PRODUCTSFORPCBASSEMBLY

ROSINACTIVATEDFLUXES(RATYPE)TheseFluxesare clear,homogenous solutions ofWWgrade rosin in special alcohol solvent systemswith effectiveactivating agents.They can be applied by foaming, dippingor spraying.

FLUX- 15C

It isa liquid solution with approximately 15%solidscontaining water white rosin blended solvent systemwith activators.The chlorides are approximately 0.1%.The surfactants incorporated into the flux yield relativelytackfree residues.

FLUX-615

It isa liquid solution with approximately 15%solids contain-ing water white rosin blended solvent system into which asmall amount of effective activating agent is incorporated.The chloridesare approximately 0.25%.

FLUX-638 .

It isa qquid solution with approximately 38% solids contain-ing ww-rosin with activators and surfactants.The chloridesare approximately 0.2%.

ROSINMILDLYACTIVATEDFLUXES(RMATYPE)TheseFluxescontain WW-rosin and solvent systemssimilarto RAfluxes,however,the activation isso incorporated thatthe chlorides are within 0.075%.They can be applied byfoaming, dipping or spraying.

FLUX- 7A

It isa liquid solution with approximately 8% solids contain-ing water white rosin blended solvent systemwith whicheffective activators are so incorporated that the chloridesare maximum 0.055%.

FLUX-415

It isa liquid solution with approximately 15%solids contain-ing water white rosin blended solvent system and activators.The chlorides are maximum 0.075%.

ROSINNONACTIVATEDFLUX(RTYPE)TheseFluxescontain WW-rosin and solvent systemswithoutany activating agents.They can be applied by foaming,dipping or spraying.

FLUX- RN40

It isa liquid solution with approximately 40% solidscontaining WWrosin in solvents system without anyactivating agent.

ORGANICWATERSOLUBLEFLUXES

Organic fluxes provide greater fluxing action than rosin butthe ionizable nature of the water-soluble residuesnecessitate

their adequate removal,generally with deionised water.

FLUX- 103

It isawater soluble organic activated flux. It isespeciallyadaptable for foam fluxing, however, it can also be appliedby dipping or brushing. It is used where inorganic fluxes aretoo corrosiveto useand rosin fluxes aretoo inactive for theapplication. It is essentialthat the flux residuesbecompletely and adequately removed.

NO CLEAN- LOWSOLIDSFLUXES

The no-clean fluxes are halogen-free with low solids.Theyleavevery little residuesthat require no-cieaning.Thenon-corrosive and non-conductive characteristicsof the

residuesusually yield higher surface insulation resistancethan the residuesof typical organic water soluble flux.They can be applied by foaming, dipping, spraying.

FLUX- 707

It isa halogen-free,modified rosin, low solids solventdesigned for wave soldering conventional and surfacemount circuit board assemblies.

FLUX- 708

It isa halogen-free,non-rosin, low solids solvent systemdesigned for similar application as Flux-707.lt containssynthetic resin.

FLUX- 709

It isa halogen-free, rosin-resin free,with lower solidspercentage solvent system designed for similar applicationas Flux-707.However,it has lessfoaming action thanFlux - 707.

FLUX- 915 (VOC- Free)It isaVOC-free,halogen-free foamable flux with low solidswater based system.Although it isa No CleanFluxthe fluxresiduesare water soluble and can be cleaned withdeionised water.

TINNINGOIL

A refined synthetic oil for useasa blanket on top of moltensolder to minimize dross.

SOLDERBARS

High purity ofTin and Leaduniformly alloyed in 63/37 or60/40 proportion for optimum performance and processconsistency.

FLUXPASTEHANDSOLDERING

For applications where a liquid flux is inconvenient touse these paste formulations are available.

FLUXPASTES18-MA(ROSINACTIVATED)It isa blend of water white rosin,surfactants and activatorsespecially formulated for assembling printed circuits.It can be applied to the areasto be soldered by anyconvenient method.

FLUXPASTES7-MA(ROSINMILDLYACTIVATED)It isa blend of water white rosin with surfactants similarto FluxPasteS-18-A.However it is mildly activated perMIL-14256D.

FLUXPASTENC-25(NO CLEAN)It isa non-rosin halogen-free paste with surfactant andactivator especially formulated for assembling printedcircuits. It is lessactive than FluxPastesS-18Aand S7-MA.

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SOLDERSTRIPPERS(NONPEROXIDE)- 2529

It isan acid basechemical solution formulated to effectively removetin/lead and tin plated surfacesfrom copper substrate.It does notcontain peroxide or fluorides.Type Z is non foaming and can beusedeither by spraying or dipping. Type N isa foaming type and isusedby dipping only.

SOLDERCONDITIONER- 1410

It isan acid basechemical cleaner for cleaning and conditioningtin/lead plated surfaces.It removes ammonia salt residuesformedduring alkaline etching. It can also be used asa presoldering cleanerto improve solderability by removing oxides formed during storage.

SOLDERBRIGHTNER- 2727

It isa non-halogen, acid chemical cleaner for cleaningand conditioning tin/lead plated surfaces.It contains additivesto enhance reflow charact~risticswhen used asa precleaner priorto infrared or hot oil fusing. It will remove ammonia salt residuesformed in alkaline etching system and oxides formed duringstorage.

COPPERCLEANER- 3033

It isan acidic,organic,water soluble,sprayablecleaner to removeorganic and inorganic soilssuch asfinger prints, light oil and tarnishfrom copper surfacesprior to application of protective coatings,solder mask,dryfilm photoresist or ink.

FLUX- 1539 (HAL.)It is a low viscosity organic liquid formulation developed for SolderCoatingof printed circuit boards by hot air levelling equipment.Theresidueof flux iswater soluble.

FLUX- 506 (RT)It is an organic liquid formulation developed for solder coating ofprinted circuit boards by roller coating equipment. The residueofflux iswater soluble.(The process is also known asRollTinning).

QUENCH- P50EIt is an organic liquid formulation developed to cool the printedcircuitpanels after solder coating (hot air leveling)process. Thesteadyrate of cooling reduces the thermal shock and preserves abrightand even solder appearance: The panels are then rinsed inwarmwater. The residues of Quench-P50E are completely watersoluble.

FLUX- 205 (I.R.)

Itisan organic liquidformulation developed for use in reflowofsolderplated printed circuit boards by infra-redfusing equipment.TheresidueofICM-205 iscompletely solubleinwater.

RT-861(ROLLTINNINGSALT)Itisa whitishgranular powder. It contains halogens andit acts as a flux and a dross reducer and enhances solder spreadduring roll tinning of printed circuits.

PROTECOT(PROTEGIVECOATING)It isa rosinbasedcoating developed to preserve the solderabilityof printed circuit boards by protecting clean metallic surfacesfrom atmospheric oxidation and other contamination. It can beapplied by spraying, dipping or brushing to a circuit board whichhas been cleaned and water rinsed.

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PRODUCTSFOR'AUTOMOTIVE,ENGINEERING& PLUMBINGINDUSTRIES

FLUX-1202

It is a high activity, organic based chloride free aluminium solderingfluxthat can be used for soldering aluminium to aluminium,aluminium to copper/brass and aluminium to plated terminals and italso performs well in hot dip coating of aluminium cable connectors.The fluxhas a specificgravity of 1.14.

FLUX-OP64

It isa solvent based, acidicsolution used prior to soldering thestainless steel surface. It is primarily used to clean the stainlesssteelsurface by removing organic contaminants and oxides.Ithas aspecificgravity of 1.55.

FLUX-ZC40

It is an acidic solution used prior to soldering the brass or coppersurfaces. It is primarily used to clean the brass and copper surfacebyremoving organic contaminants and oxides. The fluxhas a specificgravity of 1.10.

FLUXPASTEACL-15

It isazinc free blend of polyols,surfactants and activators. It isespecially used for assembling by soldering and brazing the copperand brass parts used in plumbing applications. The Flux-Pasteand itsresidues are completely water soluable.

FLUX-468

It is a low-foaming, zinc free acidic solution to primarily clean thebrass and copper surface by removing organic contaminants andoxides. It can be used in assembling operations like core-baking,tube-header (end-dipping),tube-milling and other soldering processfor automotive radiators and heater cores. The flux hasa specificgravity of 1.22.

FLUX-119

It isa water based acidicsolution used for soldering copper,brassand certain hard to solder stainless steel alloys. It has a specificgravity of 1.80.

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