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Charles L. Brown Department of Electrical and Computer Engineering
Mool C. GuptaLangley Distinguished Professor & NSF I/UCRC Center Director
Department of Electrical & Computer Engineering
University of Virginia
Workshop, November 10, 2010
Laser Based Manufacturing
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Charles L. Brown Department of Electrical and Computer Engineering
Outline
I. Introduction & Laser matter Interaction Process
II. High Power Lasers
III.Optical, Thermal and Electrical Properties of
Materials
IV. Beam Delivery and Scanning systems
V. Examples of Laser Applications
VI. Laser Process Monitoring
VII. Laser Market and Future Prospects
Outline
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Charles L. Brown Department of Electrical and Computer Engineering
Section I. Introduction & laser
matter interaction process
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Charles L. Brown Department of Electrical and Computer Engineering
National Science Foundation Center
For Laser Based Manufacturing
Develop Science, Engineeringand Technology Base for
Laser and Plasma Processing of Materials, Devices and
Systems for Advanced Manufacturing
Center Mission
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Charles L. Brown Department of Electrical and Computer Engineering
Partnership
Projects
Industry
Fed. LabsUniv.
State NSF
MembershipMembership
Mem
bers
hip
CIT
Over
head
&
Facil
ity
Funds& National
Recognition
University of Virginia (Lead)
University of Michigan-Ann Arbor
University of Illinois
Southern Methodist University
NSF Industry University Cooperative
Research Center for Laser Based
Manufacturing
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Charles L. Brown Department of Electrical and Computer Engineering
AREVA Inc. NAVAIR
GE Global Research A Army Research Lab.
NASA-Langley
General Motors R&D Trinity Industries
Trumpf Lasers
Lockheed Martin Lee Lasers
Halliburton Lesker Corp
Focus Hope Huettinger
Cymer Corp. Dexter
FIT Star Fire
IMRA Begnaud
Industrial Advisory Board Members
http://www.areva.com/servlet/ContentServer?pagename=arevagroup_en/homehttp://www.leelaser.com/index.htmlhttp://www.focushope.edu/default.htmhttp://www.nasa.gov/http://www.cymer.com/
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Charles L. Brown Department of Electrical and Computer Engineering
$30k membership allows
Technical project for 1 year
Access to center facility
Access to center technology
Interaction with all center board members
Benefit from other NSF supported projects
NOTE: Board Members have access to
center research of over $1M with an
investment of $30k in membership. NSF
report shows $7 return for every dollar
invested.
NSF I/UCRC Center
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Charles L. Brown Department of Electrical and Computer Engineering
Laser Welding: - Laser welding of light materials
-Rapid manuf. by e-beam welding
-Gas tungsten arc welding
-Galvanized steel welding
Laser Micromachining: -Laser texturing of Mo for solar
-Laser micromachining for fluidics
- Laser drilling of Ni superalloys
Laser Cladding: -Laser sintering of inconel 690
- Laser Cladding for erosion
Laser Diagnostics- -Laser corrosion detection-Navair
-Composition diagnostics during DMD
Plasma Processing: -Transparent coatings, pulsed plasma
Summary of Center Projects
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Charles L. Brown Department of Electrical and Computer Engineering
Laser and Optics Lab Two fiber lasers (IPG), 50 ns pulse width
High power CW diode laser (250W)
Fs laser
Two Nd-YAG laser (10 ns pulse width)
Optical measurement equipment
Computer controlled stages and galvo systems
Clean Room Facility for Microfabrication Optical Lithography, e-Beam Lithography,
sputtering, e-beam deposition, ion etching
Characterization Facility- SEM, TEM, AFM, X-ray, ..
Sensor and Photovoltaic Device Fabrication and Characterization Labs
Research Infrastructure
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Charles L. Brown Department of Electrical and Computer Engineering
Diode pump Solid state laser
Diode laser
IPG fiber laser
YAG laserYAG laser
Research Infrastructure
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Charles L. Brown Department of Electrical and Computer Engineering
Automotive
Panel hole cutting
Surface modification
Sheet metal welding
Aerospace
Laser cutting & welding
Laser brazing
General manufact.
Micromachining
Microfabrication
Others
Laser crystallization
Pulsed laser deposition
Medical
Eye surgery
Tissue removal
Biostimulation
Military
Laser weapons
Army laser goggles
Laser designator
Brazing
Cladding
Soldering
Seam welding
Spot welding
Diode pumping
Surface melting
Epoxy curing
Laser sintering
Laser welding
Paint stripping
Laser forming
Medical applications
Laser illumination
Composite forming
Free form fabrication
Laser Applications
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Charles L. Brown Department of Electrical and Computer Engineering
LaserMaterial
Beam Delivery & scanning
Power source
& electronicsX-Y-Z computer
controlled stage
Process
monitor &
safetyEnvironment
Fundamentals of Laser Matter
Interactions
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Charles L. Brown Department of Electrical and Computer Engineering
Laser material interactions
Laser systems
Optics and beam delivery systems
Materials and metallurgical aspects
Process sensing and control
Application specific process
Various Aspects of Laser Based Manufacturing
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Charles L. Brown Department of Electrical and Computer Engineering
Light Absorption
Temperature Rise
Melting
Vaporization
Cooling and
solidification
Material
Laser
beam
Ablated particles
Laser parameters
Optical properties of materials
Thermal properties of
materials
Electrical properties
Plasma
Plume
Light
emission
Laser Matter Interactions
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Charles L. Brown Department of Electrical and Computer Engineering
http://ej.iop.org/links/q35/KI7QquaireEtwti,zstKpA/oa3451.pdf
Interaction
time
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Charles L. Brown Department of Electrical and Computer Engineering
Laser rod
100 %
Reflecting
mirror
Partially
reflecting
mirror
Coherent
radiation
Pump source
High Power Lasers
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Charles L. Brown Department of Electrical and Computer Engineering
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Charles L. Brown Department of Electrical and Computer Engineering
Beam profile: GaussianSpectral Information
Pulse widthPolarization
-15 -10 -5 0 5 10 15
Re
lative
in
ten
sity
Time (ns)
Temporal Profile of a ns laser pulse
Pulse width at
FWHM
-6 -4 -2 0 2 4 6
Beam
width
Re
lative
in
ten
sity
Distance
I = Io exp[-r2/a]
Spatial distribution of intensity of a laser beam
Outp
ut p
ow
er
Wavelength (nm)
T.E
T.M
Laser Parameters
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Charles L. Brown Department of Electrical and Computer Engineering
Laser Beam Profile
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Charles L. Brown Department of Electrical and Computer Engineering
http://www.etechnologie.fh-stralsund.de/Daten/Fundamentals%20of%20laser%20drilling.pdf
Laser pulse characteristics
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Charles L. Brown Department of Electrical and Computer Engineering
pp
apeak
ft
PP
Tf p
1
ppeakp tPPdtE
p
ppeak
At
E
A
PI
A
tP
A
EW
ppeakp
Peak Power
Intensity
Pulse energy
Fluence
Repetition ratetp=pulse width
Pa =Average power
A=area
Ppeak = Peak power
Ep = peak energy
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Charles L. Brown Department of Electrical and Computer Engineering
I. Continuous (CW)- Important parameter is the power in Watts Between 100W and 20kW
for materials processing
II. Pulsed - Important parameters are Joules
per Pulse and number of Pulses per Second
Energy per pulse: 1mJ -1kJ
Pulse length: 1ms -1ns-100 fs
Pulse repetition rate: 0.1/s to 1 MHz
Lasers
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Charles L. Brown Department of Electrical and Computer Engineeringhttp://www.electro-optics.org//files/laser%20workshop/martukanitz.pdf#search
Laser
Types
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Charles L. Brown Department of Electrical and Computer Engineering
Important commercial lasers
Excimer 193-248nm Pulsed 10s of Watts
Nd-YAG 1064 nm CW or Pulsed kW
CO2 10600 nm CW or Pulsed kW
Cu-Vapor 534 nm Pulsed 10s of Watts
Ti-Sapphire 700-1000 nm CW or Pulsed 10s of Watts
Other gas Solid State & Semiconductor Lasers
Important Commercial Lasers
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Charles L. Brown Department of Electrical and Computer Engineering
Power density of welding and others
http://www.uni-ulm.de/ilm/AdvancedMaterials/Presentation/Admasulaserconductionwelding.pdf
Laser Power Density Regimes
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Charles L. Brown Department of Electrical and Computer Engineering
http://t1.gstatic.com/images?q=tbn:ANd9GcRDgYhJ4I0kfhbHS83UQcsA0nWgSd0aQsdYPeuJRU2rS1jSsY0&t=1&usg=
__eqVU_YCOd-vi4yZ7qTvs_5iwyRs=
Fiber Laser Nd:YAG laser
Lasers
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Charles L. Brown Department of Electrical and Computer Engineering
Section III. Optical, thermal and electrical
properties of materials
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Charles L. Brown Department of Electrical and Computer Engineering
Reflectivity
Thermal Conductivity
Specific Heat
Latent Heat
The lower these parameters the more
efficient the process since less energy is
required to melt and vaporize the material.
Important Physical Parameters
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Charles L. Brown Department of Electrical and Computer Engineering
Beer Lamberts Law
I = I0 exp (-4d/)
Where: = extinction coefficient; =
Wavelength; I = Intensity at depth d; I0 =
Intensity at the surface
Beer Lamberts Law
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Charles L. Brown Department of Electrical and Computer Engineering
http://www.intel.com
Absorption coefficeint for various semiconductors
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Charles L. Brown Department of Electrical and Computer Engineering
Table: Complex refractive index and reflection coefficient
for some materials to 1.06 micron radiation
Source: W. M. Steen
Optical Properties
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Charles L. Brown Department of Electrical and Computer Engineering
Figure: Reflectivity of steel to polarised 1.06 micron radiation,
Source: W. M. Steen
Reflectivity variation with angle
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Charles L. Brown Department of Electrical and Computer Engineering
Figure. Reflectivity of some common metals for normal incidence as
a function of wavelength. (After F. A. Jenkins and E. White, Fundamentals of Optics, 4th ed., McGraw-Hill, 1976)
Reflectivity vs. Wavelength
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Charles L. Brown Department of Electrical and Computer Engineeringhttp://free.pages.at/bastieh/download/source/vortrag/lama.pdf
Absorption vs Wavelength
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Charles L. Brown Department of Electrical and Computer Engineering
http://www.ensc.sfu.ca/people/faculty/chapman/e894/e894l15g.pdf
Schematic variation of absorption with temperature for a typical metal
surface for both the YAG and CO2 laser wavelength
Absorption and
reflectivity are very
temperature
dependent
Often undergo
significant changes
when material melts
eg Silicon, steel
becomes highly
reflective on melting
Temperature
effect on
absorption
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Charles L. Brown Department of Electrical and Computer EngineeringLaser Material Processing by W. Steen
Thermal properties of metals and
semiconductors
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Charles L. Brown Department of Electrical and Computer Engineering
Temperature Distribution
tqerIAz
TK
t
TPc zp
.
2
2
P= mass density, = specific heat, k= thermal
conductivity
; I(r) = radial distribution of laser beam
Represents attenuation of beam in z-direction a = optical
Absorption coefficient. A is absorptivity (between 0 and 1)
For flat beam
pc pPcK
D
ze
constIrI 0
Dt
zicrfc
K
DtAIztT
2
2, 0
http://www.etechnologie.fh-stralsund.de/Daten/Fundamentals%20of%20laser%20drilling.pdf
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Charles L. Brown Department of Electrical and Computer Engineering
http://www.etechnologie.fh-stralsund.de/Daten/Fundamentals%20of%20laser%20drilling.pdf
Temperature vs time
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Charles L. Brown Department of Electrical and Computer Engineering
Figure: Temperature vs. depth by copper
http://www.etechnologie.fh-stralsund.de/Daten/Fundamentals%20of%20laser%20drilling.pdf
Temperature vs Depth
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Charles L. Brown Department of Electrical and Computer Engineering
Section IV. Beam delivery and scanning
systems
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Charles L. Brown Department of Electrical and Computer Engineering
http://www.electro-optics.org//files/laser%20workshop/martukanitz.pdf#search
Hard Optic Delivery
(CO2, Nd:YAG, and Excimer Lasers)
Fiber Optics Delivery
(Primarily Nd:YAG Lasers)
Mirrors must be properly aligned and
clean
Can be used with practically any
wavelength
Hard optical systems are fairly
reliable
Versatile delivery to work station
No practical fiber materials for
use with CO2 lasers (10.6 micron
radiation)
Require high fiber bend radius
(approx 0.2m) to prevent leakage
Destroys coherency of beam,
resulting in larger focal spot
Focus HeadFibersLaser
Optics
Moving
Workplaces
Moving
Optics
Beam delivery systems for laser processing
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Charles L. Brown Department of Electrical and Computer Engineeringhttp://www.aerotech.com/pressbox/uk/release.cfm/ID/254.html
http://www.laserod
.com/mirrors.shtm
Laser Scanning Systems
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Charles L. Brown Department of Electrical and Computer Engineeringhttp://www.uslasercorp.com/catalog/fobd.html
Fiber optic beam delivery system
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Charles L. Brown Department of Electrical and Computer Engineering
Section V. Applications
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Charles L. Brown Department of Electrical and Computer Engineering
Surface Processing
Alloying
Surface Hardning
Cladding
Annealing & Doping
Crystallization
Texturing
Patterning
Direct writing
Bulk Processing
Cutting
Drilling Holes
Marking
Welding
Etching & Coating
Pulsed Laser
Depostion
Laser CVD
Applications
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Charles L. Brown Department of Electrical and Computer Engineering
Laser micromachining
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Charles L. Brown Department of Electrical and Computer Engineering
Laser Micro-machiningEDM
Sharp notch tip
Smaller heat effected zone
Laser micro notch fabrication
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Charles L. Brown Department of Electrical and Computer Engineering
AFM Image of
Double Grating in
Si
Diffraction Pattern
from Double
Grating
Micro/nano fabrication
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Charles L. Brown Department of Electrical and Computer Engineering
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Charles L. Brown Department of Electrical and Computer Engineering
Laser marking for CD disks
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Charles L. Brown Department of Electrical and Computer Engineering
Schematic of laser cleaning process
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Charles L. Brown Department of Electrical and Computer Engineering
Wavelength: 800 nm
Pulse Repetition Rate: 1 KHz
Pulse Energy: 1 mJ
Laser texture-experimental setup
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Charles L. Brown Department of Electrical and Computer Engineering
Laser surface texture
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Charles L. Brown Department of Electrical and Computer Engineering
Laser surface texture of thin films
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Charles L. Brown Department of Electrical and Computer Engineering
Surface Reflectivity Control
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Charles L. Brown Department of Electrical and Computer Engineering
Laser Generated Nanopores
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Charles L. Brown Department of Electrical and Computer Engineering
Superhydrophobic Surfaces
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Charles L. Brown Department of Electrical and Computer Engineering
Cell growth on laser textured surface
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Charles L. Brown Department of Electrical and Computer Engineering
Laser Marking
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Charles L. Brown Department of Electrical and Computer Engineering
Lasers for Photovoltaics
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Charles L. Brown Department of Electrical and Computer Engineering
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.51E16
1E17
1E18
1E19
1E20
1E21
Rsheet
= 9 ohms / sq
P C
on
cen
tra
tio
n (
ato
ms/
cm3)
Depth (m)
V=6 ; 10X Scan; P=28 W
V=6 ; 1X Scan; P=39 W
Rsheet
= 45ohms/sq
Laser Doping
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Charles L. Brown Department of Electrical and Computer Engineering
200 400 600 800 1000 1200
0
20
40
60
80
100Q
ua
ntu
m E
ffic
ien
cy
(%
)
Wavelength (nm)
300 nm junction with passivation
300 nm junction without passivation
Laser Textured Surfaces for Photodetector
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Charles L. Brown Department of Electrical and Computer Engineering
Laser imaging of weld pool surface
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Charles L. Brown Department of Electrical and Computer Engineering
http://www.cohr.com/Downloads/Paper5713Afinal.pdf#search=
Displays
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Charles L. Brown Department of Electrical and Computer Engineering
1 m
Laser texturing
Laser notch
formation
Laser sintering
Laser surface cleaning
Laser
microma
chining
Examples of Laser Processing
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Charles L. Brown Department of Electrical and Computer Engineering
Inconel 690 laser cladding on Inconel 600 for nuclear applications
Laser Aided Manufacturing for Nuclear Energy
SEM cross-section
Improve corrosion resistance of coolant
pipes by laser cladding
lower cost / higher processing speed
good adhesion & high density
minimal residual stress in base material
good chemical/mechanical/thermal
stability
avoid premature failure & enhance life
reduce repair costs
maintain generator safety, efficiency,
and up-time
transfer technology of laser metal
cladding
http://people.virginia.edu/~tcb9y/Gupta/AREVA/SMU4.wmv
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Charles L. Brown Department of Electrical and Computer Engineering
x
y
Nd:YAG LaserMirror
Lens
Argon gas environment
Nd:YAG Laser
High power CW laser
Stage
Advantages:
-Non-contact process, eliminating
contamination from walls
-Achieving extremely high temperature
(>4000C), and the control of rapid
heating and cooling rates
-Sintering to high density, with minimal
post processing requirements
Objectives:
-Provide basic understanding of laser
sintering mechanism for ultra high
temperature ceramics (UHTCs)
-Fabrication of cladding layer and 3-D
structures using UHTCs for Air Force
applications.
Laser processing of ultra high temperature ceramics
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Charles L. Brown Department of Electrical and Computer Engineering
0
0.001
0.002
0.003
0.004
0.005
0.006
0.007
0.008
0.009
0.01
15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120
2 Theta (degree)
Inte
ns
ity (
a.u
.)
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Laser sintering of nanoparticles
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Charles L. Brown Department of Electrical and Computer Engineering
Laser generated nanofibers and rods
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Charles L. Brown Department of Electrical and Computer Engineering
LASER-DRIVEN COMPRESSIVE WAVE
GENERATION
Turbine Blade & Vessel in Power Plants
Medical applications
Laser shot peening
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Charles L. Brown Department of Electrical and Computer Engineering
Section VII. Process monitoring
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Charles L. Brown Department of Electrical and Computer Engineering
Welding
Cutting
Sintering
Surface cleaning
Micromachining
Texturing
Peening
Types of Laser Processes
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Charles L. Brown Department of Electrical and Computer Engineering
Types of Physical Phenomenon for
Sensing
Optical
Emission
Absorption
Reflection
Fluorescence
Direct imaging
Plasma related
Sheath voltage, thickness etc
Density
Temperature
Acoustic
Acoustic emission from melt pools
Structural modification
Defect generation
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Charles L. Brown Department of Electrical and Computer Engineering
Example : Laser Welding
Optical signals
Acoustic signals
Plasma signals
Process signal during laser
welding
Shao et al., Journal of Physics: Conference Series 15 (2005) 10110
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Charles L. Brown Department of Electrical and Computer Engineering
Imaging in harsh environments
Better spectral and spatial resolution
Compact, reliable, low cost
High speed
Fiber optic based systems
Future prospects for laser process monitoring
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Charles L. Brown Department of Electrical and Computer Engineering
Section VII. Laser market and future prospects
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Charles L. Brown Department of Electrical and Computer Engineering
5%3%
11%
12%
13%
24%
32%
Marking
Cutting
Engraving
Microprocessing
Welding
Drilling
Other
Worldwide, by Units Sold
Source: Industrial Laser Solutions
2005 Laser Applications
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Charles L. Brown Department of Electrical and Computer Engineering
http://www.optoiq.com/index/photonics-technologies-applications/lfw-display/lfw-article-display/283868/articles/laser-focus-world/volume-43/issue-2/features/laser-marketplace-2007-diode-laser-market-takes-a-breather.html
Commercial Laser Market
-
Charles L. Brown Department of Electrical and Computer Engineering
Lasers provide a competitive edge in
manufacturing
Significant growth is expected in Laser Based
Manufacturing
Progress in high power diode, fiber and disk
lasers will generate lower cost, compact , better
efficiency and hands free operation laser
systems.
Desktop manufacturing may be possible
Our Center has long experience in laser based
process development and sensor monitoring with
excellent infrastructure and resources for
education and training
Future Prospects
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Charles L. Brown Department of Electrical and Computer Engineering
THANK YOU