Koldlok Technical Briefing. Triton Corporate Overview Triton Technology Systems, Inc. Business...

KoldlokKoldlokTechnical BriefingTechnical Briefing

Triton Corporate OverviewTriton Corporate Overview

• Triton Technology Systems, Inc. Business Purpose

• Research, Develop, Manufacture and Deliver Products and Services to:

“Eliminate Downtime and Improve Operations in Data Centre

Facilities”

Triton LocationsTriton Locations

• Corporate Offices - Santa Fe, NM• Regional Offices

• Tulsa, OK• Manufacturing - Plainfield, NJ

KOLDLOK Customer ListKOLDLOK Customer List

• Southwestern Bell

• HSBC Bank

• West Group

• Texas Instruments

• BAE Systems

• Sun Microsystems

• Anheuser Busch

• Experion

• Fortis Information

• Microsoft

• Valero Energy

• Vodafone

• Sprint

• UPS

• Dresdner Bank

• JP Morgan Chase

• VISA

• Charles Schwab

• Cable & Wireless

• SIAC

• Bank of America

• Fujitsu Services BV

• Phillip Morris Tabacco

• Standard Chartered Bank

Group of CompaniesGroup of Companies

• Triton Technology Systems• The solutions company

• Computer Site Engineering• The consulting engineering company

• The Uptime Institute• Research & education

Solution ProviderSolution Provider

• Successfully developed a suite of groundbreaking products and services• Designed to increase the reliability and availability of

data centres while• Significantly reducing energy costs

The quick financial payback

frees up capital for investment

in new IT equipment

Challenges - Increasing Heat DensitiesChallenges - Increasing Heat Densities

IT• Business Continuity

• Information outages• Business loss• Raised-floor yield

• Costs• Inefficient cooling• Cancelled agreements

• Warranty• Maintenance

Facility• Reliability

• Random outages• Ghosts

• Operations• Hot spots• Low airflow• Low static pressure• HVAC incapacity• Operations costs

Data Centre Equipment TrendsData Centre Equipment Trends

• Hotter equipment, packed in smaller footprints requiring more cooling capacity

• Additional cooling capacity typically comes from adding more cooling units

• Reclaim Lost Capacity before Adding More• Seal unmanaged openings wasting cold air

• Increase airflow, static pressure and capacity• Decrease cooling costs

Products & Services Briefing AgendaProducts & Services Briefing Agenda

The Problem

The ProblemThe Problem

• 100% of power is converted to heat• Product heat densities are increasing• Data centre cooling best practices are often counter

intuitive!• Mystery• Misapplication

Product Heat Density Trend ChartProduct Heat Density Trend Chart

AmdahlCiscoCompaqCrayDellEMCHPIBMIntelLucentMotorolaNokiaNortelSunUnisys

Thermal Management Consortium members

Example of Current Example of Current High End Heat LoadsHigh End Heat Loads

IBM eServer Blade Centre 13.3 kW 3,000 W/ft²*

Sun Sunfire 14.0 kW 2,800 W/ft²*

RLX ServerBlade 3000i 13.3 kW 2,660 W/ft²*

Dell PowerEdge 1655MC 11.9 kW 2,360 W/ft²*

HP ProLiant Ble 9.0 kW 1,800 W/ft²*

Home Electric Oven 8.0 kW 2,660 W/ft²*

* Based on product footprint

Trend chart mid-point 2003 projection = 1,200 W/ft²*

Cable CutoutsCable CutoutsWaste Cooling CapacityWaste Cooling Capacity

• Seal cut-outs• Each cut-out wastes ~ 2kW

cooling• Remove perf tiles from hot

aisles

Cooling Unit AirflowCooling Unit Airflow

Cooling Unit Airflow PlumesCooling Unit Airflow Plumes

• There is little mixing of cold air across the boundary layer of adjacent cooling unit discharge plumes

• Some mixing of returning hot air occurs

Precision Cooling DistributionPrecision Cooling DistributionSelect the Right Perforated TileSelect the Right Perforated Tile

Bypass Airflow White PaperBypass Airflow White Paper

• Extensive field research of data centres• The typical, high end data centre had:

• 2.7 X required cooling capacity installed• 10% of cabinets still had hot spot problems

• Risks the Business Continuity mission– Reduced reliability, ghosts and hardware failure

• 60% of conditioned airflow bypassed the computer equipment air intakes

Bypass AirflowBypass AirflowField Data - 23 Sites - 200,000 Ft²Field Data - 23 Sites - 200,000 Ft²

Airflow Bypass ImpactsAirflow Bypass Impacts

• 50% to 80% bypass air observed in many sites has three impacts - all unwanted• Hot Spots• Cooling unit incapacity

• Incapacity: Any condition that prevents cooling unit from delivering rated capacity - dirty filters, fouled surfaces, leaks, latent cooling, etc.

• Latent cooling penalty

Latent Cooling Penalty - Latent Cooling Penalty - From Bypass AirflowFrom Bypass Airflow

• Reduction in return air temperature results in Latent Cooling which removes moisture from the air

• Moisture removed must be subsequently replaced to maintain relative humidity above the level required for computer hardware reliability

• The energy consumed to replace lost moisture (rehumidification) is the latent cooling penalty

Related Environmental & ReliabilityRelated Environmental & ReliabilityBypass Airflow IssuesBypass Airflow Issues

• Temperature Related Outages• Too Cold - condensation shorts & bridges• Cooling Unit “Set-point Spiral”

• Reducing set-point to force cooling lowers return air temperature which increases both cooling unit incapacity and latent cooling

• Humidity Related Outages• Too High - condensation & latent cooling• Too Low - electrostatic discharge

• 22°C 72°F / 45% RH Re-circulated becomes• 29°C 85°F / 29% RH ESD Danger!


The Solution

KoldlokKoldlok

Locate Perforated Tiles forLocate Perforated Tiles forPrecision Delivery of Cooled AirflowPrecision Delivery of Cooled Airflow

Perforated tiles supply airflow to cabinet air intake

Seal Unmanaged Openings toSeal Unmanaged Openings toIncrease Airflow and Static PressureIncrease Airflow and Static Pressure

Floating Hot Spot Trouble Shooter card indicates sufficient airflow to cool 3,200+ watts

Hot Aisle / Cold Aisle ImplementationHot Aisle / Cold Aisle Implementation

Minimises heated exhaust air from one cabinet flowing into air intake of adjacent cabinet

Aisles Parallel to Cooling UnitAisles Parallel to Cooling UnitAirflow PlumeAirflow Plume

• Minimises exhaust re-circulation

• Maximises CFM per perf tile

• Minimises high velocity discharge


Koldlok Product Overview

Koldlok - An Effective Way to SealKoldlok - An Effective Way to SealUnmanaged OpeningsUnmanaged Openings

• Genesis• 10 years of research and application identified that

many data centres are at risk of heat-related equipment failures

• Development• Koldlok is the result of extensive field investigation that

determined how under floor air losses can be permanently minimised

Koldlok Product OverviewKoldlok Product Overview

• Koldlok Raised-Floor Grommet Family• Integral Koldlok (new cut-outs)• Surface Koldlok (existing cut-outs)• Extended Koldlok (large holes up to ½ tile)


Integral Koldlok (new cut-outs)Integral Koldlok (new cut-outs)

Integral Koldlok DescriptionIntegral Koldlok Description

• Integral & Split Integral• Introduced January 2002• Tile cut-out dimensions (Tile Interior Centre)

93/16”x 63/4” (233 x 172 mm)• Overall size ~ 11”x 8¼”x 1¾” (279 x 210 x 44 mm)• Usable opening ~ 8”x 4” (203 x 102 mm)• Multiple layers of different lengths cantilevered,

opposing filaments• Static dissipative

Integral KoldlokIntegral KoldlokProduct FeaturesProduct Features

• For new cut-outs• Seals unmanaged openings• Self-seals around cables• Increases airflow & static pressure• Bleeds of cable static charge• Minimises cooling unit incapacity• Dresses raw metal tile cuts for NFPA• Gas fire suppression system savings

Integral Koldlok ApplicationIntegral Koldlok Application

• New raised-floor Installation• Before equipment is installed

• Existing raised-floor application• During equipment relocation• During equipment swaps

• Includes Fasteners• Self-tapping screws• Foam stringer seal


Surface Koldlok Family (existing cut-outs)Surface Koldlok Family (existing cut-outs)

Surface Koldlok Grommet DescriptionSurface Koldlok Grommet Description

• Surface Model• For existing openings• Two part assembly w/joiner connection bars• Removable installation• Overall size

• 11”x 8¼”x 1¾” (279 x 210 x 44 mm)• Seals openings up to:

• 10”x 7” (254 x 178 mm)

Surface KoldlokSurface KoldlokFeatures & ApplicationsFeatures & Applications

• All Integral features plus:• Attaches to surface of raised floor• Split opening - surrounds cabling and seals

opening• Reusable - semi-permanent installation• Note: Does not dress raw metal tile cuts (NFPA)

• Application• Installed in data centres while equipment is

operating without affecting operations• Includes self-adhesive installation kit

Skirted Surface KoldlokSkirted Surface KoldlokDescription & ApplicationDescription & Application

Surface Model Overall Size Fits Openings

Surface 11”x 8¼”x 1¼”279 x 210 x 32 mm

10”x 7”254 x 178 mm

Surface L 11”x 8½”x 1¾”279 x 216 x 44 mm

10”x 10”254 x 254 mm

Surface XL 12”x 15”x 1¾”305 x 381 x 44 mm

10”x 13”254 x 330 mm

• Skirted Surface Models• For larger cut-out sizes• Powder coated metal skirts• Surface Koldlok Family Sizes


Extended Koldlok FamilyExtended Koldlok Family• 6” (152 mm) Filaments; 24” (610mm) Long6” (152 mm) Filaments; 24” (610mm) Long• 3” ( 76mm) Filaments; 24” (610mm) Long3” ( 76mm) Filaments; 24” (610mm) Long

Extended Koldlok DescriptionExtended Koldlok Description

• Extended Models• For large holes• Dual filament rows• 3” (76mm) mounting flange• 24” (610mm) length• Removable end caps• Overall size

• 6” Filament Model: 24”x 9”x 1½” (610 x 229 x 38 mm)• 3” Filament Model: 24”x 6”x 1½” (610 x 152 x 38 mm)

Extended KoldlokExtended KoldlokFeatures & ApplicationsFeatures & Applications

• All Integral features plus• Attaches to surface of raised floor• Can be cut to fit shorter openings

• Applications• Seals openings up to 6”x 4” (152 x 102 mm)• Dual units placed in opposing position to seal openings

up to 12”x 24” (305 x 610 mm - ½ Tile) • Installed in data centres while equipment is operating

without affecting operations• Includes adhesive installation kit

Internal Test Report ConclusionsInternal Test Report ConclusionsKoldlok GrommetKoldlok Grommet

Report #02-060 Published May 1, 2002Report #02-060 Published May 1, 2002

• Koldlok Sealing Effectiveness - Internal Test• 100% Seal with no cable penetrations and static

pressures up to 0.10” (3 mm) water column• 92% worst case seal with multiple cable penetrations

and static pressure up to 0.10” (3 mm) water column• Assumes cables are not under tension and pulled

against the sides of the Koldlok frame

Internal Test Report -Internal Test Report -Performance Test DataPerformance Test Data

• 8”x 5” (203 x 127 mm) Cut-out opening wastes• 148 CFM ? 703 Watts cooling (@ 0.01” (0.3mm) static pressure)

• Sealing 8”x 5” (203 x 127 mm) cable cut-outs regains capacity• 2 cut-outs regain ? 1.4 kW or ~1 typical rack• 20 cut-outs regain ? 14 kW or ~1 blade rack

• Sealing 400 each 8”x 5” (203 x 127 mm) cable cut-outs regain• Cool 200 - 1.4 kW typical racks or• Cool 20 - 14 kW Blade Server racks or• Eliminate 5 - 20 ton / 10,000 CFM CU

Integral Koldlok AlternativesIntegral Koldlok Alternatives

• Fire Pillows• Foam Sheets• End User Specials• Other Grommets• Other?

Seal Cable CutoutsSeal Cable Cutouts

This is one way to prevent air loss. Additional refinement is needed.


Plugging cable openings is good practice; a better choice of materials would be more appropriate


This home-made solution works only until the first cable needs to be added or removed


Ensuring that holes stay closed is an ongoing maintenance requirement with this makeshift approach.

Typically, no one is responsible for patching holes


Deformed foam from attempted cut-out seal


Attempted seal

Marketplace ApplicationsMarketplace Applications

• Integral & Split Integral Koldlok• New Data Centre Construction or Expansion• New IT & Telecom Equipment• Equipment Rotation / Swaps

• Surface & Skirted Surface Koldlok• Existing Data Centre with Equipment in Place• Hot Spots or Airflow Imbalance• Maximise Rentable / Usable Space

• Extended Koldlok (Single or Dual Units)• Larger Holes: ¼ to ½ Tile

Koldlok System BenefitsKoldlok System Benefits

• Quick Financial Return• Reduces capital & operations outlays

• Improves IT Hardware Reliability• Stabilises temperature and relative humidity• Hardens data centre

• Increases Raised-Floor Yield• Cool more equipment, more effectively• Supports business continuity mission

Koldlok Financial PaybackKoldlok Financial Payback

• Business case analysis - new Data Centre• 10,000ft² w/400 racks and 400 cable cut-outs• Hot / Cold Aisle w/200 perf tiles - 25% open• Bypass air - through raised floor

• Before: 30%• After: 10%

• Electricity cost: £0.06 kWH including demand• Financial payback: 5 Months• Capacity increase: Cool 8 blade systems

Koldlok Technical Briefing. Triton Corporate Overview Triton Technology Systems, Inc. Business...

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