The consumer MEMS microphone market

is expected to be worth $1.5B in 2024, up

from $1.1B in 2019, according to the

“Microphones, Microspeakers and Audio

Solutions” report from Yole

Développement. The main drivers are

smart speakers and wireless earbuds. Two

main players share the MEMS microphone

market, Knowles and Goertek, with

market shares of 39% and 28%,

respectively.

In this dynamic context of the consumer

microphone market, System Plus

Consulting provides a full reverse costing

study of the Infineon Sealed Dual

Membrane (SDM) XENSIVTM MEMS

microphone. This microphone, sold by

Goertek, was found in Apple’s AirPods

Pro.

Launched in 2019, Infineon SDM XENSIVTM

is the newest Infineon MEMS microphone

technology. This new MEMS microphone

structure uses two movable membranes

mechanically coupled by electrically

insulating columns to enable a differential

read-out process. In between the two

membranes, where the backplate

electrode is suspended, pressure is

reduced. This is a sealed dual-membrane

design.

The previous MEMS microphone

technology from Infineon, dual backplate

from 2014 used two backplates and one

membrane. The 2019 sealed dual-

membrane uses one backplate and two

mechanically-coupled membranes.

According to Infineon, this new design

enables practically noise-free audio signal

capturing.

This report includes a comparison

between Infineon MEMS microphone

technologies, dual-backplate and sealed

dual-membrane, in Goertek microphones.

The comparisons highlight differences in

terms of structure, process, and cost.

COMPLETE TEARDOWN WITH

• Microphone structure, including package, MEMS and ASIC analysis

• Detailed optical and SEM photos

• Precise measurements

• Supply chain evaluation

• Manufacturing cost analysis

• Estimated selling price

• Technology and cost comparisons between Infineon MEMS micro-phone technologies: Dual-backplateand sealed dual-membrane in Goertek microphones

Apple’s AirPods Pro use the newest MEMS microphone technology fromInfineon: Sealed Dual-Membrane XENSIVTM, found in Goertek’smicrophone.

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Title: Infineon SDM MEMS in GoertekMicrophone

Pages: 112

Date: March 2020

Format: PDF & Excel file

Price: EUR 3,990

Reference: SP20549

Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone

IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - MEMORY - DISPLAY

TABLE OF CONTENTS

Overview/Introduction

• Executive Summary

• Reverse Costing Methodology

• Glossary

Company Profile

• Goertek Profile and Products

• Infineon MEMS Technology

Physical Analysis

• Apple AirPods Pro Teardown

• Summary of the Physical Analysis

• Package

Package view and dimensions

Package opening

Package cross-section

• ASIC

ASIC die view and dimensions

ASIC delayering and main blocs

ASIC die process

ASIC die cross-section

• MEMS

MEMS die view and dimensions

MEMS bond pad

MEMS die process

MEMS die cross-section

Manufacturing Process Flow

• Overview

• ASIC Die Front-End Process and Fabrication Unit

• MEMS Die Front-End Process and Fabrication Unit

• Packaging Process Flow and Assembly Unit

Cost Analysis

• Summary of the Cost Analysis

• Yield Explanations and Hypotheses

• ASIC Die

ASIC front-end, wafer and die cost

ASIC die probe test, thinning and dicing

• MEMS Die

MEMS front-end, wafer and die cost

MEMS die probe test and dicing

• Packaged Component

Packaging cost per process step

Back end: Final test

Component cost

Estimated Selling Price

Comparison

• GWM1 in Apple iPhone X versus GWM1 in Apple AirPods Pro

• Infineon Dual-Backplate Versus Sealed Dual-Membrane MEMS

AUTHORS

INFINEON SDM MEMS IN GOERTEK MICROPHONE

RELATED REPORTS

Consumer MEMS Micro-phones Comparison 2020Compare the technology and cost of 19 microphones from Knowles, Goertek, AAC Technologies, STMicroelectronics, TDK-InvenSense, TDK-Epcos, Cirrus Logic and Vesper.February 2020 - EUR 6,490*

Apple iPhone X: MEMS Microphones from Goertek, Knowles, and AAC TechnologiesAnalysis and comparison of the design and process evolution used by Apple’s three MEMS microphone suppliers.March 2018 - EUR 4,490*

USound Achelous UT-P 2016 MEMS SpeakerFirst mass-produced MEMS speaker based on SOI and PZT thin film technology.October 2019 - EUR 3,990*

Peggy Gallois joined System PlusConsulting’s laboratory ofmicroelectronics team in July 2019.She has a deep knowledge of metallicmaterials. She previously worked inthe laboratory of metallographicexpertise for Dassault Aviation nearParis.

Amine Allouche is part of SystemPlus Consulting’s Power Electronicsand Compound Semiconductorsteam. Amine holds a Master’sdegree focused on Micro andNanotechnologies for integratedSystems.

COSTING TOOLS

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT

Process-BasedCosting Tools

ParametricCosting Tools

WHAT IS A REVERSE COSTING®?

Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.

IC Price+

MEMS CoSim+

Power CoSim+

LED CoSim+

3D PackageCoSim+

DisplayPrice+

PCBPrice+

SYSCost+

Our analysis is performed with our costing tools IC Price+ and MEMS CoSim+.

System Plus Consulting offers powerful costing tools to evaluate any process or device, the production cost

and selling price, from single chip to complex structures. All these tools are on sale under corporate

license.

CONTACTS

ABOUT SYSTEM PLUS CONSULTING

System Plus Consulting is specialized

in the cost analysis of electronics

from semiconductor devices to

electronic systems.

A complete range of services and

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production cost studies and to

estimate the objective selling price of

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Our services:

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www.systemplus.fr

sales@systemplus.fr

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Headquarters22, bd Benoni GoullinNantes Biotech44200 NantesFrance+33 2 40 18 09 16sales@systemplus.fr

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MEMS CoSim+Cost simulation tool to evaluate the cost of anyMEMS process or device.

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