lecture_3_given.pdf

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1 EL 512 VLSI Subsystem Design Instructor: Mazad S. Zaveri Faculty Block – 4, Room 4206 Email: [email protected] http://intranet.daiict.ac.in/~mazad_zaveri/

Transcript of lecture_3_given.pdf

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    EL 512 VLSI Subsystem Design

    Instructor: Mazad S. Zaveri

    Faculty Block 4, Room 4206Email: [email protected]

    http://intranet.daiict.ac.in/~mazad_zaveri/

  • EL 511 VLSI2

    Capacitance For an isolated wire

    Capacitance due to the parallel plates bottom of wire with the substrate

    Fringing capacitance arising from fringing fields along all the edges of the conductor with finite thickness

    Fringe = border or periphery For a non-isolated wire, i.e. wire that has adjacent wires

    Parallel plate capacitance bottom with substrate Fringing capacitance with the substrate Parallel plate capacitance side with the side of the other wire

    And some fringing capacitance between the two wire edges/surfaces

  • EL 511 VLSI3

    How to calculate the values of these capacitances ?

    Parallel plate capacitances C = ox A/d

    With appropriate interpretation of area A and d Between wire-bottom and substrate Between wire-side and other wires side

    Fringing capacitance with substrate See next slide

  • EL 511 VLSI4

    Fringing capacitance Two formulas proposed by some authors

    Includes both the fringing capacitance and the bottom-parallel plate capacitance

    Obviously, these formulae do not account for the capacitances with neighbors above or on the sides.

    [Meijs et al.]

    [Yuan et al.]

  • EL 511 VLSI5

    Upper Bound and Lower Bound for a wire capacitance

    Upper Bound: Assume that the layers above and below the conductor of interest are solid ground

    planes Assume, the layers above and below, are not switching, hence, can be modeled as ground

    planes Assume, that the capacitance to neighbors, other than the most adjacent ones, is

    negligible Note: Table 4.8 (on the next slide) gives the upper bound

    Lower Bound: Assume that there are no conductors in the system except the substrate

    Note: Table 4.9 does not provide lower bound, because it assumes adjacent wires (on the same layer) to be present. Hence, Table 4.9 is for a condition between upper bound and lower bound.

    To calculate lower bound, we can use equations on the previous slide (or we can neglect Cadj from Table 4.9)

  • EL 511 VLSI6

    Capacitance table Capacitance to neighbors accounts for more than 50% of total capacitance

  • EL 511 VLSI7

    Capacitance table Overall capacitance is slightly smaller, because there is no layer above

    But, the Cadj is slightly higher, because the fringing fields now terminate on the neighbors

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    In practice, the layers above and below the conductor of interest are neither solid planes nor totally empty The density of the metal on each level will be

    dependent on the layout/implementation of the overall circuit functionality/connectivity

  • EL 511 VLSI9

    Delay Wires have distributed resistance and capacitance along its length

    Wires can be approximated by lumped elements L-model -model T-model

    -model is generally used to model long wires, and at least 3 to 4segments are generally considered

    Because both wire resistance and capacitance increase with length, wire RC-delay grows quadratically with length Some ways to reduce delay

    Thicker and wider wires, low resistance materials/metals, Low di-electric materials between conductors

    Polysilicon and diffusion based wires (also called runners) have very high resistance, even when silicided.

    Do not use diffusion as wire.

    Use polysilicon sparingly, usually in latches and FF

  • EL 511 VLSI10

    Crosstalk Crosstalk phenomenon

    When a wire A switches, it tends to bring its neighbor B along with it, due to capacitive coupling

    Crosstalk effect is dependent on the direction of switching of A and switching of B

    Crosstalk leads to undesirable effects in terms of Delay Noise

    Crosstalk depends on the ratio of Cadj to the total capacitance. The total capacitance may include the load capacitance (if there is any) For short wires, with large loads, crosstalk is unimportant For long wires, crosstalk is important

  • EL 511 VLSI11

    Crosstalk Delay Effects

    When two adjacent wires A and B switch (creating V), the direction of switching affects the amount of charge that must be delivered (Q=Cadj V), and the delay of switching (Ceff)

    Delay will be the worst case, when A and B switch in opposite directions (V=2VDD) Coupling capacitor effectively becomes twice as large (2Cadj)

    (Miller Coupling effect/factor = 2) Delay will be least, when A and B switch in same

    direction (V=0) Coupling capacitor effectively absent (Cadj=0)

    (A is switching)

  • EL 511 VLSI12

    Crosstalk Noise Effects Wire A switches, while wire B is supposed to remain constant

    But A will try to switch B partially, creating noise on B Modeled as Aggressor and Victim network

    Condition: Victim is floating (not-driven) Capacitive voltage divider to compute victim noise

    Condition: Victim is actively driven Victims driver will supply current to oppose and reduce the victim noise, induced

    by the aggressor Drivers are modeled with resistors

  • EL 511 VLSI13

    Crosstalk Noise (Victim is undriven/driven) Waveform shows

    Step signal on the aggressor wire Coupled noise-signal on the victim wire

    Victim is driven with inverters of different inverter gate-size (current driving capacity) When victim is not driven (i.e. floating) noise remains indefinitely When victim is driven, the victims driver opposes the transition, and restores the

    victims voltage level Depending on the wires voltage, Aggressor (driver) transistor will be in LIN/SAT, and victim transistor will be in LIN/SAT

    Accordingly, that will affect Raggressor and Rvictim