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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense MPU-9150 1 21 rue La Nouë Bras de Fer 44200 Nantes - France Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr November 2012- Version 2 Written by: Sylvain HALLEREAU DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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  • 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense MPU-9150 1

    21 rue La Nou Bras de Fer 44200 Nantes - France

    Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr

    November 2012- Version 2

    Written by: Sylvain HALLEREAU

    DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

    estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

    made of the contents of this report. The quoted trademarks are property of their owners.

    http://www.systemplus.fr/http://www.systemplus.fr/http://www.systemplus.fr/

  • 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense MPU-9150 2

    Table of Contents

    1. Overview / Introduction 3

    Executive Summary

    Reverse Costing Methodology

    2. Company Profile 5

    3. Physical Analysis 13

    Synthesis of the Physical Analysis

    Physical Analysis methodology

    Package characteristics & markings

    Package opening

    Package Opening : Dies Bonding

    Package Cross Section

    Invensense ASIC Marking

    Invensense ASIC Dimensions

    Invensense ASIC minimal dimensions

    Invensense ASIC Cross section

    Invensense ASIC Process Characteristics

    Invensense MEMS marking

    Invensense MEMS Opening

    Invensense MEMS Sensing Area

    Invensense MEMS Cap

    Invensense MEMS Process Characteristics

    Magnetometer marking

    Magnetometer Dimensions

    Magnetometer Cross Section

    Magnetometer Process Characteristics

    4. Manufacturing Process Flow 84

    Global view

    Process Flow Accelerometer ASIC

    Process Flow MEMS Accelerometer

    Process Flow Magnetometer

    Process Flow Packaging

    Description of the Wafer Fabrication Unit

    5. Cost Analysis 102

    Synthesis of the cost analysis

    Methodology

    Hypothesis

    Yield Synthesis

    Invensense ASIC Wafer Cost

    Invensense ASIC Die Cost Data

    MEMS Accelerometer Wafer Cost

    MEMS Accelerometer cost per Steps

    MEMS Accelerometer Equipment cost

    MEMS Accelerometer Material cost

    MEMS Accelerometer Die Cost

    Magnetometer Wafer Cost

    Magnetometer cost per Steps

    Magnetometer Material cost

    Magnetometer Die Cost

    Back-End : Package Cost

    Back-End : Package Cost Per Steps

    Back-End : Package Material cost

    Back-End : Final Test

    MPU9150 Manufacturing Cost

    Cost Analysis Evolution over yield

    6. Estimated Selling Price Analysis 148

    Supply Chain Analysis

    Estimated Selling Price

    Price Evolution according to the yield

    Glossary

    Contacts

    http://www.systemplus.fr/http://www.systemplus.fr/

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    Package Characteristics & Markings

    Package type : LGA-24pins

    Dimensions : 4.00mm x 4.00mm x 1.00mm

    Pin pitch : 0.5mm

    Package Top view

    Package Back view

    4.00mm

    1.00mm

    0.50mm

    Package Side view

    4.00mm

    4.00mm

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    Package Opening : Optical View

    Package Opening :Main Parts

    Package Opening : Optical view

    Package opening reveals two chips bonded to

    the package susbstrate by wire bonding

    process.

    ASIC

    Magnetic concentrator

    Magnetometer

    Y-axis

    magnetometer

    MEMS Accelerometer + Gyroscope

    Magnetometer

    MEMS Accelerometer + Gyroscope

    ASIC

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  • 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense MPU-9150 5

    Package Cross Section

    Package cross-section : SEM view

    LGA substrate : SEM view

    xxm

    xxm

    xxm

    xxm

    xxm

    xxm

    xxm

    xxm xxm

    ASIC

    Magnetometer Cap

    Sensor

    Solder mask

    LGA Substrate

    Copper

    Solder

    xxm

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    Capacitive

    electrodes

    Proof mass ASIC Cavity

    X-Axis Gyro Tilt View

    Interdigitated electrodes SEM View

    MEMS Sensor X-Axis Gyro

    Bar linkage

    Bar

    linkage

    X Axis Gyroscope SEM view

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    Package Cross Section

    ASIC

    Magnetic

    concentrator

    Magnetometer

    MEMS inertiel

    Cap

    Sensor

    LGA24 substrate

    2 layers

    LGA 24 package

    Package cross-section : Optical view

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    AA' Cross Section Overview

    Cap

    Sensor

    ASIC

    The ASIC wafer and

    Sensor wafer are bonded

    together using an

    Aluminum/Germanium

    Eutectic bonding process.

    Germanium

    The Cap wafer and Sensor

    wafer are bonded together

    using an a fusion bonding

    process.

    Oxide

    Component Cross-Section AA

    Saw cut

    sign

    Germanium

    Oxide

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    Bonding Cap & Sensor

    Bonding ASIC & Sensor

    Cross Section SEM View

    Cap

    Sensor

    Oxide

    Total oxide thickness ~ 2m

    Germanium thickness ~0.25m

    Germanium

    Sensor

    ASIC

    Component Cross-Section AA

    Germanium connects electrically the MEMS

    Sensor and ASIC Aluminum metallization.

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    AK8975 Hall Sensors

    AK8975 Overview

    Hall captor details Optical View

    Hall captor Optical View

    Metal 1

    Metal 2

    Metal 3

    Si

    p-substrate

    Hall sensor

    http://www.systemplus.fr/http://www.systemplus.fr/

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    Die Cost

    The final die cost ranges from $xxx to $xxx according to yield variations.

    The back-end 0 cost (probe test and dicing) represents 2% of the cost of the die.

    The yield losses costs due to probe and dicing represents 20% of the total manufacturing cost.

    The die cost includes the rejects at

    probe test and dicing.

    The yield losses represents the

    defective dies which are rejected.

    Low Yield Medium Yield High Yield

    Cost Breakdown Cost Breakdown Cost Breakdown

    FE : ASIC Cost29%

    FE : MEMS Cost14%

    FE : ASIC/MEMS Assembly Cost

    9%

    Foundry Overhead Cost48%

    Die Cost Breakdown (Medium Yields)

    FE : ASIC Cost 19.4% 22.7% 26.2%

    FE : MEMS Cost 10.7% 11.0% 11.2%

    FE : ASIC/MEMS Assembly Cost 8.5% 7.1% 5.4%

    Foundry Overhead Cost 35.7% 37.6% 39.5%

    BE 0 : Probe Test + Dicing Cost 1.8% 2.1% 2.5%

    BE 0 : Yield losses 23.8% 19.5% 15.2%

    Die Cost 100% 100% 100%

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    Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates.

    Given the hypothesis presented in this analysis the major sources of correction would lead to

    a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

    IC +/- 8%

    MEMS +/- 5%

    Packaging +/- 10%

    Test +/- 20%

    These results are open for discussion. We can re-evaluate this component with your

    information. Please contact us:

    Conclusion

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