Introduction to 5G - dashif.org · Communications 3D video, UHD screens Smart City ... D2D...

Introduction to 5G

Etienne Chaponniere

Sr. Director, Technical Standards

DASH-IF

August 20th 2015

© 2015 Qualcomm Technologies, Inc.

Mobile has made a leap every ~10 years

D-AMPS, GSM,

IS-95 (CDMA)LTE,

LTE Advanced

WCDMA/HSPA+,

CDMA2000/EV-DO

2

AMPS, NMT, TACS

© 2015 Qualcomm Technologies, Inc.© 2015 Qualcomm Technologies, Inc. 3

Empoweringnew user experiencesnew industries and devices

new services


Potpourri of Organizations Working on 5G

4

Research Organizations Promotion Groups Standards Organizations

• China Academy of Information and

Communications Technology

• China National High-Tech R&D (863)

Program

• Cost – European Cooperation in

Science and Technology

• IEEE Communications Society

• IEEE Vehicular Technology Society

• The 5G Infrastructure Public Private

Partnership (5G-PPP)

• The METIS 2020 Project

• Wireless World Research Forum

• 4G Americas

• GSM Association (GSMA)

• Next Generation Mobile Networks

(NGMN)

• 5G Forum

• FuTURE Communication Forum

• IMT-2020 (5G) Promotion Group

• The Fifth Generation Mobile

Communication Promotion Forum

(5GMF)

• 3GPP

• ARIB

• ATIS

• CCSA

• ETSI

• ITU

• TIA

• TSDSI

• TTA

• TTC


Mobile has made a leap every ~10 years

5

WCDMA/HSPA+,

CDMA2000/EV-DO LTE, WiMAX

IMT - International Mobile Telecommunication

• IMT-2000

• CDMA Direct Spread – UMTS/WCDMA/HSDPA FDD (3GPP)

LTE Release 8/E-UTRA

• CDMA Multi-Carrier – cdma2000 (3GPP2)

• CDMA TDD – UMTS TDD & TD-SCDMA (3GPP)

• TDMA Single-Carrier – UWC-136 (TIA)

• FDMA/TDMA – DECT (ETSI)

• OFDMA TDD WMAN – 802.16e/WiMAX (IEEE)

• IMT-Advanced• LTE Release 10 (3GPP)

• WiMAX 802.16m (IEEE)

LTE Advanced, WiMAX


IMT-2020 – The ITU Vision

6

• M.2290 - M.[IMT.2020.ESTIMATE] – “Future

spectrum requirements estimate for terrestrial

IMT” – December 2013

• M.2320 - M.[IMT.FUTURE TECHNOLOGY

TRENDS] - Future technology trends of terrestrial

IMT systems – October 2014

• M.[IMT.ABOVE 6 GHz] - The technical feasibility

of IMT in the bands above 6 GHz –WP 5D targets

finalization in June 2015

• M.[IMT.Vision] – Framework and overall

objectives of the future development of IMT for

2020 and beyond –WP 5D targets finalization in

June 2015

• M.[IMT.BEYOND2020.TRAFFIC] – IMT Traffic

estimates beyond the year 2020 –WP 5D targets

finalization in June 2015

• M.[IMT.ARCH] - Architecture and Topology of

IMT Networks –WP 5D targets finalization in June

2015


The WP 5D View in M.[IMT.Vision]

7

Enhanced Mobile Broadband

Massive Machine Type Communications

Ultra-reliable and Low Latency Communications

3D video, UHD screens

Smart City

Industry automation

Gigabytes in a second

Self Driving Car

Augmented reality

Smart Home/Building

Work and play in the cloud

Voice Mission critical application,

e.g. e-health

Future IMT


The WP 5D View in M.[IMT.Vision]

8


2015 2016 2017 2018 2019 2020 2021 2022

Current 3GPP timeline delivers 5G specification by 2020*

5G timeline – our view

9

Estimated 3GPP standardization timeline for 5G

4G evolution - LTE will evolve in parallel with 5G

5G

5G RAN WG Study Items (SI)

5G Work Items 5G Work Items

5G commercialization timeline5G first deployments

5G full system

Rel 17 & beyond

5G evolution

3GPP Rel 13 Rel 14 Rel 15 Rel 16

* For information on 3GPP’s 5G timeline, see: http://www.3gpp.org/news-events/3gpp-news/1674-timeline_5g

3GPP RAN Workshop

SA SI RAN SI


Key Enhancements to LTE

Release 8

FDD and TDD

Flexible bandwidth

1.4 MHz to 20 MHz

DL SU-MIMO (up to 4 layers)

and SDMA

UL Transmit diversity and

SDMA

Downlink peak ~ 300 Mbps

Uplink peak ~ 75 Mbps

Release 9

eMBMS

Dual stream

beamforming

Positioning

Release 10

Carrier Aggregation for up

to 5 cells

Up to 8 DL layers

Up to 4 UL layers

eICIC

Relays

MDT

Downlink peak

~ 3000 Mbps

Uplink peak

~ 1500 Mbps

Release 11

DL and UP CoMP

In-device coexistence

Enhanced eICIC

CA enhancements (for

inter-band support)

ePDCCH

Enhanced beamforming

support

UTDOA

Release 12

D2D discovery and

communication (ProSe)

FDD/TDD aggregation

3GPP/WLAN radio-level

interworking

Small cell discovery and

support of small cell

on/off mechanisms

256QAM support in

downlink

Dual connectivity

Support of interference

suppression on the data

channel

CoMP operation w/ non-

ideal backhaul

Low cost LTE for MTC

Release 13


LTE Release 13

11

• LAA (License Assisted Access)

• LTE-Wifi Aggregation

• Further enhancements for MTC (low cost / range / power)

• Enhancements for D2D and DC operation

• 3D/FD MIMO

• Indoor positioning

• Single-cell Multi-Point

• Latency reduction*

• Non-orthogonal Multiple Access*

* Studies targeting normative work in Rel-14

© 2015 Qualcomm Technologies, Inc. 12

Support licensed & unlicensed spectrum sub-6GHz and above 6GHz

including mmWave bands

Integrated access& backhaul

Massivespatial

processing

Coordinatedspatial techniques

Multiple access for more active

connections

Device-to-devicecommunication &

discovery

Multi-hop

5G radio access techniques

Full self-configuration

Even denser network deployment

Context-aware network & devices

Low latency andhigh reliability


Ultra-low cost

Deep coverage

Ultra-low energy

Ultra-high reliability

High security

Robust mobility

Ultra-low latency

Deep awarenessExtreme broadband

Extreme variation of requirements

13

Wide area IOEUltra-

Reliable Services

Enhanced

Mobile

Broadband

Ultra-high capacity


Diverse

Spectrum

Types

Extreme

Range of

Application

Requirements

5GUAI

5G Unified Air Interface (UAI)Multiple techniques under a common framework to support diverse requirements & spectrum types


Phased 5G rollout leveraging 4G coverage4G+5G multi-connectivity ensures coverage and seamless mobility

15

4G+5G

4G+5G coverage

4G

Rural area

4G+5G

Sub-urban area

4G+5G

5G

4G

Downtown

4G+5G

Phased 5G rollout

4G only coverage


4G macro coverage

4G & 5G macro coverage5G deployment scenarios:• Deploy below 6GHz

• Deploy above & below 6GHz when available

Multi connectivity across bands & technologiesLeverage 4G investments and enable phased 5G rollout

16

Coverage from

other cells

4G & 5G small cell coverage

Macro5G carrier aggregation with integrated MAC across

sub-6GHz & above 6GHz

Smallcell

5G/4G/3G/Wi-Fimultimode

device

Simultaneous connectivityacross 5G, 4G and Wi-Fi


mmWave enables 5G Extreme Mobile Broadband

17

Challenges• Higher path-loss at mmWave

frequencies, susceptibility to blockage

• Robust beam search & tracking

• System design with directional

transmissions

• Device cost and RF challenges at

mmW

Opportunities• Availability of large bandwidth from

100s of MHz up to 9 GHz

• Extreme data-rates (e.g. up 10 Gbps)

• Dense spatial reuse can enable

extreme network capacity

• Beamforming to overcome poorer

propagation

• Flexible deployment with integrated

backhaul (200m – 500m) and access

(100m- 150m)

Solutions • Tight integration with 5Gsub6

increases robustness

• Smart beam search & tracking

algorithms

• Antenna management &

reconstructive beam forming

algorithms

• Coordinated scheduling for proximal

user interference management

• Phase noise mitigation in RF

components for cheaper devices

For more information on Qualcomm, visit us at:

www.qualcomm.com & www.qualcomm.com/blog

© 2015 QUALCOMM Incorporated and/or its subsidiaries. All Rights Reserved.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries,

used with permission. Other products or brand names may be trademarks or registered trademarks of their respective owners.

References in this presentation to “Qualcomm” may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiaries or business units within the

Qualcomm corporate structure, as applicable. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio.

Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering,

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