S.Stapnes 1

Current project: 2006-2011 Next phase: 2012-2017

CLIC and accelerator studies (Adli) CLIC next phase (from 2010) (Adli)

R&D 3D sensors (Sandaker) PIXEL upgrade in ATLAS (Rohne)

R&D 3D electronics (Ullaland) ALICE/FAIR (Roehrich)

R&D SiPM/MAPD incl. med. application (Erdal - Bolle)

(+ work related to ILC/Calice - Eigen)SuperB contribution ? (Eigen)

Astroparticle physics experiment ? (Berghofer)

ILO/TTO and Technical students (Nordahl) Continue next period, including outreach support

Continued R&D for 3D systems and calorimeter readout (link stronger to a LC detector)

Instrumentation for High Energy Particle and Nuclear Physics

S.Stapnes 2

 

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Schematics of 3D (Sandaker) Proposed by S.I. Parker, C.J. Kenney and J. Segal (NIM A 395 (1997) 328)

Called 3-D because, in contrast to silicon planar technology, have three dimensional (3-D) electrodes penetrating the silicon substrate

SINTEF/UiO are currently processing 3D structures for a group consisting investigation by a collaboration within Brunel Univ., Hawaii Univ., Stanford Univ. and CERN – batch two expected this year

Depletion thickness depends on p+ and n+ electrode distance, not on the substrate thickness (1) can operate at very low voltages, (2) can have a high doping for ultra-high radiation hardness, (3) are fast and (4) can be active almost to the edge

S.Stapnes 3

Motivation to develop a new pixel detector

– Radiation hardness improvement (leakage, reverse annealing issues)

– Decrease fabrication cost of pixel detector

– Develop a thin pixel detector– Easy fabrication of large area

devices– Overcome readout limitation’

Some concepts of silicon pixel detectors in HEP on the right (more possible)

Hybrid pixel

DEPFET pixel

MAPS

Combining electronics and sensors (Ullaland)

H.-G. MoserSemiconductor

LaboratoryMPI for Physics,

Munich

Industry Vision

Source : Fraunhofer-IZM

James Lu, RPI, Peaks in Packaging, 2003

Long Connection

Low Density

RC Delays

High Impedance

High Power consumption

Poor Heat Dissipation

Large Area

Challenging Interposers

I/O Pitch limitations

Short Connection

High Density

Reduced RC Delays

Low Impedance

Low Power consumption

Good Heat Dissipation

Smallest Area

Simple Interposers

Less I/O Pitch limitations

3D will be used for:

memories (memory cards), optical sensors (CMOS), smart cards

ResistorRn= few MΩ hω

R 50

substrate

Depletion Region

Pixel size: ~25 x 25 m2 to ~100 x 100 m2

Array size: 0.5 x 0.5 mm2 to 5 x 5 mm2

Photo-readout – SiPM (Erdal, Bolle)(see also talk of Eigen)

5

Silicon photomultipliers are semiconductor photon sensitive devices build from an avalanche photodiode matrix on common silicon substrate:B-field proof, small, good timing resolution, affordableTotal quantum efficiency similar to a traditional PMTGain (G) is also similar to a PMT, G vs Vb curve is linearDimensions permits extremely compact, light and robust mechanical designBeing explored in many applications today – many companies offering various types – including medical field Lot of work ahead to understand for example radiation tolerances and operational parameters

ND280 has chosen to use MPPC as the photosensors forall scintillator detectors.– Need ~50,000 MPPCs for ND280; first large-scale use ofthese devices

Hamamatsu MPPCActive area: 1.3x1.3 mm2Number of pixels: 667

S.Stapnes 6

Accelerator physics – CLIC – Ph.D student from 1.7.2006 (Adli)

The Ph.D project of Erik Adli is finishing this year, and we seeking ways to continue this very successful initial project.

Specifically, Erik Adli – who will present the status and future plans for this work - will apply for a post.doc position

We have also submitted a Nordic application for funds (NorduCLIC) with partners in Uppsala and Helsinki.

S.Stapnes 7

ILO and TTO – Technical Students (Nordahl)

The work of the Industry Liaison and Technology Transfer Officer Ole Petter Nordahl will be presented by him

The Norwegian Technical student program is currently very successful.

From an initial investment of support for 3-4 months the students are typically extended by CERN to 12 months, and even 14 months in some cases. The monthly cost is 3414 CHF, i.e 17750 NOK.

The two Norwegian CERN staff members who have been doing most of the work have been Jens Vigen and Nils Høimyr, and they are willing to continue to promote the program. Jens Vigen leads the sub-project.

We are now focusing on five areas for these students (but not exclusively) – areas where we have Norwegian activities and/or staff (order arbitrary): – Technology Transfer– Information Technology – Information Systems– CLIC and accelerator technology – Silicon sensors and electronics

S.Stapnes 8

International Research Training Group = Forskerskole

• Excellent student training/education • Regular workshops (financed outside this

project) • Successfully reviewed in Sept 2008 in

Heidelberg• Norwegian funding determine the output from

this activity from our side – remains limited

S.Stapnes 9

Objectives and status - I Join forces to develop challenging new silicon technology taking advantage of

knowledge base and new infrastructure in Norway. – For 3D sensors the work is progressing well but there are still concerns

about industrial availability of such sensors, and further lab and testbeam measurements are needed.

– The SiPM/MAPD work that was only mentioned briefly in the initial application has been successfully strengthened trough international collaborations and small local infrastructure funding.

– Extra funding is now available linked to development of a PET demonstrator in Oslo.

Focus on basic technology development the first three years, related to 3D silicon sensors and new integration methods for sensors and electronics. – As mentioned 3D sensor work is making good progress and can move into a

stage of preparing for construction projects – for example LHC upgrades, while the work on integration methods clearly will take longer. The MAPS technology is fairly well developed and Norwegian involvement in this area, even if limited, is clearly interesting.

Include a large number of students, in silicon detector system research using fully the link to “Forskerskole” students.– The school has been evaluated successfully in Germany in September 2008,

but there is limited funding on the Norwegian side in this area so our participation is still not as strong as it could have been.

S.Stapnes 10

Objectives and status - II Establish a new ILO and TT system where the focus is longer term and on

technology transfer and knowledge, via projects and human resources spending time on CERN, in addition to the traditional CERN contract follow up.– This is going well.

Strengthen the technical students program, and co-ordinate training of Norwegian students to provide an overall consistent environment for them where there is increased contact between the students, Norwegian CERN staff and researchers, and Norwegian Industries being involved in CERN projects.– The actual program is going well in terms of number of students and with

good quality, but the connection between Norwegian R&D activities and the technical student program can still be improved.

Participate in CLIC accelerator research to have a minimal activity in accelerator research, and also to answers CERN request for voluntary contributions to CLIC.– This project is going well and the focus now is on finding a longer term

funding for the CLIC participation. A Norwegian technical student is now also involved, and an additional Ph.D grant is awarded for LHC accelerator studies.

S.Stapnes 11

2006-2011 2012-2017

CLIC and accelerator studies (Adli) CLIC next phase (from 2010) (Adli) - project

R&D 3D sensors (Sandaker) PIXEL upgrade in ATLAS (Rohne) - project

R&D 3D electronics (Ullaland) ALICE/FAIR (Roehrich) - project

R&D SiPM/MAPD incl. med. application (Erdal - Bolle)

(+ work related to ILC/Calice - Eigen)SuperB contribution ? (Eigen)

Astroparticle physics experiment ? (Berghoefer)

ILO/TTO and Technical students (Nordahl) Continue next period, including outreach support

Continued R&D for 3D systems and calorimeter readout (link stronger to a LC detector)

Next period Adv. Instrumentation (green, plus yellow?)

Funding, People

Funding being used within a revised profile with some small adjustment between 2008-2010, keeping the total constant

Basically only funding for 3D sensors and lab equipment planned – so ok for 3D sensors

SiPM/MAPD solutions found outside

ILO/TTO, GRID, and Technical students executed according to plans and budgets

S.Stapnes 12

S.Stapnes 13

S.Stapnes 14

Test chip • Developed by Einar

Nygaard, Interon AS here in Oslo for us

• Analogue low noise readout for pixel sensors

Will use to study:

• Sensor performance

• Sensors after SLID bonding

• System performance after applying via process

Our goal: to apply with 3D sensors making modules active all the way to edge