Integrated Ccts

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Indigent Group of UIT

M.Talha Meraj

Abdul Aleem Siddiqui

Faizan Hanif

M.Saad Abbas


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C o n t e n t s

Dual in-line package (DIP)

Small-outline integrated circuit (SOIC)

Thin Small-outline Package (TSOP) Thin Very Small-outline Package (TVSOP)

Quad Flat Package (QFP)

Thin Quad Flat Package (TQFP) Plastic Leaded Chip carrier (PLCC)


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D u a l i n - l i n e p a c k a g e ( D I P )

In microelectronics, a dual in-line package

(DIP or DIL) is an electronic device package

with a rectangular housing and two parallel

rows of electrical connecting pins. The

package may be through-hole mounted to a

printed circuit board or inserted in a socket.


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Where dip encased?

DIP is a chip encased in a hard

plastic casing with pins along

each of the sides of theplastic casing. In the picture

to the right, is an example

of a DIP found on a computer motherboard

that has been soldered into place.
http://www.computerhope.com/jargon/m/mothboar.htmhttp://www.computerhope.com/jargon/s/solder.htmhttp://www.computerhope.com/jargon/s/solder.htmhttp://www.computerhope.com/jargon/m/mothboar.htm


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I C PA C K A G E S

Some DIPs use a small dot on the top surface

of the package to locate pin 1. The spacing

between pins (lead pitch) is typically 100 mils(

a mil is a thousandth of an inch). Dip packages

are still the most popular package for

breadboarding and educational

experimentation.


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D u a l i n - l i n e p a c k a g e ( D I P )

A DIP is usually referred to as a DIPn, where n

is the total number of pins.

Height: 200mils(5.1mm) Lead pitch: 100mils(2.54mm)


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Small-outl ine integrated circuit

A small-outline integrated circuit (SOIC) is a

surface-mounted integrated circuit (IC) package

which occupies an area about 3050% less than

an equivalent DIP, with a typical thickness that is70% less.

They are generally available in the same pin outs

as their counterpart DIP ICs. The convention fornaming the package is SOIC or sometimes just

SO followed by the number of pins.


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Small-outl ine integrated circuit


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T h i n S m a l l - o u t l i n e P a c k a g e

Thin small-outline packages, or TSOPs are a

type of surface mount IC package. They are

notably very low-profile (about 1mm) and

have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash

memory ICs due to their high pin count and

small volume.


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Thin Very Small-outline Package

Height :1.2 mm

Lead Pitch:0.4mm


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Q u a d F l a t P a c k a ge

A QFP or Quad Flat Package is a surface

mount integrated circuit package with "gull

wings" leads extending from each of the four

sides.

Versions ranging from 32 to 304 pins with a

pitch ranging from 0.4 to 1.0 mm are

common.


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A package related to QFP is PLCC which is

similar but has pins with larger pitch, 1.27 mm

(or 1/20 inch), curved up underneath a thicker

body to simplify socketing (soldering is alsopossible). It is commonly used for NOR Flash

memories and other programmable

components.


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T h i n Q u a d F l a t P a c k a g e

Height :

1.6 mm

Lead Pitch:

0.5mm


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P l a s t i c L e a d e d C h i p C a r r i e r

Height :

4.5 mm

Lead Pitch:

1.27mm


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Integrated Ccts

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