LG P500H Service Manual

Service Manual

Model : LG

-P500h

Internal Use Only

Service ManualLG-P500h

Date: October, 2010 / Issue 1.0

- � -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

LGE Internal Use Only

Table Of Contents

1. INTRODUCTION ..................................................................5

1.1 Purpose ............................................................................................... 5

1.2 Regulatory Information ............................................................... 5

1.� Abbreviations ................................................................................... 7

2. PERFORMANCE ...................................................................9

2.1 Product Name .................................................................................. 9

2.2 Supporting Standard .................................................................... 9

2.� Main Parts : GSM Solution ........................................................... 9

2.4 HW Features ....................................................................................10

2.5 SW Features ....................................................................................12

2.6 HW SPEC. .........................................................................................14

3. TECHNICAL BRIEF .............................................................22

�.1 GENERAL DESCRIPTION .............................................................22

�.2 GSM MODE ......................................................................................24

�.� UMTS MODE ...................................................................................26

�.4 GPS RECEIVER .................................................................................29

�.5 LO GENERATION and DISTRIBUTION CIRCUIT ...................29

�.6 OFF-CHIP RF COMPONENTS ....................................................29

�.7 Digital Baseband(DBB/MSM7227) .........................................�5

�.8 Hardware Architecture ...............................................................�6

�.9 Subsystem (MSM7227)...............................................................�8

�.10 Power Block ..................................................................................41

�.11 External memory interface ....................................................46

�.12 H/W Sub System .........................................................................47

�.1� Audio and sound ........................................................................54

�.14 Display ............................................................................................60

�.15 Proximity Sensor ........................................................................62

�.16 Vibrators (Q-Coin Motor) .........................................................6�

�.17 Compass Sensor .........................................................................64

�.18 Motion Sensor .............................................................................66

�.19 Main Features ..............................................................................67

4. TROUBLE SHOOTING .......................................................75

4.1 RF Component...............................................................................75

4.2 SIGNAL PATH ..................................................................................77

4.� Checking TCXO Block ..................................................................80

4.4 Checking GSM TX Module(GSM PAM + FEM) Block .......82

4.5 Checking WCDMA Block ............................................................85

4.6 Checking GSM Block ...................................................................97

4.7 GPS/WIFI/BT RF Component ................................................. 105

4.8 GPS/WIFI/BT SIGNAL PATH ..................................................... 107

4.9 GPS/WIFI/BT Trouble shooting ............................................. 109

4.10 Power ON Troubleshooting ................................................ 117

4.11 Charging Trouble shooting ................................................. 120

4. 12 �M AF Camera trouble ......................................................... 122

4. 1� Main LCD trouble ................................................................... 125

4.14 Proximity Sensor on/off trouble ....................................... 127

4.15 Motion Sensor on/off trouble ............................................ 129

4.16 Compass Sensor on/off trouble ........................................ 1�1

4.17 Q coin Motor ............................................................................. 1��

5. DOWNLOAD ................................................................... 136

6. BLOCK DIAGRAM ........................................................... 149

7. CIRCUIT DIAGRAM ........................................................ 155

8. BGA Pin Map .................................................................. 163

9. PCB LAYOUT ................................................................... 167

10. RF CALIBRATION ......................................................... 171

10.1 Configuration of Tachyon .................................................... 171

10.2 How to use Tachyon ............................................................... 17�

11. STAND ALONE TEST .................................................... 176

12. EXPLODED VIEW & REPLACEMENT PART LIST ......... 183

12.1 EXPLODED VIEW ...................................................................... 18�

12.2 Replacement Parts.................................................................. 185

12.� Accessory ................................................................................... 204

- 5 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


1. INTRODUCTION

1. INTRODUCTION1. INTRODUCTION

1.1 Purpose

This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information

A. Security

Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your company’s employees, agents, subcontractors, or person working on your company’s behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of common carrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm

If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service

A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations

Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.


1. INTRODUCTION

E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures

The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.

Following information is ESD handling:

• Service personnel should ground themselves by using a wrist strap when exchange system boards. • When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded.

• Use a suitable, grounded soldering iron. • Keep sensitive parts in these protective packages until these are used.

• When returning system boards or parts like EEPROM to the factory, use the protective package as described.



1. INTRODUCTION

6/140

1.3 AbbreviationsFor the purposes of this manual, following abbreviations apply:

Offset Phase Locked LoopOPLL

Light Emitting DiodeLED

Low Drop OutputLDO

Liquid Crystal DisplayLCD

Intermediate FrequencyIF

International Portable User IdentityIPUI

Global System for Mobile CommunicationsGSM

General Purpose Interface BusGPIB

Gaussian Minimum Shift KeyingGMSK

Flexible Printed Circuit BoardFPCB

Electrostatic DischargeESD

Electrical Erasable Programmable Read-Only MemoryEEPROM

Digital Signal ProcessingDSP

dB relative to 1 milli wattdBm

Digital Communication SystemDCS

Digital to Analog ConverterDAC

Constant Current – Constant VoltageCC-CV

Bit Error RatioBER

BasebandBB

Automatic Power ControlAPC

1. INTRODUCTION


1. INTRODUCTION

7/140

Wireless Application ProtocolWAP

Voltage Control Temperature Compensated Crystal OscillatorVCTCXO

Voltage Controlled OscillatorVCO

Universal Asynchronous Receiver/TransmitterUART

Time Division Multiple AccessTDMA

Time Division DuplexTDD

Travel AdapterTA

Side Tone Masking RatingSTMR

Pseudo SRAMPSRAM

Static Random Access MemorySRAM

Sending Loudness RatingSLR

Subscriber Identity ModuleSIM

Surface Acoustic WaveSAW

Real Time ClockRTC

Root Mean SquareRMS

Receiving Loudness RatingRLR

Radio FrequencyRF

Public Switched Telephone NetworkPSTN

Phase Locked LoopPLL

Programmable Gain AmplifierPGA

Printed Circuit BoardPCB

Power Amplifier ModulePAM

1. INTRODUCTION



2. PERFORMANCE

2. PERFORMANCE2. PERFORMANCE 2.1 Product Name

LGP500h : WCDMA850/1900/2100+EGSM/GSM850/DCS/PCS

(HSDPA 7.2Mbps GPRS Class 10 / EDGE Class 10)

2.2 Supporting Standard

Item Feature Comment

Supporting Standard WCDMA(FDD1,2,5)/EGSM/GSM850/DCS1800/PCS1900

with seamless handover

Phase 2+(include AMR)

SIM Toolkit: Class 1, 2, 3, C-E

Frequency Range WCDMA(FDD1) TX : 1920 – 1980 MHz

WCDMA(FDD1) RX : 2110 – 2170 MHz

WCDMA(FDD2) TX : 1850 – 1910 MHz


WCDMA(FDD5) TX : 824 – 849 MHz


EGSM TX: 880 – 915 MHz

EGSM RX: 925 – 960 MHz

GSM850 TX: 824 – 849 MHz

GSM850 RX: 869 – 894 MHz

DCS1800 TX : 1710 – 1785 MHz

DCS1800 RX: 1805 – 1880 MHz

PCS1900 TX: 1850 – 1910 MHz

PCS1900 RX: 1930 – 1990 MHz

Application Standard WAP 2.0

2.3 Main Parts : GSM Solution

Item Part Name Comment

Digital Baseband MSM7227 : Qualcomm

Analog Baseband PM7540 : Qualcomm

RF Chip RTR6285 : Qualcomm


2. PERFORMANCE

2.4 HW Features


Form Factor DOP type

1) Capacity

Standard : Li-Ion polymer, 1500mAh

Battery

2) Packing Type : Soft Pack

Size Standard :

113.5 x 59 x 13.3 mm

Weight 127g With Battery

Volume TBD

PCB L1B1 type, 10 Layers , 0.8t

Stand by time 2G Up to 350 hrs

3G Up to 3500 hrs

@ Paging Period 9 (2G)

@ DRX 7 (3G)

Charging time 3 hrs @ Power Off / 1500mAh

Talk time 2G Up to 250mins

3G Up to 250mins

@ Power Level 5 (2G)

@ Tx = 12dBm (3G)

RX sensitivity

WCDMA(FDD1) : -106.7 dBm WCDMA(FDD2) : -104.7 dBm WCDMA(FDD5) : -104.7 dBm EGSM : -105 dBm GSM850 : -105 dBm DCS 1800 : -105 dBm PCS 1900 : -105 dBm

WCDMA/

GSM/

GPRS

WCDMA : 24dBm/3.84MHz,+1/-3dBm

EGSM : 33dBm

GSM850 : 33 dBm

DCS 1800 : 30 dBm

PCS 1900 : 30 dBm

Class3(WCDMA)

Class4 (EGSM)

Class4 (GSM850)

Class1 (PCS)

Class1 (DCS)

TX

output

power

EDGE

GSM 900 : 27 dBm

DCS 1800 : 26 dBm

PCS 1900 : 26 dBm

E2 (GSM900)

E2 (PCS)

E2 (DCS)

GPRS compatibility GPRS Class 10

EDGE compatibility EDGE Class 10

SIM card type Plug-In SIM

3V /1.8V



2. PERFORMANCE

Display Main LCD

TFT Main LCD(3.2’, 320 x 480)

Built-in Camera 3M CMOS Camera

Status Indicator No

Keypad Function Key : 4

Side Key : 3

Function Key:

Home, Back, Menu, Search

Side Key :

Volume up/down,

Power Key

ANT Main : Internal Fixed Type

System connector 5 Pin

Ear Phone Jack 3.5Phi, 4 Pole, Stereo

PC synchronization Yes

Memory NAND Flash : 4Gbit

SDRAM : 4Gbit

Speech coding FR, EFR, HR,AMR

Data & Fax Built in Data & Fax support

Vibrator Built in Vibrator

Blue Tooth V2.1+ EDR

MIDI(for Buzzer Function) SW Decoded 72Poly

Music Player MP3/ WMA/AAC/HE-AAC/EAAC+

Video Player MPEG4, H.263, WMV9

Camcorder MPEG4, H.263,

Voice Recording Yes

Speaker Phone mode

Support Yes

Travel Adapter Yes

CDROM No

Stereo Headset Yes

Data Cable Yes

T-Flash

(External Memory) Yes


2. PERFORMANCE

2.5 SW Features


RSSI 0 ~ 4 Levels

Battery Charging 0 ~ 6 Levels

Key Volume 0 ~ 7 Level

Audio Volume 1 ~ 15 Level

Time / Date Display Yes

Multi-Language Yes English/French/German/Spanish/Italia

n/Danish/Dutch/Korean

Quick Access Mode Dialing/ Contact / Menu / Message /

Camera

PC Sync No

Speed Dial No Voice mail center -> 1 key

Profile Yes not same with feature phone setting

CLIP / CLIR Yes

Phone Book

Name / Number / Email / Chat Id/

Website/Postal

addresses/Organizations/Groups/

BirthdayNotes / Ringtone

There is no limitation on the number

of items.

It depends on

available memory amount.

Last Dial Number Yes

Last Dial Numbers, Last Received

Numbers and Last Missed Numbers

can store up to a total of 500.

Last Received

Number Yes




Last Missed Number Yes




Search by Number

/ Name Name

Group Yes


of items. It depends on

available memory amount.

Fixed Dial Number Yes

- 1� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


2. PERFORMANCE

Service Dial Number No

Own Number Yes

Read only

(add/edit/delete are not

supported)

Voice Memo Yes

Call Reminder No

Network Selection Automatic

Mute Yes

Call Divert Yes

Call Barring Yes

Call Charge (AoC) Yes

Call Duration Yes

SMS (EMS)

There is no limitation on the

number of items. It depends on

available memory

amount.

EMS does not support.

SMS Over GPRS No

EMS Melody / Picture No

Send / Receive / Save No

MMS MPEG4

Send / Receive / Save Yes

Long Message MAX 459 characters SMS 3pages

Cell Broadcast Yes

Download Over the Web

Game Yes

Calendar Yes

Memo Yes


of items.

It depends on available memory

amount.

World Clock No

Unit Convert No

Stop Watch No

Wall Paper Yes


2. PERFORMANCE

WAP Browser No

Support only web browser based on

webkit. WAP stack and wml are not

supported.

Download Melody /

Wallpaper Yes Over web browser

SIM Lock Yes Operator Dependent

SIM Toolkit Class 1, 2, 3, C

MMS Yes Google MMS Client

EONS Yes

CPHS Yes V4.2

ENS No

Camera Yes 5M AF /

Digital Zoom : x4

JAVA Yes CLDC V1.1 / MIDP V2.1

Download Over Web

Voice Dial No

IrDa No

Bluetooth Yes Ver. 2.1+EDR

(HSP,HFP,A2DP,AVRCP)

FM radio Yes

GPRS Yes Class 10

EDGE Yes Class 10

Hold / Retrieve Yes

Conference Call Yes Max. 6

DTMF Yes

Memo pad No

TTY No

AMR Yes

SyncML Yes

IM Yes

Email Yes



2. PERFORMANCE

2.6 HW SPEC.

1) GSM transceiver specification

Item Specification

Phase Error Rms : 5°

Peak : 20 °

Frequency Error GSM : 0.1 ppm

DCS/PCS : 0.1 ppm

EMC(Radiated Spurious Emission

Disturbance) GSM/DCS : < -28dBm

Transmitter Output power and Burst

Timing

GSM : 5dBm – 33dBm ± 3dB

DCS/PCS : 0dBm – 30dBm ± 3dB

Burst Timing <3.69us

Spectrum due to modulation out to

less than 1800kHz offset

200kHz : -36dBm

600kHz : -51dBm/-56dBm

Spectrum due to modulation out to

larger than 1800kHz offset to the

edge of the transmit band

GSM :

1800-3000kHz :< -63dBc(-46dBm)

3000kHz-6000kHz : <-65dBc(-46dBm)

6000kHz < : < -71dBc(-46dBm)

DCS :

1800-3000kHz :< -65dBc(-51dBm)

6000kHz < : < -73dBc(-51dBm)

Spectrum due to switching transient 400kHz : -19dBm/-22dBm(5/0), -23dBm

600kHz : -21dBm/-24dBm(5/0), -26dBm

Reference Sensitivity – TCH/FS Class II(RBER) : -105dBm(2.439%)

Usable receiver input level range 0.012(-15 - -40dBm)

Intermodulation rejection – Speech

channels

± 800kHz, ± 1600kHz

: -98dBm/-96dBm (2.439%)

AM Suppression

GSM : -31dBm

- DCS : -29dBm

-98dBm/-96dBm (2.439%)

Timing Advance ± 0.5T


2. PERFORMANCE

2) WCDMA transmitter specification

Item Specification

Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz

Band2 : 1850MHz ~ 1910 MHz

Band5 : 824MHz ~ 849MHz

Maximum Output Power +24 dBm / 3.84 MHz, +1 / -3 dB

Frequency Error within ±0.1 PPM

Open Loop Power Control Normal Conditions : within ±9 dB,

Extreme Conditions : within ±12 dB

Minimum Transmit Power < -50 dBm /3.84 MHz

Occupied Bandwidth < 5 MHz at 3.84 Mcps (99% of power)

Adjacent Channel Leakage

Power Ratio (ACLR)

> 33 dB @ ±5 MHz,

> 43 dB @ ±10 MHz

Spurious Emissions

|f-fc| > 12.5 MHz

< -36 dBm / 1 kHz RW @ 9 kHz ≤ f < 150 kHz

< -36 dBm / 10 kHz RW @ 150 KHz ≤ f < 30 MHz

< -36 dBm / 100 kHz RW @ 30 MHz ≤ f < 1 GHz

< -30 dBm / 1 MHz RW @ 1 GHz ≤ f < 12.75 GHz

< -60 dBm / 3.84 MHz RW @ 869 MHz ≤ f ≤ 894 MHz



< -67 dBm / 100 kHz RW @ 925 MHz ≤ f ≤ 935 MHz

< -79 dBm / 100 kHz RW @ 935 MHz < f ≤ 960 GHz

< -71 dBm / 100 kHz RW @ 1805 MHz ≤ f ≤ 1880 MHz

< -41 dBm / 300 kHz RW @ 1884.5 MHz < f < 1919.6 MHz

Transmit Intermodulation < -31 dBc @ 5 MHz & < -41 dBc @ 10 MHz

when Interference CW Signal Level = -40 dBc

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm

Peak Code Domain Error < -15 dB at Pout -20 dBm



2. PERFORMANCE

3) WCDMA receiver specification

Item Specification

Receive Frequency Band1 : 2110 ~ 2170 MHz

Band2 : 1930 ~ 1990 MHz

Band5 : 869 ~ 894MHz

Reference Sensitivity Level Band1 : BER < 0.001 when Îor = -106.7 dBm / 3.84 MHz

Band2 : BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz

Band5 : BER < 0.001 when Îor = -104.7 dBm / 3.84 MHz

Maximum Input Level BER < 0.001 when Îor = -25 dBm / 3.84 MHz

Adjacent Channel Selectivity

(ACS)

ACS > 33 dB where BER < 0.001 when

Îor = -92.7 dBm / 3.84 MHz

& Ioac = –52 dBm / 3.84 MHz @ ±5 MHz

Blocking Characteristic BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

& Iblocking = -56 dBm / 3.84 MHz @ Fuw(offset) = ±10 MHz

or Iblocking = -44 dBm / 3.84 MHz @ Fuw(offset) = ±15 MHz

Spurious Response BER < 0.001 when Îor = -103.7 dBm / 3.84 MHz

& Iblocking = -44 dBm

Intermodulation BER < 0.001 when Îor= -103.7 dBm / 3.84 MHz

& Iouw1 = -46 dBm @ Fuw1(offset) = ±10 MHz

& Iouw2 = -46 dBm / 3.84 MHz @ Fuw2(offset) = ±20 MHz

Spurious Emissions < -57 dBm / 100 kHz BW @ 9 kHz ≤ f < 1 GHz

< -47 dBm / 1 MHz BW @ 1 GHz ≤ f ≤ 12.75 GHz

Inner Loop Power Control

In Uplink

Adjust output(TPC command)

cmd 1dB 2dB 3dB

+1 +0.5/1.5 +1/3 +1.5/4

0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5

-1 -0.5/-1.5 -1/-3 -1.5/-4

group(10equal command group)

+1 +8/+12 +16/+24


2. PERFORMANCE

4) HSDPA transmitter specification

Item Specification

Transmit Frequency Band1 : 1920 MHz ~ 1980 MHz

Band2 : 1850MHz ~ 1910 MHz

Band5: 824MHz ~ 849MHz

Maximum Output Power Sub-Test

1=1/15, 2=12/15 21~25dBm / 3.84 MHz

3=13/15 4=15/8 20~25dBm / 3.84 MHz

5=15/7 6=15/0 19~25dBm / 3.84 MHz

HS-DPCCH

Sub-test

in table

C.10.1.4

Power

step

Power step slot

boundary

Power

step size,

P [dB]

Transmitter power

step tolerance [dB]

1 Start of

Ack/Nack

6 +/- 2.3

2 Start of CQI 1 +/- 0.6

3 Middle of CQI 0 +/- 0.6

5

4 End of CQI 5 +/- 2.3

Spectrum Emission Mask

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

Frequency offset

from carrier f Minimum requirement

Measurement

Bandwidth

2.5 ~ 3.5 MHz -35-15×( f-2.5)dBc 30 kHz

3.5 ~ 7.5 MHz -35-1×( f-3.5)dBc 1 MHz

7.5 ~ 8.5 MHz -35-10×( f-7.5)dBc 1 MHz

8.5 ~ 12.5 MHz -49dBc 1 MHz

Adjacent Channel Leakage

Power Ratio (ACLR)

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

> 33 dB @ ±5 MHz

> 43 dB @ ±10 MHz

Error Vector Magnitude < 17.5 %, when Pout ≥ -20 dBm



2. PERFORMANCE

5) HSDPA receiver specification

Item Specification

Receive Frequency

Band1 : 2110 ~ 2170 MHz

Band2 : 1930 ~ 1990 MHz

Band5 : 869 ~ 894MHz

Maximum Input Level

(BLER or R), 16QAM Only

Sub-Test : 1=1/15, 2=12/15, 3=13/15, 4=15/8, 5=15/7, 6=15/0

BLER < 10% or R >= 700kbps

6) WLAN 802.11b transceiver specification

Item Specification

Transmit Frequency 2400 MHz ~ 2483.5 MHz ( CH1~CH13 )

Tx Power Level ≤ 20dBm under (Europe), ≤ 30dBm under (USA)

Frequency Tolerance within ±25 PPM

Chip clock Frequency

Tolerance

within ±25 PPM

Spectrum Mask ≤ -30 @ fc-22MHz< f <fc-11MHz and fc+11MHz< f <fc+22MHz

≤ -50 @ f < fc-22MHz and f > fc+22MHz

Power ramp on/off time ≤ 2us

Carrier Suppression ≤ -15dB

Modulation Accuracy

(Peak EVM)

≤ 35%

Spurious Emissions < -36 dBm @ 30MHz ~ 1GHz

< -30 dBm above @ 1GHz ~ 12.75GHz

< -47 dBm @ 1.8GHz ~ 1.9GHz

< -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity ≤ -76dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%

Rx Max input Sensitivity ≥ -10dBm(1Mbps,2Mbps,5.5Mbps,11Mbps) @ FER ≤ 8%

Rx Adjacent Channel

Rejection

≥ 35dB @FER ≤ 8%,

interference input signal -70dBm@fc±25MHz(11Mbps)


2. PERFORMANCE

7) WLAN 802.11g transceiver specification

Item Specification





Tolerance

within ±25 PPM

Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)

≤ -28 @ ±20MHz offset (11MHz ~ 20Mhz)


Transmitter constellation error

(rms EVM)

≤ -5dB



< -47 dBm @ 1.8GHz ~ 1.9GHz

< -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity PER ≤ 10%

-82dBm@6Mbps, -81dBm@9Mbps, -79dBm@12Mbps


-66dBm@48Mbps, -65dBm@54Mbps

Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%

Rx Adjacent Channel

Rejection

PER ≤ 10%, ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps

ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependent sensitivity specified in min input sensitivity

8) GPS receiver specification

Item Specification

Receive Frequency 1574.42 MHz ~ 1576.42 MHz

Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding



2. PERFORMANCE

7) WLAN 802.11g transceiver specification

Item Specification





Tolerance

within ±25 PPM

Spectrum Mask ≤ -20 @ ±11MHz offset (9Mhz ~ 11MHz)



Transmitter constellation error

(rms EVM)

≤ -5dB



< -47 dBm @ 1.8GHz ~ 1.9GHz

< -47 dBm @ 5.15GHz ~ 5.3GHz

Rx Min input Sensitivity PER ≤ 10%



-66dBm@48Mbps, -65dBm@54Mbps

Rx Max input Sensitivity ≥ -20dBm(6,9,12,18,24,36,48,54Mbps) @ PER ≤ 10%

Rx Adjacent Channel

Rejection

PER ≤ 10%, ACR ≥ 16dB@6Mbps, ACR ≥ 15dB@9Mbps, ACR ≥ 13dB@12Mbps, ACR ≥ 11dB@18Mbps, ACR ≥ 8dB@24Mbps, ACR ≥ 4dB@36Mbps ACR ≥ 0dB@48Mbps, ACR ≥ -1dB@54Mbps

ACR shall be measured by setting the desired signal's strength 3 dB above the rate-dependent sensitivity specified in min input sensitivity

8) GPS receiver specification

Item Specification

Receive Frequency 1574.42 MHz ~ 1576.42 MHz

Minimum Sensitivity 1 satellite ≥-142dBm, 7 satellites ≥ -147dBm at coarse time aiding


3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 GENERAL DESCRIPTION

The LG-P500h supports UMTS-850, UMTS-1900, UMTS-2100, GSM-850, GSM-850, GSM-900, GSM-1800, and GSM-1900 based GSM/GPRS/EDGE/UMTS. All receivers and the UMTS transmitter use the radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quad-band GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated or 8-PSK-modulated signal to RF.

[Figure 1-1] Block diagram of RF part

3. TECHNICAL BRIEF

RF Block Diagram



3. TECHNICAL BRIEF

A generic, high-level functional block diagram of LGP509 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a ASM(Antenna-Switch-Module).

The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The RFIC’s Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC.

For the transmit chains, the RTR6285 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated onchip PLL and VCO. The RTR6285 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PAs. In the GSM receive path, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6285 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for

further signal processing.

The GSM/EDGE transmit path employs one stage of up-conversion and, in order to improve efficiency, is divided into phase and amplitude components to produce an open-loop Polar topology:

1. The on-chip quadrature up-converter translates the GMSK-modulated signal or 8-PSK modulated signal, to a constant envelope phase signal at RF;

2. The amplitude-modulated (AM) component is applied to the ramping control pin of Polar power amplifier from a DAC within the MSM LGP509 power supply voltages are managed and regulated by the PM7540 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC.

It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators.

The device’s general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip variables such as temperature, RF output power, and battery ID.

Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

LGP500h

LGP500h


3. TECHNICAL BRIEF

3.2 GSM MODE

3.2.1 GSM RECEIVER

The GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs of RTR6285 are connected directly to the transceiver front-end Module. GSM-850, GSM-900, GSM-1800, and GSM-1900 receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. For example Figure 1-2 shows receiver input topologies for DCS and PCS (GSM-850/900 have the same receiver input topologies). The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins.

[Figure 1-2] DCS and PCS Receiver Inputs Topologies

Since GSM-850, GSM-900, GSM-1800, and GSM-1900 signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers – this is accomplished in the switch module. The GSM-850, GSM-900, GSM-1800, and GSM-1900 receive signals are routed to the RTR6285 through band selection filters and matching networks that transform single-ended 50-Ω sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6285 input stages include MSM-controlled gain adjustments that maximize receiver dynamic range.

The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK or 8-PSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM7227 IC for further processing asshown in Figure 1-2.



3. TECHNICAL BRIEF

3.2.2 GSM TRANSMITTER

The RTR6285 transmitter outputs(HB_RF_OUT1 and LB_RF_OUT1) include on-chip output matching inductors. 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on pass-band symmetry about the band center frequency as shown in Figure 1-3.

[Figure 1-3] GSM Transmitter Outputs Topologies

The RTR6285 IC is able to support GSM 850/900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm.


3. TECHNICAL BRIEF

3.3 UMTS MODE

3.3.1 UMTS RECEIVER

The UMTS duplexer receiver output is routed to LNA circuits within the RTR6285 device as shown in Figure 1-4. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter as shown in Figure 1-5. This second stage input is configured differentially to optimize secondorder intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6285 is downconverting GSM signals and on when the UMTS is operating.

[Figure 1-4] UMTS Receiver Inputs Topologies



3. TECHNICAL BRIEF

3.3.2 UMTS TRANSMITTER

The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-converter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50-Ω interface.

The RTR6285 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6285 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator.

UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals for nine different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6285 IC design achieves this without allowing FVCO to equal FRF. The RTR6285 IC is able to support UMTS 2100/1900/1800/1700 and 850 mode transmitting. This design guideline shows only UMTS 2100 applications.


3. TECHNICAL BRIEF

[Figure 1-5] RTR6285 IC Functional Block Diagram



3. TECHNICAL BRIEF

3.4 GPS RECEIVER

The GPS receiver input employs a single-ended connection realized by this pin. The GPS input is routed from the GPS antenna switch, through a band pass filter and then an impedance transformer circuit that optimally matches the impedance looking into the GPS LNA. The impedance transformer circuit topology is shown in Figure 1-6.

[Figure 1.6] GPS Input Network Topology

3.5 LO GENERATION and DISTRIBUTION CIRCUIT

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM/EDGE, UMTS band and GPS up-converters and down-converters; with the help of these LO generation and distribution circuits, true zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RFto-baseband and from baseband-to-RF. Two fully functional fraction-N synthesizers, including VCOs and loop filters, are integrated within the RTR6285 IC. In addition, the RTR6285 has a third synthesizer used for GPS operation. The first synthesizer (PLL1) in the RTR6285 creates the transceiver Los that support the UMTS transmitter, and all four GSM band receivers and transmitters including: GSM850, GSM900, GSM1800, and GSM1900. The second synthesizer (PLL2) in the RTR6285 IC provides the LO for the UMTS primary receiver. For the RTR6285 IC only, the second synthesizer also provides the LO for the secondary UMTS receiver. The third synthesizer (PLL3), only in the RTR6285 IC, provides the LO for the GPS receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6285 ICs integrate most of the PLL loop filter components on-chip except for three off-chip loop filter-series capacitors, which significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6285 ICs have the advantage of more flexible loop bandwidth control, fast lock time, and low-integrated phase error.

- �0 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

3. TECHNICAL BRIEF

3.6 OFF-CHIP RF COMPONENTS

3.6.1. UMTS PAM

3.6.1.1 W2100, W850 (U1003,SKY77197)

The SKY77197 Power Amplifier Module (PAM) is a fully matched, 14-pad, surface mount module developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full WCDMA Band I and Band VIII coverage into a single compact package. The SKY77197 meets the stringent spectral linearity requirements of WCDMA transmission, with high power added efficiency for power output to 27.5 dBm (Band I) and 28 dBm (Band V). The SKY77197 meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA) data transmission with high power added efficiency. A directional coupler is integrated into the module thus eliminating the need for any external coupler. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance. The SKY77197 PAM is manufactured with Skyworks’ InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. No VREF voltage is required. Power down is accomplished by setting the voltage on VENABLE to zero volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with full primary voltage supplied from the battery.

SKY77197 (W2100,W850)

- �1 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


3. TECHNICAL BRIEF

3.6.1.2 W1900 (U1005, SKY77702)

The SKY77702 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module developed for

Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient module packs full

1850–1910 MHz bandwidth coverage into a single compact package. Because of high efficiencies attained

throughout the entire power range, the SKY77702 delivers unsurpassed talk-time advantages. The SKY77702

meets the stringent spectral linearity requirements of High Speed Downlink Packet Access (HSDPA), High

Speed Uplink Packet Access (HSUPA), and Long Term Evolution (LTE) data transmission with high power

added efficiency. A directional coupler is integrated into the module thus eliminating the need for any

external coupler. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC)

contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and

interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module

package to optimize efficiency and power performance. The SKY77702 PAM is manufactured with Skyworks’

InGaP GaAs Heterojunction Bipolar Transistor (HBT) BiFET process that provides for all positive voltage DC

supply operation while maintaining high efficiency and good linearity. Primary bias to the SKY77702 is

supplied directly from any three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the

3.2 to 4.2 volt range. No VREF voltage is required. Power down is accomplished by setting the voltage on

VENABLE to zero volts. No external supply side switch is needed as typical “off” leakage is a few

microamperes with full primary voltage supplied from the battery.

SKY77702 (W1900)


3. TECHNICAL BRIEF

3.6.2 19.2MHz VCTCXO (X250, KT3225L19200DCW28RA0)

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6285 IC. The oscillator frequency is controlled by the MSM6285 ICs.

TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line.

The PM7540 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM7540 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM7227 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM7540 IC REF_OUT directly to the MSM7227 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 μF low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

- �� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


3. TECHNICAL BRIEF

3.6.3 ASM + GSM PAM (U1002, SKY77544)

SKY77544 is a transmit and receive Front End Module (FEM) designed in a very low profile (0.9 mm), compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation — a complete transmit VCO-to-Antenna and Antenna-toreceive SAW filter solution. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation and EDGE Polar Modulation. WCDMA switch-through support is provided by three dedicated high-linearity ports.

The module consists of a GSM850/900 PA and DCS1800/PCS1900 PA block, impedancematching circuitry for 50 Ω input and output impedances, Tx harmonic filtering, high linearitylow insertion loss switches, and a CMOS Power Amplifier Control (PAC) block. A custom silicon integrated circuit contains decoder circuitry to control the RF switch while providing a low current external control interface. An integrated temperature sensor provides an analog voltage based on the temperature of the module.

Fabricated in InGaP/GaAs, the Heterojunction Bipolar Transistor (HBT) PA blocks support the GSM850/900 bands and DCS1800/PCS1900 bands. Both PA blocks share common power

supply pads to distribute current. The output of the PA block and the outputs to the seven

receive pads connect to the antenna pad through a highly linear antenna switch. The WCDMA

and Rx ports feature a 0 volts DC offset level, which eliminates any need for external blocking capacitors. The InGaP/GaAs die, switch die, Silicon (Si) controller die, and passive components are mounted on a multi-layer laminate substrate and the entire assembly is encapsulated with plastic overmold.

RF input and output ports of the SKY77544 are internally matched to a 50 Ω load to reduce the number of external components for a quad-band design. Extremely low leakage current of the FEM maximizes handset standby time. Band selection and control of transmit and receive RF signal flows are performed by use of four external control pads. See Figure 1.9 shown on overleaf. Mode of operation Tx, Rx, Band (GSM850, GSM900, DCS, PCS, and UMTS) is controlled with 4 logic inputs: BS1, BS2, Mode, and TxEN. Proper timing of the TxEN input and the VAPC input ensures high isolation between the antenna and Tx-VCO while the VCO is being tuned prior to the transmit burst. The Enable input controls the initial turn-on of the PAC circuitry to minimize battery drain.

The integrated power amplifier control (PAC) function provides envelope amplitude control by reducing sensitivity to input drive, temperature, power supply, and process variation.


3. TECHNICAL BRIEF

[Figure 1.9] SKY77544 Block Diagram

[Figure 1.10] SKY77544 Control Logic



3. TECHNICAL BRIEF

3.7 Digital Baseband(DBB/MSM7227)

3.7.1 General Description

A. Features(MSM7227)

The basic MSM7227 system solution consists of the MSM7227, RTR6285™, and PM7540™ ICs, plus AMSS™ system software with the SURF7227™ platform available for development. General features include:

-WCDMA Rel ‘99 plus HSDPA and HSUPA

-GSM/GPRS/EDGE

-High-performance ARM1136JF-S™ application processor at up to 600 MHz; QDSP5000™ at 320 MHz

-High-performance ARM926EJ-S™ modem processor at up to 400 MHz; QDSP4000™ at 122.88 MHz

-Java® hardware acceleration for faster Java-based games and other applets

-Support for Bluetooth® 2.1 EDR via an external Bluetooth System-on-Chip (SoC)

-High-speed, serial mobile display digital interface (MDDI) that optimizes the interconnection cost

between the MSM device and the LCD panel

-Receive diversity support for WCDMA mode, thereby providing improved capacity and data throughput

-USB 2.0 compliant high-speed USB core with limited OTG capabilities

-Integrated high-speed USB PHY

-Integrated wideband stereo codec for digital audio applications

-Direct interface to digital camera module with video front-end (VFE) image processing

-GPS position location capabilities

-Vocoder support (GSM-HR, FR, EFR, AMR, and AMR-WB/+)

-Advanced 12 × 12 ×1.05 mm, 0.4 mm pitch, 560 NSP

3.6.4 GPS LNA (U1004, RF2815)

The RF2815 is a GPS Low Noise Amplifier with an integrated SAW filter at the output. Low noise figure, along with high gain, achieved by the RF2815 makes it ideal for GPS recievers requiring high sensitivity. This module builds upon RFMD’s leading edge pHEMT process and integrates input matching and low loss high rejection SAW filter at the output. This results in high performance and a reduced solution size. The ease of implementation simplifies the reciever design.

The RF2185 is packaged in a compact 3.3 mm x 2.1 mm x 1.0 mm package with low external component count required to achieve the best-in-class performance.


3. TECHNICAL BRIEF

3.8 Hardware Architecture

<System HW Block>

Figure. Block Diagram

USBH DM & DP

Transceiver(RTR6285)


BT_UART

Capacitive Touch(Melpas + LGIT)

Key LEDKey LED

MUIC_I2C

MMC

USBPHY

SIM

UART3

LCD Backlight ICAAT2862

BL_I2C

DDR SDRAM(4G)NAND FRESH (4G)

EBI1 (DDR)

CAM I/F

TX_IQ, PRX_IQ

MOTION_I2C

BT_PCM

FM_L&R

RF I/F

USIM KPD_PWR_N

I2C

PRX_IQ

GPS

CAM_I2C

MSM7227EBI2 (NAND)

WLAN_SDIOLINE_L& R

LBEH19UNBC-338

Bluetooth v2.1Wi-Fi 802.11b/g

FM Radio

BT & Wi-Fi

FM

FEM(SKY77544)

FEM(SKY77544)DRX_IQ DRX_IQ

GPIO59

GPS

GSM & WCDMA

CAM 3M

TOUCH I2C

MCP(Micron)

Prox Sensor(GP2AP002S00F)

PROX_I2C

SBDT

MOTION Sensor(KR3DM) MOTION_INT

FUEL_I2C

Back Key

UART3

Array TPREMOTE_PWR_ON

MPP3,4

USIMUSIM I/F

GPIO106 SBDT_SSBI

PM7540KPD_DRV_N

PMIC_SSBI

AMUX_OUTHKAIN2 AMUX_OUT

AMUX_OUTPM_INT_N MSM_INT_NGPIO24

PWR/End Key

PON_RESET_N

PS_HOLDGPIO25RESIN_N

nJTAG_RESOUTJTAG_PS_HOLD

JTAG

JTAG CONN.JTAG(TCK,TDI,TDO…)UART3_TX/RX

QTKEY_I2C

System HW Block Diagram All System

Fuel Gauge(MAX17040G)Fuel Gauge(MAX17040G)

PS_HOLD

MDDI Interface

Home Key

Send Key

MUIC(TS5USBA)

MUIC(TS5USBA)

I2C

5pin

_USB

Con

nect

or5p

in_U

SBC

onne

ctor

Main Board

LINE_ON&OP

EAR1_OP&ON

HPH_L&R

LINE_OP, LINE_ON

RCV_P & N

HPH_R, HPH_L

Q-Motor(WHVM-1030Q10)


GPIO_28 LIN_PWM_FREQ

Menu Key

Volume Key

Sub FPCB

MT29C4G96MAZAPCJA-5 IT

MIC MIC

USIM

SPK_RCVP, N

Speaker & Receiver

3.5 piEarjack

EAR_L, RCOMPASS_I2CDigital Compass

(AMI304) COMPASS_INT

Key COL, Key ROW

MDDI Interface

3.2" HVGA 320*480

Audio SubWM9093ECS-R

TOUCH INT

GPIO_27

GPIO36 ~ 38

Backlight_Key

AUDIO_I2C

TCXO_19.2MHz(Kyocera)

RTR_TRK_LO_ADJ

TCXO_IN

TCXO

TCXO_RTR_19.2MHzTCXO_PM_19.2MHz

TCXO_26MHz

FM_L&RF_CLK_IN

CLK_REQ



3. TECHNICAL BRIEF

<Power Block>

Figure. Simplified Block Diagram


3. TECHNICAL BRIEF

3.9 Subsystem (MSM7227)

3.9.1. ARM Microprocessor Subsystem

The MSM7227 device uses an embedded ARM1136JF-S, ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, SDRAM, and NANDFlash devices. Through a QUALCOMM proprietary single-wire SBI (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6285 and PM7540 devices.

3.9.2. WCDMA Subsystem

The WCDMA subsystem performs the data conversions and signal processing necessary to maintain the WCDMA air interface between the handset and the base station (and also the WCDMA network). The subsystem components include:

-Searcher engine

-Demodulating fingers

-Combining block

-Frame deinterleaver

-Viterbi decoder

-Reverse link subsystem

-Turbo decoder

On the forward link traffic channel, the WCDMA subsystem searches, demodulates, and decodes incoming pilot, sync, paging, and traffic channel information. It extracts low bit-rate packet data from the forward link traffic channel and sends the packet data to the vocoder for processing. On the reverse link, the WCDMA subsystem processes the packet data from the vocoder and modulates the reverse traffic channel.

3.9.3. GSM Subsystem

The GSM subsystem performs the data conversions and signal processing necessary to maintain the GSM air interface, including PA gain control for GPRS support. For GSM, the power profile ramps up before the burst and ramps down afterward. For GPRS, transmit bursts can occur in as many as four sequential slots and the PA must be ramped up and down smoothly between each slot, holding the desired output power level during each burst. GSM support includes:

-GSM release ‘99 (circuit switching)

-GPRS (packet switching)

-EDGE E2 power class for 8 PSK



3. TECHNICAL BRIEF

3.9.4. RF Interface

The RF interface communicates with the mobile station’s external RF and analog baseband circuits. Signals to these circuits control signal gain in the Rx and Tx signal path and maintain The system’s frequency reference.

3.9.5. Single-wire serial bus interface (SSBI)

The MSM7227 device’s SSBI is designed specifically to be a quick, low pin count control protocol for QUALCOMM’s RTR6285 and PM7540 ASICs. Using the SSBI, the RTR6285 and PM7540 devices can be configured for different operating modes and for minimum power consumption, extending battery life in Standby mode. The SBI also controls DC baseband offset errors.

3.9.6. Audio function

MSM7227 audio functions include the analog Rx and Tx paths (or stereo wideband codec), audio digital signal processing (DSP) that provides adjustable gains and filtering, PCM circuits for interfacing with external devices, and additional audio DSP that actually implements encoding and decoding. Other key features include:

-The wideband codec supports stereo music/ringer melody applications in addition to the 8 kHz voice

band applications on the forward link.

-A PCM interface allows an external codec to be used instead of the internal codec; this supports inter-IC

Sound (I2S) modes that allow an external stereo DAC or SADC to be used.

-Currently in AMSS baseline only I2S output mode is supported (SDAC-only, no SADC support).

-Audio decoder summing and headset switch detection are included.

-Audio DSP includes the Rx and Tx filters needed to meet ITU-T G.712 requirements.

-A programmable sidetone path provides for summing part of the Tx audio into the Rx path.

-Many codec parameters are configurable via SBI registers.

-The audio processing is configured through QDSP5 command types and is not directly controlled by the

microprocessor.

3.9.7. Vocoder Subsystem

The MSM7227 device’s QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support the following audio functions: DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), EarSeal Echo Canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM7227 device’s integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.


3. TECHNICAL BRIEF

3.9.8. Mode Select and JTAG Interfaces

The mode pins to the MSM7227 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM7227 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.

3.9.9. General-Purpose Input/Output Interface

The MSM7227 IC includes 133 general purpose input/output (GPIO) pins, and each can be configured as a digital input or digital output. Inputs can be set to have a pull-up, pull-down, keeper, or no-pull. Output drive strength is also programmable. Software assigns functions to the GPIOs and their configurations are set accordingly. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.9.10. UART

The MSM7227 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.

-UART1 for Bluetooth

-UART2 for USIM interface

-UART3 for data

.

3.9.11. USB

The MSM7227 IC supports one High Speed USB (HS-USB) USBH port with built-in PHY and one Full Speed USB-UICC port. The MSM7227 IC supports USB interfaces using two controllers:

-The primary controller is the HS-USB port with an integrated physical layer (PHY). This HS-USB port is

also capable of supporting USB operations at low-speed and full-speed.

-The secondary controller is the FS USB-UICC port, which only supports host mode functionality.



3. TECHNICAL BRIEF

3.10 Power Block

3.10.1. General

MSM7227, included RF, is fully covered by PM7540 (Qualcomm PMIC). PM7540 cover the power of MSM7227, MSM memory, RF block, Bluetooth, USIM and TCXO.

Major power components are :

PM7540 (U403) : Phone main PMIC

3.10.2 PM7540

The PM7540 device (Figure) integrates all wireless handset power management. The power management portion accepts power from all the most common sources – battery, external charger, adapter, coin cell back-up – and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM7540 IC using Single-wire SBI(SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.


3. TECHNICAL BRIEF

Figure. PM7540 functional block diagram Figure. PM7540 functional block diagram



3. TECHNICAL BRIEF

3.10.3. Charging control

A programmable charging block in PM7540 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM7540 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

3.10.3.1. Trickle Charging

Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM7540 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickel-based batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

Parameter Min Typ Max Unit

Trickle Current 60 80 100 mA

Figure. PM7540 Charging Flow (TC Charging)


3. TECHNICAL BRIEF

3.10.3.2. Constant Current Charging

The PM7540 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

Figure. PM7540 Charging Flow (CC Charging)



3. TECHNICAL BRIEF

3.10.3.3. Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current.

3.10.3.4. LGP509 Charging Specification

-Charging Method : CC & CV (Constant Current & Constant Voltage)

-Maximum Charging Voltage : 4.2V

-Maximum Charging Current : 700mA

-Nominal Battery Capacity : 1500mAh

-Charging time : Max. 3h 30m

- Full charge indication current (icon stop current) : 50mA

3.10.3.5. LGP509 battery bar icon display

Battery Bar Number Specification

BAR 6 (Full) 90% over

BAR 6 --> 5 90% 89%

BAR 5 --> 4 70% 69%

BAR 4 --> 3 50% 49%

BAR 3 --> 2 30% 29%

BAR 2 --> 1 15% 14%

BAR 1 --> 0 5% 4%

Low Battery Pop-up 4% ~ 15% : One Time popup (No call)

Critical Low Battery Pop-up 0% ~ 3% : Level change popup (No call)

POWER OFF 0%

Remain %

Table. LGP509 battery bar specification

LGP500h

LGP500h

LGP500h


3. TECHNICAL BRIEF

3.11 External memory interface

3.11.1. MSM7227

The MSM7227 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting DDR synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SRAM, NOR flash etc. To support the high-bandwidth, high-density, and low-latency requirements of the advanced on-chip applications, the MSM7227 IC has two high-speed, high-performance memory slave interfaces: the external bus interface 1 (EBI1) and the stack memory interface (SMI). To achieve higher bandwidth and better use of the memory device interface, the SMI accepts multiple commands for the external memory

device. The SMI interface acts as a slave device to all of the bus masters within the MSM device. The masters arbitrate to gain access to the SMI, and upon obtaining the access, they issue commands to the SMI. The bus masters are connected to the SMI through an advanced extensible interface (AXI) bus bridge (or global interconnect block) and communicate over a 64-bit, non-blocking AXI bus protocol. The AXI bus bridge provides the arbitration logic for all of the bus masters.

EBI1 Features - Support for only low-power memories at 1.8-V I/O power supply voltage - AXI bus frequencies up to 133 MHz - A 16-bit/32-bit static and dynamic memory interface DDR SDRAM interface features include: - Supports both 32-bit DDR SDRAM devices, up to 133-MHz bus speed - Supports auto precharge and manual precharge - Supports partial refresh - Separate CKE pin per chip-select to support partial operation mode - Idle power down to save idling power consumption EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices(UB_N & LB_N signals). - 2Mbytes of memory per chip select. - Support for 8 bit/16bit wide NAND flash.

- Support for parallel LCD interfaces, port mapped of memory mapped(8 or 16 bit)

3.11.2.LGP509 External memory Interface

-Multi Chip Package : DDR SDRAM and NAND Flash merged 1 package -4Gbit Mobile DDR SDRAM / 4Gbit NAND Flash

Interface Spec

Part Name Product Gr Maker Operation Voltage Speed

NAND 1.8V 42ns K524G2GACB-A050

SDRAM

SEC

1.8V 200MHz

LGP500h



3. TECHNICAL BRIEF

3.12 H/W Sub System

3.12.1. RF Interface

3.12.1.1. RTR6285 (WCDMA_Tx, GSM_Tx/Rx)

MSM7227 controls RF part(RTR6285) using these signals.

-RTR6285_SSBI : SSBI I/F signals for control Sub-chipset -RTR_TXON : Power AMP on RF part -RTR_RX_I/Q_M/P, RTR_TX_I/Q_M/P : I/Q for T/Rx of RF -RTR_DAC_REF : Reference input to the MSM Tx data DACs

3.12.1.2. the others

TRK_LO_ADJ : TCXO(19.2M) Control PA_ON0/PA_RANGE0 : WCDMA(2100) TX Power Amp Enable ANT_SEL[0-3] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) GSM_PA_RAMP : Power Amp Gain Control of APC_IC

3.12.1.3. RF2815 (GPS LNA)

* GPS_LNA_EN : GPS LNA Enable Signal (GPS LNA Shutdown)


3. TECHNICAL BRIEF

3.12.1.4. LBEH19UNBC-338 (BT / WiFi module )

WiFi

* WLAN_CMD : WLAN SDIO Command Line.

* WLAN_CLK : WLAN SDIO Clock Input.

* WLAN_SDIO[3:0] : WLAN SDIO Data Line.

* WLAN_RESET_N : Low asserting reset for WLAN core.

* WLAN_HOST_WAKEUP : WL_HOST_WAKEUP signal output.

BT

* BT_UART_RXD : Bluetooth UART Serial Input.

* BT_UART_RTS : Bluetooth UART Request to Send. Active-low request.

* BT_UART_CTS : Bluetooth UART Clear to Send. Active-low clear.

* BT_UART_TXD : Bluetooth UART Serial Output.

* BT_PCM_CLK : BT PCM clock, can be PCM-master (output) or PCM-slave (input).

* BT_PCM_DIN : BT PCM data input.

* BT_PCM_SYNC : BT PCM sync signal, can be PCM-master (output) or PCM-slave (input).

* BT_PCM_OUT : BT PCM data output.

* BT_WAKEUP : BT Wakeup Input.

* BT_HOST_WAKEUP : BT Host Wakeup Output

* BT_RESET_N : Low asserting reset for BT core.

Common

* WLAN_REG_ON : If low the internal regulators will be disabled.

* SLEEP_CLK : LPO clock (32.768kHz) input. Used for low-power mode timing.

* CLK_IN : Crystal amplifier input or frequency reference input.

* CLK_REQ : Crystal Circuit / Reference Clock Enable (active-high)

FM Radio

* FM_ANT : FM RF input.

* SLEEP CLK : External reference oscillator input. (32.768KHz)

* FM_R : Right audio line output – digital input data.

* FM_L : Left audio line output – digital frame synchronization.



3. TECHNICAL BRIEF

Figure. Wifi/BT/FM Interface Block Diagram

WiFi/BT/FM Radio Block Diagram

26MHzTCXO

32.768KHz

PM7540

SLEEP_CLK(LPO Clock:32.768KHz)

3.5Ear JackFM_ANT

LBEH

19U

NB

C

MSM

7227

CLK_IN


3. TECHNICAL BRIEF

3.12.2 MSM Sub System

3.12.2.1. USIM Interface

SIM interface scheme is shown in Figure.

And, there control signals are followed

-USIM_CLK : USIM Clock -USIM_Reset : USIM Reset -USIM_Data : USIM Data T/Rx

3.12.2.2. UART Interface

UART signals are connected to MSM GPIO through IO connector with 115200 bps speed.

GPIO_Map Name Note

GPIO_86 UART3_RX Data_Rx

GPIO_87 UART3_TX Data_Tx

Table. UART Interface



3. TECHNICAL BRIEF

3.12.2.3. HS-USB

The High-Speed USB module contains an embedded UTMI+ core with a built-in transceiver eliminating the need for an external PHY. The HS-USB port is a standard 4-pin interface that connects directly to the USB connector (USBPHY_DP, USBPHY_DN, USBPHY_ID and USBPHY_VBUS). Two additional pins are required for PHY operations which include an external reference resistor pin (USBPHY_REXT) and a USB system clock pin which the USB PHY uses to lock its internal PLL (SYS_CLK)

Figure. HS-USB connections and architecture


3. TECHNICAL BRIEF

3.12.3 KEY

3.12.3.1 Side key

There are 3 side key buttons that are controlled by MSM7227.

Refer to the circuit.

Figure. Volume Side key

Figure. Power key

016AV

CN3

4

3

2

1

470R25

1AV

906AV

R613 470

R610 470

KEY_COL[2]KEY_ROW[1]

KEY_ROW[0]

0603

CN5

2

1VA2

KPD_PWR_N



3. TECHNICAL BRIEF

3.12.3.3 KEY Backlight

There are 4 White side view LED, 4 white LED in key backlight circuit

Figure. KEY Backlight

2711R

1

371 1R

1

5711R

1

LD1 LD4 LD3 LD2

C1931

2.2u

4711R

1

+VPWR

BACKLIGHT_KEY


3. TECHNICAL BRIEF

3.13 Audio and sound

3.13.1 Overview of Audio path

3.5

1.8V LDORP103K181D

Audio Block Diagram

Figure. Block diagram of Audio & Sound path



3. TECHNICAL BRIEF

3.13.2. Audio signal processing & interface

3.13.2.1 MSM7227 audio interface

The MSM7227A audio front end comprises the stereo wideband codec, PCM interface, and additional DSP audio processing. The stereo wideband codec allows the MSM7227 device to support stereo music/ringer melody applications in addition to the 8 kHz voice band applications on the forward link.

In the audio transmit path, the device operates as 13-bit linear converter with software, selectable 8 kHz and 16 kHz sampling rate. In the audio receive path, the device operates as a software-selectable 13-bit or 16-bit linear converter with software selectable 8 kHz,16 kHz, 22.05 kHz, 24 kHz, 32 kHz, 44.1 kHz, or 48 kHz sampling rate. Through software, the Rx path can be configured as either a mono or stereo output. New to the MSM7227 device is a transmit (Tx) ADC path that now supports stereo wideband sampling. The integrated codec contains all of the required conversion and amplification stages for the audio front end. The codec operates as a 13-bit linear codec with the transmit (Tx) and receive (Rx) filters designed to meet ITU-T G.712 requirements.

The codec includes a programmable side tone path for summing a portion of the Tx audio into the Rx path. An on-chip voltage/current reference is provided to generate the precise voltages and currents required by the codec. This circuit requires a single capacitor of 0.1 μF to be connected between the CCOMP and GND pins. The on-chip voltage reference also provides a microphone bias voltage required for electret condenser microphones typically used in handset applications. The MICBIAS output pin is designed to provide 1.8 V DC while delivering as much as 1 mA of current. Audio decoder summing and headset switch detection are included. The codec interface includes the amplification stages for both the microphone and earphone. On the transmit (Tx) path, the interface supports two differential microphone inputs, a differential auxiliary input, and a stereo line input. On the receive (Rx) path the interface supports one differential earphone output, a stereo single-ended headphone output, one differential auxiliary output, and stereo single-ended line outputs. The codec is configured by the codec SBI registers. The codec interface is shown in Figure.

Also part of the audio front end is the PCM interface. The PCM interface allows for an external codec to be used instead of the internal codec. This interface can be used in I2S mode which will allows for an external stereo DAC to be used. Finally, the audio front end includes additional DSP audio processing that does gains, filtering and other audio processing.

The DSP audio processing is configured through the QDSP5000 command types and is

not directly controlled by the microprocessor.


3. TECHNICAL BRIEF

Figure. Detailed diagram of MSM7227 audio interface



3. TECHNICAL BRIEF

3.13.2.2 WM9093 audio interface

The WM9093 is a high performance low power audio subsystem, including headphone driver and Class AB/D earpiece/speaker driver. The Class D speaker driver support 650mV output power at 3.6V, 1%THD.

The unique dual mode charge pump architecture provides ground referenced headphone outputs removing the requirement for external coupling capacitors. Class G technology is integrated to increase the efficiency and extend playback time by optimizing the headphone driver supply voltages according to the volume control.

The flexible input configuration allows single ended or differential stereo inputs. Mixers allow highly flexible routing to the outputs, A ‘voice Bypass’ path is also available for low-power voice applications.

The WM9093 is controlled using a two-wire I2C interface. An integrated oscillator generates all internal clocks. Removing the need to provide any external clock.

Separate mixer and volume controls are provided for each headphone and speaker driver. Automatic Gain control limits the speaker output signal in order to prevent clipping. DC offset correction to less than 1mV Guarantees a pop/click-free headphone start up.

The WM9093 is available in a 2.0mm × 2.5mm 20-bump CSP package.

Figure. Detailed diagram of WM9093 audio interface


3. TECHNICAL BRIEF

FB7011800

FB7001800

33p

C702

1

2

MIC_BIAS

33p

C703

MIC1

6

5

4

3

2

1OUT

G1

G2

G3

PWR

G4

VA615

33p

C700

MIC_1P

MIC_1N

changed 12/28MIC

R509 12

J2

2

36

5

4

1M5_MIC

M4_L

M3_DETECT

M4D-DETECT

M1_R

M6_GND

10K

R521

FB502 1800

10K

R520

106Q

D

G

S

005D

2 05D

305D

47p

C542

105D

33p

C544

M1

8 611R

15p

C545C543

47p

405D

270n

L504

VREG_MSMP_2.6V

U502

5

3 24 1

VOUTVINGNDSTBY

DN

GP

9611R

K74

VREG_MSMP_2.6V

K2. 2

705R

33p

C538

2.2u

C539

R515 12

FB5001800

FB5011800

10uC537

FM_ANT

EAR_L

EAR_R

EARJACK_SENSE

HS_MIC_BIAS_EN

HS_MIC

HIGH

LOW(DEFAULT)

STATE

UNMATING

EAR_SENSE

MATING

2009.11.16 added

10.04.08 Changed Rev.C

3.5pi Ear Jack Connector



3. TECHNICAL BRIEF

R1170 2.2K

205C

p93

305R

02

505R

K7.4

2.2KR1171

405C

u1

R1177 10

+VPWR_AUDIO

10R1176

C522

2.2u

C509 33n

33nC510

C518

2.2u

205R

02

405R

K7.4

47pC505

47pC506

u1.

03

15C

u1

.0

215C

1uC511

1uC514

VREG_MSMP_2.6V

C519

2.2u

IC5003

B

A4

C3

C2

2B

D1

D34

D

C1

A1D2

1B

D5

A2

A5

A3B5

4B

C5

4C

DN

G

OUT+

DD

VP

H

CPVDDCPVSS

CN

HPL

OUT-

SAI

B

IN2- HPR

IN1+

DD

VS

IN3-

IN2+

AD

S

IN1-

IN3+

CP

LC

S

1uC507

C508 1u

C523

2.2u

u01

30

5C

2.2uC515

VREG_HPVDD_1.8V

LINE_ON

LINE_OP

AUDIO&MOTION_I2C_SDA

HPH_R

HPH_L

AUDIO&MOTION_I2C_SCL

RCV_PRCV_N

EAR_L

EAR_R

SPK_RCV+

SPK_RCV-

Audio SUB SYSTEM


3. TECHNICAL BRIEF

3.14 Display

LCD module is connected to Main PCB with 24-pin connector.

The LCD is controlled by MDDI Interface in MSM7227.

Figure. Schematic of LCD connector (Main Board)

CN601

1312

1411

1510

169

178

187

196

205

214

223

232

241

1DZ

FL603

019

84736251

P1 P5P2 P6P3 P7P4 P8

1G

2G

VREG_LCD_2.8VVREG_LCD_1.8V

D600

4 3

5 2

6 12.2uC616 C617

2.2u

WLED_PWR

C4

4.7u

WLED5 WLED4

WLED3 WLED2

WLED1

WLED6WLED7

LCD_RESET_N

LCD_MAKERID_LOWMDDI_P_STB_MMDDI_P_STB_P

MDDI_P_DATA_MMDDI_P_DATA_P

LCD_VSYNC_O

3.2" HVGA LCD Connector



3. TECHNICAL BRIEF

Table. Interface between LCD Module and MAIN Board


3. TECHNICAL BRIEF

3.15 Proximity Sensor

When call connected, the object is moved nearer to the proximity sensor.

LCD backlight and Touch screen is disable operation automatically.

U700 : GP2AP002S00F IC used I2C interface to MSM7227

Figure. Proximity Sensor Schematic

Figure. Proximity Sensor Block Diagram

VREG_MSMP_2.6V

U700

5 4

6 3

7 2

8 1LEDASCL

LEDCSDA

VCCVIO

VOUTGND

C707

1u

R700

10

C708

0.1u

R703

10

VREG_PROX_2.8V

R702

4.7Kohms

R701

4.7Kohms

C709

4.7u

10u

C705

PROX_OUT

PROX_COMPASS_I2C_SCL

PROX_COMPASS_I2C_SDA



3. TECHNICAL BRIEF

3.16 Vibrators (Q-Coin Motor)

The strength of vibration is determined by the duty cycle of PWM (LIN_PWM_FREQ)

U602 : EUSY0404001 is Q-Coin motor driver IC.

Figure. Q-Coin Moter IC Schematic

Figure. Vibrator Block Diagram

C623

0.1u

R614

4.7KohmsR617

51K

C625 10n

R612 100K

R618

1K

R615

1K

R616

51K

VREG_MOTOR_3.3V VREG_MOTOR_3.3V

U602

B2C1

A1B1

B3C2

A3C3IN- VDD

IN+ VO+

_SHUTDOWN VO-

BYPASS GND

Q600

C

B

E GND

IN

OUT

C624

0.1u

R619 100K

LIN_PWM_FREQ

MTR_P_2sub

MTR_N_2sub

1%

1%

1%

1%1%

1%


3. TECHNICAL BRIEF

3.17 Compass Sensor

If a customer buy the application SW, The Sensor Support a Eletric Compass function

U1 : AMI304 IC used I2C interface to MSM7227

Figure. Compass Sensor Schematic

C706

470n

VREG_MSMP_2.6VVREG_MOTION_3.0V

407C

n 01

U1

12

11

10

9

5

4

6

37

28

1D

DV

D

GE

RV

AD

NG

SD

NG

DD

VA

ADDR

SCL

NC1

TN

I

VPP

DRDY

SDA


PROX_COMPASS_I2C_SDACOMPASS_DRDY



3. TECHNICAL BRIEF

Figure. Compass Sensor Block Diagram


3. TECHNICAL BRIEF

3.18 Motion Sensor

According to tilt the cell phone, the screen is had rotated automatically.

U503 : KR3DH IC used I2C interface to MSM7227

Figure. Motion Sensor Schematic

Figure. Compass Sensor Block Diagram

045C

u1.0

U503

61

7 6

5

4

8

3

9

2

10

1

11

12

13

41 512

DE

VR

ES

ER

DD

V

GND3

GND2

INT1

VDD_IO

RESERVED1

NC1

INT2

NC2

SC

SCL_SPC

GND1

OD

S_ID

S_A

DS

0A

S_O

DS

4D

NG

VREG_MOTION_3.0V

10u

C541

815R

K2. 2

915R

K2.2

MOTION_INTMOTION_I2C_SCL

MOTION_I2C_SDA



3. TECHNICAL BRIEF

3.19 Main Features

3.19.1. LG-P500h Main Features

- DOP Type design

- UMTS 2100 + UMTS 1900 + UMTS 850 + GSM 900 + DCS 1800 + PCS 1900 + GSM850 based

GSM/GPRS/EDGE/UMTS

- HSDPA 7.2Mbps

- TFT Main LCD(3.2’ HVGA, 320 x 480)

- Capacitive/Electrostatic Touch Window

- 3M AF Camera

- 3.5Phi Stereo Headset & Speaker phone

- Mobile XMF –Mobile DLS / Scaleable Polyphony

- MP3/AMR/AAC/AAC/WAV/WMA decoder and play

- MPEG4 encoder/decoder and play/save

- JPEG en/decoder

- Supports Bluetooth and HS-USB

- Supports WLAN(802.11b, 802.11g)

- Supports FM Radio

- 1500 mAh (Li-Ion)

LG-P500h


3. TECHNICAL BRIEF

3.19.2. LG-P509 Main component (bottom)

Main Board Bottom

Logic

RF

PMIC

WLAN GPS

LG-P500h



3. TECHNICAL BRIEF

3.19.2. LG-P509 Main component (bottom & Sub carrier)

Main Board Bottom & Sub carrier

Vibrator

Camera

SD memory

soket

LG-P500h


3. TECHNICAL BRIEF

3.19.2. LG-P509 Main component (Top)

Main Board Top

Power key

Side Volume key

Dome key

LG-P500h



3. TECHNICAL BRIEF

3.19.3. RF of LG-P500h

FL1006

FL1010

WCDMA PAM(II)

DCS/PCS RX Dual SAW Filter

FL1001 TCXOX200

RF Antenna connector SW1001 WCDMA (I) RX SAW Filter

EGSM/850 RX Dual SAW Filter

U1005 WCDMA (I) TX SAW Filter

FL1003

WCDMA (I) Duplexer

FL1002 External LNA(I, II ,V) U2

WCDMA (II) Duplexer WCDMA PAM(I, V) U1003

WCDMA (II) RX SAW Filter FL1012 GSM PAM/FEM module U1002

WCDMA (II) TX SAW Filter FL1009 RTR6285 U1001

Description Reference Description Reference

SW1001

X200

FL1006

U1002 FL1008

FL1009

FL1002

FL1010

FL1001

U1001

U1003

U1005

FL1003

FL1012

U2

FL1008

FL1

FL1005

FL2

FL1

FL2

WCDMA (V) RX SAW FILTER FL1005 WCDMA (V) TX SAW FILTER

WCDMA (V) Duplexer


3. TECHNICAL BRIEF

3.19.4. BaseBand of LG-P509

GPS D flip-flop U502 Level shifter U601

LCD CONN. CN601 MDDI filter FL603

J-TAG CONN. CN200 Q-coin Motor drive amp U602

Motion sensor U503 MSM7227 U200

Charge pump U1007 Memory U301


U301 U602

U1007

U503 U202

FL603

U601

CN200

CN601

LG-P500h



3. TECHNICAL BRIEF

3.19.5. Power and Logic of LG-P509

Q400

Fuel gauge IC U404

Sleep X-tal X400SIM connector J1

Battery Conn. CN401 Digital Compass U1

Charging IC Q400PM7540 U403


X400

U403

U1

J1

CN401

U404

LG-P500h


3. TECHNICAL BRIEF

3.19.6. Audio of LG-P509

CN1 CN600 U502 IC500

Audio Sub system IC500

Headset Bias LDO U502 Sub FPCB B2B conn. CN2

Camera conn. CN600 Touch Conn. CN1


LG-P500h



4. TROUBLE SHOOTING

TROUBLE SHOOTING

4.1 RF Component

U1002 FEM

SW1001 RF SW

FL1008 W2100 Duplexer

FL1010 W1900 Duplexer

U1003 W2100/W850

PAM

U1001 RF Transceiver

FL1009 W1900 Tx saw filter


U2 WCDMA LNA

FL1001 EGSM/850

Rx saw filter

FL1002 DCS/PCS

Rx saw filter

X200 VCTCXO

U1005 W1900

PAM

FL1003 W2100 Rx saw filter




FL2 W850 Duplexer

4. TROUBLE SHOOTING


4. TROUBLE SHOOTING

RF component (WCDMA / GSM)

Reference Description Reference Description

U1001 RTR6285(Transceiver) FL1001 EGSM/850 Rx saw filter

U1002 GSM TX Module

(FEM + GSM/EDGE PAM)

U2 WCDMA (I, IV)

LNA

U1003 WCDMA Dual (I,VIII) PAM U1005 WCDMA (IV) PAM

FL1006 WCDMA (I) TX SAW Filter X200 VCTCXO(19.2MHz)

FL1003 WCDMA (I) RX SAW Filter U1004 GPS LNA

FL1008 WCDMA (I) Duplexer FL1007 GPS SAW Filter

FL1009 WCDMA (IV) TX SAW Filter

FL1012 WCDMA (IV) RX SAW Filter

FL1010 WCDMA (IV) Duplexer

FL1002 DCS/PCS Rx saw filter

SW1001 RF Antenna Connector

U1004 GPS LNA

FL1007 GPS Rx saw filter



4. TROUBLE SHOOTING

4.2 SIGNAL PATH

WCDMA I and II and V Band TX Signal PATH

D2. WCDMA 2100 TX PATH

E2. WCDMA 1900 TX PATH

F2. WCDMA 850 TX PATH

G1. COMMON TX/RX PATH


4. TROUBLE SHOOTING

WCDMA I and II and V Band RX Signal PATH

D1. WCDMA 2100 RX PATH

E1. WCDMA 1900 RX PATH

F2. WCDMA 850 TX PATH

F1. COMMON TX/RX PATH



4. TROUBLE SHOOTING

GSM850/GSM900/DCS/PCS’s RX/TX Signal PATH

A. GSM850/GSM900/DCS1800/PCS1900 RX PATH

B. GSM850/GSM900/DCS1800/PCS1900 TX PATH

C. COMMON TX/RX PATH


4. TROUBLE SHOOTING

4.3 Checking TCXO Block

The output frequency (19.2MHz) of TCXO (X200) is used as the reference one of RTR6285 and PM7540 internal

VCO.

Schematic of the Crystal Part (19.2MHz)

TP3 TP2

TP1

TP2 TP3

TP1

R208 220

R210 100K

U201

3

2

4

15

VCC

GND

C220 0.1u

C221 330p

VREG_MSMA_2.6V

VREG_TCXO_2.85V

330pC210

330pC207

C205

1n

C206

0.1u

19.2MHzKT3225L19200DCW28RA0

X200

42

31VCONT OUT

GND VCC

R205 100

R209 33

C208

10n

TCXO_EN

TCXO_RTR_19.2MHZ

TCXO_PM_19.2MHZRTR_TRK_LO_ADJ

USBH_SYSCLK

Clesed to TCXO

TCXO Circuit

1.0TFFA Rev.C(220Ohm@100MHz)

TP2

TP1

TP3



4. TROUBLE SHOOTING

Check TP1VCC of TCXO

VCC ≥ 2.85V Check the PM7540No

Yes

Check TP2

2.4V ≥ Voltage ≥ 0.4V Check the MSM7227No

Yes

Check TP�

19.2 MHz Signal Check soldering and components

No

Yes

TCXO is OK


4. TROUBLE SHOOTING

4.4 Checking GSM TX Module(GSM PAM + FEM) Block

VBATT(TP1)

ANT_SEL0

ANT_SEL3

ANT_SEL2

ANT_SEL1



4. TROUBLE SHOOTING

Schematic of the Antenna Switch Block

TP1

2.2K

R1006

U1002

313029

44434241

403938

736353

1615

4131211101

343332

17

9

188 197 206 215 224

32

3

42

2

52627282

1DCS_PCS_IN

11D

NG

01D

NG

9D

NG

8D

NG

GND1

7D

NG

GSM_IN

6D

NG

VAPCGND5VBATTGND4BS2GND3BS1GND2_TXEN

ANT

ED

OM

WCDMA3

PGND4PGND5PGND6 P

MET

4X

R3

XR

2X

R1

XR

WCDMA1WCDMA2

7D

NG

P8

DN

GP

9D

NG

P PGND10PGND11PGND12

PGND13PGND14PGND15PGND16

PGND1PGND2PGND3

39pC1024

031

4R

47

R6031

5R

+VPWR_RF

C1043

10u

75

R7

19

61R

C1045 1n1nC10471nC1048

C1051 1n

19

51R

47pC1044

ANT_SEL1

ANT_SEL2ANT_SEL0

ANT_SEL3

GSM_PA_RAMP

DCS_PCS_TX

GSM_TX

0603

2mm

11dB

7dB

GSM850(824-849MHz)

8061

GSM900(880-915MHz)

PCS(1850-1910 MHz)

DCS(1710-1785 MHz)

0603

TP1


4. TROUBLE SHOOTING

Check ANT_SEL 0, 1, 2, �High Level

1.2V < Voltage < �V Check the TP1(VBATT)No

Yes

Check the Logic in each mode



4. TROUBLE SHOOTING

4.5 Checking WCDMA Block

START

1. Check TCXO 19.2MHz

6. Ro-download SW & Cal.

2. Check FEM Block Refer to 1.4

�. Check RF Tx Level

4. Check PAM BlockRefer to 1.5.4

5. Check RF Level


4. TROUBLE SHOOTING

4.5.1Checking TCXO Block

Refer to 1.3

4.5.2. Checking FEM Block

Refer to 1.4

4.5.3. Checking RF TX Level

Test Point (TX Level)

TP1

TP2

TP3

TP4



4. TROUBLE SHOOTING

U1002

313029

44434241

403938

736353

1615

4131211101

343332

17

9

188 197 206 215 224

32

3

42

2

52627282

1DCS_PCS_IN

11D

NG

01D

NG

9D

NG

8D

NG

GND1

7D

NG

GSM_IN

6D

NG


ANT

ED

OM

WCDMA3

PGND4PGND5PGND6 P

MET

4X

R3

XR

2X

R1

XR

WCDMA1WCDMA2

7D

NG

P8

DN

GP

9D

NG



PGND1PGND2PGND3

18nL1004L11

DNI

33pC1005

SW1001

43

2

1ANT COMMON

G3 G4

GND

WCDMA_2100_RTX

WCDMA_850_RTX

WCDMA_1900_RTX

TP1

33p

C1087

C1079

8.2p

L1030DNI

L1151

3n

C1929

100p

L1027 3.3n

FL1005

836.5MHz

3 2

4 1

5GND

INOUTG1G2

51

11R

C1153

33p

IN

D

3611R

C1086DNI

FL1009

1880MHz

5 2

4 1

3G3

INOUTG1G2

C1090

12p

2.7nL1035

FL2

836.5 MHz,881.5 MHz

75

84 92

3

16ANT RX

TX

GND1GND5GND2GND6

GND3 GND4

C1081DNI

8711R

0

L10216.8n

C1088

15p

L1025

1.5n

C1084

3n

L1033DNI

FL1008

75

84

92

3

16ANT RX

TX

GND1 GND6GND2 GND5GND3 GND4

DNIL1020

U1003

61 51

8 7

9 6

10 5

11 4

12 3

13 2

14 1IN_BAND_VOUT_BAND_V

VMODE_0GND3

VMODE_1VCC2_2

VCC2_1GND2

VEN_BAND_VOUT_BAND_I

VEN_BAND_IGND1

IN_BAND_ICPL_OUT

1D

NG

P

2D

NG

P

3.3p

C1089

5.6nL1029

33

R1022

18

R1023

+VPWR_RF

C10750.001uF 10u

C1077330pC1076

L1026DNI

C1109

33L1041

1.5n

C1154

4.7n

C10921.5n

C1083

33p

100p

C1094 C1096

100p 100p

C1095

L1031DNI

U1005

6 5

7 4

8 3

9 2

10 1

11PGND

VCC1VCC2

RFINRFOUT

VMODE_1CPL_IN

VMODE_0GND

VENCPL_OUT

C11121.5p

+VPWR_RF

1950MHz

FL1006

5 2

4 1

3G3

INOUTG1G2

C11111.5p

C1113100p

C1104

1n

C1110100

C1114100p 100p

C1115

2.2uC1102

33pC1103

C1108 33p

C11160.5p

L1040

2.4n

FL1010

1880,1960MHz

75

84

92

3

16ANT RX

TX

GND1 GND6

GND2 GND5

GND3 GND4

C1078

22p

C1117DNI

L113018n

10nL1022

L1150DNI

L1120DNI

100p

C12

100p

C13

9.94

7201R

PA_ON1

PA_ON0

PA_R0

PA_R0

PA_ON2

WCDMA_2100_RTX

WCDMA_2100_TX_OUT

PDET_IN

WCDMA_1900_TX_OUT

WCDMA_850_RTX

WCDMA_850_TX_OUTPA_R1

PA_R1

WCDMA_1900_RTX

W1900

0603

Band I

Band 5

W2100

W850

WCDMA 1900 Tx (1850-1910MHz)

Band 2

Near to 12 Pin Near to 12 PinNear to 4 Pin

Near to 10 Pin Near to 1 Pin

TP2

TP2

TP3

TP3

TP4TP2

TP3

TP4

TP4


4. TROUBLE SHOOTING

For testing, Max power output is needed.

Check ANT_SEL 0, 1, 2(High, Low, Low)

Check TP1 Over 21dBm? RF Tx Level is OKYes

No

Check PAM BlockRefer to 1.5.4

Check TP2 Over 21dBm? Check TX ModuleYes

No

Check TP� Over 21dBm? Check DuplexerYes

No

Check TP4 Over 7dBm? Check RTR6285Yes

No

RTR6285 Maximun output Power = 7dBmRTR6285 minimun output Power = -80dBm



4. TROUBLE SHOOTING

4.5.4. Checking PAM Block

PAM control signal

W_PA_ON (W_1900_PA_ON(C1115), W_2100_PA_ON(C1095) and W_850_PA_ON(C1096)) :

PAM Enable

W_PA_RO: PAM Gain Control

W_PA_ON must be HIGH (over 2.6V)


4. TROUBLE SHOOTING

PAM IN/OUT Signal :

When PAM is under the operation of high power mode (WCDMA_PA_R0(C1929):Low),

PAM OUT power must be over 21 dBm

PAM IN power must be under 10 dBm

TP3

TP1

TP2



4. TROUBLE SHOOTING

33p

C1087

C1079

8.2p

L1030DNI

L1151

3n

C1929

100p

L1027 3.3n

FL1005

836.5MHz

3 2

4 1

5GND

INOUTG1G2

51

11R

C1153

33p

IN

D

3611R

C1086DNI

FL1009

1880MHz

5 2

4 1

3G3

INOUTG1G2

C1090

12p

2.7nL1035

FL2

836.5 MHz,881.5 MHz

75

84 92

3

16ANT RX

TX

GND1GND5GND2GND6

GND3 GND4

C1081DNI

8711R

0

L10216.8n

C1088

15p

L1025

1.5n

C1084

3n

L1033DNI

FL1008

75

84

92

3

16ANT RX

TX


DNIL1020

U1003

61 51

8 7

9 6

10 5

11 4

12 3

13 2


VMODE_0GND3

VMODE_1VCC2_2

VCC2_1GND2


VEN_BAND_IGND1

IN_BAND_ICPL_OUT

1D

NG

P

2D

NG

P

3.3p

C1089

5.6nL1029

33

R1022

18

R1023

+VPWR_RF

C10750.001uF 10u

C1077330pC1076

L1026DNI

C1109

33L1041

1.5n

C1154

4.7n

C10921.5n

C1083

33p

100p

C1094 C1096

100p 100p

C1095

L1031DNI

U1005

6 5

7 4

8 3

9 2

10 1

11PGND

VCC1VCC2

RFINRFOUT

VMODE_1CPL_IN

VMODE_0GND

VENCPL_OUT

C11121.5p

+VPWR_RF

1950MHz

FL1006

5 2

4 1

3G3

INOUTG1G2

C11111.5p

C1113100p

C1104

1n

C1110100

C1114100p 100p

C1115

2.2uC1102

33pC1103

C1108 33p

C11160.5p

L1040

2.4n

FL1010

1880,1960MHz

75

84

92

3

16ANT RX

TX

GND1 GND6

GND2 GND5

GND3 GND4

C1078

22p

C1117DNI

L113018n

10nL1022

L1150DNI

L1120DNI

100p

C12

100p

C13

9.94

7201R

PA_ON1

PA_ON0

PA_R0

PA_R0

PA_ON2

WCDMA_2100_RTX

WCDMA_2100_TX_OUT

PDET_IN

WCDMA_1900_TX_OUT

WCDMA_850_RTX

WCDMA_850_TX_OUTPA_R1

PA_R1

WCDMA_1900_RTX

W1900

0603

Band I

Band 5

W2100

W850

WCDMA 1900 Tx (1850-1910MHz)

Band 2



TP3

TP3

TP2

TP1

TP3 TP1

TP1


4. TROUBLE SHOOTING

Set the phone Tx is On andPDM is 210

Check TP� Over 21dBm? RF Tx Level is OKYes

No

Change the board

Check TP2 PA_RO ≥ 2.6V Check MSM7227Yes

No

Check TP1 Over 10 dBm? Check RTR6285Yes

No



4. TROUBLE SHOOTING

4.5.5. Checking RF Rx Level

Test Point (RF Rx Level)

TP1

TP2

TP3

TP5

Bias

TP4

4.5.5. Checking RF Rx Level


4. TROUBLE SHOOTING

2.2K

R1006

U1002

313029

44434241

403938

736353

1615

4131211101

343332

17

918

8 197 206 215 224

32

3

42

2

52627282

1DCS_PCS_IN

11D

NG

01D

NG

9D

NG

8D

NG

GND1

7D

NG

GSM_IN

6D

NG


ANTE

DO

M

WCDMA3

PGND4PGND5PGND6 P

MET

4X

R3

XR

2X

R1

XR

WCDMA1WCDMA2

7D

NG

P8

DN

GP

9D

NG



PGND1PGND2PGND3

39pC1024

031

4R

47

R6

031

5R

R10050.75p

18nL1004

+VPWR_RF

C1043

10u

75

R7

ANT1003

L11DNI

19

61R

C1045 1n1nC1047

ANT1002

C1003

15p

100pC1007

33pC1005

1nC1048C1051 1n

C10098.2n

19

51R

47pC1044

SW1001

43

2

1ANT COMMON

G3 G4

R1004

3.3n

ANT_SEL1

ANT_SEL2ANT_SEL0

ANT_SEL3

GSM_PA_RAMP

GND

DCS_PCS_TX

GSM_TX

0603

2mm

11dB

7dB

GSM850(824-849MHz)

8061

GSM900(880-915MHz)

PCS(1850-1910 MHz)

DCS(1710-1785 MHz)

0603

TP1

C1079

8.2p

C1090

12p

2.7nL1035

FL2

836.5 MHz,881.5 MHz

75

84 92

3

16ANT RX

TX

GND1GND5GND2GND6

GND3 GND4

C1081DNI L1021

6.8n

FL1008

75

84

92

3

16ANT RX

TX


L1041

1.5n

L1031DNI

C11160.5p

FL1010

1880,1960MHz

75

84

92

3

16ANT RX

TX

GND1 GND6

GND2 GND5

GND3 GND4

C1117DNI

L113018n

L1120DNI

100p

C12

100p

C13WCDMA_2100_RTX

WCDMA_850_RTX

WCDMA_1900_RTX

Band I

Band 5

Band 2

TP2

TP2

TP2



4. TROUBLE SHOOTING

C36

1.2p

DNI

R9

C11221.2p

C2310p

FL1012

1960MHz45

1

32G1 O1

ING2 O2

8.2n

L2

8R 0

10n

C20

DNI

R12

L1042

5.6n

VREG_TCXO_2.85V

BGA735L16U2

9

8

7

6

5

014

113

212

311

14

15

16

17PGND

RFOUTM

RFOUTH

RFOUTL

CN

FE

RR

SG

V1

NE

V

CC

V2

NE

V

1H

DN

GFR

LN IF

R

2H

DN

GFR

RFINM

RFINH

RFGNDM1

RFGNDM2

L1048

5.6n

C1123DNI

C37

1.2p

C14

27p

10p

C27

C11480.5p

2.7nL6

22n

L8

10nL9

2.2n

L10 DNIC1128

R24

33p

22p

C24

L4000DNI

L7

1n

3.3n

C1012p

C28

001R 27K

R18

C1728DNI

4.7p

C15

C1928DNI

FL1881.5MHz

45

1

32G1 O1

ING2 O2

0

R14

C262.7p

RX_WCDMA_2100

RX_WCDMA_1900_M

RX_WCDMA_1900_P

RX_WCDMA_850_P

RX_WCDMA_850_M

RX_WCDMA_1900_SE

INTER_RX_SW_SEL_1

INTER_RX_SW_SEL_2

LNA_GAIN_CONTROL

0603

22p

C25

22pC22

L53.3n

TP3

TP3TP4

TP4

K191 01

R

76 01C

u1.0

p00186 01

C 3.9pC1069L1018

1.8n2nL1017

L1019

1.8n

DNIC1070

C1080 3.9p

C1073DNI

VDD_RX

C1072 33p33pC1071

2140MHz

FL1003

45

1

32G1 O1

ING2 O2

DNI

R1021

R1029DNI

WB2100_MIX_INM

WB2100_MIX_INPRX_WCDMA_1900_LNA_OUT

RX_WCDMA_2100_LNA_OUT

30

60

W2100 RX(2110 - 2170 MHz)

Bias

TP5

TP3

TP4


4. TROUBLE SHOOTING

Set the phone Rx is On

Check BIAS over 2.1V Check bias block solderingNo

Yes

Change the board

Check TP1 Signal exist? Check RF Switch (M/S)No

Yes

Check TP2 Signal exist? Check TX Module Refer 1.4No

Yes

Check TP� Signal exist? Check DuplexerNo

Yes

Check TP4 Signal exist? Check LNANo

Yes

Check TP5 Signal exist? Check RTR6285 and Rx SAW filterNo

Yes



4. TROUBLE SHOOTING

Start

1. Check TCXO Block

4. Ro-download SW & Cal.

2. Check ANT_SW Module

�. Check RF TRX Level

4.6 Checking GSM Block


4. TROUBLE SHOOTING

1

2,3



4. TROUBLE SHOOTING

4.6.1 Checking TCXO Block

Refer to 1.3

4.6.2 Checking FEM Block

Refer to 1.4

4.6.3 Checking RF TX level

TP1

TP2

TP3


4. TROUBLE SHOOTING

2.2K

R1006

U1002

313029

44434241

403938

736353

1615

4131211101

343332

17

9

188 197 206 215 224

32

3

42

2

52627282

1DCS_PCS_IN

11D

NG

01D

NG

9D

NG

8D

NG

GND1

7D

NG

GSM_IN

6D

NG


ANT

ED

OM

WCDMA3

PGND4PGND5PGND6 P

MET

4X

R3

XR

2X

R1

XR

WCDMA1WCDMA2

7D

NG

P8

DN

GP

9D

NG



PGND1PGND2PGND3

39pC1024

031

4R

47

R6

031

5R

R10050.75p

18nL1004

+VPWR_RF

C1043

10u

75

R7

ANT1003

L11DNI

19

61R

C1045 1n1nC1047

ANT1002

C1003

15p

100pC1007

33pC1005

1nC1048C1051 1n

C10098.2n

19

51R

47pC1044

SW1001

43

2

1ANT COMMON

G3 G4

R1004

3.3n

ANT_SEL1

ANT_SEL2ANT_SEL0

ANT_SEL3

GSM_PA_RAMP

GND

DCS_PCS_TX

GSM_TX

0603

2mm

11dB

7dB

GSM850(824-849MHz)

8061

GSM900(880-915MHz)

PCS(1850-1910 MHz)

DCS(1710-1785 MHz)

0603

TP1

TP3

Schematic of GSM/DCS/PCS Tx Block

TP2



4. TROUBLE SHOOTING

Check TCXO Block Refer to 1.�

Check TP1If GSM over �1 dBm?

If DCS/PCS over 28 dBm?

GSM/DCS/PCS Tx is OKCheck other part

Yes

No

Change the board

Check TP2, �If GSM(TP2) under 6 dBm?

If DCS/PCS(TP�) over 6 dBm?

Check ANT SW Block (ASM+EDGR PAM)Refer to 1.4

Yes

No

Check RTR & PAD Check soldering and componentsNo Problem

Still exist Problem

START

No


4. TROUBLE SHOOTING

4.6.4 Checking RF Rx Block

TP1

TP2



4. TROUBLE SHOOTING

U1002

313029

44434241

403938

736353

1615

4131211101

343332

17

9

188 197 206 215 224

32

3

42

2

52627282

1DCS_PCS_IN

11D

NG

01D

NG

9D

NG

8D

NG

GND1

7D

NG

GSM_IN

6D

NG


ANT

ED

OM

WCDMA3

PGND4PGND5PGND6 P

MET

4X

R3

XR

2X

R1

XR

WCDMA1WCDMA2

7D

NG

P8

DN

GP

9D

NG



PGND1PGND2PGND3

L100382n

82nL1008

0.5pL1011

DNIL1014

18nL1004

18nL1005

1842.5MHz,1960MHz

FL1002

103

52

81

9

6

74IN_1842_5 OUT_1842_5_1

OUT_1842_5_2

OUT_1960_1

IN_1960 OUT_1960_2

GND1 GND3

GND2 GND4

C1042

6.8n

5.6n

C1040

C1052

6.8n

5.6n

C1036

C1023

4.7p

L100718n

L11DNI

C1025

4.7p

22nL1010

2.2p

C1016

2.2p

C1004

12nL1013

33pC1005

881.5MHz,942.5MHz

FL1001

103

52

81

9

6

74IN_881_5 OUT_881_5_1

OUT_881_5_2

OUT_942_5_1

IN_942_5 OUT_942_5_2

GND1 GND3

GND2 GND4

SW1001

43

2

1ANT COMMON

G3 G4

DNIL1002

33p

C1014

33p

C1021

DNIL1006

33pC1039

27nL1009

33pC1041

DNIL1012

GND

WCDMA_2100_RTX

RX_PCS_P

RX_PCS_M

RX_DCS_M

RX_GSM_900_P

RX_GSM_900_M

RX_GSM_850_P

RX_GSM_850_M

RX_DCS_P

WCDMA_850_RTX

WCDMA_1900_RTX

DCS(1805-1880 MHz)

PCS(1930-1990 MHz)

GSM(925-960 MHz)

GSM(869-894 MHz)

Schematic of GSM/DCS/PCS Rx Block

TP1TP2


4. TROUBLE SHOOTING

Set the phone Rx is On

Check TP1 Signal exist? Check RF Switch (M/S)No

Yes

Change the board

Check TP2 Signal exist? Check FEM Block Refer 1.4No

Yes



4. TROUBLE SHOOTING

4.7 GPS/WIFI/BT RF Component

RF Component(GPS)

Reference Description

ANT1005 ANTENNA PAD

connected to Carrier type antenna

ANT1006 GND PAD

FL1007 GPS SAW FILTER

U1004 GPS LNA

ANT1005

ANT1006

FL1007

U1004


4. TROUBLE SHOOTING

RF component (WiFi / BT )

Reference Description

ANT1 ANTENNA PAD

connected to Carrier type antenna

ANT2 GND PAD

U500 WiFi / BT module



4. TROUBLE SHOOTING

4.8 GPS/WIFI/BT SIGNAL PATH

GPS Signal PATH (main board bottom)

GPS Rx PATH


4. TROUBLE SHOOTING

WiFi / BT Signal PATH

WiFi / BT Tx and Rx PATH



4. TROUBLE SHOOTING

4.9 GPS/WIFI/BT Trouble shooting

4.9.1 A-GPS Block

TP1

TP2


4. TROUBLE SHOOTING

Set the phone GPS is ON

Check TP1 About 2.7V? Check power LRC filter solderingNo

Yes

Change the board

Check TP2 About 2.6V? Check SW and NV itemNo

Yes

12

R1025

FL1007

52

64

31IN

OUT

GOUT_NON

1G

2G

DNIC1097

L1034DNIL12

100p

L1032DNI

DNIC1105

U1004

3

2

5

4

1NI_F

R

FIL_OUT

VDD

S_D

GND

C10990.1u18p

C1098

L1036

3.3n

R1026

1K

6.8pC1107

C1093DNI

ANT1006 C1091

47p

VREG_RF_2.7V

ANT1005

5.6n

L1028

L1039100p

8.2nC1106

GPS_INGPS_MODE

DIVERSITY_IN

Near To LNA

Schematic of the A-GPS block

TP1

TP2



4. TROUBLE SHOOTING

4.9.2 WLAN/BT/FM Block

1

2

3

START

1. Check the Power

Component Change

2. Check the Clock

�. Check the Module


4. TROUBLE SHOOTING

TP5

8pFC7

DNIC16

ANT2

10uFC18

TP7

4.7uFC5

0.1uFC2

L1

3.3uH

L3

4.7u

605R

K001

C536

1u

U500

039282726252423222120 291817 161

31

3215

14

33

3413

3512

3611

3710

389

398

407

6

415

4

42

433

442

45

1

64748494051525354 51

DN

G

2D

NG

3D

NG

4D

NG

B_E

KA

W _TS

OH_L

W

DXT_T

RA

U_TB

N_ST

C_TR

AU_T

B

N _ST

R_TR

AU_T

B

DX

R_TR

AU_T

B

ANT

BT_PCM_CLK

GND5 BT_PCM_OUT

VDD_WL_PA BT_PCM_SYNC

BT_PCM_IN

SDIO_CMD

SDIO_CLK VDD_BT_PA

SDIO_D3

SDIO_D2 S_CLK_IN

SDIO_D1 GND6

SDIO_D0 FM_ANT

WL_RST_N BT_GPIO_0

WL_WAKE_B BT_GPIO_1

REG_ON BT_GPIO_3

VBAT_IN BT_GPIO_4

BT_GPIO_7

SR_VLX1

SR_VLX1BB F_CLK_IN

F_CLK_OUT

BB2

XLV_

RS

BB T

UO

V _R

S

OID

DV

UP_L

ATX

DS_

OID

DV

TU

O_ 2P1_

GID

TU

O_2P1_

GLN

A

ODL

V2P1_

NIV

TU

O _2O

DLNL

AD

S_TB

LC

S_TB

1OI

DU

A

2OI

DU

A

N_TS

R_ TB

7D

NG

C30

0.1u

435C

u2.2

C32

0.1u

C533

1u

C535 1n

C334.7uF

ANT1

1u

C8

C17

47p

C9

2.2u

TP12

C1 0.001uF

TP9TP1TP3TP11

TP4

TP10R1

0

C62.2uF

TP13

+VPWR

VREG_MSMP_2.6V

C34 4.7uF

TP8

10uFC19

0.1u

C31 TP6

VREG_MSMP_2.6V

U501

5

3 24 1

VOUTVINGNDSTBY

DN

GP

L4DNI

+VPWR

VDD_TCXO

VDD_TCXO

26MHzX500

TG-5010LH-87N

4 2

3 1NCOUT

GNDVCC

SLEEP_CLK

FM_L

FM_R

WLAN_HOST_WAKEUP

WLAN_RESET_N BT_WAKEUP

BT_PCM_CLK

BT_PCM_SYNC

BT_UART_TXD

BT_UART_RXD

BT_UART_CTSBT_UART_RTS

BT_HOST_WAKEUP

FM_ANTQ

ER_

KLC

CLK_REQ

CLK_IN

CLK_IN

RF_IN_OUT

RF_IN_OUT

BT_PCM_DOUT

BT_PCM_DIN

WLAN_CLKWLAN_CMD

BT_RESET_N

WLAN_REG_ON

WLAN_SDIO[3]WLAN_SDIO[2]WLAN_SDIO[1]WLAN_SDIO[0]

0603

0603

306

0

306

0

306

0

306

0

30

60 306

0

close to 3

close to 17

Must Check Schematic

26MHz TCXO

Wi-Fi&BT&FM MODULE

TCXO LDO

[Figure] Schematic of WiFi/BT module



4. TROUBLE SHOOTING

TP1

TP2

TP3


4. TROUBLE SHOOTING

START

TP1 1, 2, � is OK? Check the power blockNo

Yes

Board change

SDIO OK? UART OK? Module check

Yes

No



4. TROUBLE SHOOTING

Main clock part

CLK_IN

TP1TP2

TP1

TP2

605R

K001

C536

1u

435C

u2.2 C533

1u

C535 1n

U501

5

3 24 1

VOUTVINGNDSTBY

DN

GP

+VPWR

VDD_TCXO

VDD_TCXO

26MHzX500

TG-5010LH-87N

4 2

3 1NCOUT

GNDVCCCLK_REQ

CLK_IN0603

0603

3060

3060

26MHz TCXOTCXO LDO

TP1

Main clock part

TP2


4. TROUBLE SHOOTING

- Bluetooth RF Test procedure

1. Set phone to Bluetooth test-mode.

- Blue tooth ON: Enter Test Mode(277634#*#) Module test set BT DUT BT DUT ON

2. Insert a phone in a TEMCELL (in case of radiation test)

3. Set ‘discover’ after push menu button of the tester and select the link analyzer.

4. After ‘set test mode’, confirm the connection state.

5. Measure the power of full channel after hopping mode is selected to ‘ON’

6. You can select wanted test cases after getting an optimized power

7. Blue tooth On/Off

- Menu Key settings Wireless controls Bluetooth Turn on/Turn off



4. TROUBLE SHOOTING

4.10 Power ON Troubleshooting

Power On sequence of P509 is :

Power key press KPD_PWR_N go to low PM7540 Power Up VREG_MSMC1_1.2V(C433), VREG_MSMC2_1.2V(C434), VREG_MSME_1.8V(C435), VREG_MSMP_2.7V(C453), VREG_MSMA_2.6V(C452), VREG_TCXO_2.85V(C457) power ON Phone booting and PS_HOLD(D404) go to High

START

Battery voltage higher than �.70V(OCV)? Change or charging the Battery

No

Yes

Redownload SW image

VA20 hight to low when key pness? Check correctly working powerkeyNo

Yes

VMSMC1_1.2V, VMSMC2_1.2V,VMSMP_2.6V, VMSME_1.8V, VTCXO_2.85V,

VMSMA_2.6V power up?Change the Main board

No

Yes

is clock OK?X1:19.2M Change the Main board

No

Yes

P500h


4. TROUBLE SHOOTING

TP1 : KPD_PWR_N go to low



4. TROUBLE SHOOTING

VMSMC2_1.2V

VMSMC1_1.2V

VMSME_1.8V

VMSMP_2.6V

VMSMA_2.6V

VTCXO_2.85V

PS_HOLD


4. TROUBLE SHOOTING

4.11 Charging Trouble shooting

U400

96

53

4

82

71IN1 OUT1

IN2 OUT2

IC1

OVLO IC2DN

G

DN

GP

CN4

11

10

9

5

4

3

2

1

8

7

6

u 14 04

C

504C

u1

VCHG_VBUS

C40222p

FL1013

5

6

31

42P2 P4

P1 P3

6P

5P

p2 23 04

C

004DZ

FL400

1IN OUT

GND1 GND2

D400

USB_IDMAX_DP

MAX_DM


2mm

REV.E_CHANGED_0517

2mm

TA OVP Circuit

VBUS 2mm

u-USB Connector

C407100u

+VPWR_RF10nC408

VCHG_VBUS

VBAT

Q400

56473829110

DRAIN_B

NC1 COLLECTOR_B

COLLECTOR EMITTER

SOURCE BASE

DRAIN NC2

GATE

004R

1.0

10u

C409

+VPWR

+VPWR_RF|+VPWR

ISNS_P

CHG_CTL_N

BATT_FET_N

2mm1608

2009.11.16 changed

160810V

2mm1%ISNS_M

Charging Procedure- Connect TA or u-USB Cable- Control the charging current by PM7540 IC- Charging current flows into the battery

Check Point- Connection of TA or USB Cable- Charging current path(NUS55�0MIN)- Battery

Troubleshooting Setup- Connect TA and battery to the phone

Troubleshooting Procedure- Check the charger (TA or USB Cable) connector- Check the OVP Circuit- Check the charging current Path- Check the battery

Charging Current Flow

TA(5.1V)

MainBattery



4. TROUBLE SHOOTING

Check the pin and battery Connect terminals of I/O connector

Connection OK?No

Yes

Is the u- USB Cable)voltage 4.8V (or 5.0V)?

No

Yes

Is it charging properlyAfter turning on?

START

Check PMIC SMT status by X-ray Exchange PMIC or Change the main

board and Retest

Change I/O connector

Change TA (or u-USB cable)

ENDYes

No

Charger Troubleshooting Flow


4. TROUBLE SHOOTING

4. 12 3M AF Camera trouble

3M camera control signals are generated by ISX005 and MSM7227.

Check the camera Conn. and reconnect the camera

Camera is OK?

No

Change the Main board

ENDYes

Check IOVDD(TP5), DVDD(TP6), AVDD(TP7)

START

Yes

Check the EMI Filter(FL601, FL602)

Camera is OK

No

No

Yes

MSM 7227 output signal checkMCLK(TP1), PCLK(TP2),

Reset(TP�), Standby(TP4)

Change the camera

YesEND

Change the Filter(FL601, FL602)

No

No

Yes



4. TROUBLE SHOOTING

47

R211

DNI

C222

7.5p

C223

U15

W15

AC16

AB16

AF15

Y15

AC15

AB15

W14

AE14

AC14

Y14

AC13

U13

Y13

AB13

W13

W12

AB12

Y12

AC12

AC11

AF10

W9

AE10

U12

AF9

AC20

AF20

AB21

AE20

AF21

AF22

AC23

AE23

AC21

AF23

AE21

AB22

AC22

AE24

AE25

AF24GPIO_0GPIO_1GPIO_2GPIO_3GPIO_4GPIO_5GPIO_6GPIO_7GPIO_8GPIO_9

GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26GPIO_27GPIO_28GPIO_29GPIO_30GPIO_31GPIO_32GPIO_33GPIO_34GPIO_35GPIO_36GPIO_37GPIO_38GPIO_39GPIO_40GPIO_41GPIO_42

MOTION_INT

BT_WAKEUP


CAM_DATA[3]CAM_DATA[2]

PS_HOLDPM_INT_N

CAM_MCLKCAM_VSYNCCAM_HSYNC

AUDIO&MOTION_I2C_SCLLIN_PWM_FREQ

MUIC_I2C_SDA

MUIC_I2C_SCL

MUIC_INT

EARJACK_SENSE

PA_ON1

HS_MIC_BIAS_EN


CAM_RESET_NCAM_PWDN

CAM_DATA[4]CAM_DATA[5]CAM_DATA[6]CAM_DATA[7]CAM_PCLK

COMPASS_DRDY

KEY_COL[2]

KEY_COL[1]

KEY_COL[0]

KEY_ROW[1]

KEY_ROW[0]

WLAN_REG_ON

LNA_GAIN_CONTROL

DIVERSITY_LNA_EN

MOTION_I2C_SCLMOTION_I2C_SDA

REV.E_CHANGED_0517

TP1

FL600

7.5pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

FL601

7.5pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

FL602

7.5pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G


CAM_VSYNCCAM_HSYNC


FLT_CAM_VSYNCFLT_CAM_HSYNC

CAM_DATA[4]CAM_DATA[5]CAM_DATA[6]CAM_DATA[7]

FLT_CAM_DATA[0]FLT_CAM_DATA[1]FLT_CAM_DATA[2]FLT_CAM_DATA[3]

FLT_CAM_DATA[4]FLT_CAM_DATA[5]FLT_CAM_DATA[6]FLT_CAM_DATA[7]

1608

1608

1608

MSM7227

EMI FILTER


4. TROUBLE SHOOTING

516C

u1.0

FB600

120

FB602

120

33p

C608

C606

4.7u

416C

F u1

VA607

120

FB601

CAM_IOVDD_2.6V

CAM_AF_2.8V

FB603

120

CAM_DVDD_1.2V

CN600

17

16

15

14

13

12

11

10

9

8

7

6

5

314

323

332

341

30

29

28

27

26

25

24

23

22

21

20

19

18

R605 12

CAM_AVDD_2.7V

316C

u01406

RK2.2

30 6R

K2. 2C605

4.7uC604

4.7u

CAM_MCLK

CAM_I2C_SCLCAM_I2C_SDA

FLT_CAM_VSYNCFLT_CAM_HSYNC

CAM_RESET_N

CAM_PWDN

CAM_PCLK

FLT_CAM_DATA[0]FLT_CAM_DATA[1]FLT_CAM_DATA[2]FLT_CAM_DATA[3]FLT_CAM_DATA[4]FLT_CAM_DATA[5]FLT_CAM_DATA[6]FLT_CAM_DATA[7]

TP7TP6 TP5

TP3

TP4

TP2



4. TROUBLE SHOOTING

4. 13 Main LCD trouble

Main LCD control signals are generated by MSM7227. Those signal’s path are :

MSM7227 -> LCD Module

Press END key to tun the power On

Is the circuit powered?

Yes

END

Follow the Power ON trouble shooting

No

LCD display OK?

START

No

Check Power VREG_LCD_1.8V(TP1)VREG_LCD_2.8V(TP2)

No


Disconnect and reconnect LCD connector

Change the LCD module

The LCD works

Yes

Yes

Yes


4. TROUBLE SHOOTING

CN601

1312

1411

1510

169

178

187

196

205

214

223

232

241

1DZ

FL603

019

84736251


1G

2G


D600

4 3

5 2

6 12.2uC616 C617

2.2u

WLED_PWR

C4

4.7u

WLED5 WLED4

WLED3 WLED2

WLED1

WLED6WLED7

LCD_RESET_N

LCD_MAKERID_LOWMDDI_P_STB_MMDDI_P_STB_P


LCD_VSYNC_O


TP2TP1



4. TROUBLE SHOOTING

4.14 Proximity Sensor on/off trouble

Proximity Sensor is worked as below :

Send Key click Phone number click Call connected Object moved at the sensor

Control the screen’s on/off operation automatically

Measurement

VREG_MSMP_2.6V

VREG_PROX_2.6V

PROX_OUT

PROX_COMPASS_I2C_SCL / SDA

Object moved at the Proximity Sensor

LCD off?

No

Check PROXI_SDA / SCL output & Prox_out

No

No

Work well?

START

END

Change the Proximity Sensor U700

No

Yes

Send Key click & call connected

Chang the main board

Yes


4. TROUBLE SHOOTING

VREG_MSMP_2.6V

U700

5 4

6 3

7 2

8 1LEDASCL

LEDCSDA

VCCVIO

VOUTGND

C707

1u

R700

10

C708

0.1u

R703

10

VREG_PROX_2.8V

R702

4.7Kohms

R701

4.7Kohms

C709

4.7u

10u

C705

PROX_OUT


PROX_COMPASS_I2C_SDATP1

TP2

TP3



4. TROUBLE SHOOTING

4.15 Motion Sensor on/off trouble

Motion Sensor is worked as below :

Accelerometer Sensor function On Tilt the phone (90˚) The screen is had rotated automatically.

Measurement

VREG_MSMP_3.0V

MOTION_INT

MOTION_I2C_SDA / SCL

Tilt the phone

The screen is ratated

No

MOTION_INT outputNo

Yes

Work well?

START

END


No

Yes

Accelerometer Sensor function On


Yes

Check mation_I2C_SDA / SCLoutput

NoChange the Motion Sensor U50�

Yes

- 1�0 -LGE Internal Use Only Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

4. TROUBLE SHOOTING

045C

u1.0

U503

61

7 6

5

4

8

3

9

2

10

1

11

12

13

41 512

DE

VR

ES

ER

DD

V

GND3

GND2

INT1

VDD_IO

RESERVED1

NC1

INT2

NC2

SC

SCL_SPC

GND1

OD

S_ID

S_A

DS

0A

S_O

DS

4D

NG

VREG_MOTION_3.0V

10u

C541

815R

K2. 2

915R

K2.2

MOTION_INTMOTION_I2C_SCL

MOTION_I2C_SDA

TP1

TP3

TP2

- 1�1 -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


4. TROUBLE SHOOTING

4.16 Compass Sensor on/off trouble

Compass Sensor is worked as below :

Compass Sensor function On

Measurement

VREG_MSMP_2.6V

VREG_MOTION_3.0V

PROX_COMPASS_I2C_SCL / SDA

COMPASS_DRDY

Chang the position of thr phone

The direction is correct?

No

Check the COMPASS_DRDY &PROX_COMPASS_I2C_SDA

/ SCL output

No

Yes

Work well?

START

END

Change the Compass Sensor U1

No

Yes

Compass Sensor function On

Chang the main board

Yes


4. TROUBLE SHOOTING

C706

470n

VREG_MSMP_2.6VVREG_MOTION_3.0V

407C

n 01

U1

12

11

10

9

5

4

6

37

28

1D

DV

D

GE

RV

AD

NG

SD

NG

DD

VA

ADDR

SCL

NC1

TN

I

VPP

DRDY

SDA



TP3 TP2

TP1

- 1�� -Copyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes


4. TROUBLE SHOOTING

4.17 Q coin Motor

Q coin Motor is worked as below :

touch touch-window Vibration feedback

U601 : Used the PWM pulse

Measurement

VREG_MOTOR_3.3V

LIN_PWM_FREQ

MTR_N_2sub/MTR_P_2sub

Output of U602 OK? (L42-L18)

Yes

No

VREG_MOTOR_�.�V(C624) is �.�V?LIN_PWM_FREQ(U602)is working?

START

Check SW

Change the Q coin Motor(VB700)

Yes

No

Reboot

Check an U602 SMT status by X-ray, Exchange it

Work well?Yes

No

END

Measurement

VREG_MOTOR_�.�V

LIN_PWM_FREQ

MTR_N_2sub/MTR_P_2sub


4. TROUBLE SHOOTING

C623

0.1u

R614

4.7KohmsR617

51K

C625 10n

R612 100K

R618

1K

R615

1K

R616

51K


U602

B2C1

A1B1

B3C2

A3C3IN- VDD

IN+ VO+

_SHUTDOWN VO-

BYPASS GND

Q600

C

B

E GND

IN

OUT

C624

0.1u

R619 100K

LIN_PWM_FREQ

MTR_P_2sub

MTR_N_2sub

1%

1%

1%

1%1%

1%

TP2

VB700

2

1

3 L

n51

4AV

3AV

n51

1L

MTR_N_2sub

MTR_P_2sub

TP1

TP4

TP3



4. TROUBLE SHOOTING


5. DOWNLOAD


5. DOWNLOAD

5. DOWNLOAD

LG-P500h

LG-P500h

5. DOWNLOAD



5. DOWNLOAD



5. DOWNLOAD

LG-P500h

LG-P500h

LG-P500h



5. DOWNLOAD

LG-P500h

LG-P500h

5. DOWNLOAD



5. DOWNLOAD

LG-P500h

5. DOWNLOAD




5. DOWNLOAD5. DOWNLOAD



5. DOWNLOAD

LG-P500h

LG-P500h

LG-P500h

LG-P500h

LG-P500h

LG-P500h

LG-P500hLG-P500h

5. DOWNLOAD




5. DOWNLOAD

LG-P500h LG-P500h

LG-P500h LG-P500h

LG-P500h

LG-P500h LG-P500h

5. DOWNLOAD



5. DOWNLOAD

LG-P500h LG-P500h

LG-P500h

LG-P500h

5. DOWNLOAD



6. BLOCK DIAGRAM

6. BLOCK DIAGRAM

USBH DM & DP



BT_UART

Capacitive Touch(Melpas + LGIT)

Key LEDKey LED

MUIC_I2C

MMC

USBPHY

SIM

UART3

LCD Backlight ICAAT2862

BL_I2C

DDR SDRAM(4G)NAND FRESH (4G)

EBI1 (DDR)

CAM I/F

TX_IQ, PRX_IQ

MOTION_I2C

BT_PCM

FM_L&R

RF I/F

USIM KPD_PWR_N

I2C

PRX_IQ

GPS

CAM_I2C

MSM7227EBI2 (NAND)

WLAN_SDIOLINE_L& R

LBEH19UNBC-338

Bluetooth v2.1Wi-Fi 802.11b/g

FM Radio

BT & Wi-Fi

FM

FEM(SKY77544)

FEM(SKY77544)DRX_IQ DRX_IQ

GPIO59

GPS

GSM & WCDMA

CAM 3M

TOUCH I2C

MCP(Micron)

Prox Sensor(GP2AP002S00F)

PROX_I2C

SBDT

MOTION Sensor(KR3DM) MOTION_INT

FUEL_I2C

Back Key

UART3

Array TPREMOTE_PWR_ON

MPP3,4

USIMUSIM I/F

GPIO106 SBDT_SSBI

PM7540KPD_DRV_N

PMIC_SSBI

AMUX_OUTHKAIN2 AMUX_OUT

AMUX_OUTPM_INT_N MSM_INT_NGPIO24

PWR/End Key

PON_RESET_N

PS_HOLDGPIO25RESIN_N

nJTAG_RESOUTJTAG_PS_HOLD

JTAG

JTAG CONN.JTAG(TCK,TDI,TDO…)UART3_TX/RX

QTKEY_I2C

System HW Block Diagram All System

Fuel Gauge(MAX17040G)Fuel Gauge(MAX17040G)

PS_HOLD

MDDI Interface

Home Key

Send Key

MUIC(TS5USBA)

MUIC(TS5USBA)

I2C

5pin

_USB

Con

nect

or5p

in_U

SBC

onne

ctor

Main Board

LINE_ON&OP

EAR1_OP&ON

HPH_L&R

LINE_OP, LINE_ON

RCV_P & N

HPH_R, HPH_L



GPIO_28 LIN_PWM_FREQ

Menu Key

Volume Key

Sub FPCB

MT29C4G96MAZAPCJA-5 IT

MIC MIC

USIM

SPK_RCVP, N

Speaker & Receiver

3.5 piEarjack

EAR_L, RCOMPASS_I2CDigital Compass

(AMI304) COMPASS_INT

Key COL, Key ROW

MDDI Interface

3.2" HVGA 320*480

Audio SubWM9093ECS-R

TOUCH INT

GPIO_27

GPIO36 ~ 38

Backlight_Key

AUDIO_I2C

TCXO_19.2MHz(Kyocera)

RTR_TRK_LO_ADJ

TCXO_IN

TCXO

TCXO_RTR_19.2MHzTCXO_PM_19.2MHz

TCXO_26MHz

FM_L&RF_CLK_IN

CLK_REQ


6. BLOCK DIAGRAM

RF Block Diagram



6. BLOCK DIAGRAM


5. DOWNLOAD

3.5

1.8V LDORP103K181D

Audio Block Diagram



5. DOWNLOAD

WiFi/BT/FM Radio Block Diagram

26MHzTCXO

32.768KHz

PM7540

SLEEP_CLK(LPO Clock:32.768KHz)

3.5Ear JackFM_ANT

LBEH

19U

NB

C

MSM

7227

CLK_IN

- 155 -

7. CIRCUIT DIAGRAM

LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

33p

C1087

C36

1.2p

12

R1025

L1045

DNI

C1079

8.2p

DNI

R9

FL1007

52

64

31IN

OUT

GOUT_NON

1G

2G

2.2K

R1006

C11221.2p

L1030DNI

U1002

313029

44434241

403938

736353

1615

413121110 1

343332

17

9

188 197 206 215 224

32

3

42

2

52627282

1DCS_PCS_IN

11D

NG

01D

NG

9D

NG

8D

NG

GND1

7D

NG

GSM_IN

6D

NG


ANT

ED

OM

WCDMA3

PGND4PGND5PGND6 P

MET

4X

R3

XR

2X

R1

XR

WCDMA1WCDMA2

7D

NG

P8

DN

GP

9D

NG



PGND1PGND2PGND3

DNIC1097

39pC1024

L1034DNI

L100382n

82nL1008

0.5pL1011

DNIL1014

L1015

100pL10165.6n

L1151

3n

C1929

100p

2.2R1010

10R1012

031

4R

47

R6

031

5R

C10090.0082uH

C2310p

FL1012

1960MHz45

1

32G1 O1

ING2 O2

8.2n

L2

L1027 3.3n

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

L

K

J

I

H

G

F

E

D

C

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

R1004

2.7n

18nL1004

FL1005

836.5MHz

3 2

4 1

5GND

INOUTG1G2

9401C

u1.0

10u

C1163

51

11R

+VPWR_RF

C1043

10u

100pC1065

75

R7

VREG_SMPS_2.1V

C1153

33p

33pC1046

C1022 33p

R19

0

18nL1005

5501C

u1.0

u1.00301

C

IN

D

3611R

p227201

C

12KR10181842.5MHz,1960MHz

FL1002

103

52

81

9

6

74IN_1842_5 OUT_1842_5_1

OUT_1842_5_2

OUT_1960_1

IN_1960 OUT_1960_2

GND1 GND3

GND2 GND4

K19101

R

33pC1020

C1086DNI

C1042

6.8n

U1001

32

92

82

53

43

96

62

61

60

54

4336

3738

2768

2552

2142

8

745

144

5347

2246

10

649

448

3

51

6750

1939

40

18

1741

16

1533

32

1331

1430

12

1159

58

956

24

557

55

65

6620

632

6426RF_ON TX_IP

TCXO TX_IN

SBDT TX_QP

TX_QN

LB_RF_OUT1

LB_RF_OUT2 VTUNE1

VTUNE2

HB_RF_OUT1 VTUNE_GPS

HB_RF_OUT2

HB_RF_OUT3 PRX_QP

PRX_QN

WPRXLBP PRX_IP

WPRXLBN PRX_IN

WPRXHBP

WPRXHBN DRX_QP

DRX_QN

WDRXLB DRX_IP

DRX_IN

WDRXHB1

WDRXHB2 NC

GCELL_INP DAC_IREF

GCELL_INN

VDDA1_1

EGSM_INP VDDA1_2

EGSM_INN VDDA1_3

VDDA1_4

DCS_INP VDDA1_5

DCS_INN VDDA1_6

GPCS_INP VDDA2_1

GPCS_INN VDDA2_2

VDDA2_3

GPS_IN VDDA2_4

PDET_IN VDDA2_5

TX_RBIAS VDDA2_6

WPRXSE1 VDDA2_7

WPRXSE2 VDDA2_8

VDDA2_9

VDDA2_10

VDDA2_11

VDDA2_12DN

GP

TU

O_2E

SX

RP

W

TU

O_1E

SX

RP

W

PNI_

XM_

BW

MNI_

XM_

BW

MD

DV

5.6n

C1040

C1011 100p

VREG_RF_2.7V

10 R1016

u1.08301

C

C1052

6.8n

5.6n

C1036

1nC1018

C1023

4.7p

L100718n

FL1009

1880MHz

5 2

4 1

3G3

INOUTG1G2

C1090

12p

R101710

68pC1010

ANT1003

C1012 100p

C1017 33p

VREG_MSMP_2.6V

7601C

u1.0

C101968p

L11DNI

3501C

u1.0

u010501

C

p229201

C

7301C

n1

u1.09501

C

0601C

u1.0

C1025

4.7p

22nL1010

u7.46501

C

4501C

u7.4

u1.08501

C

7501C

u1.0

22pC1064

p0018601

C

0.1uC1066

3601C

u1.0

2.2p

C1016

2.2p

C1004

19

61R

C1045 1n

L12100p

VDD_RX

1nC1047

2.7nL1035

FL2

836.5 MHz,881.5 MHz

75

84 92

3

16ANT RX

TX

GND1GND5GND2GND6

GND3 GND4

FB2

0

C1081DNI

8711R

0

ANT1002

L10216.8n

C1088

15p

12nL1013

L1025

1.5n

R10051p

33pC1005

C1084

3n

1nC1048

2140 MHz

FL1011

52

41

3G3

IN OUTG1 G2

3.9pC1069

L1033DNI

L1018

1.8n

0R1015

C1051 1n

2nL1017

L1019

1.8n

DNIC1070

C100756p

DNIC1105

C1080 3.9p

U1004

3

2

5

4

1NI_F

R

FIL_OUT

VDD

S_D

GND

C10990.1u18p

C1098

19

51R

C1073DNI

L1036

3.3n

R1026

1K

VDD_RX

C1072 33p33pC1071

6.8pC1107

8R 0

47pC1044

22p

C25

FL1008

75

84

92

3

16ANT RX

TX


C1093DNI

2140MHz

FL1003

45

1

32G1 O1

ING2 O2

10nC1013

10n

C20

DNIL1020

U1003

61 51

8 7

9 6

10 5

11 4

12 3

13 2


VMODE_0GND3

VMODE_1VCC2_2

VCC2_1GND2


VEN_BAND_IGND1

IN_BAND_ICPL_OUT

1D

NG

P

2D

NG

P

DNI

R12

3.3p

C1089

L1042

5.6n

5.6nL1029

33

R1022

18

R1023

+VPWR_RF

C10750.001uF 10u

C1077330pC1076

L1026DNI

C1109

33L1041

1.5n

C1154

4.7n

C10921.5n

C1083

33p

100p

C1094 C1096

100p 100p

C1095

C11

100p

4301C

u1.0

33pC1118

C1127

DNI

p221301

C

p223301

C

VREG_TCXO_2.85V

ANT1006 C1091

47p

BGA735L16U2

9

8

7

6

5

014

113

2 12

311

14

15

16

17PGND

RFOUTM

RFOUTH

RFOUTL

CN

FE

RR

SG

V1

NE

V

CC

V2

NE

V

1H

DN

GFR

LNIF

R

2H

DN

GFR

RFINM

RFINH

RFGNDM1

RFGNDM2U1006

7

43

52

61RFIN RFOUT

EN RREF

GS VCCDN

GP

C1130

10n

VREG_RF_2.7V

ANT1005

R1030 27K

5.6n

L1028

C1120 10p C1121 33p

C1015 10n

u1.02301

C

2601C

u1.0

u1.01601

C

VREG_TCXO_2.85V

L1031DNI

L1044

3.6n

10pC1119

L1043

2n

100p

C1129

FB3

0

U1005

6 5

7 4

8 3

9 2

10 1

11PGND

VCC1VCC2

RFINRFOUT

VMODE_1CPL_IN

VMODE_0GND

VENCPL_OUT

C11121.5p

881.5MHz,942.5MHz

FL1001

103

52

81

9

6

74IN_881_5 OUT_881_5_1

OUT_881_5_2

OUT_942_5_1

IN_942_5 OUT_942_5_2

GND1 GND3

GND2 GND4

+VPWR_RF

L1048

5.6n

C1123DNI

1950MHz

FL1006

5 2

4 1

3G3

INOUTG1G2

22pC22

C37

1.2p

C14

27p

10p

C27

C11480.5p

2.7nL6

C11111.5p

22n

L8

10nL9

2.2n

L10

C1113100p

C1104

1n

DNIC1128

C1110100

C1114100p 100p

C1115

2.2uC1102

33pC1103

C1108 33p

C11160.5p

R24

33p

L1040

2.4n

FL1010

1880,1960MHz

75

84

92

3

16ANT RX

TX

GND1 GND6

GND2 GND5

GND3 GND4

22p

C24

C1078

22p

L4000DNI

C1117DNI

L113018n

L10326.8n

SW1001

43

2

1ANT COMMON

G3 G4

u1.08201

C

DNIL1002

33p

C1014

33p

C1021

DNIL1006

33pC1039

27nL1009

33pC1041

DNIL1012

10nL1022

L53.3n

L7

1n

3.3n

C10

L1039100p

8.2nC1106

12p

C28

L1150DNI

001R

L1120DNI

L1110DNI

100p

C12

100p

C13

27K

R18

C1728DNI

4.7p

C15

C1928DNI

FL1881.5MHz

45

1

32G1 O1

ING2 O2

DNI

R1021

0

R14

C262.7p

C1003

10p

9.94

7201R

4.7uC1162

4.7uC1160

R1029DNI

ANT_SEL1

ANT_SEL2ANT_SEL0

ANT_SEL3

TCXO_RTR_19.2MHZ

GSM_PA_RAMP

TX_ON

VSNS_RF_SMPS

VREG_SMPS_2.1V|VSNS_RF_SMPS

PA_ON1

GND

GND

PA_ON0

PA_R0

PA_R0

PA_ON2

GPS_IN

GPS_IN

DCS_PCS_TX

DCS_PCS_TX

GSM_TX

GSM_TX

WCDMA_2100_RTX

WCDMA_2100_RTX

RX_PCS_P

RX_PCS_P

RX_PCS_M

RX_PCS_M

RX_DCS_MRX_DCS_M

RX_GSM_900_P

RX_GSM_900_P

RX_GSM_900_M

RX_GSM_900_M

RX_GSM_850_P

RX_GSM_850_P

RX_GSM_850_M

RX_GSM_850_M

WCDMA_2100_TX_OUT

WCDMA_2100_TX_OUT

RX_WCDMA_2100

RX_WCDMA_2100

PDET_IN

PDET_IN

DAC_REF

TX_I_P

TX_I_M

TX_Q_P

TX_Q_MRX0_I_PRX0_I_M

RX0_Q_MRX0_Q_P

RX1_I_PRX1_I_M

RX1_Q_MRX1_Q_P

GPS_MODE

RTR6285_SSBI

RX_DCS_P

RX_DCS_P

RX_WCDMA_1900_M

RX_WCDMA_1900_M

RX_WCDMA_1900_P

RX_WCDMA_1900_P

WCDMA_1900_TX_OUT

WCDMA_1900_TX_OUT

RX_WCDMA_850_P

RX_WCDMA_850_P

RX_WCDMA_850_M

RX_WCDMA_850_M

WB2100_MIX_INM

MNI_

XIM_0012

BW

WB2100_MIX_INP

PNI_

XIM_0012

BW

WCDMA_850_RTX

WCDMA_850_RTX

WCDMA_850_TX_OUT

WCDMA_850_TX_OUTRX_WCDMA_1900_LNA_OUT


RX_WCDMA_1900_SE

RX_WCDMA_1900_SE

PA_R1

PA_R1

WCDMA_1900_RTX

WCDMA_1900_RTX

DIVERSITY_IN

DIVERSITY_IN

AWS_RXDIV_LNA_OUT

AWS_RXDIV_LNA_OUT



INTER_RX_SW_SEL_1

INTER_RX_SW_SEL_2

LNA_GAIN_CONTROL

DIVERSITY_LNA_EN

0603

W1900

0603

80

61

0603

30

60

50

01

50

01

W2100

VDDA1 : Pin 3,4,6,10,22,53 = +2.7V VDC

GSM Quad

LOW

GSM850 RX

ANT_SEL0 ANT_SEL1 ANT_SEL2

GSM900 RX

DCS1800 RX

VDDA2 : Pin 1,7,8,21,25,27,37,43,54,60,61,62 = +2.1V VDC

ANT_SEL3

LOW

LOW

ANTENNA SWITCH MODULE LOGIC(SKY77544)

LOW

HIGH HIGH LOW

LOW

LOWLOWLOW

LOW

2mm

11dB

LOW

DCS(1805-1880 MHz)

PCS(1930-1990 MHz)

GSM(925-960 MHz)

LOW

LOW (X)

GSM(869-894 MHz)

LOW (X)

LOW (X)

EUSY0344001

W900(W850)

LOW (X)

HIGH

HIGH

7dB

HIGH

HIGH

LOW LOW

LOW

LOW

HIGH

HIGH

+2.1V

GSM850(824-849MHz)

1%

HIGH

PCS1900 RX

W1700

GSM850/GSM900 TX

8061

+2.7V

DCS1800/PCS1900 TX

HIGH

HIGH

HIGH

HIGH

GSM900(880-915MHz)

HIGH

HIGH

LOW

PCS(1850-1910 MHz)

DCS(1710-1785 MHz)

Band I

Band 5

W2100

W850

AWS DIVERSITY

WCDMA Triple

LNA for the GPS

W2100 RX(2110 - 2170 MHz)

WCDMA RX 2100 LNA Circuit

0603

0603

WCDMA 1900 Tx (1850-1910MHz)

Band 2

0603

0603

0603

0603

3060

306

0

30

60

30

60

0603

0603

0603

Near To LNA

Near To RTR



7. CIRCUIT DIAGRAM


L

K

J

I

H

G

F

E

D

C

B

A

12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

12 11 10 9 8 7 6 5 4 3 2 1

302R

K01

R208 220

2.2n

C204

VBAT

UAT200

12

11

10

9

8

7

6

5

4

3

2

1GND

RX

TX

NC1

ON_SW

VBAT

NC2

NC3

NC4

DSR

RTS

CTS

GND

RX

TX

VCHAR

ON_SW

VBAT

PWR

URXD

UTXD

3G2.5G

VCHG_VBUS

VREG_MSMP_2.6V

11 2C

Fu1

202R

K1

CN200

1615

87

96

105

114

123

132

141

1817

102R

K01

R210 100K

U201

3

2

4

15

VCC

GND

R218 100

202A

V

002A

V

102A

V

312R

K01

R215 100

C220 0.1u

C221 330p

VREG_MSMA_2.6V

412C

u1.051 2

Cu 1. 0

712C

u1.0

VREG_TCXO_2.85V

R216 1K

330pC210

C227

0.1u

330pC207

C202

0.1u

612C

u1.0

C201

47p

VREG_MSMP_2.6V

402R K 2. 2

VREG_MSMA_2.6V

VREG_MSMP_2.6V

R217 100

312C

F u1

102D

49.9

R214

002C

p74

R219 1K

C205

1n

812C

u1.0

302A

V

C20322u

702R

IND

R26

0

R220 K001

002D

21 2C

u1.0

15002

R

U202

43

52

61D VCC

CP NC

GND Q

912C

u1.0

TP201

33p

C225

47

R211

DNI

C222

7.5p

C223

C206

0.1u

0.1u

C224

VREG_TCXO_2.85V

C226

33n

2KR212

19.2MHzKT3225L19200DCW28RA0

X200

42

31VCONT OUT

GND VCC

402A

V

502A

V

TP202

TP203

R205 100

TP200

602R

0406

SU

BV_

GH

CV

MIC_BIAS

R209 33

U200

M5

Y18

AC19

AF18

Y17

U16

AC18

AF17

W16

AE17

AC17

Y16

AB17

W5

W3

V5

V6

AB9

V9

V8

Y9

W8

AB8

V3

V2

U2

U8

U9

AF4

AE2

AB7

AE4

AE3

AD3

L2

L8

L3

L9

AD2

AC6

AC3

AC2

U15

W15

AC16

AB16

AF15

Y15

AC15

AB15

W14

AE14

AC14

Y14

AC13

U13

Y13

AB13

W13

W12

AB12

Y12

AC12

AC11

AF10

W9

AE10

U12

AF9

AC20

AF20

AB21

AE20

AF21

AF22

AC23

AE23

AC21

AF23

AE21

AB22

AC22

AE24

AE25

AF24

6M

8M

9M

8E

A

7F

A

8C

A

6F

A

7C

A

6E

A

11

R

81

BA

81

W

11

Y

71

C

71

B

61

H

81

H

71

M

62

G

01

Y

11

T

01

W

61

EA

8F

A

61

FA

5F

A

31

F

21

C

21

B

11

H

11

J

21

H

21

J

11

E

21

F

11

F

21

E

91

EA

91

FA

02

BA

51

C

61

F

31

H

41

H

41

J

31

J

11

C

41

L

3F

2F

3E

2E

2D

52

G

61

L

91

C

91

B

91

H

62

F

02

H

81

J

71

J

32

H

22

F

32

F

61

J

71

E

51

J

71

F

61

B

61

C

51

H

81

B

52

B

12

F

02

B

02

F

71

H

02

E

02

C

81

C

81

F

B21

B22

C21

E21

C22

C24

E26

B24

F25

C26

D26

C23

B23

C25

D25

E23

W20

AD26

N17

T20

J25

M20

N25

V26

H26

L25

P20

U26

V19

AC25

U19

U20

AB23

W25

W26

R19

T19

W22

AC26

V23

AB26

AB25

AA23

AA25

Y26

Y23

T17

Y22

W23

AA26

V20

J26

K20

J20

J23

J22

K19

K26

L22

L19

L23

L20

M19

L26

M26

M22

M23

N26

N19

N20

P26

R26

P19

R25

T26

R22

R23

R20

T23

T22

U25

U23

U22

4C

6G

5G

6N

3N

2N

2W

6W

3M

8T

2K

3K

2J

3J

2H

3H

2G

3G

6R

2P

3P

2R

3R

11

B

41F

A

31

FA

21

FA

11

FA

5B

A

3B

A

2B

A

3A

A

2A

A

2Y

6A

A

2M

3U

11

W

9E

A

9C

A

6B

A

3Y

71

W

91B

A

51

E

41

C

31

C

51

B

41

B

31

B

8H

6F

5F

01

J

01

H

9H

01

C

01

B

9C

9B

8F

8E

7F

7E

7C

7B

6C

5C

6B

5B

PI_R_E

NIL

NI

_R_EN

IL

PI_L_E

NIL

NI_L_E

NIL

P1CIM

N1CIM

P2CIM

N2CIM

PIXUA

NIXUA

PO_ENI

LNO_EN

IL

PO_1R

AE

NO_1

RA

ETUOXUA

R_H

PH

L_HPH

PM

OCC

SAIB_C

IM

FERV_

HPH

KL

CS

YS_YH

PBSU

PD

_Y

HPBSU

ND_

YHPBS

UD

I_YHPB

SU

SUBV_Y

HP

BSU

TXER_Y

HPBSU

N_NISER

N_TUO

SER

NE_G

ODW

0_E

DOM

1_E

DOM

2_

EDOM

3_EDOM

OXCT

JDA_

OL_KRT

KLC_

PEELS

IDTSMTN

_TSRT

OD

TKCTKCTR

P_

ATAD_I

DDM

N_ATAD_I

DDM

P_BTS_I

DDM

N_BTS_I

DDM

KLCP_C

DCL

P_TU

O_I

N_TU

O_I

P_T

UO_Q

N_T

UO_Q

FE

R_CAD

0HC_PI

_I

0HC_M

I_I

0HC_P

I_Q

0HC_

MI_Q

1HC

_PI_I

1H

C_MI_I

1HC_PI_Q

1HC_MI_

Q

NO_XT

JDA_

CGA_XT

0NO

_AP

0E

GNAR_AP

LTC_RWP

_AP

M_LTC_R

WP_AP

FER_GB_

MSG

0NIAK

H1NIAK

H2NI

AKH

EBI1_DQ_0EBI1_DQ_1EBI1_DQ_2EBI1_DQ_3EBI1_DQ_4EBI1_DQ_5EBI1_DQ_6EBI1_DQ_7EBI1_DQ_8EBI1_DQ_9EBI1_DQ_10EBI1_DQ_11EBI1_DQ_12EBI1_DQ_13EBI1_DQ_14EBI1_DQ_15EBI1_DQ_16EBI1_DQ_17EBI1_DQ_18EBI1_DQ_19EBI1_DQ_20EBI1_DQ_21EBI1_DQ_22EBI1_DQ_23EBI1_DQ_24EBI1_DQ_25EBI1_DQ_26EBI1_DQ_27EBI1_DQ_28EBI1_DQ_29EBI1_DQ_30EBI1_DQ_31

EBI1_ADR_0EBI1_ADR_1EBI1_ADR_2EBI1_ADR_3EBI1_ADR_4EBI1_ADR_5EBI1_ADR_6EBI1_ADR_7EBI1_ADR_8EBI1_ADR_9EBI1_ADR_10EBI1_ADR_11EBI1_ADR_12EBI1_ADR_13

EBI1_CKE0EBI1_CKE1EBI1_DCLKEBI1_DCLKBEBI1_WE_NEBI1_CS0_NEBI1_CS1_NEBI1_BA_0EBI1_BA_1EBI1_DQS_0EBI1_DQS_1EBI1_DQS_2EBI1_DQS_3EBI1_DM_0EBI1_DM_1EBI1_DM_2EBI1_DM_3EBI1_RAS_NEBI1_CAS_NEBI1_RESOUT_NEBI1_CAL

EBI2_DATA_0EBI2_DATA_1EBI2_DATA_2EBI2_DATA_3EBI2_DATA_4EBI2_DATA_5EBI2_DATA_6EBI2_DATA_7EBI2_DATA_8EBI2_DATA_9EBI2_DATA_10EBI2_DATA_11EBI2_DATA_12EBI2_DATA_13EBI2_DATA_14EBI2_DATA_150

_R

DA

_2

IB

E

1_

RD

A_2

IB

E

2_R

DA_2IBE

3_R

DA_2IBE

4_R

DA_2IBE

5_R

DA_2IBE

6_R

DA_2IBE

7_R

DA_2IBE

8_R

DA_2IBE

9_R

DA_2IBE

01_R

DA_2IBE

11_R

DA_2IBE

21_R

DA_2IBE

31_R

DA_2IBE

41_R

DA_2IBE

51_R

DA_2IBE

61_R

DA_2IBE

N_0

SC_2IBE

N_1

SC_2IBE

N_4

SC_2IBE

N_5

SC_2IBE

N_6

SC_2IBE

N_7

SC_2IBE

KLC_2IBE

N_

EW_2IBE

N_

EO_2IBE

N_

BU_2IBE

N_

BL_2IBE

N_0YS

UB_2IBE

REPIW

RL_ST

LL_ST

RU_ST

LU_ST

231_OIPG

131_OIPG

031_OIPG

921_OIPG

821_OIPG

721_OIPG

621_OIPG

521_OIPG

421_OIPG

321_OIPG

221_OIPG

121_OIPG

021_OIPG

911_OIPG

811_OIPG

711_OIPG

611_OIPG

511_OIPG

411_OIPG

311_OIPG

211_OIPG

111_OIPG

011_OIPG

901_OIPG

801_OIPG

701_OIPG

601_OIPG

501_OIPG

401_OIPG

301_OIPG

201_OIPG

101_OIPG

001_OIPG

99_OIPG

89_OIPG

79_OIPG

69_OIPG

59_OIPG

49_OIPG

39_OIPG

29_OIPG

19_OIPG

09_OIPG

98_OIPG

88_OIPG

78_OIPG

68_OIPG

58_OIPG

GPIO_0GPIO_1GPIO_2GPIO_3GPIO_4GPIO_5GPIO_6GPIO_7GPIO_8GPIO_9GPIO_10GPIO_11GPIO_12GPIO_13GPIO_14GPIO_15GPIO_16GPIO_17GPIO_18GPIO_19GPIO_20GPIO_21GPIO_22GPIO_23GPIO_24GPIO_25GPIO_26GPIO_27GPIO_28GPIO_29GPIO_30GPIO_31GPIO_32GPIO_33GPIO_34GPIO_35GPIO_36GPIO_37GPIO_38GPIO_39GPIO_40GPIO_41GPIO_42GPIO_43GPIO_44GPIO_45GPIO_46GPIO_47GPIO_48GPIO_49GPIO_50GPIO_51GPIO_52GPIO_53GPIO_54GPIO_55GPIO_56GPIO_57GPIO_58GPIO_59GPIO_60GPIO_61GPIO_62GPIO_63GPIO_64GPIO_65GPIO_66GPIO_67GPIO_68GPIO_69GPIO_70GPIO_71

GPIO_72_GRFC_9GPIO_73_GRFC_8GPIO_74_GRFC_7GPIO_75_GRFC_6GPIO_76_GRFC_5GPIO_77_GRFC_4GPIO_78_GRFC_3GPIO_79_GRFC_2GPIO_80_GRFC_1GPIO_81_GRFC_0

GPIO_82GPIO_83GPIO_84

C208

10n

SDRAM_ADDR[13]

TS

R_N

OPn

SMT_

MS

M

MSM_TMS

ODT_

MS

M

MSM_TDO

IDT_

MS

M

MSM_TDI

PMIC_TCXO

OX

CT_CI

MP

KCT_

MS

M

MSM_TCK

TU

OS

ER_

GATJn

nJTAG_RESOUT

KLC_

PE

ELS

KCT

R_M

SM

MSM_RTCK

nRESETOUT

IB

SS_

CIM

PN

E_O

XCT

TCXO_EN

2E

Wn

2B

Un2

EOn

2BLn

EBI2_DATA[9]EBI2_DATA[8]EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]

EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]

EBI2_DATA[1]EBI2_DATA[0]

SC_

HS

ALF_D

NA

Nn

YD

AE

R_H

SALF_

DN

AN

nSDRAM_WE

nSDRAM_RAS

SDRAM_DQS3SDRAM_DQS2SDRAM_DQS1SDRAM_DQS0

SDRAM_DQM3SDRAM_DQM2SDRAM_DQM1SDRAM_DQM0

SDRAM_DCLK1SDRAM_DCLK0

nSDRAM_CAS

SDRAM_BA1SDRAM_BA0

SDRAM_ADDR[9]SDRAM_ADDR[8]SDRAM_ADDR[7]SDRAM_ADDR[6]SDRAM_ADDR[5]SDRAM_ADDR[4]SDRAM_ADDR[3]SDRAM_ADDR[2]

SDRAM_ADDR[12]SDRAM_ADDR[11]SDRAM_ADDR[10]

SDRAM_ADDR[1]SDRAM_ADDR[0]

ANT_SEL1ANT_SEL2

ANT_SEL0

ANT_SEL3

TCXO_RTR_19.2MHZ

PM

AR_

AP_

MS

G

JTAG_PS_HOLD

MOTION_INT

TU

O_X

OR

P

NO_

ENIL

PO _

ENIL

L_MF

R_M F

MD_

HB

SU

PU

EK

AW_T

SO

H_N

ALW

N_TE

SE

R_N

ALW

BT_WAKEUP

MICROSD_DET_N


REMOTE_PWR_ON

REMOTE_PWR_ON

TU

O_X

UM

A

FE

R_C

AD_

AP_

MS

G

TCXO_PM_19.2MHZ

RTR_TRK_LO_ADJ

RTR_TRK_LO_ADJ

P1_CI

M

UART3_TX

XT_3TR

AU

UART3_TX

UART3_TX

UART3_RX

XR_3T

RA

U

UART3_RX

UART3_RX

BT_PCM_CLKBT_PCM_SYNC

PD_

HB

SUR_

HP

HL_

HP

H

MMC_CMDMMC_DATA[0]MMC_DATA[1]MMC_DATA[2]MMC_DATA[3]MSM_USIM_DATA

MSM_USIM_RSTMSM_USIM_CLKBT_UART_TXDBT_UART_RXDBT_UART_CTSBT_UART_RTS


PS_HOLDPM_INT_N

BT_HOST_WAKEUP

CAM_MCLKCAM_VSYNCCAM_HSYNC

AUDIO&MOTION_I2C_SCLLIN_PWM_FREQ

P_V

CR

N_V

CR

NO_

XT

MUIC_I2C_SDA

MUIC_I2C_SCL

MUIC_INT

BT_PCM_DOUTBT_PCM_DIN

EARJACK_SENSE

AD

S_C2I_

HC

UOT

TNI_

HC

UOT

LC

S_C2I_

HC

UOT

LCD_BL_EN

PA_ON1

MMC_CLK

SDRAM_DATA[31]SDRAM_DATA[30]SDRAM_DATA[29]SDRAM_DATA[28]SDRAM_DATA[27]SDRAM_DATA[26]SDRAM_DATA[25]SDRAM_DATA[24]SDRAM_DATA[23]SDRAM_DATA[22]SDRAM_DATA[21]SDRAM_DATA[20]SDRAM_DATA[19]SDRAM_DATA[18]SDRAM_DATA[17]

SDRAM_DATA[15]SDRAM_DATA[14]SDRAM_DATA[13]SDRAM_DATA[12]SDRAM_DATA[11]SDRAM_DATA[10]SDRAM_DATA[9]SDRAM_DATA[8]SDRAM_DATA[7]SDRAM_DATA[6]SDRAM_DATA[5]SDRAM_DATA[4]SDRAM_DATA[3]SDRAM_DATA[2]SDRAM_DATA[1]SDRAM_DATA[0]

SDRAM_DATA[16]

nSDRAM_CS0

KLC

SY

S_H

BS

U

USBH_SYSCLK

AD

S_

C2

I_

LE

UF

FUEL_I2C_SCL

SDRAM_CKE0

HS_MIC_BIAS_EN

WLAN_CLKWLAN_CMD

CI

M_

SH

CIM_

SH

NTS

RT_M

SM

MSM_TRSTN


N_

TES

ER

_D

CL

LC

S_C2I_

SS

AP

MO

C_X

OR

P

WO

L_D

IR

EK

AM_

DC

L

AD

S_C2I_

SS

AP

MO

C_X

OR

P


N1_CI

M

GND|MIC_1N

N_

TES

ER

_T

B

nSDRAM_CS1

SDRAM_CKE1

CAM_RESET_NCAM_PWDN


LC

S_C2I_L

B_D

CLA

DS_

C2I_LB_

DCL

CAM_PCLK

M_

BTS

_P

_IDD

MP_B

TS

_P_

IDD

MM

_AT

AD

_P_I

DDM

P_AT

AD_

P_I

DDM

O_

CNY

SV

_D

CLM

COMPASS_DRDY

KEY_COL[2]

KEY_COL[1]

KEY_COL[0]

KEY_ROW[1]

KEY_ROW[0]

WLAN_REG_ON

0N

O_A

P0

R_A

P

2N

O_A

P

FE

R_C

AD

P_I_XT

M_I_XT

P_Q_

XTM_

Q_XT

P_I_0X

RM_I_0

XR

M_Q_0

XR

P_Q_0

XR

P_I_1X

RM_I_1

XR

M_Q_1

XR

P_Q_1

XR

GPS_MODE

RTR6285_SSBI

1R

_AP

INTER_RX_SW_SEL_1

INTER_RX_SW_SEL_2

LNA_GAIN_CONTROL

DIVERSITY_LNA_EN

TRK_LO_ADJ

JD

A_OL_

KRT


MMC_COVER_DETECT

MOTION_I2C_SCLMOTION_I2C_SDA

GPS D FLIP-FLOP

MPM Port

Array TP

Clesed to NC7SZ74L8X

Clesed to TCXO

TCXO Circuit

ARM9&ARM11 JTAG

1.0T

0000 : Native, ARM9 on PJTAG, ARM11 on AJTAG

ARM9&ARM11 JTAG

MODE[3:0]

0001 : Native, ARM9 + ARM11 on PJTAG

FFA Rev.C(220Ohm@100MHz)

2010.01.18 updatedNEST JIG

(MIC_1N)

RX

1X

_H

CU

OT

UY

2Y

_H

CU

OT

LX

2X

_H

CU

OT

DY

1Y

_H

CU

OT

FFA

71

ppm)

3B(

04

57M

P

;ES

NES

_TA

BV

REV.E_CHANGED_0517

- 157 -

7. CIRCUIT DIAGRAM


833C

u01

u01323

C

R301

0

C301 0.1u

C300 0.1u

u2.2413

C

L

K

J

I

H

G

F

E

D

C

B

A

12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

12 11 10 9 8 7 6 5 4 3 2 1

613C

n01

u22513

C

R304

0

813C

n01

913C

n1

71 3C

n1

523C

u1.0

623C

u1.0

923C

u1.0

033C

u1.0

023C

n01

423C

n1

823C

n1

233C

n1

533C

u1.0

VREG_MSMC1_1.25V

133C

n01

933C

u1.0

143C

u1.0

043C

n01

633C

n01

733C

n1

243C

n1

903C

n01

213C

u2.2u2.2

703C

U301

01P

1P

4M

M3

5G

1G

5E

01B

1B

H8

7H

7J01R

9R

G10

2R

F9

1R

E10

01A

D9

9A

C10

2A

N10

M9

E7

L10

F8

K10

G6

J9

J8

H2

G9

G2

F10

K1

E9

B2

D10

E3

C9

G8

N9

F3

M10

J2

L9

K9

C7

J10

C8

D7

M2

D8

P9

D6

J1

E8

H9

D5

C1

F6

B9

F7

E6

M1

H4

P8

H3

H10

F5

H1

E4

D1

F4

B8

G4

G3

P6

J4

C5

H5

H6

N5

J5

B5

J6

G7

C6

K6

C3

K5

C4

K7

B4

L8

B7

K8

B3

L7

B6

L6

L5

N8

L4

M7

N7

K2

P5

J3

P4

F1

N4

F2

P3

K3

P2

D4

M8

E2

N6

D3

M6

E1

P7

D2

M5

C2

N3

L3

N2

L2

N1

L1

K4A0

A1

IO0

A2

IO1

A3

IO2

A4

IO3

A5

IO4

A6

IO5

A7

IO6

A8

IO7

A9

IO8

A10

IO9

A11

IO10

A12

IO11

BA0

IO12

BA1

IO13

IO14

DQ0

IO15

DQ1

DQ2

CE#

DQ3

RE#

DQ4

WE#2

DQ5

CLE

DQ6

ALE

DQ7

WP#

DQ8

R_B#

DQ9

DQ10

VCC1

DQ11

VCC2

DQ12

DQ13

VSS6

DQ14

VSS7

DQ15

DQ16

VDD6

DQ17

VDD1

DQ18

VDD2

DQ19

VDD3

DQ20

VDD4

DQ21

VDD5

DQ22

DQ23

VSS8

DQ24

VSS1

DQ25

VSS2

DQ26

VSS3

DQ27

VSS4

DQ28

VSS5

DQ29

DQ30

VDDQ0

DQ31

VDDQ1

VDDQ5

CS0#

VDDQ3

CS1#

VDDQ4

CK

VDDQ2

CKE0

VDDQ7

CKE1

VDDQ6

WE#1

VDDQ8

RAS#

VDDQ9

CAS#

DM0

VSSQ0

DM1

VSSQ1

DM2

VSSQ2

DM3

VSSQ3

VSSQ4

0U

ND

VSSQ5

1U

ND

VSSQ6

2U

ND

VSSQ7

3U

ND

VSSQ8

4U

ND

VSSQ9

5U

ND

6U

ND

0S

QD

2S

QD

CK#

4C

N

6C

N

3S

QD

UN

D

1S

QD

A13

1UF

R

2UF

R

KC

OL

223C

u1.0

VREG_MSME_1.8V

003R

K001

TP301TP302203

RK001

U200

L5

E10

AE22

AD25

AE18

AE15

AE11

AE7

Y5

T5

H25

E25

E22

Y25

V25

T25

P25

M25

K25

AE12

AC10

AC5

Y8

AF26

AF25

AF3

AF2

AE26

AB11

Y20

W19

U17

U11

P23

N23

M11

L17

L12

K23

K9

J19

G23

E19

C2

B26

B3

B2

T2

R8

R5

P9

N8

K6

K5

J6

J5

F9

E6

C8

C3

U6

T6

T3

R9

P8

P5

N9

K8

J9

J8

H6

H5

E9

E5

D3

B8

AE13

AE5

AB14

AB10

AA22

Y19

Y6

V22

U14

T16

T15

T14

T13

T12

R17

R16

R15

R14

R13

R12

P22

P17

P16

P15

P14

P13

P12

P11

P6

N22

N16

N15

N14

N13

N12

M16

M15

M14

M13

M12

L15

L13

L6

K22

G22

F19

F15

F10

E14

B4

7G

A

6G

A

5G

A

4G

A

3G

A

72

GA

62

GA

52

GA

42

GA

32

GA

22

GA

12

GA

02

GA

2G

A

91

GA

81

GA

71

GA

61

GA

51

GA

41

GA

31

GA

21

GA

11

GA

01

GA

1G

A

72

FA

1F

A

72

EA

1E

A

72

DA

1D

A

72

CA

1C

A

72

BA

1B

A

72

AA

1A

A

72

A

62

A

52

A

42

A

32

A

22

A

12

A

02

A

91

A

81

A

71

A

61

A

51

A

41

A

31

A

21

A

11

A

01

A

9A

8A

7A

6A

5A

4A

3A

2A

1A

61E

41F

5AA

22

H

11

N

5N

81E

31

E

5U

9T

72Y

1Y

72W

1W

72

V

1V

72

U

1U

72T

1T

72R

1R

72P

1P

72

N

1N

72M

1M

72L

1L

72K

1K

72

J

1J

72H

1H

72G

1G

72F

1F

72E

1E

72

D

1D

72C

1C

72B

1B

9GA

8G

A56_C

N66_

CN

76_

CN

86_

CN

96

_CN

07

_CN

17_CN

27_CN

37_C

N47_CN

57_

CN

67

_CN

77

_CN

87

_CN

97

_CN

08_CN

18_C

N28_C

N38_

CN

48

_CN

58

_CN

68

_CN

78

_CN

88_CN

98_C

N09_C

N19_

CN

29

_CN

39

_CN

49

_CN

59

_CN

69

_CN

79

_CN

89_CN

99_C

N001

_CN

101

_CN

20

1_CN

30

1_CN

40

1_CN

1DVSR

2DVSR

8P_

DDV

9P

_DDV

01

P_DD

V

GRP

_E

SU

FQ_

DDV

1C

_SNS_

DD

V2C

_SNS_D

DV

6P

2_YH

PBSU_DD

V3P

3_Y

HPBSU_

DDV

1_C

N2_C

N3_C

N4_C

N5_C

N6_C

N7_C

N8_C

N9_C

N01_C

N11_C

N21_C

N31_C

N41_C

N51_C

N61_C

N71_C

N81_C

N91_C

N02_C

N12_C

N22_C

N32_C

N42_C

N52_C

N62_C

N72_C

N82_C

N92_C

N03_C

N13_C

N23_C

N33_C

N43_C

N53_C

N63_C

N73_C

N83_C

N93_C

N04_C

N14_C

N24_C

N34_C

N44_C

N54_C

N64_C

N74_C

N84_C

N94_C

N05_C

N15_C

N25_C

N35_C

N45_C

N55_C

N65_C

N75_C

N85_C

N95_C

N06_C

N16_C

N26_C

N36_C

N46_C

N

GND1GND2GND3GND4GND5GND6GND7GND8GND9GND10GND11GND12GND13GND14GND15GND16GND17GND18GND19GND20GND21GND22GND23GND24GND25GND26GND27GND28GND29GND30GND31GND32GND33GND34GND35GND36GND37GND38GND39GND40GND41GND42GND43GND44GND45GND46GND47GND48GND49GND50

GND_A1GND_A2GND_A3GND_A4GND_A5GND_A6GND_A7GND_A8GND_A9GND_A10GND_A11GND_A12GND_A13GND_A14GND_A15GND_A16

VDD_A1VDD_A2VDD_A3VDD_A4VDD_A5VDD_A6VDD_A7VDD_A8VDD_A9VDD_A10VDD_A11VDD_A12VDD_A13

VDD_C1_1VDD_C1_2VDD_C1_3VDD_C1_4VDD_C1_5VDD_C1_6VDD_C1_7VDD_C1_8VDD_C1_9VDD_C1_10VDD_C1_11VDD_C1_12VDD_C1_13VDD_C1_14VDD_C1_15VDD_C1_16VDD_C1_17VDD_C1_18VDD_C1_19VDD_C1_20VDD_C1_21VDD_C1_22VDD_C1_23VDD_C1_24

VDD_C2_1VDD_C2_2VDD_C2_3

VDD_MDDI

VDD_P1_1VDD_P1_2VDD_P1_3VDD_P1_4VDD_P1_5VDD_P1_6

VDD_P2_1VDD_P2_2VDD_P2_3

VDD_P3_1VDD_P3_2VDD_P3_3VDD_P3_4VDD_P3_5VDD_P3_6

VDD_P4_1VDD_P4_2

VDD_P7_1VDD_P7_2

92R

0

TP300

VREG_MSME_1.8V

VREG_MSME_1.8V

113C

Fu1

VREG_MSME_1.8V

313C

Fu1

V3.3_B

SU

V6.2_A

MS

M_G

ER

V

V9.2_2X

UA_

GE

RV

VREG_MSMP_2.6V

VREG_MSME_1.8V

VREG_MSMC2_1.25V

VREG_MSMC1_1.25V

VREG_MSMA_2.6V

R303

0VSNS_MSMC2_1.25V

VSNS_MSMC1_1.25V

VSNS_MSME_1.8V

u01333

C

723C

u01

013C

u1.0

VREG_MSMP_2.6VVREG_MSMA_2.6VVREG_MSMC2_1.25V VREG_MSME_1.8VVREG_MSMC1_1.25V

V8.1_E

MS

M_G

ER

V

V6.2_P

MS

M_G

ER

V

V8.1_E

MS

M_G

ER

V

603C

Fu 1

503C

u1.0

803C

u7.4

203C

IND

SDRAM_ADDR[13]

nRESETOUT

nWE2nUB2

nOE2

nLB2

]9[A

TA

D_2

IB

E

EBI2_DATA[9]EBI2_DATA[8]EBI2_DATA[7]EBI2_DATA[6]EBI2_DATA[5]EBI2_DATA[4]EBI2_DATA[3]EBI2_DATA[2]

EBI2_DATA[15]EBI2_DATA[14]EBI2_DATA[13]EBI2_DATA[12]EBI2_DATA[11]EBI2_DATA[10]

EBI2_DATA[1]EBI2_DATA[0]

nNAND_FLASH_CS

NAND_FLASH_READY

nSDRAM_WEnSDRAM_RAS

3SQ

D_

MA

RD

S

2SQ

D_

MA

RD

S

1SQ

D_M

AR

DS

0SQ

D_

MA

RD

S

SDRAM_DQM3SDRAM_DQM2SDRAM_DQM1SDRAM_DQM0

SDRAM_DCLK1SDRAM_DCLK0

nSDRAM_CAS

SDRAM_BA1SDRAM_BA0

SDRAM_ADDR[9]SDRAM_ADDR[8]SDRAM_ADDR[7]SDRAM_ADDR[6]SDRAM_ADDR[5]SDRAM_ADDR[4]SDRAM_ADDR[3]SDRAM_ADDR[2]

SDRAM_ADDR[12]SDRAM_ADDR[11]SDRAM_ADDR[10]

SDRAM_ADDR[1]SDRAM_ADDR[0]

PM

AR_

AP_

MS

G

MD_

HB

SU

PD _

HB

SU

SDRAM_DATA[31]SDRAM_DATA[30]SDRAM_DATA[29]SDRAM_DATA[28]SDRAM_DATA[27]SDRAM_DATA[26]

]52

[A

TA

D_MA

RD

S

SDRAM_DATA[25]SDRAM_DATA[24]SDRAM_DATA[23]SDRAM_DATA[22]SDRAM_DATA[21]SDRAM_DATA[20]SDRAM_DATA[19]

]8

1[

AT

AD_

MA

RD

S

SDRAM_DATA[18]SDRAM_DATA[17]

]51[AT

AD_

MA

RD

SSDRAM_DATA[15]SDRAM_DATA[14]SDRAM_DATA[13]

]21

[A

TAD_

MA

RD

S

SDRAM_DATA[12]SDRAM_DATA[11]SDRAM_DATA[10]SDRAM_DATA[9]SDRAM_DATA[8]SDRAM_DATA[7]SDRAM_DATA[6]SDRAM_DATA[5]SDRAM_DATA[4]SDRAM_DATA[3]SDRAM_DATA[2]SDRAM_DATA[1]SDRAM_DATA[0]

SDRAM_DATA[16]

nSDRAM_CS0

KLC

SY

S_H

BS

U

SDRAM_CKE0

nSDRAM_CS1

SDRAM_CKE1

M_B

TS_P_IDD

MP_B

TS_P_IDD

MM_A

TAD_P_IDDM

P_A

TAD_P_

IDD

M

IBS

S_

58

26

RT

R

JD

A_O

L_

KR

T

80

61

u2

2 >

-

u01

D

.veR

AFF

V8.

1 -

8P

:

CDC

L E

SU

UOY

FI

Cap for MSM7227 Power

MSM7227 Power Part MCP (4G NAND FLASH +4G DDR SDRAM)

8061

80

61

8061

8061

For Artwork

REV.C_0408_CHANGED

2010.01.25 updated

7. CIRCUIT DIAGRAM


C426 1n

2.2u

L400

10uC438

C411 0.1u

VREG_MSMP_2.6V

634C

u7.4

C415 0.1u

C444 2.2u

VREG_LCD_2.8V

CN401

3

24

1

C407100u

VREG_AUX2_2.9V

524R

K1

VBAT

u7.4254

C

C437 1n

+VPWR_AUDIO

C412

33p

C413 0.1u

C458 0.1u

+VPWR

C419 0.1uC418 0.1uC417 0.1u

C422 0.1uC421 0.1uC420 0.1u

434C

u7.4

10uC427

4.7uL402

VBAT

104D

U404

9

7 4

8 1

6

5

3 2CELLVDD

SEO

EO

CTGSDA

GNDSCL DN

GP

R415

10K

D404

C443

1u

2.2u

C454

VREG_MOTION_3.0V

D402

C442

1u

VREG_MSMP_2.6V

714R

K2.2

+VPWR_RF

C457

1u

n1134

C

VREG_SMPS_2.1V

VREG_MSMC2_1.25V

2.2u

C451

u7.4334

C

L

K

J

I

H

G

F

E

D

C

B

A

12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

12 11 10 9 8 7 6 5 4 3 2 1

VREG_MSMA_2.6V

C448

2.2u

u2.2424

C

VREG_RUIM_3.0V

n1034

CVCHG_VBUS

VREG_MSMC1_1.25V

VBAT

C455

2.2u

C410 0.1u

C447

2.2u

234C

n1

R424 51

VREG_TCXO_2.85V

814R

K2. 2

IC1

4B

D2

B2

A1 A2

B3

C2

A4

C1

A3 D1

E4

D3 D4

E3

E2 C3

E1 C4

1B

YLP

PU

SV

UART_TXVBUS

UART_RXDM

DP

USB_DMID

USB_DP

AUDIO_LR2_2K

AUDIO_R

MIC

DSS

_INT

SDACLDO

SCL

GNDTE

SI

R423 121K

U403

9J

8J

7J

6J

5J

9H

8H

7H

6H

5H

9G

8G

7G

6G

5G

9F

8F

7F

6F

5F

9E

8E

7E

6E

5E

H1

E10F1

F10E1

C12N2

B1

M12B2

K7

A5

N13A4

M13B5

B4

G10A7

D9A6

H12B7

B6

C13

A13D10

A12K10

H10

G12J10

G1

M1K4

D13J4

E12H4

N11M2

A3L2

A10H2

A8

H13K2

G13J2

A11G4

K13F4

E13D5

B13B3

A9M5

N12N3

J13N1

A2M3

K6

M4K5

N4K9

M9K8

N10M11

M6L12

N6A1

M8D4

N8B12

J1D8

K1N5

M7

2G

21

D

7D

8B

01

M

6D

9B

21

J

31

F

21

F

21

K

7N

9N

01

B

31

L

11

B

2F

4E

2C

1C

1D

1L

2D

2E

GH

CV

N_LTC_

GH

C

SU

BV_

BS

U

N_LTC_

BS

U

P_S

NSI

M_S

NS I

N_ TEF_T

AB

TA

BV

NIO

CV

PU

KC

AB_

V

AN

A_D

DV

E_1C_

DD

V

AP_2

C_D

DV

2P

G_D

DV

6P

G_D

DV

2E

MS

M_D

DV

PM

SM_

DD

V

1FR_

DD

V

2FR_

DD

V

MIU

R_D

DV

RK

PS_L_

DD

V

RK

PS_

R _D

DV

OX

CT_D

DV

NAL

W_D

DV

MPP_1

MPP_2 VSW_5V

MPP_3 VREG_5V

MPP_4 VSW_MSMC1

MPP_5 VREG_MSMC1

MPP_6 VSW_MSMC2

MPP_7 VREG_MSMC2

MPP_8 VSW_MSME

MPP_9 VREG_MSME

MPP_10 VSW_PA

MPP_11 VREG_PA

MPP_12

MPP_13 VREG_GP1

MPP_14 VREG_GP2

MPP_15 VREG_GP3

MPP_16 VREG_GP4

MPP_17 VREF_GP5

MPP_18 VREG_GP6

MPP_19 VREG_MMC

MPP_20 VREG_MSMA

MPP_21 VREG_MSME2

MPP_22 VREG_MSMP

VREG_RFRX1

USB_ID VREG_RFRX2

USB_D_P VREG_RFTX

USB_D_M VREG_RUIM1

USB_OE_N VREG_SYNT

USB_DAT VREG_TCXO

USB_SE0 VREG_USB

VREG_WLAN

SBST MIC_BIAS

SBCK

SBDT_SSBI REF_ISET

MSM_INT_N REG_GND

REF_BYP

SPKR_IN_L_M

SPKR_IN_L_P TCXO_IN

SPKR_OUT_L_M TCXO_EN

SPKR_OUT_L_P TCXO_OUT

SPKR_IN_R_P

SPKR_IN_R_M XTAL_IN

SPKR_OUT_R_P XTAL_OUT

SPKR_OUT_R_M

SLEEP_CLK

VIDEO_IN AMUX_OUT

VIDEO_OUT

VIB_DRV_N KPD_PWR_N

KPD_DRV_N PON_RESET_N

LCD_DRV_N PS_HOLD

FLSH_DRV_N

1D

NG

2D

NG

3D

NG

4D

NG

5D

NG

6D

NG

7D

NG

8D

NG

9D

NG

01D

NG

11D

NG

21D

NG

31D

NG

41D

NG

51D

NG

61D

NG

71D

NG

81D

NG

91D

NG

02D

NG

12D

NG

22D

NG

32D

NG

42D

NG

52D

NG

VREG_RF_2.7V

C450

2.2u

VREG_MSME_1.8V

+VPWR

924C

n1

L404 4.7u

VREG_LCD_1.8V

VREG_MSME_1.8V

VREG_MSMP_2.6V

4.7uL401

R407

4.7

K051

624R

VREG_HPVDD_1.8V

TP400TP401

VREG_MSMP_2.6V

TP402

200K

R428

+VPWR

USB_3.3V

VREG_TOUCH_3.0V

4.7uL403

U400

96

53

4

82

71IN1 OUT1

IN2 OUT2

IC1

OVLO IC2DN

G

DN

GP

CN4

11

10

9

5

4

3

2

1

8

7

6

u7.4354

C

1u

C40

1 64C

Fu1

004C

u1.0

2.2u

C456C3

2.2u

R401 2.2K

504R

smho

K7.4

404R

K2

0391C u1

02R

K7.4

R413

470Kohms

804R

K01

C441

u1.0

u7.4534

C

C425 1n

R4141K

u1404

C

214R

051

10u

C428

114R

051

U401

5

3 24 1

VOUTVINGNDSTBY

DN

GP

K6.08

904R

VREG_MSMP_2.6V

0.1u

C439

VBAT

304D

104DZ

C440

10n

VREG_PROX_2.8V

2.2u

C446

614R

smho

K086

SC2

1

724R

smho

K034

VREG_MMC_3.0V

C460 10pF

C459 10pF

304R

K2

C462

DNI

014R

K074

1u

C45

CAM_AF_2.8V

504C

u1

VCHG_VBUS

zHK8

67

.23

AS5123

XN

004X

21

C40222p

FL1013

5

6

31

42P2 P4

P1 P3

6P

5P

10nC408

VCHG_VBUS

VBAT

Q400

56473829110

DRAIN_B

NC1 COLLECTOR_B

COLLECTOR EMITTER

SOURCE BASE

DRAIN NC2

GATE

004R

1.0

p22304

C

0.1u

C401

00 4D Z

FL400

1IN OUT

GND1 GND2

VCHG_VBUS

VREG_MSMP_2.6V

C48

10n

+VPWR

D400

10u

C409

1n

C414

+VPWR

+VPWR_RF|+VPWR

RW

PV+

USB_3.3V_EN

USB_3.3V_EN

nPON_RST

PMIC_TCXO

SLEEP_CLK

PMIC_SSBI

TCXO_EN

JTAG_PS_HOLD

USBH_DM

REMOTE_PWR_ON

AMUX_OUT

GSM_PA_DAC_REF

TCXO_PM_19.2MHZ

UART3_TXUART3_RX

USBH_DP

MSM_USIM_DATA

MSM_USIM_RST

MSM_USIM_CLK

PS_HOLD

PM_INT_N

SIM_RST

SIM_CLK

VBAT_TEMP

VBAT_TEMP

VBAT_SENSE

VBAT_SENSE

USB_ID

USB_IDMAX_DP

MAX_DP

MAX_DM

MAX_DM

KPD_PWR_N

P_S

NSI

ISNS_P

N_LTC_

GH

C

CHG_CTL_N

N_TEF_TT

AB

BATT_FET_N

VSNS_MSME_1.8V

PCB_REVISION

PCB_REVISION

MUIC_I2C_SDAMUIC_I2C_SCL

MUIC_INT

VSNS_RF_SMPS

VSNS_MSMC1_1.25V

FUEL_I2C_SDAFUEL_I2C_SCL

VSNS_MSMC2_1.25V

NIO

CV

SIM_IO

BACKLIGHT_KEY

Place crystal and load caps close to PM7540

Must Check Battery Conn. Pin Map

1%

rehtegot etu oR

REV.C_0408_CHANGED

0.5mm

Local Ground Plan

PM7540

Place in PM7540 room at shield edge

0.6mm

0.6mm

These CAPs close to inductors

REV.C_0408_CHANGED

1.1

.ve

R

0.6mm

USB 3.3V LDO

Route together

Place close to PM7540 pins

1608

150K

1%

150K

150K

R1

ADC

150K

A&F

150K

R2

R2

2.13V

10K

68K

47K

150K

150K

REV

1.93V

D&I

C&H

B&G

Rev.1.1

150K

150K

HKAIN0 : PCB Revision Check ADC

0.16V

Rev.1.0

E&J

Rev.1.2 680K

0.81V

100K

1.73V

0.62V

300K

R1

430K

M_S

NS

I

1.30V

1.04V

close to each other

2mm

mm5.0 9N ,7N

0603

VOLTAGE DETECTOR REMOVED

Fuel Gauge IC & Battery Conn.

2mm


SERIAL RESISTOR REMOVED

1608

Am

08

e

ldn

aH

n

aC

e

ca

rT

2mm

REV.1.0_0624_CHANGED

2mm

09.12.17 added

Turbo Mode

09.11.12 added

2009.11.16 changed

160810V

Aloha 091209

0.3mm0.3mm

REV.C_0408_CHANGED

REV.E_CHANGED_0517

REV.E_CHANGED_0517

REV.C_0408_CHANGED

2mm

Battery Charging Circuit

MUIC

TA OVP Circuit

VBUS 2mm

u-USB Connector

2mm1%ISNS_M

CITIZEN -> NDK

- 159 -

7. CIRCUIT DIAGRAM


TP5

8pFC7

R509 12

DNIC16

R1170 2.2K

FB7011800

ANT2

C523

DNI

10uFC18

FB7001800

205C

p93

TP7

4.7uFC5

305R

02

0.1uFC2

505R

K7.4

2.2KR1171L1

3.3uH

C545

47pF

J2

2

36

5

4

1M5_MIC

M4_L

M3_DETECT

M4D-DETECT

M1_R

M6_GND

L3

4.7u

405C

u1

10K

R521

FB502 1800

10K

R520

33p

C702

1

2

605R

K001

106Q

D

G

S

R1177 10

+VPWR_AUDIO

C536

1u

10R1176

U500

039282726252423222120291817161

31

3215

14

33

3413

3512

3611

3710

389

398

407

6

415

4

42

433

442

45

1

6474849405152535451

DN

G

2D

NG

3D

NG

4D

NG

B_E

KA

W _TS

OH_L

W

DXT_T

RA

U_TB

N_ST

C_TR

AU_T

B

N_ST

R_TR

AU_T

B

DX

R_TR

AU_T

B

ANT

BT_PCM_CLK

GND5 BT_PCM_OUT

VDD_WL_PA BT_PCM_SYNC

BT_PCM_IN

SDIO_CMD

SDIO_CLK VDD_BT_PA

SDIO_D3

SDIO_D2 S_CLK_IN

SDIO_D1 GND6

SDIO_D0 FM_ANT

WL_RST_N BT_GPIO_0

WL_WAKE_B BT_GPIO_1

REG_ON BT_GPIO_3

VBAT_IN BT_GPIO_4

BT_GPIO_7

SR_VLX1

SR_VLX1BB F_CLK_IN

F_CLK_OUT

BB2

XLV_

RS

BBT

UO

V_R

S

OID

DV

UP_L

ATX

DS_

OID

DV

TU

O_ 2P1_

GID

TU

O_2P1_

GLN

A

ODL

V2P1_

NIV

TU

O _2O

DLNL

AD

S_TB

LC

S_TB

1OI

DU

A

2OI

DU

A

N_TS

R_TB

7D

NG

C30

0.1u

MIC_BIAS

435C

u2 .2

C32

0.1u

C533

1u

C535 1n

005D

205D

305D

47p

C542

C334.7uF

ANT1

105D

1u

C8

33p

C703

C17

47p

33p

C544

M1

8611R

C543

47p

405D

270n

L504

C522

2.2u

VREG_MSMP_2.6V

C9

2.2u

TP12

C1 0.001uF

TP9TP1TP3TP11

TP4

C509 33n

U502

5

3 24 1

VOUTVINGNDSTBY

DN

GP

TP10R1

0

C62.2uF

9611R

K74

TP13

+VPWR

VREG_MSMP_2.6V

MIC1

6

5

4

3

2

1OUT

G1

G2

G3

PWR

G4

C34 4.7uF 33nC510

TP8

10uFC19

0.1u

C31 TP6

VREG_MSMP_2.6V

C518

2.2u

L

K

J

I

H

G

F

E

D

C

B

A

12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

12 11 10 9 8 7 6 5 4 3 2 1

VA615

205R

02

VREG_MSMP_2.6V

K2.2

705R

33p

C538

2.2u

C539

U501

5

3 24 1

VOUTVINGNDSTBY

DN

GP

L4DNI

405R

K7.4

47pC505

47pC506

u1

.0

31

5C

u1.

0215

C

1uC511

1uC514

VREG_MSMP_2.6V

C519

2.2u

IC500

3B

A4

C3

C2

2B

D1

D3

4D

C1

A1D2

1B

D5

A2

A5

A3B5

4B

C5

4C

DN

G

OUT+

DD

VP

H

CPVDDCPVSS

CN

HPL

OUT-

SAI

B

IN2- HPR

IN1+

DD

VS

IN3-

IN2+

AD

S

IN1-

IN3+

CP

LC

S

1uC507

C508 1u

u01

30

5C

R515 12

2.2uC515

VREG_HPVDD_1.8V

FB5001800

FB5011800

33p

C700

+VPWR

VDD_TCXO

VDD_TCXO

26MHzX500

TG-5010LH-87N

4 2

3 1NCOUT

GNDVCC

10uC537

SLEEP_CLK

LINE_ON

LINE_OP

FM_L

FM_R

WLAN_HOST_WAKEUP

WLAN_RESET_N BT_WAKEUP


MIC_1P

BT_PCM_CLK

BT_PCM_SYNC

HPH_R

HPH_L

BT_UART_TXD

BT_UART_RXD

BT_UART_CTSBT_UART_RTS

BT_HOST_WAKEUP

AUDIO&MOTION_I2C_SCL

FM_ANT

FM_ANT

QE

R_K

LC

CLK_REQ

CLK_IN

CLK_IN

RF_IN_OUT

RF_IN_OUT

RCV_PRCV_N

EAR_L

EAR_L

EAR_R

EAR_R

BT_PCM_DOUT

BT_PCM_DIN

EARJACK_SENSE

HS_MIC_BIAS_EN

WLAN_CLKWLAN_CMD

HS_MIC

MIC_1N

BT_RESET_N

SPK_RCV+

SPK_RCV-

WLAN_REG_ON


changed 12/28

0603

MIC

0603

3060

306

0

30

60

30

60

306

0 30

60

close to 3

close to 17

HIGH

LOW(DEFAULT)

STATE

UNMATING

Audio SUB SYSTEM

EAR_SENSE

MATING


2009.11.16 added


3.5pi Ear Jack Connector

26MHz TCXO

Wi-Fi&BT&FM MODULE

TCXO LDO

7. CIRCUIT DIAGRAM


0.1u

C623

516C

u1.0

FB600

120

J1

51

62

73

84

910GND2 GND1

RESERVED1 RESERVED2

CLK I_O

RST VPP

VCC GND

2711R

1

VREG_MMC_3.0V

FB602

120

33p

C608

C619

33p

37 11R

1

CN2

1312

1411

1510

169

178

187

196

205

214

223

232

241

C621

33p

C620

0.1u

C618

33p

R614

4.7KohmsR617

51K

C625 10n

VREG_MSMP_2.6V

FL600

7.5pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

OJ600 OJ601

CN601

1312

1411

1510

169

178

187

196

205

214

223

232

241

1DZ

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

L

K

J

I

H

G

F

E

D

C

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

5711R

1

FL601

7.5pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

FL602

7.5pF

015

64

73

82

91INOUT_A1 INOUT_B1

INOUT_A2 INOUT_B2

INOUT_A3 INOUT_B3

INOUT_A4 INOUT_B4

1G

2G

C6114.7uF

LD1

R612 100K

C606

4.7u

FL603

019

84736251


1G

2G

416C

Fu1

LD4


D600

4 3

5 2

6 12.2uC616 C617

2.2u

WLED_PWR

006L

smho1

R618

1K

VA607

116R

smh o

K1.5

R615

1K

VREG_RUIM_3.0VVREG_RUIM_3.0V

106BF

smho7.4

D601

43

52

61R616

51K


U1007

520 26

114

8

3

9

105

16

17

18

19

15

14

13

1223

17

1222422+2

C

+1C

- 1C

-2C

IN1 OUT

IN2 BL1

BL2

BL3

BL4

BL5

BL6

BL7_AUX1

BL8_AUX2

EN LDOA

LDOB

SDA

LDOC

SCL LDOD

DN

GA

DN

GP

PE

CAM_IOVDD_2.6V

U602

B2C1

A1B1

B3C2

A3C3IN- VDD

IN+ VO+

_SHUTDOWN VO-

BYPASS GND

Q600

C

B

E GND

IN

OUT

C624

0.1u

WLED_PWR

LD3 LD2

C1931

2.2u

CAM_IOVDD_2.6V

CAM_DVDD_1.2V

CAM_AVDD_2.7V

C6102.2u

C6092.2u

C622

33pF

2.2uC612

VREG_MOTOR_3.3V

4.7K

R601

4.7K

R600

VREG_MSMP_2.6V

206

R

K0

01

+VPWR

C600

1u

C601

1u

706

Cu2.

2u2

.2

20

6C

471 1R

1

CAM_AF_2.8V

FB603

120

CAM_DVDD_1.2V

CN600

17

16

15

14

13

12

11

10

9

8

7

6

5

314

323

332

341

30

29

28

27

26

25

24

23

22

21

20

19

18

R605 12

CAM_AVDD_2.7V

316C

u01406

RK2.2

306R

K2.2

VREG_LCD_1.8V VREG_MSMP_2.6V

U601

43

52

61VCCA VCCB

A B

GND OE_

+VPWR

C605

4.7uC604

4.7u

C4

4.7u

R619 100K

MICROSD_DET_N

MMC_CMD

MMC_DATA[0]

MMC_DATA[1]

MMC_DATA[2] MMC_DATA[3]


CAM_MCLK

CAM_VSYNCCAM_HSYNC

LIN_PWM_FREQ

SIM_RST

SIM_RST

SIM_CLK SIM_CLK

LCD_BL_EN

MMC_CLK


VCOIN

WLED5

WLED5

WLED4

WLED4

WLED3

WLED3

WLED2

WLED2

WLED1

WLED1

WLED6

WLED6

WLED7

WLED7

LCD_RESET_N

LCD_MAKERID_LOW

MTR_P_2sub

MTR_P_2sub

MTR_N_2sub

MTR_N_2sub


FLT_CAM_VSYNC

FLT_CAM_VSYNC

FLT_CAM_HSYNC

FLT_CAM_HSYNC

CAM_RESET_N

CAM_PWDN


LCD_BL_I2C_SCL

LCD_BL_I2C_SDA

CAM_PCLK

FLT_CAM_DATA[0]

FLT_CAM_DATA[0]

FLT_CAM_DATA[1]

FLT_CAM_DATA[1]

FLT_CAM_DATA[2]

FLT_CAM_DATA[2]

FLT_CAM_DATA[3]

FLT_CAM_DATA[3]

FLT_CAM_DATA[4]

FLT_CAM_DATA[4]

FLT_CAM_DATA[5]

FLT_CAM_DATA[5]

FLT_CAM_DATA[6]

FLT_CAM_DATA[6]

FLT_CAM_DATA[7]

FLT_CAM_DATA[7]

MDDI_P_STB_MMDDI_P_STB_P


MLCD_VSYNC_O

LCD_VSYNC_O

LCD_VSYNC_O

SPK_RCV+ SPK_RCV-

SIM_IO

SIM_IO

MMC_COVER_DETECT

BACKLIGHT_KEY

MAIN-SUB CONNECTOR

1608

1608

1608

KEY BACKLIGHT LED

Rev.E Changed _ 0517

BACKLIGHT CHARGE PUMP


CAMERA EMI FILTER

LEVEL SHIFTREV.E_CHANGED_0517

USIM Socket

3M CAMERA

1%

1%

LGIT_1/4'' SVCY0024801(C3AA-Y314A)

1%

Q-coin MOTOR

1%1%

1%

- 161 - LGE Internal Use OnlyCopyright © 2010 LG Electronics. Inc. All right reserved.Only for training and service purposes

7. CIRCUIT DIAGRAM

045C

u1.0

C706

470n

VREG_TOUCH_3.0V

VREG_MSMP_2.6V

4.7Kohms

R2

4.7Kohms

R3

VA612

VREG_MOTION_3.0V

016AV

VREG_MSMP_2.6V

VREG_MOTION_3.0V

U700

5 4

6 3

7 2

8 1LEDASCL

LEDCSDA

VCCVIO

VOUTGND U503KR3DH

2D

EV

RE

SE

R

DD

V

GND3

GND2

INT1

VDD_IO

RESERVED1

NC1

INT2

NC2

SC

SCL_SPC

GND1

OD

S_ID

S_A

DS

0A

S_O

DS

4D

NG

10u

C541

CN3

4

3

2

1

470R25

1AV

906AV

VA613VA611 VA614

C707

1u

815R

K2.2

915R

K2.2

R613 470

R700

10

R610 470

C708

0.1u

407C

n01

CN1

65

74

83

92

101

G1 G2

G3 G4

KB702KB701

KB703

R703

10

KB704

VREG_PROX_2.8V

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

L

K

J

I

H

G

F

E

D

C

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

R702

4.7Kohms

R701

4.7Kohms

C709

4.7u

U1

12

11

10

9

5

4

6

37

28

1D

DV

D

GE

RV

AD

NG

SD

NG

DD

VA

ADDR

SCL

NC1

TNI

VPP

DRDY

SDA

10u

C705

CN5

2

1VA2

MOTION_INT

PROX_OUT

KPD_PWR_N

TOUCH_I2C_SDATOUCH_INT

TOUCH_I2C_SCL



PROX_COMPASS_I2C_SDA


KEY_COL[2]

KEY_COL[1]KEY_COL[0]

KEY_ROW[1]

KEY_ROW[1]

KEY_ROW[0]

KEY_ROW[0]

MOTION_I2C_SCL

MOTION_I2C_SDA

TOUCH

DOCKING

2010.01.20 updated


HALL IC(N.A)

HOT KEY

Acceleration Sensor

VOLUME SIDEKEY

0603

Digital Compass

REV.E_CHANGED_0517

HOMESEND

MENU

Proximity Sensor

0603

REV.C_0408_CHANGED

POWER KEY

SEVY0008101

33010S5CLVE

7. CIRCUIT DIAGRAM


1uC701

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

L

K

J

I

H

G

F

E

D

C

B

A

L

K

J

I

H

G

F

E

D

C

B

A

16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

VB700

2

1 K0

22

00

7R

4L

n33

1K

R709

BAT1

1AV

2AV

3L

n5 1

50

7A

V

40

7A

V

30

7A

V

00

7A

V

20

7A

V

10

7A

V

CN1

ENBY0034101

GB042-24P-H10-E3000

1312

1411

1510

169

178

187

196

205

214

223

232

241

n33

2L

4AV

3AV

017R

K022

S700GND

DAT2

CD_DAT3

CMD

VDD

CLK

VSS

CARD_DETECT

DAT0

COVER_DETECT1

DAT1

n5 1

1L

C7051u

60

7A

VK

74

30

7R

K7

44

07

R

K7

45

07

R

60

7R

K7

4

K7

47

07

R

VREG_MMC_3.0V VREG_MSMP_2.6V

VREG_MMC_3.0V

VREG_MSMP_2.6V

CN701

2

1

MMC_DATA[3] MMC_DATA[3]

MMC_DATA[0]

MMC_DATA[0]

MMC_DATA[1]

MMC_DATA[1]

MMC_DATA[2]

MMC_DATA[2]

MMC_CD

MMC_CD

MMC_CMD

MMC_CMD

MMC_CLK

MMC_CLK

MTR_N_2sub

MTR_N_2sub

MTR_P_2sub

MTR_P_2sub

SPK_RCV-

SPK_RCV-

SPK_RCV+

SPK_RCV+

VCOIN

VCOIN

MMC_COVER_DETECT

MMC_COVER_DETECT

LGP500_SUB_PCB_Rev A

BACK-UP BATTERY Micro SD SocketMain2Sub B2B VIBRATOR(Q-Motor)

SPEAKER PAD



8. BGA PIN MAP

8. BGA PIN MAP8. BGA PIN MAP

MCP


8. BGA PIN MAP

MSM7227



8. BGA PIN MAP

RTR6285(Top View)


8. BGA PIN MAP

PM7540(PMIC)

- 167 -

9. PCB LAYOUT


107BK

C203

102C

3DL

R1175

LD2

5NC

MIC

1

202C

307BK

007BF

107BF

VA615

3711R

C1931

VA614VA6122711R

VA613VA611

4DL407BK

507C

C709

R700

007U

C707

C708

307R

107R

9611R

Q601

207R

8611R

207BK

LD1R1174

LG-P500h_MAIN_SPFY0233701-1.1_PLACE_TOP

MIC1 : Microphone- no far-end voice- no voice recording

9. PCB LAYOUT


E

D

A

F

ADM

7

5

13A B C D

1

6

12

10

10

NHGF MLKJ

24 20

E

13

11

1

1

ABC

5

4

27

110

A EDCB

K LJHGFEDCB

B

LJ KHG

U V W Y AA ABACN P R T

4

E

D

C

1834

RPNM

AGAFAE

17

12

24

13

814

1001U

106NC

514 C

R414

2AV52 R

1AV

CN

3D

404

254 C

454 C

854 C

324 R

744 C

014 C

224 C

344 C

114 R

214 R

044 C

804 C

TP4

304U

C420

2NC

31PT

005 U23 C

TP109PT

C448

064 C

C438

302PT

1J

104 NC

R409

C513

915 C

503 C

TP6

535 C

605 R

C533

534 C

134 C

C430

C433

634 C

234 C

92 R

R415

D403

004 DZ

002U2BF

0311L

206BF

103U

613 C702R

402 CC337

502 R

602 C

7101 R

0501 C

5101 R

C1096

1LF

9011 C 9701 C

5001 U

C1115

R403

FL603C

339C

1064

9201R

125 R

105BF

FB601 7011 C

R1026

C1106

5011 C

C341

002 C

L1015L1016

C27

U2

L1012

1001WS

AN

T1003

5001TNA

C1063

6001TNA

2301L

0211 C

906 C

216 C

106 U

016 C

116 C

8001L

7001L

1001LF

1 U

704 R

102AV

VA

202

C622

C620

C407

2TNA

1TNA

016AV

316 R

C706

C704

R219

502AV

424 C

R218 V

A204

804 R

VA

200R

217

L600

512 R

R216

126 C

302AV

C618

D601

116 R

C619

244 C

C409

R410

D401

C16

71 C 4L

TP8

C419

C421

C450

C418

C457

TP402

Q400

R400

2 R3 R

1NC

906AV

016 R

C18

TP7

1PT

R1

11PT

5 C

3PT

C2

C446

C444

C456

164 C

824 R

524 R

C34

TP401

C428

714 C

114 C

314 C

404U

305 C205 C

L1

L3

C453

405 C

C451

004X

954 C

D402

004L

214 C

102PT

614 R

314 R ZD401934 C

R1171

R1177

R1176

6 C

R427

R426

305 R

C510

R1170

C508

C512

205 R

C507

54 C

C509

115 C

415 C

C505

C8C

33

C19

C31

624 C

03 C

3 C C41404 C

U401

304L

524 C

144 C

554 C724 C

204L

104L

734 C 0391 C

404L

202PT

714 R

814 R

C522

IC500

003 R

812 C

212 C

505 R

405 R

C515

C506

325 C

C518

9 C

406 C5PT21PT

7 C

1 C

005X

TP302

635 C

113 C

203 RC534

U501

203 C

723 C

264 C

133 C

233 C

913 C

223 C

TP301

R424 003 C

004PT

402 R

033 C

103 C

602 R

403 R

C434

712 C

512 C

612 C

207 C

C429 007 C

412 C

C213

C211

307 C

504 C

004 D

C402

FL1005R

1163

9201L

8011 C

C404

004 U

C401

006BF 506 C

903 C 413 C

C320

103 R

C219

C315

U201

022 C 802 R

122 C012 R

4801 C

3511 C

6801 C

L1030

C1087

C1095

L1027

R1022

R1023

9801 C

3301L

0511L

FL1009

L1151R

1178

C1104

C1114

C1113

R20

C48

R404

C400

FL400

304 C

4NC

C1056

C207

C1094

U1003

2201L

C1077

R1027

406 R 306 R

703 C

C313213 C

62 R

C336

C333

C335

902 R 802 C

002X

3611 C

012 C 502 C

2701 C

C1071

C1068

L1017

7601 C

5501 C

3701 C

R1019

3001LF

C1076 3801 C

6201L

5201L

C1929

0201LC1078

5701 C

C1154

0111 C

2LF

1201L

C1103

C1111

C1102

C1112

L1040

11 R

R405

R401

FL1013

1 CI

CN

600TP

300R

211

C222

C340

6101 R

C224

C1053

C1054

C1070

2211 C

9601 C 8101L

C13

L1120

C1081

C11

R14

013 C

603 C 606 CC

317

C318

R214

R220TP

200

C342

523 C

323 C

C338C

324

623 C

303 R

R212

C226

302 R

202U

C225

0801 C 9101L

C1062

C1061C

1162

C1049 5101 C

L4000

C11232401L

L8

8401L

73 C

63 C

9R

C1728

L10

C1128

FL1012

51 C

5L

52 C

02 C

22 C

L1110

C12

1401L

7111 C

0101LFC

1116

025 R

C625

803 C

R615

R618

C223

R19

C540

R202

C601

ZD1

C1065

C1066

C1032

915 R

C1031

815 R

R1021

8 R

L1035R

18

L1031

C1005

2J

005BF

905 R

D501

245 C

005D

006LF

206LF

216 R

206U

R616

C624

C623

R617

R614

R619

Q600

C328

C616

C617

D600

923 C

C4R

201

102 D

002 D

C607

305U

145 C

L7

C1928

6L

C1148

82 C

R24

01 R

01 C

R12

C14

L9 32 C

L2

C26

C24

FL1008

0901 C

4001L

L11

R1004

3001 C

9001 C

5001 R

C615

C537

5201 R

7001 U

C1029

C1028

C1030

C1018

C1013

C1027

C1007

FB502

C545

445 C

L504

D503

205D

U502

705 R

C539

C543

C614

R515

C613

405D

106LF

R605

VA

607

FB603C

608

4001U

C1097

3901 C

6301L

8201L

8901 C

C1121

L1045

9901 C

0301 RL1039

C602

R602

R600

006 C

R601

722 C

002 R 312 R

C1023

C1042

1101L

C1052

C1036

4101L

C1040

3101L 0101L

C1021

L1006

L1009

C1041

2001LF

C1039

2001U

AN

T1002

L1044FL1011

CN

200

8301 C0101 R

C1046

2201 C 8801 C

3301 C

1501 C 7401 C

C538

L12

1901 C 4301L

7211 C

FL1007

C1118

6001U

0311 C

L1043

C1119

9211 C

2101 R 7301 C

6001LF

8101 R3BF

0611 C

C1010

C1019

1101 C

7501 C

0201 C

8501 C

7101 C

2901 C

0601 C

9501 C

2101 C

3001L

C1016

C1025

5001L

C1004

4301 C

L1002

C1024

6001 R

C1014

C1044

3401 C

8401 C

7 R

5401 C

R15

61 R

R5 6 R

4 R

LG-P500h_MAIN_SPFY0233701-1.1_PLACE_BOT

J2 : 3.5pi Ear-Jack- no Sound

CN600 : 3M Camera DOP Connector- no Camera

U301 : Memory- no Booting

CN601 : LCD Conn.- no Display

U200 : DBB- no Power On- no Servive

U1007 : ChargePump- no LCD backlight

X200 : 19.2Mhz X-tal- no Power On- no Service

U1001 : Transceiver- no Service- RF Sensitivity & TX Power

U1002 : FEM&GSM PAM- no Service- RF Sensitivity & TX Power

IC1 : MUIC- no Booting- no USB/Serial Connection

CN4 : I/O conn.- no USB Connection.- no Serial Connection.

CN2 : GPS,WIFI,Motor Connector - no GPS/WiFi/Motor

CN1 : Touch Connector - no touch sensing

IC500 : Audio AMP Sub System & Signal Distributor

- no Sound

U500 : BT+FM Radio Module- no BT Connection- no FM Radio

U403 : PMIC- no Booting- no Power On- no Service

U1003 : PAM- no Service- RF Sensitivity & TX Power

J1 : SIM Conn.- No SIM

CN401 : Battery Conn.- no power On

Q400 : Charging IC- no Battery Charge

U1005 : PAM- no Service- RF Sensitivity & TX Power

- 169 -

9. PCB LAYOUT


R703

VA

702

407R

507AV

1AV

2AV

VA

706507C

R700

VA

704

VA

703

C706

R706

017R

R705

VA

700

3AV

4AV

107C

907R

107AV

707R

BA

T1

LG-P500h_F_SUB_SPCY0242301-1.1_TOP

9. PCB LAYOUT


LG-P500h_F_SUB_SPCY0242301-1.1_BOT

107 NC

007S

007BV

4L

L3

CN

1

2L

L1



10. RF CALIBRATION

10. RF CALIBRATION

10.1 Configuration of Tachyon

10.1.1 Configuration of directory

LG-P500h/ LG-P500h

LG-P500h

LG-P500h LG-P500h LG-P500h


10. RF CALIBRATION

F o ld e r D e s c r ip tio n

Tachyon Exe file and MFC dll, UI dll is present.

CommonCommon dll files.(XML Data I/O , Auto Test Logic, Tachyon Logic Control, Communication)

ConfigEnvirement files.(Port configuration, Loss adjust)

Instrument Tester control dll.

ModelModel files is present. (Model -> Solution (Qualcomm, EMP, ADI, INFINEON) -> MODEL NAME(LGGW620, LGSH470, ..) -> BUYER NAME(SKT, TEL, VIVO, …)

OCX Conponent files.

PhoneCmd Phone communication file

ReportReport Files is present.(Cal data, test data)

F i le D e s c r ip tio n

‘MODEL NAME’_Calibration.XMLThere are imformations to calibrate.It consist of calibration items.

‘MODEL NAME’_CallSetup.XML There are imformations to call.

‘MODEL NAME’_NV.INIIt consists of default values.It is written when ‘cal&auto’ is begun.

‘MODEL NAME’_Sequence.XML It is described a testing procedures.

10.1.2 Description of basic folders

10.1.3 Description of configuration files



10.2 How to use Tachyon

10.2.1 Model selection

Follow the procedure before start calibration & auto test

a. Click the icon, in tool bar. Then, you can see the below screen.

b. Select Model “LGP500h”

10. RF CALIBRATION


10. RF CALIBRATION

c. Select the model : You should select “LGP500h”

d. Select the buyer (must be double clicked) Then, you can see “PASS” in Config File Check.

e. Click select button

C

D

E



10.2.2 Start cal & auto

a. Click calibration & autotest button, in Tool bar.

b. Calibration & autotest will be executed in order.

1) Precede Action.

- NV write

- Test command send.

2) Calibration

�) Auto test

4) After action

- Phone reset

- Change UE to AMSS

10. RF CALIBRATION


11. STAND ALONE TEST


Hidden Menu Start

Start shortcut keys: �845#*500#

Hidden Menu List

Start the desired menu: Menu, click

Version Info

Classified Information representation

Factory Reset

Format SD Card : SD Card Data reset

Factory Reset : Changing the Factory

Delete Userdata : Disabled




Device Test List

Auto All Test :

-> Auto All Test menu click

-> Continuous information on the menu, giving you ability test

Auto All Test Result

Auto All Test Result

-> From the factory with the ability to view the results screen

Device Test List

Auto All Test : Device functionality testing at the factory to use

Auto All Test Result : Test Result

LCD Test : Display test(Color)

Proximity Test : Proximity Sensor

Vibrator Test : Vibrator test

Camera Test : Camera & Cam test

Sound Test : Sound test

RTC Test : Date/Time Setting

Touch Test : Display touch test

Motion Sensor test : Motion Sensor test

External Memory Test : SD Card Write test

Compass Test : Compass Test

GPS Test : GPS Test

IRT Test : N/A



LCD Test List

Manual Test : Click on the following screen

Automatic Test : Automatically, without clicking

- White Display

- Black Display

- Red,Green, Blue, White Display

- Red,Green, Blue, White Display 2

Proximity Test

Phone contact with your fingers in the top of the sensor

determine the sensor response

- Away 1

- Near 0

Vibrator test

A case-by-state vibration tests




Camera test

Menu features disabled

This feature is part of Auto All Test replaced by

-> Auto All Test

-> Camera test

-> Cam test

Sound test

Ring : Ringtone test

Effect Sound :

Message Tone :

Loop Back test : Mic & Speak loop Back test

Audio CAL Tool : Setting

-> Ring menyujung Enabled

RTC test

Date & time : setting



Touch test

Finger Print : Free mode test

Grid Touch Test : Block mode on touch point mode test

Touch Key Test : key test

Grid Touch Color Change

Block Touch Test

Motion Sensor test

Motion Sensor test

-> 4 Check the operation of the sensor in the direction of lean

External Memory Test

SD Card test

-> Write a test check of the SD Card memory




Key / Compass Test

SD Card : Check Recognition

SIM Card : Check Recognition

Up/Down key : Check Recognition

End Call key : Check Recognition

Menu key : Check Recognition

Home key : Check Recognition

Back key : Check Recognition

Search key : Check Recognition

Compass test

GPS Test

GPS test : GPS check recognition

ELT Test

Automatic Mode

Manual Mode :



ELT Test

Automatic Mode : LCD Automatic on/off test

-> time setting

ELT Manual Test

LCD Backlight

Ringtone

Vibrator

Camera

Audio Loopback

-> test on the device is working

(The ability to use plant)

- 183 -

12. EXPLODED VIEW & REPLACEMENT PART LIST

12.1 EXPLODED VIEW


SMJY00ACGM01

MTAD00

SPKY01

ADCA00

SPKY00

EBP00

ABFZ01ACGM00

GMEY00

SBPL00

ACQ00

EAA00

MBFZ00

GMZZ00

SUSY00 SJMY00EBR00

ACKA00

SUMY00

EBR01

MBJZ01

MBJZ00

SVLM00 ABFZ00

AKAC00

Description

Bracket Assembly

Motor,DC

PCB Assembly,Flexible

Speaker Module

Cover Assembly,Rear

Antenna,PIFA

Touch Window Assembly

Keypad Assembly,Main

LCD,Module-TFT

Cover Assembly,Front

Tape,Window

Button

Button

Bracket Assembly

PCB Assembly,Main

Can Assembly,Shield

Dome Assembly,Metal

PCB,Sidekey

Camera Module

PCB,Sidekey

Microphone,Condenser

Screw,Machine

SCREW MACHINE

Bracket

Rechargeable Battery,Lithium Ion

Cover Assembly,Battery

Location

ABFZ01

SJMY00

EBR00

SUSY00

ACGM00

EAA00

SMZY00

AKAC00

SVLM00

ACGM01

MTAD00

MBJZ00

MBJZ01

ABFZ00

EBR01

ACKA00

ADCA00

SPKY00

EBP00

SPKY01

SUMY00

GMEY00

GMZZ00

MBFZ00

SBPL00

ACQ00




by SBOM standard on GCSC

Level LocationNo. Description Part Number Spec Remark

1 AGQ000000 Phone Assembly - AGQ86291501 LGP500H.AVIVBK BK:Black -

2 ACQ100400 Cover Assembly,EMS - ACQ85324601 LGP500H.AVIVBK BK:Black -

3 ABFZ01 Bracket Assembly - ABFZ0027801 LG-P500 ORF ZZ:Without Color -

3 ACGM00 Cover Assembly,Rear - ACGM0169610 LG-P500H SS:SHINE SILVER -

4 MDJ000000 Filter MFBZ0024401 COMPLEX LG-P500 ZZ:Without Color FILTER, MIC_REAR

4 MEG000000 Holder MHGZ0035901 COMPLEX LG-P500 ORF ZZ:Without Color MOLD, SiliconeRubber K-770, , , , ,

4 MCQ000000 Damper MPBZ0318301 COMPLEX LG-P500 ZZ:Without Color PAD, CAMERA

4 MCQ000002 Damper MPBZ0318501 COMPLEX LG-P500 ZZ:Without Color PAD, MOTOR

4 MCQ000001 Damper MPBZ0326101 COMPLEX LG-P500 ZZ:Without Color PAD, CONN_LCD

4 MJN061100 Tape,Protect MTAB0447002 COMPLEX LG-P500 BL:Blue TAPE,PROTECTION_REAR_B_2

4 MCR000000 Decor MDAY0085204 COMPLEX LG-P500 ORF BK:Black 3.2 Mega Pixels Printed

4 MCK063300 Cover,Rear MCJN0126901 COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PCLUPOY GP-2102, , , , ,

4 MBK070300 Can,Shield MCBA0085901 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,STS,

4 MJN061101 Tape,Protect MTAB0447102 COMPLEX LG-P500 BL:Blue TAPE,PROTECTION_REAR_C_2

4 MKC009400 Window,Camera MWAE0064901 COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,(empty), , , , ,

4 MJN000000 Tape MTAZ0353001 COMPLEX LG-P500 ZZ:Without Color TAPE, MIC

4 MJN089300 Tape,Window MTAD0133101 COMPLEX LG-P500 ZZ:Without Color TAPE,WINDOW_CAMERA

3 ACQ003400 Cover Assembly,Bar - ACGV0021801 LG-P500 ORF BK:Black -

4 AKAC00 Keypad Assembly,Main AKAC0018601 LG-P500 ORF ZZ:Without Color -

4 ACGM01 Cover Assembly,Front - ACGK0170701 LG-P500 ORF ZZ:Without Color -

5 MEG000000 Holder MHGZ0036001 COMPLEX LG-P500 ORF ZZ:Without Color MOLD, SiliconeRubber K-770, , , , ,

5 MCQ043300 Damper,LCD MPBG0118401 COMPLEX LG-P500 ZZ:Without Color PAD, LCD

5 MJN061100 Tape,Protect MTAB0451701 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_VOL

5 MJN061101 Tape,Protect MTAB0451901 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_PWR

5 MTAD00 Tape,Window MTAD0134201 COMPLEX LG-P500 ZZ:Without Color TAPE, MAIN_WINDOW

12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered

<Mechanic component>




5 MBJZ00 Button MBJZ0041201 COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PCLUPOY SC-1004A, , , , ,

5 MBJZ01 Button MBJZ0041301 COMPLEX LG-P500 ORF SS:SHINE SILVER MOLD, PCLUPOY SC-1004A, , , , ,

5 MCK032700 Cover,Front - MCJK0134701 COMPLEX LG-P500 ORF BK:Black MOLD, PC LUPOY SC-2302, , , , ,

6 MFEZ00 Frame MFEZ0037101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,

6 MICE001 INSERT,NUT MICE0016901 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

6 MICE00 INSERT,NUT MICE0016909 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,

5 MCR000000 Decor MDAY0086601 COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,(empty), , , , ,

5 MDJ000000 Filter MFBZ0024201 COMPLEX LG-P500 ZZ:Without Color FILTER_SPEAKER

5 MDS000000 Gasket MGAZ0109001 COMPLEX LG-P500 ZZ:Without Color Gasket_ESD

5 MJN000000 Tape MTAZ0353301 COMPLEX LG-P500 ZZ:Without Color TAPE,RUBBER_PROXIMITY

4 MHK000000 Sheet MSAZ0074801 COMPLEX LG-P500 ZZ:Without Color SHEET_LCD_COG

4 MJN061100 Tape,Protect MTAB0447401 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_BAR

4 MJN061102 Tape,Protect MTAB0450301 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_WINDOW

4 MJN061101 Tape,Protect MTAB0447201 COMPLEX LG-P500 ZZ:Without Color TAPE,PROTECTION_KEYPAD

4 ABFZ00 Bracket Assembly - ABFZ0026601 LG-P500 ORF ZZ:Without Color -

5 MJN000001 Tape MJN67672601 COMPLEX LG-P500 ZZ:Without Color TAPE, BRACKET_SIDE

5 MBFZ00 Bracket MBFZ0053801 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,

5 MTAZ00 Tape MTAZ0353101 COMPLEX LG-P500 ZZ:Without Color TAPE, BRACKET_LCD

5 ACKA00 Can Assembly,Shield - ACKA0032401 LG-P500 ORF ZZ:Without Color -

6 MEZ000900 Label,After Service MLAB0006701 COMPLEX GS505 TMO ZZ:Without Color COMPLEX, (empty),, , , ,

6 MCQ000000 Damper MCQ66465901 COMPLEX LG-P500 ZZ:Without Color PAD, CAN_SHIELD

6 MCBA00 Can,Shield MCBA0089101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS, STS, , , , ,

6 MTAZ01 Tape MTAZ0347201 COMPLEX LG-P500 ZZ:Without Color TAPE, CAMERA_BACK

6 MTAZ00 Tape MTAZ0366501 COMPLEX LG-P500 ZZ:Without Color TAPE, CAMERA_SIDE

5 ADCA00 Dome Assembly,Metal ADCA0117901 LG-P500 ORF ZZ:Without Color -

5 MDJ000000 Filter MFBZ0031701 COMPLEX LG-P500 ORF ZZ:Without Color COMPLEX,(empty), , , , ,

6 SC2 Can Assembly,Shield - ABM73436401 LGP500.AORFZY ZZ:Without Color -





7 MDQ000000 Frame MFEZ0045301 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,Ni,

7 MBK070300 Can,Shield MCBA0103101 COMPLEX LG-P500 ORF ZZ:Without Color PRESS,Ni,

5 MEZ000000 LABEL MLAZ0038301 LG-VX6000 SV,ZZ,PID Label 4 Array

3 GMEY00 Screw,Machine GMEY0013901 BH + 1.4mM 4mM MSWR FZB N - ARIMACOMMUNICATIONS CORP.

3 GMZZ00 SCREW MACHINE GMZZ0019003 111111,3.5 mm,1.5 mm,MSWR3 ,N ,+ ,- ,NYLOK Coating(ZnB-BLACK)

3 MBFZ00 Bracket MBFZ0059701 COMPLEX LG-VS660 VRZ ZZ:Without Color PRESS, STS, , , ,,

2 MEZ002100 LABEL,APPROVAL MLAA0062320 GU280 OREBK BK,ZZ,COMPLEX, (empty), , , , ,

1 AGF000000 Package Assembly APAY0151823 LGP500H.AVIVBK ZZ:Without Color LGP500H VIV BrazilPacking

1 AAD000000 Addition Assembly - AAD85597901 LGP500H.AVIVBK BK:Black -

2 ACQ00 Cover Assembly,Battery - ACQ85319907 LGP500.AORFZY BK:Black -

3 MCK004100 Cover,Battery MCJA0119607 COMPLEX LG-P509 BK:Black MOLD,PC LUPOY SC-1004A,

3 MJN061100 Tape,Protect MTAB0448101 COMPLEX LG-P500 ZZ:Without ColorTAPE_GUIDE_COVER_BATTERY

2 AFN053800 ManualAssembly,Operation - AFN75252824 LGP500H.AVIVBK ZZ:Without Color LGP500H manual assy for

VIV

3 MBM062600 Card,Quick Reference MBM63198501 COMPLEX LGP500H.AVIVBK ZZ:Without Color Brazil Leafletfor LGP500H





2 EAN011400 IC,Memory Card,MICRO SD EAN61826701

MMAGR02GUECA-2MBTN 2GBYTE 2.7VTO3.6V MICRO SDCARD 15.0x11.0x1.0MM TR 8P MicroSD Card 2GBSAMSUNG ELECTRONICS CO., LTD.

4 SJMY00 Motor,DC SJMY0007116 WHVM-1030Q10 2 V,65 mA,10 *3.0T,3V, WOOSUNG G&TCO.,LTD

4 EBR00 PCB Assembly,Flexible - EBR72701001 LG-P500 FLEXIBLE 1.0

5 SACE00 PCB Assembly,Flexible,SMT - EBR72700601 LGP500.AORFBK FLEXIBLE 1.0

6 SACC00 PCB Assembly,Flexible,SMT Bottom - EBR72700701 LGP500.AORFBK FLEXIBLE 1.0

7 L1,L3 Inductor,Multilayer,Chip ELCH0001032HK1005 18NJ-T 18NH 5% 0V 8A 3.1GOHM 350mHZ 300mNON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD

7 CN1 Connector,BtoB ENBY0034101 GB042-24P-H10-E3000 24P 0.40MM STRAIGHT PLUG SMDR/TP 1M - LS Mtron Ltd.

7 L2,L4 Inductor,Multilayer,Chip ELCH0001417 LL1005-FHL33NJ 33NH 5% 0V 200mA 1OHM 1.7GHZ 10NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

7 S700 Socket,Card ENSY0023802 SCHB1B0201 Micro-SD 8P ANGLE SMD R/TP - ALPSELECTRIC KOREA CO.,LTD.

6 SACD00 PCB Assembly,Flexible,SMT Top - EBR72700801 LGP500.AORFBK FLEXIBLE 1.0

7 EAX010700 PCB,Flexible SPCY0242301SPCY0242301 POLYI Multi - 0.25 LG-P500OREBK,FLEXIBLE,F,POLYI,0.25 mm,MULTI-3 LGInnotek.com

7

VA1,VA2,VA3,VA4,VA700,VA701,VA702,VA703,VA704,VA705,VA706

Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE SMDR/TP INNOCHIPS TECHNOLOGY

7 BAT1 Module,Assembly SMZY0026701EECEP0F333YD GM750 SFRTN BackupCapacitor,0.03F,3.8pi,Module Assembly PANASONICINDUSTRIAL KOREA CO., LTD

7R703,R704,R705,R706,

R707Resistor,Chip ERHZ0000486 MCR01MZP5J473 47KOHM 5% 1/16W 1005 R/TP - ROHM

Semiconductor KOREA CORPORATION

7 C706 Capacitor,Ceramic,Chip ECCH0017601 CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C 1005R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

7 R700,R710 Resistor,Chip ERHZ0000445 MCR01MZP5J224 220KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

12.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered

<Main component>





7 C701 Capacitor,Ceramic,Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005R/TP - TDK KOREA COOPERATION

7 C705 Capacitor,Ceramic,Chip ECCH0004904 GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C 1005 R/TP- MURATA MANUFACTURING CO.,LTD.

7 R709 Resistor,Chip ERHY0000241 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

4 SUSY00 Speaker Module SUSY0028914 ISDT-181230-08W-04 ASSY,8 ohm,91 dB,1812mm,3.0T,20mm,WIRE GoerTek Inc.

4 EAA010400 Antenna,Helical SNMF0066301 HIR-02A16-0000AA DUAL -5DB 50OHM 5 E.M.W CO., LTD.

4 EAA00 Antenna,PIFA EAA62385801 HIR-02A62-0000AA MULTI -5DB 3:1 E.M.W CO., LTD.

4 SMZY00 Touch Window Assembly SMZY0029602 TSMC-P304A Captive TSM Assembly,3.2" ,; ,Module AssemblyLG INNOTEK.,LTD.

4 SVLM00 LCD,Module-TFT SVLM0041401TX08D42VM0BAAMain,3.2,HVGA,49.52x77.83x1.9t,16.7M,TFT,TM,S6D05A1(Samsung),Bending Type, HITACHI DISPLAYS.,LTD

3 EBR01 PCB Assembly,Main - EBR72673401 LG-P500h MAIN 1.0

4 EBR071500 PCBAssembly,Main,Insert - EBR72701401 LG-P500 MAIN 1.0

5 SPKY00 PCB,Sidekey SPKY0093201 SPKY0093201 POLYI Double DOUBLE 0.15 LG-P500TMO,SIDEKEY,E,POLYI,0.15 mm,DOUBLE LG Innotek.com

5 EBP00 Camera Module EBP61301801 C3AA-Y314C C3AA-Y314C 3M AF, Sony(1/5"), 8.5x8.5x5.4t,FPCB 3.5mm, 90degree LG INNOTEK CO., LTD

5 SPKY01 PCB,Sidekey SPKY0093401 SPKY0093401 POLYI Double DOUBLE 0.15 LG-P500TMO,SIDEKEY,E,POLYI,0.15 mm,DOUBLE LG Innotek.com

4 EBR071800 PCB Assembly,Main,SMT - EBR72673501 LG-P500h MAIN 1.0

5 SAD010000 Software,Mobile SAD32751001 V10a - CENTRAL AND SOUTH AMERICA QCT -

5 EBR071700 PCB Assembly,Main,SMT Top - EBR72673601 LG-P500h MAIN 1.0

6 EAX010000 PCB,Main SPFY0233701SPFY0233701 FR-4 - LX-BUMP 10 0.8 LG-P500TMO,MAIN,F,FR-4,0.8 mm,LX-BUMP 10 UNITECH PRINTEDCIRCUIT BOARD CORP.

6 SUMY00 Microphone,Condenser SUMY0010610SPM0410LR5H-QB SPM0410LR5H-QB,UNIT,42dB,4.72*3.76*1.25,mems TDMA Improve KNOWLESACOUSTICS

6 C1931 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 C202,C708 Capacitor,Ceramic,Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C1005 R/TP - MURATA MANUFACTURING CO.,LTD.

6 R1169 Resistor,Chip ERHZ0000287 MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION




6

R1172,R1173,R1174,R1175

Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 LD1,LD2,LD3,LD4 LED,Chip EDLH0014803 SSC-WH107 WHITE 2.7~3.1 20mA 100~230mcd x, y 64mW

1608 R/TP 2P - SEOUL SEMICONDUCTOR CO.,LTD

6 R701,R702 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 FB700,FB701 Filter,Bead SFBH0008102 BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P

MURATA MANUFACTURING CO.,LTD.

6 U700 IC,Proximity EUSY0376201 GP2AP002S00F GP2AP002S00F,8,R/TP SHARPCORPORATION.

6 R700,R703 Resistor,Chip ERHZ0000402 MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 C705 Capacitor,Ceramic,Chip ECCH0007803 CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

6

VA611,VA612,VA613,VA614

Varistor SEVY0008101 EVLC5S01033 EVLC5S01033,5.5 V, ,SMD ,0603 AMOTECHCO., LTD.


6 Q601 FET EQFP0004501SI1305-E3 P-CHANNEL MOSFET -8V +-8 -0.92A 0.28OHM340mW SOT323 R/TP 9P VISHAY INTERTECHNOLOGYASIA PTE LTD

6 VA615 Varistor SEVY0007902 ICVS0305500FR ICVS0305500FR,5.6 V,M ,SMD ,0603 SIZEINNOCHIPS TECHNOLOGY

6 C203 Capacitor,TA,Conformal ECTH0001903 F980J226MMA 22 uF,6.3V,M,L_ESR,1608,R/TP NICHICONCORPORATION, EAST JAPAN SALES OFFICE


6 R1168 Resistor,Chip ERHZ0000407 MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 C201 Capacitor,Ceramic,Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION

5 EBR071600 PCB Assembly,Main,SMT Bottom - EBR72673701 LG-P500h MAIN 1.0

6 C1079 Capacitor,Ceramic,Chip ECZH0000846 C1005C0G1H8R2CT000F 8.2pF 0.25PF 50V NP0 -55TO+125C 1005 R/TP - TDK KOREA COOPERATION

6 C1007 Capacitor,Ceramic,Chip ECZH0000841 C1005C0G1H560JT000F 56pF 5% 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION

6 FL1009 Filter,Saw SFSY0034701 SAFEA1G88KB7F00 1880 1.4*1.1*0.5 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.

6 FL1012 Filter,Saw SFSY0034601 SAFEB1G96FL0F00 1960 1.4*1.1*0.6 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.





6 FL1 Filter,Saw SFSY0030001 SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.

6 FL1005 Filter,Saw SFSY0029901 SAFEB836MAL0F00 836.5 1.4X1.1X0.6 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.

6FL600,FL601,FL602

Filter,EMI/Power SFEY0011401 ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD R/TPINNOCHIPS TECHNOLOGY

6 FL2 Filter,Duplexer,DCN SDDY0005201SAYFP836MAJ0F00 881500000 869 to 894 836500000 824 to849 2.4 1.8 2.5x2.0x0.55 DUAL SMD R/TP - MURATAMANUFACTURING CO.,LTD.

6 U503 IC,Acceleration Sensor EUSY0408701 KR3DH NONE NONE LGA R/TP 16P - STMICROELECTRONICS ASIA PACIFIC PTE LTD.

6 C1122,C36,C37 Capacitor,Ceramic,Chip ECCH0000701 C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0 -

55TO+125C 1005 R/TP - TDK CORPORATION

6 C26 Capacitor,Ceramic,Chip ECCH0000175 GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C 1005R/TP - MURATA MANUFACTURING CO.,LTD.

6 FL1010 Filter,Duplexer,PCS SDPY0004701

ACMD-7407 ACMD-7407,1880 MHz,1960 MHz,2.8 dB,3.2dB,55 dB,50 dB,2.5*2.0*0.95,SMD,FBAR,Band2 Rx unbal.AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE.LIMITED


6 L1040 Inductor,Multilayer,Chip ELCH0003828LQG15HS2N4S02D 2.4NH 0.3NH 0V 300mA 0.15OHM 6GHZ8 NON SHIELD 1 1X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.

6 C1111,C1112 Capacitor,Ceramic,Chip ECZH0000822 C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0 -

55TO+125C 1005 R/TP - TDK KOREA COOPERATION

6 U1003 IC,Power Amplifier SMPY0021701SKY77197 28.25 dBm,40 %,A,-36 dBc,27dB,4x5x0.85,SMD,3G Dual PAM Band 1+5 w/coupler,LGA,R/TP,14, SKYWORKS SOLUTIONS INC.

6 U1005 IC,Power Amplifier SMPY0022801

SKY77702-12 28.6 dBm,36 %,10 mA,-34 dBc,27dB,3.0*3.0*1.0,SMD,USPCS,WBNAD 2,CPL,3MODE,3.2V~4.2V,-35dBc at 28.6dBm2nd,28.6dBm,595mA,1,SMD,R/TP,10 SKYWORKSSOLUTIONS INC.

6 L5 Inductor,Multilayer,Chip ELCH0001034HK1005 3N3S-T 3.3NH 0.3NH 0V 8A 8GOHM 100mHZ 300mNON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD

6 L1130 Inductor,Multilayer,Chip ELCH00010521005GC2T18NJLF 18NH 5% 0V 200mA 0.65OHM 1.6GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 L1042,L1048 Inductor,Multilayer,Chip ELCH0001054

1005GC2T5N6SLF 5.6NH 0.3NH 0V 300mA 0.27OHM 3.2GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 L7 Inductor,Multilayer,Chip ELCH0001403 LL1005-FHL1N0S 1NH 0.3NH 0V 500mA 0.1OHM 20GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

6 L1025,L1041 Inductor,Multilayer,Chip ELCH0001404 LL1005-FHL1N5S_ 1.5NH 0.3NH 0V 500mA 0.13OHM 12GHZ

8 NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.




6 C1084,L1151 Inductor,Multilayer,Chip ELCH0003820

LQG15HS3N0S02D 3NH 0.3NH 0V 300mA 0.17OHM 6GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.

6 C1009 Inductor,Multilayer,Chip ELCH00047051005GC2T8N2J00 8.2NH 5% 0V 250mA 0.37OHM 2.8GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 C1110 Resistor,Chip ERHY0003301 MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP - ROHM.


6 FB2,FB3 Resistor,Chip ERHZ0000401 MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 C14 Capacitor,Ceramic,Chip ECCH0000117 CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C 1005R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R611 Resistor,Chip ERHZ0000530 MCR01MZP5J512 5.1KOHM 5% 1/16W 1005 R/TP - ROHM.

6 R1030,R18 Resistor,Chip ERHY0000137 MCR01MZP5F2702 27KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6

C1130,C20,C208,C309,C316,C318,C320,C331,C336,C340,C408,C440,C48,C625,C

704

Capacitor,Ceramic,Chip ECCH0000155 MCH153CN103KK 10nF 10% 16V X7R -55TO+125C 1005R/TP - ROHM Semiconductor KOREA CORPORATION

6R201,R203,R213,R408,R520,R521

Resistor,Chip ERHZ0000405 MCR01MZP5J103 10KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6

C1005,C1014,C1017,C1020,C1021,C1022,C1039,C1041,C1071,C1072,C1083,C1087,C1103,C1108,C1118,C1121,C1153,

C225,C412,C538,C544,C608,C618,C619,C621,C622,C700,C702,C703,

R24

Capacitor,Ceramic,Chip ECZH0000830 C1005C0G1H330JT000F 33pF 5% 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION





6 C202,C708 Capacitor,Ceramic,Chip ECZH0003103 GRM36X7R104K10PT 100nF 10% 10V X7R -55TO+125C1005 R/TP - MURATA MANUFACTURING CO.,LTD.

6 L1018,L1019 Inductor,Multilayer,Chip ELCH0001412 LL1005-FHL1N8S 1.8NH 0.3NH 0V 500mA 0.14OHM 12GHZ

8 NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

6 R600,R601 Resistor,Chip ERHZ0000485 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 R205,R215,R217,R218 Resistor,Chip ERHY0009503 MCR006YZPJ101 100OHM 5% 1/20W 0603 R/TP - ROHM


6 C1013,C1015 Capacitor,Ceramic,Chip ECCH0009106 C0603X7R1C103KT 10nF 10% 10V X7R -55TO+125C 0603

R/TP - TDK CORPORATION

6

D400,D500,D501,D502,D503,D504,

ZD1

Diode,TVS EDTY0010101 ESD9B5.0ST5G ESD9B5.0ST5G,SOD-923,5 V,300mW,R/TP,15pF SCG HONG KONG SAR LTD.

6 C1107 Capacitor,Ceramic,Chip ECCH0001001 C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION

6 L1022 Inductor,Multilayer,Chip ELCH00010481005GC2T10NJLF 10NH 5% 0V 250mA 0.42OHM 2.5GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 U500 Module,WLAN SMZY0024901 LBEH19UNBC-338 2.3VTO5.5V LGA 54P 9.0x7.8x1.3MMMURATA MANUFACTURING CO.,LTD.

6 C201 Capacitor,Ceramic,Chip ECCH0000122 MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION


6 R1016,R1017 Filter,Bead SFBH0007102 BLM15AG100PN1 10ohm 1.0x0.5x0.55 SMD R/TP 2P


6 C1931 Capacitor,Ceramic,Chip ECCH0000198 CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C 1005R/TP . SAMSUNG ELECTRO-MECHANICS CO., LTD.

6

R1006,R1170,R1171,

R204,R401,R417,R418,R507,R518,R519,R603,

R604

Resistor,Chip ERHZ0000443 MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION


6C1076,

C207,C210,C221

Capacitor,Ceramic,Chip ECCH0000137 C1005X7R1H331KT000F 0.33nF 10% 50V X7R -55TO+125C1005 R/TP - TDK KOREA COOPERATION

6 C1069,C1080 Capacitor,Ceramic,Chip ECCH0000195 GRM1555C1H3R9C 3.9pF 0.25PF 50V NP0 -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

6 R701,R702 Resistor,Chip ERHY0000254 MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION




6 FL1007 Filter,Saw SFSY0027101 B7742 - - - - 5P EPCOS PTE LTD.

6

C1065,C1068,C1094,C1095,C1096,C1113,C1114,C1115,C1929

Capacitor,Ceramic,Chip ECCH0009103 C0603C0G1H101JT00NN 100pF 5% 50V X7R -55TO+125C0603 R/TP - TDK CORPORATION

6 R1176,R1177 Resistor,Chip ERHZ0000206 MCR01MZP5F10R0 10OHM 0.1% 1/16W 1005 R/TP - ROHM


6 U601 IC,TTL EUSY0391601 NLSV1T244-D 0.9~4.5V - LEVEL SHIFTER - R/TP 6P - SCGHONG KONG SAR LTD.

6 R1005 Capacitor,Ceramic,Chip ECZH0000802 C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C 1005R/TP - TDK KOREA COOPERATION

6 R1023 Resistor,Chip ERHZ0000428 MCR01MZP5J180 18OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6

C1028,C1030,C1032,C1034,C1038,C1049,C1053,C1055,C1057,C1058,C1059,C1060,C1061,C1062,C1063,C1066,C1067,

C224,C30,C31,C32

Capacitor,Ceramic,Chip ECCH0009101 C0603X5R0J104KT00NN 0.1uF 10% 6.3V X5R -55TO+85C0603 R/TP - TDK CORPORATION

6 C705 Capacitor,Ceramic,Chip ECCH0007803 CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C 1608R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 L1 Inductor,WireWound,Chip ELCP0012101

CIG21L3R3MNE 0H 20% - 800mA 0.22OHM - - SHIELD2X1.25X1MM NONE - SAMSUNG ELECTRO-MECHANICSCO., LTD.

6 C204 Capacitor,Ceramic,Chip ECCH0000147 MCH155CN222KK 2.2nF 10% 50V X7R -55TO+125C 1005R/TP - ROHM.

6

C1011,C1012,

C11,C1129,C12,C13,

L1015,L1039,L12

Capacitor,Ceramic,Chip ECZH0000813 C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C 1005R/TP - TDK KOREA COOPERATION






6 C33,C34,C606 Capacitor,Ceramic,Chip ECCH0006201 C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -55TO+85C

1608 R/TP - TDK CORPORATION

6 C1046 Capacitor,Ceramic,Chip ECZH0025916 GRM0335C1E330J 33pF 5% 25V NP0 -55TO+125C 0603R/TP - MURATA MANUFACTURING CO.,LTD.

6 R1018 Resistor,Chip ERHY0009555 MCR006YZPF1202 12KOHM 1% 1/20W 0603 R/TP - ROHMSemiconductor KOREA CORPORATION

6 D402 Diode,Switching EDSY0011901 SDB310Q 340mV 30V 200mA 1A 0SEC 150mW EMD2 R/TP2P 1 AUK CORP

6R210,R220,R300,R302,R612,R619

Resistor,Chip ERHZ0000204 MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6

C1018,C1037,C1045,C1047,C1048,C1051,C414,C535

Capacitor,Ceramic,Chip ECZH0025920 GRM033R71C102K 1nF 10% 16V X7R -55TO+125C 1608R/TP - MURATA MANUFACTURING CO.,LTD.

6 C537 Capacitor,TA,Conformal ECTH0004801 TCM0J106M8R 10 uF,6.3V,M,STD,1608,R/TP ROHM.

6

VA611,VA612,VA613,VA614

Varistor SEVY0008101 EVLC5S01033 EVLC5S01033,5.5 V, ,SMD ,0603 AMOTECHCO., LTD.

6

C1,C1075,C1104,

C205,C317,C319,C324,C328,C332,C337,C342,C425,C426,C429,C430,C431,C432,

C437

Capacitor,Ceramic,Chip ECCH0000143 MCH155CN102KK 1nF 10% 50V X7R -55TO+125C 1005 R/TP- ROHM Semiconductor KOREA CORPORATION

6

R202,R216,R219,R414,R425,R615,

R618

Resistor,Chip ERHY0003201 MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP - ROHM.

6 U1007 IC,Sub PMIC EUSY0378001 AAT2862 AAT2862,TQFN34,24,R/TP,3x4x0.8 AdvancedAnalogic Technologies HK Limited

6 C7 Capacitor,Ceramic,Chip ECCH0000109 MCH155A080DK 8pF 0.25PF 50V NP0 -55TO+125C 1005R/TP - ROHM Semiconductor KOREA CORPORATION

6 CN600 Connector,BtoB ENBY0040301 GB042-34S-H10-E3000 34P 0.4MM STRAIGHT SOCKETSMD R/TP 1M - LS Mtron Ltd.

6 R25,R610,R613 Resistor,Chip ERHY0009541 MCR006YZPF4700 470OHM 1% 1/20W 0603 R/TP - ROHM


6 C701 Capacitor,Ceramic,Chip ECZH0001215 C1005X5R1A105KT000F 1uF 10% 10V X5R -55TO+85C 1005R/TP - TDK KOREA COOPERATION




6C4,C433,

C434,C435,C436,C5

Capacitor,Ceramic,Chip ECCH0007802 CV105X5R475M10AT 4.7uF 20% 10V X5R -55TO+85C 1608R/TP - KYOCERA CORP.

6 U200 IC,Digital BasebandProcessor,3G EUSY0392302 MSM7227 0VTO0V 0W BGA R/TP 560P - QUALCOMM

INCORPORATED.

6 C10,L1036 Inductor,Multilayer,Chip ELCH00047091005GC2T3N3S00 3.3NH 0.3NH 0V 300mA 0.19OHM 4.5GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 D200,D201,D401,D404 Diode,Switching EDSY0010501 KDS114E 900mV 30V 100mA 1A 0SEC 100mW ESC R/TP 2P

1 KEC CORPORAITION

6 IC1 IC,Analog Multiplexer EUSY0372001 TS5USBA33402YZPR TS5USBA33402,WCSP,20,R/TP,MUICTEXAS INSTRUMENTS KOREA LTD, HONGKONG BRANCH.

6 FL1003 Filter,Saw SFSY0028201 SAFEB2G14FB0F00 - - - - 2P MURATA MANUFACTURINGCO.,LTD.

6 R1025,R509,R515 Resistor,Chip ERHZ0000348 MCR01MZP5F12R0 12OHM 1% 1/16W 1005 R/TP - ROHM


6 R15,R16 Resistor,Chip ERHZ0000517 MCR01MZP5J910 91 ohm,1/16W,J,1005,R/TP ROHMSemiconductor KOREA CORPORATION

6R1,R26,

R29,R301,R303,R304

Wire Pad,Short SAFP0000501 LG-VS760 VRZ

6FB600,FB602,FB603

Filter,Bead SFBH0009901 HB-1M1005-121JT 120 1.0x0.5x0.5MM SMD R/TP 2PCERATECH CORPORATION

6 U1002 RF Module SMRH0006201SKY77544 MHz,MHz,POLA EDGE QUAD TXMODULE,SP9T,6.0*6.0*1.0,28p, SKYWORKS SOLUTIONSINC.

6 C1088 Capacitor,Ceramic,Chip ECCH0000112 MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION

6 C1024,C502 Capacitor,Ceramic,Chip ECCH0000120 MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION

6 FL400 Filter,EMI/Power SFEY0015301 NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TPMURATA MANUFACTURING CO.,LTD.

6 L401,L402 Inductor,WireWound,Chip ELCP0008005

CPI2520LZ4R7ME 4.7UH 20% 0V 900mA 0.3OHM 0HZ 0SHIELD 2.5X2X1MM NONE R/TP SAMWHA CAPACITORCO, LTD.

6

C1050,C1077,C1163,

C18,C19

Capacitor,Ceramic,Chip ECCH0005604GRM188R60J106M 10000000pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATAMANUFACTURING CO.,LTD.

6 C1106,L2 Inductor,Multilayer,Chip ELCH0003838LQG15HS8N2J02 8.2NH 5% - 300mA 0.24OHM 3.7KHZ 8SHIELD 1 1.0X0.5X0.55MM R/TP MURATAMANUFACTURING CO.,LTD.


6 U202 IC,TTL EUSY0408201 74LVC1G79GM 1.65~5.5V - D FLIP-FLOP SOT R/TP 6P -STC CORP.





6 J2 Jack,Phone ENJE0007601 KJA-PH-0-0176 1P 4P ANGLE R/TP 4mM BLACK 6P - KSDCO., LTD


6 FB700,FB701 Filter,Bead SFBH0008102 BLM15HD182SN1 1800 1.0x0.5x0.5MM SMD R/TP 2P


6 U301 IC,MCP,NAND EUSY0426801

MT29C4G96MAZAPCJA-5 IT FBGA ,137 ,ETC,4G(LB/256Mx16)NAND+4G(DDR400/16Mx4x32*2_2CS_2CKE) SDRAM ,;,IC,MCP MICRON SEMICONDUCTOR ASIA PTE LTD.

6R10,R1015,

R14,R19,R8

PCB ASSY,MAIN,PAD SHORT SAFP0000401 LG-LU3000 LGTBK,MAIN,A,


6 CN2,CN601 Connector,BtoB ENBY0034201 GB042-24S-H10-E3000 24P 0.40MM STRAIGHT SOCKETSMD R/TP 1M - LS Mtron Ltd.

6

C1078,C22,C24,

C25,C402,C403

Capacitor,Ceramic,Chip ECCH0000115 MCH155A220JK 22pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION

6 C1089 Capacitor,Ceramic,Chip ECCH0000180 GRM1555C1H3R3C 3.3pF 0.25PF 50V NP0 -55TO+125C1005 R/TP - MURATA MANUFACTURING CO.,LTD.

6 L1008 Inductor,Multilayer,Chip ELCH00047171005GC2T82NJ00 89NH 5% 0V 150mA 2.1OHM 700MHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6

C1027,C1029,C1031,C1033,C1064

Capacitor,Ceramic,Chip ECCH0009216 GRM0335C1E220J 22pF 5% 25V X7R -55TO+125C 0603R/TP - MURATA MANUFACTURING CO.,LTD.

6 R403,R404 Resistor,Chip ERHZ0000437 MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 R1027,R214 Resistor,Chip ERHY0000104 MCR01MZP5F49R9 49.9OHM 1% 1/16W 1005 R/TP - ROHM


6 C1010,C1019 Capacitor,Ceramic,Chip ECCH0009206 GRM0335C1E680J 68pF 5% 25V X7R -55TO+125C 0603

R/TP - MURATA MANUFACTURING CO.,LTD.

6 L10 Inductor,Multilayer,Chip ELCH0003832LQG15HS2N2S02 2.2NH 0.3NH - 300mA 0.12OHM 6KHZ 8SHIELD 1 1.0X0.5X0.55MM R/TP MURATAMANUFACTURING CO.,LTD.

6 U501 IC,LDO VoltageRegulator EUSY0407101

BU28TD4WNVX SSON004,4,R/TP,2.8V 150mA SingleLDO,IC,LDO Voltage RegulatorIC,LDO Voltage RegulatorROHM.

6 L1027 Inductor,Multilayer,Chip ELCH0001405 LL1005-FHL3N3S LL1005-FH3N3S,3.3 nH,S ,1005 ,R/TP ,TOKO, INC.

6 R207 Wire Pad,Open SAFO0000501 AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI




6L1004,L1005,L1007

Inductor,Multilayer,Chip ELCH00047141005GC2T18NJ00 18NH 5% 0V 200mA 0.65OHM 1.6GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 R428 Resistor,Chip ERHY0000161 MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 U404 IC,A/D Converter EUSY0242303 MAX17040G DFN,8,R/TP,Fuel gauge,IC,CMOSIC,CMOSMAXIM INTEGRATED PRODUCTS INC.

6 L3 Inductor,Wire Wound,chip ELCP0008001 MIP2520D4R7M 4.7UH 30% 0V 1.1A 0.11OHM 0HZ 0 SHIELD

2.5X2X1MM NONE R/TP FDK CORPORATION.


6 L1016 Inductor,Multilayer,Chip ELCH00047181005GC2T5N6S00 5.6NH 0.3NH 0V 300mA 0.27OHM 3.2GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 L1017,L1043 Inductor,Multilayer,Chip ELCH0003844 LQG15HS2N0S02 LQG15HS2N0S02,2 nH,S,1005,R/TP,Chip

coil MURATA MANUFACTURING CO.,LTD.

6

C1036,C1040,L1028,L1029

Inductor,Multilayer,Chip ELCH0001036HK1005 5N6S-T 5.6NH 0.3NH 0V 8A 5.7GOHM 150mHZ300m NON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD


6

C1003,C1119,C1120,

C23,C27,C459,C460

Capacitor,Ceramic,Chip ECCH0000110 MCH155A100D 10pF 0.25PF 50V NP0 -55TO+125C 1005R/TP - ROHM Semiconductor KOREA CORPORATION

6 C1092 Inductor,Multilayer,Chip ELCH0001033HK1005 1N5S-T 1.5NH 0.3NH 0V 8A 13GOHM 50mHZ 300mNON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD

6 C1098 Capacitor,Ceramic,Chip ECCH0000113 MCH155A180J 18pF 5% 50V NP0 -55TO+125C 1005 R/TP -ROHM Semiconductor KOREA CORPORATION

6

R1172,R1173,R1174,R1175

Resistor,Chip ERHZ0000434 MCR01MZP5J1R0 1OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 C223 Capacitor,Ceramic,Chip ECCH0010501 GRM1555C1H7R5D 7.5pF C0G TYPE(No X7R) MURATAMANUFACTURING CO.,LTD.



6 CN4 Connector,I/O ENRY0010501 GU075-5P-SD-E1500 5P 0.65MM ANGLE RECEPTACLE DIPR/TP - LS Mtron Ltd.

6 R409 Resistor,Chip ERHZ0000318 MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP -ROHM Semiconductor KOREA CORPORATION

6 C407 Capacitor,TA,Conformal ECTH0002703 TCTAL1A107M8R 0.0001F 20% 10V 50UA -55TO+125C0OHM 3.2x1.6x1.1 NONE SMD R/TP ROHM CO.,LTD.





6

VA200,VA201,VA202,VA203,VA204,VA205

Varistor SEVY0004401 ICVL0518400V500FR 18V 0% 40F 1.0*0.5*0.55 NONE SMDR/TP INNOCHIPS TECHNOLOGY

6 L1035,L6,R1004 Inductor,Multilayer,Chip ELCH0001056

1005GC2T2N7SLF 2.7NH 0.3NH 0V 300mA 0.17OHM 5.5GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.

6 R506 Resistor,Chip ERHY0009506 MCR006YZPJ104 100KOHM 5% 1/20W 0603 R/TP - ROHMSemiconductor KOREA CORPORATION

6 C1102,C602,C607 Capacitor,Ceramic,Chip ECCH0005602 GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C 1608

R/TP - MURATA MANUFACTURING CO.,LTD.

6 L1010 Inductor,Multilayer,Chip ELCH00047111005GC2T22NJ00 22NH 5% 0V 200mA 0.8OHM 1.5GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP PILKORELECTRONICS LTD.


6 U1004 IC,RF Amplifier SMZY0025501 RF2815 3.3*2.1*1.0,FILTER+GPS LNA+FILTERMODULE,GPS, RF MICRO DEVICES INC

6 U1 IC,A/D Converter EUSY0418501 AMI304 QFN,12,R/TP,Geomagnetic Sensor,IC,A/DConverterIC,A/D Converter AICHI STEEL CORPORATION

6 CN200 Connector,BtoB ENBY0045901 AXT614124 14P 0.4MM STRAIGHT HEADER SMD R/TP 1M -BJ PANASONIC ELECTRONIC PARTS CO.,LTD

6 R11 Resistor,Chip ERHY0000181 MCR01MZP5F15R0 15 ohm,1/16W,F,1005,R/TP ROHM.

6 SW1001 Connector,RF ENWY0008701 MS-156C NONE STRAIGHT SOCKET SMD T/REEL AU50OHM 400mDB HIROSE KOREA CO.,LTD

6 C534 Capacitor,Ceramic,Chip ECCH0007804 CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C 1005R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R400 Resistor,Chip ERHZ0003901 MCR10EZHFLR100 0.1OHM 1% 1/4W 2012 R/TP - ROHM.

6 L8 Inductor,Multilayer,Chip ELCH0001413 LL1005-FHL22NJ 22NH 5% 0V 300mA 0.7OHM 2.1GHZ 10NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

6 R423 Resistor,Chip ERHZ0004201 MCR01MZP5F1213 121KOHM 1% 1/16W 1005 R/TP -ROHM.

6 L403,L404 Inductor,Wire Wound,Chip ELCP0008004 MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ 0

SHIELD 2.0X1.6X1.0MM NONE R/TP FDK CORPORATION.

6 L1009 Inductor,Multilayer,Chip ELCH0005005 HK100527NJ 27NH 5% 0V 8A 2.3GOHM 470mHZ 300m NONSHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDEN CO.,LTD

6

VA1,VA2,VA3,VA4,VA700,VA701,VA702,VA703,VA704,VA705,VA706

Varistor SEVY0004301 ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE SMDR/TP INNOCHIPS TECHNOLOGY




6 D600,D601 Diode,TVS EDTY0009801 VSMF05LCC 5V 6V 12V 2A 25W SOT-963 R/TP 6P 5PROTEK DEVICES INC.

6 C400,C401 Capacitor,Ceramic,Chip ECCH0000182 GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C 1005R/TP - MURATA MANUFACTURING CO.,LTD.

6 C1154 Inductor,Multilayer,Chip ELCH0001035HK1005 4N7S-T 4.7NH 0.3NH 0V 8A 6GOHM 120mHZ 300mNON SHIELD 1 1.0X0.5X0.5MM R/TP TAIYO YUDENCO.,LTD

6 C1090,C28 Capacitor,Ceramic,Chip ECZH0000816 C1005C0G1H120JT000F 12pF 5% 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION

6 C613 Capacitor,TA,Conformal ECTH0003701 TCSCM0J106MJAR 10 uF,6.3V,M,L_ESR,1608,R/TPSAMSUNG ELECTRO-MECHANICS CO., LTD.

6 CN401 Connector,TerminalBlock ENZY0029201 04-9247-003-017-829+ 3,2.5 mm,STRAIGHT,Gold,Twin

contact KYOCERA ELCO KOREA SALES CO.,LTD.

6 U602 IC,Audio Amplifier EUSY0404001TPA6202A1ZQVR BGA,8,R/TP,Class AB SPK Amp,IC,AudioAmplifierIC,Audio Amplifier TEXAS INSTRUMENTS KOREALTD, HONGKONG BRANCH.

6 R1010 Resistor,Chip ERHZ0000456 MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 FB601,R407 Resistor,Chip ERHZ0000488 MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP - ROHM


6 FL1001 Filter,Saw,Dual SFSB0001802 SAWEN881MCN0F00 881.5MHz, 1960MHz 1.8*1.4*0.5 SMDR/TP 10P MURATA MANUFACTURING CO.,LTD.

6 C1023,C1025,C15 Capacitor,Ceramic,Chip ECZH0000839 C1005C0G1H4R7CT000F 4.7pF 0.25PF 50V NP0 -


6

C1042,C1052,L1021,L1032

Inductor,Multilayer,Chip ELCH0004713 1005GC2T6N8J00 1005GC2T6N8J00,6.8 nH,J ,1005 ,R/TP ,PILKOR ELECTRONICS LTD.

6 FL1013 Filter,EMI/Power SFEY0016301 ICMEF112P900M COMMON MODE NOISE FILTER 0HZ 0F0H SMD R/TP INNOCHIPS TECHNOLOGY

6 U403 IC,PMIC EUSY0342201 PM7540 -0.5~18 N/A 0W CSP R/TP 137P - QUALCOMMINCORPORATED.

6 C315 Capacitor,Ceramic,Chip ECCH0017501 CL10A226MQ8NRNE 22uF 20% 6.3V X5R -55TO+85C 1608R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R602 Resistor,Chip ERHZ0000406 MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 C533,C536,C8 Capacitor,Ceramic,Chip ECCH0017301 CL03A105MQ3CSNH 0.000001F 20% 6.3V X5R -45TO+85C

0603 R/TP - SAMSUNG ELECTRO-MECHANICS CO., LTD.

6 R1178 Resistor,Chip ERHY0009501 MCR006YZPJ000 0OHM 5% 1/20W 0603 R/TP - ROHMSemiconductor KOREA CORPORATION

6C1109,R1022,R209

Resistor,Chip ERHZ0000463 MCR01MZP5J330 33OHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 C226 Capacitor,Ceramic,Chip ECCH0009203 GRM033R60J333K 33nF 10% 6.3V X5R -55TO+85C 0603R/TP - MURATA MANUFACTURING CO.,LTD.





6 FL1011 Filter,Saw SFSY0039301

SAFEB2G14AL0F00 2140MHz,1.4*1.1*0.6,SMD,2110M~2170M,IL 3.5,5pin,U-U,50-50,W-BAND I RxDIVERSITY,2140,1.4*1.1*0.6,SMD,R/TP,2140,1.4*1.1*0.6,SMD,R/TP MURATA MANUFACTURING CO.,LTD.

6C1116,C1148,L1011

Capacitor,Ceramic,Chip ECZH0001002 C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -55TO+125C1005 R/TP - TDK KOREA COOPERATION

6 ZD401 Diode,TVS EDTY0008601 PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1PROTEK DEVICES INC.

6 D403 Diode,TVS EDTY0008606 PRSB6.8C 4.7V 5.7 - - 10W - R/TP 2P 1 PROTEK DEVICESINC.

6 R616,R617 Resistor,Chip ERHZ0000295 MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION


6 X200 Oscillator,VCTCXO EXSK0008901 KT3225L19200DCW28RA0 19.2MHZ 2PPM 2.8V0.0x0.0x0.0MM NONE SMD R/TP KYOCERA CORP.

6 R410,R413 Resistor,Chip ERHZ0000288 MCR01MZP5F4703 470KOHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 L1044 Inductor,Multilayer,Chip ELCH0003816LQG15HS3N6S02D 3.6NH 0.3NH 0V 300mA 0.18OHM 6GHZ8 NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.

6 L504 Inductor,Multilayer,Chip ELCH0010402 LK1005R27-T LK1005R27-T,270 nH,M ,1005 ,R/TP ,CHIPTAIYO YUDEN CO.,LTD

6 U2 IC,RF Amplifier EUSY0365001 BGA735 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP 16P -INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE LTD.

6 U201 IC,MCP,NOR EUSY0216301 NC7SV00P5X_NL SC70 ,5 PIN,R/TP ,Single 2-Input NANDGate FAIRCHILD SEMICONDUCTOR


6 R208 Filter,Bead SFBH0009601 HB-1T1005-221JT 220 ohm 1.0*0.5*0.5 SMD R/TP 2PCERATECH CORPORATION

6 ZD400 Diode,TVS EDTY0008602 PSD12-LF 12V 13.3 25.9V 21A 500W SOD323 R/TP 2P 1PROTEK DEVICES INC.

6 FL1006 Filter,Saw SFSY0028101 SAFEB1G95KA0F00 1950 1.4*1.1*0.6 SMD R/TP 5PMURATA MANUFACTURING CO.,LTD.

6 C1099 Capacitor,Ceramic,Chip ECCH0002001 C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -30TO+85C 1005R/TP - TDK CORPORATION

6 IC500 IC,Audio Sub System EUSY0403901 WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P -WOLFSON MICROELECTRONICS PLC

6 J1 Card Socket ENSY0024701 GCA26C-8S-H15-E1500 SIM 8P ANGLE SMD R/TP - LSMtron Ltd.

6 R1026 Resistor,Chip ERHZ0000404 MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION




6 C1004,C1016 Capacitor,Ceramic,Chip ECCH0000901 C1005C0G1H2R2CT000F 2.2pF 0.25PF 50V NP0 -


6 U1006 IC,RF Amplifier EUSY0365401 BGA711L7 -0.3~3.6 2.7-3.0 NA 0W 0W NA 0 TSLP R/TP 7P -INFINEON TECHNOLOGIES (ASIA PACIFIC) PTE LTD.

6 U1001 IC,Tx/Rx EUSY0344001 RTR6285 1.8VTO3V,2.7VTO3V 500mW QFN R/TP 68P -QUALCOMM INCORPORATED.


6 U400 IC,Voltage Detector EUSY0374601 MAX14528 MAX14528,TDFN,8,R/TP,Programmable OVPMAXIM INTEGRATED PRODUCTS INC.


6 C404 Capacitor,Ceramic,Chip ECZH0003503 GRM188R61E105K 1uF 10% 25V X5R -55TO+85C 1608 R/TP- MURATA MANUFACTURING CO.,LTD.

6 Q400 FET EQFP0008601 NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A 0.07OHM1.3W TSOP6 R/TP 8P ON SEMICONDUCTOR

6 X400 Crystal EXXY0026801 NX3215SA 32.768KHZ 20PPM 0F NONE SMD R/TP NIHONDEMPA KOGYO CO.,LTD.

6 L400 Inductor,Wire Wound,Chip ELCP0011901

CPI2012NHL2R2MT 2.2UH 20% - 800mA 0.25OHM - -SHIELD 2X1.25X1MM NONE - SAMWHA CAPACITOR CO,LTD.




6 L9 Inductor,Multilayer,Chip ELCH0001409 LL1005-FHL10NJ 10NH 5% 0V 400mA 0.3OHM 3.6GHZ 9NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

6 C509,C510 Capacitor,Ceramic,Chip ECCH0000161 MCH153CN333KK 33nF 10% 16V X7R -55TO+125C 1005R/TP - ROHM Semiconductor KOREA CORPORATION

6 Q600 TR,Bipolar EQBN0012401 KRC402E NPN 30V 0V 50V 100mA 500mA 50 100mW ESMR/TP 3P KEC CORPORAITION

6 FL603 Filter,EMI/Power SFEY0015901 ICMEF214P101MFR ICMEF214P101MFR,SMD,ESD Commonmode Filter INNOCHIPS TECHNOLOGY

6 CN1 Connector,BtoB ENBY0058601 51338-9873 10P 0.40MM STRAIGHT FEMALE SMD R/TP1.5M - HANKOOK MOLEX

6 L1003 Inductor,Multilayer,Chip ELCH0001425 LL1005-FHL82NJ 82NH 5% 0V 200mA 1.9OHM 970MHZ 10NON SHIELD 1 1.0X0.5X0.5MM R/TP TOKO, INC.

6 R424 Resistor,Chip ERHY0000105 MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP - ROHMSemiconductor KOREA CORPORATION

6 FL1002 Filter,Saw,Dual SFSB0001902 SAWEN1G84CN0F00 1842.5MHz, 1960MHz 1.8*1.4*0.5 SMDR/TP 10P MURATA MANUFACTURING CO.,LTD.

6 C706 Capacitor,Ceramic,Chip ECZH0001217 GRM155R60J474K 470nF 10% 6.3V X5R -25TO+70C 1005BK-DUP - MURATA MANUFACTURING CO.,LTD.

6 R206 Resistor,Chip ERHY0024201 MCR01MZP5F6041 6040 ohm,1/16W,F,1005,R/TP ROHM.





6 FL1008 Filter,Duplexer,IMT SDMY0001901

SAYFP1G95AA0B00 SAYFP1G95AA0B00,1950 MHz,2140MHz,1.8 dB,2.4 dB,52 dB,43dB,2.5*2.0*0.55,SMD,Band1,2520size,SAW,Rx unbal MURATAMANUFACTURING CO.,LTD.

6 C1044 Capacitor,Ceramic,Chip ECZH0025917 GRM0335C1E470J 47pF 5% 25V NP0 -55TO+125C 0603R/TP - MURATA MANUFACTURING CO.,LTD.

6 L1013 Inductor,Multilayer,Chip ELCH0003819LQG15HS12NJ02D 12NH 5% 0V 300mA 0.28OHM 3GHZ 8NON SHIELD 1 1.0X0.5X0.5MM R/TP MURATAMANUFACTURING CO.,LTD.

6 X500 Oscillator,TCXO EXST0001901 TG-5010LH-87N 26MHZ 2.5PPM 2.8V 32.0x25.0x10.0MM -SMD R/TP EPSON TOYOCOM CORP





2 EBX000000 Accessory,Data Cable SGDY0016701 KCA-ET-8-0020 KCA-ET-8-0020 Micro USB, 1.2M KSD CO.,LTD

2 EAB010200 Earphone,Stereo SGEY0003744EMB-LGE004MSKB 3mW 16OHM 115DB 85HZTO126HZ 1MBLACK 3.5 L TYPE STEREO 4POLE PLUG - CRESYNCO.,LTD

2 SBPL00 RechargeableBattery,Lithium Ion SBPL0102301 LGIP-400N-WW-LGC 3.7 V,1500 mAh,1

CELL,PRISMATIC,PRISMATIC,BLACK, LG Chem,LTD.

2 EAY060000 Adapters SSAD0036001 STA-U12BR 90Vac~264Vac 5.1V 700mA 5060 GOST NONENONE - SUNLIN ELECTRONICS CO.,LTD

12.3 Accessory Note: This Chapter is used for reference, Part order is ordered

LG P500H Service Manual

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