LDS Introduction

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Laser Direct Structure

Shenzhen V-ON Magnetic Electronic Technology CO.,LTDhttp://www.vonant.net/

Email:[email protected]
http://www.vonant.net/http://www.vonant.net/http://www.vonant.net/http://www.vonant.net/


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Laser Direct Struc tu re(LDS)Laser Direct Struc tu re(LDS)

Confidential Proprietary

Index

1. General introduction2. Intellectual properties

3. Process and Technology specification

4. New LDS Materials

5. Tech Application

MI (Mechanics-Integrated ) Antenna

LDS with different paintings

LDS in automotive and camera applications

6. Manufacture lead time and capacity

Section 1

Section 2


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General introduction


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Main Process

Materials preparation

Injection molding

Laser activation

Electroless plating


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Material VI in house

Outsourcing to various tier

suppliers

Equipment 1.7 million RMB 3.6 million RMB

Cycle time 50mm/s 50mm/s

Efficiency High High

Yield about 95% about 95%On line test < 6S < 6S

The raw material of injection molding and

electroless plating chemicals are made by V-ON .The Laser equipment is developed by V-ON.


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S W

OT

1. V-ON developed total solution on raw

material, laser activation and plating .

2.Innovated the first class surface pattern +paintingtechnique.

3. Developed a series material which can be used for LDS

technology (Such as :PC/ABS,PC+GF,PP,PBT

etc).

4.Owned a series of forming technology

(For example : single shot, two shot,

insert-molding etc.)

5.Applied the Material patent

6.Have set up a experienced team for

technology development

7.Fast and flexibility sample preparation

(leadtime:7 days after the pattern release).

1.BASF,SABIC etc famous Chemical

company push the material whichsuitable for LDS

2.Large area part exist the productivity

issue while have the competition on cost

breakdown with other surface

metallization technology such as:

PVD,CVD etc.

1.Limition of the client resource.

2. V-ON Brand among materialmanufacturer.

1.3D Antenna have showed the excellent

performance ,which drive the

dramatically use of the LDS

technology on smart phone market.

2. The great market potential on Other

section. Such as :The B/T earphone,dental equipment, socket, PLC, ECU of

motor and Auto ,RFID etc.

3.Cost performance advantage on 3D

design

4.No pollution process can match with

the environment need.


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2.Intellectual Properties

1. LDS owned by V-ON is a selective activation platingtechnology. Which use energy beams to sublimatethe selective plastics area so as to expose specialnano-size particles encapsulated in the polymermatrix which is very efficient to promote the

electroless plating, so only the selected area couldbe plated .

2. Processing: Polymercompounding moldingsublimation of the selective plastics area

electroless plating Cu or Ni-Cu electroless platingNi plating Au

3. Application:Manufacture complicated 3D circuits.


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Chinese Patent of LDS


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Applicable Materials

1. Currently, PC/ABS and PBT (for high temperature

application) have been tested to be applicable in

antennas. PPA may be more suitable in other applications

such as automobiles and semiconductors. SPS may be

the most ideal materials for antenna application, which is

under development.2. CRI at V-ON has strong competence in designing and

preparing materials for various applications.


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Material Test

Material characteristics Comparison between the V-ON PC/ABS and general PC/ABS.


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Material Test

Material characteristics Comparison between the V-ON PC/ABS and

general PC/ABS.

With moderate fluidity & high toughness, LDS materials could be shapedby extrusion or injection process, then people could design patternsflexibly on shaped articles via laser, cutting, burnishing, plasma, electronbeams.


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3. Process and Technology specification

Laser Activation Process

Materials

preparation

Injection

molding Laser activation Electroless plating


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Laser Activation

350*350


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Laser Activation


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Metallization


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4 . New LDS Materials

1. PA based Material will be used for high strengthcondition.

2. PC+GF based material will be used for the

current mobile-phone housing .

3. which need to match the mechanicalperformance.

4. High toughness PC/ABS based material will be

used for the secondary housing part.

L Di S (LDS)L Di S (LDS)


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New LDS Materials studying

L Di t St t (LDS)L Di t St t (LDS)


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New LDS MaterialsPI Material



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New LDS MaterialsPTFE Material



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5. Applications ----MI Antenna

Solution 1:

2K mold LDS

Solution 2:

PC + GF LDS

Single shot



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LDS Max Space Utility

Conclusion:

With LDS antenna design, overall RF performance improvement on Eve is observedcompared to the original FPC antenna.

GF in the back cover has impact on LDS antenna performance. By removing it, further

performance improvement could be achieved.

FPC antenna LDS antenna designed by V-ON

FPC Sample LDS Sample



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Section 2application of LDS

Shenzhen V-ON Magnetic Electronic Technology

CO.,LTD

Laser Direct Str c t re(LDS)Laser Direct Str c t re(LDS)


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LDS antenna samples



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Applications -----MI Antenna Molding



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Antenna Test Facility



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LDS with different paintings

LDS materials decoration can be achieved viapainting , e.g. high gloss, matt finish, soft-touch,

multi-coloured painting.



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LDS paintings

Both LDS antenna and plastic can be painting , andpainting oil has good adhesion on the two parts.



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LDS tech. of painting without mark


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LDS tech. of painting without mark

We obtain no mark with plating samples with high gloss and

matt finish effects, which can meet the requirement of class 1.

No Marking painting



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LDS tech. of Via-hole without mark

Advantages in three aspects.

Innovation points:Free and credible feed-in method by sealing and polishing.

Realizing no mark for via-hole by common painting process.



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LDS In automotive applications

Car radio crash components with high reliability



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LDS In automotive applications

Light sensor

Locomotive detection sensor



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LDS In camera applications

Typical Structure

Of Cameras



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LDS In camera applications



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LDS In Aerospace applications

Hybrid manufacturing process:3D Prints + LDS.



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6.Manufacture lead time and capacity plan

Calculation based on Injection machine: 500K/month/set

Laser machine: 500K/month/3 sets

Plating line: 2M/month/line

RF Tester: 300K/month/set



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6.Manufacture lead time and capacity plan

Process Equipments 2011 2012 2013 2014 2015

Molding Inject Machine 1 2 6 8 12

Laser Laser Machine 1 2 4 8 16

Plating Plating line 1 1 1 3 5

RF Test RF Tester 1 2 2 4 6

0

2000

4000

6000

8000

10000

12000

2011 2012 2013 2014 2015

LDS CapacityUnit: Kpcs/month)



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Thank You For Attention

A V-ON-patented LDS manufacture technology

combining material preparation, equipment design

and process innovation.

LDS Introduction

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