InvenSense MPU-6000 - System Plus · 2017. 1. 12. · InvenSense –MPU-6000 7 AA' Cross Section...
Transcript of InvenSense MPU-6000 - System Plus · 2017. 1. 12. · InvenSense –MPU-6000 7 AA' Cross Section...
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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense – MPU-6000 1
9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France
Phone : +33 (0) 240 180 916 - email : [email protected] - website : www.systemplus.fr
October 2011 - Version 1
Written by: Maher SAHMIMI
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic
estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is
made of the contents of this report. The quoted trademarks are property of their owners.
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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense – MPU-6000 2
Table of Contents
1. Overview / Introduction……………………….…........………3
– Executive Summary
– Reverse Costing Methodology
2. Company Profiles ………………………………....…………...6
3. Physical Analysis………………………………......…………10
– Physical Analysis Methodology
– Package Characteristics & Markings
– Pin Out and Signal Description
– Block Diagram
– Package X-Ray
– Package Opening
– Package Cross-Section
– Device Structure 20
– Die Dimensions
– MEMS Sensor 22
– MEMS Sensor -3-Axis Gyroscope
– MEMS Sensor -X-Axis Gyroscope
– MEMS Sensor -Y-Axis Gyroscope
– MEMS Sensor -Z-Axis Gyroscope
– MEMS Sensor -3-Axis Accelerometer
– ASIC Marking 32
– ASIC Bond Pad
– ASIC Cavities
– ASIC Delayering
– ASIC Logic Area
– ASIC Memory
– Component Cross-Section 41
– Cap View
– Physical Data Summary 50
4. Manufacturing Process Flow…………………………..…51
– Global Overview
– MEMS Process Overview
– ASIC Process Characteristics
– ASIC Process Characteristics
– ASIC Process Flow
– MEMS Process Flow
– Description of the Wafer Fabrication Units
5. Cost Analysis……………………………………………..…64
– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Supply Chain Analysis
– Yields Explanation
– Yields Hypothesis 70
– ASIC Front-End Cost (CMOS)
– ASIC Front-End Cost ( Cavities)
– ASIC Front-End Cost ( CMOS+ Cavities)
– MEMS Front-End Cost 76
– MEMS FE Cost per Steps
– MEMS Wafer : Equipment Cost per Family
– MEMS Wafer : Consumable Cost per Family
– Total Wafer Cost 86
– MEMS Die cost
– Component Packaging Cost 89
– Component Final Test Cost
6. Estimated Price Analysis …………………………………92
– Manufacturers financial ratios
– Estimated manufacturer Price
– Estimated Selling Price
Conclusion
Glossary
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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense – MPU-6000 3
Package Characteristics & Markings
Package Top view
40 pins QFN Package
Back view
0.9mm
Package Side view
• Package type: 24-pin QFN
• Dimensions: 4.0mm x 4.0mm x 0.9mm
• Pin pitch: 0.5mm
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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense – MPU-6000 4
• The ASIC die is glued on the leadframe and connected to the substrate by wire
bonding .
Package Opening
Package Opening optical Views
Package Opening SEM Views
MEMS
ASIC
ASIC
MEMS
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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense – MPU-6000 5
Package Cross section
MEMS CAP
ASIC
MEMS Gyroscope
Leadframe
Package
MEMS Accelerometer
The package is a standard QFN package
Package Cross section
MEMS CAP
MEMS Sensor
ASIC
Wafer Thickness (µm)
ASIC xxx
MEMS Sensor xxx
MEMS Cap xxx
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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense – MPU-6000 6
Capacitive
electrodes
Proof mass ASIC Cavity
X-Axis Gyro– Tilt View
Interdigitated electrodes SEM View
MEMS Sensor – X-Axis Gyro
Bar linkage
Bar
linkage
X Axis Gyroscope SEM view
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© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. InvenSense – MPU-6000 7
AA' Cross Section Overview
Cap
Sensor
ASIC
The ASIC wafer and
Sensor wafer are bonded
together using an
Aluminum/Germanium
Eutectic bonding process.
Germanium
The Cap wafer and Sensor
wafer are bonded together
using an a fusion bonding
process.
Oxide
Component Cross-Section AA’
Saw cut
sign
Germanium
Oxide
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Bonding Cap & Sensor
Bonding ASIC & Sensor
Cross Section SEM View
Cap
Sensor
Oxide
Total oxide thickness ~ 2µm
Germanium thickness ~0.25µm
Germanium
Sensor
ASIC
Component Cross-Section AA’
Germanium connects electrically the MEMS
Sensor and ASIC Aluminum metallization.
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Die Cost
• The final die cost ranges from $xxx to $xxx according to yield variations.
• The back-end 0 cost (probe test and dicing) represents 2% of the cost of the die.
• The yield losses costs due to probe and dicing represents 20% of the total manufacturing cost.
– The die cost includes the rejects at
probe test and dicing.
– The yield losses represents the
defective dies which are rejected.
Low Yield Medium Yield High Yield
Cost Breakdown Cost Breakdown Cost Breakdown
FE : ASIC Cost29%
FE : MEMS Cost14%
FE : ASIC/MEMS Assembly Cost
9%
Foundry Overhead Cost48%
Die Cost Breakdown (Medium Yields)
FE : ASIC Cost 19.4% 22.7% 26.2%
FE : MEMS Cost 10.7% 11.0% 11.2%
FE : ASIC/MEMS Assembly Cost 8.5% 7.1% 5.4%
Foundry Overhead Cost 35.7% 37.6% 39.5%
BE 0 : Probe Test + Dicing Cost 1.8% 2.1% 2.5%
BE 0 : Yield losses 23.8% 19.5% 15.2%
Die Cost 100% 100% 100%
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• Reverse costing analysis represents the best cost/price evaluation given the publically available data, completed with industry expert estimates.
• Given the hypothesis presented in this analysis the major sources of correction would
lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)
• MEMS +/- 5%
• IC +/- 8%
• Test +/- 20%
• Packaging +/- 10%
• These results are open for discussion. We can re-evaluate this circuit with your
information. Please contact us:
Conclusion
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