Introduction

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Introduction. Background Executive Director of QPL in 1992. Co-founder of Compass Technology Co,. Ltd.. Executive Director since Oct, 1997 and as CEO since June 2000. Non-performer in school. Survey. What is your expectation as Start-ups?. Smooth Sailing. Roller Coaster. - PowerPoint PPT Presentation

Transcript of Introduction

Page 1: Introduction
Page 2: Introduction

IntroductionIntroduction

• Background– Executive Director of QPL in 1992. – Co-founder of Compass Technology

Co,. Ltd.. – Executive Director since Oct, 1997 and

as CEO since June 2000

• Non-performer in school

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SurveySurvey

What is your expectation as Start-ups?

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Smooth Sailing

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Roller Coaster

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Company ProfileCompany Profile

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Company Profile

Compass Technology Co., Ltd.

Founded in June 11,1997.

Area: HK-150,000ft2. (13,935m2)

China-21,528ft2. (2,000m2)

Paid-up Capital-HK$429M. (USD 55M)

Investor Base- Employee owned with additional investment by blue chip Asian, European VC Funds. GEMS General Oriental Investments (HK) Ltd. Temasek Holdings Ltd. Value Partners.

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Business nature Manufacture state-of-the-art Semiconductor IC

packaging interconnect materials.

Application Flexible Substrates ( TCP, LCD Driver, Flip Chip, TBGA, BGA,

BGA, CSP, MCM)

Capacity 250,000 linear meters per month by year 2003

Manufacturing Quality System ISO 9002 - certified on Dec, 1999 ISO 14001- certified on Dec, 2000 ISO 9001- by Q3 2003 QS 9000 - by Q2 2004

Compass Technology

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State-of-the-art Production LineState-of-the-art Production Line

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Sample of Packaging MaterialsSample of Packaging Materials

Source: Hong Kong University of Science & Technology

Semiconductor IC packaging interconnect materialsSemiconductor IC packaging interconnect materials

Essence of a packageEssence of a package

Chip

Substrate

PCB1st level

interconnect2nd level

interconnect

IC

SUBSTRATE

Printed Circuit Board

Compass

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Function of Electronic PackagingFunction of Electronic Packaging

Packaging & Assembly

Chip protection

Power distribution

Signal passage

Heat dissipation

Geometry transformer

Source: Hong Kong University of Science & Technology

Essence of a packageEssence of a package

Chip

Substrate

PCB1st level

interconnect2nd level

interconnect

IC

SUBSTRATE

Printed Circuit Board

Compass

Semiconductor IC packaging interconnect materialsSemiconductor IC packaging interconnect materials

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Product ApplicationsProduct Applications

• Communications– Broadband– Internet– Wireless– Network– Multi-Media– Cable Modems– Cable Set-Top Boxes– WAP Cellular Phone– Switch Controllers

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• Computer– Laser printer– Micro Processor– Memory (Rambus, Flash)

• Consumer Electronics– Digital Signal Processors– Video Camcorder– Digital Camera

Product ApplicationsProduct Applications

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Current Customer BaseCurrent Customer Base

Direct Customers Indirect Customers

Mitsui

EEMS

CARSEM

I-Cube

ASE

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Start up Experience in our businessStart up Experience in our business

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Start up Experience Start up Experience

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Co-operative Education Scheme, CityU (協助教育計劃 )– 1 year on-the-job Training Program for under-graduates

Industrial Attachment Scheme, CityU (暑期就業計劃 )– Summer Internship for under-graduates

Youth Work Experience and Training Scheme, Labour Dept.

(勞工處青少年就業計劃 )– 1 year training program for youth between 15 to 24

Selective Placement, Labour Dept. (勞工處展能就業計劃 )– Recruitment of employees with physical disabilities

Production Technician Pre-Employment Training Scheme, ERB

(僱員再培訓局生產技術員再培訓計劃 )– Training & recruitment Program for the unemployed

Youth Pre-Employment Scheme, Labour Dept. (勞工處展翅計劃 )– 6 months training & recruitment program for F.5 graduates.

Corporate ResponsibilitiesCorporate Responsibilities

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1. ISO140001 certified- Recycle the wasted material through recyclers.- Reduce in consumption of office paper and electricity.- Provide training program to employee preserving environment.

2.Gas filters incorporated on all machines to prevent air pollution.

3.Certified Waste Water Treatment Plant that meet Hong Kong Government EP Regulations.

Green company

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• City University of Hong Kong (EPA Center)

- Failure Analysis - Reliability Testing

- Tape Substrate Functional Testing

• Hong Kong Polytechnic University (PCB Technology Transfer Unit)

- Via formation by UV YAG or CO2 laser drilling on blind and through hole- Laser drilling on 2metal & multi-layer PI substrates Development

Technology Development Collaboration Programs with Universities

• Hong Kong University of Science & Technology (EPACK LAB)

- Material characterization & testing- Research in advance engineering materials & technology - Blind & through via hole metallization on 2 metal layer substrate

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‧ Xiamen University (China) (Department of Chemistry & Institute of Physical Chemistry) - Metal Finish Process Study and Development

- Plating Solution Analysis and Maintenance

Technology Development Collaboration Programs with Universities

‧ Georgia Tech (Package Research Center) - Research and development in advance packaging

materials

(Material research & development for tape substrate) solder

resist - evaluate % cure under different thermal condition )

* Students exchange program with Georgia Tech to do

material research in polymers

* Current member of Package Research Center.

* Programs supported by HKSAR Applied Research Council.

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ConclusionConclusion

“If you help enough people to get what they want, you will get what you want.”


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