Lecture 2-IntelliSuite Tutorial
-
Upload
helena-bogdzel -
Category
Documents
-
view
958 -
download
3
Transcript of Lecture 2-IntelliSuite Tutorial
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliSuite TutorialLecture 2
Sazzadur Chowdhury, Ph.D.Electrical and Computer Engineering
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Overview
• IntelliSuite is a MEMS design and verification tool
• The software can simulate actual steps in a fabrication process to develop a 3-D model of a MEMS device
• The developed 3-D model can then be used to perform 3-D simulations such as
• Electrostatic, Mechanical, Thermal or Coupled thermo-electro-mechanical simulations using finite element analysis method
• Microfluidics• Electromagnetic• Electrokinetics• Packaging• System level simulation• Macro-model extraction
http://www.intellisensesoftware.com
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
MEMS Process Simulation Design Flow
Wafer
Deposition Lithography Etch
3-D Model
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
MEMS 3-D Model Behavior Simulation Concept
3-D Model
Behavior Pattern
Boundary Condition
Load Meshing
Analysis Options
Fab. Proc. Simulation
Manual 3-D Builder
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
MEMS Simulation Objectives
• To investigate a material’s physical characteristics for suitability of it’s use in a particular device based on a specific deposition method
• Selection of a deposition or etching method for a material to obtain a desired device geometry
• To optimize the process steps
• Check for process compatibility
• To simulate the 3-D model of the device for behavior
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliSuite Overview
• IntelliFab• IntelliMask• Mematerial• 3-D Builder• Thermoelectromechanical Analysis• Microfluidics and BioMEMS• AnisE (Anisotropic Etch Simulation)• Technical Reference
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliFab: Getting Started
• Start • IntelliSuite• Intellifab
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliFab
• File
• Process
• Database
• Construct
• Simulation
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Adding a Fabrication Process Step
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Building a Process Table
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
3-D Visualization
•Construct
•Visualize
•Scale
•Sequence once
•Cross-section
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Database
• This option allows you to add process steps to the currently open database.
• New materials are added to MEMaterial
• Deposition, Etching, Bond, Mask, Substrate,• Electroplating, Doping, Liftoff Metalization, or Clean.
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Process Steps
• Bonding• Definition• Deposition• Doping• Electroplating• Etch• Sacrifice• Laser Ablation
(Ablation is the process of removing material by vaporization or disintegration.
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliMask
• Single Mask• Multilayer Mask• Convert (DXF, GDSII)• The IntelliSuite GDSII file converter provides several options.
Users can convert all cells, or just selected cells, of a multi-cell multi-level *.gds file into multi-layer *.msk files. A multi-layer *.msk file will be generated for each selected cell, and also for each sub cell of the selected cell
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
GDS Cell Tree After Conversion
•IntelliSuite Masks can be exported to GDSII format for fabrication
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliMask Features
• Manhattan geometry• Non-Manhattan Geometry• Cartesian Co-ordinate• Polar Coordinate• Switch layers
Mask Editor Tool Bar
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Grids and Layers
•Keyboard Entry
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Mematerial
• Mematerial is a powerful, easy-to-use simulation tool for the mechanical, electrical, and optical modeling of thin films deposited on silicon substrates.
• Applications include the design of:• Microsensors and microactuators
• Integrated circuits• Device packaging• Other silicon microstructures
• The software presents data on the properties of materials in two- and three dimensional graphs as well as in tables
• All data are experimentally verified• New values can be predicted using interpolation and
extrapolation
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Mematerial
Single Parameter of interest
Two parameter of interest
Mematerial Window
Parameter Window
Parameter Graphs
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Mematerial: Data Manipulation
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
3D Builder
2-D area 3-D Area
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Elements Construction
• Gaps and overlaps cannot exist anywhere along the common edge when a continuous structure is modeled.
• The adjacent edges either must both be straight, or they must have compatible curvatures.
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Mesh Refinement
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
ThermoelectricalMechanical Module
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Analysis Option
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Analysis Options: Static Analysis
• Stress/Displacement• Heat Transfer• Heat Transfer / Thermal Stress• Thermal Electrical• Thermal Electrical / Thermal Stress• ThermoElectroMechanical Relaxation• Electrostatic• Electrostatic Force vs. Displacement
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Relaxation Method
Domain 102
111 )x,.....,x,x(f )i(
m)i()i(
Domain 2011
21
12 )x,.....,x,x(f )i(m
)i()i(
Domain m011
21
1 )x,.....,x,x(f )i(m
)i()i(m
Converged
i=i+1
YesNo
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Analysis Options: Frequency Analysis
• Static Stress• Heat Transfer / Thermal Stress• ThermoElectroMechanical Relaxation
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Analysis Options: Dynamic Analysis
• Stress / Disp. (Direct Integration)• Stress / Disp. (Mode Based)• Heat Transfer Transient• Thermal Electrical Transient• Stress / Disp. / Squeezed Film (Direct Integration)• Stress / Disp. / Electrostatic (Direct Integration)• Stress / Disp. / Electrostatic (Mode Based)• Stress / Disp. / Electrostatic / Squeezed Film (Direct Integration)
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Analysis Options: Macro-Model
• Rigid Body Variables• Spring Constants• Squeezed Film Damping Variables• Capacitance• Capacitance vs. Displacement• Mechanical Reduced Order Modeling• ElectroMechanical Reduced Order Modeling
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Loads
• Several types of loads can be applied in the ThermoElectroMechanical Analysis module: Temperature, Pressure, Displacement, Heat Convection, Heat Flux, Acceleration, Coriolis Force, Voltage, Current, and Charge Density.
• Loads can be applied on a face or a node• Amplitude vs Time• Amplitude vs Frequency
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Boundary
• Fixed• YZ Fixed• XY fixed• XZ fixed• X fixed• Y Fixed• Z Fixed• Free• Attach spring, etc.
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Load-Boundary Application Example
0 V DC 1 Pascal
12 V DCFixed Boundary
Fixed Boundary
• PECVD Nitride, Au and Ti layers are removed
• 4 lateral faces of the diaphragm are X, Y, Z fixed
• Nitride Backplate and wafer faces are X, Y, Z fixed
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Mesh
• Automesh• User Defined mesh• Mechanical mesh• Electrical mesh
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Result
• Displacement• Deformed shape• Stress components• Stress invariants• Potential• Electrical field• Current density• Capacitance• Charge density• Pressure• Natural frequency• Mode animation• Macromodel
• Node value
• Node curve
• 2-d plot- Mechanical
• 2-D plot-Electromechanical
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Layout: Die Size
Die Size Entry Window
Click
• Construction
• Layout
• Die size
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Electrostatic Comb Drive Example
• An electrostatic comb drive is a kind of resonator that is actuated electrostatically.
• The movement of the free comb due to electrostatic excitation changes the capacitance among the comb fingers, which is sensed and used to drive some other micro structure
Courtesy: Sandia Laboratory
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Comb Drive Construction: Begin
Click•Construction
•Show Palette
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 1Substrate Definition
Click • Definition
• Geometry• Si
• Czochralski
The OpSet window pops up and data can now be entered in the OpSet window
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Substrate Definition OpSet Window
• Change parameters as necessary
Click• Add process• Add process
• The OpSet window disappears, and first step is entered into the Process Table.
• The Process Construction Palette remains on the screen
OpSet Window
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 2: Substrate Clean Up
Click • Etch
• Element• Si
• Clean
Piranha: A solution of H2SO4 and H2O2 at 1200 C
Click• Process
• Piranha• Add Process
• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Result of 2nd Step
The wafer is cleaned and the 2nd step is added to the process construction tableClick
• Construction• Visualize
Visualizer window pops up
Click• Visualize
• AllA 3-D model of the structure is displayed. Using middle or right mouse button adjust a suitable view angle.
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 3Silicon Dioxide Deposition
Click• Deposition
• Compounds• SiO2
• Thermal
• Time_dep (enter 600)• H20 pp (enter 10)• t-film (entert_685)• t_etch( enter 685)• t_after (enter 0)• Add Process• Add Process
OpSetWindowEntry
Process Construction Palette
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 4Silicon Nitride Deposition
Click• Deposition
• Compounds• Si3N4
• PECVD
This layer protects the wafer during subsequent processing
• t_film (enter 1000)• Add Process
• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 5Cleaning After Plasma Deposition
Click• Etch
• Element• Si
• Clean
This cleaning step is necessary because diffusion cannot follow plasma deposition
RCA: A solution of NH4OH:H2O2:H2O
• Process• RCA
• Add Process• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 6Polysilicon Layer Deposition
Click• Deposition
• Compounds• PolySi
• LPCVD• t_film (enter 2000)
• Add Process• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 7Aluminum Contact Deposition
Click• Deposit
• Element• Al
• Sputter• Process
• Ar-Ambient
• Add Process• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 8Photoresist Deposition
Click• Deposition
• Polymers• PR-S1800
• Spin
PR-S1800 series is a positive photoresist. It is a proprietary chemical from Shipley Corporation, MA, USA. Main ingredients are: (1) Propylene glycol methyl ether acetate (70%), (2) A Novalac resin (20%), and (3) diazonapthoquinone (1-10%)
• Add Process• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 9First Mask Definition
Click• Definition
• Mask• UV
• Contact• Mask Number (enter 1)
• Process• Suss
• Add Process• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Mask Definition OpSet Window
ClickLayouttwice to invoke theMask Editor
Mask No.
(Must be a unique numerical value)
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Mask Editor: First Mask
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 10Photoresist Pattern
Click• Etch
• Polymers• PR-S1800
• Wet• Process: 1112A (solvent)
• t_etch (enter 990000)• Add Process
• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 11Aluminum Etch
Click• Etch
• Element• Al
• Wet
PAN Phosphoric+Acetic+Nitric Acid
• Process• PAN
• t_etch (enter 990000)• Add process
• Add process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 12 Photoresist Strip
Click• Etch
• Polymers• PR-S1800
• Wet• Process: 1165 (solvent)
• t_etch (enter 990000)• Add Process
• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 132nd Photoresist Deposition
Click• Deposition
• Polymers• PR-S1800
• Spin• Add Process
• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step142nd Mask Definition
Click• Definition
• Mask• UV
• Contact
This mask patterns the polysilicon layer
• Mask Number (enter 2)• Process
• Suss• Add Process
• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Mask Editor: Second Mask
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 15Photoresist Etch
Click• Etch
• Polymers• PR-S1800
• Wet• Process: 1112A (solvent)
• t_etch (enter 990000)• Add Process
• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 16Polysilicon Plasma Etch
Click• Etch
• Compound• Poly Si
• Dry• Process
• SF6-Plasma• T_etch (enter 990000)
• Add Process• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 17Photoresist Strip
Click• Etch
• Polymers• PR-S1800
• Wet• Process: 1165 (solvent)
• t_etch (enter 990000)• Add Process
• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 18Nitride Etch
Click• Etch
• Compound• Si3N4
• Wet
Phosphoric acid (70% concentrated)
• Process• Sacrifice
• t_etch (enter 1e6)• Add Process
•Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 19Silicon Dioxide Etch
Click• Etch
• Compound• SiO2
• Wet
Buffered Oxide Etch (BOE) is a 5:1 mixture of NH4F and HF
• Process: BOE(solvent)• t_etch (enter 990000)
• Add Process• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Step 20Substrate Sacrificial Etch
Click• Etch
• Element• Si
• Wet• Process
• Sacrifice• t_etch (enter 1e6)
• Add Process• Add Process
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Comb Drive 3-D model
Complete Process table 3_D Model
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliSuite Fabrication Simulation Example
Conceptual Drawing IntelliSuite Fabrication Simulation Result Cross-section
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliSuite Fabrication Simulation Example
Conceptual Drawing IntelliSuite Fabrication Simulation Result Cross-section
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Intellisuite Fabrication Simulation of an Electromagnetic Microactuator
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliSuite Simulation Result of Electrostatic Pressure due to a Bias Voltage
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliSuite Simulation Result of Displacement due to Electrostatic Pressure due to a Bias Voltage
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
Animation of a Diaphragm Vibration for an Acoustical Wave at 1 kHz at 1 Pascal
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliSuite Dynamic Analysis Example
Transient Response of a Diaphragm Vibration for an Acoustical Wave at 1kHz at
1 Pascal
RESEARCH CENTRE FOR INTEGRATED MICROSYSTEMS - UNIVERSITY OF WINDSOR
06-88-435 Microelectromechanical Systems (MEMS) Summer 2011
IntelliSuite Dynamic Analysis Example
Mode based steady state analysis
Resonant peak for first vibrational mode