Large Area Electronics: Challenges and Opportunities Going ... · Large Area Electronics:...

1 D.Lupo, CIMLAE Launch 20140203

Large Area Electronics: Challenges and Opportunities Going from Lab to Fab – and Device to Product

Prof. Donald Lupo

Department of Electronics and Communications Engineering Tampere University of Technology

Tampere, Finland [email protected]

mailto:[email protected]

Outline • Large area electronics: what are we talking (and not talking)

about? • Where is it going (OE-A Roadmap)? • Key challenges: “Red brick walls” • No one buys a transistor– system integration • Some ways to go

• Print when it makes sense: simple circuits, heterogenous integration, energy harvesting and distributed electronics – and well-being

• Moving towards fully printed- the Thin Film story • Large area – an opportunity for the UK to create value?


What are we talking about today?

• A lot of the multibillion dollar electronics business is „large area“ • Si fabs have moved to larger wafers while also going

to smaller features (ca 11 nm in 2015) • Displays including TFT backplanes now made on 2-3

m size substrates • We‘re talking here about something else

• Larger structures and patterning processes for these (printing, coating, embossing…..)

• Flexible and large area devices (displays, OPV, OLED lighting…)

• Flexible, lightweight, low cost, multifunctional systems • Also called TOLAE


What we’ve been saying: A Future Multi-Billion $ Market

Organic electronics enables new applications and opens new markets

2012: 8 Bn US$, predominantly by OLED displays

Potential for a 50 Bn US $ market within the next 10 years driven by lighting, displays, OPV, logic, memory/RFID, sensors

So- when will we realise this potential? And where?

For this we need roadmapping


Core activities of OE-A Aims

See where the field is going Identify key opportunities and, especially, challenges

Updated every 1-2 years, current 5th edition published 2013 Based on expertise of OE-A member organisations and

discussions in the community – over 50 core team members in the last round

Application areas: OPV, flexible displays, OLED lighting, electronics and components, integrated smart systems

Technology teams: materials, substrates, patterning processes Approach:

Vision for short, medium and long term products Application and technology parameters needed Compare with “linear development” Identify predicted trends, and needs for breakthroughs (“red

brick walls”, term borrowed from Semi roadmap)

Roadmapping: The OE-A Roadmap, Fifth Edition


OE-A Roadmap, Key Messages Organic and printed electronics progresses in an “organic growth” Commercial products are now appearing in most of the application

clusters, more products are in the pilot or test marketing phases Continued “organic growth” in a number of areas is more likely than a

new “killer app” Heterogeneous integration

(organic and Si) and hybrid processing will be important for new products in the short to medium term.


Published in the OE-A brochure. More detailed white paper available for download from www.oe-a.org

http://www.oe-a.org/



OE-A Roadmap, Key Trends

Mobilities of organic semiconductors, conductivity of printed conductors and efficiency of OPV materials continue to increase rapidly

Patterning processes are being scaled to smaller dimensions Hybrid processing and heterogeneous integration of printed and silicon based

components show promise of leading to new products Flexible, lightweight, mobile

electronic products are starting to enter the market, enabled by organic and printed electronics

Applications in intelligent packaging and smart textiles are starting to appear


Automotive Applications

• Today – Printed antennas – Airbag sensors (seats) – Electrochromic rear mirrors – Electroluminesence: ambient

lighting, instrument cluster – Printed window defrosters – Electrochromic glass roofs – Touch displays – Switches with OLEDs – Printed seat heaters

• Tomorrow – Touch surfaces / MMI – OPV for energy harvesting – OLED rear lighting – OLED interior lights – Flexible OLED displays – OLED rear mirrors

Picture: PolyIC, IEE, Heliatek


Smart Textile Applications • Today

– Safety clothing – Fashion: Keypads and solar cells

integrated, sensors in sports jackets

• Tomorrow – Smart Clothing with

• Batteries • Loudspeakers • OPV • Lighting • Sensors

– Smart carpets with pressure sensors – Textiles for health monitoring:

temperature, respiration, blood pressure

– Seat heaters for cars and furnitures

Source: Cetemmsa, Fraunhofer IZM, Hong Kong Polytechnic University


Printing / Packaging / Advertising • Today

– Printed Interactive Cards – Interactive Journals (Display, PV,

batteries LEDs) e.g. Esquire, TV Movie

– Interactive Pricetags and Smart shelves

– Interactive posters: electroluminescent, motion sensors

– Tickets – Smart packages with printed

lighting elements

• Tomorrow – Smart Labels: e.g. Time-

Temperature Indicators – Intelligent packaging – Interactive newspapers – Interactive billboards – Printed RFID tags

Source: Thin Film, Bauer Media, ISORG, Karl Knauer


Healthcare Applications

• Today – Diagnostic electrodes

• Printed blood glucose test strips • Printed flexible electrodes for

ECG, EEG, EOG • Printed cholesterol test strips

– Therapeutic electrodes – Laboratory analytical electrodes – Smart pharmaceutical blister

package for field trials

• Tomorrow – Smart Packages to support

patient compliance – Flexible Displays integrated in

package for patient information – Anti-counterfeit – RFID for logistics – Smart clothing with embedded

motion and physiological sensors – Flexible textile sensors in mattresses

to prevent sores – Smart patches: light therapy, drug

delivery, temperature – OLED blankets for phototherapy

Source: Holst Centre, Philips, Dura Stick


Energy

• Today – Flexible batteries

• Smart Packaging • Mobile and other electronic devices

– Flexible OPV for consumer goods e.g. bags or backpacks

– OPV powered keyboard

• Tomorrow – Building Integrated Photovoltaic

(BIP) – OPV canopy – Automotive applications

Source: Konarka, Heliatek


Lighting

• Today – Designer luminaires – Electroluminescence, night

lighting, ambient lighting

• Tomorrow – Smart windows with OLEDs – Flexible OLED wallpaper – Integration in textiles

• Bags • Safety clothing • Fashion and sportswear

Source: OSRAM


Displays

• Today – Electrophoretic displays – OLED displays

for smart Phones, tablets – eReaders – OLED TV (55“) – Smart price tags

(Electrochromic, e-ink)

• Tomorrow – Flexible color eReader – Flexible OLED displays – Rollable OLED TV

Source: Ella Retail, LG, Samsung


Short List of Key Application Parameters

Different sets of key parameters for different applications

Short list of most important parameters: Complexity of the device Operating frequency of the circuit Lifetime/stability/homogeneity/reliability Operating voltage Efficiency Cost

Source: Osram, Holst Centre, Thin Film Electronics


Technology: Short List of Key Technology Parameters

Mobility / electrical performance (threshold voltage, on/off current)

Resolution / registration Barrier properties /

environmental stability Flexibility / bending radius Fit of process parameters

(speed, temperature, solvents, ambient conditions, vacuum, inert gas atmosphere)

Yield

Source: CPI 16 D.Lupo, CIMLAE Launch 20140203

Key Challenges / Red Brick Walls

Major breakthroughs are absolutely necessary: Materials

Charge carrier mobilities of printable commercially available n- and p-type semiconductors above 5 – 10 cm²/Vs

Improved processability and reproducibility even more critical Improved environmental stability is needed to enable

operation in robust environment Processes

Higher resolution, registration and process stability of the patterning processes needed

Uniformity over large areas need to be improved High-throughput inline electrical characterization is necessary

Encapsulation Flexible, transparent barriers at low cost with improved barrier properties

Standards and Regulations Defining new standards which reflects the needs of organic and printed

electronics applications



about? • Where is it going (OE-A Roadmap)?

• Key trends • Key challenges: “red brick walls”

• No one buys a transistor–system integration • Some ways to go

• Print when it makes sense, Si for the rest: heterogenous integration, energy harvesting and distributed electronics – and well-being



From the device to the system • Scientific literature still very focused on champion

materials (mobilities) and devices (efficiency, on/off ratio etc.)

• But the market for single transistors has gone down significantly in the last 30 years…..

• People don’t buy devices, they buy products that do something they want/need

• For this you need to integrate different devices to a system, which is non-trivial • Different devices with different operating voltages,

impedances etc. • Circuit design can’t just be taken over blindly from Si


Organic circuit issues: rectification • Fully printed half-wave rectifiers work

pretty well even with “bad” semiconductors • But we throw half the RF cycle away • The “obvious solution”: full wave • The reality: a full-wave rectifier based on

gravure printed PTAA diodes actually delivers less than half-wave due to series resistance

• May still be useful for low frequencies and need for low ripple voltage

• For RF harvesting: antenna resonance changed by diode capacitance: the “best” diodes don’t give the most energy (M. Li et al, submitted)

• If you need more voltage: charge pump circuit may make more sense

• The circuit has to fit the application AND account for properties of organic devices

5 mm

P. Heljo at al., Proceedings MRS, 2012, IEEE Trans. Electron Dev. 60, 870 2013)

P. Heljo at al., Organic Electronics 15, 306 (2014)


System issues: energy • One goal of TOLAE is “electronics

everywhere”: sensors, smart cards, packaging…….

• But what about power? Batteries • Can be a cost issue (if not buttons) • Are subject to laws concerning disposal

and may have safety issues • But best energy density

• Harvesting ambient energy • RF: depends on readers/logistics or needs

to be able to harvest “mobile phone smog” • Light: optimisation of PV for indoor/low

light • Piezo: motion harvesting, need improved

printable/flexible materials • Storage: supercaps can be “almost

edible” and have lower energy density but higher cycle life

0.5

1.0

1.5

2.0

0 2 4 6 8 10 12

0.0

0.5

1.0

1.5

2 cm2, high input 2 cm2, low input 4 cm2, high input 4 cm2, low input

V capa

citor (V

)

Time (h)

V ASIC (V

)

printed antenna

printed diode

Lehtimäki et al., Int. J. Elect. Power and Energy Systems, in press (2014)


System issues: uniformity • A semiconductor with a mobility of 5 is great

• So is an on/off ratio of a million • A solar cell of 12% • An OLED with 80 lm/W

• But this isn’t enough: reliability, reproducibility and uniformity are needed for real products

• Example display backplane: > 1 million TFTs • For e-paper: already need good uniformity • For current driven displays (OLEDs) extremely high

uniformity needed • Sometimes better to sacrifice some mobility for uniformity

• Example sensors • If we want to control and read a sensor with printed circuits,

this means analog electronics • Still a challenge for printed/organic – and a good field for

research



about? • Where is it going (OE-A Roadmap)?

• Key trends • Key challenges: “red brick walls”

• No one buys a transistor–system integration • Some ways to go

• Print when it makes sense: simple circuits, heterogenous integration, energy harvesting and distributed electronics – and wellbeing



Heterogenous System Integration • Printing can do many things

– Sensors – Lighting elements – PV and photodetectors – Display elements – Energy harvesters – Energy storage (batteries and supercaps) – Interconnects

• But when it comes to calculations it can’t compete with Si yet

• One approach- stay away from number crunching, very simple applications

• Another – print the stuff that should be printed, use Si where it’s best: heterogenous integration


Motivation for Heterogenous Integration

Energy


Opportunities for Integration


Application field – electronic skin • Using conventional components

and designing for stretchability – complex multifunctional sensors

J. Rogers group, Univ. of illinois

• Fully organic components

T. Someya group, Univ. Tokyo


From mixed to fully printed – Thin Film Electronics • A lot can be done by combining printing and conventional

microelectronics and this will be important for some time • But the goal eventually is to print everything (form factor, flexibility,

cost…..) • Recent demonstration that this is feasible from Thin Film Electronics

and partners: a fully functional temperature sensor tag with memory, logic, battery and display


Inherently large area • What inherently needs large area? Among others,

displays, OLED lighting and OPV • The UK seems to be going in the right direction here

• CDT as founder of PLED displays • Recent CPI announcement of display backplanes • Start-ups and spin-offs for OPV

• Keep up the good work – and remember: it’s how the whole system works. Only nerds will care if it’s organic.


Summary – a few takeaways

• The TOLAE market is there and growing, even if the “big splash” stories aren’t there

• OE-A’s roadmap has identified opportunities and major challenges – these need to be addressed

• It’s not about a device or a mobility – think systems and circuits! • Remember that organic devices can be different • Don’t be afraid of heterogenous integration • But don’t lose the vision of printing either; it will come • The UK is doing the right thing with current activities – and with this

Centre


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