Infineon SDM MEMS in Goertek Microphone - System Plus · Presented in 2019, Infineon SDM XENSIVTM...
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+33 2 40 18 09 16 [email protected] www.systemplus.fr SP20549 – MEMS report by Amine ALLOUCHE Laboratory Analysis by Peggy GALLOIS March 2020 – SAMPLE REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT 22 bd Benoni Goullin 44200 NANTES - FRANCE Infineon SDM MEMS in Goertek Microphone Apple’s AirPods Pro use the newest MEMS microphone technology from Infineon: Sealed Dual-Membrane XENSIVTM, found in Goertek’s microphone.
Transcript of Infineon SDM MEMS in Goertek Microphone - System Plus · Presented in 2019, Infineon SDM XENSIVTM...
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 1
+33 2 40 18 09 16 [email protected] www.systemplus.fr
SP20549 – MEMS report by Amine ALLOUCHELaboratory Analysis by Peggy GALLOIS
March 2020 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORTREVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
22 bd Benoni Goullin44200 NANTES - FRANCE
Infineon SDM MEMS in Goertek MicrophoneApple’s AirPods Pro use the newest MEMS microphone technology fromInfineon: Sealed Dual-Membrane XENSIVTM, found in Goertek’s microphone.
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 2
Table of Contents
Overview / Introduction 4
o Executive Summary
o Reverse Costing Methodology
o Glossary
Company Profile 9
o Goertek profile and products
o Infineon MEMS Technology
Physical Analysis 15
o Apple AirPods Pro Teardown
o Summary of the physical analysis
o Package
Package View & Dimensions
Package Opening
Package Cross-Section
o ASIC
ASIC Die View & Dimensions
ASIC Delayering & Main Blocs
ASIC Die Process
ASIC Die Cross-Section
o MEMS
MEMS Die View & Dimensions
MEMS Bond Pad
MEMS Die Process
MEMS Die Cross-Section
MEMS Die Process Characteristics
Manufacturing Process Flow 67
o Overview
o ASIC Die Front-End Process & Fabrication Unit
o MEMS Die Front-End Process & Fabrication Unit
o Packaging Process Flow & Assembly Unit
Cost Analysis 81
o Summary of the cost analysis
o Yields Explanation & Hypotheses
o ASIC Die
ASIC Front-End Cost
ASIC Die Probe Test, Thinning & Dicing
ASIC Wafer & Die Cost
o MEMS Die
MEMS Front-End Cost
MEMS Die Probe Test & Dicing
MEMS Wafer & Die Cost
o Packaged Component
Packaging Cost (per process steps)
Back End: Final Test
Component Cost
Estimated Selling Price 99
Comparison 101
o GWM1 (in Apple iPhone X) versus GWM1 (in Apple AirPods Pro)
o Infineon Dual-Backplate versus Sealed Dual-Membrane MEMS
Feedbacks 106
Company services 108
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing costand selling price of the Infineon Sealed Dual Membrane (SDM) XENSIVTM MEMS microphone. Thismicrophone, sold by Goertek, was found in the Apple AirPods Pro.
Presented in 2019, Infineon SDM XENSIVTM is the newest Infineon MEMS microphone technology. This newMEMS microphone structure uses two movable membranes mechanically coupled by electrically insulatingcolumns to enable a differential read-out process. Between the two membranes, a reduced atmosphericpressure is present where the backplate electrode is suspended: it is a sealed dual-membrane design.
Compared to the previous MEMS microphone technology from Infineon: dual-backplate (2014), the sealed dual-membrane (2019) uses one backplate and two mechanically coupled membranes instead of two backplates andone membrane for 2014 design. According to Infineon, this new design enables practically noise-free audiosignal capturing.
This report includes a comparison between Infineon MEMS microphone technologies: dual-backplate and sealeddual-membrane in Goertek microphones. The comparisons highlight differences in terms of structure, process,and cost.
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 4
Overview / Introduction
Company Profile
Physical Analysiso Apple AirPods Pro Teardowno Summary of the Physical
Analysiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Apple AirPods Pro Teardown
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 5
Overview / Introduction
Company Profile
Physical Analysiso Apple AirPods Pro Teardowno Summary of the Physical
Analysiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Package Opening
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 6
Overview / Introduction
Company Profile
Physical Analysiso Apple AirPods Pro Teardowno Summary of the Physical
Analysiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Package Cross-Section
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 7
Overview / Introduction
Company Profile
Physical Analysiso Apple AirPods Pro Teardowno Summary of the Physical
Analysiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
ASIC Die Proces
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 8
Overview / Introduction
Company Profile
Physical Analysiso Apple AirPods Pro Teardowno Summary of the Physical
Analysiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
MEMS Top Membrane
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 9
Overview / Introduction
Company Profile
Physical Analysiso Apple AirPods Pro Teardowno Summary of the Physical
Analysiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
MEMS Cross-Section – Edge region: Backplate
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 10
Overview / Introduction
Company Profile
Physical Analysiso Apple AirPods Pro Teardowno Summary of the Physical
Analysiso Packageo ASIC Dieo MEMS Die
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
MEMS Characteristics
Feature Parameter Dimension
xxx xxx Thickness xxx
Metal Pad xxx Thickness xxx
Top Membrane
xxx Thickness xxx
xxx Diameter xxx
xxx Depth xxx
xxx Width xxx
Top Membrane/ Backplate xxx Thickness xxx
Backplate
xxx Thickness xxx
xxx Diameter xxx
xxx Depth xxx
Backplate/ xxx xxx Thickness xxx
xxx
xxx Thickness xxx
xxx Thickness xxx
xxx Width xxx
xxx xxx Thickness xxx
xxx xxxDiameter xxx
Thickness xxx
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 11
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flowo Overviewo ASIC Process Flowo MEMS Process Flowo Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
ASIC Front-End Process
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 12
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flowo Overviewo ASIC Process Flowo MEMS Process Flowo Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
MEMS Process Flow (2/4)
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 13
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flowo Overviewo ASIC Process Flowo MEMS Process Flowo Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Packaging Process Flow (1/2)
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 14
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Yields Explanation &
Hypotheseso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
ASIC Front-End Cost
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 15
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Yields Explanation &
Hypotheseso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
MEMS Front-End Cost per Process Steps
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 16
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Yields Explanation &
Hypotheseso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Packaging Costo Component Cost
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Package Cost
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 17
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Estimated Selling Price
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 18
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Infineon Evolution – MEMS Comparison
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 19
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Infineon Evolution – MEMS Process Comparison
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 20
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Plus
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
MEMS• SP20458: Consumer MEMS Microphone Comparison • SP18384: Apple iPhone X: MEMS Microphones from
Goertek, Knowles, and AAC Technologies• SP19491 - USound Achelous UT-P 2016 MEMS Speaker• SP17314 - Vesper VM1000 Piezoelectric Microphone• SP16292-SP16294-SP16296 - Apple iPhone 7 Plus: MEMS
Microphones
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
MEMS• Microphones, Microspeakers and Audio Solutions Market and
Technology Trends 2019• Status of the MEMS Industry 2019
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 21
COMPANYSERVICES
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 22
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
Business Model Fields of Expertise
©2020 by System Plus Consulting | SP20549 - Infineon Sealed Dual-Membrane (SDM) MEMS in Goertek Microphone | Sample 23
Overview / Introduction
Company Profile
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Feedbacks
Related Reports
About System Pluso Company serviceso Contacto Legal
Contact
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