Keko Equipment NEWSLETTER · needed, multiple printers may be used. process & machine tape type...

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Keko Equipment NEWSLETTERNO. 6

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We have been facing a general economic recession for the past two years, as well as the stagnation of Europe and America and the entry of new players in the world markets. How has Keko Equipment Com-pany coped with the new conditions?

TK: We have not felt the recession, we’ve increased the scope of our operations each year, and this year has been a record breaking year for us. We are present on all key world markets; therefore, it is easier for us to balance the issues from individual markets. However, one of the main difficulties has been facing the “weakness” of the US dollar; and that has been going on for quite some time now. Besides producing devices for the production of passive electronic components, we have expanded our operations into other emerging markets. We have also developed solutions in the green energy area; however, the subsidies in this area have dried up in the European market, which consequently led to the reduction of investments in this area. Green energy is obviously more of a political issue rather than an economic one, and without national financial support, the development has stagnated in this area. We are looking for market opportunities in new technologies and we also carefully monitor all trends.

JŠ: To be honest, this is more a recession of the west-ern world. Russia and China are facing great growth, and we have also made many steps forward in those regions. These are markets that are not considered as

“We provide complete solutions”

We interviewed Mr. Tone Konda and Mr. Jože Štupar, both directors of Keko Equipment, to ascertain their opinion regarding the current worldwide situation and how it has affected their business.

technological followers, but have become the top provid-ers of services in the fields of technology. We support producers in developing new products. We also apply our know-how in various fields of industry.

You have mentioned growth of Chinese and Russian markets. This means that your distribution network has also changed or expanded?

TK: We have been present in the Chinese market for a very long time; and now we are successfully entering the Russian market with a local partner. The reduced activity on the western markets makes these two markets of key importance for us. The distribution network is also expanding in other markets, and even though the EU and USA markets have seen a slowdown, they have shown positive growth compared to last year.

JŠ: One of the problems of the European market is that certain industrial branches very much depend on na-tional subsidies, and since that has decreased drastically, the investments also decreased. On the other hand, Rus-sia is strategically setting up and developing the industry of electronic components, where we have a lot to offer.

TK: Both markets, Russian and Chinese, are equally de-manding as all other markets. Any underestimation of those markets would get back at us, since both markets

have developed substantially in the past years, people are open and focused in foreign markets, and a dynamic and progressive atmosphere is present.

JŠ: Each market has its own cultural identity and specif-ics. They are quite demanding and specific about what they need so we try to remain flexible. Our advantage on the Russian market is that, as Slavs, we have a better understanding of each other. Unfortunately, the Russian market still faces many bureaucratic obstacles despite its progress. Chinese people are very pragmatic; how-ever, they are quite demanding negotiators, Europeans and Americans are traditionally known as demanding buyers as well, we are doing the best we can to satisfy each market and every customer.

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Development has been mentioned many times. What are the key developmental goals of Keko Equipment?

JŠ: The drive of the development is production and not theory. The Chinese are very strong in this area; they are in constant contact with production.

TK: The ideas originate from customers who develop new products and require the technology for their produc-tion. Occasionally, we apply our solutions to other areas like pharmaceuticals, food industry etc. We are cur-rently (slowly) investing in additional production facilities

at our location in Žužemberk, and we are looking at the possibility of open-ing an additional production plant in China. The aim is to compete on vari-ous development-related tenders.

JŠ: We are seriously considering establishing an institute or R&D centre for the development of new applications based on our technologies, in this way we can offer greater support to our customers and their development, which is currently very popular in the Rus-sian market. Russians are becoming technologically independent, they want their own solutions, and they are becoming more demanding. We also wish to cooperate more with the Jožef Štefan Institute in Ljubljana. We are one of the world leaders for this type of equipment and technologies, but this is a highly specialised sector and the market is very limited, we are always looking for new applications for our machines in other industries.

How do you assess progress in the past two years?

JŠ: Progress happens on a daily basis and remains constant, it is difficult to speak about large steps; how-ever, development is constantly evolving. This year, our

production department has been extremely occupied due to a large number of orders received, so there are many ideas that have been placed on stand-by, and are awaiting reali-sation. We cannot consider develop-ment as isolated from other areas of work, since it is very much connected with other func-tions, our designers are not separate from production; they also put a lot of effort into what they do and are rewarded by seeing how their solutions are functioning in practice. Our activity is very specific and involves spe-cial knowledge; that means that each new development engineer needs to be trained separately. In the future we plan to also employ technical experts from abroad.

TK: Despite progress we stick to the basic concept, which is to provide complete solutions. Since we offer machines for the entire production processes, from the production of the ceramic tapes to the sintering of the ceramic packages, we are very good providers of services for production lines that develop new products. We take full advantage of any downturn in our industry by coming up with new ideas and products.

We have been present in the market for many years, the average lifetime of our machines is 10 to 15 years; so we feel honoured when customers keep coming back to us throughout the years when they need to expand or upgrade their production capabilities. Our basic ac-tivity remains the manufacturing of machines for the production of electronic passive components. Our staff includes many young experts, we are also experiencing an internal technological development and introducing a larger scope of CNC technology. Our plans are chal-lenging, but there is no reason why we could not realise them just as we have realised our plans so far.

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Multilayer ceramic stacking principles

KEKO Equipment’s machines selection guide

Multilayer ceramic components are manufactured from single green ceramic sheets. The single layers are very accurately stacked to form a multilayer package; the machines that perform this operation are called stack-ers or collators. Keko Equipment produces a wide range of stackers, adapted to different component types and production requirements. In this article I would like to ex-plain the main stacking principles used by our machines and I would like to also offer some advice regarding how to select the proper stacking process and machine.Proper process and machine selection depends on several criteria like:

- Tape type: • Tape on carrier film (PET) • Tape without carrier (freestanding tape) • Tape on roll • Individual sheets- Tape properties: • Tape thickness • Tape taking properties • Punched / no punched • Other properties which may influence the stacking performance, e.g. formation of bubbles, brittleness, etc. - Component type: • Number of layers • Number of patterns • LTCC, MLCC, MLV, MLI, piezo, etc.- Production volume: • small, medium , large

Processing possibilities to build a ceramic stackThere are two possible methods:- Print on stack process- Separate printing, drying and stacking

Processes descriptions and machines selection guide

PRINT ON STACK PROCESS

Keko equipment is a leading worldwide supplier of print on stack technology and machines, owning several pat-ented solutions. Advantages:• Lowest production cost (tape stacking, electrode printing and drying is done in one machine)• Small footprint• Suitable for medium to large scale production• Possible to fill vias on thin layers• Possible to use freestanding tape, or tape on carrier filmDisadvantages:• Limited layer count depending on tape / print thick-ness ratio. (Larger ratio means more layers, smaller ratio means less layers. (The stack thickness is uneven at high layer counts and the printing quality deteriorates)• Limited number of printed pattern (max. 4)• Not a flexible process. It would take about the same time to build one stack than to build several ones. Main issue is the drying step.Generally, print on stack process is recommendable where products design does not change very often, for components with less 100 layers, and with less than 4 different prints in the stack. Products: MLCC (up to 100 layers, depending on tape thickness), MLCV, MLCI, Piezo ceramics, etc.Machines: Manual machines suitable for pilot or medium production. The production line can consist of sever-al manual machines. For smooth operation two op-erators are needed, one on the printer and one on the stacker. Individual layers are stacked and printed one by one un-til the full stack is built. In case different patterns are needed, multiple printers may be used.

PROCESS &

MACHINE

TAPE TYPE TAPE PROPERTIES

COMPONENTTYPE PRODUCTION

VOLUME

ELECTRODESARE PRINTED PRINT DRYING

LAYER ISPRESSED ONTO A CARRIER

CYCLE REPEATS AS MANY TIMEAS NECESSARY

PRINTER (P-200)

STACKER (SM)

SD

-3 D

RIE

R

TRA

NS

PO

RT

OF

CA

RR

IER

S

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SEPARATE PRINTING, SEPARATE STACKING

This is the most common approach to produce multilayer electronic ceramic components. Advantages: • Universal process suitable to produce most types of components• Stable conditions during printing and stacking• Highest layer count possible• Very flexible, suitable for small or large production volumesDisadvantages: • Difficult to handle tapes without carrier film• Difficult to fill vias on thin ceramic sheets• Higher investments cost• Larger production space requiredProducts:• all types of multilayer electronic ceramic componentsMachines:Here will be described the stacker based on the type of printed tape used. Tape on PET carrier, pre- printed, wound on roll

Applications: MLCC, MLCV, large scale productionKeko equipment is currently not offering a suitable stack-er to build stacks from a roll of pre-printed ceramic tape.

Foil on PET carrier, pre-printed, single sheet handlingTwo methods of stacking are possible:• Stacking a sheet (face down) on top of previous layer and then peeling off the PET film• Removing the PET film first then stacking a new sheet on top of a previous one

Machines for stacking first then peeling off the PET-film

SM-series: Basic stacker with pin alignment and man-ual PET film removal, it uses a uniaxial press for stacking. It is suitable for R&D or small scale production level where high alignment accuracy is not required. Heated upper and bottom pressing plates. Up to 2 mm stacking height. Up to 42 tons pressing force. Suit-able for inline installation with a printer for print on stack technology (previously described).

Automatic machines for medium and large produc-tion volumes are represented by our PAL-printing and stacking machine series. These machines have wide configuration possibilities adapted to particular produc-tion requirements.

The machine on the picture above is a basic PAL machine with one printer, one drier, and one automatic tape feeder from a roll. This machine is suitable for the production of components where only one printing pattern is needed, e.g. MLCC, MLCV or piezo components. The prints can be automatically shifted or rotated depending on the design of the component.The machine pictured below is a high end chip ferrite automatic production line consisting of automatic single sheet loading, vision alignment, two screen printers, two driers and cassette loading / unloading.

The output of this line may be over one million chip fer-rites per day.

Some features of this technology include: • The stacks are built on carrier palettes• The carrier palettes are transported from station to station (press, printer and drier) as many times as required depending on the number of layers needed.• Longer drying time increases the number of carrier palettes that can be processed with the same cycle time.

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SW - seriesUniversal stacker designedprimary for LTCC, HTCC andsimilar applications. Wide range of options like:• Manual or fully auto-matic version.• Pin or vision align-ment• Possibility of stacking sheets face up or face down.• Possibility of pressing under a vacuum.• Vacuum stack fixing.

SB - seriesFully automatic version only. High output, short cycle time. Process takes place on several stages simultaneously. Vision or pin alignment.For large scale application like MLCI, LTCC, etc..Up to 32 pat-terns (sheets) m a n i p u l a t e d from cassettes. Process takes p l a c e o n 24 carrier pellets, transported step by step from sta-tion to station.Not suitable for tape thickness bel low 15 mi -crons and high layer count.Peeling of PET film first then stacking pressing sheet on top of previous layer

ST - seriesThe main advantage of using this approach is that it’s suitable to build stacks with a high number of layers using relatively thin sheets. It’s appropriate to produce MLCC, MLCV, piezo components, etc. This technology is not suitable to process punched sheets used in LTCC, HTCC and MLVI production.• Manual or automatic tape handling from cassettes.• Stacking on a carrier palette or (as an option) into a cavity.• Stacks of up to 1000 layers can be built (using a cavity) for piezo ceramic components.• Stacks up to 8 different patterns.

Conclusion

The stacking process has a great influence on the final quality of the product. Any issues from the previous steps are immediately evident during the stacking process. The results do not depend only on the machines; they also depend on the material and its condition. The most critical stacking properties are:• uniform tape thickness• low tacking forces• low release force of the PET film• minimum tape distortion during pressing• small tape shrinkage due to temperature• adequate tape air permeability• tape should not be too brittle• tape should accept some tension forcesThe tape properties define the stacking ability of the stacker; unfortunately, there’s no tape system that has all the ideal properties for stacking. It’s not always pos-sible to achieve high stacking quality without improving some of the ceramic tape properties, not even machine modifications can compensate for inferior tape proper-ties.In most cases, testing of the stacking properties for a particular tape is necessary. Keko Equipment’s engi-neers will offer advice or adapt the machine as much as possible to be able to process your particular material.On the next page there is a graphic showing the stacking machine selection guide, you can also use it to find the limits of a particular stacking method.Please also read my article regarding the influences to the stacking accuracy in our newsletter No.5

Jože ŠtuparTechnical manager

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Stacking process and stacking machine selection guide

TAPE ON ROLL

PRE-PRINTEDBLANK

(not printed)

ON CARRIERFILM

NO CARRIERFILM

THICKNESS< 5 MICRONS

THICKNESS> 5 MICRONS

THICKNESS<20 MICRONS

THICKNESS>20 MICRONS

CONTACTKEKO

>4 PRINTEDPATTERN

<4 PRINTEDPATTERN

>4 PRINTEDPATTERN

CURRENTLY NOTIN PROGRAM



> 50 PRINTEDLAYERS

> 50 PRINTEDLAYERS

PAL machine type with carrier film supported tape

feeder

PAL machine type with freestanding tape feeder

<4 PRINTEDPATTERN

< 50 PRINTEDLAYERS

< 50 PRINTEDLAYERS

Legend

Print on stack process

Carrier film removing after pressing

Carrier film removing before pressing

Customer material needs to be verified

in order to confirm process limits for

particular material

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INDIVIDUAL SHEETS

Sheet with or without viasand/or cavities, printed or blank

Without print,vias not filled

On carrier filmthickness >15micr.

orfreestanding tape

thickness >100micr.

On carrier filmthickness >15micr.

orfreestanding tape

thickness >100micr.

On carrier filmthickness <15micr.

orfreestanding tape

thickness <100micr.

On carrier filmthickness <15micr.

orfreestanding tape

thickness <100micr.

Electrodesprinted, vias filled

no vias or cavity holes

>4 PRINTEDPATTERN


> 50 PRINTEDLAYERS

SB stacker type

SW stacker type

Alternate stackingface up/down poss.vacuum press (opt.)

Face downstacking only

> 50 PRINTEDLAYERS

Tape on carrier filmthickness< 5microns

orfreestanding tape

thickness <100micr.

Tape on carrier filmthickness> 5microns

orfreestanding tape

thickness >100micr.

Foil types<8

Foil types>8

< 50 PRINTEDLAYERS

< 50 PRINTEDLAYERS

CONTACTKEKO

PAL machine type with individual sheet loadervision or pin alignment (previous FSP)

CONTACTKEKO

<4 PRINTEDPATTERN

High layer count1 to>1000 possible

Low layer count <50

CONTACTKEKO

SW stacker type

Printed or blank sheets,

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New developed multiple pin servo motor driven punching tool dramatically increases punching efficiency, punching simultaneously up to 50 via holes at once. Maximal punching speed of tool is 15Hz. Multiple tool punching is particular suitable for mass LTCC and MLCI production. Minimal punching diameter is around 80 micron.

Next to multiple punching too, we developed also servo motor driven single pin punching toot. Advantage of this tool is in quiet operation, less tool vibration at high speed what reflects in longer tool life time.

Limitations of conventional via filling methods are known. Not only thick layers and small via diameter are difficult to fill by conductive paste, also thin layers bellow 30 microns are extremely difficult to via fill, as via filling paste is pushed easy out of it. Avoiding this problem Keko equipment engineers developed reliable via filling process and machines for via filling thin tapes. Process is especially suitable for 100 to 5 microns tape thicknesses.

Process is suitable for low or high volume production and can be completely automatic. Contact Keko Equipment for more information.

Punching up to five hundred 80 micron holes per second using multiple pin punching tool

Thin layer via filling invention

Production steps

Thin layers

Carrier

Squeegee

Screen or stencil

Next layerCycle repeatsas many timesas necessary

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Trade Fairs & Exhibitions

In 2010 and 2011 we were attending CARTS Jacksonville, Conference Kunshan China, EXPO Moscow, EXPO Solar South Korea, IMAPS Munich, Printed Electronics Dusseldorf, Productronica...

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StandardProductsOverview

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CAM-L25xxx

Casting machineL aboratory type25 only - max. PET film width in cm

Dryer length m2, 3, 4 ( )T (T)op heatingB (B)ottom heating

CAM-C xxxx

Casting machineCompact type25 35or -max. PET film width in cm

B - for base model without touch screenand automatic blade gap setting

L - for 2 m longer dying section

CAM-H xxx

Casting machine

Horizontal type

25 45 60or or - max. PET film width in cmDrier length: 20 (m)6 - (in 2m steps)

Standard Products Overview 2012

Slurrypreparing

Tapecasting

- adjustable rotation speed and time- adjustable to different jar sizes

- compact size requiring minimum floor size- suitable for solvent and water based systems- high accuracy in thickness control- automatic tracking of carrier film- automatic slurry feeding- applicable for up to 100 micron tape thickness

Roller benches

BL - series

Laboratory tape casters

L-series

Models:BL X-

Roller bench

1, 3, 6, 8 Max. number of jarson rubber rollers

Tapepunching

Tape casting on polyester film



Tape casting on steel belt

Compact tape casters

C-series

Horizontal drying zone

tape casters

H-series

SC-25xxx

Sheet cutter25 35or - max. Tape width in cm

PN - without registration punching, - with punch toolT C- sheet to tray, - sheet to magazine (cassette)

M Ffor tape on Mylar, for freestanding tape

PAM- xxx

Punching machine

S-M

s- multiple pins punching tool

ingle pin punching tools type

(4 or 8)Number of tool positionTools have to be specified separately

Tape handling - manual- magazine to magazine- reel feeder to magazine

MCCRC

Steel belt tape casters

S-series

CAM-S3 x0

Casting machine

Stainless steel belt type

3 60 0or steel belt- max. width in cmDrier length (m)5 (7, 9, 11)

Automatic green tape blanker

SC-series

Punching machine

PAM-series

- for laboratory or small production volume- casting on PET film- casting speed control- gravity slurry feeding- tape winding

- thickness 5-500 microns (0.2 - 2 mils)- advanced drying regimes possible- high accuracy in thickness control- automatic tracking of carrier film- automatic slurry feeding

- suitable for price sensitive applications- diferent drying regimes- high accuracy doctor blade- automatic tracking of steel belt- automatic slurry feeding- tape winding

- blanks single sheets from a roll of green tape- suitable for freestanding or Mylar based tapes- trims sheet edges- punch registration holes- transferes blanked sheets to a magazine- sorting blanked sheets acording to thair thickness

- punch holes for vias and registration in green tape- punch cavity rectangle or square holes- Manual, CAD, NcDrill and DXF file input- tool brakage detection- automatic sheets re-alignment

Tapeblanking

1/4

Especially suitable for LTCC production

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Screenprinting

Screen printersP - series

Automatic screen printersP - series

Models:

Roll to rollprinting

Drying

Coversheets

making

DrierSD - series

Cover sheets makerCSM - series

Stacking machineSW - series

Stacking

P-xxx

PrinterPrinter size or200 400

BSA

basic modelstandard modeladvanced model

vf in case of via filling option

SD xxxx-

I R (IR)nfra ed drying

30 45or - max. width in cmbelt

2 (4, 6, 8) (m) - Drier lenght

Drier

Automatic roll to roll screen printersRTP - series

SW x-xxx

Stacker typeSW

Sheet size: , , inch4 6 8

PV

- pin registration- vision registration

Pressing force: - low up to 200 kN- high up to 420 kN

LH

CSM- xxx

Cover Sheet Maker

Foil type: - reestanding- ylar

F FM M

Foil width: cm max.25

C - cassettes for carriers

- models available to meet al requirements- Fully programmable printing parameters- Print/print, print/flood, flood/print, o contact print

stencil printing, via filling- Extensive options for demanding advanced

technology applications

leerhT

n ,

- Automatic sheet handling, printing, drying process- Two models available to meet al requirements- Fully programmable printing parameters- Print/print, print/flood, flood/print, on contact print,

stencil printin via filling and screen cleaning- Extensive options for demanding advanced

technology applications

g,

- Makes cover sheets directly onto carrying palettefrom a roll of tape

- Glues the cover sheet to custom carrying palette- Sheet blanker and press in one unit

- Universal manual or automatic stacking machinefor low to medium LTCC or other similarcomponent production

- Suitable for tapes with or without carrier film- Process on one carrier pallette- Possible to start building stack from top or from

bottom

- single , substrates or wafers-- a

tleb hsem dezinolfets -- IR fast drying version available- height adapted to Keko manual screen printers

dry sheets after printingair flow ensure high drying efficiency

djustable internal and fresh airflow circulation.heets are transported by

2/4

-

---

Automatic screen printing on to tape from a rollsuitable for different applicationAdvanced print alignment feedbackDouble color printing with precise alignment versionSpecially designed for MLCC high layers production

- Efficient tape drying- enshure short cycle time- Printed tape tracking control on winding side

P- x200 AM

PrinterPrinter size 200

SA

standard modeladvanced model

A Mutomatic anipulation

RTP xx-

Roll to roll printer

200or printing width400 -

S -single print- double printD

SM-xxx

Stacker typeSM


P- no registration- pin registration

Pressing force: - low up to 200 kN- high up to 420 kN

LH

Manual stackerSM - series

--Uniaxial lamination possibilitySimplified manual stacker

-Pre-r can beegistration done by registration pins

A - for automatic sheetsloading from cassette

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Stacking

Printing &stacking

Stacking machine

SB - series

Printing and stacking machine

PAL - series

Models:

Laminating

Isostatic lamination press

ILS - series

Uniaxial thermal press

TPR - series

SB- xxx

Stacker

Sheet size: , inch6 8

Sheet loading: - anual- utomatic

M MA A

V - vision alignmentP - pin alignment

ILS xxx-

Isostatic laminator

Max. bar size in inch: or or or4 6 10 12

Max. pressure for 6000PSI (42Mpa)for 10000PSI (70Mpa)

610

D in case of double chamber length (for ILS-6 only)

TPR xxx-

Thermal Press

Max. bar size in inch: or4 6

CF

- cavity for high stack lamination- flat plates

Pressing force: - low up to 400kN- high up to 700 kN

LH

PAL x- xx

Printing And Laminating System

Sheet size: , inch6 8

1, 2, 3 Number of printers

M- Mylar feederF-S-

Free standing tape feederSheet loading

- Universal system for components up to 100 layers- High productivity = low cost per component- Suitable for smallest components size- Uses carrier film tapes, freestanding tapes

and individual sheets- Special configurations like: -several printers

-several driers-sheet vision alignment-other special requirements

-

-Easy to operate, quick product turn-around time- ompact design takes little floor space

Multiple stacks are laminated simultaneously-High stack lamination possibility-Simplified versions available

Rigid, c

-

-Easy to operate, quick product turn-around time- ompact design takes little floor space-Stores up to 99 pressure programs

Up to 40 stacks/substrates laminated simultaneously-Wide selection range of bar size

Rigid, c

3/4

Print on stacktechnology

- Automatic sheet loading from cassettes- Carrier palettes automatic loading / unloading- Pressing first than removing carrier film- Pre-r- Automatic vision alignment- Suitable for high volume production- Suitable for various components

egistration is done by registration pins

Contact supplier for particular application

Higher forces an vacuum chamber on request

Standard 24 carrier block carousel transport

Vacuum seeling device inclouded

Stacking machine

ST-series ST x-xxx

Stacker typeST


Sheet loading: - anual- utomatic

M MA A

V -P

vision alignment-pin alignment

P - Carrier plates auto loadingC - cavity, for high stacks, without pressing

posibility- Automatic sheet loading from cassettes- Carrier palette automatic loading / unloading

skcats naht ,tsrif-- Pre-r- Automatic vision alignment- Suitable also for very high layer count- Not suitable for tapes with punched holes

Automatically removes carrier filmegistration is done by registration pins

Process on one carrier palette at the same time

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Cutting Cutting machine

CM-series CM- x15x

C achineutting M

bar size: , , , inch4 6 8 10

A -M

Auto bar handling from/to cassette- Manual machine without auto vision alignment

- Automatically

-

prints electrodes on to solar silicon wafersor thin ceramic SOFC substratesLoads wafers from cassettes or inline integration

- Short exchange time for different dimensions-

- Unique, high speed self cleaning wafer/substratetransport ensures minimal manipulation and low breakage

Vision alignment and breakage check- High precision screen printing with precise

squeegee control prints the electrodes- IR drier for efficient drying- Modular design, for different configurations- Automatic unloading in to cassettes or on to furnace belt

Automatic solar cells printing line

SOC-seriesSolar

andSOFCcells

printer

- Cuts the most difficulthigh thickness green Ceramic Ware

- Automatically positions knife with high accuracy- Automatically finds cutting markers- Adjustable speed and cutting depth- High productivity due to high cutting speed

4/4

Contact producer for detailed specification!

Pre and post heating plates optionally

CNC Drilling machine

DM-seriesD xxM-

Drilling machine

bar size: , , inch6 8 10

R - For routing capabilities- Cuts round components out of green ceramic- Drills holes- Automatically positions bar by vision system- Two working spindles with programable cutting

speed alove using two different cutting tools- DXF file conversion- Vacuum bar fixing

CNCdrilling

Customdesigned

Our machines are developed, designed and produced in our house.

One of Keko Equipment strongest part is custom designed equipment basted on customrequirements and our long term designing and machines production experiences.

Many customers are satisfied with our innovative solutions adapted to their needs.

Experienced production team is guaranty for quality and success.

Contact us, if you are looking for custom solution, which you can not find on the market.

HOTMELT

Edge Trimmer

ET-series ET-xx

Edge utterC

bar size: , , , inch4 6 8 10

-A

edge trimmingm & t- edge trim ing bar split ing function-

- Bar Edge trimming and Splitting posibility-

Simple, flexible and accurate

Laser pointers installed for preciseblock positioning

- Heated cutting table and cutting blade

Automatic solar cells printing line

SOC-series

2011

1919

Installed Keko Equipment machines worldwide

20Production: Studio Virc, November 2011

KEKO EQUIPMENT, d.o.o. Grajski trg 15 8360 Žužemberk Slovenia, Europetel: +386 7 388 52 00 fax: +386 7 388 52 03 e-mail:[email protected]

Company Profile

KEKO Equipment Ltd. is a leader in the manufacture

of machines for the production of multilayer passive

ceramic components but also many other products,

based on a tape casting process.

Twenty-five years of experience have given us the

vast knowledge that is now marketed under our own

brand in the European, Asian, American and Australian

markets.

Our roots stretch a long way back to when we were a

unit of the Iskra consortium. Since 1995 the company is

in private hands and its philosophy today is formulated

by a team of highly motivated engineers and designers.

In addition to the extensive range of proven products,

we focus our specialized know-how into custom manu-

facturing.

In the development of specialized technological solu-

tions we take into account our customers require-

ments and the needs of each individual buyer, thus pro-

viding the basis for a successful long-term relationship.

This is aided by our widespread sales network that

spans all continents, where we always cooperate

closely with knowledgeable local agents. They have

helped us to provide very successful post-sales services

and ensure customer satisfaction.

Knowledge, flexibility and innovation are our company’s

key competitive advantages and our brand name’s good

reputation now reaches all over the world.

Keko Equipment NEWSLETTER · needed, multiple printers may be used. process & machine tape type...

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