Intel Foveros 3D Packaging Technology · Intel shows another way to interconnect dies in processor...
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22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr Intel Foveros 3D Packaging Technology Intel Core i5-L16G7: the first utilisation of Intel’s Foveros Technology with Package-on-Package configuration in a consumer product. SP20555 - Packaging report by Stéphane Elisabeth & Belinda Dube Laboratory analysis by Nicolas Radufe September 2020 – Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
Transcript of Intel Foveros 3D Packaging Technology · Intel shows another way to interconnect dies in processor...
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 1
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Intel Foveros 3D Packaging Technology
Intel Core i5-L16G7: the first utilisation of Intel’s Foveros Technology with Package-on-Package configuration in a consumer product.
SP20555 - Packaging report by Stéphane Elisabeth & Belinda DubeLaboratory analysis by Nicolas Radufe
September 2020 – Sample
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
Company Profile 8
o Intel
o Lakefield vs Previous generation
o Lakefield Foveros
Physical Analysis 22
o Samsung Galaxy S Book Teardown 16
o Summary of the Physical Analysis 23
o Board Analysis 25
✓ Board Overview
✓ Board Heatsink
o Package on Package Analysis 32
✓ Package on Package Opening
✓ Package on Package Cross Section
o DRAM Memory Package 56
✓ Package View & Dimensions
✓ Package Cross-Section
✓ DRAM Memory Die Analysis
o Processor Package 76
✓ Package View & Dimensions
✓ Package Overview
✓ Package Cross-Section (Interposer, PCB, Substrate)
✓ Interposer Die Analysis
✓ Processor Die Analysis
Physical Analysis Comparison 134
Manufacturing Process 139
o Global Overview
o DRAM Front-End Process & Fabrication Unit
o Interposer and Processor Front-End Process & Fabrication Unit
o Processor Packaging process Flow
o Package on Package Assembly
Cost Analysis 162
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o DRAM Memory Cost Analysis 165
✓ Wafer & Die Cost
✓ Component Cost
o Processor Cost Analysis 170
✓ Wafer & Die Cost
o Interposer Cost Analysis 176
✓ Bumping Back-End Cost & Cost per steps
✓ Wafer & Die Cost
✓ packaging Cost & Cost per steps
✓ Packaging Wafer & Component Cost
o Component Cost Analysis 184
✓ Package on Package Cost & Cost per steps
✓ Final Test & Component Cost
✓ Estimated Price Analysis 184
Feedbacks 190
System Plus Consulting services 192
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 3
O V E R V I E WMETHODOLOGY
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 4
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Executive Summary
As feature scaling hits the limits of physics, the semiconductor industry is already researching for “more-than-Moore”technology enablers. In this area, multi-die packages are essential to integrate more functions into a small form factor,whatever is the lithographic technology node, be it conventional integrated circuits (ICs) at 7nm, or Radio Frequency(RF) ICs at 28 nm. All this must be at low cost and in a short time to market. From this perspective, Intel has developedseveral interconnect technologies to enable heterogenous integration using chiplets. An early glimpse of the technologyenablers was seen in 2018 on an Intel processor, then called Embedded Multi-die interconnect Bridge (EMiB). Today,Intel shows another way to interconnect dies in processor using an active interposer and Foveros technology.
Foveros allows 3D Face-to-Face (F-F) stacking for integration of different types of devices on an active interposer usingThrough Silicon Vias (TSVs). The interposer is used as a bridge for the different chiplets. However it also comprises low-power components such as input/output (I/O) connections and power delivery with high performance logic.
The Intel Core i5-L16G7 analyzed in this report features Intel’s hybrid packaging technology. This technology relies onFoveros F-F die stacking and Package-on-Package (PoP) configuration. The design aims to integrate 10 nm computing diewith SK Hynix LPDDR4 DRAM in a PoP architecture in a single package. This lowers power consumption and increasescore performance while reducing the form factor and z-height to fit ultra-mobile applications. In the structure, the 10nm computing die is directly connected to a 22 nm Interposer using Foveros F2F technology and via-middle TSVs. Thatallows easy power transfer to the processor chip.
This report constitutes an exhaustive analysis of the Intel Core i5-L16G7 processor. This report includes a fullinvestigation of Intel’s hybrid packaging technology. It features a detailed study of the 3D package including theprocessor die, Foveros features and interposer die analysis and cross-sections. The report also integrates the physicalanalysis of the LPDDR4X DRAM dies integrated in the package. Finally, it contains a complete cost analysis and a sellingprice estimation of the component and a physical comparison with TSMC’s Chip-on-Wafer-on-Substrate (CoWoS)technology.
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 5
Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
Package is analyzed and measuredThe dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die markingSetup of the manufacturing process.
Costing analysis
Setup of the manufacturing environmentCost simulation of the process steps
Selling price analysis
Supply chain analysisAnalysis of the selling price
Executive Summary
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 6
PHYSICALANALYSIS
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Samsung Galaxy Heat sink Dimensions
Board heatsink Side View©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Board Cross-Section
Package Cross Section– Optical View©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Intel Core i5-L16G7 3D Package
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Intel Core i5-L16G7 Package – X-Ray View©2020 by System Plus Consulting
Intel Core i5-L16G7 3D Package
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Intel Core i5-L16G7 3D Package –X-Ray Image ©2020 by System Plus Consulting
Intel Core i5-L16G7 3D Package
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Intel Core i5-L16G7 3D Package Cross Section
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Memory Package Cross Section-Top Package PCB
DRAM Package Cross Section– SEM View©2020 by System Plus Consulting
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Processor Package Cross Section-Bottom Package PCB
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Processor Package Cross Section
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Processor Package Cross Section
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Processor Package Cross Section
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Processor Package Cross Section
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Processor Package Cross Section
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Samsung Galaxy Teardowno Global Overviewo Board Analysis
o Board Overviewo Package on Package Analysis
o View & Dimensionso Package X-rayo Opening & Cross-Section
o DRAM Memoryo View & Dimensionso Opening & Cross-Sectiono Die View & Cross-Section
o Processor Analysiso View & Dimensionso Opening & Cross-Sectiono Interposer Die & Cross
Sectiono Processor Die & Cross
Sectiono Package on Package Assembly
o Cross-Section
Physical Comparison
Manufacturing Process Flow
Cost Analysis
FeedbacksRelated ReportsAbout System Plus
Package on Package Cross Section
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparisono Intel Lakefield vs Nvidia Tesla
V100 Package Comparisono Cost Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
Intel Lakefield Interposer vs Nvidia Tesla Package Interposer
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flowo Global Overviewo DRAM Process & Fabo Interposer Front End& Fabo Interposer Process Flowo Processor Front End &Fabo Processor Packaging Process
Flowo Package on Package Assembly
Cost Analysis
Feedbacks
Related Reports
About System Plus
Processor Package - Packaging Process Flow (4/4)
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 23
C O S TANALYSIS
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso DRAM Memory Costo Processor Wafer & Die o Interposer Front Endo Interposer TSV, Bumping &Cost
Stepso Interposer Wafer & Die Costo Packaging Cost& Step Costso Package Processor& Interposer
Component Costo Package on Package Cost &Step
Costo Final Test & Component Costo Component Price
Feedbacks
Related Reports
About System Plus
Processor Wafer Front End Cost
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso DRAM Memory Costo Processor Wafer & Die o Interposer Front Endo Interposer TSV, Bumping &Cost
Stepso Interposer Wafer & Die Costo Packaging Cost& Step Costso Package Processor& Interposer
Component Costo Package on Package Cost &Step
Costo Final Test & Component Costo Component Price
Feedbacks
Related Reports
About System Plus
Interposer Bumping Back-End cost per process steps
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso DRAM Memory Costo Processor Wafer & Die o Interposer Front Endo Interposer TSV, Bumping &Cost
Stepso Interposer Wafer & Die Costo Packaging Cost& Step Costso Package Processor& Interposer
Component Costo Package on Package Cost &Step
Costo Final Test & Component Costo Component Price
Feedbacks
Related Reports
About System Plus
Interposer Wafer & Die Cost
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 27
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysiso Cost Analysis Summaryo Yields Explanation &
Hypotheseso DRAM Memory Costo Processor Wafer & Die o Interposer Front Endo Interposer TSV, Bumping &Cost
Stepso Interposer Wafer & Die Costo Packaging Cost& Step Costso Package Processor& Interposer
Component Costo Package on Package Cost &Step
Costo Final Test & Component Costo Component Price
Feedbacks
Related Reports
About System Plus
Intel Core i5-L16G7 Component Cost
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Plus
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• Status of the Advanced Packaging Industry 2020• Advanced Packaging Quarterly Market Monitor• (x)PU: High-End CPU and GPU for Datacenter Applications 2020
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
ADVANCED PACKAGING• Fan-Out Packaging Processes Comparison 2020• Advanced System-in-Package Technology in Apple’s
AirPods Pro• Advanced packaging technology in the Apple Watch
Series 4’s System-in-Package
Related Reports
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 29
SystemPlusConsultingSERVI CES
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 30
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
©2020 by System Plus Consulting | SP20555 - Intel Foveros 3D Packaging Technology | Sample 31
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Physical Comparison
Manufacturing Process Flow
Cost Analysis
Feedbacks
Related Reports
About System Pluso Company serviceso Contact
Contact
Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]
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www.systemplus.fr
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