InvenSense ICM-30630 Tri-Core 6-Axis Sensor Hub · 2017-01-12 · Using knowledge obtained from...

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COMPLETE TEARDOWN WITH: Detailed photos Precise measurements Material analysis Manufacturing process flow Supply chain evaluation Manufacturing cost analysis Estimated sales price Comparison with Bosch BMF-055 9-Axis Sensor Hub and previous-generation 6- Axis IMU With the emergence of connected objects and wearable devices like the personal fitness coach, InvenSense offers in the ICM- 30630 a competitive, complete motion- tracking solution. The ICM-30630 is the latest version of InvenSense’s 6-axis device (3-axis gyroscope + 3-axis accelerometer), based on the same technology used in smartphones like the Apple iPhone, with a MCU included in the package. Compared with the stand-alone InvenSense ICM-30630 Tri-Core 6-Axis Sensor Hub Title: InvenSense ICM-30630 Tri-Core 6-Axis Sensor Hub Pages: 153 Date: April 2016 Format: PDF & Excel file Price: Full report: EUR 3,490 World’s first tri-core 6-axis motion tracking solution with integrated sensor-hub framework software sensor hub, this approach eliminates a package and reduces system-level power. In competition with Bosch Sensortec and STMicroelectronics, InvenSense provides a low-power, highly programmable device for consumer electronics. ICM-30360 MEMS sensors are fabricated with a low number of masks and are directly assembled on the ASIC by eutectic bonding. The device is shipped in a 3x3x1mm LGA package whose footprint is the same as the previous generation IMU. Using knowledge obtained from previous acquisitions, InvenSense was able to design its own MCU, which provides a fully open platform. This report also features a detailed technology and cost comparison with the leading-edge sensor hub from Bosch Sensortec, highlighting the different choices made by the two designers, and InvenSense’s incredibly smart design.
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Transcript of InvenSense ICM-30630 Tri-Core 6-Axis Sensor Hub · 2017-01-12 · Using knowledge obtained from...

  • COMPLETE TEARDOWN WITH:

    • Detailed photos

    • Precise measurements

    • Material analysis

    • Manufacturing process flow

    • Supply chain evaluation

    • Manufacturing cost analysis

    • Estimated sales price

    • Comparison with BoschBMF-055 9-Axis Sensor Huband previous-generation 6-Axis IMU

    With the emergence of connected objectsand wearable devices like the personalfitness coach, InvenSense offers in the ICM-30630 a competitive, complete motion-tracking solution.The ICM-30630 is the latest version ofInvenSense’s 6-axis device (3-axis gyroscope+ 3-axis accelerometer), based on the sametechnology used in smartphones like theApple iPhone, with a MCU included in thepackage. Compared with the stand-alone

    InvenSense ICM-30630Tri-Core 6-Axis Sensor Hub

    Title: InvenSense ICM-30630 Tri-Core 6-Axis Sensor Hub

    Pages: 153

    Date: April 2016

    Format: PDF & Excel file

    Price: Full report: EUR 3,490

    World’s first tri-core 6-axis motion tracking solution with integrated sensor-hub framework software

    sensor hub, this approach eliminates a package and reduces system-levelpower.

    In competition with Bosch Sensortec and STMicroelectronics, InvenSenseprovides a low-power, highly programmable device for consumer electronics.

    ICM-30360 MEMS sensors are fabricated with a low number of masks andare directly assembled on the ASIC by eutectic bonding. The device isshipped in a 3x3x1mm LGA package whose footprint is the same as theprevious generation IMU.

    Using knowledge obtained from previous acquisitions, InvenSense was ableto design its own MCU, which provides a fully open platform.

    This report also features a detailed technology and cost comparison with theleading-edge sensor hub from Bosch Sensortec, highlighting the differentchoices made by the two designers, and InvenSense’s incredibly smartdesign.

  • Performed by

    TABLE OF CONTENTS

    Overview / Introduction

    InvenSense Company

    Profile Physical analysis

    Physical analysis methodology• Package Package characteristics: view,

    dimensions, and opening Package cross-section

    • MEMS Die View, dimensions, and markings MEMS sensing area: technical

    description MEMS cap removed ASIC delayering and process Die cross-section: ASIC Die cross-section: MEMS cap and

    sensor• MCU Die View, dimensions, and markings Delayering and main block ID Process and die cross-section Die process characteristics

    Manufacturing Process Flow

    • Global overview• ASIC & MCU front-end process• MEMS process flow• ASIC & MCU wafer fabrication unit• Packaging process flow and assembly

    unit

    Cost Analysis

    • Main steps of economic analysis• Yields hypotheses• ASIC front-end cost• MEMS front-end cost• ASIC/MEMS assembly cost• MEMS front-end cost per

    process steps• Total front-end cost• Back-end 0: probe test and

    dicing• Wafer and die cost• MCU front-end and back-end 0

    cost• MCU die cost• Back-end: packaging cost• Back-end: packaging cost per

    process steps• Back-end: final test cost• Component cost and price

    Cost & price comparison with Bosch Sensortec 9-Axis Sensor Hub BMF055

    ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS CoSim+ and IC Price+

    MEMS CoSim+

    System Plus Consulting offerspowerful costing tools to evaluatethe production cost & selling pricefrom single chip to complexstructures.

    MEMS Cosim+Cost simulation tool to evaluatethe cost of any MEMS process ordevice:

    From single chip to complexstructures.

    IC Price+The tool performs the necessarycost simulation of any IntegratedCircuit: ASICs, microcontrollers,DSP, memories, smartpower…

    IC Price+

    Yvon Le Goff has joined SystemPlus Consulting in 2011, in orderto set up the laboratory ofSystem Plus Consulting. Hepreviously worked during 25years in Atmel NantesTechnological Analysis Laboratoryas fab support in physical analysis,and 3 years at Hirex Engineering inToulouse, in a DPA lab.

    Author (Lab):YvonLe Goff

    Stéphane has a deep knowledge ofMaterials characterizations andElectronics systems. He holds anEngineering Degree in Electronicsand Numerical Technology, and aPhD in Materials forMicroelectronics.

    Author:StéphaneElisabeth

  • BOSCH Sensortec BMF055Cortex M0+ 9-Axis Sensor Hub

    in SiP

    STMicroelectronics LSM6DS3 6-Axis MEMS IMU

    mCube MC3635: The Smallest MEMS

    Accelerometer for Wearables

    Industry’s first Custom-Programmable System-in-Package 9-Axis Motion Sensor.

    ST’s extra small (only 6mm3) and sub-mA IMU named 2014 MEMS device of the year.

    Ultra-low power 3D TSV MEMS Single-Chip 3-axis Accelerometer.

    Pages: 246Date: April 2016

    Full report: EUR 3,490*

    Pages: 140Date: June 2015

    Full report: EUR 2,990*

    Pages: 114Date: April 2016

    Full report: EUR 3,290*

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