Investigation of Valve Effects on Wafer Defectivity using ...
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Investigation of Valve Effects on Wafer Defectivity using an Oxide Slurry
Budge Johl and Hethel Porter“2007 3rd Annual Levitronix CMP
User Conference”Rohm and Haas Electronic Materials
CMP Technologies Phoenix, AZ
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Outline
Objective of Study
Experimental Setup
Historical Data
Analytical Results & Discussion
Polishing Results
Summary
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Objective
Test New Valve vs. Old Valve Technologies on Oxide Slurry Shear Effects.
Collect Analytical Data to Ascertain any Shifts in Slurry Health.
Polish Wafers and Review Polishing Performance Effects of Valve Technologies.
Acknowledgements:
Parker Hannifin Corp. (Valves)
Levitronix (Pump)
Rohm and Haas (CMPIC Polishing Lab.)
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New Valve Technology
OLD TECHNOLOGY
NEW! TECHNOLOGY
Tongue & Groove caused Areas for Slurry to Cake Up and Cause Premature Failure and Leak by
Enhanced Flow CharacteristicsNo Areas for Entrapment or Agglomeration
Slide Courtesy of Parker Hannifin Corp.
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Sample Port
MaglevPump
SlurryTank
Valve Actuator
Test Valve
Experimental Setup
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PolishingPolishing Tool Used:
Applied Materials Mirra®
Wafer Type:TEOS Blanket Wafers
Slurry:Klebosol™ 1501-50 Oxide Slurry
Pads:IC1010™
Politex™
Suba™
Conditioner:DiaGrid™
Klebosol is a registered trademark of AZ Electronic Materials
IC1010, Suba, and Politex are tradmarks of Rohm and Haas Company or its affiliates,
DiaGrid is a registered trademark of Kinik Co.
Mirra is a Registered Trademark of Applied Materials, Inc.
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Historical Large Particle Size ResultsOxide Slurry
Levitronix Pump (Without Valves)
Micron Size (µ)
0 5 10 15 20
Cum
ulat
ive
Cou
nts
> D
iam
eter
0
500
1000
1500
2000
Time 0 HourTime 24 Hour (~3x > Turnovers)
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Historical Pump Results without Valves
Oxide RR and Defectivity Response
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
Defect Counts RR
Wafer Results
Nor
mal
ized
Val
ues
STANDARD (0 Hour)
LEVITRONIX (336 Hour)
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Analytical Lab Testing
Laboratory Analysis:
Large & Mean Particle Size
Zeta Potential
Conductivity
pH
Viscosity
Density
Total Percent Solids
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Large Particle Size Results
Parker Old Valve vs. New ValveTechnologyLevitronix Pump Recirculated Oxide Slurry
Micron Size (µ)
0 1 2 3 4 5
Cum
ulat
ive
Cou
nts
> D
iam
eter
0
200
400
600
800
1000
Old Valve Delta (24 Hour)New Valve Delta (24 Hour)
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Delta of LPD
ANOVA Analysis
Data Shows Significant Difference Between Valve Technologies
0
500
1000
1500
2000
2500
Del
ta P
artic
le S
ize
(u)
New Old
Valve Type
Each PairStudent's t0.05
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Possible Effects of LPD Shift
Effects of Slurry Shear:
Increase in LPD’s
Decreased Filter Life
Distribution System Cleanliness
Day-tanks
Valves, Pneumatic & Manual
Synergistic Effects with Poor Pumps
May Effect Wafer Defectivity Over Time
May Influence RR & % NU
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Filter Life Reduction
0
100
200
300
400
500
600
700
800
900
9:56:07 AM 9:58:59 AM 10:01:54 AM 10:04:49 AM 10:07:44 AM 10:10:39 AM 10:13:34 AM
Time
Flow
(mL/
min
)
0
5
10
15
20
25
30
35
Del
ta P
(psi
)
Flow(L/min)Delta-Pressure(psig)
Filter Life can be Reduced with Increased Slurry and Gels and Agglomerations
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Mean Particle Size (nm)
ANOVA Analysis
No Significant Difference between New and Old Valves on Mean Particle Size Distribution
70
72
74
76
78
80
82
84
Mea
n P
artic
le S
ize
(nm
)
New Valve Old Valve
Valve Type
Each PairStudent's t0.05
Mean Particle Size (nm) of New vs. Old Valve
25
45
65
85
105
125
0 5 10 15 20 25
Sampling Time (hr)
MP
S (n
m)
New Valve Old Valve
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Zeta Potential (mV)
ANOVA Analysis
No Significant Difference between New and Old Valves on Zeta Potential
-36
-36.2
-36.4
-36.6
-36.8
-37
Zeta
Pot
entia
l (m
V)
New Valve Old Valve
Valve Type
Each PairStudent's t
0.05
Zeta Potential (mV) of New vs. Old Valve
-40.00
-38.00
-36.00
-34.00
-32.00
0 5 10 15 20 25
Sampling Time (hr)
Zeta
Pot
entia
l (m
V)
New Valve Old Valve
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Conductivity
ANOVA Analysis
No Significant Difference between New and Old Valves on Conductivity
2900
2950
3000
3050
3100
3150
3200
Con
duct
ivity
(uS
/cm
)
New Valve Old Valve
Valve Type
Each PairStudent's t0.05 Conductivity (uS/cm) of New vs. Old Valve
2000
2500
3000
3500
4000
0 5 10 15 20 25
Sampling Time (hr)
Con
duct
ivity
(uS
/cm
) New Valve Old Valve
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pH
ANOVA Analysis
No Significant Difference between New and Old Valves on pH
10.5
10.6
10.7
10.8
10.9
pH
New Valve Old Valve
Valve Type
Each PairStudent's t
0.05pH of New vs. Old Valve
10.5
10.6
10.7
10.8
10.9
0 5 10 15 20 25
Sampling Time (hr)
pH
New Valve Old Valve
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Viscosity
ANOVA Analysis
No Significant Difference between New and Old Valves on Viscosity
2
2.1
2.2
2.3
Vis
cosi
ty (c
P)
New Valve Old Valve
Valve Type
Each PairStudent's t
0.05 Viscosity (cP) of New vs. Old Valve
0.00
1.00
2.00
3.00
4.00
5.00
0 5 10 15 20 25
Sampling Time (hr)
Vis
cosi
ty (c
P)
New Valve Old Valve
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Density
ANOVA Analysis
No Significant Difference between New and Old Valves on Density
1.19
1.195
1.2
1.205
1.21
1.215
1.22
Den
sity
(g/m
L)
New Valve Old Valve
Valve Type
Each PairStudent's t0.05
Density of New vs. Old Valve
1.200
1.202
1.204
1.206
1.208
1.210
0 5 10 15 20 25
Sampling Time (hr)
Den
sity
(g/m
L)
New Valve Old Valve
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Total Percent Solids
No Significant Difference between New and Old Valves on Total Percent Solids
ANOVA Analysis
30.5
30.75
31
31.25
31.5
Tota
l Per
cent
Sol
ids
New Valve Old Valve
Valve Type
Each PairStudent's t0.05 Total Percent Solids of New vs. Old Valve
30
30.5
31
31.5
32
0 5 10 15 20 25
Sampling Time (hr)
Tota
l Per
cent
Sol
ids New Valve Old Valve
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ANOVA Analysis of Removal Rate and % NU
% NU
No Significant Difference on RR and %NU
Normalized Removal Rate
0.985
0.995
1.005
1.015
1.025
Nor
mal
ized
RR
Filtered New Valve Unfiltered-Control Old ValveEach PairStudent's t
0.05
1
1.5
2
2.5
3
3.5
4
% N
U
Filtered New Valve Unfiltered-Control Old Valve Each PairStudent's t0.05
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Defectivity
Filtered Unfiltered - Control New Valve Old Valve
No Significant Difference on Defect Counts
ANOVA Analysis
0.5
0.75
1
1.25
1.5
Nor
mal
ized
Def
ect C
ount
Filtered New Valve Unfiltered-Control Old Valve Each PairStudent's t
0.05
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Summary
Increase in Large Particle Size Distribution was Evident with Old Valve Technology
This Shift can Decrease Filter Lifetimes
Distribution System Cleanliness can be Effected
The Data Shows that Polishing Results Showed No Significant Differences in:
Defectivity
RR
% NU
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Summary
Synergistic Response on Wafer Defectivity may be more Evident if:
Old Valve Technologies are Coupled with Shear-causing Distribution Systems
Number of Valves in the Distribution System
Slurry Distribution System Resident Time
Wafer Defectivity may Vary with Specific Slurry Chemistries
THANK YOU FOR YOUR TIME
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