KFT00_CH1-System Description Spec 12

KFT00 Service Manual

Content

CHAPTER 1 SYSTEM DESCRIPTION SPECIFICATION ....................................1

1. SCOPE.............................................................................................................................. 1-1 1.1 One 2.5"W, 9.5mmH Hard Disk, Up to 320GB ................................................................ 1-1 1.2 Optical Disc Drive ............................................................................................................ 1-1 1.3 CPU ................................................................................................................................. 1-1 1.4 Chip Set ........................................................................................................................... 1-1 1.5 Memory ............................................................................................................................ 1-1 1.6 BIOS ................................................................................................................................ 1-2 1.7 FDD devices .................................................................................................................... 1-2 1.8 Options............................................................................................................................. 1-2 1.9 Pointing Device................................................................................................................ 1-2 1.10 I/O Ports......................................................................................................................... 1-2 1.11 Mini Card Organization .................................................................................................. 1-3 1.12 NEWCARD .................................................................................................................... 1-3 1.13 Excellent Power Management Function ........................................................................ 1-3 1.14 Switch ............................................................................................................................ 1-3 1.15 Memory Card & SO-DIMM Socket ................................................................................ 1-3

2. Electrical Specification................................................................................................... 1-4 2.1 Input Voltage/Current....................................................................................................... 1-4 2.2 Mother Board ................................................................................................................... 1-4 2.3 Audio Port ........................................................................................................................ 1-5

3. Display Device ................................................................................................................... 1-5 3.1 LCD.................................................................................................................................. 1-5 3.2 Camera ............................................................................................................................ 1-5

4. Communications ................................................................................................................ 1-5 4.1 Wireless LAN ................................................................................................................... 1-5 4.2 Modem............................................................................................................................. 1-6 4.3 Bluetooth.......................................................................................................................... 1-6

CHAPTER 2 SOFTWARE SPECIFICATION........................................................2

1. System Components Summary ........................................................................................ 2-1

2. System Controls ................................................................................................................. 2-2 2.1 Hot Keys .......................................................................................................................... 2-2 2.2 Buttons............................................................................................................................. 2-3 2.3 System status indicators.................................................................................................. 2-3

3. Core BIOS Features........................................................................................................... 2-4 3.1 Multi Boot ......................................................................................................................... 2-4 3.2 Boot Block........................................................................................................................ 2-4

4. Thermal management ....................................................................................................... 2-4

5. Power Management for ACPI mode................................................................................. 2-4 5.1 Introduction ...................................................................................................................... 2-4 5.2 System Time-outs ............................................................................................................ 2-4 5.3 System Power Management............................................................................................ 2-4 5.4 Device Power Management............................................................................................. 2-5 5.5 Hibernation....................................................................................................................... 2-5

Content

6. ACPI (Advanced Configuration and Power Interface) ................................................... 2-6 6.1 Introduction ...................................................................................................................... 2-6 6.2 ACPI Sleep Status ........................................................................................................... 2-6 6.3 Fast Resume.................................................................................................................... 2-6 6.4 Power State Transition Diagram ...................................................................................... 2-6 6.5 Storage Devices and Batteries ........................................................................................ 2-7 6.6 Bootable Device............................................................................................................... 2-7 6.7 Embedded controller........................................................................................................ 2-7

7. PC2001................................................................................................................................ 2-7

8. Miscellaneous Features .................................................................................................... 2-7 8.1 Single BIOS ROM............................................................................................................ 2-7 8.2 USB Support .................................................................................................................... 2-7 8.3 Flash utility – one BIOS ROM only .................................................................................. 2-8 8.4 Crisis Recovery................................................................................................................ 2-8 8.5 VGA Support .................................................................................................................... 2-8

9. Customer Specific Features ............................................................................................. 2-8 9.1 Display of System Type and BIOS Version Number on Boot .......................................... 2-8 9.2 CMOS RAM management ............................................................................................... 2-8 9.3 System Management BIOS(SM BIOS) version 2.4 (DMI 2.0)......................................... 2-9 9.4 EEPROM ......................................................................................................................... 2-9

10. System Setup................................................................................................................. 2-10 10.1 Invoking setup.............................................................................................................. 2-10 10.2 Setup screens.............................................................................................................. 2-10

11. OS Compatibility ............................................................................................................ 2-13

CHAPTER 3 HARDWARE ...................................................................................3

1. Major Sub-assembly Specification .................................................................................. 3-1 1.1 Top View : ........................................................................................................................ 3-1 1.2 Bottom view: .................................................................................................................... 3-2

CHAPTER 4 DC-DC CONVERTER......................................................................4

1. POWER ............................................................................................................................... 4-1 1.1 4cells Li-Ion 18650 size smart battery Pack with 35.52Wh capacity............................... 4-1 1.2 6cells Li-Ion 18650 size smart battery Pack with 53.28Wh capacity............................... 4-1

2. DC-DC CONVERTER ......................................................................................................... 4-1 2.1 KFT00 Adapter Description.............................................................................................. 4-1 2.2 Feature............................................................................................................................. 4-1 2.3 Adapter Electrical Specification ....................................................................................... 4-2

3. DC-DC CONVERTER ......................................................................................................... 4-3 3.1 Description....................................................................................................................... 4-3 3.2 Features........................................................................................................................... 4-3 3.3 Electrical specification ..................................................................................................... 4-3 3.4 Temperature Range: ........................................................................................................ 4-3 3.5 Charger ............................................................................................................................ 4-8 3.6 OVER Current protection:................................................................................................ 4-9

Content

3.7 OVER Voltage protection:................................................................................................ 4-9 3.8 Under voltage protection.................................................................................................. 4-9 3.9 I/O .................................................................................................................................... 4-9 3.10 BATTERY..................................................................................................................... 4-10

4. INVERTER SPECIFICATION............................................................................................ 4-12 4.1 Features......................................................................................................................... 4-12 4.2 Absolute maximum rating .............................................................................................. 4-12

5. Electrical specification.................................................................................................... 4-14 5.1 Electrical specification ................................................................................................... 4-14 5.2 Thermal.......................................................................................................................... 4-14

6. Connector description .................................................................................................... 4-14 6.1 Input Connector: ............................................................................................................ 4-14 6.2 Output Connector: ......................................................................................................... 4-15

7. Safety Protection ............................................................................................................. 4-15 7.1 Open lamp protection: ................................................................................................... 4-15 7.2 Human body safety test: ................................................................................................ 4-15 7.3 Abnormal test: ................................................................................................................ 4-15

CHAPTER 5 DISASSEMBLY GUIDE...................................................................5

1. Disassembling the Base Unit......................................................................................... 5-1 1.1 Removing the Battery Pack ............................................................................................. 5-2 1.2 Disassembling the ODD (CD-ROM/DVD-ROM/CD-RW…)............................................. 5-3 1.3 Removing the Bluetooth Module ..................................................................................... 5-4 1.4 Removing the HDD Module............................................................................................ 5-5 1.4 Removing the HDD Module ............................................................................................. 5-6 1.5 Removing the DDR RAM................................................................................................. 5-8 1.6 Removing the Wireless LAN Card................................................................................... 5-9 1.7 Removing the System Fan ............................................................................................ 5-11 1.8 Removing the Thermal Module.................................................................................... 5-112 1.9 Removing the CPU ........................................................................................................ 5-13 1.10 Removing the Keyboard .............................................................................................. 5-14 1.11 Removing the LCD Module.......................................................................................... 5-17 1.12 Disassembling the Display and the Inverter Board ..................................................... 5-19 1.13 Removing the Camera Module.................................................................................... 5-23 1.14 Removing the Logic Upper .......................................................................................... 5-24 1.15 Removing the Motherboard ......................................................................................... 5-26 1.16 Removing the Modem Card......................................................................................... 5-28 1.17 Removing the Speaker ................................................................................................ 5-29

CHAPTER 6 TESTING AND TROUBLESHOOTING ...........................................6

1. Testing and Troubleshooting ........................................................................................... 6-1 1.1 PERFORM VISUAL INSPECTION.................................................................................. 6-1 1.2 Troubleshooting Flowchart............................................................................................... 6-1 1.3 Power Supply Troubleshooting........................................................................................ 6-4 1.4 Display Troubleshooting .................................................................................................. 6-8 1.5 Keyboard Troubleshooting............................................................................................. 6-11 1.6 External USB Devices Troubleshooting......................................................................... 6-12 1.7 3in1 card function Failure Troubleshooting.................................................................... 6-14

Content

1.8 Touch Pad Troubleshooting ........................................................................................... 6-16 1.9 Speaker Troubleshooting ............................................................................................... 6-17 1.10 CD-ROM/DVD Troubleshooting................................................................................... 6-19 1.11 Modem Troubleshooting .............................................................................................. 6-21 1.12 Express card Troubleshooting ..................................................................................... 6-23 1.13 Wireless LAN Troubleshooting .................................................................................... 6-25 1.14 Fingerprint function Troubleshooting ........................................................................... 6-26 1.15 Camera function Troubleshooting................................................................................ 6-27 1.16 Blue tooth function Troubleshooting ............................................................................ 6-29

Chapter 1 System Description

Specification

1

Chapter 1 System Description Specification

1. SCOPE • This document describes the functional specifications for the Compal Notebook personal

computer KFT00 series. The system is hardware and software compatible with the IBM PC/ATX

personal computer.

1.1 One 2.5"W, 9.5mmH Hard Disk, Up to 320GB

• Support SATA

• 5400RPM or 7200RPM

• Easily removable

• Capacity from 120GB to 320GB and bigger in future

1.2 Optical Disc Drive

• 12.7mmh, Combo(DVD/CD-RW) Drive

• 12.7mmh, DVD Super Multi Drive

1.3 CPU

• Intel Celeron 65nm Standard Voltage, 2.0/2.13/2.26GHz 533MHz FSB, 1MB L2 catch

1.4 Chip Set

• SiS M672FX+SiS 968

• ENE KB926 for Keyboard Controller, Battery management Unit

• Realtek RTS5159 for 3 in 1 controller.

• Integrated VGA solution for Mirage 3+ , 256MB share from system memory.307ELV for

LVDS .

• Realtek ALC268 for High Definition Audio Codec with.

• PHY, Realtek RTL8201CL for 10/100 MB LAN.

1.5 Memory

• No on board memoryl..

• Support DDR-II 667/800 MHz module.

• Two SODIMM with 1GB/2GB modules.

• Easy upgrade from bottom side for two SODIMM.

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• Max. 4GB

1.6 BIOS

• Flash ROM 1MB

• Support multi-boot

• Suspend to RAM (S3)/Disk (S4)

• Various hot-keys for system control

• Support SMBIOS 2.4 ,PCI2.2.

• ACPI 2.0 compliance with Intel Speed Step Support C1, C2, C3, and S3, S4 for mobile CPU

• DMI utility for BIOS serial number configurable/asset tag

• Support PXE

• Support Y2K solution

• Support Magic packet Wake on LAN from S3

• Wake on LAN form S4/S5 in AC mode

• System information

1.7 FDD devices

• External USB FDD

1.8 Options

• 1024MB/2048MB SO-DIMM modules

• MINI Card Wireless LAN module

• MDC Modem module

• Bluetooth module

1.9 Pointing Device

• Touch pad

• 2 buttons (up and down)

1.10 I/O Ports

• PCI-Express Card, 34/54mm. x 1zs

• USB V2.0, x 3

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• RGB; VGA port x 1, 15pins

• Microphone-in x 1

• Headphone-out jack x 1

• DC-in jack x 1

• Mini Card x1

• Media Card Reader(SD/MMC/MS/MS pro) x 1

• RJ-11 jack x 1 for 56Kbps V.90/92 Modem x 1

• RJ-45 jack x1

• Kensington lock x 1

1.11 Mini Card Organization

• One Mini card slot for WLAN

1.12 NEWCARD

• One Single-Wide New Card socket

• Supports both PCI-Express Card and USB2.0 Card

1.13 Excellent Power Management Function

• Suspend to RAM or Suspend to Disk mode, by time out or by hot key

• HDD Local Stand-By mode by time out

• LCD Local Stand-By mode by time out

• Low battery alarm by beep

• Auto-backlight off when LCD cover closed

• Full ACPI 1.0B supported

• LCD Auto-DIM mode by time out

1.14 Switch

• Power Button x1

• Magnetic lid switch control

1.15 Memory Card & SO-DIMM Socket

• 3-in-1 Card Reader (MS, SD, MMC, XD)

1-3


• Realtek RTS5159 Card Reader controller

2. Electrical Specification

2.1 Input Voltage/Current

• 8V to19V at the summing point of AC-DC and battery

• INPUT Current 7.8A max from 6-cell battery


• 3.42 A max from 65W AC-DC Adapter.

2.2 Mother Board

2.2.1 Microprocessor

• Intel Merom-Celeron M

• Santa Rosa Generation

• Montevina Generation

2.2.2 System Logic

• SiS M672FX + SiS 968

• ENE KB926 for Keyboard Controller, Battery management Unit

• Realtek RTS5159 for Card Reader controller

• Realtek ALC268 for High Definition Audio Codec with Dolby.

• PHY, Realtek RTL8201CL for 10/100 MB LAN.

2.2.3 Video Subsystem

• SiS M672FX, 256MB share from system memory

• SiS 307ELV for LVDS

2.2.4 Keyboard Controller

• ENE KB926 K/B Controller

2.2.5 Audio subsystem

• Realtek ALC268

• HD Audio

• Microphone-in and headphone-out

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• Two stereo speakers

2.2.6 RTS5159 3IN1 Card Reader

• Integrated 3-in-1 Flash Media

• Supports MMC Ver.4.2 ,SD Memory

• Supports SD Memory Card CPRM Security Mode

• Supports Memory Stick and MS PRO Media Cards

2.3 Audio Port

2.3.1 MIC IN

• AC-coupled input,100mVP-P maximum

2.3.2 Headphone out

• 44.1/48/96/192kHz

• Build-in Speaker

• 4Ω 2W Main Speaker

3. Display Device

3.1 LCD

• COLOR TFT/WXGA LCD (TMD LTD121EXVV-V01 Glare)

Dimensions : 275.8 (W) X 178 (H) X 5.5 (D) mm(max)

1280 X 800 WXGA Resolution

Brightness 200 Nit (Typ)

3.2 Camera

• 1.3M pixels CMOS module, fix-type, D-max GAA-061406-C1A.

• 2.0M pixels CMOS module, fix-type, Chicony CNF7220.

4. Communications

4.1 Wireless LAN

• Wireless LAN mini card

• PCI Express base specification compliant

• 802.11 b/g/n : Arcadyan chip

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4.2 Modem

• Internal Modem with MDC solution (MDC1.5)

4.3 Bluetooth

• Bluetooth module : module maker: Foxconn chipset: Broadcom Bluetooth V2.1+EDR

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Chapter 2 Software

Specification

2

Chapter2 Software Specification

1. System Components Summary

Processor

- Intel Celeron 65nm Standard Voltage (Santa Rosa Generation): Celeron 570, 2.26GHz, 533MHz FSB, 1MB L2 cache Celeron 560, 2.13GHz, 533MHz FSB, 1MB L2 cache Celeron 550, 2.00GHz, 533MHz FSB, 1MB L2 cache

- Intel Celeron 65nm Standard Voltage (Montevina Generation) FSB - 667 MHz FSB support

Core Logic - SiS 968(B0)- KFT00: M672FX(A1)/M672(A1)

System Memory

- No on board memory - Support DDR-II 533/667MHz - Two SODIMM with 1GB/2GB modules - Easy upgrade from bottom side for two SODIMM. - Max. 4GB

Display - 12.1" (16:10) WXGA(1280x800) (glare/anti-glare and anti-reflection)

HDD

- 9.5mm, 2.5" S-ATA HDD - support with 120/160/250/320GB ( 5400rpm ) capacity - support with 120/160GB ( 7200rpm ) capacity - Easily removable no more than two screws

Optical Drives

- Fixed 12.7mm height SATA ODD: - Combo (CD-RW/DVD-ROM/DVD Dual) (8x)

DVD-RAM/-R/-RW readable - DVD Super-Multi (DVD-RAM/-R/-RW/+R/+RW Super Multi )

DVD-RAM/-R/-RW writable Support Double-Layer Recording is required

Video Chip KFT00

- Mirage 3+ , 256MB share from system memory

Audio

- Realtek ALC268 - HD Audio - Microphone-in and headphone-out - Two stereo speakers

On-board Comms

- Askey/AgereAM5/CastleNet V.92/56K bps; V.90/56K bps

- PCI BUS LAN Chip: 10/100Mbps - Wireless LAN, Arcadyan 802.11 b/g, 802.11 n - Antenna: WiMAX x 2 - Bluetooth USB type, ver 2.1, Foxconn(Broadcom)

Keyboard

- 82/85 keys support with 101/102 key emulation without stick-point. - Windows key, Application key - Standard pitch, 2.0mm travel length. - Multi-Langue support. - The plate of K/B for Intel is different with the plate for A30 customers - The printing of K/B is same for both Intel and A30

Pointing Device - Touch pad with two buttons ( up & down)

Web Cam KFT00 - 1.3M pixel CMOS via USB 2.0 interface. - 2.0M pixel CMOS via USB 2.0 interface.

2-1


I/O Ports

- PCI-Express Card, 34/54mm. x 1zs - USB V2.0, x 3 - RGB; VGA port x 1, 15pins - Microphone-in x 1 - Headphone-out jack x 1 - DC-in jack x 1 - Mini Card x1 - Media Card Reader(SD/MMC/MS/MS pro) x 1 - RJ-11 jack x 1 for 56Kbps V.90/92 Modem x 1 - RJ-45 jack x 1 - Kensington lock x 1

User keys

- Power Button. x 1 - Magnetic Lid Switch. x 1

a. Volume Down b. Volume Up c. Mute Button d. Wireless on/off e. Smart Charging

Security - KFT00: Fingerprint UPEK TCS4EA - Design ready for Windows Vista - Kensington lock

Controls - Power button x 1 - Magnetic lid switch control

AC adapter - Universal AC Adapter, 19V DC, 3 pins 240V 65W

Battery

- Life Cycle: 70% Design Capacity after 300 Cycles in 25 degrees C.

6-cell Li-On, 18650 type, 4800mAH 4-cell Li-On, 18650 type, 2400mAH

Software

- Phoenix First BIOS - 1024KB Flash BIOS ROM - Suspend to RAM/Disk - No support APM - USB memory Boot support - Support SMBIOS 2.4, PCI2.2. - ACPI 2.0 compliance with Intel Speed-step Support C1, C2, C3, C4 and S3, S4 for mobile CPU

Operating System - Windows XP 32-bit. - Windows Vista 32-bit.

Keyboard Controller

- ENE KB926 K/B Controller (Version C0)

2. System Controls

2.1 Hot Keys

Fn+F1 Enters S3 sleep state

Fn+F2 Wirelss Enable/Disable

Fn+F3 LCD/CRT/LCD+CRT Switch

Fn+F4 Brightness down

Fn+F5 Brightness up

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Fn+F6 Mute

Fn+F7 Volume Down

Fn+F8 Volume Up

Fn+F9 Media Play/Pause

Fn+F10 Media Stop

Fn+F11 Media Play Backward

Fn+F12 Media Play Forward

1. After rebooting, pad lock is set to off and Num lock is also too. In this state, the embedded cursor/number pad is not enabled on the notebook keyboard.

2. When the embedded keypad is on, holding down Fn will turn the embedded keypad off.

Note1: Hot keys for brightness/Volume up /down adjustment are in repeat mode, others will only be updated once for each key depression.

Note2: Hot keys not support display switch in DOS mode

2.2 Buttons

2.2.1 Power Button The activity of the power button is as follows:

• If system is Off/Hibernate: System will be turned on while Power switch is depressed by more than 100 ms

• If system is in Standby state: System will resume while Power switch is depressed by more than 100 ms.

• If system on with legacy mode: depress this button will turn off power.

If system is running in ACPI OS, the power button acts as the sleep button, and let OS controls the policy of power button which is defined in Power Option under the OS.

2.2.2 Power Button Over-ride Holding down the Power Button for 4 seconds will cause an unconditional transfer to the off state without notifying the operating system.

2.2.3 Lid switch If the system is running under legacy mode:

• Closing the lid will turn off LCD backlight.

If the system is running under ACPI mode:

• The operating system will determine what action to take when the lid is opened and closed.

The function of lid switch will follow the OS setting in power management (Nothing, Standby or Hibernate). If nothing, the backlight must turn off when the lid is closed.

2.3 System status indicators

Please refer to Keyboard BIOS specification.

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3. Core BIOS Features

3.1 Multi Boot

The notebook can support Multi-Boot for selecting the boot sequence of Hard Drive, Removable Devices, CD-ROM/DVD Drive and Network in Setup.

3.2 Boot Block

The Flash ROM used in many systems today offer the customer the advantage of electronically reprogramming the BIOS without physically replacing the BIOS ROM. This advantage, however, does create a possible hazard: power failures or fluctuations that occur during updating the Flash ROM can damage the BIOS code, making the system unbootable. To prevent this possible hazard, many Flash ROM include a special non-volatile region that can never be erased. This region, called the boot block, contains a fail-safe recovery routine. If the boot block finds corrupted BIOS, it prompts the end user to insert a diskette, from which it loads several files that replace the corrupted BIOS on the Flash ROM with an uncorrupted one.

4. Thermal management Please refer to Keyboard BIOS specification.

5. Power Management for ACPI mode

5.1 Introduction

The notebook supports ACPI. The system will dynamically switch to ACPI mode for configuration and power management when an ACPI OS is loaded.

When ACPI is not loaded and enabled, the power management function will be disabled.

5.2 System Time-outs

If the system is running in ACPI mode, system Time-outs is handled by the operating system. BIOS time-outs are disabled. System time-outs are set using the control panel power applet.

5.3 System Power Management

The overall system can be in one of the system power states as described below:

ACPI mode Power Management

Mech. Off (G3) All devices in the system are turned off completely.

Soft Off (G2/S5) OS initiated shutdown. All devices in the system are turned off completely.

Working (G0/S0) Individual devices such as the CPU and hard disk may be power managed in this state.

S3 Sleeping State CPU set power down

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VGA Suspend New Card Suspend Audio Suspend Hard Disk Power Down ODD Power Down Super I/O Power Down

S4 Sleeping State System Saves all system states and data onto disk prior to power off the whole system.

5.4 Device Power Management

Under ACPI mode, the device specific power management supported by this notebook includes the CPU throttling, monitor power management and the hard disk.

5.4.1 CPU power management • ACPI mode

The operating system detects when the system is idle and places the CPU in one of the 3 CPU low power states (C1, C2 or C3) depending on how much latency it believes the system can afford.

The C1 state is simply the CPU halt instruction. The C2 state is the CPU stop grant state. The C3 state is the CPU stops clock state. The CPU stays in this state until an interrupt occurs.

5.4.2 Hard Disk The operating system uses the spin down timer of the hard drive to set time-outs. The BIOS time-out of the hard disk must be disabled in ACPI mode. The user can sets the hard disk spin down time-out in the control panel power applet.

5.4.3 Display Device The monitor can be turned off after a period of no activity based on the settings of the

OS.

5.4.4 System Wake Up Sources The table below lists the wake up events for all low power states:

Events S3 S4 S5 Process required

Any key O X X X

Power button O O O X

LAN (On board) *3 O O O O

RTC*3 O O X O

Critical low battery O X X X

Field ‘Process Required’ identifies that further process for the occurred events must be processed during wake up or resume procedure.

5.5 Hibernation

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To support the hibernate state, the save to disk partition or file will be created by the operating system if the user select to enable the hibernation.

It is the responsibility of the operating system to save the system state to a disk file and restore the system state when it is turned back on.

6. ACPI (Advanced Configuration and Power Interface)

6.1 Introduction

The Advanced Configuration and Power Interface (ACPI) is a well-specified power management and configuration mechanism. It evolves the existing collection of power management codes, APM, PnP BIOS, and Etc.

6.2 ACPI Sleep Status

BIOS must support the following sleep states – S3, S4 and S5.

6.3 Fast Resume

BIOS must hands off the control to the operating system within the following time limits:

Required S3->S0 2sec

6.4 Power State Transition Diagram

The state transition diagram in ACPI mode is as follows:

From (State) Leave By Condition Enter (State)

S3 Power Button S0

On board LAN

Alarm

Critical low battery(Only in DC mode)

Power Button

On board LAN S4

RTC

S0

S5 Power Button S0

S0 Press Lid switch (depends on ACPI OS setting) S3

Standby icon in shutdown menu in Windows.

ACPI OS timer expired

Critical low battery (depends on ACPI OS setting)

Critical low battery (depends on ACPI OS setting)

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Press Power Button (depends on ACPI OS setting)


Press Power Button (depends on ACPI OS setting)

6.5 Storage Devices and Batteries

Possible storage devices are FDD, HDD, CD-ROM and DVD-ROM

6.5.1 Floppy Disk and Hard Disk, CD-ROM and DVD-ROM The BIOS must report the correct types of these devices if the drive is installed in the system during POST. Two devices, which belong to the same category, are not supported in this notebook.

6.5.2 Batteries The BIOS must follow ACPI specification and report the correct number of the installed battery and status.

6.6 Bootable Device

The system is capable of booting from onboard HDD, CD ROM, DVD-ROM, external USB Floppy and USB ATA Flash device.

6.7 Embedded controller

The keyboard controller will act as the ACPI embedded controller and support the ACPI EC protocol and interface.

7. PC2001 The notebook must meet Microsoft Logo requirements in accordance and the Microsoft Logo test programs.

8. Miscellaneous Features

8.1 Single BIOS ROM

The system BIOS and Keyboard BIOS share one single flash ROM. The size of the flash ROM is 1MB.

8.2 USB Support

This feature allows the use of a USB keyboard to access BIOS Setup and to be used in DOS without additional drivers. USB floppy boot and Crisis Recovery from USB floppy

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is also supported. The driver provides other USB devices support after loading the operating system.

8.3 Flash utility – one BIOS ROM only

The flash utility can be used to program both system and keyboard BIOS at the same time.

8.4 Crisis Recovery

This feature provides an opportunity for system that cannot boot up. With a crisis floppy diskette, the system can perform crisis recovery by using internal PS2 keyboard.

To perform crisis recovery using keyboard, do the following:

Power off the system.

Plug-in the USB floppy drive with crisis floppy diskette inserted.

Hold down Fn + B keys.

Plug-in AC adapter and make sure it is powered.

Power on the system from off state (i.e. cold boot) while holding down <Fn+B> key.

After POST, release <Fn+B> key. The system should boot from floppy and perform crisis recovery action.

8.5 VGA Support

This section describes the expected behavior when a video monitor is connected to the VGA port on the notebook .The feature needs VGA driver support

The BIOS will use both the RGB and pin 11 methods to determine the presence of an external VGA monitor.

Video modes supported on the secondary display path (need VGA driver support)

Supported video modes and timings please refer to the technical reference of VGA vendor. In particular, text mode and standard VGA modes are not supported.

9. Customer Specific Features

9.1 Display of System Type and BIOS Version Number on Boot

BIOS Version V1.00*

Note: * The numbers of BIOS version will be changed.

9.2 CMOS RAM management

The BIOS will automatically update certain information in CMOS on each boot. This information includes:

• DRAM size and configuration

• Hard disk configuration

• Always report the existence of one FDD.

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If the CMOS RAM fails checksum or a power lost on CMOS battery is detected during boot, an appropriate error message will be displayed:

Establishing default CMOS configuration

Run SETUP to change configuration

The system BIOS must automatically load default values defined in the setup menu during POST when encounter these problems. The user must not be required to take any action to continue the rest of POST (or entering SETUP).

9.3 System Management BIOS(SM BIOS) version 2.4 (DMI 2.0)

Limited DMI 2.0 BIOS information are provided:

BIOS version number is type 0 data item.

Type 1:

• System serial number – 64 alphanumeric characters

• System manufacturer name –16 alphanumeric characters

• System product name – 32 alphanumeric characters

• System version – 32 alphanumeric characters

Type 2:

• Motherboard Product name – ‘KFT00’

Type 3:

• Asset tag number – 64 alphanumeric characters

9.4 EEPROM

There is one EEPROM that is used to store many important system and user data in the notebook (some data are reserved for future to use)). The size of the EEPROM is 2K bytes.

The EEPROM map is listing as below:

Name Offset Comments

System Serial Number 00h – 1Fh

20h - 3Fh

32 bytes of Serial number.

32 bytes of Bundle number.

Manufacturer name 40h – 4Fh 16 bytes for DMI type 1

System version 50h - 6Fh 32 bytes of System version

UUID 70h – 7Fh 16 bytes for UUID.

System product name 80h – 9Fh 32 bytes of System product name.

DMI type 11 A0h – DDh 62 bytes for DMI type 11

Unused DEh – DFh Unused

GUID E0h – E7h 8 bytes for GUID

Born On Date E8h For multi logo support

Reserved EBh - EFh Reserved

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Keyboard type F0h Define for US/UK/JP keyboard

Keyboard BIOS used F1h 1 byte for Keyboard BIOS used

Branding F2h 1 byte for Branding.

Calendar F3h – F8h 6 byte for Calendar, Hours, Minutes

Unused F9h – FDh Unused

EEPROM initialized flag FEh Set to AAh when the EEPROM get initialized.

Assettag number 200h – 23Fh 64 bytes for DMI Type 3

Reserved 240h - 7FFh Reserved

10. System Setup

10.1 Invoking setup

The setup function can only be invoked by pressing F2 when “Press <F2> to enter Setup” message is prompted on the bottom of screen during POST or by selecting <Enter Setup> in Boot Menu after pressing F12.

During setup, all Fn function keys and power saving functions are disabled.

10.2 Setup screens

10.2.1 Main Menu PhoenixBIOS Setup Utility

Main Boot Exit

Item specific Help

System Time: [19:34:35]

System Date: [01/01/2007]

Product Name: XXXXXXXX

Serial Number: XXXXXXXX

System Memory: 640 KB

Extended Memory: XXXXXX KB

BIOS Version: X.XX

UUID Number: XXXXXXXXXXXXX

XXXXXXXXXXXXX

2-10


F1 Help ↑↓ select Item F5/F6 Change Values F9 Setup Defaults

Esc Exit ←→ select menu Enter Select 4 Sub-Menu F10 Save and Exit

• System Time and System Date

The hour is displayed with 24-hour format. The values set in these two fields take effect immediately.

• System Memory

This field reports the memory size of system base memory. The size is fixed to 640KB.

• Extended Memory

This field reports the memory size of the extended memory with an integer in the system,

but 32Bit SMI will occupy 1 MB and UMA frame buffer (Integrated VGA uses only).

Extended Memory size = Total memory size - 1 MB – 1 MB – UMA frame buffer

• BIOS Version

This field displays current version of the BIOS.

• UUID

This field displays the platform UUID number.

10.2.2 Boot PhoenixBIOS Setup Utility

Main Boot Exit

Item specific Help

Boot priority order: HDD IDE CD FDD HDD LAN SiS191 UNDI, PXE-2.1 Excluded from boot order: HDD USB

2-11


LAN

F1 Help ↑↓ select Item F5/F6 Change Values F9 Setup Defaults


10.2.3 Exit menu PhoenixBIOS Setup Utility

Main Boot Exit

Item specific Help

Exit Saving Changes Exit Discarding Changes Load Setup Defaults F1 Help ↑↓ select Item F5/F6 Change Values F9 Setup Defaults


• Exit Saving Changes

Allows the user to save changes to CMOS and reboot system. The following message is prompted when user press “Enter” on the item.

Setup Confirmation

Save configuration changes and exit now?

[Yes] [No]

Yes: Exit SETUP and reboot

No: Back to previous screen

2-12


• Exit Discarding Changes

Setup Warning

Configuration has not been saved!

Save before exiting?

[Yes] [No]

• Load Setup Defaults

Allows the user loads default value in CMOS Setup. The following message is prompted when user press “Enter” on this item:

Setup Confirmation

Load default confirmation now?

[Yes] [No]

It still stay in Setup when press a key.

11. OS Compatibility Windows XP 32-bit

Windows Vista 32-bit

2-13

Chapter 3

Hardware

3

Chapter3 Hardware

1. Major Sub-assembly Specification System interconnection (For KFT00)

1.1 Top View :

NO Description 1 KFT00_MB 8 K/B CONN

10 EXP-CARD CONN 15 LVDS 20 Bluetooth CONN 22 MIC CONN 23 T/P CONN 24 F/P CONN 25 SPEAKER (2 PIN) 27 CAMERA CONN 28 RJ11 CONN 29 CAPACITION BOARD CONN

3-1


1.2 Bottom view:

NO Description NO Description 2 USB CONN (2 SLOT) 17 VGA PORT 3 USB CONN (1 SLOT) 18 MDC CONN 4 RJ45 REV 19 MINI-CARD SOCKET 5 RJ11 REV TYPE 21 SD CARD SOCKET 6 DC-IN (65W) 26 BATTERY CONN 7 ODD CONN 30 MINI_CARD_H15_STANDOFF 9 FAN CONN 31 MDC_H3_STANDOFF 11 SATA HDD CONN 12 CPU SOCKET 13 DDRII CONN (H=5.2) 14 DDRII

CONN(H=9.2)

16 AUDIO JACK

3-2

Chapter 4 DC-DC Converter

4

Chapter4 DC-DC Converter

1. POWER

1.1 4cells Li-Ion 18650 size smart battery Pack with 35.52Wh capacity

1.2 6cells Li-Ion 18650 size smart battery Pack with 53.28Wh capacity

2. DC-DC CONVERTER KFT00 Series Power System block diagram

2.1 KFT00 Adapter Description

This specification defines the performance and characteristic of 65W AC adapter power supply. It supplies a constant voltage 19V output source for KFT00 series notebook computer.

2.2 Feature

• Accepts universal input from 100V AC to 264V AC

4-1


• Offers constant Voltage 19V output source with 90W max output power capacity. • High efficiency 85% min at 115VAC fall load • Compact Size

2.3 Adapter Electrical Specification

2.3.1 Input Voltage range: universal input, 100VAC TO 264VAC

2.3.2 Inrush current: 150A Peak and no damage @220VAC

2.3.3 Input frequency range: 47~63Hz

2.3.4 Input Current: 2.0Amax at 100 VAC

2.3.5 Start-up time: ≤ 3sec Max. @115VAC

2.3.6 HOLD-UP time: 10ms min. @115VAC, full load condition

2.3.7 OVP: 29V max. automatic shut down

2.3.8 Short circuit protection: Output can be shorted without damage, and auto recovery.

2.3.9 OUTPUT Voltage Regulation: 18.5-20V including the effects of line Voltage variation, load

current, ripple and noise

2.3.10 OUTPUT Current: Current: 0Amin, 3.42Amax continuous

2.3.11 OUTPUT Voltage ripple: 300mv PK-PK for full load.

2.3.12 OUTPUT Voltage Dynamic regulation: Output voltage within 18.5-19.9V, load current

10%←→100%, frequency 100Hz, 50% duty cycle, recover time≤1msec.

2.3.13 DC OUTPUT PIN OUT:

PIN1 Center Pin Adapter +output

PIN2 Barrel (Ring) Adapter returns.

2.3.14 Temperature Range:

Operating temperature: 0 TO 40

Storage temperature: -20 TO 65

4-2


3. DC-DC CONVERTER

3.1 Description

The DC-DC converter is designed to supply the power for KFT00 series notebook computer of Compal. It supply +5VALWP, +3VALWP, +1.8VALWP, +1.5VSP, +1.2VALWP, +1.05VSP, +0.9VSP, for logical system, + CPU_CORE for CPU and supplies for the built-in KB926 microprocessor which handles the keyboard and PMU control functions of the system. The power ON/OFF is controlled by KB926. There is also a built-in charger power source. It can charge battery pack whether the computer is ON or OFF.

3.2 Features

3.2.1 High efficiency, up to 85% (using battery)

3.2.2 Accept wide range DC input voltage from 8V to 19V

3.2.3 Built-in charger power source

3.2.4 The power ON/OFF is controlled by software

3.3 Electrical specification

3.3.1 Input Voltage/Current

• 8V to19V at the summing point of AC-DC and battery



• 3.42 A max from 65W AC-DC Adapter.

3.4 Temperature Range:

3.4.1 Operating temperature : 0* C to 40* C

3.4.2 storage temperature range : -20* C to 65* C CDC/DC OUTPUT

3.4.3 Fixed output voltage/Current

Item +5VALWP +CPU_CORE

nominal voltage +5V depend on VID

min. current 0A 0A

max. current 5.677A 25.2A

peak current 8.11A 36A

total regulation 5V±5% depend on VCC static and

Transient Tolerance--

ripple voltage 100mVp-p max 20mVp-p max@36A

4-3


Item +0.9VSP +3VALWP +1.05VSP

nominal voltage +0.9V +3.3V +1.05V

min. current 0A 0A 0A

max. current 1.4A 3.395A 3.22A

peak current 2A 4.85A 4.6A

total regulation 0.9V±5% 3.3V±5% 1.05V±5%

ripple voltage 40mVp-p max 100mVp-p max 100mVp-p max.

Item +1.8VALWP +1.5VSP +1.2VALWP

nominal voltage +1.8V +1.5V +1.2V

min. current 0A 0A 0A

max. current 6.81A 0.966A 2.254A

peak current 8.51A 1.38A 3.22A

total regulation 1.8V±5% 1.5V±5% 1.2V±5%

ripple voltage 100mVp-p max 100mVp-p max 100mVp-p max

3.4.4 VOLTAGE IDENTIFICATION CODES

VID6 VID5 VID4 VID3 VID2 VID1 VID0 VDAC

0 0 0 0 0 0 0 1.5000

0 0 0 0 0 0 1 1.4875

0 0 0 0 0 1 0 1.4750

0 0 0 0 0 1 1 1.4625

0 0 0 0 1 0 0 1.4500

0 0 0 0 1 0 1 1.4375

0 0 0 0 1 1 0 1.4250

0 0 0 0 1 1 1 1.4125

0 0 0 1 0 0 0 1.4000

0 0 0 1 0 0 1 1.3875

0 0 0 1 0 1 0 1.3750

0 0 0 1 0 1 1 1.3625

0 0 0 1 1 0 0 1.3500

0 0 0 1 1 0 1 1.3375

0 0 0 1 1 1 0 1.3250

0 0 0 1 1 1 1 1.3125

0 0 1 0 0 0 0 1.3000

4-4


0 0 1 0 0 0 1 1.2875

0 0 1 0 0 1 0 1.2750

0 0 1 0 0 1 1 1.2625

0 0 1 0 1 0 0 1.2500

0 0 1 0 1 0 1 1.2375

0 0 1 0 1 1 0 1.2250

0 0 1 0 1 1 1 1.2125

0 0 1 1 0 0 0 1.2000

0 0 1 1 0 0 1 1.1875

0 0 1 1 0 1 0 1.1750

0 0 1 1 0 1 1 1.1625

0 0 1 1 1 0 0 1.1500

0 0 1 1 1 0 1 1.1375

0 0 1 1 1 1 0 1.1250

0 0 1 1 1 1 1 1.1125

0 1 0 0 0 0 0 1.1000

0 1 0 0 0 0 1 1.0875

1 0 0 0 1 0 1.164V

0 1 0 0 0 1 0 1.0750

0 1 0 0 0 1 1 1.0625

0 1 0 0 1 0 0 1.0500

0 1 0 0 1 0 1 1.0375

0 1 0 0 1 1 0 1.0250

0 1 0 0 1 1 1 1.0125

0 1 0 1 0 0 0 1.0000

0 1 0 1 0 0 1 0.9875

0 1 0 1 0 1 0 0.9750

0 1 0 1 0 1 1 0.9625

0 1 0 1 1 0 0 0.9500

0 1 0 1 1 0 1 0.9375

0 1 0 1 1 1 0 0.9250

0 1 0 1 1 1 1 0.9125

0 1 1 0 0 0 0 0.9000

0 1 1 0 0 0 1 0.8875

0 1 1 0 0 1 0 0.8750

4-5


0 1 1 0 0 1 1 0.8625

0 1 1 0 1 0 0 0.8500

0 1 1 0 1 0 1 0.8375

0 1 1 0 1 1 0 0.8250

0 1 1 0 1 1 1 0.8125

0 1 1 1 0 0 0 0.8000

0 1 1 1 0 0 1 0.7875

0 1 1 1 0 1 0 0.7750

0 1 1 1 0 1 1 0.7625

0 1 1 1 1 0 0 0.7500

0 1 1 1 1 0 1 0.7375

0 1 1 1 1 1 0 0.7250

0 1 1 1 1 1 1 0.7125

1 0 0 0 0 0 0 0.7000

1 0 0 0 0 0 1 0.6875

1 0 0 0 0 1 0 0.6750

1 0 0 0 0 1 1 0.6650

1 0 0 0 1 0 0 0.6500

1 0 0 0 1 0 1 0.6375

1 0 0 0 1 1 0 0.6250

1 0 0 0 1 1 1 0.6125

1 0 0 1 0 0 0 0.6000

1 0 0 1 0 0 1 0.5875

1 0 0 1 0 1 0.5750

1 0 0 1 0 1 1 0.5625

1 0 0 1 1 0 0 0.5500

1 0 0 1 1 0 1 0.5375

1

1 0 0 1 1 1 0 0.5250

1 0 0 1 1 1 1 0.5125

1 0 1 0 0 0 0 0.5000

1 0 1 0 0 0 1 0.4875

1 0 1 0 0 1 0 0.4750

1 0 1 0 0 1 1 0.4625

4-6


1 0 1 0 1 0 0 0.4500

1 0 1 0 1 0 1 0.4375

1 0 1 0 1 1 0 0.4250

1 0 1 0 1 1 1 0.4125

1 0 1 1 0 0 0 0.4000

1 0 1 1 0 0 1 0.3875

1 0 1 1 0 1 0 0.3750

1 0 1 1 0 1 1 0.3625

1 0 1 1 1 0 0 0.3500

1 0 1 1 1 0 1 0.3375

1 0 1 1 1 1 0 0.3250

1 0 1 1 1 1 1 0.3125

1 1 0 0 0 0 0 0.3000

1 1 0 0 0 0 1 0.2875

1 1 0 0 0 1 0 0.2750

1 1 0 0 0 1 1 0.2625

1 1 0 0 1 0 0 0.2500

1 1 0 0 1 0 1 0.2375

1

1 1 0 0 1 1 0 0.2250

1 1 0 0 1 1 1 0.2125

1 1 0 1 0 0 0 0.2000

1

1 1 0 1 0 0 1 0.1875

1 1 0 1 0 1 0 0.1750

1

1

1 0 1 0 1 1 0.1625

1

11 1 0 1 1 0 0 0.1500

1 1 0 1 1 0 1 0.1375

1 1 0 1 1 1 0 0.1250

1 1 0 1 1 1 1 0.1125

1 1 1 0 0 0 0 0.1000

1 1 1 0 0 0 1 0.8750

1 1 1 0 0 1 0 0.7500

4-7


1 1 1 0 0 1 1 0.6250

1 1 1 0 1 0 0 0.5000

1 1 1 0 1 0 1 0.3750

1 1 1 0 1 1 0 0.2500

1 1 1 0 1 1 1 0.1250

1 1 1 1 0 0 0 0

1 1 1 1 0 0 1 0

1 1 1 1 0 1 0 0

1 1 1 1 0 1 1 0

1 1 1 1 1 0 0 0

1 1 1 1 1 0 1 0

1 1 1 1 1 1 0 0

1 1 1 1 1 1 1 0

3.5 Charger

3.5.1 Controlled by KB926 microprocessor from motherboard

3.5.2 Temperature sense capability for the battery (charge active between 0°C~ 40°C)

3.5.3 Fast charge current 3Amps(max.) for Li-Ion Battery at system off, approach 36W fast

charge at system ON. (depend on system load)

3.5.4 Trickle charge: Typical 625 mA pre-charge current for Li-Ion Battery . All trickle charge are

controlled by KB926.

3.5.5 Charge termination: When Fully-Charge bit is set ,charger is terminated by KB926

3.5.6 When system is turned off, the charge time is 3.5 hrs typically from empty to full for Li-Ion6

cell battery . When system is turned off, the charge time is 3.5hrs typically from empty to full for

Li-Ion 4 cell battery .

3.5.7 Other battery services are presented by KB926 microprocessor includes maximum charging

timer, charging temperature range etc.

3.5.8 Charge power.

Constant current mode: 3.0A±8% for 6cell 1.5A±8% for 4cell Constant adapter current mode: 3.13A±6% (For 65W system)

4-8


BATT+ Constant Voltage mode: 12.6V±1% for 6cell Li-Ion Battery. 16.8.V±1% for 4cell Li-Ion Battery.

3.6 OVER Current protection:

1. +3VALWP: >10.77A. 2. +5VALWP: >9.5A. 3. CPU_CORE: >43.2A. 4. +1.8VALWP: >8.74A. 5. +1.2VALWP: >8.4A.

3.7 OVER Voltage protection:

+5VALWP: 5V *(112.5% ~ 117.5%)

+3VALWP: 3.3V *(112.5% ~ 117.%)

+CPU_CORE over 200mV of programmed VID level

+1.8VALWP 1.8V *(111% ~ 119%)

+1.2VALWP 1.2V *(111% ~ 119%)

3.8 Under voltage protection

+5VALWP: 5V *(65% ~ 75%)

+3VALWP: 3.3V *(65% ~75%)

+CPU_CORE under 300mV of programmed VID level

+1.8VALWP 1.8V *(65% ~ 75%)

+1.2VALWP 1.2V*(65% ~ 75%)

3.9 I/O

3.9.1 DC-Jack

Pin 1,2: Center pin Adapter power +input

Pin 3,4: Barrel (Ring) Adapter power return

3.9.2 Battery Connector

Pin 1: GND

Pin 2: TS(TS_A)

Pin 3: B/I

Pin 4: ID

Pin 5: SMC(EC_SMCA)

Pin 6: SMD(EC_SMDA)

Pin 7: BATT+

3.9.3 Interface between Power with M/B

DC/DC

4-9


Signals I/O Voltage Level

Description

SUSP# I 0~3.3V Low Active, system suspend control signal

51ON# I 0~floating Low Active, POWER ON control signal.

FSTCHG I 0~3.3V High Active, ENE925 use this pin to control the fast charge of charge

ACOFF I 0~3.3V High Active, turn off the Adaptor power for battery automatic learning cycle

ACIN O 0~3.3V High Active, provide to ENE925 to mean the Adaptor power is present

VGATE O 0~3.3V High Active, it will go high when +CPU_CORE is ready

VR_ON I 0~3.3V High Active, turn on/off the +CPU_COREP & VID_VCC

BATT_TEMP O 0~3.3V Analog signal, ENE925 using this voltage level to calculate battery’s

temperature

IREF I 0~3.3V Analog signal, ENE925 using this voltage for setting charge current

VID [0..6] I 0~3.3V The +CPU_CORE voltage depends on those PIN’s VID[6..0]

CHGRTC O 3.3V Charge RTC-battery power source

EC_SMDA, EC_SMCA I/O 0~5V Interface of Smbus, communicate between ENE925 and smart

battery

SYSON I 0~3.3V High Active, ENE926 use this pin to control the SYSON signal

BATT_OVP O 0~3.3V Analog signal, ENE926 using this voltage level for battery over voltage protection

PSI# I 0~1.05V Analog signal, enable CPU_CORE regulator at light load mode.

DPRSLPVR I 0~1.05V Analog signal, control CPU C3,C4 signal.

H_DPRSTP# I 0~1.05V Analog signal, control CPU C3,C4 signal.

CLK_ENABLE# O 0~3.3V Analog signal, clock generator enable signal.

CHGSEL I 0~3.3V Control 2800mAH charge voltage

3.10 BATTERY

1.3.10.1 Li-Ion smart

1.3.10.2

1. Battery Specification

1-1. EE information

4 cell 6 cell Battery Design Capacity(mAH)

2400 4800

Battery Configuration 4S1P 3S2P

4-10


Battery Nominal Voltage(V) 14.8 11.1 Single Cell Chemistry Li-ion Li-ion Single Cell Type 18650 18650 Single Cell Capacity(mAH) 2400 2400 Dumb/Smart Battery Smart Battery

(SMBus ver. 1.1.) Smart Battery (SMBus ver. 1.1.)

Cycle Life 70% after 300 cycles 70% after 300 cycles Nominal Charging Voltage(V)

16.8 12.6

Nominal Charging Current(A)

1.68 3.36

Protection Function OVP UVP OTP OCP

OVP UVP OTP OCP

1-2. Battery Connector Pin Assignment

Connector Male on M/B : TBD

Connector Female on Battery : Suyin / 200274FS007G514ZU

Pin No. Symbol Comments

1 GND Battery Negative Terminal.

2 TS Connect to thermister(Note 3)

3 B/I Battery-In Pin(Note 2)

4 ID Identify pin(Note 1)

5 SMC SMBus clock interface I/O pin.

6 SMD SMBus data interface I/O pin.

7 BATT+ Batt+, Battery Positive Terminal. Note: 1. ID pin must be floating for 3S2P

ID pin Connect 1Kohm to GND for 4S1P

2. The battery can be charged/discharged only while this pin is connected to GND by the system. 3. Thermister: DTN-C103F3H-SYS115A (or 103AT2 equivalent).

The other thermister Pin is connected GND.

4-11


4. INVERTER SPECIFICATION This inverter is designed to light up the CCFL of LCD for notebook. It should be supported KFT00 12.1 LCD panels. There are two control signals that come from system to control lamp brightness. One signal is named DAC_BRIG, which limits current to meet LCD lamp current specification. Another one is named PWM, which adjusts lamp brightness. This inverter brightness is adjusted by PWM burst mode. The PWM burst mode is that turning on and off the lamp at a rate of 150Hz. The effective brightness is a function of the duty cycle.

4.1 Features

4.1.1 Wide range 9V to 21V input voltage

4.1.2 Brightness adjustment by PWM burst mode.

4.1.3 Close loop controls lamp current.

4.2 Absolute maximum rating

4.2.1 Environment: Temperature: Operating temperature: 0 ~ 55 Storage temperature : -20 ~ 70

Humidity: 0 ~ 90% without condensation

ESD:8KV contact without error action,12 KV (air) without error action, 15KV (air) without damaged.

MTBF: MIN 50000 hours.( In Compal system)

4.4.2 Electrical characteristic

No Item Symbol Min. Typ. Max. Unit Comment

1 Input voltage INV_PWR 9 14.8 20 V 7.5V(continuous)

can work *Note 1

2 Input current Iin -- 0.33 -- A

3 Lamp current IL 3.0 -- 6.8 mA DAC=0V *Note 2

4 Lamp current IL 2.7 -- 6.3 mA DAC=1V

5 Frequency F 45 55 65 KHz *Note3

6 Output power Pout -- -- 4.5 W

7 Efficiency η 80% -- -- --

8 Starting voltage Vs 1600 -- -- V At 0’C

9 Starting time Tvs 1 -- 1.5 Sec

10 Dispoff# 2.8 3.3 3.6 V Backlight on/off signal

4-12


0 0.5 0.8 V Low level

11 Limited lamp maximum current DAC-BRIG 0 3.3 V *Note 2

142 150 158 Hz PWM signal frequency

3.0 3.3 3.6 V PWM signal amplitude12 PWM signal *note 4 INV_PWM

30 -- 100 % Period

TonDuty =

13 lamp current over-

shoot -- -- 10 %

Line transient( 10.8V to 21V/100us) and turn on transient

14 Current Waveform

factor rms

p

II

1.27 2 1.56 Multiple OR rms

p

II−

*10

15 Unbalance

Rate rms

pp

I

II −− -10% 0 +10% Multiple

16 Turn off current

(Hight side) IHL -- -- 0 A PWM=30%

17 Turn off voltage

(Low side) Voff -- -- 150Vp-p V PWM=30%

18 Voltage Rise time

(Low side) Trise -- -- 300us us PWM=30%

19 Voltage fall time

(Low side) Tfall -- -- 300us us PWM=30%

Notes: *1 The inverter can work in 7.5V input voltae(continuous),but 7.5V electronic characteristic will

not be care.(Note:the display must be normal and can not glitter or become dark) *2. Limited lamp maximum current by DAC_BRIG signal:

When DAC_BRIG voltage is 0V and INV_PWM enables (100%), lamp has max. limited current. When DAC_BRIG voltage is 3.3V and INV_PWM enables (100%), lamp has min. limited current. When add 1V DAC, the 100% Lamp current will decrease 0.5mA. DAC_BRIG signal comes from system chipset with internal resistance of 3KΩ.

*3. Inverter operating frequency should be within specification (45~65kHz) at max. and min. brightness load.

*4. INV_PWM enable implies INV_PWM signal is High level (On duty cycle is 100%). It is a square wave of 150Hz to adjust backlight brightness that is a function of PWM duty cycle. Backlight brightness is maximum value under INV_PWM at 100% and brightness is minimum under INV_PWM at 30%.

*5. The system interface signals belong to 3.3V. *6.Please make sure open lamp output voltage should be within starting voltage specification. *7. Inverter should pass human body safety test. *8. Inverter should no smoking by any component open/ short test

4-13


*9. Transformer voltage stress should not be over 85% under any condition ( turn on overshoot transient and line transient).

*10. Audio noise should be less than 36dB at 10 cm distance.

5. Electrical specification

5.1 Electrical specification

No Symbol Min. Typ. Max. Unit Comment

Voper. -- 650 -- Vrms Lamp operating voltage(650+/-50)

IL 6.2 6.5 6.8 mArms DAC_BRIG: 0 V, PWM: 100%

IL 3.0 3.3 3.6 mArms DAC_BRIG: 0 V, PWM:30%

IL 5.7 6 6.3 mArms DAC_BRIG: 1 V, PWM: 100%

IL 2.7 3 3.3 mArms DAC_BRIG: 1 V, PWM:30%

f 45 55 65 KHz

1

η 80% -- -- --

5.2 Thermal

All components on inverter board should follow below rules: 5.2.1 Component using conditions (component stress) must be within component specification including voltage rating, current rating, temperature etc. 5.2.2 Component temperature should follow below:

a. ∆ T < 30 , at 25, 35 b. Component temperature should be less than 70 inside system at 35.

6. Connector description

6.1 Input Connector:

CN1: ACES 87213-0700; JST SM07B-SRSS-TB No. Symbol Description 1 INV_PWR Input voltage (9V-20V)

2 INV_PWR Input voltage (9V-20V)

3 INV_PWM Adjust brightness by burst mode(3.3 V 150Hz)

4 DISOFF # Backlight on/off control, active HIGH(3.3V)

5 DAC_BRIG Max. current limit

6 GND Power system return

4-14


7 GND Power system return

6.2 Output Connector:

CN2: JST_SM02B_BHSS-1

No. Symbol Description

1 HV Connected to high voltage of LCD lamp

2 LV Connected to low voltage of LCD lamp

7. Safety Protection

7.1 Open lamp protection:

When inverter is on open lamp status, any component on inverter should be O.K and inverter is no damaged, no fire and no arcing. If inverter can’t shunt down during open lamp happen, inverter must pass below conditions: i.) Human body test. ii.)Open lamp burning: Inverter burns for 24 hours at open lamp status. No parts damage.

7.2 Human body safety test:

Short inverter output, transformer secondary output to GND by a 2KΩ resistor which connects one end to GND and another one to those outputs. They should meet output current limitation requirement as follow. Output current I is the current that flows through 2KΩ resistor.

1. Output current I ≦ 0.7mA , if frequency f ≦ 1KHz 2. Output current I ≦ 0.7mA * f (kHz) , if frequency f ≧ 1KHz.

However, output current should be less than 70mA even frequency is more than 100KHz.

7.3 Abnormal test:

Any one component is shorted or open; inverter should be no fire, no arcing. And result must meet output current limitation requirement.

4-15

Chapter 5 Disassembly Guide

5

Chapter5 Disassembly Guide

1. Disassembling the Base Unit

These are the directions for disassembling the base unit. You will need a 5.5mm Nut Driver, a medium size Philips screwdriver.

These directions are to disassemble the complete unit and are cross-referenced to Chapter 7 for the replacement of component parts.

Before disassembly, make sure the notebook is powered off.

5-1


1.1 Removing the Battery Pack

To remove the battery pack from the battery bay, follow the steps below:

1. Turn the notebook upside down.

2. Slide the battery lock in the direction of the arrow to unlock the battery pack.

3. Slide the battery release latch in the direction of the arrow. The battery pack will pop-up

automatically. Gently pry the battery pack from its housing.

NOTE: Always start laptop disassembly by removing the battery pack first.

5-2


1.2 Disassembling the ODD (CD-ROM/DVD-ROM/CD-RW…)

Follow the steps below to disassemble the optical drive (ODD):


2. Remove the M2.5x5 screw securing the ODD.

3. Insert a flat screwdriver into the slot as shown and gently push out the ODD.

4. Remove the two M2x3 screws from the bracket plate, and then remove the bracket plate.

5-3


1.3 Removing the Bluetooth Module

Follow the steps below to remove the Bluetooth module:


2. Loose the M2.5x5 screw and remove the Bluetooth module cover.

3. Pull up the Bluetooth module cover in the direction of the arrow.

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4. Pull out the Bluetooth module as shown.

5. Disconnect the Bluetooth cable, and remove the Bluetooth module.

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1.4 Removing the HDD Module

Follow the steps below to remove the HDD module:


2. Remove the nine M2.5x8 screws and one M2.5x5 screws securing the bottom cover.

3. Pull up the bottom cover in the direction of the arrow.

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4. Remove the two M2.5x4 screws securing the HDD module in place.

5. Pull the tab to remove the HDD module in the direction of the arrow.

6. Remove the four silver M3x3 screws to take off the HDD case.

7. Remove the HDD module from the HDD case.

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1.5 Removing the DDR RAM

To remove the DDR RAM, first remove the bottom cover. Then follow the steps below:

1. Push the latches to release the RAM module. A spring will force one end of the module up.

2. Push the latches to release the RAM module. A spring will force one end of the module up.

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1.6 Removing the Wireless LAN Card

To remove the Wireless LAN card, first remove the bottom cover. Then follow the steps below:

1. Disconnect the two antennas from the wireless LAN card.

2. Remove the two M2x3 screws attaching the stand-off bracket to the motherboard.

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3. Grasp the wireless LAN card and pull it out.

CAUTION: Do not touch the connectors on the wireless LAN card or on the computer. Debris on the connectors may cause the unit to malfunction.

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1.7 Removing the System Fan

To remove the system fan, first remove the bottom cover. Then follow the steps below:

1. Remove the one M2.5x5 screw securing the system fan.

2. Disconnect the fan connector from the motherboard as shown, and lift out the system fan.

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1.8 Removing the Thermal Module

To remove the thermal module, first remove the bottom cover and system fan. Then follow the steps below:

1. Remove the four spring screws securing the thermal module to the motherboard.

2. Lift and remove the thermal module from the motherboard.

CAUTION: When you remove the thermal module, use the CPU grease tool to remove the grease on the CPU and thermal module. Reapply fresh grease before reinstalling the thermal module.

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1.9 Removing the CPU

To remove the CPU, first remove the bottom cover, system fan, and thermal module. Then follow the steps below:

1. Turn the cam on the CPU socket with a flat-blade screwdriver so that the notch on the cam is aligned with the open side of the CPU socket to unlock the CPU.

2. Gently lift out the CPU.

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1.10 Removing the Keyboard

To remove the keyboard, first remove the battery pack, HDD, memory module, ODD, keyboard, , Bluetooth module, wireless LAN card, system fan, thermal module, and CPU, Follow the steps below to remove the keyboard:

1. Remove the three M2x3 screws and one M2.5x8 screw from the battery compartment as shown.

2. Turn the notebook over and open the display. Lift up the function button board from the right

side.

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3. Pull the function button board towards you as shown.

4. Disconnect the function button board cable as shown.

CAUTION: The function button board module is attached to its cover and should not be removed. Removing it from its cover may cause irreversible damage to the module.

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5. Pull the keyboard towards you, revealing the keyboard cable underneath.

6. Use a thin tool such as a screwdriver to lever up the connector bracket and disconnect the

keyboard cable from the motherboard.

7. Lift and remove the keyboard.

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1.11 Removing the LCD Module

To remove the LCD module, first remove the keyboard, and the function button board. Then follow the steps below:

1. Disconnect the LCD power (LVDS), inverter, CMOS, and one microphone cables and pull the wireless antennas free from the notebook as shown.

2. Remove the two M2.5x5 screws and two M2.5x10 screws securing the LCD module to the

logic upper.

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3. Remove the LCD module.

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1.12 Disassembling the Display and the Inverter Board

To disassemble the display and inverter board, first remove the LCD module. Then follow these steps:

1. Remove the four screw pads as shown.

2. Remove the four M2.5x5 screws securing the LCD bezel to the LCD module.

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3. Carefully insert your fingers between the display and the LCD bezel as indicated by the arrow, and gently pry up the LCD bezel.

4. Remove the four screws mounting the display, inverter board, and LVDS cable to the LCD

cover:

Two M2.5x5 screws on the display.

One M2.5x3 screw on the inverter board.

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5. Disconnect the two connectors on either side of the inverter board. Remove the inverter board.

6. Gently lift out the display. Remove the four M2x3 screws securing the hinges to the display.

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7. Disconnect the LVDS cable from the back of the LCD panel.

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1.13 Removing the Camera Module

To remove the camera module, first remove the LCD module and lift out LCD display and inverter board. Then follow these steps:

1. Disconnect the CMOS cable from the CMOS module as shown.

2. Remove the CMOS module.

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1.14 Removing the Logic Upper

To remove the logic upper, first remove the battery pack, HDD, memory module, ODD, keyboard, power board, Bluetooth module, wireless LAN card, system fan, thermal module, CPU, and LCD module. Follow the steps below to remove the logic upper.

1. Turn the notebook upside down and remove the five M2.5x8 screws and two M2.5x5 screws from the bottom side of the notebook.

2. Turn the notebook over and remove the one M2.5x5 screw attaching the logic upper to the

motherboard.

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3. Disconnect the touch pad and fingerprint cables as shown.

4. Lift off the logic upper.

NOTE: The touchpad module is attached to the rear of the logic upper and cannot be removed.

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1.15 Removing the Motherboard

To remove the motherboard, first remove the logic upper. Then follow the steps below:

1. Remove the M2.5x5 screw securing the motherboard to the logic lower.

2. Disconnect the speaker and Bluetooth cables as shown.

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3. Lift out the motherboard.

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1.16 Removing the Modem Card

To remove the modem card, first remove the motherboard. Then follow the steps below:

1. Turn over the motherboard and remove the two M2x3 screws securing the modem card to the motherboard.

2. Remove the modem card.

3. Disconnect the MDC cable from the modem card.

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1.17 Removing the Speaker

To remove the speaker, first remove the logic upper. Then follow the steps below:

1. Remove the one M2.5x5 screw securing the speakers to the rear side of the logic upper.

2. Lift out the speaker as shown.

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Chapter 6 Testing and

Troubleshooting

6

Chapter6 Testing and Troubleshooting

1. Testing and Troubleshooting The purpose of this chapter is to provide a systematic method of isolating problems you may have with the KFT00 series Notebook Computer. We assume that you have a basic understanding of DOS based computer systems as well as knowledge of standard trouble-shooting procedures. This manual is written under the assumption that the problems are indeed related with Notebook itself. The improper usage and application software problems are excluded in this chapter. The system BIOS Beep Code is an integrated unit to detect some errors in the system board. This beep code will give immediate identification of certain system board problems. If the troubleshooting procedure is followed step by step, it can efficiently isolate the problem and the problem can be solved easily.

1.1 PERFORM VISUAL INSPECTION

Check the following: • Power cords are properly connected and secured • Power supply is adequate for operation • There are no obvious shorts or opens • There are no obviously burned or heated components • All components appear normal

1.2 Troubleshooting Flowchart

Use the flowchart in Figure 6-1 as a guide for determining which troubleshooting procedures to execute. Before going through the flowchart steps, verify the following:

• Ask the user if a password is registered and, if it is, ask him or her to enter the password.

• Verify with the customer that VISTA32 is installed on the hard disk. Operating systems that were not preinstalled by Compal can cause the computer to malfunction.

• Make sure all optional equipment is removed from the computer. • Make sure the floppy disk drive is empty.

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Figure 6-1 Troubleshooting flowchart (1/2)

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Figure 6-1 Troubleshooting flowchart (2/2)

If the diagnostics program cannot detect an error, the problem may be intermittent. The test program should be executed several times to isolate the problem. When a problem has been located, perform the appropriate troubleshooting procedures as follows:

• If an error is detected by the main battery test, perform the Power Supply

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Troubleshooting procedures in Section 6-2. • If an error is detected by the display test, perform the Display Troubleshooting

procedures in Section 6-3. • If an error is detected by the keyboard test, perform the Keyboard • Troubleshooting procedures in Section 6-4. • If an error is detected when using an external USB device, perform the External • USB Devices Troubleshooting procedures in Section 6-5. • If an error is detected when using the 3in1 card connection, perform the 3in1 • Card failure Troubleshooting procedures in Section 6-6. • If an error is detected when using the touch pad, perform the Touch Pad

Troubleshooting procedures in Section 6-7. • If an error is detected when using the speakers, perform the Speaker

Troubleshooting procedures in Section 6-8. • If an error is detected when using the CD/DVD drive, perform the CD-ROM/DVD

Drive Troubleshooting procedures in Section 6-9. • If an error is detected when using the modem, perform the Modem

Troubleshooting procedures in Section 6-10. • If an error is detected when using the Express card unit, perform the Express

card Troubleshooting procedures in Section 6-11. • If an error is detected when using the Wireless LAN unit, perform the Wireless

LAN Troubleshooting procedures in Section 6-12 • If an error is detected when using the Fingerprint function unit, perform the

Fingerprint function Troubleshooting procedures in Section 6-13

1.3 Power Supply Troubleshooting

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Figure 6-2 Power Supply Troubleshooting Process

The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed. The flowchart in Figure 6-2 gives a summary of the process. The procedures described in this section are:

• Procedure 1: Power status check • Procedure 2: Adaptor / battery replacement • Procedure 3: Power supply connection check

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• Procedure 4: Diagnostic check • Procedure 5: Internal connection check

The following LEDs indicate the power supply status:

Battery LED

The power supply controller displays the power supply status through the Battery and the POWER LEDs as listed in the tables below.

Table 2-1 Battery LED

Battery State LED colors Definition red, blinking Battery charging with AC . blue, solid on Battery fully charged by AC

Charging

color off Battery abnormal: stop charging with AC (Bad cell/ Overheated)

Color off Battery within low state: 12 minutes remaining red, solid (system send out a warning with beep)

Battery within critical low state: 3 minutesremaining. The system is protected and cannot bere-powered on without the AC power connected.

Discharging

red solid on Battery not in low or critical low state; indischarging state

Table 2-2 POWER LED

Power supply status POWER LED System Power On (LED is solid blue). blue Solid on System Suspended Blue blinking System Power Off. Off

To check the power supply status, install a battery pack and connect an AC adaptor to the DC-IN port on the computer and to a power supply. If the Battery LED are not lit, go to Procedure 2

Procedure 2 Adaptor / battery replacement

A faulty adaptor may not supply power or may not charge the battery.

Perform Check 1.

Check 1 Connect a new AC adaptor. If the problem is not resolved, go to Check 2.

Check 2 Insert a new battery. If the problem is still not resolved, go to Procedure 3.

Procedure 3 Power supply connection check

The power supply wiring diagram is shown below:

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Any of the connectors may be disconnected. Perform Check 1.

Check 1 Disconnect the AC power cord from wall outlet. Check the power cable for breaks.

If the power cord is damaged, connect a new AC power cord. If there is no damage, go to Check 2.

Check 2 Make sure the AC adaptor cord and AC power cord are firmly plugged into the DC-IN socket, AC adaptor inlet and wall outlet.

If these cables are connected correctly, go to Check 3. Check 3

Make sure that the DC-IN input port socket is firmly secured to the system board of the computer.

If the DC-IN input socket is loose, go to Procedure 5. If it is not loose, go to Check 4.

Check 4 Use a multi-meter to make sure that the AC adaptor output voltage is close to 19 V.

If the output is several percent lower than 19 V, go to Check 5. If the output is close to 19 V, go to Check 6.

Check 5

Connect a new AC adaptor or AC power cord. If the battery LED does not light, go to Check 6.

Check 6 Make sure the battery pack is installed in the computer correctly.

If the battery is properly installed and the battery LED still does not light, go to Procedure 4.

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Procedure 4 Diagnostic check

The power supply may not charge the battery pack. Perform the following procedures:

Reinstall the battery pack. Attach the AC adaptor and turn on the power. If you cannot turn on the power, go to Procedure 5.

Run the Diagnostic test following the procedures described Tests and Diagnostics. If no problem is detected, the battery is functioning normally.

Procedure 5 Replacement check

The system board may be disconnected or damaged. Disassemble the computer following the steps described Replacement Procedures. Check the connection between the AC adaptor and the system board. After checking the connection, perform Check 1:

Check 1

Use a multi-meter to make sure that the fuses on the system board are not blown.

If a fuse is not blown, go to Check 2.

If a fuse is blown, go to Check 3. Check 2

Make sure that the battery CONN is firmly connected to the system board.

If it is connected firmly, go to Check 3. Check 3

The system board may be damaged. Replace it with a new one following the instructions in Chapter 4.

1.4 Display Troubleshooting

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Figure 6-3 Display troubleshooting process This section describes how to determine if the computer’s display is functioning properly. The process is outlined in Figure 6-3. Start with Procedure 1 and continue with the other procedures as instructed.

Procedure 1: External display check Procedure 2: Diagnostic check

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Procedure 3: Connector and replacement check

Procedure 1 External display check

Connect an external display to the computer’s external monitor port, then boot the computer. The computer automatically detects the external display. Press Fn+F3 to switch to the external display.

If the external display works correctly, the internal LCD may be damaged. Go to Procedure 3.

If the external monitor appears to have the same problem as the internal monitor, the system board may be damaged. Go to Procedure 2.

Procedure 2 Diagnostic check

The Display Test program is stored on the computer’s Diagnostics disk. This program checks the display controller on the system board. Insert the Diagnostics disk in the computer’s floppy disk drive, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics for details.

If an error is detected, go to Procedure 3. If an error is not detected, the display is functioning properly.

Procedure 3 Connector and replacement check

The FL inverter board, LCD module, and system board are connected to the display circuits. Any of these components may be damaged. Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks:

Check 1

Make sure the DDRRAM module is seated properly. Test display again.

If the problem still exits, replace the DDRRAM module. If the problem still exists, perform check 2.

Check 2

Replace the FL inverter board with a new one and test display again.

If the problem still exists, perform Check 3. Check 3

Replace the LCD module with a new one and test display again.


Replace the LCD/FL cable with a new one and test display again.


Replace the CPU with another of the same specifications.


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The system board may be damaged. Replace it with a new one.

1.5 Keyboard Troubleshooting

Figure 6-4 Keyboard troubleshooting process To determine if the computer’s keyboard is functioning properly, perform the following procedures. Figure 6-5 outlines the process. Start with Procedure 1 and continue with the other procedures as instructed.

Procedure 1: External keyboard check

Procedure 2: Diagnostic check

Procedure 3: Connector and replacement check

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Procedure 1 External keyboard check

Connect a USB keyboard to one of the computer’s keyboard/mouse ports, then boot the computer. The computer automatically detects the external keyboard.

If the external keyboard works correctly, the internal keyboard or its connections may be faulty. Go to Procedure 2.

If the external keyboard appears to have the same problem as the internal keyboard, the system board may be damaged.

Procedure 2 Diagnostic test

Run the Diagnostic Program, which will automatically execute the Keyboard Test. Refer to Chapter 3, Tests and Diagnostics for more information on how to run the program.

If an error is located, go to Procedure 3. If an error does not occur, the keyboard is functioning properly.


The keyboard and/or system board may be disconnected or damaged. Replacement Procedures and perform the following checks.

Check 1

Make sure the keyboard cable is firmly connected to the system board.

If the connection is loose, reconnect firmly and repeat Procedure 2. If there is still an error, go to Check 2.

Check 2

The keyboard may be damaged.


The system board may be damaged. Replace it with a new one.

1.6 External USB Devices Troubleshooting

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Figure 6-5 External USB device troubleshooting process To determine if the computer’s external USB devices are functioning properly, perform the following procedures. Figure 6-5 outlines the process. Start with Procedure 1 and continue as instructed.

Procedure 1: External device and connection check Procedure 2: Replace system board

Procedure 1 External device and connection check

The USB device may be damaged or the connection may be faulty. Perform Check 1.

Check 1

Make sure USB device cable is firmly plugged into one of the USB sockets.

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If the cable is connected correctly, go to Check 2. Check 2

Plug the USB device into another USB socket (there are three in all).

If the USB device still does not work, go to Check 4. If the device functions correctly when connected to another USB port, go to Check 3

Check 3

Make sure that the USB socket is firmly secured to the system board of the computer.

If the malfunction remains, the system board may be damaged. Go to Procedure 2.

Check 4

Connect an alternative USB device to one of the computer’s USB ports, and then boot the computer. The computer automatically detects the external device.

If the alternative USB device works correctly, the original device may be damaged and should be replaced.

If the alternative USB device appears to have the same problem as the original device, the system board may be damaged. Go to Procedure 2.

Procedure 2 Replace system board

If the error persists, the system board may be damaged.

1.7 3in1 card function Failure Troubleshooting

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Figure 6-6 3in1 troubleshooting process

This section describes how to determine if the 3in1 card player is functioning properly. The process is summarized in Figure 6-6. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.

Procedure 1: express card test Procedure 2: 3in1 card socket replacement check

Procedure 1 3in1 card test

The 3in1 card contains a 3in1 card test program. Ensure the card in fully inserted into the socket before running the program.

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If an error occurs during the 3in1 card test, perform Procedure 2. If no error occurs, it is likely the that original PC card was faulty.

Procedure 2 3in1 card socket replacement check

The 3in1 card socket may be damaged or defective, for instance the socket pins can be bent. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and replace the socket. If the problem persists, the system board may be defective or damaged.

1.8 Touch Pad Troubleshooting

Figure 6-7 Touch Pad troubleshooting process

To determine if the computer’s built-in Touch Pad is functioning properly, perform the following procedures. Figure 6-7 outlines the process. Start with Procedure 1 and continue as instructed.

Procedure 1: Touch Pad connection check

Procedure 2: Touch Pad replacement check

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Procedure 1 Touch Pad connection check

The Touch Pad is connected by the Touch Pad FPC to the system board. Make sure the Touch Pad FPC cable is firmly connected to the Touch Pad and system board. Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks.

If any of the connections are loose, reconnect firmly. If any of the connections is damaged, or there is still an error, go to Procedure 2.

Procedure 2 Touch Pad replacement check

The Touch Pad unit or FPC may be defective or damaged.

1.9 Speaker Troubleshooting

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Figure 6-8 Speaker troubleshooting process To determine if the computer’s built-in speakers are functioning properly, perform the following procedures. Figure 6-8 outlines the process. First adjust the speaker volume to an appropriate level. Start with Procedure 1 and continue as instructed.

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Procedure 1: Audio source test Procedure 2: Earphone test Procedure 3: Connection check Procedure 4: Replacement check

Procedure 1 Audio source test

Try different audio sources (e.g. an audio CD and digital music file) to determine whether the fault is in the speaker system or not. If not all sources have sound problems, the problem is in the source devices. If all have the same problem, continue with Procedure 2.

Procedure 2 Earphone test

Connect a set if earphones or external speakers. If these function correctly, go to Procedure 3. If they do not function correctly, the system board may be defective or damaged. Replace it with a new one.

Procedure 3 Connection check

Disassemble the computer following the steps described Replacement Procedures and make sure the speaker cable is firmly connected to the system board. If the stereo speakers are still not functioning properly, go to Procedure 4.

Procedure 4 Replacement Check

If the stereo speakers don't sound properly, the stereo speakers may be defective or damaged. Replace them with new ones. If the stereo speakers still do not work properly.

1.10 CD-ROM/DVD Troubleshooting

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Figure 6-9 CD-ROM/DVD drive troubleshooting process

This section describes how to determine if the computer’s internal DVD-ROM drive or CD-RW/DVD-ROM drive is functioning properly. Figure 6-9 outlines the process. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.

Procedure 1: Audio CD test

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Procedure 2: Drive cleaning check Procedure 3: Software check Procedure 4: Diagnostic test Procedure 5: Connection and replacement check

Procedure 1 Audio CD check

First, insert an audio CD into the CD/DVD drive. If it works, the problem is not with the drive. Go to Procedure 3. If the audio CD does not work, go to Procedure 2. If the CD/DVD LED on the front panel does not light when the disc is played and the drive gives no response, go straight to Procedure 3.

Procedure 2 Drive cleaning check

Insert a CD/DVD drive-cleaning disk into the drive clean according to the drive-cleaning product instructions. If the problem persists, go to Procedure 3.

Procedure 3 Software check

Ensure that the appropriate driver has been installed on the computer for the CD/DVD drive.


The CD-ROM/DVD-ROM test program stored in the Diagnostics Disk will test the drive’s ability to play an audio CD, as well as the functions of the CD control buttons. If any errors occur while executing the diagnostic program, go to Procedure 5.

Procedure 5 Connection check and replacement check

The DVD-ROM drive or the CD-RW/DVD-ROM drive connects to the system board. The drive may be disconnected, or the drive or system board may be damaged. Replacement Procedures and perform the following checks: Check 1

Make sure the drive is firmly connected to the system board.

If the connection is good and there is still an error, go to Check 2. Check 2

The drive or drive cable may be defective or damaged. Replacement Procedures.

If the drive is still not functioning properly, perform Check 3. Check 3

The system board may be damaged.

1.11 Modem Troubleshooting

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Figure 6-10 Modem troubleshooting process This section describes how to determine if the computer's modem is functioning properly. Figure 6-10 outlines the process. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.

Procedure 1: Telephone line connection check Procedure 2: Modem card connection check Procedure 3: Modem card replacement check

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Procedure 1 Telephone line connection check

The telephone cable may be damaged or the connections may be loose. Attempt to connect the computer to a network through using the modem. If the modem does not function at all, go to Procedure 3. If the attempt fails because the computer detects no telephone signal, the fault may be in the telephone cable, the wall socket or the modem port. Perform Check 1:

Check 1 Make sure telephone cable is firmly plugged into both the telephone wall socket and the modem port of the computer.

If the cable is connected correctly, go to Check 2. Check 2 Make sure the modem port is firmly secured to the system board of the computer.

If the malfunction remains, go to Check 3. Check 3 The telephone cable may be damaged. Replace with a good cable.

If the malfunction remains, go to Procedure 2

Procedure 2 Modem card connection check

Disassemble the computer following the steps described Replacement Procedures and ensure that the modem card is well connected to the system board. If the problem persists, perform Procedure 3.

Procedure 3 Modem replacement check

The modem card or RJ-11 jack may be faulty. Try replacing them. If the problem persists, the system board may be defective or damaged. Replace the System Board with a new one following the steps Replacement Procedures.

1.12 Express card Troubleshooting

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Figure 6-11 Express card troubleshooting process This section describes how to determine if the express card player is functioning properly. The process is summarized in Figure 6-11. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required.

Procedure 1: express card test Procedure 2: express socket replacement check

Procedure 1 Express card test

The Express test card contains a express test program. Ensure the card in fully inserted into the socket before running the program.

If an error occurs during the express test, perform Procedure 2. If no error occurs, it is likely the that original PC card was faulty.

Procedure 2 express card socket replacement check

The express card socket may be damaged or defective, for instance the socket pins can be bent. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and replace the socket. If the problem persists, the system board may be defective or damaged.

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1.13 Wireless LAN Troubleshooting

Figure 6-12 Wireless LAN troubleshooting process

The wireless LAN antenna wire, wireless LAN unit or system board may each be the source of a wireless LAN fault. Any of these components may be damaged. To determine if the computer’s wireless LAN system is functioning properly, perform the following procedures. Figure 2-15 outlines the process. Start with Procedure 1 and continue with the other procedures as instructed.

Procedure 1: Diagnostic test Procedure 2: Connector and replacement check

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Run the Diagnostic Program, which will automatically execute the wireless LAN test. Refer to Chapter 3, Tests and Diagnostics for more information on the program.

If an error is located, go to Procedure 2. If an error is not located, the wireless LAN system is functioning properly.

Check 1: Make sure the wireless select switch installed in your installed programs.

Check 2: press keyboard “Fn+F2” make sure wireless is enable

If the program persist .go to Procedure


The wireless LAN antenna, wireless LAN unit or system board may be disconnected or damaged.

Disassemble the computer following the steps described in Chapter 4, Replacement Procedures,

and perform the following checks.

Check 1

Make sure that the wireless LAN antenna is firmly connected to the wireless LAN unit (refer to

Chapter 4 for instructions) and that the wireless LAN unit is securely slotted into the system

board. If the problem persists, go to Check 2.

Check 2

Check that the wireless communication switch is turned to “On”, then make sure that the wireless

communication LED on the front panel is lit.

If the LED is lit but the wireless LAN function is still faulty, the antenna may be damaged. Replace

with a new antenna following the steps in Chapter 4, Replacement Procedures. If the problem persists, or if the wireless LAN LED is not lit when the wireless communication switch is turned to “On”, go to Check 3.

Check 3

The wireless LAN unit may be damaged. Replace it with a new one following the instructions in

Chapter 4. If the problem still exists, perform Check 4.

Check 4

The system board may be damaged. Replace it with a new one following the instructions in

Chapter

1.14 Fingerprint function Troubleshooting

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Figure 6-13 Fingerprint troubleshooting process

To determine if the computer’s built-in fingerprint is functioning properly, perform the following procedures. Figure 6-13 outlines the process. Start with Procedure 1 and continue as instructed.

Procedure 1: fingerprint connection check

Procedure 2: fingerprint replacement check

Procedure 1 Fingerprint connection check

The Fingerprint is connected by the Fingerprint FPC to the system board. Make sure the Fingerprint FPC cable is firmly connected to the Fingerprint and system board. Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks.


Procedure 2 Fingerprint replacement check

The Fingerprint unit or FPC may be defective or damaged.

1.15 Camera function Troubleshooting

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Figure 6-14 camera trouble shooting process

This section describes how to determine if the computer’s camera is functioning properly. Figure 6-14 outlines the process. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.

Procedure 1: Camera connection check

Procedure 2: blue tooth replacement check

Procedure 1 Camera connection check

The Camera is connected by the Camera cable to the system board. Make sure the camera cable is firmly connected to the camera board and system board. Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks.

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Procedure 2 Camera replacement check

The camera board or cable may be defective or damaged.

1.16 Blue tooth function Troubleshooting

Figure 6-15 blue tooth trouble shooting process

This section describes how to determine if the computer’s blue tooth is functioning properly. Figure 6-15 outlines the process. Perform the steps below starting with Procedure 1 and continue with the other procedures as required.

Procedure 1: blue tooth connection check

Procedure 2: blue tooth replacement check

Procedure 1 blue tooth connection check

The blue tooth is connected by the blue tooth cable to the system board. Make sure the blue tooth cable is firmly connected to the blue tooth device and system board. Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks.


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Procedure 2 blue tooth replacement check

The blue tooth device or cable may be defective or damaged.

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KFT00_CH1-System Description Spec 12

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Transcript of KFT00_CH1-System Description Spec 12