Memoori Webinar – LED’s Lighting the Way towards smart CitiesSemiconductor approach to integrated lighting solutionsMICHAEL LEGOFF (CEO)

DR KEITH STRICKLAND (C TO)

11 TH MAY 2016

2COMPANY CONFIDENTIAL

Plessey is an innovative technology design and manufacturing company

• Globally recognised British brand

• Innovation and technology centres in Swindon and Plymouth

• Significant manufacturing facilities in Plymouth

• Strong management team and experienced advisory board

World class GaN-on-Silicon light emitting diode (“LED”) manufacturing technology for the growing solid state lighting (“SSL”) market

• In March 2013 Plessey launched world’s first available GaN on 6-inch silicon LED products

• GaN on Silicon USPs in conjunction with silicon / IC industry advanced packaging

• Differentiated SSL solutions – Integrated Inteligent (i2LED) approach

• Provides integration solution for smart LED lighting

• Cost advantage over traditional LED manufacturing technologies

• Demonstrating LED performance at >60% WPE

Executive Summary

3COMPANY CONFIDENTIAL

Global Presence

HQ R&D centre Sales office

Plymouth

Swindon

Philadelphia

Florianópolis

ShenzhenDelhi

Shanghai

Munich

Milan

4COMPANY CONFIDENTIAL

2016 AND ONWARDS

Acquisition of CamGaN provides access

to ground-breaking LED technology

Market-leading sensor technology

developed alongside legacy product sales

Plessey doubles efficacy within the year, from 32 to 64lm/W

Plessey produces world’s first commercial LEDs manufactured on 6” (150mm) diameter silicon substrates

Transfer of experimental recipe onto production tool completed

Plessey re-launched from the Swindon

and Plymouth facilities

Mainstream GaN-on-Si production

Expanded product range – Power LEDs

Efficacy at 130lm/W, and higher in lab

2013201220112010 2014

Advanced packaging solutions

i2LED technology

14 reactors installation plans

Plessey: An innovative technology company

2015

5COMPANY CONFIDENTIAL

Si

HEAT

GaN on Silicon – Inherent Unique Selling Points

• Better Thermal Performance that provides 3 degrees of leverage• Lower LED operating temp Higher reliability

• Simpler heat sink Lower system cost

• Higher drive current cost down through more lumens per die area

• Improved Hot-Cold factor

• Focussed light emitting surface (smaller etendue)• Surface emitter V.S. volume emitter: How “spread out” the light is

• Simpler and lower cost optical system

• Better lm/W maintenance when scaling up die size

• Better uniformity• Better process control for target wavelength

• Higher wavelength binning yield Lower cost for LEDs with tight

binning requests

• Sharper wavelength peak for big die

• Better colour control for a high power LED

Si 149 W/m·K

Sapphire 27 W/m·K

LIGHT

SiLight absorption → Efficiency loss~20% efficiency drop ~2% efficiency drop

Our GaN-on-Si

Typical GaN-on-Sapphire

Wavelength Std Dev

Consistent PL wavelength standard deviation of < 3nm, typical 2.5nm.Wafer bow is within a tight range of 0 um 10um

Si

Si

Si

mirror

Simple mesa Vertical Thin Film

6COMPANY CONFIDENTIAL

n-up VLED Chip on Si

Chip Scale Packaging

Wafer Level Packaging

GEN 1: Vertical LED GEN 2: Segmentation/ Chip Scale Optics and

Advanced Packaging

GEN 3: Wafer Scale Packaging &TSV

Intelligent LED Monolithic

Si-Integration

GEN 4: Active Sub-mount

• Double bottom contacts• Active bonded wafer

• Addressable arrays• Zener Diode• Low Power regulation• Photodiodes• Mount on Silicon

• n-Up VLED with wire bond• Two bottom contact• Wafer level phosphor

dispense• TSV-Through Silicon Vias• Wafer scale LED to sub-

mountHV Segmentation

• VHA process• Segmented LED on chip

On-Chip Diagnostics & Controls for• Temperature• Intensity• Spectrum• ESD Connectivity & CommunicationsMicro displays

Hi-Voltage (>48V) DC / AC LEDs for system level benefits in• Retrofits (space constraint)• Driver efficiency• AutomotiveHigh Density LED Arrays for• Automotive Headlamps• Intelligent LED Displays• Power Projection Sources

• Cost Reduction by Scaling to 8” Si• Large Area LEDs• Surface Emission• Superior Thermal Performance• Competitive performance

• No Wire Bonds (Hi Reliability)• Flat Top for Direct Optical Attach• Optimized Active Area Usage• No Far Field Wire Bond Shadow• Low Contact Resistance, • Good thermal resistance

Technology Roadmap

Chip Scale Optics and Reflectors

• White light beam shaping• Reduced secondary optics

• Size and format• System cost advantages• Greater design freedom• Spots• Hi Bays• Stadiums

• On Chip white light • Collimation potential down

to 10 degrees

Thank You