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Intel 32nm Technology

Mark Bohr

Intel Senior Fellow

Logic Technology Development

Feb. 10, 2009

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Key Messages

• Intel has developed a 32nm logic technology with

industry-leading features

• Intel is first to demonstrate working 32nm processors

• Intel’s 32nm process is on track for production

readiness in Q4 ’09

• Both CPU and SoC versions of this 32nm process will

be available

• Intel’s strength as an integrated device manufacturer

allows us to continue to deliver new generations of

advanced process technology on a 2 year cadence

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Intel Logic Technology Development

Process Name P1264 P1266 P1268 P1270 P1272

Lithography 65nm 45nm 32nm 22nm 16nm

1st Production 2005 2007 2009 2011 2013

Manufacturing

Development

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45nm High-k + Metal Gate Transistors

Revolutionary transistor technology for

improved performance and lower leakage

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45nm Microprocessor Products

45nm production ramp has been the fastest yet

Twice as fast as the 65nm ramp in its first year

Single Core

6 Core

Dual Core

8 Core

Quad Core

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Intel Logic Technology Evolution

Process Name P1264 P1266 P1268 P1270 P1272

Lithography 65nm 45nm 32nm 22nm 16nm

1st Production 2005 2007 2009 2011 2013

Manufacturing

Development

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32nm Technology

• 2nd generation high-k + metal gate transistors

• Immersion lithography on critical layers

• 9 copper + low-k interconnect layers

• ~70% dimension scaling from 45nm generation

• Pb-free and halogen-free packages

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32nm Transistors

• 2nd generation high-k + metal gate

0.9nm equivalent oxide thickness high-k

(scaled from 1.0 nm on 45nm)

Replacement Metal Gate process flow

30nm gate length

4th generation strained silicon

• >22% performance increase

• Tightest reported gate pitch

• Highest reported drive currents

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Transistor Pitch Scaling

Transistor gate pitch continues to scale 0.7x every 2 years

Tightest gate pitch of all reported 32nm technologies

100

1000

1995 2000 2005 2010

Gate Pitch

(nm)

0.7x every

2 years

32nm Generation

112.5 nm Pitch

PitchPitchPitch

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32nm Transistor Performance

32nm provides improved performance or reduced leakage

Highest drive current of all reported 32nm technologies

1

10

100

1000

0.6 0.8 1.0 1.2 1.4 1.6 1.8

ION (mA/um)I O

FF

(n

A/u

m)

1.0 VIntel

45nm

Intel

32nm

1

10

100

1000

0.8 1.0 1.2 1.4 1.6 1.8 2.0

ION (mA/um)

I OF

F (n

A/u

m)

1.0 VIntel

45nm

Intel

32nm

Better Better

+14% +22%

>5x

>10x

NMOS PMOS

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SRAM Cell Size Scaling

Transistor density doubles every 2 years

Moore’s Law continues!

0.1

1

10

1995 2000 2005 2010

Cell Area

(um2)

0.5x every

2 years32nm Generation

0.171 um2 Cell

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32nm SRAM Test Chip

• 0.171 um2 cell

• 291 Mbit

• >1.9 billion transistors

• 4 GHz operation

• First demonstrated Sep ’07

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Rapid Yield Improvement

Defect

Density

(log scale)

2002 2003 2004 2005 2006 2007 2008 2009 20102002 2003 2004 2005 2006 2007 2008 2009 20102002 2003 2004 2005 2006 2007 2008 2009 2010

90 nm 65 nm 45 nm 32 nm

32nm yield improvement on track for Q4 ’09 production

2 year

Higher

Chip

Yield

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32nm Manufacturing Fabs

D1D Oregon - Now D1C Oregon - 4Q 2009

Fab 11X New Mexico - 2010Fab 32 Arizona - 2010

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System Integration

High

Performance

Logic

Memory

Analog Graphics

Low

Power

Logic

Power

Regulator

I/O I/O

I/O

Analog

High Perf.

Logic

GraphicsLow Power

Logic

Power

Reg.

Memory

Discrete SoC

System integration will continue, using key elements

such as the AtomTM core, to realize improved

performance and power in a smaller form factor

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32nm SoC Process

45 nm 32 nm 22 nm

Process: P1266 P1266.8 P1268 P1269 P1270 P1271

Products: CPU SoC CPU SoC CPU SoC

Intel is developing both CPU and SoC versions of each

process generation, to provide transistors, interconnects

and other device features optimized for each product line

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Integrated Device Manufacturer Advantage

PackagingMasks

Process

Design Tools

Product

Manufacturing

Design for Manufacturing

Co-Optimized Process+Product

Rapid Yield Learning

Early Product Ramp

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Summary

• Intel has developed a 32nm logic technology with

industry-leading features

• Intel is first to demonstrate working 32nm processors

• Intel’s 32nm process is on track for production

readiness in Q4 ’09

• Both CPU and SoC versions of this 32nm process will

be available

• Intel’s strength as an integrated device manufacturer

allows us to continue to deliver new generations of

advanced process technology on a 2 year cadence

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