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INFN Rome Silicon Microstrip Detector for SBS

F. De Persio – S. Kiprich - F. Meddi – G.M. Urciuoli

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Summary 1) About us: Presentation of the JLAB12 INFN Roma group. 2) Silicon Detector Advantages on SBS: Resolution. Position. 3) Silicon Microstrip Detector: Design. 4) Detector Construction: PCBs for Detectors. Assembly. 5) Future Outlook: Current status and next steps.

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INFN Rome Group

Maurizio Zullo Mechanical CAD Designer

Giacomo Chiodi Electronic CAD Designer

Riccardo Lunadei Electronic CAD Designer

Felice Citronelli Electronic CAD Designer

Franco Meddi Associated Prof. Univ. La Sapienza

Sergiy Kiprich NSC-KIPT Kharkov Engeener

Fulvio De Persio INFN Associate

Alessandro Ruggieri Programmer

Salvatore Sestito Lab. Tecnichan

Guido Maria Urciuoli INFN Researcher

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Silicon Detector Advantages and Position

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Improved Resolution using silicon detectors before the SBS magnet

M. Pentia et al. “A fast procedure for geometric parameter determination of a silicon vertex tracker”, NIM A369 (1996) 101

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≈63%

≈58%

≈26%

≈103% 2 Times better!

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Silicon Detector Position on SBS

Silicon Detectors

Fulvio De Persio To cover the whole vertical acceptance the Silicon X plane should be located at 48 cm and Y plane at 50 cm from the center of the target.

Silicon Microstrip Detector: Design

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Detector Sketch

5mm

5mm

10mm

10mm

8.5mm 8.5mm 6.5mm

A

A

B

B

C

C

D

D 103500

Custom Design maximum active area from a 6” Wafer

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0 50 100 150 200

0

200

400

600

800

1000

I_le

ak

V_r

Det_1

Det_2

Det_3

Det_4

Det_5

25000 e-h

≈ 55 V

Prototype

I-V Curves

Planes

(V) (n

A)

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Silicon Microstrip Detector: Close Up

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Silicon Microstrip Detector

Guard Ring PAD (500x90 µm2)

DC PAD for bonding (200x40 µm2)

Strip Pitch 50 µm

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X-Y Plane Y

X

Only Y

Only Y

Only X

Only X

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Detector Construction: PCBs for Detector

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• Minimize the size of PCB and the length of the tracks. • Minimize the ground plane.

• Design a cradle that houses the silicon detector in the

PCB.

• Simplify ultrasonic wirebonding work.

Strategy for Fan-Out PCB design

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4 Layers PCB

Channels 2070 Layer1 = 518 Ch Layer2 = 518 Ch Layer3 = 517 Ch Layer4 = 517 Ch

Silicon Detector

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23 cm

Final Design for Half X Plane PCB

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PCB for X plane and Y Plane

Piano Y Piano X

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Complete System

F.E. electronics (APV25)

Kapton

Backplane

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SNR Simulation Result

Time

0s 20ns 40ns 60ns 80ns 100ns 120ns 140ns 160ns 180ns 200ns 220ns 240ns 260ns 280ns 300ns

I(R3) I(R37) I(R38) I(R39) I(R40) I(R41) I(R42) I(R43) I(R44) I(R45) I(R46) I(R47) I(R48) I(R49) I(R50)

-10nA

0A

10nA

20nA

30nA

40nA

50nA

60nA

SNR = Min 18 , Max 21 (APV25 gate = 50 ns)

Pulsed Strip

Adjacent strips

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Detector Construction: Assembly

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• Prepare the clean room for all the assembly

task

• Golden wire bonding points on detector backside for reverse polarization.

• Glue the detector to PCB.

• Wirebonding detector strip to the PCB tracks.

Activity in Clean Room CL 10000

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25 µm gold wire

Conductive Glue: Epotek H20E

Ni-Ag wire for Vr

Detector Backside A

D

C B

0 1000 2000

0,09

0,12

0,15

R (A-D)

R (

Oh

m)

Time (Hours)

4 months

Test of Golden Wire bonding and conductive glue

400 µm

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Gluing Detector and PCB

After 5h ( Glue Curing time at 60 °C ) : OK

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Non-Conductive Glue: Momentive RTV 615

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Custom Ultrasonic wirebonding station

Programmable motorized long run stage (X and Y ) and fine step (50 µm) for a precise and fast skip from a bonding to the next.

K&S 4225 semi-automatic bonding machine

Microscope Leica M80 (80X)

60 µm

Custom Wedge for fine pitch wirebonding.

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Ultrasonic wirebonding

18 µm Al wire

1.2 mm

3 mm

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16 mm

8 mm

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Full bonding of 2070 ch. (One Det.)

Conductive glue point on bonding over PCB.

Non-conductive glue deposition on bonding.

…Wirebonding improved reliability!

Timeline and Milestones

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Timeline and Milestones

End of Test on Prototype

Silicon Detector In Hand

2009 2010 2011 2012 2013 2014 2015

Today

Detector Prototype Ready for Testing

Detector Glued on PCB and wire-bonded

PCB Y In Hand

PCB X In Hand

Project Start

Simulation (Detector and PCB)

Work on Read Out Electronics

Work on Clean Room

Prototype Assembly

Prototype Test

Plane X and Y Assembly Fulvio De Persio

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END (Hope see you in the 2015 meeting.)

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SPARE

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Silicon Microstrip Detector:

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Guard Ring PAD (500x90 µm2)

DC PAD for bonding (200x40 µm2)

Strip Pitch 50 µm

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850 µm

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Al metallization

p+ implant

Tipe N Bulk

PSPICE Final Model: 15 Strips

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Silicon Microstrip Detector: Simulation

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3D PSPICE Model for a Strip detector

X

Z

Y

Detector Model: 15 strips 1 Cell: Lstrip = 250 µm 400 Cells: Lstrip = 10 cm

Rstr Cs

Csub

Cm Rmet

Rimp

Rsub

Cf

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n- substrate

p+ implant

Al metalization

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Modeled detector response to a MIP

MIP ( 300 µm Si) ≈ 4.2 fC

0 0 25 50 (ns)

0

0 (nA)

-80

-120

-160

-200

0 0 100 200 300 400

0

20 (µV)

0

-20

-40

-60

-80

(ns)

MIP Pulse Detector Response

Pulsed Strip

Adjacent strips

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Tr = 5ns

Tf = 35ns

Detector Construction:

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Silicon Detector Cradle

Read Out Connector

PCB Macroscopic view

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50

5 0

Layer 3L

Layer 1L

Layer 1R

Layer 2R

800 um

µm

Layer 2L

Layer 4L

Layer 3R

300 µm Layer 4R

PCB for Y Plane

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Final Design for Half Y Plane PCB

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Kapton PCB Backplane for 4 APV25

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Parameters of PCB and Kapton connector

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Results of Simulation on PCB for the X Plane

Time

0s 20ns 40ns 60ns 80ns 100ns 120ns 140ns 160ns 180ns 200ns 220ns 240ns 260ns 280ns 300ns

I(R3) I(R37) I(R38) I(R39) I(R40) I(R41) I(R42) I(R43) I(R44) I(R45) I(R46) I(R47) I(R48) I(R49) I(R50)

-10nA

0A

10nA

20nA

30nA

40nA

50nA

60nA

50 ns

SNR = Min 16 , Max 20

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Detector Construction: PCB Simulation

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PCB simulation

Detector (400 cells = 10 cm strip)

Impedance of F.E. (APV25)

Al WIRE PCB Connector P5KS PCB Kapton

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• Foundamenal Parameter SNR = Q / ENC

Q : simulation ENC :From the noise curve of Read Out Electronics

Evaluation of SNR

1.81 pf 4.48 pf

• Length of tracks • Distance from the ground plane • Distance between tracks (Crosstalk)

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Y

Y

X

X

MPD DPP

MPD

MPD

DPP

DPP

MPD DPP

MPD DPP

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Detector Construction:

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Gold Wire Bonding

A B

C D

25 µm gold wire Fulvio De Persio

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Glued Point

A B

C D

Conductive Glue: Epotek H20E Fulvio De Persio

A

D

C B

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Golden wire bondingon a mechanical samples

Ni wire coated with Ag

Detector Backside

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Gluing Detector and PCB

Teflon detector vacuum holder

PCB Holder

Micrometrical moviment for fine adjustement ( X, Y, Z , θ)

Programable motorized long run stage with fine step (5 µm minimum step) for aligment in X and Y.

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Wirebonding strength test

Digiatal Dinamometer with fine movimentations

Small hook for test Al wire of 18 µm ø

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Wire Loops Sequence

Odd channel

Even channel 1° pad to 1° layer 2° pad to 3° layer 3° pad to 2° Layer 4° pad to 4° layer 5° pad to 1° layer …….

Otherwise!!!!!!

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