8
R70
9
5.1K
5.1K
R70
4
R714
100K
C75
60.
1u
C75
70.
1u
C75
54.
7u
PWR_ON_SW
PWR_I2C_SCLPWR_I2C_SDA
THERMAL_IRQ
THERMD_P
THERMD_P
THERMD_N
THERMD_N
TEMP_PWROFF_N
TEMP_PWROFF_N
APTEMP_PWROFF_N
Shield CAN clip_TOP
Shield CANC-Clip_Main to SUS
Pin1 check!!!
POP memoryAP CORE TEMP SENSE CIRCUIT BYPASS CAPs
AP20 PWR
- 176 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
R813 0
R825
100
D802
Q801
D
G
S
C811
2.2u
C82
615
p
TP801
R82
015
0K
FC-135_32.768KA-AC3X801
32.768KHz21
L805 10u
220nC845
0.1u
C83
1
C812
2.2u
C84
62.
2u
2.2u
C84
9
VCC_BBAT
VCC_IO_1V8
220n C830 R812
1K
2.2uL803
TP802
R803
4020
10u
C80
1
V_CHG
D801
10K
R801
C82
92.
2u
VCC_MIPI_1V2
DNIR818
C848 10n
R81
6
1M
C841 1u
C82
810
0n
VCC_IO_1V8
R805 100K
2.2u
C85
0
C85
12.
2u
C85
22.
2u
C85
32.
2u
L802 1.5u
V_POWERRAIL
0.1u
C84
7
VCC_DDRx_3V3
C843 0.1u
C844 0.1u
VCC_RTC
0.1u
C833
VCC_IO_1V2
USB_OUT_5V
V_POWERRAIL
68KR819
C85
82.
2u
C816
10u
C815
10u
DNIR817
C817
10u
0.1u
C83
2
U801
G8
G5
F8E5
F6E4
F5D6
F4D5
E6C5
E7
L12C4
L10D1
F12
A12L11
A1
D3
E12D4
D12G3
B1
F11C1
E11
K12E3
J12E2
E1
G9
H9
H2
K10H1
J10J1
G12A4
H12
B12B5
C12B2
A2
K11B3
J11A3
G10C3
H10B4
G11C2
H11
G7
F10D8
E10B6
C7
F9A6
E9A5
D11J3
C11J2
K3
D10L3
C10K2
L1
D9L2
C9K1
A11D7
B11C8
E8
A10F7
B10
J9
A9J8
B9J6
H8
A8C6
B8
D2
A7
B7G2
L9G1
K9
K8
L8H7
L6H4
K6J7
K7G6
L7H3
G4
L5H6
K5H5
J5
K4F3
J4F2
L4F1CHG1 IN_V1
CHG2 LX_V1_1
CHG3 LX_V1_2
FB_V1
EXTON_ PG_V1_1
ONKEY_ PG_V1_2
RSTIN_
RST_ IN_V2
BBPMUEN_ LX_V2
PWREN FB_V2
SYSCKEN PG_V2
MBFLT_ IN_V3
LX_V3
FB_V3
OUT3_3V PG_V3
OUT5V IN1
OUT1
VL
IN2
NC1 OUT2
NC2
NC3 IN3
NC4 OUT3
NC5
IN4
TXIN OUT4
TXOUT
TCLKAP IN5
TCLK2 OUT5
LXW IN6
FBW OUT6
PGW1
PGW2 IN7
CSW1 OUT7
CSW2
CPW IN8
PWMW OUT8
IN12C IN9
SDA1 OUT9
SDA2
SCL1 IN10
SCL2 OUT10
IRQ_
IN11
VCCADC OUT11
AUX1 IN12
AUX2 OUT12
YP IN13
YN OUT13
XP
XN IN14
TIPQ_ OUT14
IN15
ADCREF OUT15
VRTC IN16
SDBY OUT16
BBAT
IN17
OUT17
MBAT1
MBAT2 IN18
MBAT3 OUT18
IN19
CSP OUT19
CSN
MBDET IN20
THM OUT20
TTP
NC6
REFBP NC7
NC8
PMICGND NC9
ADCGND NC10
TCXOGND
GND1 GND6
GND2 GND7
GND3 GND8
GND4 GND9
GND5 GND10
GND11
GND12
V_POWERRAIL
VCC_CORE_1V2
VCC_IO_1V8
VCC_DDRx_3V3
VCC_PLL_1V1
VCC_USB_3V3
VCC_eMMC_2V8
VCC_HDMI_PLL_1V8
VCC_FUSE_3V3
VCC_HDMI_3V3
VCC_SDIO_2V8
VCC_MOTOR_3V0
VCC_APTEMP_3V3
VCC_eMMC_2V8
VCC_VI_1V8C
854
2.2u
R82
168
0K
C80
71u
1uC
860
1uC
861
C86
21u
C86
31u 1u
C86
4
C86
81u1u
C86
6
C86
71u
VCC_IO_1V8
1uC
859
0.1uC820
R811 1M
2.2u
C85
6
VCC_IO_1V8
C85
72.
2u
C86
51u
VCC_SENSOR_3V0
VCC_SENSOR_1V8
VCC_TOUCH_3V1
0.1u
C80
3
C80
61u
C80
90.
1u
C8181u
0.1u
C80
8
10u
C80
5
V_POWERRAIL
0.1u
C80
4
VCC_IO_1V8
C82
110
u
VCC_CPU_1V0
U802
C4
A4
D3
D1
D4
A3
C2
C1
D2
A1
A2
B1
B4
B2
C3
B3LX1
PGND1
EN
LX2
SNS+
AG
ND
IN1
SDA
SNS-
VID0
VID1
SYNC
VDD
SCL
IN2
PGND2
V_POWERRAIL
C82
310
u
C834
0.1u
L801 1.5u
C810
1u
VCC_TOUCH_1V8
R80
2
2.2K
CN801
3
2
1
D1
D2
C83
510
0p
10n
C83
6
10p
C83
7
V_POWERRAIL
C83
83p R814 10
C84
010
0u
VA801
C83
933
u
ZD801
C82
715
p
M80
1
C85
54.
7u
L804 1u
C819 1u
C80
21u
C814
0.1u
C82
20.
1u
VCC_CPU_1V0
R80
810
K
C82
40.
1u
VCC_IO_1V8
VCC_LCD_2V8
VCC_LCD_1V8
VCC_BBAT
C86
90.
1u
0.1u
C82
5
C842
470n
10R80
4
C870
2.2u
BATT_TEMP
BATT_TEMP
PWR_ON_SW
PWR_I2C_SCL
PWR_I2C_SCL
PWR_I2C_SDA
PWR_I2C_SDA
PWR_INT_N
SYS_RESET_N_AP20
SYS_RESET_N_AP20
PMU_32K_CLK
BATT_LOW_INT
AP_PWR_ON CORE_PWR_EN
CPU_PWR_EN
PCB_VER_ADC
PCB_VER_ADC
BLED_IN
BLED_OUT
HOOK_ADC
PMIC FOR AP202.0mm
Place Load Caps Close to PMIC
PWR ON
MAX8907C
1%
1%
R2
R1
150K
Resistane depending on PCB revision
150K
150K
150K
150K
68K 1.8V
1.8V
1.8V
1.8V
1.8V
1.8VRev.1.0
1.8V
1.8V
150K
MPP #1 : PCB Revision Check ADC
REV
F
680K
D 100K
300K
E 150K
C
470K
A
Supply voltage
6.2K
150K
B
68K
Rev.1.1
R1 R2
47K
DCDC for CPU 1.0V
Pair to CPU power
RTC SUPERCAP
BATT conn.
- 177 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
R91
6
1M
C903
0.1u
68KR912
VCC_IO_1V8
U902
4 3
5 2
6 1SWVIN
GNDVOUT
FB_SHDN
C911
4.7u
100K
R911
VCC_VGA_HDMI_5V0
FL901
5
6
31
42P2 P4
P1 P3
P6
P5
CN901
25
24
23
22
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
21
20
C90
60.
1u
FL904
5
6
31
42P2 P4
P1 P3
P6
P5
FL903
5
6
31
42P2 P4
P1 P3
P6
P5
FL902
5
6
31
42P2 P4
P1 P3
P6
P5
R90
347
K
R90
447
K
R90
547
K
R90
647
K
R90
747
K
R90
847
K
R90
947
K10
KR
910
0.1uC901
VCC_eMMC_2V8
C908
0.1u
C904
0.1u
VCC_IO_1V8
C909
0.1u
VCC_IO_1V8
4.7uL901
C910
10u
V_POWERRAILVCC_VGA_HDMI_5V0
R90
247
K
R91
8
330K
C90
52.
2u
C90
21u
C90
72.
2u
U901
R5
R3
R2
R1
P14
P13
P12
P10P
3P
2P
1N
14N
13N
12N
10N3
N2
N1
M14
M13
M12
M10M
9M
8M
5M
3M
2M
1L1
4L1
3L1
2L3L2L1K
14K
13K
12K
11K
10K9
K8
K7
K5
AH11K3AH9K1AH6J14AH4J13AG13J12AG2J11AE14J10AE1J9AA14J8AA13J7AA12J1AA11H14AA10H13AA9H12AA8H11AA7H10AA2H9AA1H8Y14H7Y13H6Y12H2Y11H1Y10D14Y9D1Y8B13Y7B2Y6A11Y3A9Y1A6W14A4W13W12AA5W11AA3W10Y4W9W4W8K6W7AA6W3AA4W2Y5W1Y2V14K4V13U8V12R10V3P5V2M7V1U9U14T10U13N5U12M6U10U7K2U6U5W5U3U2W6U1T14J6T13J5T12J4T5J3T3J2T2H5T1H4R14H3R13R12L4
A1_INDEX NC74NC75
DAT0 NC76DAT1 NC77DAT2 NC78DAT3 NC79DAT4 RFU12DAT5 NC81DAT6 NC82DAT7 NC83
NC84CLK NC85
NC86CMD RST_N
RFU15VDDI RFU13
RFU16VCC1 NC91VCC2 NC92VCC3 NC93VCC4 NC94VSS1 NC95VSS2 NC96VSS3 NC97VSS4 NC98VSSQ1 NC99VSSQ2 NC100VSSQ3 NC101VSSQ4 NC102VSSQ5 NC103VCCQ1 NC104VCCQ2 NC105VCCQ3 NC106VCCQ4 NC107VCCQ5 NC108
NC109NC1 NC110NC2 NC111NC3 NC112NC4 NC113NC5 NC114NC6 NC115NC7 NC116NC8 NC117NC9 NC118NC10 NC119RFU1 NC120RFU2 NC121NC13 NC122NC14 NC123NC15 RFU14NC16 NC125NC17 NC126NC18 RFU17NC19 NC128NC20 NC129NC21 NC130NC22 NC131NC23 NC132NC24 NC133NC25 NC134NC26 NC135NC27 NC136NC28 NC137NC29 NC138NC30 NC139
RFU
3N
C32
NC
33N
C34
NC
35N
C36
NC
37N
C38
NC
39N
C40
NC
41N
C42
NC
43N
C44
NC
45N
C46
NC
47N
C48
RFU
4R
FU5
RFU
6R
FU7
NC
53N
C54
NC
55N
C56
NC
57N
C58
RFU
8N
C60
NC
61N
C62
NC
63N
C64
RFU
9R
FU10
NC
67N
C68
NC
69N
C70
NC
71N
C72
RFU
11
R91
7
47K
D903 D902
D901
MMC_CMD
MMC_DAT1MMC_DAT2MMC_DAT3
MMC_CLK
MMC_DAT4MMC_DAT5MMC_DAT6MMC_DAT7
HDMI_TXD0N
DDC_SCLDDC_SDA
HDMI_REG_EN
HDMI_TXD2PHDMI_TXD2N
HDMI_TXD1PHDMI_TXD1N
HDMI_TXD0P
HDMI_TXCPHDMI_TXCN
MMC_DAT0
HDMI_INT_N
HDMI Connector
HDMI BOOST Converter
Toshiba 8GBUSER MEMORY_eMMC I/F
- 178 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
FL1009
1
42
5
6
3P2 P4
P1 P3
P6
P5
R1016
100
0.1u
C10
16
2.2u
C1033
C10
130.
1u
C1025
2.2u
FL1008
15pF
10 5
6 4
7 3
8 2
9 1INOUT_A1INOUT_B1
INOUT_A2INOUT_B2
INOUT_A3INOUT_B3
INOUT_A4INOUT_B4
G1
G2
15pF
FL1004
105
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
G2
FL1002
15pF
10 5
6 4
7 3
8 2
9 1INOUT_A1INOUT_B1
INOUT_A2INOUT_B2
INOUT_A3INOUT_B3
INOUT_A4INOUT_B4
G1
G2
FL1005
15pF
105
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
G2
15pF
FL1007
105
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
G2
15pF
FL1003
105
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
G2
C1029
15pVA1003
2.2u
C1031
0
R1004
2.2u
C1022
C1024
2.2u
DNI R1006
VCC_LCD_1V8
V_POWERRAIL
R10
11
4.7K
VCC_LCD_1V8
U1003
D2
E1
A4
C1
B3
F3C5
A3
A2
C2
B2
D1
B1
A1
D3
F1
E2
F2
E3
E4
F4
E5
F5
C3
D5A5
C4
D4
B4
B5
C2+
C1+ C1-
C2-
IN NEG
SDA
BL1
BL2
BL3
BL4
BL5
BL6
BL7
BL8
SCL
LDOA
LDOB
BC_M
LDOC
FLTR
LDOD
AG
ND
1
PG
ND
1
PG
ND
2
SBIAS
AMB_IN
IN_LDO
AGND2
EN
C1032 10n
L10021u
VA1001 VA1002100K
R1007 R1008
100K
U1002
15
87
96
105
114
123
132
141CT RSET
EN_SET FLOUTA
FLEN FLGND
AGND FLOUTB
IN FLINH
LX GND
PGND OUTG_S
LUG
VCC_LCD_2V8
C1030
2.2u
100K
R10
17
CN1003
2625
2724
2823
2922
3021
3120
3219
3318
3417
3516
3615
3714
3813
3912
4011
4110
429
438
447
456
465
474
483
492
501
C1005
1u
CN1001
1312
1411
1510
169
178
187
196
205
214
223
232
241
VT_AVDD_2V8
C10
151u1u
C10
14
VT_IO_DVDD_1V8
FL1006
15pF
105
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
G2
FB10
02
FB10
03
FL1001
109
84736251
P1 P5P2 P6P3 P7P4 P8
G1
G2
ZD1002
1u
C10100.1u
C1006
CAM_AF_2V8
VT_AVDD_2V8
VT_IO_DVDD_1V8
V_POWERRAIL
CAM_VDIG_1V2
L1001 2.2u
C1023
47n
CAM_VIO_1V8
U1001
B1
E1C2
B2
C1
E2
D3
C3
A1C4
B3
A3
D4
E3
D2
B4E4
A2
D1
A4
VB
ATT
VIN
2
VIN
1VINB LDO1
FB
SW
GNDB
LDO2
IRQ_N
SDA LDO3
SCL
DVS
EN
LDO4
DEFSEL
IDSEL LDO5
GN
D
CAM_AVDD_2V8
CN1002
1312
1411
1510
169
178
187
196
205
214
223
232
241
CAM_VIO_1V8 CAM_AF_2V8
CAM_AVDD_2V8
CAM_VDIG_1V2
0.1u
C1007 C1008
0.1u
ZD1003
0.1u
C1011
R10030
2.2u
C1003
2.2u
C1026
C1019
2.2u 1u
C1020
1u
C1021C1018
2.2u
C1017
1u
C1009
1u
10u
C1012
10u
C1001C1004
2.2u 2.2u
C1002
100K
R10
10
1u
C1027
1u
C1028
V_POWERRAIL
VCC_IO_1V8
2.2u
C1034
2.2u
C1035
2.2u
C1036
R10
05
200K
R10
12
4.7K
R10
13
4.7K
VCC_IO_1V8
FB10
01
FB1004
TP1001 TP1002
GND
V_POWERRAIL
VT_CAM_PWDN
VT_HSYNC
VT_VSYNC
VT_RESET_N
8M_MIPI_DATA0_N8M_MIPI_DATA0_P
8M_MIPI_DATA1_P8M_MIPI_DATA1_N
CAM_I2C_SDA
CAM_I2C_SDA
CAM_I2C_SDA
CAM_I2C_SCL
CAM_I2C_SCL
CAM_I2C_SCL
CAM_MCLK
CAM_MCLK
LCD_RESET_N
8M_MIPI_CLK_P
8M_RESET_N
BL_DCDC_RST_N
8M_MIPI_CLK_N
CAM_SUBPM_EN
FLASH_LED_EN
FLASH_LED_INH
FLASH_LED_TORCH
8M_CAM_VCM_EN
LCD_MAKER_ID
LCD_CS
BL_DCDC_SDABL_DCDC_SCL
LCD_D23LCD_D21LCD_D19LCD_D17
LCD_D15LCD_D13LCD_D11LCD_D9
LCD_D7LCD_D5LCD_D3LCD_D1
LCD_D22LCD_D20LCD_D18LCD_D16
LCD_D14LCD_D12LCD_D10LCD_D8
LCD_D6LCD_D4LCD_D2LCD_D0
DCXWRX
LCD_TE
GSM
_TXO
N_I
ND
LSENSOR_BIAS
LSENSOR_SENS
VT_CAM_DATA[0]
VT_CAM_DATA[1]
VT_CAM_DATA[4]
VT_CAM_DATA[5]
LCD_BL_OUT1
LCD_BL_OUT1
LCD_BL_OUT2
LCD_BL_OUT2
LCD_BL_OUT3
LCD_BL_OUT3
LCD_BL_OUT5
LCD_BL_OUT5
LCD_BL_OUT6
LCD_BL_OUT6
LCD_BL_OUT7
LCD_BL_OUT7
LCD_BL_OUT4
LCD_BL_OUT4
LCD_BL_OUT8
LCD_BL_OUT8
LCD_PWM
LCD_PWM
VT_CAM_DATA[2]
VT_CAM_DATA[3]
VT_CAM_DATA[6]
VT_CAM_DATA[7]
FLASH_LED_ANODE
LCD_CSX
LCD_CSX
LCD_TE_BF
LCD_TE_BF
LCD_WRX
LCD_WRX
LCD_DCX
LCD_DCX
LCD_R6
LCD_R6
LCD_R4
LCD_R4
LCD_R2
LCD_R2
LCD_R0
LCD_R0
LCD_G6
LCD_G6
LCD_G4
LCD_G4
LCD_G2
LCD_G2
LCD_G0
LCD_G0
LCD_B6
LCD_B6
LCD_B4
LCD_B4
LCD_B2
LCD_B2
LCD_B0
LCD_B0
LCD_R7
LCD_R7
LCD_R5
LCD_R5
LCD_R3
LCD_R3
LCD_R1
LCD_R1
LCD_G7
LCD_G7
LCD_G5
LCD_G5
LCD_G3
LCD_G3
LCD_G1
LCD_G1
LCD_B7
LCD_B7
LCD_B5
LCD_B5
LCD_B3
LCD_B3
LCD_B1
LCD_B1
FLASH_LED_CATHODE
VT_PCLK
0.5 mm
1.0 mm
LCD (CPU)
1.0 mm
cathode
anode
Routing line must be thick enough to support 1A!!1%
Movie Mode : 111mA
Flash Mode : 810mA
CAMERA FLASH LED
CAMERA FLASH LED DRIVER
0.5 mm
1.3M_VT CAMERA SUB PMIC-CAM POWER8M_MIPI_CAMERA
4.0'' LCD Backlight Charge pump
LCD_PWM
- 179 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
DN
IC
1108
D11
01
C1109
0.1uC1110
0.1u
CN1103
1312
1411
1510
169
178
187
196
205
214
223
232
241
FB1101 1800
VA1101
1uC
1111
VCC_TOUCH_1V8
10K
R11
06
C1113
0.1u
FB1102 1800
1800FB1103
FB1104 1800
FB1105 1800
VCC_IO_1V8
MIC1101
4
3
2
1P
G1
G2
O
47p
C1101
10p
C1102 C1103
33p
15pF
FL1102
105
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
G2
15pF
FL1101
105
64
73
82
91INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
G1
G2
R11
0510
K
47p
C1114
10p
C1115 C1116
33p
CN1104
65
74
83
92
101
VCC_TOUCH_3V1
C11121u
R11
0310
K
V_CHG
VCC_SENSOR_1V8 VCC_SENSOR_3V0
CN1102
1312
1411
1510
169
178
187
196
205
214
223
232
241
VCC_TOUCH_1V8
VA1102
D11
00
V_POWERRAIL
VCC_IO_1V8
VCC_SDIO_2V8
2.85V_SIM
C1104
0.1uC1106
0.1u
C1105
0.1u
CN1101
1615
1714
1813
1912
2011
2110
229
238
247
256
265
274
283
292
301
G1 G2
G3 G4
MICROSD_CMDMICROSD_CLK
PWR_ON_SW
PWR_ON_SW
TOUCH_MAKER_ID
TOUCH_INT
VT_DATA[0]VT_DATA[1]
VT_DATA[4]VT_DATA[5]
MICROSD_DET_N
MICROSD_DAT1MICROSD_DAT2
MICROSD_DAT3
GEN2_I2C_SCL
GEN2_I2C_SDA
MICROSD_DAT0
GEN1_I2C_SDA
GEN1_I2C_SCL
PROXI_OUT
VT_DATA[2]VT_DATA[3]
VT_DATA[6]VT_DATA[7]
VOL_KEY_UP
HALL_INT
BLED_IN
BLED_OUT
LSENSOR_BIAS
LSENSOR_SENS
VT_CAM_DATA[0]VT_CAM_DATA[1]
VT_CAM_DATA[4]VT_CAM_DATA[5]
VT_CAM_DATA[2]VT_CAM_DATA[3]
VT_CAM_DATA[6]VT_CAM_DATA[7]
FLASH_LED_ANODE
MIC1P
50PIN_EAR_L
USB_ID
50PIN_EAR_SENSE
50PIN_EJ_MIC
MICBIAS
MICBIAS
50PIN_EAR_R
USB_DM
USB_DP
SPK_P
SPK_N
RCV_N
RCV_P
EAR_GND
UART_RX_MDMUART_TX_MDM
SIM_RSTSIM_IOSIM_CLK
FLASH_LED_CATHODE
MIC2P
VOL_KEY_DOWN
25V
SUB MIC
TOUCH CONNECTOR
Main to Upper_FPCB connector Main to Sub connector
Main to Lower_FPCB connector
- 180 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
0 R1220
C12
012.
2u
FB1202
0.1u
C1208
1M
R12
19
VCC_IO_1V8
R12
2347
K
0R1221
C1216
DNI DNI
C1217
R12120
R1205 0
1uC1218
1uC1223
U1201
G7
H7
H8
G8
B3
C3
A2
B1
A6
B4
C4
B5
C5
H6
G6
G5
F8
F9
E8
E7
C9
B6
A7
A5
A3
E1
D3
A4
G2
H1
F3
F7
E2
H9
C1
A1
D6
A8
A9
C7
B7
B8
B9
C8
D7
F5
H4
H5
F6
G4
E5
H3
F4
H2
G3
F2
E4
E3
G1
C6
E6
D5
D4
D1
D2
F1
G9
D8
C2
B2
D9
E9LDO1VDDAVDD1SPKVDD1SPKVDD2AVDD2CPVDDDCVDDDBVDDLDO2VDD
LDO1ENALDO2ENAVREFC
DMICCLCK
BCLK1LRCLK1DACDAT1ADCDAT1ADCLGCLK/GPIO1
GPIO3/BCLK2GPIO4/LRCLK2GPIO5/DACDAT2GPIO7/ADCDAT2GPIO6/ADCDLRCLK2
GPIO11/BCLK3GPIO10/LRCLK3GPIO8/DACDAT3GPIO9/ADCDAT3
IN1LNIN1LP
IN2LN/DMICDAT1IN2LP/VRXN
IN1RN1N1RP
IN2RN/DMICDAT2IN2RP/VRXP
AGND1SPKGND1SPKGND2
CPGNDDGND
HP2GND
SDASCLK
CS/ADDRCIFMODE
MCLK1GPIO2/MCLK2
SPKMODEREFFGND
MICBIAS1MICBIAS2
VMIDC
AGND2AGND3
HPOUT2NHPOUT2P
HPOUT1FBHPOUT1RHPOUT1L
LINEOUT1NLINEOUT1PLINEOUT2NLINEOUT2PLINEOUTFB
SPKOUTLNSPKOUTLP
SPKOUTRNSPKOUTRP
CPCACPCB
CPVOUTNCPVOUTP
VCC_AUDIO_1V8
C1207
1u
V_POWERRAIL
C1206
1u
C1213 0.1u 20R1214
100KR1203
C1205
4.7u
2.2uC1225
2.2uC1224
C1220 2.2u
C1211 4.7u
4.7u
C1209
1uC1214
R1213 20
100KR1204
TP1201
VCC_AUDIO_1V8
TP1203
1u
C1222
C1210
4.7u
R1218 10K
R1217 10K
C1212 0.1u
0.1u
C12
04
C12
020.
1u
VCC_AUDIO_1V8 VCC_AUDIO_1V8VCC_IO_1V8
C1221
47p
R12
16
2.2K
120pC1226
V_POWERRAIL
FB1201
C12
034.
7u
C1227
0.1u
Q1201
43
52
61
D1
D4
D2
D3
GS
R12220
AUDIO_MCLK
DAP1_SCLKDAP1_FSDAP1_DOUTDAP1_DIN
DAP2_SCLKDAP2_FS
AUDIO_INT_N
GEN2_I2C_SCLGEN2_I2C_SDA
DAP2_DOUT
AUDIO_MCLK2
DAP2_DIN
EARJACK_SENSE
WM_LDO_EN
HOOK_ADC
MIC1P
50PIN_EAR_L
50PIN_EAR_SENSE
50PIN_EJ_MIC
50PIN_EJ_MIC
MICBIAS
50PIN_EAR_R
SPK_PSPK_N
RCV_N
RCV_P
EAR_GND
EJ_MICBIAS
EJ_MICBIAS
HOOK_DET
MIC2P
3.5Phi EARJACK Detect
EJ_MICBIAS Added
RCV Path Added
Wolfson WM8994
3.5Phi MIC Detect
- 181 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
R13
1310
0K
CN1301
2
1
U1306
25 21 2022 192324
18
17
98 107 11
6
12
5
13
4
14
3
15
2
16
1CLKIN
NC7
NC1
NC6
NC2
NC5
NC3
VDD
NC4
INT
IME_DA
FSY
NC
IME
_CL
RE
GO
UT
VLO
GIC
AD
0
NC8
GND
SD
A
SC
L
RE
SV
1
CLK
OU
T
CP
OU
T
RE
SV
2
NC
9
R1332 0
R13
270
OJ1304
10K
R1314
VCC_SENSOR_3V0
R1331 0
VCC_SENSOR_1V8
C1310
0.1u
C1311
0.1u
U1305
12
11
10
9
5
4
6
37
28
1D
VD
D
VR
EG
GN
DA
GN
DS
AV
DD
ADDR
SCL
NC1
INT
VPP
DRDY
SDA
OJ1301
1u
C1304
1u
C1312
R13
22
DN
I
4.7K
R13
15
VCC_MOTOR_3V0
U1304
91011
54
63
72
81EN VDP
PWM GND
MODE VDD
GAIN VDN
NC
3
NC
2
NC
1
C1315
10n
C1314
1u
R13
16
4.7K
C1301
0.1u
VCC_IO_1V8
DN
IR13
18
2.2u
C1307
R1310
2.2K
V_CHG
V_POWERRAIL
R13
0315
0
R13
0515
0
R13
0410
0K
0.1u
C1323
V_POWERRAIL
TP1302
VCC_SENSOR_1V8 VCC_SENSOR_3V0
0.1u
C1322
C1317
1u0.1u
C13
19
0.1u
C13
18
C13
131u
VCC_IO_1V8
C1321
0.1u
VCC_SENSOR_3V0
0 R1329
C1320
1u
U1307
4
3
2
1
510
6
7
8
9SCL
DNC4
INT
DNC3
SD
AV
DD
IO_VDD
DNC1
DNC2
GND
R1330DNI
VCC_SENSOR_1V8
R13
0110
0K
1uC
1308
1uC
1305
C13
062.
2u
V_POWERRAIL
VBUS_OUT
C13
02
1u
V_CHG
560
R13
11
U1302
65
74
83
92
101
11PGND
VIN BATT
ISET PGB
GND1 CHGSB
LDO GND2
IEOC EN_SET
VCC_IO_1V8
U1303
9
74
81
6
5
32CELL VDD
SEO
EO
CTG SDA
GND SCL
PG
ND
C13
031u
10n
C13
09
V_POWERRAIL
L1302 100n
L1301 100n
R13
125.
1K
TP1301
C1316
2.2n DN
IR
1326
IC1301
11 12
9
4
6
3
5
2
7
18
10HSD3+
HSD2+ D+
HSD2-
D-
HSD1-
GND
HSD1+
SEL0
HSD3-
VCCSEL1
R13
240
R13
250
OJ1302
U1301
B2
C1
C2
C3 A2
C4
D3
D1 D4
A1
B1
A3
B4 B3
B5 A5
C5 A4
D5 D2BATVB
DN1COMN1
DP2COMP2
U1UID
U2
RES
MIC
AUD1CAP
AUD2
GND
ISETIC
SC
L
SD
A
INT
R13
0210
0K
USB_AP20_DNUSB_AP20_DP
AP20_UART_SW
GYR
O_I
NT_
N
MOTION_INT
GEN2_I2C_SCL
GEN
2_I2
C_S
CL
GEN2_I2C_SCL
GEN2_I2C_SDA
GEN
2_I2
C_S
DA
GEN
2_I2
C_S
DA
INT_N_MUIC
UART2_RX_AP20
UART2_TX_AP20
COM_INT
CHG_EN_SET_N_AP20
CHG_STATUS_N_AP20
MDM_UART_SW
VIBE_ENVIBE_PWM
MUIC_SDAMUIC_SCL
USB_ID
USB_DMUSB_DP
IME_
DA
IME_DA
IME_CL
IME_
CL
UART_TX
UART_TX
UART_RX
UART_RXUSB_DN_MDMUART_RX_MDM
UART_TX_MDM
I2C_FUEL_SDAI2C_FUEL_SCL
USB_DP_MDM
CHG_PGB_N
Compass Sensor
Boss GND contact
MOTOR DRIVER IC
90ohm matching !!90ohm matching !!
DP3T SWITCH
MUIC
1%
2mm
1%
Close to batt. connector
Close to batt. connector
GND pad on the bottom of chip has to be connected to main GND trace through many vias for heat emission.
CHARGER IC
Gyro Sensor
FUEL Gauge
Motion Sensor
- 182 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
38.4MHz
KT3225L38400UCW28TA0X1401
32
41GND1 VCC
GND2 OUT
U1402
5
3 24 1
VOUTVINGNDSTBY
PG
ND
R1401
20K
C1404
1uF
2.2uF
C1408
V_POWERRAIL
C1407 1nCLK_IN
CLK_REQ
38.4MHz for WLAN
C1412
10u
R1402
0
R14
03 0
C1410
0.1u
TP1401
TP14
03
TP14
04
TP1402
C1405
DNI DNI
C1406
L1402
3.3u
ANT1401
1
V_POWERRAIL
C1414
0.1u0.1u
C1413
VCC_IO_1V8
VCC_IO_1V8
C14
190.
1u
C14
184.
7u
4.7u
C14
17
0.1u
C14
15
4.7u
C14
16
1u
C1411
10u
C1409
U1401
62 59
2827262524232221201918
17
16
15
29
58
30
31
14
32
13
33
12
34
11
35
10
36
9
37
8
38
7
39
6
40
5
41
4
42
3
2
60
1
43
44
45
46
474849505152535455565761G
ND
1
BT_
PC
M_S
YN
C
BT_
PC
M_I
N
BT_
PC
M_C
LK
BT_
UA
RT_
CTS
_N
BT_
UA
RT_
RTS
_N
BT_
UA
RT_
TXD
BT_
UA
RT_
RX
D
GN
D4
SLE
EP
_CLK
GN
D7
FM_R
X_A
NT
GND9
FM_TX_ANT
GND2
OSC_OUT
GND11
GN
D13
2G4_ANT
GND14
OSC_IN
BT_WAKE_B
GND15
BT_HOST_WAKE_B
AUD_IN_R
I2S_DI
AUD_IN_L
I2S_DO
AUD_OUT_R
I2S_CK
AUD_OUT_L
I2S_WS
GND8
BT_ENABLE
VBAT2
WL_ENABLE
VBAT1
WL_HOST_WAKE_N
GND3
WL_WAKE_N
SR_VLX1
SDIO_CMD
SR_AVDD_2P5
GND10
BT_
PC
M_O
UT
VD
D_P
A
SDIO_D3
SDIO_D2
GND12
SD
IO_D
1
SD
IO_D
0
SD
IO_C
LK
CLK
_RE
Q
UA
RT_
RX
UA
RT_
TX
VD
DIO
VD
DIO
_SD
VIN
_LD
O_I
N
VD
D_C
OR
E
VD
D_R
AD
IO_P
LL
GN
D5
GN
D6
BT_
PCM
_DIN
BT_
PCM
_SYN
CB
T_PC
M_D
OU
TB
T_PC
M_C
LK
WLAN_EN
BT_
UA
RT_
CTS
_NB
T_U
AR
T_R
TS_N
BT_
UA
RT_
RXD
BT_
UA
RT_
TXD
CLK
32K
WLAN_HOST_WAKEUP
WLA
N_S
DIO
[0]
WLAN_SDIO[2]
WLA
N_S
DIO
[1]
WLAN_CMD
WLA
N_C
LK
WLAN_SDIO[3]
BT_WAKEUP
WLAN_WAKEUP
BT_HOST_WAKEUP
BT_EN
CLK_IN
CLK
_REQ
WLAN + BT + FMRadio
- 183 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
U101
5
32
41OUT VDD
GND NC
PG
ND
CN101
1615
1714
1813
1912
2011
2110
229
238
247
256
265
274
283
292
301
G1 G2
G3 G4
S101
168
7
6
5
4
3
2
1 15
G5 G3 G1 CD
C1
C2
C3
C4
C5
C6
C7
C8
G6 G4 G2 COM
G7
TP107
C107
0.1u
VA101
CN102
2
1
R10
7
10K
47K
R10
4
R10
5
47K
47K
R10
6
R10
2
4.7K
TP102TP103TP104TP105TP106
C103
0.1u
VCC_IO_1V8
C104
22pDNI
C102
2.85V_SIM
C101
22p
R10
1
220K
D10
3
43
52
61
C105
100n
J101
9 8
10 7
6 3
5 2
4 1VCCGND1
RSTVPP
CLKIO
GND2GND5
GND3GND4
VCC_IO_1V8
C106
4.7u
VCC_SDIO_2V8
D10
2
43
52
61
R10
3
47K
D10
1
43
52
61
VCC_SDIO_2V8
VCC_IO_1V82.85V_SIM
V_POWERRAIL
VA102
SIM_CLK
SIM_CLK
SIM_IO
SIM_IO
SIM_RST
SIM_RST
MICROSD_CLK
MICROSD_CLK
MICROSD_CMD
MICROSD_CMD
MICROSD_DAT0
MICROSD_DAT0
MICROSD_DAT1
MICROSD_DAT1
MICROSD_DAT2
MICROSD_DAT2
MICROSD_DAT3
MICROSD_DAT3
MICROSD_DET_NMICROSD_DET_N
V_POWERRAIL
PWR_ON_SW
PWR_ON_SW
UART2_TX_AP20
UART2_TX_AP20
UART2_RX_AP20
UART2_RX_AP20
FLASH_LED_CATHODE
FLASH_LED_CATHODE
HALL_INT
HALL_INT
FLASH_LED_ANODE
FLASH_LED_ANODE
Hall ICArray TPTP gap 1mm!
Micro SD Card Interface USIM For Infinieon
Flash
Sub connector
- 184 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
VA101
R101
20
D103
RCLAMP0504P.TCT
43
52
61
7P_GND
IO1 IO4
NC 5V_NC
IO2 IO3
J101
ENJE0007602
2
36
5
4
1 M5_MIC
M4_L
M3_DETECT
M4D-DETECT
M1_R
M6_GND
CN100
1
KB
101
CN102
1312
1411
1510
169
178
187
196
205
214
223
232
241
CN101
1
VA104
U102
6
4 3
2
5 1VCCIOUT
GND1
GC1GC2
GN
D2
U101
54
63
72
81LEDA SCL
LEDC SDA
VCC VIO
VOUT GND
VCC_SENSOR_1V8
VCC_SENSOR_3V0
10
R10210u
C101
1u
C105
0.1u
C104
1uC102
4.7u
C103
VCC_SENSOR_3V0VCC_SENSOR_1V8
VA102
LSENSOR_BIAS
LSENSOR_BIAS
LSENSOR_SENS
LSENSOR_SENS
50PIN_FM_ANT
50PIN_FM_ANT
50PIN_EAR_SENSE
50PIN_EAR_SENSE
50PIN_EJ_MIC
50PIN_EJ_MIC
50PIN_EAR_L
50PIN_EAR_L
50PIN_EAR_R
50PIN_EAR_R
PROXI_OUT
PROXI_OUT
GEN2_I2C_SCL
GEN2_I2C_SCL
GEN2_I2C_SDA
GEN2_I2C_SDA
RCV_P
RCV_P
RCV_N
RCV_N
PWR_ON_SW
PWR_ON_SW
ENJE0007601-->ENJE0007602
Upper_FPCB connector
Proximity Sensor
3.5pi Ear Jack Connector
Ambient Light Sensor PWR_KEY
Receiver
- 185 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
7. CIRCUIT DIAGRAM
VA105
VA103
VA102
KB
102
L101 82n
HIR-02A57-0000AA
2
1
SP101
KB
101
C105 8.2p
LD102 LD103 LD104
CN104
11
10
9
5
4
3
2
1
8
7
6
FL101
5
6
31
42P2 P4
P1 P3
P6
P5
VA104
SW101
G1
ANTG2
LD101
82nL102
MIC101
6
5
4
3
2
1OUT
G1
G2
VDD
G3
G4
ANT101
ANT_L-01B
FEED
VA101
FL102
INOUT
GND1GND2
C10
31u
C10
40.
1u
V_CHG
ANT_L-01B
ANT102
FEED
CN103
1312
1411
1510
169
178
187
196
205
214
223
232
241
V_CHG
C101
DNIC102
DNI
MICBIAS
MICBIAS
MIC1P
MIC1P
MIC_GND
MIC_GND
SPK_N
SPK_N
SPK_P
SPK_P
USB_ID
USB_ID
USB_DM
USB_DM
BLED_OUT
BLED_OUT
BLED_IN
BLED_IN
USB_DP
USB_DP
VOL_KEY_DOWN
VOL_KEY_DOWN
VOL_KEY_UP
VOL_KEY_UP
KEY LEDsSPEAKER +/-
MicroUSB
MAIN MIC
VOL UP/DOWN KEY
RF_Mobile Switch
Lower_FPCB
8. BGA PIN MAP
- 186 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U101 PMB5703(Transceiver)
8. BGA PIN MAP
8. BGA PIN MAP
- 187 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U202 PMB9801
8. BGA PIN MAP
- 188 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U301 H8BCS0QG0MMR-46M
8. BGA PIN MAP
- 189 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Not Used
U302 H8TBR00U0MLR : LPDDR2 memory(512MB), POP
Used
8. BGA PIN MAP
- 190 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U401 AP20
Not Used
Used
8. BGA PIN MAP
- 191 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U602 MAX8907C(PMIC)
8. BGA PIN MAP
- 192 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U701 Toshiba 8G NAND FlashNC Not Used
8. BGA PIN MAP
- 193 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U802 LDO
8. BGA PIN MAP
- 194 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Not UsedU1001(WM8994)
Used
U1001(WM8994)
8. BGA PIN MAP
- 195 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
U1206 MUICU1206 MUIC
- 196 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
1
L Y
CM
B
AA
CP
1
1 54
BA
C
D
E
AC
AD AE AF
AA
AB
AG AH
46
PNM WVUTR
C
B
A
B
1
A E
D
F
14
C D HGFE KJ
DEFGHJKL
9
14
A
1
RTUVY W NPAH
AG ABAF
AE
AD
AC
C
K
L
N
M
D
E
F
G
H
J
1A
B
1AB
29
10
DEFGHJKLMN
F
C
B
A
D
RTUVWYAA
AB
AC
E
56
4
C142
C123
L117
U102
C136
C1319
C1316
C870
C145
C144
R1330
R1318
C1102
C911
U1303
C1014
R1008
R1007
U1304
C1211
R904
CN701
C840
C1024
C418
C1206
U203
L103
R312
C433
C442R1005
C504
VA1001
C436
VA1002
R1212
R306
C435R1203
R317
C1212
C441
C1220
C1213
C1224
C1225
R1218
R1217
C243
C242
C1202
U101
L127
C112
C146
U302
C432
TP303
C116
C117
C221
L107
R1017
TP316
TP310
TP315
TP319
TP305
TP311
TP320
TP308
TP321
TP313
L212
U202
C222
C203
U201
FL104
U1306
Q704
Q703
U1302
C839C
1302
C835
C132
C124
L119
R719
C143
L121
C1323
R1301 R1325
C1306
R1312
R1313
R1324
C1304
R1311
C1305
R1310
C1307
R1315
U1301
R1314
R1316
C836
IC1301
U1307
C128
FL102
L112
L123
C148
R1329
FL103 C133
C1322
R1322
C127
Q501
R521
R524
R816
U1001
D801
C1012
C1317
C903
U901
L113
C135
C129
R1327C
841
R1326
C1318
C1017
C1002
C844
C845
C1018
C1004
R801
R1302
L1001C1320
C1321
R1003
C1001
R912
C902
C1313
R825
R817
C1103 C1101
FL904
FL902
CN
1301R
917M
IC1101
C1015
FL903
FL901
U902
C1019
R916
R918
Q801
Q1201 R1223
C1003
C1020
R1221
L901
C1021
C907
R1222
C1221
C1222
R1216
C1226R1220
R1305
C1309
R1304
C1016
C1013
C1312 R1205
C1314
C910
R903
C905
D902
L1301
L1302
D903
C1023
L1002
C1022
R1204
C1207
R1219
C1216
C1315
C1227
C1204
C1217
C1214 C1210
C1218
C739
C1209
C1223
R907
R906
R908
R1010
C764
R909
R910C901
R905
R902
R1303 C1308C1303
C904
U1201
FB1201
FB1202
C1208
C1203
C1205
U1002
R310TP1301TP1302
C110
C108C
109
R603 C812
C115
R1006R1004
R1214L402
R207
FL205
C103
R106
L128
C422
L401C
407
C406
L405
L409
TP1203
C446
C408
R402
C420
C402
R1213
C235
C403
C239
C118
C236
C150
L222
C238
C120
C149
C121
R109
U204
C247
C147
C102
C111
L118
R316R303
C246
C248
R104
R103
C106
R101
R102
C306
R305
C303
C409
C415
C440
R307
C424
C444
L404
C416
L216
C245L218
L215C
130
L125
L214
C216
L223
L217
C218
C240
C241
FL206C244
L205
L204
C217
C215
FL101
L102L104
FL203
L106
C305C308
U301
TP302C
104
C107
L101L108 C105
L105
C101
C223
L129
L210
FL201
L225
L219
C204
L202
R201
C229
L213
C304
C1035
TP304
TP314
TP306
C443C437
TP317TP318
703P
T21
3PT
L109
C228
C119
C208
L110
L203
L224
L220
L221
C202
C209
C1027
C1025
R308
R318
FL202
C232
C214
R1013 R1012
C1032
C1026
C1028
C1033
C1036
U1003
C1034
C301
C302R302C307
C423
C414
C413C401C412
C434
L406C417
C421
C439
L407
L403
C410
C448
C425
R203
C411
R202
R204
C234R304
C231
FL204
L226L211
C220
C227
C233
C213
C201C
211
L201
C212
C207
9. PCB LAYOUT
U1003 : LCD Backlight charge pump - no display
U301 : CP Memory- no booting
U302 : CP Modem- no Service
FL201 : Filter.- no WCDMA service- no RF sensitivity
FL101 : Filter/ Seperater- no GSM service- no RF sensitivity
MIC1101 : MIC- no 2nd_mic.
CN1301 : Motor pad - no vibration
U1001: Camera PMIC- no 8M Camera- no 1.3M Camera
U1307 : Gyro Sensor- no Gyro Sensor
U201 : PAM(Band1)- no Service- RF Sensitivity & TX Power
FL203 : Filter- no Service- RF Sensitivity & TX Power
U202 : PAM(Band 4)- no Service- RF Sensitivity & TX Po
U1201 : Audio codec- no sound
FL901/FL902/FL903/FL904 : HDMI filter-no HDMI display
U1304 : Motor D-IC- no vibration
U1002 : Flash LED D-IC - no Flash
U1306 : Gyro Sensor- no Gyro Sensor
U1302 : Charger IC - no charging
U902 : HDMI booster- no HDMI display
Q1201 : FET- no Ear-jack detect
U203 : RF Amplifier - no AWS service
U1303 : Fuel gauge - Battery Bar Accuracy declined
U901 : EMMC memory- no booting
U1301 : MUIC- no USB/UART
U204: AND Gate - no RF Amplifer Control
U101 : PAM- no Service- RF Sensitivity & TX Power
LG-P999_SPFY0248001_1.2 _PLACE_TOP
- 197 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
AHA
A BR B
C
15
25
1324
1
1014
AJ
AKALAC AB
5 7
6 8
TUVWYAA
AB
AC
ADAEAF
AGY W V NP MRU T
24
12
12
5026
CDEGHJKLMNP F CDH G F EL K J
13
2413
31 2313
24
40
21
20
A1
1A
12
DEFGHJL K AB
1
12
11
16
30
50
12
26
5030
16
12
26
11
D
T
3142
24
610
1513
25
EFGHJKLMNPR
1ABC
5
1
106
15
1615
2625
2120
12
5030
401
305
16
SC
701
SC704
L124
CN1104
ZD102
AN
T101
R637
U702
CN801
L126
U103
C858
R640
R705
FB701
D1101
C1007
C803
FB1002
R653
R618
R643
R713
SC710
FB1001
FB1003
R654
R701
C1301C601
C772
X601
L804
R711
C823
R710
R712
C822
Q701
C511
CN901
C830
C862
C861
C404
C805
C514
C527
C523
C864
C549
C529
C869
FB501
L1402 C1409
R516
C506
FB1105
C1310
C431 C427
C515
C535
C505
C501
C438
R504
C508
M801
C531
SW102
FL1007FL1003
R519
C520
AN
T1401
C1405
FL1008FL1005
FL1002R
520X1401
R315
SC
711
R707R626
C744
C151
AN
T103
C131
C134
C1112
R1103
SC708
C1113
C731
R623
R624
R708
C733
TP801
R703
C748
C749
C745
C824
VA601
C726
C761
C722
C768
C738
C737
C715
C742
C752
TP802
R658
TP701
C757
C604
C729
C603
C755
R659
C1114
ZD801
C804
C838
C1116
C1115
C837
C1111
R625 R622
C139
C122
FL1009
C125
C141ZD100
C140
R112
C728
C712
TP609TP1201
C763
C713
C730
C711
R606
C751
R628
R607
R656
C762
R629
R604
R605
C1413
C747
R602
CN1103
R638
U601
FL1001
ZD101
ZD1002
C769
C716
C725
R641
R642
C771
R657
C717
R709
R706C
734
R704
C719
C727
C750
R1105
R1106
CN
1001
FL1101
R636
C760
C756
R714
U1305
C1005C
1006
CN
1002
C1008
C1010ZD1003
C1009
SC703
C753
R644
C720
C746
C758
C754
R639
C1105
C1011R645
C1414
R635
C721
R702
C908
C741
C1104
R621
C706
C710
C724
C708
C735
R647
C701 C
718C705
C704
C702
C602
C743
C703
R650
TP607
C765
R649
C714
U703
D1100
R715 C767
R814 R1331VA801
FL1102
C846
R615
R619
R803 C815
C723
R651
R911
D901
C906
C802
R802
L805
C814L801
R627
L802C709
R813
C707 C816
C831
R617
R616
C817
C732
L803
C848
U602
C821
Q702R717
R655
R716
R646
R718
C1110
C1109
C842
R1332
R805 C828R811
C524
D802
C809 C
819C801C847
U801
C853
C851
C856
C859
C860C
811
C806
C808
C857
C770
C1201
C825
C909
R804
R808
U802
TP606TP605
C550
TP608
C834C820
C832
C863
C865
L502
C544
R818
R819
C868
C810
C818
C843
C1404
C829
R812
C833
C867
C827
X801
C826
C855
C849
C850
C866 C
405C852
C513
C854
L503
L501C522
C526
L504
R523
C528
C525
TP301
R522
Q502
Q301
R301
SC702
C1416
C1415
SC
712
CN
1102
FB1101
VA1101
VA
1102
C1108
R820
R821
C759
C766TP1404
TP1403
C1418
C1412
C1417C1419
R514
TP512 TP503
TP510
C533
TP511
U501
C539
C517
C518
TP513
C546
R501
C736
CN
1101
C1410
C1411
C545
C1311
C1106
FB1104
R634
R631
C740
R632
U1401
C445
C509C428
C541
C430
C543
C542
C537TP501
TP502
C540
C502
C551
R525
C519
X502
C534
SC709
C530
FL1006FB
1004C
1407
C507
R1011
VA1003
R1016
FB1102
FB1103
C1029
C1406
CN
601 FL1004
TP1401
C1030
TP1402
C447
L408
D502
C429
C419
C426
SC706
FB401
C512
D501
C510
C548
C516
R515
C503
C538
C532
C536
PT501
C521
CN
301S
W101
R1403
R1402
TP1001
CN
1003
C1408
R1401
U1402
PT502
C807
R314
X501
R503
SC707
TP1002
C547
C1031
CN901 : HDMI Conn. - no HDMI diplay
CN1001 : 1.3M Camera Conn.- no 1.3M camera
ANT103 : GPS Ant. Conn.- no Radio with Intenna
ANT101 : AWS Ant. Conn.- no Radio with Intenna
CN1002 : 8M Camera Conn.- no 8M camera
CN1104 : Touch Conn.- no touch
U702 : POP memory(Top)- no booting
U602 : OR Gate- no Download mode
U802 : CPU Power DC- no Booting- no Power On
U1401 : WiFi+BT Radio Module- no WiFi connection- no BT Connection
U501 : Modem PMIC- no service
X1401 : WLAN/BT Xtal- no WiFi / BT
CN1003 : LCD Conn. –no display
CN1101 : Sub FPCB Conn.-no SIM-no T-flash memory-no Flash LED
ANT1401 : WiFi/Bluetooth antenna- no WiFi/Bluetooth
CN1102 : Upper FPCB Conn. - no Power on - no Ear-jack - no illumination sensor - no proximity sensor - no FM radio
M801 : Super Cap- no RTC maintain
SW101 : Coaxial Conn.- no Service
X502 : Modem PMIC Xtal- no service
X501 : 26MHz Xtal- no service
U801 : PMIC- no Booting- no Power On- no Service
X601 : 12Mhz X-tal- no Power On- no Booting
CN801 : Battery Conn.- no power On
CN1103 : Lower FPCB Conn.- no USB/UART- no 4 key LED- no side key- no 1st MIC.
U1305 : Compass sensor. - no compass sensor
LG-P999_SPFY0248001_1.2 _PLACE_BOT
- 198 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
15
3016
CN
102
CN
101
TP107
LG-P999_F_SUB_SPCY0255401_1.0_TOP
- 199 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
C101
J101
R101
R103
TP105
C102
C103
C104
R102
D101
VA101
C105
VA102
U101 C107
TP104
D103
D102
C106
R107R106
R105
R104
S101
TP103TP102TP106
LG-P999_F_SUB_SPCY0255401_1.0_BOT
- 200 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
1324
12C102
R102
C103
J101
KB101
CN101
CN100
VA102
D103
CN
102
VA101
VA104
U102
U101
R101
C1
05
C104
C1
01
LG-P999_F_UPPER_SPCY0255101_1.0_BOTTOM
- 201 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
LD104VA104 LD103L102VA102L101 VA101LD102VA103LD101
LG-P999_RF_LOWER_SPCY0254701_1.0_TOP
- 202 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
9. PCB LAYOUT
SP101
CN104
SW101
CN103
KB101KB102
VA105
FL102
FL101
C104
C103
MIC101
C102
ANT101
C105
C101
AN
T1
02
LG-P999_RF_LOWER_SPCY0254701_1.0_BOT
10. CALIBRATION
- 203 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10. CALIBRATIONContent
10.1 Calibration & RF Auto Test Program (Tachyon)
10.1 Configuration of Tachyon10.1.1 Configuration of directory
10.1.2 Description of basic folders
10 1 3 Description of configuration files
10.1 Calibration & RF Auto Test Program (Tachyon)
10.1.3 Description of configuration files
10.2 How to use Tachyon10.2.1 Model selection
10.2.2 Start cal & auto
1 / 5
10. CALIBRATION
- 204 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
10.1.1 Configuration of directory
1. Configuration of Tachyon
2 / 5
10. CALIBRATION
- 205 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
1. Configuration of Tachyon
10.1.2 Description of basic folders
Folder Description
Tachyon Exe file and MFC dll, UI dll is present.
Common Common dll files.Common (XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)
Config Envirement files.(Port configuration, Loss adjust)
Instrument Tester control dll.
ModelModel files is present. (Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL NAME(LGGW620, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, …)
OCX Conponent files.
PhoneCmd Phone communication file
Report Report Files is present.(Cal data, test data)
3 / 5
10. CALIBRATION
- 206 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
1. Configuration of Tachyon
10.1.3 Description of configuration files
File Description
‘MODEL NAME’_Calibration.XML There are imformations to calibrate.It consist of calibration items.
‘MODEL NAME’_CallSetup.XML There are imformations to call.
‘MODEL NAME’ NV INI It consists of default values.MODEL NAME _NV.INI It is written when ‘cal&auto’ is begun.
‘MODEL NAME’_Sequence.XML It is described a testing procedures.
3 / 5
10. CALIBRATION
- 207 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. How to use Tachyon
10.2.1 Model selection
Follow the procedure before start calibration & auto test
a. Click the icon, in tool bar.
Then, you can see the below screen
4 / 5
10.2 How to use Tachyon
10. CALIBRATION
- 208 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
b. Select Model “P999”
10. CALIBRATION
- 209 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. How to use Tachyon
10.2.1 Model selection
Follow the procedure before start calibration & auto test
c. Select the model : You should select “LGP999
d S l t th b ( t b d bl li k d)d. Select the buyer (must be double clicked)Then, you can see “PASS” in Config File Check.
e. Click select button
C
D
E
5 / 5
LG-P999
LG-P999LG-P999LG-P999LG-P999LG-P999LG-P999LG-P999LG-P999
10. CALIBRATION
- 210 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
2. How to use Tachyon
10.2.2 Start cal & auto
a. Click calibration & autotest button, in Tool bar
b. Calibration & autotest will be executed in order.
1) Precede Action.- NV write- Test command send.
2) Calibration3) Auto test4) After action
- Phone reset- Change UE to AMSS
4 / 5
LG-P999
11. STAND-ALONE TEST
- 211 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
11. STAND ALONE TEST
Hidden Menu StartStart shortcut keys:277634#*#
Hidden Menu ListStart the desired menu: Menu, click
List : Auto all Test: Device functionality testing at the factory to useAccelerometer Test ALC/Proximity TestBluetooth Scan Test Camera TestCompass Test Gyroscope TestExternal Memory Test Font TestHall Sensor Test Key/Compass TestLCD Test RTC TestSound Test Touch TestVibrator Test Wifi Scan TestGyro Cal Test EMI TestHDMI Test Touch LED Brightness
Device Test List
Auto All Test : -> Auto All Test menu click-> Continuous information on the menu, giving you ability test
11. STAND-ALONE TEST
- 212 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Accelerometer Test
Proximity Test : Proximity Sensor
Phone contact with your fingers in the top of the sensor determine the sensor response Far 1.0 Near 0.0
Check the “Auto brightness mode” ALC level changed due to the brightness
Bluetooth Scan Test
11. STAND-ALONE TEST
- 213 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Camera TestMenu features disabled This feature is part of Auto All Test replaced by -> Auto All Test -> Primary Camera Preview -> Secondary Camera Preview -> Touch Flashlight Preview
Camera Test 1Primary Camera Preview
Camera Test 2Secondary Camera Preview
Camera Test 3Touch Flashlight Preview
11. STAND-ALONE TEST
- 214 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
External Memory Test :SD Card
SD Card test -> Write a test check of the SD Card memory
Key/Compass Test
Up/Down key : Check RecognitionMenu key : Check RecognitionHome key : Check RecognitionBack key : Check RecognitionSearch key : Check RecognitionCompass test
LCD Test List
Manual Test : Click on the following screen Automatic Test : Automatically, without clicking
Red Display Green Display Blue Display White Display Red, Green, Blue, White Display Red ,Green, Blue, Black Display
11. STAND-ALONE TEST
- 215 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Touch window testWrite with finger
Ring test
Vibrator testA case-by-state vibration tests
11. STAND-ALONE TEST
- 216 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Wifi Scan test
Gyro Sensor test
Audio Loop Back TestMic & Speak Phone loop Back test
11. STAND-ALONE TEST
- 217 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
ELT Test
Automatic Mode : Test Automatically Manual Mode : Test selectivity
ELT Test
Automatic Mode : LCD Automatic on/off test -> time setting
ELT Manual Test
LCD Backlight RingtoneVibratorCameraAudio Loopback-> test on the device is working(The ability to use plant)
11. STAND-ALONE TEST
- 218 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
SW Sanity Test:FPRI TestCRC Test: BIN CRC
CAL CRC EFS CRC EFS CRC Detail
Factory Reset:Format External SD card : External SD Card Data reset Format Internal SD card : Internal SD Card Data resetFactory Rest :Changing the Factory
Version InfoClassified Information representation
11. STAND-ALONE TEST
- 219 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Module Test list:
BT DUT setting SMS Prefer setLCD Always ONHidden ResetUSB mode selectionReboot CP/APSMPL countCharging Test
WLAN performance on SW
ERS Menu
11. STAND-ALONE TEST
- 220 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Contacts Test
Aging Test
Port SettingSelect-> OK
11. STAND-ALONE TEST
- 221 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Browser Utility
AT Test
Modem SettingMenu : Engineering Mode
Band Selection Auto Call Answering RRC Version Setting QCRIL/Android Log On/Off PDP Setting HSDPA Category GSM A5 Algorithm Protocol Test GCF Flag Arm9 Log ON/Off
11. STAND-ALONE TEST
- 222 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
GPS Test
SMS Test->Automatic Memfull Test
Modem Setting Menu : Engineering Mode
Band Selection Auto Call Answering RRC Version Setting QCRIL/Android Log On/Off PDP Setting HSDPA Category GSM A5 Algorithm Protocol Test GCF Flag Arm9 Log ON/Off
11. STAND-ALONE TEST
- 223 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
WPS test
SMS Test->Automatic Memfull Test
DRM Test
11. STAND-ALONE TEST
- 224 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
FM radio TestInput the Freq. & Volume
VT memu
Log service
- 225 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 EXPLODED VIEW
ACGK00
MBJZ01 MCCZ03SURY00
SVCY01
MEV00
EBR02
MIDZ00
MEV01
AFBZ00
GMEY00 ACGM00
MCCZ00
MCCZ01
MCCF00ACGA00
GMEY01
ABM00
FAB00
SBPL00
EAA01
EAD00
SUMY01
EBR01
MDS01
SVLM00MDS00
MPBG00
MBL00
MCCZ02
SAFY00
MCQ00
ACKA00SUMY00
MCBA00 SVCY00
EBR00
SJMY00
MBJZ00
Location Description
ACGM00 Cover Assembly,Rear
MCCZ00 Cap
MCCZ01 Cap
MCCF00 Cap,Mobile Switch
GMEY00 Screw,Machine
SAFY00 PCB Assembly,Main
ABM00 Can Assembly,Shield
ACKA00 Can Assembly,Shield
SVCY00 Camera Module
EBR00 PCB Assembly,Flexible
SJMY00 Motor,DC
SUMY00 Microphone,Condenser
MCBA00 Can,Shield
GMEY01 Screw,Machine
MPBG00 Damper,LCD
MIDZ00 Insulator
MDS00 Gasket
MDS01 Gasket
MCQ00 Damper
MCCZ02 Cap
MCCZ03 Cap
GMEY01 Screw,Machine
FAB00 Screw,Machine
MEV00 Insulator
MEV01 Insulator
SVLM00 LCD,Module-TFT
SVCY01 Camera Module
SURY00 Receiver
AFBZ00 Frame Assembly
EBR01 PCB Assembly,Flexible
SUMY01 Microphone,Condenser
EBR02 PCB Assembly,Flexible
EAA01 PIFA Antenna,RF
EAD00 Cable,Assembly
ACGK00 Cover Assembly,Front
MBL00 Cap
MBJZ00 Button
MBJZ01 Button
SBPL00 Rechargeable Battery,Lithium Ion
ACGA00 Cover Assembly,Battery
- 226 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
EXPLODED VIEW (Total)
23
22
17
16
12
8
7
6
4
1
2
3
10
11
9
5
13
1514
19
18
21
202322212019181716151413121110987654321
- 227 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
EXPLODED VIEW (Assy)
A
B
C
U
D
F
G
H JK
L
Q
R
S
M
I O
P
E
T
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 228 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
1 AGQ000000 Phone Assembly APEY0994702 LGP999DW.ATMODW ZY:Color Unfixed -
2 MEZ002100 Label, Approval MLAA0062301 COMPLEX KB770 DEUBK ZZ:Without Color -
2 ACGY00 Cover Assembly,EMS ACGY0093302 LGP999DW.ATMODW BN:BLUISH GREEN -
3 ACGM00 Cover Assembly,Rear ACGM0178601 LG-P999BN TMOBN BN:BLUISH GREEN - P, 22
4 MCQ015700 Damper,Connector MCQ66484501 COMPLEX LGP999BN.ATMOBN ZZ:Without Color
Pad_Conn_Touch
4 MCK063300 Cover, Rear MCJN0129601 COMPLEX LG-P990 ORF ZZ:Without Color MOLD, PCLUPOY SC-1004ML, , , , ,
4 MDS000000 Gasket MDS63552101 COMPLEX LGP990.AORFZY ZZ:Without Color -
4 MCE000000 Contact MCE62253001 COMPLEX LG-P990 ZZ:Without Color P990_PIN_DPA
4 MCCZ00 Cap MCCZ0047401 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MCCZ01 Cap MCCZ0047301 COMPLEX LG-P990 ORF ZZ:Without Color MOLD, PCLUPOY SC-1004ML, , , , ,
4 MCCF00 Cap,Mobile Switch MCCF0072601 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,
(empty), , , , ,
4 MBFZ00 Bracket MBFZ0059101 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 EAA00 PIFA Antenna,Multiple EAA62504801 ACC-00127 TRIPLE -2DB 3:1 Planar Inverted F Type -
MOBITECH CORPORATION
4 MCQ000003 Damper MPBZ0341401 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MCQ049800 Damper, Motor MPBJ0079601 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MKC009400 Window, Camera MWAE0067001 COMPLEX LG-P990 ORF ZZ:Without Color CUTTING,Tempered Glass, , , , ,
4 MJN089300 Tape, Window MTAD0137601 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MCQ000001 Damper MPBZ0341701 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Mechanic component>
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 229 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
4 MCQ000002 Damper MPBZ0341601 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MCQ000004 Damper MPBZ0341501 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MCQ000000 Damper MCQ66580701 COMPLEX LGP990.AORFZY BK:Black -
3 GMEY00 Screw, Machine GMEY0012901 GMEY0012901 FH + 1.4mM 2.5mM MSWR NI PLT N -LG ELECTRONICS INC. L, 17
3 SAFY00 PCB Assembly,Main SAFY0400802 LGP999DW.ATMODW 1.0 MAIN J, 16
4 EBR071500 PCB Assembly,Main, Insert EBR73245601 LGP999DW.ATMODW 1.2 Main
5 ABM00 Can Assembly,Shield ABM73516601 LGP999DW.ATMODW ZZ:Without Color P999 CAN
ASSY, SHIELD(BOT)
6 MBK070300 Can, Shield MCBA0103401 COMPLEX LG-P999BN TMOBN ZZ:Without ColorPRESS, STS,
6 MEV000000 Insulator MIDZ0283301 COMPLEX LG-P999BN TMOBN ZZ:Without ColorCOMPLEX, (empty),
5 ACKA00 Can Assembly,Shield ACKA0038301 LG-P999BN TMOBN ZZ:Without Color TOP 1
6 MBK070300 Can, Shield MCBA0103301 COMPLEX LG-P999BN TMOBN ZZ:Without ColorPRESS, STS,
6 MGAZ00 Gasket MGAZ0113201 COMPLEX LG-P999BN TMOBN ZZ:Without ColorCOMPLEX, (empty),
5 SVCY00 Camera Module SVCY0025401C8AA-Y232C C8AA-Y232C 8M AF, Sony(1/3.2"),9.5x9.5x6.5t, MIPI, FPCB, 90degree LG INNOTEK CO.,LTD
K, 13
5 EBR00 PCB Assembly,Flexible EBR73315802 LGP990.AORFZY 1.0 Flexible E, 15
6 EBR070100 PCB Assembly,Flexible, Insert EBR73292301 LGP999DW.ATMODW 1.1 Flexible
7 MCQ000000 Damper MCQ66505801 COMPLEX LGP990.AORFZY ZZ:Without Color -
7 EAT030000 Module, Assembly SMZY0029901 MP100OS LED 2 Vendor Managment TRAIS CO., LTD.
7 MDS000000 Gasket MDS63750501 COMPLEX LGP990.AORFZY ZZ:Without Color -
6 EBR070400 PCB Assembly,Flexible, SMT EBR73315901 LGP999DW.ATMODW 1.0 Flexible
7 EAX010700 PCB, Flexible SPCY0255401 SPCY0255401 LGP990.AORFZY 1.0 - - - - FlexibleYOUNG POONG ELECTRONICS CO. LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 230 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 EBR070200PCB Assembly,Flexible,SMT Bottom
EBR73292401 LGP999DW.ATMODW 1.0 Flexible
7 EBR070300PCB Assembly,Flexible,SMT Top
EBR73292501 LGP999DW.ATMODW 1.0 Flexible
5 SJMY00 Motor, DC SJMY0007118 MVMF-A301F 2.0 V, 40 mA, 10*3.0, Q-Coin 12mm Wire,3V, - LG INNOTEK CO., LTD M, 14
5 RAA050100 Resin, PC BRAH0001301 UF-1060
4 SAFF00 PCB Assembly,Main, SMT SAFF0299602 LGP999DW.ATMODW 1.1 MAIN
5 MEZ000000 Label MLAZ0038301 COMPLEX LG-VX6000 ZZ:Without Color PID Label 4Array PRINTING,
5 SAFC00PCB Assembly,Main,SMT Bottom
SAFC0162402 LGP999DW.ATMODW 1.2 MAIN
5 SAFD00 PCB Assembly,Main, SMT Top SAFD0159802 LGP999DW.ATMODW 1.2 MAIN
6 SUMY00 Microphone,Condenser SUMY0010609 SPU0410HR5H -PB SPU0410HR5H -PB, UNIT, 42 dB,
3.76*2.95*1.1, mems smd mic KNOWLES ACOUSTICS
6 MCBA00 Can, Shield MCBA0103201 COMPLEX LG-P999BN TMOBN ZZ:Without ColorPRESS, STS,
6 SPFY00 PCB, Main SPFY0248001 SPFY0248001 LGP999DW.ATMODW 1.1 FR-4 - -0.8mm Main LG Innotek.com
3 GMEY01 Screw, Machine GMEY0009201 GMEY0009201 BH + 2.7mM 3.5mM MSWR3 FZB N NLG ELECTRONICS INC. Q, 18
3 ACGV00 Cover Assembly,Bar ACGV0027302 LGP999DW.ATMODW BN:BLUISH GREEN -
4 MJN061101 Tape, Protect MTAB0438501 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MJN061100 Tape, Protect MTAB0435001 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MPBG00 Damper, LCD MPBG0115801 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MIDZ00 Insulator MIDZ0272901 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
4 MDS00 Gasket MDS63650201 COMPLEX LGP990.AORFZY ZZ:Without Color -
4 MDS01 Gasket MDS63631301 COMPLEX LGP990.ABUOZY ZZ:Without Color Gasket,LCD, Ground
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 231 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
4 MCQ00 Damper MCQ66592201 COMPLEX LGP999DW.ATMODW ZZ:Without ColorP999_PAD_TOUCH_FPCB
4 MCCZ02 Cap MCCZ0048101 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , , B, 7
4 MCCZ03 Cap MCCZ0047101 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , , U, 4
4 GMEY01 Screw, Machine GMEY0009201 GMEY0009201 BH + 2.7mM 3.5mM MSWR3 FZB N NLG ELECTRONICS INC.
4 FAB00 Screw, Machine FAB31219601 BH + 1.4mM 2.5mM SWRCH18A ZN N A I, 19
4 MEV00 Insulator MEV63893401 COMPLEX LGP990.ANEUDW BK:Black -
4 MEV01 Insulator MEV63872701 COMPLEX LGP990.ASFRDW BK:Black -
4 SVLM00 LCD, Module-TFT SVLM0042001TX10D07VM0BAA Main, 4.0", 480*800,96.6*56.34*1.94T, 262K, TFT, TM, TA8851A, HITACHIDISPLAYS., LTD
C, 5
4 SVCY01 Camera Module SVCY0026601LM14MIFF HSIS-LM14MIFF 1.3M Wide View,Aptina(1/6"), 7x7x3.3t, FPCB(BtoB) HANSUNGELCOMTEC CO., LTD.
T, 11
4 SURY00 Receiver SURY0010114 BWBR1207L-04B-P 30mW 32OHM 105DB 0HZTO0HZWIRE - BUJEON ELECTRONICS CO., LTD D, 6
4 AFBZ00 Frame Assembly AFBZ0022701 LG-P990 ORF ZZ:Without Color LCD H, 12
5 MDS000002 Gasket MDS63633801 COMPLEX LGP999DW.ATMODW ZZ:Without ColorP999_GASKET_CAN_BOT
5 MDS000000 Gasket MDS63535501 COMPLEX LGP990.AORFZY ZZ:Without Color -
5 MJN000002 Tape MTAZ0381801 COMPLEX LG-P999BN TMOBN ZZ:Without ColorCOMPLEX, (empty),
5 MJN000000 Tape MTAZ0360401 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MJN000001 Tape MTAZ0360001 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MEZ000900 Label, AfterService MLAB0006701 COMPLEX GS505 TMO ZZ:Without Color COMPLEX,
(empty), , , , ,
5 MDS000001 Gasket MDS63552001 COMPLEX LGP990.AORFZY ZZ:Without Color -
5 MBFZ00 Bracket MBFZ0058101 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
6 MDQ000000 Frame MFEZ0041101 COMPLEX LG-P990 ORF ZZ:Without Color MOLD, PA 6LUMID GP-2330A, , , , ,
4 EBR01 PCB Assembly,Flexible EBR73667501 LGP999DW.ATMODW 1.0 Flexible 9
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 232 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
5 EBR070400 PCB Assembly,Flexible, SMT EBR73667601 LGP999DW.ATMODW 1.0 Flexible
6 EAX010700 PCB, Flexible EAX64207401 LGP999DW.ATMODW A POLYI SBL 6L 0.5T Flexible
6 EBR070300PCB Assembly,Flexible,SMT Top
EBR73681901 LGP999DW.ATMODW 1.0 Flexible
6 EBR070200PCB Assembly,Flexible,SMT Bottom
EBR73681801 LGP999DW.ATMODW 1.0 Flexible
7 SUMY01 Microphone,Condenser SUMY0010616 SUMY0010616 FPCB, dB, 1.1TO10V, KNOWLES
ACOUSTICS
4 EBR02 PCB Assembly,Flexible EBR73342701 LGP990.AORFZY 1.0 Flexible F, 8
5 EBR070400 PCB Assembly,Flexible, SMT EBR73342801 LGP990.AORFZY 1.0 Flexible
6 EBR070300PCB Assembly,Flexible,SMT Top
EBR73343001 LGP990.AORFZY 1.0 Flexible
6 EAX010700 PCB, Flexible SPCY0255101SPCY0255101 LGP990.AORFZY 1.0 POLYI Multi -0.25mm Flexible YOUNG POONG ELECTRONICS CO.LTD.
6 EBR070200PCB Assembly,Flexible,SMT Bottom
EBR73342901 LGP990.AORFZY 1.0 Flexible
4 EAA01 PIFA Antenna, RF EAA62406501 HIL-02A69-0000AA MULTI -2DB 3.0 - - E.M.W CO.,LTD. O, 20
4 EAD00 Cable, Assembly EAD61725901 80388-202B-80L-01 UFL-LP-066 UFL-LP-066 0.08M 2BLACK none N I-PEX CO., LTD G, 10
4 ACGK00 Cover Assembly,Front ACGK0173902 LGP999DW.ATMODW DW:DARK BROWN - A, 1
5 MDJ000001 Filter MFBZ0031401 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MEV000000 Insulator MIDZ0273201 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MHK000000 Sheet MSAZ0075001 COMPLEX LG-P999BN TMOBN ZZ:Without ColorCOMPLEX, (empty),
5 MJN061100 Tape, Protect MTAB0438301 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MJN061101 Tape, Protect MTAB0438401 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 233 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
5 MEV000001 Insulator MEV63891601 COMPLEX LGP990.AORFZY ZZ:Without Color -
5 MDJ000000 Filter MFBZ0031301 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MCQ000003 Damper MCQ66475101 COMPLEX LGP990.AORFZY ZZ:Without Color Pad LEDProtect
5 MCQ074200 Damper, Speaker MCQ66476301 COMPLEX LGP990.AORFZY ZZ:Without Color PadSpeaker
5 MDJ000002 Filter MDJ63106701 COMPLEX LGP999DW.ATMODW ZZ:Without ColorFILTER(MIC)
5 AJX043300 Touch WindowAssembly EBD61065201 3G404-40CC63 CAPACITIVE TOUCH GG Synaptics Gen
3 4.0inch B to B Multi Touch Sintek Photronics
5 MCR000000 Decor Assembly ACW73597401 LGSU660.ASKTBK BK:Black -
6 MCR000000 Decor MCR64430301 PRESS STS 0.3 LGSU660.ASKTDW BK:Black -
6 MJN020801 Tape, Decor MJN67712601 COMPLEX LGSU660.ASKTDW ZZ:Without Color -
6 MJN020800 Tape, Decor MJN67712501 COMPLEX LGSU660.ASKTDW ZZ:Without Color -
5 MBL00 Cap MBL64824001 COMPLEX LGP990.AORFZY ZZ:Without ColorCAP(MIC, FRONT)
5 MBJZ00 Button MBJZ0045801 COMPLEX LG-P990 ORF ZZ:Without Color MOLD, PCLUPOY SC-1004ML, , , , , 2
5 MBJZ01 Button MBJZ0045901 COMPLEX LG-P990 ORF ZZ:Without Color MOLD, PCLUPOY SC-1004ML, , , , , 3
5 MCJK00 Cover, Front MCJK0137501 COMPLEX LG-P990 ORF ZZ:Without Color MOLD, ABSHI-153, , , , ,
6 MET099500 INSERT, NUT MICE0016908 MECH_COMMON ZY, ZZ, PRESS, STS, , , , ,
6 MET099501 Insert, Nut MICE0016901 COMPLEX MECH_COMMON ZZ:Without Color -
5 MPBZ00 Damper MPBZ0336001 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MPBZ02 Damper MPBZ0341301 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
5 MTAZ01 Tape MTAZ0356201 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
1 AGF000000 PackageAssembly APAY0147412 LGP999DW.ATMODW ZZ:Without Color T-mobile
USA_(Star DOP) 630/Pallet
2 MAY084001 Box, Unit MBEF0147423 COMPLEX LGP999DW.ATMODW RD:Red Star DOP_T-mobile USA (Lower case)
2 MAY084000 Box, Unit MBEF0147422 COMPLEX LGP999DW.ATMODW RD:Red Star DOP_T-mobile USA (upper case)
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 234 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
2 MAY047100 Box, Master MBEE0060116 COMPLEX LGP999DW.ATMODW ZZ:Without Color StarDOP(5) Master box
2 MCQ007000 Damper, Box MPBA0011405 COMPLEX LGP999DW.ATMODW ZZ:Without Color StarDOP _Phone Pad
2 AGJ000000 Pallet Assembly APLY0003730 LGP999DW.ATMODW ZZ:Without Color T-mobile StarDOP Pallet Assy(630EA)
3 MCK000000 Cover MCJZ0059319 COMPLEX LGP999DW.ATMODW ZZ:Without Color StarDOP_Pallet CAP
3 MCQ000001 Damper MPBZ0036883 COMPLEX LGP999DW.ATMODW ZZ:Without Color StarDOP_Pallet Dead space Sleeve
3 MCQ000000 Damper MPBZ0001227 COMPLEX LG-TM910 VRZ DB ZZ:Without ColorVX9000_Angle
3 MPCY00 Pallet MPCY0005202 COMPLEX LG-TM520 ZZ:Without Color -
2 MEZ084101 Label, Unit Box MLAQ0017702 COMPLEX LGP999DW.ATMODW ZZ:Without ColorCOMPLEX, PCX COMPLEX
2 MLAJ00 Label,Master Box MLAJ0004402 COMPLEX CG300 CGR ZZ:Without Color LABEL,
MASTER BOX(for CGR TDR 2VER. mbox_label)
2 MLAP Label, Unit MLAP0001144 COMPLEX GS505 TMO ZZ:Without Color COMPLEX,(empty), , , , ,
2 MLAZ00 Label MLAZ0050901 COMPLEX KU990 GBRBK ZZ:Without Color -
1 AAD000000 Addition Assembly AAAY0494601 LG-P990 ORF BK:Black -
2 ACGA00 Cover Assembly,Battery ACGA0047806 LGP999DW.ATMODW DW:DARK BROWN - S, 23
3 ACW000000 Decor Assembly ADBY0021801 LG-P990 ORF BK:Black -
4 MJN061100 Tape, Protect MJN67708901 COMPLEX LGP990.AORFZY ZZ:Without Color -
4 MDAY00 Decor MDAY0090801 COMPLEX LG-P990 ORF ZZ:Without Color PRESS,STS, , , , ,
3 MKC009400 Window, Camera MWAE0067601 COMPLEX LG-P990 ORF ZZ:Without Color CUTTING,Tempered Glass, , , , ,
3 MJN020800 Tape, Decor MTAA0232401 COMPLEX LG-P990 ORF ZZ:Without Color COMPLEX,(empty), , , , ,
3 MHK000000 Sheet MSAZ0075101 COMPLEX LG-P999BN TMOBN ZZ:Without ColorCOMPLEX, (empty),
3 MJN061100 Tape, Protect MJN67759201 COMPLEX LGP999DW.ATMODW ZZ:Without ColorTAPE, PROTECT(B/C)
3 MCJA00 Cover, Battery MCJA0122701 COMPLEX LG-P990 ORF ZZ:Without Color MOLD, PCLUPOY SC-1004ML, , , , ,
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 235 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
8 R101 Resistor, Chip ERHZ0000245 MCR01MZP5F2203 220KOHM 1% 1/16W 1005 R/TP -ROHM.
8D101,D102,D103
Diode, TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5PROTEK DEVICES INC.
8 C106 Capacitor,Ceramic, Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
8 S101 Socket, Card ENSY0023601 SCHA4B0402 Micro-SD 8P ANGLE SMD R/TP - ALPSELECTRIC KOREA CO., LTD.
8 R107 Resistor, Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP -ROHM.
8 C103,C105
Capacitor,Ceramic, Chip ECCH0000182 GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
8 U101 IC, Hall EffectSwitch EUSY0362601 BU52031NVX SSON004, 4, R/TP, Hall IC, IC, CMOSIC,
CMOS - SSON R/TP 4P - ROHM.
8
R103,R104,R105,R106
Resistor, Chip ERHZ0000287 MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP -ROHM.
8 C101,C104
Capacitor,Ceramic, Chip ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
8 J101 Card Socket ENSY0024301 KP09N-6S-2.54SF SIM 6P ANGLE SMD R/TP -HIROSE KOREA CO., LTD
8 R102 Resistor, Chip ERHZ0000286 MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP -ROHM.
8 VA101,VA102 Varistor SEVY0004401 ICVL0518400V500FR 18V 0% 40pF 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
8 C107 Capacitor,Ceramic, Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.
8 CN101 Connector, BtoB ENBY0052101 55909-0374 30P 0.40MM STRAIGHT MALE SMD R/TP1.5M - HANKOOK MOLEX
6 FB1004 Filter, Bead EAM62150301CIM05J600NC 60 ohm 1.0X0.5X0.5 25% 0.2 ohm 0.65ASMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICSCO., LTD.
12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered
<Main component>
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 236 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6FB1001,FB1002,FB1003
Filter, Bead EAM62131001CIM05J102NC 1000 ohm 1.0X0.5X0.5 25% 0.8 ohm 0.25SMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICSCO., LTD.
6
C1030,C1031,C1201,C501,C535,C536,C542,C769,C770,C811,C829,C846,C854,C858
Capacitor,Ceramic, Chip ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 C842 Capacitor,Ceramic, Chip ECZH0001210 C1005Y5V1A474ZT000F 470nF -20TO+80% 10V Y5V -
30TO+85C 1005 R/TP - TDK KOREA COOPERATION
6 R811 Resistor, Chip ERHY0009507 MCR006YZPJ105 1MOHM 5% 1/20W 0603 R/TP -ROHM.
6 C106 Capacitor,Ceramic, Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6R626,R705,R706
Resistor, Chip ERHY0000104 MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 237 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C1006,C1007,C1008,C1011,C1104,C1105,C1106,C1109,C1110,C1113,C1310,C1311,C1413,C1414,C1415,C1419,C426,C438,C505,C701,C702,C703,C706,C711,C713,C714,C716,C717,C718,C719,C720,C722,C723,C724
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 238 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C729,C730,C733,C734,C736,C738,C740,C741,C745,C746,C747,C748,C749,C750,C751,C752,C753,C756,C757,C758,C759,C761,C762,C763,C766,C771,C772,C814,C820,C822,C824,C825
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
6
C831,C832,C833,C834,C843,C847,C908,C909
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
6D1100,D1101,D901
Diode, TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEKDEVICES INC.
6
FB1101,FB1102,FB1103,FB1104,FB1105
Filter, Bead SFBH0008105BLM15BD182SN1D 1800 ohm 1.0X0.5X0.5 25% 1.4 ohm0.1A SMD R/TP 2P 0 MURATA MANUFACTURINGCO., LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 239 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
R1103,R1105,R1106,R514,R631,R632,R636,R637,R638,R655,R656,R657,R701,R702
Resistor, Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -ROHM.
6 U601 IC, ApplicationProcessor EUSY0415102 AP20H , 48, 481PIN, 12MP, HD, 3D, IC, Digital Signal
Processors BGA R/TP 481P NVIDIA CORP
6
R647,R658,R659,R804,R814
Resistor, Chip ERHY0009502 MCR006YZPJ100 10OHM 5% 1/20W 0603 R/TP -ROHM.
6 ZD801 Diode, TVS EDTY0008610 PLW0501H-LF 800mV 6V 12.5V 16A 250W SOD523R/TP 2P 1 PROTEK DEVICES INC.
6R1016,R712,R713
Resistor, Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -ROHM.
6 R622,R625 Resistor, Chip ERHY0009302 MCR006YZPF1001 1KOHM 1% 1/20W 0603 R/TP -
ROHM.
6 C1407,C767
Capacitor,Ceramic, Chip ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 M801 CapacitorAssembly SMZY0023501 PAS311HR-VG1 3.8 Backup Capacitor 0.03F, Module
Assembly, KOREA TAIYO YUDEN.CO., LTD.
6
L501,L502,L503,L504
Inductor, WireWound, Chip ELCP0011801
CPI2012NHL4R7MT 4.7UH 20% - 600mA 0.3OHM - -SHIELD 2X1.25X1MM NONE R/TP SAMWHACAPACITOR CO, LTD.
6 R808 Resistor, Chip ERHY0009303 MCR006YZPF1002 10KOHM 1% 1/20W 0603 R/TP -ROHM.
6 R503 Resistor, Chip ERHZ0000312 MCR01MZP5F6802 68KOHM 1% 1/16W 1005 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 240 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
R301,R523,R602,R634,R639,R640,R641,R642,R644,R716,R718,R805,R911
Resistor, Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP -ROHM.
6
R604,R607,R645,R651,R714
Resistor, Chip ERHY0009536 MCR006YZPF1003 100KOHM 1% 1/20W 0603 R/TP -ROHM.
6 C107 Capacitor,Ceramic, Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.
6ZD100,
ZD1002,ZD1003
Diode, TVS EDTY0009601 Rclamp0521P.TCT 5V 6 5V 4A 100W - R/TP 2P 1SEMTECH CORPORATION
6 D502 Diode, TVS EDTY0009401 VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P5 ROHM.
6 R819 Resistor, Chip ERHY0009558 MCR006YZPF6802 68KOHM 1% 1/20W 0603 R/TP -ROHM.
6 FL1009 Filter, EMI/Power SFEY0016301 ICMEF112P900M COMMON MODE NOISE FILTER 0HZ0F 0H SMD R/TP INNOCHIPS TECHNOLOGY
6 CN901 Connector, I/O ENRY0011201 78592-0001 19P 0.40MM ANGLE RECEPTACLE DIPR/TP - HANKOOK MOLEX
6
SC701,SC702,SC703,SC704,SC706,SC707,SC708,SC709,SC710,SC711,SC712
Clip MCGY0003801 COMPLEX LG-KH3900 KTF ZZ:Without Color -
6 C547 Capacitor,Ceramic, Chip ECCH0000161
MCH153CN333KK 33nF 10% 16V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 241 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 U702 IC, MCP, NAND EUSY0424401
H8TBR00U0MLR-0DM 4096MBIT 1.14VTO1.3V,1.7VTO1.95V 12.0x12.0x0.86 TR 168P DRAM FBGA4Gb LPDDR2 PoP (12x12/168ball/400MHz) HYNIXSEMICONDUCTOR INC.
6
C1009,C404,C818,C859,C860,C861,C862,C863,C864,C866,C867
Capacitor,Ceramic, Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005
R/TP - MURATA MANUFACTURING CO., LTD.
6
R703,R704,R708,R709
Resistor, Chip ERHY0009312 MCR006YZPF5101 5.1KOHM 1% 1/20W 0603 R/TP -ROHM.
6 L805 Inductor, WireWound, Chip ELCP0008016 MIPS2520D100 10UH 30% - 200mA 0.28OHM - -
SHIELD 2.5X2X1MM NONE - FDK CORPORATION.
6
C1409,C1412,C510,C511,C512,C513,C515,C516,C517,C518,C801,C805,C821
Capacitor,Ceramic, Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 U801 IC, PMIC EUSY0388301 MAX8907C , 132 , R/TP , , ; , IC, PMIC MAXIMINTEGRATED PRODUCTS INC.
6 U1402 IC, LDO VoltageRegulator EUSY0407101
BU28TD4WNVX SSON004, 4, R/TP, 2.8V 150mA SingleLDO, IC, LDO Voltage RegulatorIC, LDO VoltageRegulator ROHM.
6
FL1002,FL1003,FL1004,FL1005,FL1006,FL1007,FL1008,FL1101,FL1102
Filter, EMI/Power SFEY0010501 ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMDR/TP INNOCHIPS TECHNOLOGY
6 R1402,R1403 Wire Pad, Short SAFP0000501 LG-VS760 VRZ
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 242 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 U501 IC, PMIC EUSY0342202 PM8028 BGA, 137, R/TP, MDM9600 PMIC FOR LTE, IC,PMICIC, PMIC QUALCOMM INCORPORATED.
6C430,C431,C519
Capacitor,Ceramic, Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6
C1005,C1010,C1112,C1404,C1411,C514,C802,C806,C807,C819,C865,C868
Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C
1005 R/TP - TDK KOREA COOPERATION
6 X502,X801 Crystal EXXY0026901 Q13FC1350000300 32.768KHZ 20PPM 0F NONE SMD
R/TP EPSON TOYOCOM CORP
6 L1402 Inductor, WireWound, Chip ELCP0012101
CIG21L3R3MNE 0H 20% - 800mA - - 0.22OHM - -SHIELD 2X1.25X1MM NONE - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6CN1001,CN1002,CN1103
Connector, BtoB ENBY0034201 GB042-24S-H10-E3000 24P 0.40MM STRAIGHTSOCKET SMD R/TP 1M - LS Mtron Ltd.
6 X601 Crystal EXXY0017801 DSX321G(12MHZ, 8PF) 12MHZ 50PPM 8PF 32*25SMD R/TP DAISHINKU CORPORATION.
6 C405 Capacitor, TA,Conformal ECTH0007201
TLJR476M010R3200 0.000047F 20% 10V 18.8UA -55TO+125C 3.2OHM 2.05X1.3X1.2MM NONE SMDR/TP AVX/KYOCERA H.K LTD.
6
C122,C131,C140,C151,C522,C524,C526,C528
Capacitor,Ceramic, Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6
C1408,C428,C429,C546,C849,C850,C851,C852,C853,C856,C857
Capacitor,Ceramic, Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 243 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6C530,C531,C837
Capacitor,Ceramic, Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
6 R519 Resistor, Chip ERHZ0000295 MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP -ROHM.
6 FB401 Filter, Bead EAM62070701BLM03PG330SN1D 33 ohm 0.6X0.3X0.3 25% 0.09 ohm0.75A SMD R/TP 2P 0 MURATA MANUFACTURINGCO., LTD.
6 L126 Inductor,Multilayer, Chip ELCH0003844
LQG15HS2N0S02D 2NH 0.3NH - 300mA 0.1OHM 6GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6
C815,C816,C817,C823
Capacitor,Ceramic, Chip ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,LTD.
6 L804 Inductor, WireWound, Chip EAP61766701
VLS252010ET-1R0N 1UH 30% - 1.9A 0.07OHM - -SHIELD 2.5X2X1MM NONE R/TP TDK KOREACOOPERATION
6 X501 Crystal EXXY0025101 DSX321G - 10PPM - - - SMD P/TP DAISHINKUCORPORATION.
6 SW102 Connector, RF ENWY0008701 MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU50OHM 400mDB HIROSE KOREA CO., LTD
6ANT101,ANT103,ANT1401
Contact MCE62252901 COMPLEX LGP999BN ZZ:Without Color LG-P999CLIP_SUB
6 FL1001 Filter, EMI/Power SFEY0015901 ICMEF214P101MFR ICMEF214P101MFR, SMD, ESDCommon mode Filter INNOCHIPS TECHNOLOGY
6 PT502 Thermistor, NTC SETY0001401 NCP18WD683E03RB 68KOHM 1% 0V 0A 4.15KK SMDP/TP 1608size MURATA MANUFACTURING CO., LTD.
6 C601,C602
Capacitor,Ceramic, Chip ECCH0000108 C1005NP0709DGT 7pF 0.5PF 50V NP0 -55TO+125C
1005 R/TP - NEOTECH CO., LTD
6 Q701 FET EQFN0002901 2SK3019FPBTL N-CHANNEL MOSFET 30V +-20100mA 8OHM 150mW SC75A R/TP 3P ROHM.
6 L124 Inductor,Multilayer, Chip ELCH0004704
1005GC2T4N7SLF 4.7NH 0.3NH - 300mA 0.23OHM3.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
6CN1104,CN301,CN601
Connector, BtoB ENBY0050901 GB042-10P-H10-E3000 10P 0.4MM STRAIGHT MALESMD R/TP 1M - LS Mtron Ltd.
6R1331,R1332,R813
PCB ASSY,MAIN,PAD SHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 244 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 R627 Resistor, Chip ERHY0039802 RC0402FR-07453RL 453OHM 1% 1/16W 1005 R/TP -YAGEO CORPORATION
6 C1116 Capacitor,Ceramic, Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 C447 Capacitor,Ceramic, Chip ECCH0000133 C1005X7R1H221KT000F 0.22nF 10% 50V X7R -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6
R501,R504,R635,R646,R717,R818
PCB ASSY,MAIN, PADOPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
6 C828 Capacitor,Ceramic, Chip ECZH0004402
CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V -30TO+85C 1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.
6C1029,C826,C827
Capacitor,Ceramic, Chip ECCH0009520 MCH032A150JK 15pF 5% 25V X7R -55TO+125C 0603
R/TP - ROHM.
6
R615,R616,R617,R618,R619
Resistor, Chip ERHY0009527 MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP -ROHM.
6 X1401 Oscillator, TCXO EXST0002201 KT3225L38400UCW28TA0 38.4MHZ 1.5PPM 2.8V0.0x0.0x0.0MM NONE SMD R/TP KYOCERA CORP.
6 C1115,C139
Capacitor,Ceramic, Chip ECCH0000110
MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 R1401 Resistor, Chip ERHY0009554 MCR006YZPF2002 20KOHM 1% 1/20W 0603 R/TP -ROHM.
6R605,R606,R802
Resistor, Chip ERHY0009586 MCR006YZPF2201 2.2KOHM 1% 1/20W 0603 R/TP -ROHM.
6 U802 IC, DC, DCConverter EUSY0405402 MAX8952EWE+T 2.5 to 5.5V adj 1.6W CSP R/TP 16P -
MAXIM INTEGRATED PRODUCTS INC.
6 R623,R624 Resistor, Chip ERHY0009306 MCR006YZPF1801 1.8KOHM 1% 1/20W 0603 R/TP -
ROHM.
6 R515 Resistor, Chip ERHZ0000493 MCR01MZP5J513 51KOHM 5% 1/16W 1005 R/TP -ROHM.
6 D501 Diode, Switching EDSY0010501 KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESCR/TP 2P 1 KEC CORPORAITION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 245 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 R715 Resistor, Chip ERHZ0000231 MCR01MZP5F1803 180KOHM 1% 1/16W 1005 R/TP -ROHM.
6 U1305 IC, GeomagneticSensor EUSY0418501
AMI304 QFN, 12, R/TP, Geomagnetic Sensor, IC, A/DConverterIC, A/D Converter - QFN R/TP 12P - AICHISTEEL CORPORATION
6 C1111,C810
Capacitor,Ceramic, Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608
R/TP - MURATA MANUFACTURING CO., LTD.
6
R1011,R621,R628,R629,R649,R650,R653,R654
Resistor, Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP -ROHM.
6 L803 Inductor, WireWound, chip ELCP0008013 MIPSZ2012D2R2 MIPSZ2012D2R2, 2.2 uH, N,
2.0X1.2X1.0, R/TP FDK CORPORATION.
6 U703 IC, TemperatureSensor EUSY0426201 NCT1008 DFN, 8, R/TP, Remote Temperature Sensor, IC,
A/D Converter - DFN R/TP 8P - ON SEMICONDUCTOR
6 C427 Capacitor,Ceramic, Chip ECCH0009102 C0603X7R1H221KT 220pF 10% 50V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6 VA101,VA102 Varistor SEVY0004401 ICVL0518400V500FR 18V 0% 40pF 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
6
C523,C525,C527,C529,C549,C550
Capacitor,Ceramic, Chip ECCH0017501
CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 VA1101 Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMDR/TP AMOTECH CO., LTD.
6 CN1003 Connector, BtoB ENBY0040401 GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUGSMD R/TP 1M - LS Mtron Ltd.
6 CN1102 Connector, BtoB ENBY0034101 GB042-24P-H10-E3000 24P 0.40MM STRAIGHT PLUGSMD R/TP 1M - LS Mtron Ltd.
6 R112 Resistor, Chip ERHY0009540 MCR006YZPF2702 27KOHM 1% 1/20W 0603 R/TP -ROHM.
6 C520,C545
Capacitor,Ceramic, Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C
1005 R/TP - TDK CORPORATION
6 R643 Resistor, Chip ERHZ0003601 MCR01MZSF2004 2MOHM 1% 1/16W 1005 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 246 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
R103,R104,R105,R106
Resistor, Chip ERHZ0000287 MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP -ROHM.
6 C141,C848
Capacitor,Ceramic, Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6 R520,R820 Resistor, Chip ERHZ0000222 MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP -
ROHM.
6 Q502 FET EQFN0005601 KTK5132E N-CHANNEL MOSFET 30V +-20 100mA7OHM 100mW ESM R/TP 3P KEC CORPORAITION
6 FB501 Filter, Bead SFBH0002302BLM18PG121SN1J 120 ohm 1.6X0.8X0.8 25% 0.05 ohm2A SMD R/TP 2P 0 MURATA MANUFACTURING CO.,LTD.
6 C838 Capacitor,Ceramic, Chip ECCH0000104 MCH155A030C 3pF 0.25PF 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 R711 Resistor, Chip ERHY0009550 MCR006YZPF4702 47KOHM 1% 1/20W 0603 R/TP -ROHM.
6 C830 Capacitor,Ceramic, Chip ECCH0032801
GRM033R60J224M 0.00000022F 20% 6.3V X5R -55TO+85C 0603 R/TP 0.3MM MURATAMANUFACTURING CO., LTD.
6 PT501 Thermistor SETY0007301NCP15WF104F03RC NTC, 100000 ohm, SMD, 4250K+/-1%, 100K, 1%, 0.1mA, 4250K+/-1%, SMD, R/TPMURATA MANUFACTURING CO., LTD.
6 Q702 FET EQFP0000101 2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A 40OHM100mW SSM R/TP 3P TOSHIBA
6 R516 Resistor, Chip ERHY0009547 MCR006YZPF2003 200KOHM 1% 1/20W 0603 R/TP -ROHM.
6 CN1101 Connector, BtoB ENBY0052201 51338-0374 30P 0.40MM STRAIGHT FEMALE SMDR/TP 1.5M - HANKOOK MOLEX
6 C732 Capacitor,Ceramic, Chip ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6 L801,L802
Inductor, WireWound, chip ELCP0012801
MIPS2520D1R5 1.6 uH, N, 2.5*2.0*1.0, R/TP, 0.0000015,30%, 1.2A, 0.1 OHM, 2.5X2X1MM, NONE, R/TP,Inductor, Wire Wound, Chip FDK CORPORATION.
6 U103 IC, RF Amplifier EUSY0365401BGA711L7 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP7P - INFINEON TECHNOLOGIES (ASIA PACIFIC) PTELTD.
6 C1114 Capacitor,Ceramic, Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 247 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 R107 Resistor, Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP -ROHM.
6 R812 Resistor, Chip ERHY0009504 MCR006YZPJ102 1KOHM 5% 1/20W 0603 R/TP -ROHM.
6 Q301 FET EQFP0003601NTJD4105CT1G P-CHANNEL MOSFET 20V +-12660mA 0.63OHM 270mW SC70 R/TP 6P ONSEMICONDUCTOR
6 U602 IC, Gate EUSY0428401 XSON6 , 6 , R/TP , OR Gate , ; , IC, TTL
6 R821 Resistor, Chip ERHZ0000537 MCR01MZP5F6803 680KOHM 1% 1/16W 1005 R/TP -ROHM.
6 CN801 Connector,Terminal Block ENZY0029901
04-9254-003-032-829+ 3, 2.5 mm, ANGLE, Gold, TwinSide PCB cut 3.2 KYOCERA ELCO KOREA SALES CO.,LTD.
6 R803 Resistor, Chip ERHY0042405 RC0201FR-074K02L 4.02KOHM 1% 1/20W 0603 R/TP -YAGEO CORPORATION
6 R707 Resistor, Chip ERHZ0000250 MCR01MZP5F2400 240OHM 1% 1/16W 1005 R/TP -ROHM.
6 L408 Inductor,Multilayer, Chip ELCH0003835
LQG15HS4N7S02D 4.7NH 0.3NH - 300mA 0.18OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6 R525 Resistor, Chip ERHY0009541 MCR006YZPF4700 470OHM 1% 1/20W 0603 R/TP -ROHM.
6 R522 Resistor, Chip ERHZ0000203 MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP -ROHM.
6 R710 Resistor, Chip ERHY0024601 RC0603J151CS 150OHM 5% 1/20W 0603 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 U1401 Module, WLAN SMZY0025001 SWB-B25 2.3VTO5.5V LGA 62P 9.0x7.8x1.2MMSAMSUNG ELECTRO-MECHANICS CO., LTD.
6 FB701 Filter, Bead SFBH0009302 MMZ1005Y400CT 40 ohm 1.0X0.5X0.5 25% 0.12 ohm0.55A SMD R/TP 2P 0 TDK CORPORATION
6 VA1102,VA801 Varistor SEVY0008102 EVLC5S01015 5.5V 0% 15pF 0.6*0.3*0.33 NONE SMD
R/TP AMOTECH CO., LTD.
6 SW101 connector, RF ENWY0005501 20279-001E-01 NONE STRAIGHT SOCKET SMD R/TPAU 50OHM 400mDB I-PEX CO., LTD
6 C521 Capacitor,Ceramic, Chip ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 D802 Diode, Switching EAH61532901 BA891_ 1V 35V - - 0SEC 715mW SOD523 R/TP 2P 1NXP Semiconductors
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 248 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 U302IC, DigitalBasebandProcessor, 3G
EAN61857702
MDM6200-U 0VTO0V, 0VTO0V, 0VTO0V 0W 486 NSP,6200 Die Revision, Slim Modem, 12.2x9.8, DPA14.4,int.RF, USB2.0HS BGA R/TP 486P QUALCOMMINCORPORATED.
6 FB1201,FB1202 Filter, Bead EAM62131201
CIM05J121NC 120 ohm 1.0X0.5X0.5 25% 0.3 ohm 0.5ASMD R/TP 2P 0 SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 R1216 Resistor, Chip ERHZ0000243 MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP -ROHM.
6 C141,C848
Capacitor,Ceramic, Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6
C1005,C1010,C1112,C1404,C1411,C514,C802,C806,C807,C819,C865,C868
Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C
1005 R/TP - TDK KOREA COOPERATION
6R626,R705,R706
Resistor, Chip ERHY0000104 MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP -ROHM.
6
C122,C131,C140,C151,C522,C524,C526,C528
Capacitor,Ceramic, Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 C106 Capacitor,Ceramic, Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 249 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C1006,C1007,C1008,C1011,C1104,C1105,C1106,C1109,C1110,C1113,C1310,C1311,C1413,C1414,C1415,C1419,C426,C438,C505,C701,C702,C703,C706,C711,C713,C714,C716,C717,C718,C719,C720,C722,C723,C724
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 250 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C729,C730,C733,C734,C736,C738,C740,C741,C745,C746,C747,C748,C749,C750,C751,C752,C753,C756,C757,C758,C759,C761,C762,C763,C766,C771,C772,C814,C820,C822,C824,C825
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
6
C831,C832,C833,C834,C843,C847,C908,C909
Capacitor,Ceramic, Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -
55TO+85C 0603 R/TP - TDK CORPORATION
6
R604,R607,R645,R651,R714
Resistor, Chip ERHY0009536 MCR006YZPF1003 100KOHM 1% 1/20W 0603 R/TP -ROHM.
6R1331,R1332,R813
PCB ASSY,MAIN, PADSHORT
SAFP0000401 LG-LU3000 LGTBK, MAIN, A,
6 FL202 Filter, Saw SFSY0028101 SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5PMURATA MANUFACTURING CO., LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 251 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6R1310,R316,R317
Resistor, Chip ERHY0009516 MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP -ROHM.
6
L101,L118,L125,L215,L221
Inductor,Multilayer, Chip ELCH0004701
1005GC2T12NJLF 12NH 5% - 250mA 0.48OHM 2.1GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 L214,L216
Inductor,Multilayer, Chip ELCH0001049
1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 R819 Resistor, Chip ERHY0009558 MCR006YZPF6802 68KOHM 1% 1/20W 0603 R/TP -ROHM.
6 C227 Capacitor,Ceramic, Chip ECZH0000816 C1005C0G1H120JT000F 12pF 5% 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 C147 Capacitor,Ceramic, Chip ECZH0001002 C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 R622,R625 Resistor, Chip ERHY0009302 MCR006YZPF1001 1KOHM 1% 1/20W 0603 R/TP -
ROHM.
6 C405 Capacitor, TA,Conformal ECTH0007201
TLJR476M010R3200 0.000047F 20% 10V 18.8UA -55TO+125C 3.2OHM 2.05X1.3X1.2MM NONE SMDR/TP AVX/KYOCERA H.K LTD.
6 L124 Inductor,Multilayer, Chip ELCH0004704
1005GC2T4N7SLF 4.7NH 0.3NH - 300mA 0.23OHM3.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
6
R615,R616,R617,R618,R619
Resistor, Chip ERHY0009527 MCR006YZPJ473 47KOHM 5% 1/20W 0603 R/TP -ROHM.
6
R301,R523,R602,R634,R639,R640,R641,R642,R644,R716,R718,R805,R911
Resistor, Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP -ROHM.
6 C201,C202
Capacitor,Ceramic, Chip ECCH0000137 C1005X7R1H331KT000F 0.33nF 10% 50V X7R -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 252 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C1030,C1031,C1201,C501,C535,C536,C542,C769,C770,C811,C829,C846,C854,C858
Capacitor,Ceramic, Chip ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6C406,C409,C416
Capacitor,Ceramic, Chip ECCH0009201
GRM033R60J473KE19D 47nF 10% 6.3V X5R -55TO+85C 0603 R/TP - MURATA MANUFACTURINGCO., LTD.
6
C1009,C404,C818,C859,C860,C861,C862,C863,C864,C866,C867
Capacitor,Ceramic, Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005
R/TP - MURATA MANUFACTURING CO., LTD.
6 C1111,C810
Capacitor,Ceramic, Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608
R/TP - MURATA MANUFACTURING CO., LTD.
6 U1002 IC, DC, DCConverter EUSY0264502
AAT1270IFO-T1 AAT1270IFO-T1, DFN, 14 PIN, R/TP,700mA Boost converter Advanced Analogic TechnologiesHK Limited
6 L401 Inductor,Multilayer, Chip ELCH0001431 LL1005-FHL68NJ 68NH 5% - 180mA 1.7OHM 1.3GHZ
10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6
R501,R504,R635,R646,R717,R818
PCB ASSY,MAIN, PADOPEN
SAFO0000401 AX3100 ATL SV_SHIPBACK, MAIN, A, 0OHM DNI
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 253 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
R1103,R1105,R1106,R514,R631,R632,R636,R637,R638,R655,R656,R657,R701,R702
Resistor, Chip ERHY0009505 MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -ROHM.
6 U202 IC, PowerAmplifier SMPY0023601
SKY77703-12 28.4 dBm, 40 %, 10 A, -40 dBc, 27 dB,3.0*3.0*1.0, SMD, AWS, WBAND 4, LBAND 4, CPL, 3MODE, 3.2V~4.2V, 28.4dBm, 1, SMD, R/TP, 10SKYWORKS SOLUTIONS INC.
6 FL104 Filter, Saw SFSY0033401 B9415 1575.42 1.4*1.1*0.4 SMD R/TP 5P EPCOS PTELTD.
6 C839 Capacitor, TA,Conformal ECTH0005203 TCTP1A336M8R , [empty] , [empty] , , [empty] , , [empty] ,
[empty] , [empty] , [empty] ROHM.
6 CN701 Contact MCIZ0008201 COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,BeCu, , 3.0, 1.5, 1.5,
6 C1306 Capacitor,Ceramic, Chip ECCH0005603 GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
6 R710 Resistor, Chip ERHY0024601 RC0603J151CS 150OHM 5% 1/20W 0603 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 Q701 FET EQFN0002901 2SK3019FPBTL N-CHANNEL MOSFET 30V +-20100mA 8OHM 150mW SC75A R/TP 3P ROHM.
6 U1304 IC, Motor Driver EUSY0238306 ISA1000 2.4~3.6V 150mV~300mV 0W DFN R/TP 8P -
6C430,C431,C519
Capacitor,Ceramic, Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6 C115,C116
Capacitor,Ceramic, Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 U301 IC, MCP, NAND EUSY0425901H8BCS0QG0MMR-46M NAND/1G SDRAM/512M0VTO0V 8.0x9.0x1.0 TR 130P NAND+DRAM BGA -HYNIX SEMICONDUCTOR INC.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 254 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6
C1408,C428,C429,C546,C849,C850,C851,C852,C853,C856,C857
Capacitor,Ceramic, Chip ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6L102,L205,L403
Inductor,Multilayer, Chip ELCH0001048
1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM 2.5GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 C1114 Capacitor,Ceramic, Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 Q1201 FET EQFP0011401
SI1467DH-T1-GE3 SOT-363, 1.5 W, 20 V, 3 A, R/TP, P-CHANNEL, MOSFET, 20V, 8V, 3A, 0.15ohm, 1.5W,SOT363, R/TP, 6P VISHAY INTERTECHNOLOGY ASIAPTE LTD
6 C1115,C139
Capacitor,Ceramic, Chip ECCH0000110
MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 L405 Inductor,Multilayer, Chip ELCH0004722
1005GC2T47NJLF 47NH 5% - 200mA 1.3OHM 1GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 L201 Inductor,Multilayer, Chip ELCH0003847
LQG15HS1N8S02D 1.8NH 0.3NH - 300mA 0.1OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6 R811 Resistor, Chip ERHY0009507 MCR006YZPJ105 1MOHM 5% 1/20W 0603 R/TP -ROHM.
6 Q502 FET EQFN0005601 KTK5132E N-CHANNEL MOSFET 30V +-20 100mA7OHM 100mW ESM R/TP 3P KEC CORPORAITION
6 C1116 Capacitor,Ceramic, Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6
R1011,R621,R628,R629,R649,R650,R653,R654
Resistor, Chip ERHY0009526 MCR006YZPJ472 4.7KOHM 5% 1/20W 0603 R/TP -ROHM.
6
C119,C204,C245,C246
Capacitor,Ceramic, Chip ECZH0000846 C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 255 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 C109,C1101
Capacitor,Ceramic, Chip ECZH0025917 GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 U1003 IC, Sub PMIC EUSY0336503 AAT2870IUW-T1 CSP , 35 , R/TP , 3.1x2.6 , ; , IC, SubPMIC Advanced Analogic Technologies HK Limited
6 C110 Capacitor,Ceramic, Chip ECZH0025908 GRM0335C1E8R0D 8pF 0.5PF 25V C0G -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 L103 Inductor,Multilayer, Chip ELCH0012510
LQW15AN15NG00D 15NH 2% - 460mA 0.16OHM 5GHZ30 NON SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6 VA1101 Varistor SEVY0001001 EVLC14S02050 14V 0% 50F 1.0*0.5*0.6 NONE SMDR/TP AMOTECH CO., LTD.
6L203,L219,L222
Inductor,Multilayer, Chip ELCH0001056
1005GC2T2N7SLF 2.7NH 0.3NH - 300mA 0.17OHM5.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
6 C520,C545
Capacitor,Ceramic, Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C
1005 R/TP - TDK CORPORATION
6 C521 Capacitor,Ceramic, Chip ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 L226 Inductor,Multilayer, Chip ELCH0005015
HK1005 6N8J 6.8NH 5% - 300mA 0.25OHM 3.9GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6C130,C146,C209
Capacitor,Ceramic, Chip ECZH0000802 C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C
1005 R/TP - TDK KOREA COOPERATION
6 L107 Inductor,Multilayer, Chip ELCH0004711
1005GC2T22NJLF 22NH 5% - 200mA 0.8OHM 1.5GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 C427 Capacitor,Ceramic, Chip ECCH0009102 C0603X7R1H221KT 220pF 10% 50V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6 IC1301 IC, Analog Switch EAN61871401FSUSB63 2.7~4.3V 400NSEC 45NSEC 0W MLP R/TP12P 1 FAIRCHILD SEMICONDUCTOR HONG KONGLTD.
6 R916 Resistor, Chip ERHZ0000205 MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP -ROHM.
6 R1213,R1214 Resistor, Chip ERHY0009539 MCR006YZPF20R0 20OHM 1% 1/20W 0603 R/TP -
ROHM.
6 U901 IC, MCP, NAND EUSY0413602 THGBM2G6D2FBAI9 8Gbyte 0VTO0V 12.0x16.0x1.2 TR169P MLC NAND BGA - TOSHIBA
6 C107 Capacitor,Ceramic, Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 256 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 FL203 Filter, Duplexer,IMT SDMY0003901
B7699 1732.5 MHz, 2132.5 MHz, 1.8 dB, 2.5 dB, 52 dB,45 dB, 2.5*2.0*0.89, SMD, Band4, SAW, Rx unbalance,2132.5, 2112.4 to 2152.6, 1732.5, 1712.4 to 1752.6, 2.5,1.8, 2.5x2.0x0.89, DUAL, SMD, R/TP EPCOS PTE LTD.
6 R1005 Resistor, Chip ERHZ0000439 MCR01MZP5J204 200KOHM 5% 1/16W 1005 R/TP -ROHM.
6 R522 Resistor, Chip ERHZ0000203 MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP -ROHM.
6D1100,D1101,D901
Diode, TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEKDEVICES INC.
6 U101 IC, PowerAmplifier SMPY0022501
ACPM-7868-TR1 3.0V~4.8V None None 0W 0W None 4SMD R/TP 16P QCT Linear EDGE, 5.0*5.0*1.1 AVAGOTECHNOLOGIES INTERNATIONAL SALES PTE.LIMITED
6 R203,R204 Resistor, Chip ERHZ0000415 MCR01MZP5J131 130OHM 5% 1/16W 1005 R/TP -
ROHM.
6 FL1009 Filter, EMI/Power SFEY0016301 ICMEF112P900M COMMON MODE NOISE FILTER 0HZ0F 0H SMD R/TP INNOCHIPS TECHNOLOGY
6 FL101 Filter, Separator SFAY0013601D5024 1.15 35 35 GSM Quad, UMTS Triple, 1.15 dB, 1.5dB, 40 dB, 40 dB, 4532, GSM LB HB Diplexing, FEMEPCOS PTE LTD.
6C530,C531,C837
Capacitor,Ceramic, Chip ECCH0009514 MCH032A(AN)100DK 10pF 0.5PF 25V X7R -
55TO+125C 0603 R/TP - ROHM.
6 U902 IC, DC, DCConverter EUSY0264505
AAT1217ICA-1.2-T1 SOT, 6, R/TP, Step up DCDC, IC,DC, DC ConverterIC, DC, DC Converter AdvancedAnalogic Technologies HK Limited
6 L402,L404
Inductor,Multilayer, Chip ELCH0004112 LLV0603-FH4N7S 4.7NH 0.3NH - 250mA 0.3OHM 4GHZ
5.5 SHIELD NONE 0.6X0.3X0.3MM R/TP TOKO, INC.
6 U103 IC, RF Amplifier EUSY0365401BGA711L7 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP7P - INFINEON TECHNOLOGIES (ASIA PACIFIC) PTELTD.
6 R817 Wire Pad, Open SAFO0000501 AX3100 ATL SV_SHIPBACK, MAIN, A,0OHM_1005_DNI
6 C112 Capacitor,Ceramic, Chip ECCH0009230 GRM033R61A222K 2.2nF 10% 25V X5R -55TO+85C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 L408 Inductor,Multilayer, Chip ELCH0003835
LQG15HS4N7S02D 4.7NH 0.3NH - 300mA 0.18OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6 C101,C104
Capacitor,Ceramic, Chip ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 257 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 L220 Inductor,Multilayer, Chip ELCH0004707
1005GC2T1N5SLF 1.5NH 0.3NH - 300mA 0.13OHM7GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 L108 Inductor,Multilayer, Chip ELCH0003820
LQG15HS3N0S02D 3NH 0.3NH - 300mA 0.17OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6 L210 Inductor,Multilayer, Chip ELCH0005003
HK1005 12NJ 12NH 5% - 300mA 0.4OHM 2.7GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6
C101,C104,C117,C144,C145
Capacitor,Ceramic, Chip ECCH0000901 C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 C208 Capacitor,Ceramic, Chip ECCH0000175 GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C
1005 R/TP - MURATA MANUFACTURING CO., LTD.
6 U1301 IC, MUIC EUSY0405401 MAX14526DEEWP MUIC , ; , IC, Analog Multiplexer CSPR/TP 20P MAXIM INTEGRATED PRODUCTS INC.
6 C221,C222
Capacitor,Ceramic, Chip ECCH0005602 GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
6 L119,L218
Inductor,Multilayer, Chip ELCH0001054
1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
6 L129 Inductor,Multilayer, Chip ELCH0004108
LLV0603-FH2N2S 2.2NH 0.3NH - 250mA 0.2OHM8.5GHZ 5 SHIELD NONE 0.6X0.3X0.3MM R/TP TOKO,INC.
6 C830 Capacitor,Ceramic, Chip ECCH0032801
GRM033R60J224M 0.00000022F 20% 6.3V X5R -55TO+85C 0603 R/TP 0.3MM MURATAMANUFACTURING CO., LTD.
6
C1409,C1412,C510,C511,C512,C513,C515,C516,C517,C518,C801,C805,C821
Capacitor,Ceramic, Chip ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
6 R303 Resistor, Chip ERHY0035301 RC1005F4021CS 4.02KOHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 258 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 L225 Inductor,Multilayer, Chip ELCH0003815
LQG15HS2N7S02D 2.7NH 0.3NH - 300mA 0.15OHM6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6 L112 Inductor,Multilayer, Chip ELCH0009120
0402CS-4N3XJEW 4.3NH 5% - 700mA 0.091OHM 6GHZ18 NON SHIELD NONE 1.19X0.64X0.66MM R/TPCOILCRAFT SINGAPORE PTE LTD.
6 U102 IC, RF Amplifier EUSY0400201ALM-2506 , 6, R/TP, ALM-1106 GPS LNA H/F version,IC, GPSIC, GPS AVAGO TECHNOLOGIESINTERNATIONAL SALES PTE. LIMITED
6R1016,R712,R713
Resistor, Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP -ROHM.
6 L1301,L1302
Inductor,Multilayer, Chip ELCH0004727
1005GC2TR10JLF 100NH 5% - 100mA 2.3OHM600MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPPILKOR ELECTRONICS LTD.
6 C1103 Capacitor,Ceramic, Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C
0603 R/TP - MURATA MANUFACTURING CO., LTD.
6 L901 Inductor, WireWound, Chip ELCP0008019
VLS252010ET- 4R7M 4.7UH 20% - 800mA 0.332OHM - -NON SHIELD 2.5X2X1MM NONE - TDKCORPORATION
6 FL102 Filter, Saw SFSY0028201 SAFEB2G14FB0F00 - - - - 2P MURATAMANUFACTURING CO., LTD.
6 FL204 Filter, Saw SFSY0034401
SAFEA1G73AA0F00 SAFEA1G73AA0F00, 1732.5 MHz,1.4*1.1*0.5, SMD, 1710M~1755M, IL 2.6, 6pin, U-U, 50-50, AWS_WCDMA BAND IV Tx MURATAMANUFACTURING CO., LTD.
6 R112 Resistor, Chip ERHY0009540 MCR006YZPF2702 27KOHM 1% 1/20W 0603 R/TP -ROHM.
6 R102 Resistor, Chip ERHZ0000286 MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP -ROHM.
6 L127,L224
Inductor,Multilayer, Chip ELCH0005020
HK1005 1N0S 1NH 0.3NH - 300mA 0.08OHM 10GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6 L1001 Inductor,Multilayer, Chip ELCH0010401
LK1005 2R2K-T 2.2UH 10% - 20mA 1.15OHM 40MHZ 20SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6 C1316 Capacitor,Ceramic, Chip ECCH0000147 MCH155CN222KK 2.2nF 10% 50V X7R -55TO+125C
1005 R/TP - ROHM.
6 C1226 Capacitor,Ceramic, Chip ECCH0000129 MCH155A121JK 120pF 5% 50V NP0 -55TO+125C 1005
R/TP - ROHM Semiconductor KOREA CORPORATION
6 C136 Capacitor,Ceramic, Chip ECCH0001001 C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 259 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 R305 Resistor, Chip ERHY0042406 RC0201JR-0751KL 51KOHM 5% 1/20W 0603 R/TP -YAGEO CORPORATION
6 L128 Inductor,Multilayer, Chip ELCH0001057
1005GC2T3N9SLF 3.9NH 0.3NH - 300mA 0.22OHM4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 C446 Capacitor,Ceramic, Chip ECCH0000145
MCH155CN152KK 1.5nF 10% 50V X7R -55TO+125C1005 R/TP - ROHM Semiconductor KOREACORPORATION
6 C840 Capacitor, TA,Conformal ECTH0002703 TCTAL1A107M8R 0.0001F 20% 10V 50UA -55TO+125C
0OHM 3.2x1.6x1.1 NONE SMD R/TP ROHM CO., LTD.
6 U1302 IC, Charger EUSY0410801RT9524 DFN, 10, R/TP, DFN Cal Test Mode SingleCharger IC for Micro USB, IC, ChargerIC, ChargerRICHTEK TECHNOLOGY CORP.
6 C407 Capacitor,Ceramic, Chip ECCH0009110 C0603X7R0J223KT 22nF 10% 6.3V X7R -55TO+125C
0603 R/TP - TDK CORPORATION
6 L109 Inductor,Multilayer, Chip ELCH0003814
LQG15HS5N1S02D 5.1NH 0.3NH - 300mA 0.2OHM5.3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO., LTD.
6 D801 Diode, Switching EDSY0018101 RB521CS-30GJT2R 350mV 30V 100mA 0A 0SEC200mW VMN2 R/TP 2P 1 ROHM.
6 R1312 Resistor, Chip ERHZ0000294 MCR01MZP5F5101 5.1KOHM 1% 1/16W 1005 R/TP -ROHM.
6 L211 Inductor,Multilayer, Chip ELCH0005001
HK1005 2N2S 2.2NH 0.3NH - 300mA 0.13OHM 6GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDENCO., LTD
6 L105 Inductor,Multilayer, Chip ELCH0004710
1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
6 R1311 Resistor, Chip ERHZ0000298 MCR01MZP5F5600 560OHM 1% 1/16W 1005 R/TP -ROHM.
6 R202 Resistor, Chip ERHY0008206 RC1005F430CS 43OHM 1% 1/16W 1005 R/TP -SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 R918 Resistor, Chip ERHZ0000467 MCR01MZP5J334 330KOHM 5% 1/16W 1005 R/TP -ROHM.
6 C203 Capacitor,Ceramic, Chip ECZH0001421 C1608X5R0J225KT000N 2.2uF 10% 6.3V X5R -
55TO+85C 1608 R/TP - TDK KOREA COOPERATION
6 L1002 Inductor, WireWound, chip ELCP0008008 MIPS2520D1R0M MIPS2520D1R0M, 1 uH, M,
2.0x2.5x1.0, R/TP, MLCI FDK CORPORATION.
6 U1306 IC, Gyro Sensor EUSY0434601 MPU3050 1.8~3.6 Gyro Sensor - QFN R/TP 24P -INVENSENSE
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 260 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 C1023 Capacitor,Ceramic, Chip ECCH0000163 C1005X5R473KDT 47nF 10% 10V X5R -55TO+85C
1005 R/TP - NEOTECH CO., LTD
6 U204 IC, Gate EUSY0227901 TC7SH08FS TC7SH08FS, SON5-P-0.35(fSV) , 5 PIN,R/TP , 2-INPUT AND GATE TOSHIBA
6 FL205 Filter, Saw SFSY0030001 SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5PMURATA MANUFACTURING CO., LTD.
6 U1303 IC, Fuel Gauge EUSY0242303MAX17040G DFN, 8, R/TP, Fuel gauge, IC, CMOSIC,CMOS - - DFN R/TP 8P - MAXIM INTEGRATEDPRODUCTS INC.
6 L126 Inductor,Multilayer, Chip ELCH0003844
LQG15HS2N0S02D 2NH 0.3NH - 300mA 0.1OHM 6GHZ8 SHIELD NONE 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO., LTD.
6 Q703 FET EQFP0011201NTLJS2103P-D WDFN6, 1.9 W, -12 V, -5.9 A, R/TP, P-CHANNEL, MOSFET, -12 V, +-8 V, -4.2 A, 1.9 W, SC88,R/TP, 6P ON SEMICONDUCTOR
6 U1201 IC, Audio Codec EUSY0415201 WM8994 0.95~5.5V 0W WLCSP R/TP 72P - WOLFSONMICROELECTRONICS PLC
6 U1001 IC, MM PMIC EUSY0227205LP8720TLX 2.7 To 5.5V Adj 1.2W CSP R/TP 20P -NATIONAL SEMICONDUCTOR ASIA PACIFIC PTE.LTD.
6 C235,C239
Capacitor,Ceramic, Chip ECCH0000185
GRM1555C1H5R6C 5.6pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.
6 U201 IC, PowerAmplifier SMPY0020702
ACPM-5201-LR1 dBm, %, A, dBc, dB, 3.0*3.0*1.1, SMD,WBAND 1, CPL, 3 MODE, BYPASS CLAMPING, SMD,R/TP, AVAGO TECHNOLOGIES INTERNATIONALSALES PTE. LIMITED
6 FL103 Filter, Saw SFSY0033402 B9417 1575.42 1.4*1.1*0.4 SMD R/TP 5P EPCOS PTELTD.
6 C306 Capacitor,Ceramic, Chip ECZH0000803 C1005C0G1H020CT000F 2pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA COOPERATION
6 L110 Inductor,Multilayer, Chip ELCH0003836
LQG15HS5N6S02D 5.6NH 0.3NH - 300mA 0.2OHM4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TPMURATA MANUFACTURING CO., LTD.
6 C732 Capacitor,Ceramic, Chip ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,LTD.
6 U1307 IC, AccelerationSensor EUSY0410101
KXTF9 1.8V to 3.6V 400KHZ 12BIT 1SPS 1W LGA R/TP10P Accelerometer Sensor - LGA R/TP 10P - KIONIX,INC.
6 FL206 Filter, Saw SFSY0035001 B9411 2140 1.4*1.1*0.45 SMD R/TP - EPCOS PTE LTD.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 261 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
6 L106 Inductor,Multilayer, Chip ELCH0001430 LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM 1.03GHZ
10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.
6 FL201 Filter, Duplexer,IMT SDMY0002601
B7696 2140000000 2112.4 to 2167.6 19500000001922.4 to 1977.6 2.6 1.9 2.5x2.0x0.89 DUAL SMD R/TP -EPCOS PTE LTD.
6 L204 Inductor,Multilayer, Chip ELCH0004712
1005GC2T3N9SLF 3.9NH 0.3NH - 300mA 0.22OHM4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
7
LD101,LD102,LD103,LD104
LED, Chip EDLH001510799-218UMC/2229397/TR8 WHITE 2.95~3.25 30mA1200~1600mcd x, y 110mW - R/TP 2P - EVERLIGHTELECTRONICS CO., LTD.
7 VA101,VA102 Varistor SEVY0004401 ICVL0518400V500FR 18V 0% 40pF 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
7 L101,L102
Inductor,Multilayer, Chip ELCH0005824
CIH05T82NJNC 82NH 5% 0V 100mA - - 1.6OHM600MHZ 8 NON SHIELD 1 1.0X0.5X0.5MM R/TPSAMSUNG ELECTRO-MECHANICS CO., LTD.
7 FL102 Filter, EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TPMURATA MANUFACTURING CO., LTD.
7 CN1102 Connector, BtoB ENBY0034101 GB042-24P-H10-E3000 24P 0.40MM STRAIGHT PLUGSMD R/TP 1M - LS Mtron Ltd.
7 C1111,C810
Capacitor,Ceramic, Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608
R/TP - MURATA MANUFACTURING CO., LTD.
7 ANT101,ANT102 Contact MCIZ0000701 COMPLEX L-01B NTTEW ZZ:Without Color -
7 FL1009 Filter, EMI/Power SFEY0016301 ICMEF112P900M COMMON MODE NOISE FILTER 0HZ0F 0H SMD R/TP INNOCHIPS TECHNOLOGY
7 C104 Capacitor,Ceramic, Chip ECZH0003504 GRM188R71E104K 100nF 10% 25V X7R -55TO+125C
1608 R/TP - MURATA MANUFACTURING CO., LTD.
7 L103 Inductor,Multilayer, Chip ELCH0004715
1005GC2T27NJLF 27NH 5% - 200mA 0.9OHM 1.4GHZ 8SHIELD NONE 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.
7 SW101 connector, RF ENWY0005501 20279-001E-01 NONE STRAIGHT SOCKET SMD R/TPAU 50OHM 400mDB I-PEX CO., LTD
7 VA101,VA102 Varistor SEVY0004401 ICVL0518400V500FR 18V 0% 40pF 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
7 CN104 Connector, I/O ENRY001100120-5151-005-102-883 5P 0.65MM ANGLERECEPTACLE DIP R/TP - KYOCERA ELCO KOREASALES CO., LTD.
7 R101 Resistor, Chip ERHZ0000240 MCR01MZP5F20R0 20OHM 1% 1/16W 1005 R/TP -ROHM.
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 262 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 VA101,VA102 Varistor SEVY0004401 ICVL0518400V500FR 18V 0% 40pF 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
7
C1009,C404,C818,C859,C860,C861,C862,C863,C864,C866,C867
Capacitor,Ceramic, Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005
R/TP - MURATA MANUFACTURING CO., LTD.
7 R102 Resistor, Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -ROHM.
7 C106 Capacitor,Ceramic, Chip ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICSCO., LTD.
7 U101 IC, Proximity EUSY0376201 GP2AP002S00F GP2AP002S00F, 8, R/TP SHARPCORPORATION.
7CN1001,CN1002,CN1103
Connector, BtoB ENBY0034201 GB042-24S-H10-E3000 24P 0.40MM STRAIGHTSOCKET SMD R/TP 1M - LS Mtron Ltd.
7
C1005,C1010,C1112,C1404,C1411,C514,C802,C806,C807,C819,C865,C868
Capacitor,Ceramic, Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C
1005 R/TP - TDK KOREA COOPERATION
7
C815,C816,C817,C823
Capacitor,Ceramic, Chip ECCH0005604
GRM188R60J106M 10000000 pF, 6.3V, M, X5R, TC,1608, R/TP, 0.8 mm MURATA MANUFACTURING CO.,LTD.
7 C107 Capacitor,Ceramic, Chip ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C 1005 R/TP - MURATA MANUFACTURINGCO., LTD.
7 U102 IC, Ambient LightSensor EUSY0388201
BH1621FVC BH1621FVC, WSOF6, 5, R/TP, 1.6*1.6 -WSOF6 R/TP 5P - ROHM Semiconductor KOREACORPORATION
7 J101 Jack, Phone ENJE0007602 EJ56-35R-4PBA-6S 1P 4P ANGLE R/TP 4mM BLACK6P - HIROSE KOREA CO., LTD
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 263 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
Level Location No. Description PartNumber Spec Remark
7 D103 Diode, TVS EDTY0009201 Rclamp0504P.TCT 5V 7.82 0V 0A 10W TFSC R/TP 2P 1SEMTECH CORPORATION
12. EXPLODED VIEW & REPLACEMENT PART LIST
- 264 - Copyright © 2011 LG Electronics. Inc. All right reserved.Only for training and service purposes
LGE Internal Use Only
by SBOM standard on GCSC
Level Location No. Description PartNumber Spec Remark
2 SBPL00RechargeableBattery,Lithium Ion
SBPL0103001FL-53HN-TCD 3.7 V, 1500 mAh, 1 CELL, PRISMATIC,534553, Frame Type Innerpack, WW, PRISMATIC,BLACK, TOCAD DONG-HWA CO., LTD
R, 21
2 EAN011400 IC, Memory Card,SD EUSY0345808
TM9073 0.029 0VTO0V, 0VTO0V, 0VTO0V MICRO SDCARD 80.0x50.0x5.0MM R/TP 0P - LG ELECTRONICSINC.
2 AFN053800 Manual Assembly,Operation AFN75432401 LGP999DW.ATMODW ZZ:Without Color -
3 MBM062600 Card, QuickReference MBM63357401 COMPLEX LGP999DW.ATMODW ZZ:Without Color -
3 MBM087200 Card, Warranty MBM63198202 COMPLEX LGP999DW.ATMODW ZZ:Without ColorWarranty for LGP999DW TMO
3 MBM068900 CARD, SERVICEGUIDE MCDE0008401 GD570 TMOAQ AQ, ZZ, PRINTING, (empty), , , , ,
3 MEA000000 GUIDE MGDZ0002301 GS505 TMO ZY, ZZ, PRINTING, (empty), , , , ,
2 EAY060000 Adapters SSAD0033802STA-U13WV 90Vac~264Vac 5.1V 1A 5060 UL/CSANONE NONE - Power Systems Technologies Far EastLtd
2 EBX000000 Accessory,Data Cable SGDY0017903 LG0040 , 1.2M, Micro USB, BLACK, ningbo broad
telecommunication co., ltd
12.3 Accessory Note: This Chapter is used for reference, Part order is ordered