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Introduction to packaging

Manjunath.M.S

MEMS Packaging

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General Packaging process

Die Attach

Wafer sawVacuum Mount

Curing

Wafer Mount

Pick and Place

Epoxy dispensing

Wirebond Process

Sealing/ Encapsulation

Testing/Calibration/Shipping

Wirebond

Ball Shear test

Wire Pull test

Mold Compound dispensing

Curing

Laser welding

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Semi Automatic Wafer Dicing Machine

Make M/s. MTI Cut

Model EC-400

Mode Semi Automatic

SPECIFICATIONSMotor : DC motor (110V) with variable speed up to 3,000 rpm.Accuracy : 0.0025 mm moving resolution and 0.01 mm position accuracy.Cutting Blades : 4" dia x 0.35 mm thick fully sintered diamond blade

Control mode : Manual control / PC control

Range 3 dimensions : X-axis: 8" Y-axis:4" Z-axis:4"

The MTI Cut Wafer Dicer is semiautomatic machine, suitable to dice wafer. Maximum size of wafer 4. Wafer material Silicon, Glass etc Blade width 0.35mm, Device pitch min 2.5mm.

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Semi Automatic Die attach & wirebondingMachine

Bond head

Microscope

Motorized Wire-Spool

Fiber Optic Illuminator

Wedge bond 17-75

Ribbon max. 25x250

Ball & bump bond 17-50

Axis control Motorized Z & Y, Manual X

Ultrasonic system PLL control 62kHz transducer

Specifications:

Heater Stage

Control - Puck

6,5 TFT Touch Panel

trason c power att output

Bond time 15 2,000 msec.

Bond force 15 150 cN

Heater stagecontroller

Built-in, 250C max

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Semi Automatic Die attach Machine

Epoxyvacuum pump1. pick-up tool

1.

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Semi Automatic Wirebonding Machine

Bond head

Control - Puck

Microscope

Motorized Wire-Spool

Fiber Optic Illuminator

Wedge bond 17-75

Ribbon max. 25x250

Ball & bump bond 17-50

Axis control Motorized Z & Y, Manual X

Ultrasonic system PLL control 62kHz transducer

Ultrasonic power 0 2 Watt output

Bond time 15 2,000 msec.

Specifications:

Heater Stage6,5 TFT Touch Panel

Bond force 15 150 cNHeater stagecontroller

Built-in, 250C max

TPT Wirebonder is semiautomatic machine to establish connectivity between die andsubstrate Wire material Au (25) & Cu, Al (33) Bonding type Ball bonding, Wedge bonding & Ball Bump Minimum bond pad size 80x80, pad pitch of 90, Distance btw 1st & 2nd Bond btw 1-5mm length Metallization thickness of min 100nm of material Au/Al with a bond pad

appropriate seed layer.

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Laser Dicing Machine

Make M/s. Miyachi Unitek

Model LW70AE

Mode Semi Automatic

Type Nd-YAG Laser

Laser Welding machine has capability of Spot and Seam welding MEMS packages madeof metals and alloys such as SS304/304L/316/321, Kovar, Invar etc

Tool Specifications:

Type Delta BDMS four (4) axis

Enclosure 40"W x 26"D x 40"HXY Table 6" x 6"

Power Supply 220VAC, 50 Hz

Work Holding 5" rotary stage with 3-

jaw chuck & Collets

Work Holding

Capacity

50mm diameter parts

Laser Specifications:

Type Nd-YAG

Coolant Water CooledPower Supply 400 VAC, 3 - phase

Max Avg Power 70W

Max Pulse Energy 70J

Pulse Duration 0.25-30ms

Wavelength 1064nm

Pulse repetition 1-200Hz

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Thermocompression Bonding:

A process which involves the use of force, time, and heat to join the two materials.

The wire (heated in some cases) is pressed against the hot surface (at 3000 C or more)at high force for a limited period of time to achieve the bond.

Wire Bonding Types

Thermosonic Bonding:A process which involves the use of force, time, ultrasonics and heat to join two materials.

The wire (heated in some cases) is pressed against the hot surface (at 150 deg. C or less)

at low force and vibrated for a limited period of time to achieve the bond.

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Pressure calibrators

Pressure Calibrator (Hydraulic and Pneumatic):Hydraulic Pressure Calibrator(0-1200bar) and Pneumatic Calibrator (-1 to100bar) with data acquisition system are available for pressure transducer

calibration and characterization.

Make DH-Budenberg

Type Hydraulic

Model DHB 42/501

Range 0 to 1200 bar

Make DH-Budenberg

Type Pneumatic

Model DHB 42/041

Range -1 to 100 bar

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Hot and Cold Chamber

Make M/s. Vtsch

Model VCL7003

Mode Automatic

Tool Specifications:

Test space volume 34 Lts

Temperature Range for

temperature tests

-700 C to +1800 C

Temperature Range for

climatic tests

+100 C to +950 C

Humidity range 10% r.h to 98% r.h

Data capture Simpati, Software Package

This Hot and Cold Enclosure / Test Chamber is used for evaluatingdevice quality, reliability and identify manufacturing flaws on MEMSdevices.