2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense MPU-9150 1

21 rue La Nou Bras de Fer 44200 Nantes - France

Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr

November 2012- Version 2

Written by: Sylvain HALLEREAU

DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic

estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is

made of the contents of this report. The quoted trademarks are property of their owners.

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Table of Contents

1. Overview / Introduction 3

Executive Summary

Reverse Costing Methodology

2. Company Profile 5

3. Physical Analysis 13

Synthesis of the Physical Analysis

Physical Analysis methodology

Package characteristics & markings

Package opening

Package Opening : Dies Bonding

Package Cross Section

Invensense ASIC Marking

Invensense ASIC Dimensions

Invensense ASIC minimal dimensions

Invensense ASIC Cross section

Invensense ASIC Process Characteristics

Invensense MEMS marking

Invensense MEMS Opening

Invensense MEMS Sensing Area

Invensense MEMS Cap

Invensense MEMS Process Characteristics

Magnetometer marking

Magnetometer Dimensions

Magnetometer Cross Section

Magnetometer Process Characteristics

4. Manufacturing Process Flow 84

Global view

Process Flow Accelerometer ASIC

Process Flow MEMS Accelerometer

Process Flow Magnetometer

Process Flow Packaging

Description of the Wafer Fabrication Unit

5. Cost Analysis 102

Synthesis of the cost analysis

Methodology

Hypothesis

Yield Synthesis

Invensense ASIC Wafer Cost

Invensense ASIC Die Cost Data

MEMS Accelerometer Wafer Cost

MEMS Accelerometer cost per Steps

MEMS Accelerometer Equipment cost

MEMS Accelerometer Material cost

MEMS Accelerometer Die Cost

Magnetometer Wafer Cost

Magnetometer cost per Steps

Magnetometer Material cost

Magnetometer Die Cost

Back-End : Package Cost

Back-End : Package Cost Per Steps

Back-End : Package Material cost

Back-End : Final Test

MPU9150 Manufacturing Cost

Cost Analysis Evolution over yield

6. Estimated Selling Price Analysis 148

Supply Chain Analysis

Estimated Selling Price

Price Evolution according to the yield

Glossary

Contacts

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Package Characteristics & Markings

Package type : LGA-24pins

Dimensions : 4.00mm x 4.00mm x 1.00mm

Pin pitch : 0.5mm

Package Top view

Package Back view

4.00mm

1.00mm

0.50mm

Package Side view

4.00mm

4.00mm

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Package Opening : Optical View

Package Opening :Main Parts

Package Opening : Optical view

Package opening reveals two chips bonded to

the package susbstrate by wire bonding

process.

ASIC

Magnetic concentrator

Magnetometer

Y-axis

magnetometer

MEMS Accelerometer + Gyroscope

Magnetometer

MEMS Accelerometer + Gyroscope

ASIC

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Package Cross Section

Package cross-section : SEM view

LGA substrate : SEM view

xxm

xxm

xxm

xxm

xxm

xxm

xxm

xxm xxm

ASIC

Magnetometer Cap

Sensor

Solder mask

LGA Substrate

Copper

Solder

xxm

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Capacitive

electrodes

Proof mass ASIC Cavity

X-Axis Gyro Tilt View

Interdigitated electrodes SEM View

MEMS Sensor X-Axis Gyro

Bar linkage

Bar

linkage

X Axis Gyroscope SEM view

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Package Cross Section

ASIC

Magnetic

concentrator

Magnetometer

MEMS inertiel

Cap

Sensor

LGA24 substrate

2 layers

LGA 24 package

Package cross-section : Optical view

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AA' Cross Section Overview

Cap

Sensor

ASIC

The ASIC wafer and

Sensor wafer are bonded

together using an

Aluminum/Germanium

Eutectic bonding process.

Germanium

The Cap wafer and Sensor

wafer are bonded together

using an a fusion bonding

process.

Oxide

Component Cross-Section AA

Saw cut

sign

Germanium

Oxide

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Bonding Cap & Sensor

Bonding ASIC & Sensor

Cross Section SEM View

Cap

Sensor

Oxide

Total oxide thickness ~ 2m

Germanium thickness ~0.25m

Germanium

Sensor

ASIC

Component Cross-Section AA

Germanium connects electrically the MEMS

Sensor and ASIC Aluminum metallization.

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AK8975 Hall Sensors

AK8975 Overview

Hall captor details Optical View

Hall captor Optical View

Metal 1

Metal 2

Metal 3

Si

p-substrate

Hall sensor

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Die Cost

The final die cost ranges from $xxx to $xxx according to yield variations.

The back-end 0 cost (probe test and dicing) represents 2% of the cost of the die.

The yield losses costs due to probe and dicing represents 20% of the total manufacturing cost.

The die cost includes the rejects at

probe test and dicing.

The yield losses represents the

defective dies which are rejected.

Low Yield Medium Yield High Yield

Cost Breakdown Cost Breakdown Cost Breakdown

FE : ASIC Cost29%

FE : MEMS Cost14%

FE : ASIC/MEMS Assembly Cost

9%

Foundry Overhead Cost48%

Die Cost Breakdown (Medium Yields)

FE : ASIC Cost 19.4% 22.7% 26.2%

FE : MEMS Cost 10.7% 11.0% 11.2%

FE : ASIC/MEMS Assembly Cost 8.5% 7.1% 5.4%

Foundry Overhead Cost 35.7% 37.6% 39.5%

BE 0 : Probe Test + Dicing Cost 1.8% 2.1% 2.5%

BE 0 : Yield losses 23.8% 19.5% 15.2%

Die Cost 100% 100% 100%

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Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates.

Given the hypothesis presented in this analysis the major sources of correction would lead to

a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)

IC +/- 8%

MEMS +/- 5%

Packaging +/- 10%

Test +/- 20%

These results are open for discussion. We can re-evaluate this component with your

information. Please contact us:

Conclusion

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