IoT PRODUCT SELECTION GUIDE - telit.com · PDF file2g (gsm/gprs/edge) 4g 50/150 3.75g...

IoT PRODUCT SELECTION GUIDE

3 | Product Selection Guide

PRODUCT APPROVALS AVAILABLE FOR BANDS TECHNOLOGY DATA SPEED (UL/DL) INTERFACES FEATURESP

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2 G

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(ED

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Kbp

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G

(UM

TS) K

bps

3.5

G

(HSD

PA) M

bps

3.5

G

(HSP

A) M

bps

3.75

G (

HSP

A+) M

bps

CD

MA

(1xR

TT) K

bps

4 G

(L

TE) M

bps

USB

type

AAI

(ana

log

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DVI

(di

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DAC

(di

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ADC

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GP

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CAN

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(10

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Size

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4G LTE

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LE910 V2 Cat.4 Series • • • • • • • • • • •

NA - AT&T - LTE FDD (2,4,5,12,13)NA - Verizon - LTE FDD (2,4,13)

EU - LTE FDD (1,3,7,8,20)AU - LTE FDD (3,7,28)

NA - UMTS (2,5)EU - UMTS (1,8)EU - GSM (3,8)

4G (LTE Cat.4)3.75G (HSPA+)

3G (UMTS) 2G (GSM | GPRS | EDGE)

4G 50/1503.75G 5.76/42.0

3G 384/3842G 236/236

2.0 HS

• • •

28.2 x 28.2 x 2.2

LGA RF PAD

-40°C to

+85°C

• • • • • • • •

LE910 Cat.1 Series • • • • • • • • •

NA - AT&T - LTE FDD (2,4,5,12,13) NA - Verizon - LTE FDD (2,4,13)

EU - LTE FDD (1,3,7,8,20)JN - LTE FDD (1,19,21)

NA - UMTS (2,5)EU - GSM (3,8)

4G (LTE Cat.1) 4G 5/10 • • • • • • • • •

LE910C1 Series • • • • • • • • • •NA var - 4G (2,4,12), UMTS (1,2,4,5,8), 2G (2,3,5,8)

NS Var - 4G (2,4,5,12,25,26)AP Var - 4G (1,3,5,8,28), UMTS (1,5,8)

4G (LTE Cat.1)

4G (10/5) 3.75 5.76/42.0

3.5 384/384 2G 236/236

• • • • • • •

ME910C1 Cat.M1/NB1 Series • • • • • • •

NA - LTE FDD (2,4,12)NV - LTE FDD (4,13)

E1 - LTE FDD (3,8,20)4G M1/NB1 4G 375/300 kbps • • • • • • • • • •

NE910C1 Cat.NB1 Series • • • E1 - LTE FDD (8,20) 4G NB1 4G 20/250 kbps • • • • • • • • • •

3G

UM

TS |

HSP

A+

HE 910 Series • • • • • • • • • • • • • • • •Global - UMTS (1,2,4,5,6,8,19)

EU - UMTS (1,5,6,8,19)NA - UMTS (2,4,5,6,19)

GSM (2,3,5,8)

3.75G (HSPA+)3G (UMTS)

2G (GSM | GPRS | EDGE)

3.75G 5.76/21.03.5G 5.76/7.23G 384/384

2G 118.4/236.8

• • • 28 • • • • • • • • • •

3G

UM

TS |

HSP

A

UE 910 Series • • • • • • • •NA - UMTS (2,5)EU - UMTS (1,8)NA - GSM (2,5)EU - GSM (3,8)

3.5G (HSPA) 3G (UMTS)


3.5G 5.76/7.23G 384/384

2G 118.4/236.8• • • • • • • • • • • • • • •

UE 910 3G Series • • • • NA - UMTS (2,5) 3.5G (HSPA) 3G (UMTS) 3.5G 5.76/7.2 • • • • • • • • • • • • • • •

2G

CDM

A | 1

xRTT CE 910 Series • • • • • • CDMA (BC0,BC1) DUAL

CDMA (BC0) SC2G (CDMA | 1xRTT) CDMA 153.6k bps

(full-duplex)2.0 FS

• • • • 28.2 x 28.2 x 2 • • • •

CE 910-SL • • • CDMA (BC5) • • 28.2 x 28.2 x 2.35 •

2G

GSM

| G

PR

S GE 910 Series • • • • • • • • • • • • •GSM (2,3,5,8) 2G (GSM | GPRS) 2G 40/80

• • • •28.2 x 28.2 x

2.25

32 • • • • • • • • • • • •

GE 910-QUAD V3 • • • • • • • • • • • • – • • • • • • • • • • • • • •

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5 Fa

mily

3G

UM

TS |

HSP

A

Embe

dded

UL 865 Series • • • • • • • • •NA - UMTS (2,5)EU - UMTS (1,8)NA - GSM (2,5)EU - GSM (3,8)

3.5G (HSPA)3G (UMTS)


3.5G 5.76/7.23G 384/384

2G 118.4/236.82.0-HS • • • • 24.4 x 24.4 x

2.6 QFN

RF PAD

-40°C to

+85°C

• • • • • • • • • •

2G

CDM

A | 1

xRTT

CL 865 Series • • • • • CDMA (BC0,BC1) DUALCDMA (BC0) SC

2G (CDMA | 1xRTT) CDMA 153.6 kbps (full duplex) 2.0-FS • • • • • 24.4 x 24.4 x

2.45 QFN • • • •

GSM

| G

PR

S

GL 865 V3 Series • • • • • • • • • • • GSM (2,3,5,8) 2G (GSM | GPRS) 2G 40/80 – • • • • • 24.4 x 24.4 x 2.6 QFN • • • • • • • • • •


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4G LTE

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LE 866 Cat.1 Series • • • • • • • • •SV1 - LTE (4,13) NA - LTE (2,4,12)

KK - LTE (3,8)KS - LTE FDD (3,5)JS - LTE FDD (1,8)

4G (LTE Cat.1) 4G 5/10

2.0-HS

• • • •15 x 25 x

2.2

LGA RF PAD

-40°C to

+85°C

• • • • •

ME866A1 Cat.M1 Series • • • • NV - LTE FDD (4,13) NA - LTE FDD (2,4,12) 4G (M1) 4G 375/300 kbps • • • • • • • •

NE866B1 Cat.NB1 Series • • • • • E1 - LTE (8,20) 4G (NB1) 4G 20/250 kbps – • • • 15 x 19 x2.2 • •

3G

UM

TS |

HSP

A

UE 866 Series • • • • • • • • •NA - UMTS (2,5)EU - UMTS (1,8)EU - GSM (3,8)

3.5G (HSPA) 3G (UMTS) 3.5G 5.76/7.2 2.0-HS • • • • 15 x 25 x

2.2 • • • • • • • • •

2G

GSM

| G

PR

S

GE 866-QUAD • • • • • • • • • • • • GSM (2,3,5,8) 2G (GSM | GPRS) 2G 40/80 – • • • • • 15 x 19 x 2.2 • • • • • • • •


RO

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TEC

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Pic

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FP

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BFC

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DG

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CAN

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2 G

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G

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bps

3.5

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3.5

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3.75

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CD

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4 G

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USB

type

AAI

(ana

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DVI

(di

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DAC

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ADC

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CAN

(Au

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Ethe

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(100

MB

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Size

(m

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LE92

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4G

LTE

Embe

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LE 922A6 Series • • • • •A1-4G (1,3,7,28,40)

3G (1,8)E1-4G (3,7,20)

E2-4G (3,7,8,28,20,32)

Rel. 10 LTE FDD & TDD,Cat 6 2C-HSPA+

LTE FDD:DL: 300 Mbps,UL: 50 Mbps,DC-HSPA+:

DL: 42 Mbps, UL: 11Mbps

3.0 • 34 x 40 x 3

LGA RF PAD

-40°C to

+85°C • •

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UM

TS |

H

SPA

HE 922-3GR • • • • • • • • 3G (1,2,5,8)2G (2,3,5,8) 3G (HSPA+/UMTS)

3.5G3G

2.75G2G 2.0 OTG

• • •34 x 40 x

3

0°C to +70°C-40°C

to +85°C

• •

Wi-

Fi

WE 922-3GR • • • • • • IEEE 802.11 (b/g/n) N/A • • • • •

AU

TOM

OTI

VExE

920

Fam

ily

LTE LE 920A4 Series

AUTO • • • • • • • • • • • •

NA - LTE FDD (2,4,5,7,12)NA - HSPA+ (2,4,5)

NA - 2G (2,5)EU - LTE FDD (1,3,7,8,20)

EU - HSPA+ (1,3,8)EU - 2G (3,8)

CN - LTE FDD (1,3,5,8,26)CN - LTE TDD (38, 39,40,41M)

CN - HSPA+ (1,5,8)CN - 2G (3,8)

TD-SCDMA (34,39)

Rel.9 LTE FDD & TDD Cat.43G (HSPA+/UMTS)

2G (GSM/GPRS/EDGE)

4G 50/1503.75G 5.76/42.0

3.5G 384/3842G 236/236

2.0 OTG • • • • •34 x 40 x

2.8

-40°C to

+85°C

• • • • • • •

3G

UM

TS |

H

SPA

+ HE 920 Series AUTO • • • • • • • •

EU - UMTS (1,5,6,8,19)NA - UMTS (2,4,5,6,19)

GSM (2,3,5,8)



3.75G 5.76/14.4 3G 384/384

2G 236.8/236.82.0-HS • • • • • 30 • • • •

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GSM

| G

PR

S GE 910-QUADAUTO • • • • • • • GSM (2,3,5,8) 2G (GSM | GPRS) 2G 40/80 2.0-FS • • • • 28.2 x 28.2 x

2.25 • • • • • • • • • • • •

3G

UM

TS |

HSP

A UE 910-EU V2AUTO • • • UMTS (1,8)

GSM (3,8)

3.5G (HSPA)3G (UMTS)


3.5G 0.384/3.63G 384/384

2G 118.4/236.82.0-HS • • • • • 28.2 x 28.2 x

2.2 • • • • • •

ATO

P3G

UM

TS |

H

SPA

+

ATOP 3.5G • • • • • • • WW - UMTS (1,2,5,6,8,19)US - UMTS (1,2,4,5,6,19)



3.75G 5.76/14.4 3G 384/384

2G 236.8/236.82.0-HS • • • • • • • 30 x 30 x

3.38 30 • • • • • •


Term

inal

Fam

ily

2G

GSM

| G

PR

S

Term

inal

GT 863-PY • • GSM (2,3,5,8) 2G (GSM | GPRS) 2G 40/80 – • 107 x 64 x 33

Termi-nal

SMA

-30°C to

+75°C

• • • •

3G

UM

TS |

HSP

A

GT 863-3EU • UMTS (1,5,8)GSM (2,3,5,8)

3.5G (HSDPA) 3G (UMTS)


3.5G 5.76/7.23G 384/384

2G 236.8/2962.0

83 x 64 x 33

SMA • • • •

2G

GSM

| G

PR

S

GT 864-QUAD / PY • • GSM (2,3,5,8) 2G (GSM | GPRS) 2G 40/80 – • • • 77 x 67 x 26

FME • • • •


RO

DU

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AMIL

Y

GEN

ERAT

ION

TEC

HN

OLO

GY

FOR

M F

ACTO

RDATACARDS &

TERMINALS

Pic

ture

– B

acks

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min

al F

amily

Fr

ont-

/Bac

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e

R&

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RED

GC

FP

TCR

BFC

C

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CC

DG

1 &

2 (C

CF)

CC

CAN

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(RC

M)

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LEM

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TIN

AM

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AN

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MER

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APAC

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RAL

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OR

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2 G

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Kbp

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G

(UM

TS) K

bps

3.5

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(HSD

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3.5

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(HSP

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3.75

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bps

CD

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(1xR

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bps

4 G

(L

TE) M

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USB

type

AAI

(ana

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audi

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DVI

(di

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DAC

(di

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ADC

(an

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GP

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CAN

(Au

tom

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Ethe

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(100

MB

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Size

(m

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mou

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Ante

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conn

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Tem

pera

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Ran

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GN

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LM94

x Fa

mily

4G LTE

Min

i PCI

e

LM 940 • • • • • • • • • • •LTE FDD (1-5,7,8,12,13,17,20,25,

26,28,29,30,66)LTE TDD (38,40,41)

3G (1,2,4,5,8)

4G (Cat. 11)

LTE Cat. 11 Upto 600 Mbps DL

w/ 3x CA DL,256QAM DL

Upto 75 Mbps UL w/ UL 64QAM

DC-HSPA+DL: 42 MbpsUL: 11MPBS

2.0&

3.0

• 50.95 x 30 x2.7

MiniPCIe

U.FL

-40°C to

+85°C

• •

M.2 LN 940 • • • • • • • • • • • • • • •

LTE FDD (1,2,3,4,5,7,8,12,13,17,18,19,20,21,25, 26,28,29,30,38,39,40,41,66)

WCDMA 3G (1,2,3,4,5,6,8,19)

4G (LTE)3G (WCDMA)

4G LTE (Cat. 11 DL@256QAM)

Upto 600 Mbps;4G LTE (Cat. 9 DL@64QAM)

Upto 450 Mbps;4G LTE (Cat. 6 DL@64QAM)

Upto 300 Mbps;4G LTE UL

50 Mbps (Cat 11@16QAM)

• 30 x 42 x 2.3

M.2 MHF • •

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ini P

CIe

Fam

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4G LTE

Min

i PCI

e

LE910 V2 Mini PCIe • • • • • • • • • • •

NA - LTE (2,4,5,12,13)EU - LTE (1,3,7,8,20)

AU - LTE (3,7,28)SV - LTE (2,4,13)EU - UMTS (1,8) NA - UMTS (2,5)EU - GSM (3,8)

4G (LTE)3.75G (HSPA+)


4G 50/150

2.0-HS

• • •

51 x 30 x 3.2

MiniPCIe

U.FL-40°C

to +85°C

• • • • • • • •

LE 910 Mini PCIe • • • • • • • • • • • •NA - AT&T - LTE FDD (2,4,5,17)NA - Verizon - LTE FDD (4,13)

EU - LTE FDD (3,7,20)NA - UMTS (2,5)EU - UMTS (1,8)

4G (LTE)3.75G (HSPA+)


4G 50/1003.75G 5.76/42.0

3G 384/3842G 236/236

• • • • 32 • • • • •

3G

UM

TS |

H

SPA

+

HE 910 Mini PCIe • • • • • • • • • • • • UMTS (1,2,4,5,6,8,19)GSM (2,3,5,8)

3.75G (HSPA+) 3G (UMTS)


3.75G 5.76/21.0 3.5G 5.76/7.2 3G 384/384

2G 118.4/236.8• • 28 • • • • • • • • • • •


PRODUCT PROTOCOL FREQUENCY FEATURES ELECTRICAL ENVIRONMENTALR

ADIO

TEC

HN

OLO

GY

FOR

M F

ACTO

R

SHORT RANGE IoT MODULES

Pic

ture

– B

ack

side

Blu

etoo

th Q

ualif

icat

ion

RF

Ope

ratin

g Fr

eque

ncy

Embe

dded

Sta

ck O

ptio

n

Seri

al s

peed

(Kbp

s)

Inte

rfac

es

Pow

er S

uppl

y (V

)

Idle

pow

er s

avin

g

Out

put P

ower

( dB

m)

Size

(mm

)

Ante

nna

conn

ectio

n

Tem

pera

ture

ran

ge

Mou

ntin

g

Cer

tific

atio

n

Blu

etoo

th &

NFC

Embe

dded

BLUEMOD +SR BT4.0 2.4 - 2.495 GHz

Classic Bluetooth Serial Port Profile (SPP)Bluetooth Low Energy using Telits "Terminal I/O" Profile (SPP like)One SPP connection and one BLE connection concurrent (in MUX mode)GATT Server, HIDNFC Handover

9.6 - 921 UART I2C, GPIO, ADC 2.5 - 3.6 150µA -23 to +8 10 x 17 x 2.6

Integrated Ceramic or

RF pad-30°C +85°C LGA, 49pins RED, FCC, IC, KCC, MIC

BL871 BT4.2 2.4 - 2.495 GHz

BR/EDR• Up to 7 active devices• Up to 3 piconets simultaneously, 1 as master and 2 as slaves• Up to 2 Synchronous Connection Oriented (SCO) links on the same

piconet• Support for All Voice Air-Coding – Continuously Variable Slope Delta

(CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and transparent (uncoded)

• Provide an assisted mode for HFP 1.6 Wideband Speech (WBS) profile or A2DP profile to reduce host processing workload and power

• Support of multiple Bluetooth profiles with enhanced QoS Bluetooth Low Energy

• Support for up to 10 connections• Multiple sniff instances tightly coupled to achieve minimum power

consumption• Independent buffering for LE allows large numbers of multiple

connections without affecting BR/EDR performance• Built-In coexistence and prioritization handling for BR/EDR and LE• Capabilities of Link Layer TopologyScatternet - Can act concurrently as peripheral and central– Network support for up to 10 Devices– Time Line Optimization algorithms to achieve maximum channel

utilization

Typ 115.2 max 4 Mbps (asynchronous)

UART PCM 2.2 - 4.8 7µA Up to +12 9.7 x 10.1 x 2.5 Integrated

ceramic -40°C +85°C LCC, 18pins RED, SRCC

BLUEMOD +S BLE4.1 2.4 - 2.495 GHz

Terminal I/O ( BLE SPP like) peripheral and central roleGATT central role+ handling for 4 concurrent links (3 in central role and 1 in peripheral role)Over the air updateAutomation I/O, SCIS

9.6 - 921 UART I2C, GPIO, ADC 1.8 - 3.6 <2µA -23 to +4 10 x 17 x 2.6 Integrated

ceramic -20°C +70°C LGA, 49pins RED, FCC, IC, KCC, MIC, Anatel

BLUEMOD +S42 BLE4.2 2.4 - 2.495 GHz

Terminal I/O ( BLE SPP like) GATT central + peripheral roleNFC HandoverLE Secure Connections (LESC)Configurable DIS (Device Information Service)LE Data Length ExtensionOver the air update


ceramic -40°C +85°C LGA, 49pins RED, FCC, IC, KCC, MIC

BLUEMOD +S42M BLE4.2 2.4 - 2.495 GHz

Terminal I/O ( BLE SPP like)GATT central or peripheral roleLE Secure Connections (LESC)Configurable DIS (Device Information Service)LE Data Length ExtensionOver the air update


ceramic 0°C +70°C LGA, 49pins RED, SRCC

BLUEMOD +S50 BLE5 2.4 - 2.495 GHz

Terminal I/O ( BLE SPP like) peripheral and central roleGATT central role + handling for 4 concurrent links (3 in central role and 1 in peripheral role) over the air updateNFC Handoverautomatic "external clock" detectionLE Secure Connections (LESC)Configurable DIS (Device Information Service)LE Data Length Extension2 MB/s PHY for LESlot Availability MaskBroadcasting channel improvements


ceramic -40°C +85°C LGA, 49pins RED, FCC, IC



ADIO

TEC

HN

OLO

GY

FOR

M F

ACTO

R


Pic

ture

– B

ack

side

Rad

io P

roto

col

RF

Oper

atin

g Fr

eque

ncy

Secu

rity

Pro

toco

ls

Net

wor

king

Pro

toco

ls

I/O

Inte

rfac

es

Hos

t Con

nect

ions

Inte

rnal

Fla

sh

Supp

orte

d D

ata

Rat

es

I/O

Vol

tage

VBAT

Ope

ratin

g Vo

ltage

RF

Out

put P

ower

(Typ

ical

)

Rx

Sens

itivi

ty

Wak

e Fr

om S

tand

by T

ime

Out

line

Dim

ensi

ons

(mm

)

Ope

ratin

g Te

mpe

ratu

re

Pin

Cou

nt

Ante

nna

Opt

ions

Cer

tific

atio

ns a

nd C

ompl

ianc

e

Wi-

Fi M

odul

es

Embe

dded

WE866A1-P IEEE 802.11b/g/n

2.4 - 2.495 GHz

WPA/WPA2 -Personal, WPA/WPA2 - Enterprise

WEP, TLS/SSL Client and Server,

HTTPs

IP Stack (IPV4 and IPV6): TCP, UDP, RAW, ARP,

DHCP, DNS, ICMP, SSL 3.0, TLS 1.2, HTTP(s)

server

SPI UART

4-wire UART SPI interface

16 Mb Up to 72Mb/s 1.5 - 2.1 V 1.8V 3.1- 4.5V

+17.25 dBm (802.11b) +16.25 dBm (802.11g)

+16dBm (802.11n MCS0)

-94.7 dBm (802.11b)

-88 dBm (802.11n MCS0)

3ms 15 x 19 x 2.2 -40° to +85 °C 49 pins RF PAD

RED FCC/IC Wi-Fi

GS2200M IEEE 802.11b/g/n

2.4 - 2.495 GHz


(PEAP,EAP-FAST, EAPTLS,

EAP-TTLS), WEP, TLS/SSL

Client and Server, HTTPs

TCP, UDP, IPv4, IPv6, TLS Client and Server,

SNTP client, DHCP Client and Server v4, DHCP Client and Server v6,

DNS Client and Server, mDNS, DNS-SD, HTTP Client and Server, and

XML Parser

SPI, UART, SDIO,

I2C, I2S,GPIO (19),

16 & 12 bit ADC,

JTAG, PWM (3), RTC

SPI, UART, SDIO 4 MB Up to

72Mb/s3.3V or

1.8V 1.6-3.6V 2.7- 3.6V

+15 dBm (802.11b) +14dBm (802.11g ) +14dBm (802.11n

MCS0)

-91 dBm (802.11b) -88 dBm (802.11n

MCS0)1 ms 13.5 x

17.85 x 2.1 -20° to +70°C 66 pinsUFL connector or Integrated

Ceramic

RED FCC/IC TELEC Wi-Fi

GS2101M IEEE 802.11b/g/n

2.4 - 2.495 GHz


(PEAP,EAP-FAST, EAPTLS,

EAP-TTLS), WEP, TLS/SSL

Client and Server, HTTPs

TCP, UDP, IPv4, IPv6, TLS Client and Server,

SNTP client, DHCP Client and Server v4, DHCP Client and Server v6,

DNS Client and Server, mDNS, DNS-SD, HTTP Client and Server, and

XML Parser

SPI, UART, SDIO,

I2C, I2S,GPIO, ADC

(16 bit), ADC (12bit), JTAG

SPI, UART, SDIO 4 MB Up to

72Mb/s 2.7- 3.6V 1.6-3.6V 2.7- 3.6V

+15 dBm (802.11b 1Mbps), +14dBm (802.11g 6Mbps), +14dBm (802.11n

MCS0)

-91 dBm (802.11b) -88 dBm (802.11n

MCS0)1 ms 18 x 25 x

2.5 -40° to +85 °C 40 pinsUFL connector or Printed PCB

antenna

RED FCC/IC TELEC Wi-Fi

PRODUCT PROTOCOL FREQUENCY FEATURES ELECTRICAL ENVIRONMENTAL

RAD

IO T

ECH

NO

LOG

Y

FOR

M F

ACTO

R


Pic

ture

– B

ack

side

Embe

dded

Sta

ck O

ptio

n

Freq

uenc

y ba

nd

Seri

al s

peed

(Kbp

s)

Inte

rfac

es

Rad

io D

ata

Rat

e

Pow

er S

uppl

y (V

)

Idle

pow

er s

avin

g

Out

put P

ower

(dB

m)

Size

(mm

)

Ante

nna

conn

ectio

n

Tem

pera

ture

ran

ge

Mou

ntin

g

Cer

tific

atio

n

SubG

Hz

Pro

prie

tary

Embe

dded

LE50-433 / 868 P2P, Star network, I/O copy, Adressed secured mode 433 - 435 MHz 863 - 870 MHz 1.2 - 115.2 UART

GPIO, ADC9.6 to 115.2 Kbps 4.8 to 115.2 Kbps 2- 3.6 Stand by <2µA 13

14 26x15x3.0 RF pad -40°C +85°C LCC 30 pins RED

LE70-868 / 915 P2P, Star network, I/O copy, Adressed secured mode 863 - 870 MHz 902 - 928 MHz 1.2 - 115.2 UART

GPIO, ADC 4.8 to 57.6 Kbps 2.3- 3.6 Stand by <2µA 27 27 26x15x3.0 RF pad -40°C +85°C LCC 30 pins RED

FCC/IC/ANATEL

EN13

757

Wir

eles

s M

-Bus

ME50-868 Wireless MBUS part 4 2013: S,T,C modes 863 - 870 MHz 1.2 - 115.2 UART GPIO, ADC 4.8 to 100 Kbps 2- 3.6 Stand by <2µA 14 26x15x3.0 RF pad -40°C +85°C LCC 30 pins RED

ME50 / ME70 -169 Wireless MBUS part 4 2013: N modes 169 - 170 MHz 1.2 - 115.2 UART GPIO, ADC 2.4 to 19.2 Kbps 2.3- 3.6 Stand by <2µA 15.5

30 26x15x3.0 RF pad -40°C +85°C LCC 30 pins RED

IEEE

802

.15.

4 Zi

gbee

®

ZE51 / ZE61 -2.4 Zigbee Pro 2.4 - 2.49 GHz Up to 115.2 UART GPIO, ADC 250 Kbps 2- 3.6 Stand by <2µA 4

20 26x15x3.0 RF PAD or Integrated -40°C +85°C LCC 30 pins RED

FCC/IC/ANATEL



ADIO

TEC

HN

OLO

GY

FOR

M F

ACTO

R

LPWA (UNLICENSED BANDS) IoT MODULES

Pic

ture

– B

ack

side

Embe

dded

Sta

ck O

ptio

n

Freq

uenc

y ba

nd

Seri

al s

peed

(Kbp

s)

Inte

rfac

es

Rad

io D

ata

Rat

e

Pow

er S

uppl

y (V

)

Idle

pow

er s

avin

g

Out

put P

ower

(dB

m)

Size

(mm

)

Ante

nna

conn

ectio

n

Tem

pera

ture

ran

ge

Mou

ntin

g

Cer

tific

atio

n

SIG

FOX®

R

eady

Embe

dded

LE51-868 SStar network, I/O copySigfoxOver the air update

863 - 870 MHz 1.2- 115.2 UART GPIO, ADC

2.4 to 100Kbps 100b/s (Sigfox) 2- 3.6 Stand by <2µA 15.5 26x15x3.0 RF pad -40°C +85°C Half Moon, 30pins RED

LoR

a ®

+ B

LE4.

2

RE866A1

LoRa: LoRaWan 1.02 BLE4.2• Terminal I/O ( BLE SPP like) • GATT central + peripheral role• NFC Handover• LE Secure Connections (LESC)• Configurable DIS (Device Information Service)• LE Data Length ExtensionOver the air update

863 - 870 MHz 2.4 - 2.49 GHz 9.6 - 921 UART

I2C, GPIO, ADCSF7 to SF12

1Mb/s 2- 3.6 Stand by <1µA

LoRA: Up to

19 BLE: -23 to

+5

15x19x2.2 RF PAD: LoRa Integrated: BLE -40°C +85°C LGA, 49pins RED, BLE4.2, LoRa Alliance

Wir

epas

BlueMod+W42 Wirepas Mesh network 2.4 -2.49 GHz 9.6 - 921 UART I2C, GPIO, ADC 1Mb/s 1.7- 3.6 Stand by <1µA -23 to

+5 10x17x2.6 Integrated -40°C +85°C LGA, 49pins RED

IoT MODULE SERVICES

TELIT IoT APPZONE TSM – TELIT SOFTWARE MANAGEMENTTelit Software Management is a premium service enabling Telit customers to OTA manage their device software.

Accelerate innovation using framework and tools to access the full power of the IoT module.

IoT AppZone simplifies the design of your products and using Telit IoT Services allows you to manage the full lifecycle of your applications and software components.

Rely on powerful development tools, professional grade framework and APIs, built in IoT cloud services support.

Over the air software update service supports all previous generations of Telit modules and new 3G and 4G platforms.


PRODUCT POWER SUPPLY RF SENSITIVITY ENVIRONMENTAL CONSTELLATIONS FEATURES INTERFACES R

ADIO

TEC

HN

OLO

GY

FO

RM

FAC

TOR

POSITIONING & TIMING

Pic

ture

– B

ack

side

Chi

p So

lutio

n

Supp

ly r

ange

(V)

Pow

er A

CQ

(mW

)

Pow

er T

rack

(mW

)

Pow

er b

Kup

(µW

)

ACQ

Sen

sitiv

ity

NAV

Sen

sitiv

ity

TRAC

K S

ensi

tivity

Size

(m

m)

Ante

nna

Size

Tem

pera

ture

R

ange

Mou

ntin

g

GP

S / Q

ZSS

GLO

NAS

S

Gal

ileo

Bei

dou

Mem

ory

max

upd

ate

rate

(Hz)

Bar

o

Acc

+ G

yro

LNA

DC

Blo

ck

MEM

S Po

rt

GP

IO

UAR

T

SPI

I2C

USB

PO

SITI

ON

ING

GP

SEm

bedd

ed

JF2SS4

1.8 83 67 25 -148 -160 -163 11 x 11 x 2.4

N/A -40°C to +85°C SMT

• F / R / EE 5

• • • • •

JN3 3-3.6 135 106 132 -148 -160 -163 12.2 x 16 x 2.4 • • • •

SL871-SMT3337

3-4.3

51 45 21 -144 -159 -163

10.1 x 9.7 x 2.4•

R 10

•

SL871L-S 64 54 21 -147 -161 -164 • • • •

SL869L-V2S MT3337 64 54 21 -148 -161 -162 12.2 x 16 x 2.4 • • • •

GN

SS

SE868-V3SS5B02 1.8

76 70 69 -148 -163 -165 11 x 11 x 2.6

N/A -40°C to +85°C SMT

• • • •

F 10

• • • • •

SE873Q5 101 77 62 -146 -161 -167 7 x 7 x 1.85 • • • • • • • • •

SL871MT3333 3-4.3

76 66 21 -145 -159 -162

10.1 x 9.7 x 2.4• • • • • • •

SL871L 86 76 21 -147 -160 -163 • • • • • • • • •

SL869 Teseo 2 3-3.6 221 139 241 -146 -158 -162

12.2 x 16 x 2.4

• • • • • • • •

SL869L-V2 MT3333 3-4.3 86 76 23 -148 -160 -162 • • • • • • • •

SL869-V3 Teseo 3 3-3.6 171 147 251 -147 -158 -162 • • • • • • • • •

SMA

RT

AN

TEN

NA G

NSS

SE868K3-AMT3333

3-4.3

111 99 59 -148 -161 -164 11 x 11 x 6.1 9 x 9 x 4

-40°C to +85°C SMT

• • • F

10

• • • •

SE868K3-AL 111 99 59 -146 -157 -157 11 x 11 x 4.1 9 x 9 x 2 • • • • • • •

GP

S

SE868K7-A MT3337

85 71 21 -148 -163 -164 11 x 11 x 6.1 9 x 9 x 4 • R

• •

SE868K7-AL 85 71 21 -148 -159 -160 11 x 11 x 4.1 9 x 9 x 2 • • •

GN

SS

SC872-A MT3333 99 86 56 -148 163 -164 21 x 22 x 6.8 21 x 22 x 4 -30°C to +70°C CONN • • • • F

• •

SL876Q5-A SS5B02 1.8 84 70 68 -148 -161 -165 11 x 11.9 x 2.15 8 x 3 x 1.3 -40°C to +85°C SMT • • • • • • • • • •

DEA

DR

ECK

OG

NIN

G

SL869-3DR

Teseo 3 3-3.6

188 158 218 -147 -158 -162

12.2 x 16 x 2.4 N/A -40°C to +85°C SMT

• • • • F 10

• • • • • • •

SL869-ADR 188 158 221 -147 -158 -162 • • • • • • • • • •

TIM

ING

SL869-T Teseo 2 3-3.6 221 139 241 -146 -158 -162 12.2 x 16 x 2.4 N/A -40°C to +85°C SMT • • • F 10 • • • •

F = Flash R = ROM EE = EEPROM


TEC

HN

OLO

GY

FORM

FAC

TOR

EVALUATION KIT

Des

igne

d to

Pow

er S

uppl

y Au

tom

otive

Set

Pow

er S

uppl

y La

bora

tory

Set

Pow

er S

uppl

y Po

rtab

le S

etup

OV p

rote

ctio

n/

Reve

rse

pola

rity

prot

ectio

n

LED

Indi

cato

r

SIM

Car

d Ho

ld

GPIO

(o

n In

terf

ace

boar

d)

Inte

rfac

e

Spea

ker O

utpu

t

Mic

roph

one

line

(INT

/ EXT

)

Earp

iece

Out

put

EVA

LUAT

ION

KIT

Cel

lula

rCo

mpa

ct

Embe

dded

EVK 2

Develop and test applications via AT commands through serial ports or USB• Program and/or update any Telit module• Debug and/or improve applications based on Telit modules• Implement simple applications with Appzone interpreter-

equipped modules, without the need for an external microprocessor

5 - 40 V + 3.8 V fixed supply

Rechargeable Li-Ion

battery pack

On all Input DC

lines

2 • • • 2 x RS232• 2 x USB

Opt.1: 10 mW / 16 W max Opt.2: 675 mW / 8 W max

1 x Single-Ended

Max 10 mW / 16 W 1 x Single-

Ended

EVK 4

Deploy any end-to-end IoT proof of concept in a single IoT platform• The Rapid IoT Development Kit comes in both a stand-alone

mode via Telit’s on-module local processing power (HE910 x 3G) and an interface mode with Open Hardware Platforms such as TI launch Pad, Raspberry PI, and Arduino.

• The Kit provides the easiest way to plug into the powerful deviceWISE IoT platform.

• Temperature Sensors and Accelerometers help you collect data from your environment

N/A

• External DC power supply (2.2 - 16.3 V)

• External boards (3.3 - 5.0 V)

• USB port (5.0 V)

Battery (3.7 V)

On all Input DC

lines

6 (3 Program-

mable)• •

• Headers for TI LaunchPad, Raspberry PI 2, Arduino shields• RS232 / Mini USB serial ports• 2 potentiometers/ 2 latch switches

N/A: Only Digital Audio available

EVB

Develop and test applications via AT commands through serial ports or USB• Program and/or update any Telit module• Debug and/or improve applications based on Telit modules• Implement simple applications with Appzone interpreter-

equipped modules, without the need for an external microprocessor

6-15V + 3.8 V fixed supply

Rechargeable Li-Ion

battery pack

On all Input DC

lines

2 • •

• Control switches• USB interface• UART interface (2x)• Micro SD card interface• JTAG interface• Thermal monitoring & cooling• IO connectors (ADC, DVI, I2C, SPI, GPIO1, GPIO2)• Extension connector

2.5W@8 ohm / 4W@4 ohm

• 3.5mm stereo audio jack

• RJ11 Terminal phone type mono audio socket

2.5W@8 ohm / 4W@4 ohm

Posi

tioni

ng &

Tim

ing SL869-ADR GNSS

Automotive DR EVKDevelop and test Automotive Dead Reckoning Through

USB powerThrough USB

powerThrough USB

power N/A 2 N/A N/A USB, SMA RF, SMA PPS N/A N/A N/A

SL869-T EVK GNSS Timing Develop and test Precise timing applications Through USB power

Through USB power

Through USB power N/A 2 N/A N/A USB, SMA RF, SMA PPS N/A N/A N/A

SE868-V3 EVK GNSS Develop and test multi-constellation navigation applications Through USB power

Through USB power

Through USB power N/A 3 N/A N/A USB, SMA RF N/A N/A N/A

SL871L-S EVK GPS Develop and test GPS navigation applications Through USB power

Through USB power

Through USB power N/A 2 N/A N/A USB, SMA RF N/A N/A N/A

Wi-

Fi

GS2200M Starter Kit Board (SKB)

Evaluate and develop applications based on the GS2200M ultra-low-power Wi-Fi modules. Supports development of either host-less or hosted designs.

USB, battery (2-AA),

Arduino host (+5V) or bench

supply

USB, battery (2-AA), Arduino host (+5V) or bench supply (+3.3V)

2 AA Battery N/A

Software accessible

buttons (3) and LEDs (2)

N/A Arduino Header

• Pre-loaded with Temperature and Light Sensor firmware• Apple® HomeKit™ compatible • Arduino™-compatible interface• Pmod™-compatible UART, SPI and I2C interfaces• Built-in temperature and light sensors• Built-in power measurement support • Software accessible buttons (3) and LEDs (2)• Built-in USB serial debug and flash programming port• JTAG debugger interface

Yes N/A N/A

GS2101M Evaluation Board (EVB)

Evaluate and develop applications based on the GS2101M ultra-low-power Wi-Fi modules. Supports development of either host-less or hosted designs.

USB, or bench supply (+3.3V)

USB, or bench supply (+3.3V) N/A N/A

Power, Run/Program, UART, and

GPIOs

N/A

36 Header

on board

• Supports multiple serial ports• Two 12-bit ADCs• Temperature and light sensors • Comes programmed with Serial-to-WiFi

software, Wi-Fi security, WPS and networking stack

• Push button for WPS, Alarms, Factory Restore, and Reset

• JTAG interface• Daughter card connector

Yes N/A N/A

Blu

eMod BlueEva Develop and test all BlueMod modules Through USB

power Through USB power Battery (3.7 V) N/A 3 N/A • USB, UART, JTAG, extension connectors, control switches, 1 x NFC Antenna Class6/V1.0, push buttons, reset, buzzer N/A N/A N/A

BlueDev Development Kit for Bluetooth Modules Nordic based Through USB power Through USB power Battery (3.7 V) N/A 3 N/A • USB, UART, JTAG, extension connectors, control switches, 1 x NFC

Antenna Class6/V1.0, push buttons, reset, buzzer N/A N/A N/A

Any Market. Any Industry. Anywhere.

ENABLING END-TO-END IoT SOLUTIONS

Telit reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. The information contained herein is provided “as is”. No warranty of any kind, either express or implied, is made in relation to the accuracy, reliability, fitness for a particular purpose or content of this document. This document may be revised by Telit at any time. For most recent documents, please visit www.telit.com Copyright © 2017, Telit[0

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