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Date: 17-Aug-2009 Sheet of File: E:\MEGMEET\PCB\MLT019L-J\1.1(2009.08.17\MLT019L-J-1.1(2009.08.17).ddbDrawn By:

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MLT019L-C POWER

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14 142

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A Title

Number RevisionSize

A4

Date: 17-Aug-2009 Sheet of File: E:\MEGMEET\PCB\MLT019L-J\1.1(2009.08.17\MLT019L-J-1.1(2009.08.17).ddbDrawn By:

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LC370WX1-SLA1 .PDF1. General Description2. Absolute Maximum Ratings3. Electrical Specifications3-1. Electrical Characteristics3-2. Interface Connections3-3. Signal Timing Specifications3-4. Signal Timing Waveforms3-6. Power Sequence4. Optical Specification5. Mechanical Characteristics6. Reliability8. Packing9. Precautions

Mstar9E89_2007-10-03.pdfcpu.pdfext_in.pdfsocket.pdfPower Supply.pdfTuner+HDMI+Audio.pdfAudio AMP.pdf

28-A00058-0022_CompSkil.pdfModel

05-26DF08-120 AT26DF081A PRINTING.pdfFeatures1. Description2. Pin Descriptions and Pinouts3. Block Diagram4. Memory Array5. Device Operation6. Commands and Addressing7. Read Commands7.1 Read Array

8. Program and Erase Commands8.1 Byte/Page Program8.2 Sequential Program Mode8.3 Block Erase8.4 Chip Erase

9. Protection Commands and Features9.1 Write Enable9.2 Write Disable9.3 Protect Sector9.4 Unprotect Sector9.5 Global Protect/Unprotect9.6 Read Sector Protection Registers9.7 Protected States and the Write Protect (WP) Pin

10. Status Register Commands10.1 Read Status Register10.1.1 SPRL Bit10.1.2 SPM Bit10.1.3 EPE Bit10.1.4 WPP Bit10.1.5 SWP Bits10.1.6 WEL Bit10.1.7 RDY/BSY Bit

10.2 Write Status Register

11. Other Commands and Functions11.1 Read Manufacturer and Device ID11.2 Deep Power-down11.3 Resume from Deep Power-down11.4 Hold

12. Electrical Specifications12.1 Absolute Maximum Ratings*12.2 DC and AC Operating Range12.3 DC Characteristics12.4 AC Characteristics12.5 Program and Erase Characteristics12.6 Power-up Conditions12.7 Input Test Waveforms and Measurement Levels12.8 Output Test Load

13. Waveforms14. Ordering Information14.1 Green Package Options (Pb/Halide-free/RoHS Compliant)

15. Packaging Information15.1 8S1 - JEDEC SOIC15.2 8S2 - EIAJ SOIC

16. Revision History

TDA8944j-02.pdf1. General description2. Features3. Applications4. Quick reference data5. Ordering information6. Block diagram7. Pinning information7.1 Pinning7.2 Pin description

8. Functional description8.1 Input configuration8.2 Power amplifier8.2.1 Output power measurement8.2.2 Headroom

8.3 Mode selection8.3.1 Switch-on and switch-off

8.4 Supply Voltage Ripple Rejection (SVRR)8.5 Built-in protection circuits8.5.1 Short-circuit protection8.5.2 Thermal shutdown protection

9. Limiting values10. Thermal characteristics11. Static characteristics12. Dynamic characteristics13. Internal circuitry14. Application information14.1 Printed-circuit board (PCB)14.1.1 Layout and grounding14.1.2 Power supply decoupling

14.2 Thermal behaviour and heatsink calculation

15. Test information15.1 Quality information15.2 Test conditions

16. Package outline17. Soldering17.1 Introduction to soldering through-hole mount packages17.2 Soldering by dipping or by solder wave17.3 Manual soldering17.4 Package related soldering information

18. Revision history19. Data sheet status20. Definitions21. Disclaimers

SPECIFICATION FOR APPROVALInput voltage range

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