LED Packaging market and technology 2013 Report by Yole Developpement
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Transcript of LED Packaging market and technology 2013 Report by Yole Developpement
Copyrights © Yole Développement SA. All rights reserved. © 2012 1
75 cours Emile Zola, F-69001 Lyon-Villeurbanne, France Tel : +33 472 83 01 80 - Fax : +33 472 83 01 83
Web: http://www.yole.fr
LED Packaging
A Comprehensive Survey Of LED Packaging Covering Main Technologies and Market Metrics
© 2012 2 Copyrights © Yole Développement SA. All rights reserved.
Executive Summary Equipment Market (2/2)
• The graph shows our estimate of actual equipment sales after accounting for:
– Investment cycles and evolution of the average industry capacity utilization rate.
– Natural replacement market (tools reaching their end of life) + technology driven replacement market (new generation of tools offering significant cost of ownership benefits)
• An unprecedented investment cycle started toward the end of 2009 and have extended through early 2012. This cycle initiated in Korea was then essentially fueled by MOCVD subsidies and other incentives in China, as the country is aggressively trying to position itself as a future leader in Solid State Lighting. This has led to a world averaged overcapacity that have briefly exceed 50% for some tools (e.g.: capacity utilization rate < 50%) by middle 2012.
• This in turn have caused a 12-18 month down cycle corresponding to the absorption of this overcapacity as well as some consolidations that will bring the industry back to more usual utilization rates of 80%.
• This down cycle will extend through middle 2013. Then we expect a new investment cycle to kick in to respond to further increasing demand for general lighting. This might lead to another shorter excess investment to be absorbed in 2016 - 2017.
• End of line related equipment (die attach and beyond) though tend to be less prompt to investment overshoot and follow demand more closely.
Executive Summary
© 2012 3 Copyrights © Yole Développement SA. All rights reserved.
Executive Summary Wafer Bonding
• Wafer bonding is an enabling technology for active layer transfer of AlInGaP and InGaN vertical LEDs.
• For both GaAs-based and Sapphire-based LEDs, wafer bonding enables improved thermal, electrical and / or optical properties to ensure high power operation, which is needed for future applications such as general lighting
• While thermo-compression bonding is often applied for LEDs grown on GaAs… Eutectic and solder bonding dominates for InGaN LEDs grown on sapphire substrates. The selection of the substrate, bonding process and material system as well as appropriate adhesion layers and diffusion barriers is essential for a high yield bonding process.
• Alternative techniques to wafer bonding also exists (metal electroplating…) however their use is still “marginal” and restricted to companies that have developed specific IP.
• Wafer bonding process and the associated substrate removal process will grow in concert with the increasing popularity of vertical LEDs.
• We estimate that a minimum of XX bonding equipment will be needed between 2012 and 2017. Factoring in capacity utilization rates and replacement market, we forecast actual sales of equipment to reach XX units in the period.
Executive Summary
© 2012 4 Copyrights © Yole Développement SA. All rights reserved.
Executive Summary Die Singulation
• Laser based scribing or dicing has grown significantly since 2005. However, mechanical solutions are still improving on a regular basis thanks to new design, blades and processes and remain strong for GaAs based LEDs as well as for some vertical LED structures.
• New laser technologies are being developed in order gain further market share against mechanical techniques and further increase throughput and yields.
• With the advent of more complex vertical LED structures, new singulation techniques are emerging including dry or wet etching, or combinations of mechanical and laser techniques.
• Cost and performance are the main elements to decide on a singulation technique. The choice is strongly application dependent and can vary based on the die size, substrate, type of structure and nature of the layers and substrates.
• We estimate that a minimum of X,X76 new tools will be needed in the 2012-2017 period. However, due to the replacement market and capacity utilization rates, we’re forecasting a total volume of X,X80 tools.
Executive Summary
© 2012 5 Copyrights © Yole Développement SA. All rights reserved.
Executive Summary Thermal Management - Packaging Substrates (Including COB)
• Thermal management is one of the most critical aspect of the design and manufacturing of high power LEDs. It requires a full system approach to ensure compatibility between all components and maximum LED package performance. A multitude of designs and substrate materials are being used by LED manufacturers. Due to the potential competitive advantages brought in by each solution, standardization seems unlikely, putting extra burden on manufacturing lines and equipment that often need to be modified or reconfigured when switching from a product to another.
• We expect innovation in materials and package design to continue at a rapid pace in order to enable the development of higher brightness and efficiency packages while lowering LED solutions cost of ownership.
• Standard leadframe with plastic casing will remains the solution of choice for most low and middle power application.
• For high power application, the field remains wide open due to the variety of package types and applications. Dual Plated Copper AlN based ceramic substrates are emerging as a promising solution for handling very high power densities and cost is expecting to decrease significantly. Chip On Board designs are also emerging for various type of applications. They can use ceramic substrates or allow MCPCBs to be used directly as substrates, potentially reducing manufacturing complexity and material cost. Longer term, Silicon is another very promising candidate for high power applications.
Executive Summary
© 2012 6 Copyrights © Yole Développement SA. All rights reserved.
Executive Summary Die Attach
• Most LEDs are low power and can be attached using standard adhesives (Epoxy, Acrylic, Silicone).
• Backside metallization increases as the penetration rate of vertical LEDs increases in middle power and high power LED packages.
• The die attach material of choice for high power LED packages is silver filled epoxy, with varying content rates of silver particles.
• In some very high power packages, Au / Sn solder paste is more and more used… However, it is still considered as expensive (cost factor of nearly x2 with silver filled epoxy).
• As the market of high power LEDs is growing and as die sizes of large size LEDs keep on increasing, the market for die attach materials of LEDs will keep growing fast over the next 5 years.
• There is still a large diversity of technology options and materials for die attach and new ones may add up to the list in the future, particularly technologies developed by the power electronics industry, like low temperature sintering of silver nanoparticles. Eutectic bonding might also develop significantly and be used for Flip chip mounting instead of stud bumping.
Standard MESA Structure
Vertical structure Flip Chip Mesa
Structure
LED substrate Sapphire Metal (Cu) Semiconductor (Si, Ge, SiC) Sapphire (or removed
sapphire)
Low power LED package Standard adhesives
Mid power LED package Standard adhesives, silver-filled epoxy, back-side metal and
silver-filled epoxy or back-side metal on silver paste (substrate
side)
back-side metal (Au, Ni) with silver-filled epoxy
back-side metal (AuSn, Au, Pt) with silver-filled epoxy or
AuSn solder past, Eutectic
High power LED Package Gold bumps and underfill
Executive Summary
© 2012 7 Copyrights © Yole Développement SA. All rights reserved.
LED Penetration Rates - Comparison 2012 vs. 2020
*: Penetration rate of LED based LCD TV vs. all other technologies (CCLF based LCD, OLED, Plasma, CRT…)
LCD Display Applications
Lighting Applications
LED Market Overview
© 2012 8 Copyrights © Yole Développement SA. All rights reserved.
HB LED Packaging Companies Headquarters
Lumileds, Cree,
Luminus, Avago…
PhotonStar
Osram
Optogan
Heesung, Itswell, LG
Innotek, Lumens,
LumiMicro, Seoul
Semiconductor,
Wooree LED…
Citizen, Epitex,
Kodenshi, Toyoda
Gosei, Nichia…
A-Bright, American
Bright, Lumitek,
Lustrous, Neo-Neon,
Oasis, Optotech, Unity
Opto, Visera…
Advanced
Photoelectronic, APT,
BYD, Fangda, Golden
Valley, HuiYuan,
Huixin, Nationstar…
Dominant
Semiconductors
Kwality Group
• There are more than 120 companies involved in HB LED packaging.
• Some companies are vertically integrated and produce a fraction or all their epiwafers (eg: Lumileds, Nichia, Lextar, Osram, Toyoda Gosei, Cree, Samsung LED, LG Innotek…).
• The number of companies in China has strongly increased in 2012.
LED Packaging Overview
© 2012 9 Copyrights © Yole Développement SA. All rights reserved.
Leading LED Packaging Companies 2011 Revenue Ranking
In 2011, Nichia holds #1 position with a market share of ~21%... And the Top-10 Packaged LED manufacturers represented more than 80% of the overall Packaged LED business.
LED Packaging Overview
© 2012 10 Copyrights © Yole Développement SA. All rights reserved.
• Laser Lift Off equipment sales have been taking off in the last couple years thanks to the increasing popularity of vertical LED structures.
• We estimate that a minimum of XX new sets of equipment will be needed between 2012 and 2017. Factoring in capacity utilization rates and replacement market, we forecast actual sales of equipment to reach XX units in the period.
• A pause is likely after the strong investment cycle of 2010-2011 but adoption of LLO technology will keep increasing until 2016… However, IP constraints, cost, performance limitations or damaged caused to the epilayer are providing incentive for the development of alternative techniques.
LLO Equipment Volumes and Revenues
Substrate Removal
© 2012 11 Copyrights © Yole Développement SA. All rights reserved.
Comparison of Die Singulation Techniques
1. In real manufacturing conditions, cutting speed can be lower than announced feed speed - In some case, 2 or more passes are needed for a full cut
Capex Consumable Typical Cutting
Speed1 Street Width Typical
Yield
Main
Application Comments
Blade
Dicing
• < $XXXk for
dual spindle
• < $XXXk for
single spindle
Blades
(Diamond…)
• GaAs: X to XXmm/s
• SiC: X to XXmm/s
• X0 to X0µm
Recent progress
allow street
width < X0µm
90 to 95%
• GaAs and SiC
based LEDs
• Vertical LED
structures
• Well suited for large
dice and vertical
LED structures with
metal substrates
Laser
Dicing • > $XM /
• Si: XXmm/s for
150µm thick
• Cu / Mo based: XX
to XXmm/s for
100µm thick
• GaAs: XX to
XXmm/s for 100µm
thick
• Cu based: X0
to X0µm
• GaAs: X5µm
(Multibeam)
> 95% • Vertical LED
structures
• Requires thin
wafers (< 150µm)
• Multibeam can
increase cutting
speed by up to x3
and cut thicker
wafers (250µm
wafer on GaAs)
Diamond
Scribe &
Break
• $XXXk Diamond tips
• GaAs: XX to
XXmm/s
• Sapphire: X to
XXmm/s
• X5 to X0µm
~90%
• GaAs based
LEDs
• Requires thin
wafers (< 150µm)
Laser
Scribe &
Break
• $XXXk to
$X.XM /
• Sapphire: X to
XXXmm/s
• GaAs: Up to
XXXmm/s
• 1X-X5 um
Potentially as
low as 10µm
with stealth
dicing (no Kerf
loss)
98 to 99%
• Sapphire
based LEDs
• Requires thin
wafers
• Scribing speed
depends on depth
required
Die Singulation
© 2012 12 Copyrights © Yole Développement SA. All rights reserved.
Thermal Management of High Power LEDs Main Design Options
Ch
ip O
n B
oa
rd (
CO
B)
PCB
PCB (MCPCB, FR-4, CEM-3, Ceramic…)
Substrate Only
Si Submount
Substrate
Leadframe / Heat
slug
Optek Lednium
Ceramic
Lumileds Luxeon Rebel
Silicon (Wafer Level Packaging)
Viscera Technology
Leadframe / Heat
slug
Lumileds Luxeon
Ceramic
Cree-X-lamp
Heatsink (Metal, Plastic…)
Heatsink
Ch
ip O
n H
ea
tsin
k (
CO
H)
LED Die Chip
Level
Packaged
LED
Level1
LED
Module
Level 2
LED Light
Engine
Level 3
Thermal Management - Packaging Substrates
© 2012 13 Copyrights © Yole Développement SA. All rights reserved.
Choosing the Substrate Type (3/3)
Thermal
Conductivity
Thermo-
Mechanical
Match
Moldability Cost Size Light
Reflectivity
Status &
Trend
Al2O3 Ceramic Fair Fair Fair Excellent Excellent Fair Dominant but
decreasing
AlN Ceramic Excellent Excellent Fair Fair Excellent
Fair
Large
volumes -
Increasing
fast
Leadframes Fair Poor Excellent Excellent Poor Fair Decreasing
Silicon Excellent Excellent Excellent Fair Excellent Fair Few devices -
Promising
Glass Ceramic Excellent Fair Excellent ? Excellent Excellent Emerging
Thermal Management - Packaging Substrates
© 2012 14 Copyrights © Yole Développement SA. All rights reserved.
High Power LED Substrate Market Penetration by Substrate Type (2/2)
Thermal Management - Packaging Substrates
© 2012 15 Copyrights © Yole Développement SA. All rights reserved.
Die Attach of LEDs Summary Table
Standard MESA
Structure Vertical structure
Flip Chip Mesa
Structure
LED substrate
Sapphire Metal (Cu) Semiconductor (Si,
Ge, SiC)
Sapphire (or removed sapphire)
Low power LED package
Standard adhesives
Mid power LED package
Standard adhesives, silver-filled epoxy, back-
side metal and silver-filled epoxy or back-side
metal on silver paste (substrate side)
back-side metal (Au, Ni) with silver-filled
epoxy
back-side metal (AuSn, Au, Pt) with silver-
filled epoxy or AuSn solder past, Eutectic
High power LED Package
Gold bumps and underfill
Die Attach / Die Bonding
© 2012 16 Copyrights © Yole Développement SA. All rights reserved.
Flip Chip Example - Lumileds Luxeon Rebel (1/2)
Contact to lower (n-GaN)
level
Contact to upper (p-GaN)
level
Bump
(b)
(c)
(d)
(a)
(a) x-ray picture of substrate metal layers through LED die and bumps
(b) Drawing of LED front (bottom) side layout
(c) Drawing of LED cross-section with contacts
(d) Picture of LED die front side
Source: System Plus Consulting
Interconnects
© 2012 17 Copyrights © Yole Développement SA. All rights reserved.
Focus on Silicone The Different Type of Silicone for Encapsulation (1/3)
Hard
ne
ss
Refractive Index
1.39 1.41 1.50 1.44
A70
A50
Gel
A20
1.53 1.57
D70
D30
Low
Reflective
Index
Silicone
Methyl
Silicone Methyl-
Phenyl
Silicone
Encapsulation and Optics
© 2012 18 Copyrights © Yole Développement SA. All rights reserved.
Long Term Vision of WLP 3D Packaging Roadmap
2010 2011 2012 2013 2015 2014 2016 2017 2018 2020 2019
Qualification First product on
the market !
1 year
LED
Driver
Driver integration
in the module
LED
LED
3D Silicon
submount
ESD / EMI IPD
Interposer
Multi-chip
modules
Single
chip
modules
LED Driver
Driver
LED LED
LED LED
Wire bonded LED
LED connected by Flip Chip LED
LED
Fully integrated
LED module
(possible future
architecture)
Wafer Level Packaging
© 2012 19 Copyrights © Yole Développement SA. All rights reserved.
Testing Equipment Main Players
Package Testing, Sorting and Taping
Wafer Defect Inspection
Wafer / Die Probing & Sorting
Yield Management / SPC
Testing and Binning
© 2012 20 Copyrights © Yole Développement SA. All rights reserved.
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