Industrial Embedded Systems 2015 Resource Guide

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www.industr ia l -embedded.com VOLUME 11 • NUMBER 1 2015 RESOURCE GUIDE

COLUMNS 4 Foreword Thinking Five keys to securing the IIoT data pipe By Brandon Lewis, Assistant Managing Editor

5 Industrial Insights Industrial Internet of Things – How much will

manufacturing devices be networked? By Alex Hong, IHS

EVENTSEmbedded TechCon® June 8-10 Moscone Center, San Francisco, CAwww.embeddedtechcon.com

IoT Evolution Developer’s Conference August 17-20 Caesar’s Palace, Las Vegas, NV www.iotevolutionexpo.com/developers-conference/west/

E-CASTIoT and M2M safety and security October 21 Presented by Echelon, Freescale, GrammaTech, RTI ecast.opensystemsmedia.com/549

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Industry news: www.industrial-embedded.com/news

RESOURCE GUIDE3 PROFILE INDEX 24 Human Interface25 Industrial Hardware37 Industrial Internet/IoT40 Industrial Software41 Industrial Storage40 Industrial Systems43 Sensors and Control43 Small Form Factor Modules

FEATURESIndustrial Internet 6 Industrial Internet Consortium:

Purpose and membershipBy Stephen Mellor, Industrial Internet Consortium

8 The rise of Industrial/Enterprise IoTInterview with Steve Jennis, PrismTech

12 Protocol gateways make IoT efficient, accurate, and low costBy Cindy Hollenbeck, SoftPLC Corporation

Sensors 16 Sensor processing platforms

add performance, cut SWaP for the Industrial InternetInterview with Rubin Dhillon, GE Intelligent Platforms

Industrial Software 18 Safety-certified software shrinks to

new lows on multicore SoCsBy Brandon Lewis, Assistant Managing Editor

Industrial Hardware 22 Best practices in meeting oil and

gas data acquisition needsBy Maria Hansson, Kontron

2015 OpenSystems Media ® © 2015 Industrial Embedded SystemsAll registered brands and trademarks in Industrial Embedded Systems are property of their respective owners. ISSN: Print 1932-2488 Online 1932-2496

COVERThe 2015 Industrial Embedded Systems Resource Guide surveys industry as they power up the Industrial Internet. Find building blocks for your next Industrial Internet deployment, such as Critical Link’s MitySOM-5CSx Altera Cyclone V SoC-based SOM, in product profiles beginning on page 24. Image of Sheringham Shoal Offshore Wind Farm courtesy Harald Pettersen/Statoil.

2 / 2015 Resource Guide I n d u s t r i a l E m b e d d e d S y s t e m s www.industrial-embedded.com

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E M B E D D E D S Y S T E M SINDUSTRIAL

John McHale Group Editorial Director Military Embedded Systems PC/104 and Small Form Factors PICMG Systems & Technology VITA TechnologiesRich Nass Embedded Computing Brand Director Embedded Computing Design [email protected] Gipper Editorial Director VITA Technologies [email protected] Schwaderer Editorial Director Embedded Computing Design [email protected] DeVoe Managing Editor Embedded Computing Design [email protected] Gilmore, E-cast Manager [email protected]

Lisa Daigle Assistant Managing Editor Military Embedded Systems PC/104 and Small Form Factors [email protected] Iriarte Assistant Editor Military Embedded Systems [email protected] Cole Senior Editor Military Embedded Systems [email protected] Dear Technical Contributor Embedded Computing Design [email protected] Konrad Witte Senior Web DeveloperSteph Sweet, Creative Director Dave Diomede, Creative Services DirectorJoann Toth, Senior DesignerChris Rassiccia, Graphic Designer

10 ACCES I/O Products, Inc. – Rugged, industrial-strength USB

44 Annapolis Micro Systems, Inc. – WILDSTAR OpenVPX ecosystem

1 Critical Link – MitySOM-5CSx Altera Cyclone V SoC-based SOM

21 Elma Electronic – Reduce, save, improve. Elma’s rugged platforms do all that – and more

20 Toradex – 500 Million+ people rely on Toradex every day

11 WDL Systems – The power inside tomorrow’s technology

HUMAN INTERFACE24 EMAC, Inc.25 MEN Micro Inc.

INDUSTRIAL HARDWARE 25 - 26 ACCES I/O Products, Inc.26 Acnodes Corporation27 Aitech Defense Systems, Inc.28 - 34 Annapolis Micro Systems, Inc.35 Critical Link35 Intermas US LLC36 - 37 WinSystems

INDUSTRIAL INTERNET/IoT 37 ADLINK Technology, Inc.38 Artila Electronics Co., Ltd.38 EMAC, Inc.39 Isola39 WinSystems

INDUSTRIAL SOFTWARE 40 WITTENSTEIN high integrity systems

INDUSTRIAL STORAGE 41 Annapolis Micro Systems, Inc.42 ATP Electronics

INDUSTRIAL SYSTEMS 40 Innovative Integration

SENSORS AND CONTROL 43 Innovative Integration

SMALL FORM FACTOR MODULES 43 Innovative Integration

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By Brandon Lewis, Assistant Managing Editor

>>foreword thinking

Five keys to securing the IIoT data pipeIndustry is realizing the missed opportunities that have resulted from squandered connections between machine data and analytics in those conventional configurations, and have begun pushing for designs that leverage the Internet and the cloud more heavily. Obviously, opening these networks to the broader Internet comes with inherent security risks, and fur-ther complicates the ongoing tradeoff developers must make between performance, reliability, and security.

In response, companies are turning to the data distribution service (DDS), a middleware standard governed by the Object Management Group (OMG) that provides a scalable, secure data pipe for Industrial Internet systems. While the DDS stan-dard itself was originally developed by Real-Time Innovations (RTI) and Thales Group in 2001 and approved by the OMG in 2003, vendors of the middleware recently realized the need for more comprehensive definitions of the security model and service plugin interface (SPI) architecture in the standard, and subsequently began work on the DDS Security Specification (DDS-SECURITY) in 2014. After successfully demonstrating interoperability of DDS-SECURITY at OMG meetings in March, David Barnett, VP of Products and Markets at RTI, agreed to walk me through the five key tenets of the spec:

1. Authentication – In the DDS-SECURITY spec, authentication is used to verify that every device or user participating in a distributed system is who he, she, or it attests to be. The DDS Authentication SPI provides faculties for performing mutual authentication between participants so that “shared secrets” can be established, and sets the table for Access Control.

2. Access Control – Access Control may be the most critical security component of Industrial Internet/IIoT systems, as it defines who can publish or subscribe to a certain type of data or metadata across a DDS network. DDS provides very fine-grained access control, and includes a “discovery” feature that enables applications to be written in such a way that when new sensors are added to a network they can automatically be identified without any additional coding required. The Access Control SPI also gives developers control over the kinds of data/metadata those applications have visibility into, which combined with discovery is key to building and deploying scalable distributed networks.

3. Cryptographic – The Cryptographic SPI, in other words encryption, ensures that data moving across DDS networks in private. However, unlike typical forms of encryption,

the elegance of cryptography in DDS is that it allows developers to choose what data needs to be encrypted and what doesn’t. The ability to select only certain data for encryption is important for the resource and bandwidth constraints of industrial systems and networks. For those messages that are not encrypted, the DDS Security Specification also includes provisions for secure digital signatures so that senders can be authenticated without the overhead of encryption itself, which helps protect systems that may be vulnerable to spoofing or man-in-the-middle attacks.

4. Logging – Logging supports auditing of all security-related events on a distributed network. This gives administrators the ability to monitor any attempts to break into the system, including instances when the content of a message doesn’t match its signature, usually an evidence of a man-in-the-middle attack.

5. Tagging – Finally, tagging is a feature that allows developers to inject metadata into a message that designates the content’s security level. As an extension of access control, this makes it possible for sensor data from a wind turbine, for example, to be classified by “confidential” or “unrestricted” so that the appropriate data can be mad available only to specific participants in large distributed networks.

RTI provides these DDS-SECURITY SPIs in their out-of-the-box Connext product that uses standard algorithms for encryption and public key infrastructure (PKI) for authentication, and also implements a plug-in approach for organizations that already have already policies and practices in place, or that need to meet the certification requirements of a particular industry. The flexibility of the DDS domain-specific modeling paradigm is one of the elements of the middleware that set it apart from other low-level messaging standards such as MQTT and CoAP, and a major enabler of the five keys to a secure IIoT data pipe.

OMG members expect to approve the DDS-SECURITY specifi-cation by the end of the year. IES

“The flexibility of the DDS domain-specific

modeling paradigm is one of the elements of

the middleware that set it apart from other

low-level messaging standards ...”


average when compared to other sectors of the electronics industry, some of which approach nearly 50 percent connectivity (enterprise and consumer). In this regard, the potential for deploying networks in industrial automation environments is still large and unrealized.

However, this situation is changing. Forecasts project that for new instal-lations, the percentage of network-enabled industrial automation devices will far exceed the average for those already in operation, with the compound annual growth rate (CAGR) of such deployments increasing from 19.0 per-cent in the base year of 2013 to 24.1 per-cent in 2019 in Industry 4.0 and smart manufacturing environments.

An example of this change is the increased use of Industrial Ethernet (IE) in programmable logic controllers (PLCs), which are a key component of automation systems. Over the last few years, embedded networking features have largely been restricted to mid- and large-sized PLCs, but recently more and

more compact PLCs are being integrated with IE technology as plant operators realize the importance of improving the productivity of their factories. This also illustrates the proliferation of networking technology at the control level of manu-facturing centers rather than solely at a supervisory level in the monitoring office.

With PLC and other connected applica-tions gaining traction at the control level in manufacturing environments, networking technologies will subsequently see wider adoption in the world of industrial auto-mation and control. This will lead to more open environments in the manufacturing center, and an opportunity to capitalize on the untapped potential of networking technologies for the IIoT. IES

Alex Hong is Senior Analyst, Discrete Process and Automation in the Industrial and Medical Technology Group at IHS Technology.

IHS Technology technology.ihs.com [email protected]


By Alex Hong, Analyst, Industrial Automation, IHS

Industrial InsightsIndustrial Internet of Things – How much will manufacturing devices be networked?The concepts of Industry 4.0 proposed by Germany, the Smart Manufacturing Leadership Coalition in the United States, and Made in China 2025 and “Internet Plus” in China are national stra-tegic initiatives to enhance the penetra-tion of networks in the manufacturing industry. Although they have different names, the philosophy behind them is almost exactly the same – integrate net-working technologies into manufacturing processes. Technologies and strategies that previously have not been associated with the manufacturing industry are now being advanced, such as customization, shortened delivery times, real-time data analysis, cybersecurity, Big Data, and so on. All of these concepts are part of the convergence of networking and manufacturing. This is what we call the Industrial Internet of Things (IIoT).

The IIoT is changing manufacturing from an “old-fashioned” and “conservative” industry to one that is more interactive and in line with the consumer experience. However, the past few years have shown this process to be quite slow, as business owners have applied network technolo-gies to their manufacturing centers cau-tiously to ensure minimal disruption of the manufacturing process. Even in the networked applications deployed today, proprietary network technology and tra-ditional architectures as fieldbus remain the rule rather than the exception.

A recent IHS report on the Internet of Things shows that while the manufac-turing industry is currently comprised of an installed base of 23.8 billion industrial automation devices, networked applica-tions are still not prevalent (Table 1). Currently, only 9.1 percent of discrete process and automation elements are connected to a network, which is below

Table 1 | Currently only 9.1 percent of automation devices are networked, but deployments of Internet-enabled manufacturing devices will grow at a 24.1 percent CAGR through 2019. Source: IHS Technology.

2013 2015 2019 CAGR ’13-’19

Installed Base – Consumer CPE 508,192 599,866 765,602 7.1

Percent Connected 70.3 72.4 80.6

Installed Base – Enterprise CPE 1,158,885 1,317,992 1,522,995 4.7


Installed Base – Mobile Handsets 6,949,396 8,013,115 9,144,474 4.7


Installed Base – Industrial Automation 23,760,519 37,494,480 56,494,044 15.5


New Shipments – Industrial Automation 5,298,296 5,925,095 7,060,258 4.9




http://www.technology.ihs.com


Industrial Internet

This is the first of in a series of

articles describing the Industrial

Internet Consortium (IIC). The first entry

describes the goals, membership, and

a broad outline of its work.

The Industrial Internet Consortium was founded on March 27, 2014 by AT&T, Cisco, GE, IBM and Intel. Its mission is “to accelerate growth of the Industrial Internet by coordinating ecosystem ini-tiatives to connect and integrate objects with people, processes, and data using common architectures, interoperability, and open standards that lead to trans-formational business outcomes.”

The rationale behind the Consortium is cooperation and collaboration. The founding companies discovered they had to solve similar technical problems with different partners repeatedly, with the danger that the problems would be solved in incompatible ways. Rework increases costs and the likelihood that similar technologies will be incompat-ible, even when developed by the same company. This was both ineffective and inefficient. To scale the Industrial Internet so it can be widely utilized and adopted, there must be an ecosystem to enable innovation across multiple com-panies and technologies.

This innovation often springs from small companies who need partners. These companies can ill afford the time and money required to trek to every poten-tial partner, open the doors, find the right people, establish relationships, and then commence lengthy negotia-tions. They’d go out of business. They need a forum to meet the right com-panies, and some templates for how to construct agreements that are beneficial to all parties.

Moreover, the Industrial Internet is a “blue ocean” market, full of opportunity and bereft of competition. Why quibble over tidbits near the shore? Why not grow new markets in collaboration with partners, each taking a share of a larger pie in “coopetition”?

As of May 1st, IIC membership totals 163 companies, representing public and private organizations across the world including large global leaders, startup companies, system integrators, research institutions, universities, government institutions, and market researchers. In Figure 1, the small slice includes founders and individuals.

Many of the large companies, and cer-tainly the founders, are global. They may have headquarters in the U.S., Japan, or South Korea, but their reach is world-wide (Figure 2). Nearly half the mem-bership comprises small companies. This is a result of a deliberate decision to price small-company membership at an affordable level to encourage smaller companies to join and so support the goal of encouraging an ecosystem for innovation.

InitiativesIIC EcosystemThe IIC has three main initiatives, as illustrated in Figure 3. The first element, the IIC Ecosystem, brings companies together to advance innovation, create ideas, insights, and best practices, and to provide thought leadership. The Industrial Internet has started to

CONSORTIUMindustrial internet

Industrial Internet Consortium: Purpose and membershipBy Stephen Mellor, Industrial Internet Consortium

Figure 1 | The Industrial Internet Consortium is comprised of public and private entities, from startups to market leaders, from non-profit organizations to government institutions.

Member Organizations

Large, 46

Small, 78

Nonprofit, 32

Figure 2 | The Industrial Internet Consortium is a global organization that encourages innovation and ecosystem advancement by supporting smaller companies.

Member OrganizationsAustralia, 1

Europe,30

North America, 103

South America, 2

Asia,27


When Sir Tim Berners Lee invented the Universal Resource Locator he could not have imagined what the Internet would become over the next 30 years, and that innova-tion continues today. So it is with the Industrial Internet – we can’t predict what it will be a few decades from now, but we do know that to grow it must have an open architecture that is secure and private, with interoperable parts (or, in English, parts that work together).

TestbedsThe third and final initiative is Testbeds. We can write requirements, blog entries, standards, and presentations laden with bullets till the cows come home. But does it work? To find out, we have to build something and put it through its paces. The IIC facilitates Testbeds by bringing companies together to build these facilities. Then, by executing real code and moving real machinery, we can determine whether the archi-tecture really is open, interoperable, secure, and private. And iterate.

Testbeds require funding. So, in addition to bringing companies together to fund them, the IIC has several initiatives to build relationships with academia and global government agencies to build public-private initiatives.

To learn more about the Industrial Internet Consortium or find out how to become a member, visit www.iiconsortium.org. IESReferences:[1] World Economic Forum. “Industrial Internet of Things: Unleashing the potential of

connected products and services.” http://www.weforum.org/reports/industrial-internet-things-unleashing-potential-connected-products-and-services.

Stephen Mellor is Chief Technical Officer for the Industrial Internet Consortium.

Industrial Internet Consortium www.iiconsortium.org

@IIConsortium

www.linkedin.com/groups/Industrial-Internet-Consortium-5189581

www.facebook.com/IIConsortium

www.youtube.com/user/IIConsortium


transform the industry through new processes and connected products and services. One goal of the IIC is to create awareness of the innovation happening today, and to champion innovation in connected intelligent machines and pro-cesses to external audiences with a look at what is to come.

Sample Ecosystem activities include teaming with the World Economic Forum on its January 2015 report, “Industrial Internet of Things: Unleashing the Potential of Connected Products & Services” [1]; keynotes and talks at more than 20 conferences in North America, Europe, and Asia; published case studies from IIC members; opening a global dig-ital conversation on specific IoT topics; and more.

Technology & SecurityThe second initiative is Technology and Security. This provides interoperability, security, and privacy by producing requirements for standards in open architectures. Note that the IIC produces requirements for standards, not the stan-dards themselves. The IIC is not a stan-dards organization. Rather, it hopes to use its depth (from applications to chips) and breadth (across much of the indus-trial space), and a spirit of collaboration and cooperation, to bring together and harmonize global standards activities to avoid market fragmentation and grow that market!

Figure 3 | The three main initiatives of the Industrial Internet Consortium are identified as the IIC Ecosystem, Technology & Security, and Testbeds.

The IICEcosystemCompanies joining together to advance innovation, create ideas, insights and best practices, and to provide thought leadership

Technology& SecurityProvide interoperability, security and privacy by producing requirements for standards in open architectures

TestbedsInnovation to drive new products, processes, and services

“... we can’t predict what it

will be a few decades from

now, but we do know that to

grow [the Industrial Internet]

must have an open architecture

that is secure and private,

with interoperable parts.”

http://www.iiconsortium.org

http://www.weforum.org/reports/industrial-internet-things-unleashing-potential-connected-products-and-services

http://www.iiconsortium.org


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Industrial Internet

And then you’ve got the enterprise, and I include Industrial IoT in Enterprise IoT. As the operational technology (OT) and information technology (IT) worlds converge, they start to become indistinguishable from each other in the sense that enterprises want end-to-end systems, enterprise-wide data sharing, and to be able to extract new insights – or business value – from data wherever it makes sense, whether it’s at the system edge device, or in a gateway, or in the cloud, or even in an inter-company supply chain where you abstract above an individual enterprise. [The inter-company supply chain] is one of the thrusts of Germany’s Industry 4.0 initiative, where they’re not looking at just factory automation, but inter-factory automation – to integrate the supply chain from raw materials generation, whether in a mine or an oil refinery or any other raw material production, right through to the new connected car sitting in your driveway.

So you’ve got what I call Enterprise IoT, and I think that’s a thrilling place to be right now for several reasons. Firstly, it’s clearly going to be the biggest market. Secondly, it’s also the most demanding market because of all the data sharing requirements for the optimization and coordination of edge devices – like the “brilliant machines” GE talks about that stream terabytes of data – as well as the analysis of Big Data in the cloud for trend analysis, preventative maintenance, or failure prediction, or locally for fine-tune control, fault analysis, etc. Whether the data delivery requirements are in microseconds, milliseconds, or seconds, the system has to cope. So there is lots of technical innovation and opportunity for new players. Thirdly, it is a “hot” market with lots of press coverage and investment activity.

Enterprise IoT is also where IT and OT organizations have to interface. So it’s forcing the OT guys to get familiar with things like tablets and cloud services and using the Internet for communications rather than proprietary in-house LANs, and it’s forcing the IT guys to understand how their company actually makes money – what they make, how they make it, how they deliver it, what suppliers they have to work with to do that,

As the IoT hype peaks, the time

has come for marketing to become

implementation, for promise to become

fulfillment. However, not all variants

of the IoT are created equal, and this

interview with Steve Jennis, Senior

Vice President, PrismTech, reveals how

the Industrial/Enterprise IoT differs

from consumer-oriented versions of

the IoT, as well as the requirement

for an Industrial IoT data connectivity

architecture and projections for when

the major industry players will make

the IIoT a reality for big business.

What’s the difference between the IoT and the Industrial IoT?JENNIS: It’s a question of market seg-mentation and I think many people are still trying to work it out to be honest. Let’s start by looking at all the contribu-tory parts.

You’ve got the consumer world, the world of Adidas and Nike, where large manufacturers are selling connected products to the consumer. That’s one flavor of the IoT. Then you’ve got the home automation market with Google Nest and Apple and those guys, which is not quite the consumer market of Nike and Adidas because it’s really looking at establishing a foothold in the family home and selling all sorts of connected devices in a plugged-together systems environment. So it’s consumer, but it’s more systems-led than product-led. Then another flavor is what you might call the traditional M2M space, with applica-tions like fleet management and vending machine monitoring that are more busi-ness than consumer, but are still what I’d call tactical rather than strategic – point solutions that are very often silos of data and lacking some of the vendor support or robustness that major enterprises are looking for.

The rise of Industrial/Enterprise IoTInterview with Steve Jennis, PrismTech



and so on. The IT guys are coming out of their computer rooms and away from their Oracle databases and SAP configu-rations, and they’re having to get their shoes “dirty” on the shop floor.

In summary, the consumer and tactical space is the IoT sandpit right now where people are checking out self-contained applications, seeing what pays off, what works, what makes money, and what doesn’t – toe-in-the-water stuff. But if we’re really going to move towards the digital enterprise, that requires much more than tactical IoT implementations or single-purpose consumer products. What’s required is an end-to-end strategy for the enterprise that makes data – whether it’s operational data or corporate data – available on demand for con-trol and analysis and fine-tuning and insights and feedback and new services, wherever that value add needs to be. The big Enterprise IoT market is just over the horizon, but it will not take off until the trusted vendors to that enter-prise market have viable IIoT solutions.

How does DDS help facilitate the IT/OT integration?JENNIS: The way we look at it is that, inevitably, in any scenario, you’re going to have multiple protocols in your system. It’s never going to be a single-protocol solution in an enter-prise environment. The reality is that most Enterprise IoT systems will have elements of brownfield or legacy sub-systems, and you will have to extract data from or deliver data to those sub-systems, which could be running on any-thing from a proprietary protocol to an out-dated standard, for example. So you have to have some way of bridging to and from those subsystems. That’s the first thing. You’ve got to have access to the data and be able to deliver, so you need good gateway technology.

Secondly, for a corporate data con-nectivity platform you need to satisfy a number of requirements, so you’re going to have to have a high quality of service (QoS) data delivery backbone that is not in any way constraining the potential of the system. So it’s a bit like telecoms backhaul, where you have to be able to support a lot of calls and you don’t know what peak demand is going to be or what people are going

to be streaming to their cell phones, but you’ve got to be able to deliver the data and you’ve got to be up and ready to do that 99.9999 percent of the time. Regardless of what the system needs, you’ve got to be able to deliver the data.

So the data connectivity backbone pro-tocol has to be able to do many things in terms of QoS over and above just moving data around. When you start looking at candidate protocols for this sort of enterprise-wide backbone, you start to discount many pretty quickly. Anything that’s proprietary is going to be out the window straight away because nobody today is going to tie their whole corporate infrastructure to one particular vendor. The days of being 100 percent single-vendor are gone – users want openness, they want standards, and they even want open source in some cases.

So, you discount all the proprietary pro-tocols – and that rules out a lot of the traditional industrial/OT protocols, by the way. Then you have to discount the lightweight protocols that don’t have the QoS for an enterprise backbone like MQTT or CoAP. These support very few QoS – MQTT supports three – and don’t support sophisticated data-centric features such as content-based filtering, traffic optimization for bandwidth con-straints, dynamic discovery, and the many other QoS that are needed for the high performance, efficiency, fault toler-ance, and reliable recovery required in an enterprise system; all the clever stuff that needs to be supported in a back-bone so that you can manipulate the data in multiple dimensions – in terms of latency, in terms of determinism, in terms of routing, bandwidth efficiency, security, and so on.

In addition, you need a protocol that can be implemented in resource-constrained edge devices, the cloud, and everything in between.

So if you’re going to go with an enter-prise strategy you need a backbone protocol that’s going to be able to support everything you need to do in the future, so you need to choose one that isn’t specific to a particular vertical market or a particular tactical applica-tion. You need an enterprise-grade data connectivity solution, and one that can

easily bridge to other protocols. What’s it going to be for the enterprise IoT? We think DDS has a great shot at being the protocol of choice because of its com-prehensive QoS and proven capability in mission-critical systems.

Already a lot of the lightweight protocols touted for the IoT today are showing their limitations – particularly for edge com-puting, where low-latency peer-to-peer interoperability is essential (in addition to device to cloud). There are a number of influential papers that have been pub-lished recently from experts in markets such as smart energy/smart grid that basically say DDS is essential because it’s the only protocol that has the suite of QoS required for a backbone data con-nectivity platform in critical systems.

PrismTech’s Vortex platform utilizes the DDS protocol to provide 23 QoS that support it being used as an enter-prise data connectivity platform. It also includes the Vortex Gateway, which utilizes Apache Camel bridging tech-nology to provide support for integra-tion of legacy or new subsystems into the Enterprise IoT environment, with specific connectors for DDS and over 80 other protocols.

We’re not shy about telling people that they can choose any protocol they’d like, but to be aware that it might be the weakest link in their chain. If you have extremely high-performance hard-ware and software running at the edge and you’ve got unlimited, affordable resources in the cloud, you also need the right data-connectivity platform to make the best use of all that computing power or it could be like trying to drive a Ferrari down a road full of potholes; great data, but poor delivery infrastruc-ture. It doesn’t really matter if you have “brilliant machines” at the edge and incredible Big Data analytics in the cloud if you can’t move the data in a reliable and timely way to take advantage of it in real time. You’d really be wasting a lot of your investment in the “Things” and the cloud services without the right data-connectivity glue between them.

A lot of the IoT buzz is about device-to-cloud, but seems to ignore device-to-device. Maybe this is because many vendors are selling cloud services, and



Industrial Internet DDS is a protocol that’s already cracked the problem at the edge and has now been extended to the cloud. It’s much easier to do that than to start in the cloud and then try to solve edge prob-lems because you just don’t have the low-latency capability you require. If your protocol has been designed to sup-port applications that have one-second updates, you’re a million times away from handling microsecond computing. But if you start at microseconds and crack that problem, doing one-second updates is easy. You just take a break.

What we’re finding is that people look at a cloud-based approach, and that’s all well and good until they get out to the sharp end of the spear where you need to integrate machines that are operating in real time and require data analytics at the edge. People are getting to realize now that both are required: Cisco has recognized this with Fog Computing; Intel has recognized this with their back-ground in industrial automation and real-time systems such as their Wind River franchise; and the IBMs and Microsofts are beginning to realize it as they begin to face IT/OT integration challenges.

When are we going to see the Industrial/Enterprise IoT living up to all the hype?JENNIS: We have a strange situation today in that we have an extremely exciting market that everyone now pretty much agrees is going to be massive, but you don’t see the major players really coming in yet with full force. You might argue that IBM has had their Smarter Planet initiative around for several years, and that’s true, and there’s a lot of talk about the IoT from people like Cisco in terms of the Internet of Everything and Fog Computing. But I’m not aware that they have yet delivered complete Enterprise IoT solutions. And when you look at the traditional M2M vendors, whether you’re talking about Xively or SeeControl or Digi International or Eurotech, they’re all relatively small companies primarily focused on tactical applications.

But I fully expect that in the next 12-18 months we’re going to see the big IT guys coming to market with much

when you’re in the cloud everything at ground level only looks like a simple data source. But if you don’t really care about anything except what data goes up to the cloud then you’re missing a key price of the puzzle, for instance your requirements for edge computing are conveniently ignored. However, when you talk to forward-looking enterprises or an advanced OEM, they need to do their computing wherever it generates value in the system. Not just in the device, not just in the cloud, but in the device, in the cloud, in the gateway, and anywhere between where new value can be generated. Anywhere that you can extract value from the data you need to be capable of control and/or analytics, and if you’re going to have an enterprise-wide strategy you need to have this distributed computing paradigm and you need to have the IoT tools and infrastructure to support it. That’s when experts arrive at DDS, because DDS, with its heritage as a real-time distributed computing protocol, handles really demanding performance at the edge as well as in the cloud.


http://acces.io


more complete platform solutions and really energize the enterprise space to move aggressively forward to exploit the IIoT. They are going to do very well in that market because, basically, very large organizations like to do business with very large organizations. You’re not going to provide a strategic IoT platform to a major global enterprise if you’re a smaller vendor. Most major enterprises will want to be partnered with an Intel or a Cisco or an IBM or a Microsoft for their IoT infrastructure. The same applies to many of the large OEMs (with maybe the obvious exception being GE, which is doing it all themselves at the moment and marketing the heck out of it and positioning themselves as the dominant player, but that doesn’t come free – they claim over 1,000 software engineers are working on Industrial Internet technolo-gies and deployments[1]). The majority of large enterprises and OEMs are not going to build platforms themselves or go to smaller vendors, they’re going to turn around to their trusted large vendors and say, “you’re our enterprise platform provider, where’s your IIoT platform?”

The big users and OEMs, the guys who spend seven or eight figures a year on their IT infrastructure and applications and knitting it all together, those with thousands of employees in hundreds of countries, they’re waiting for their major vendors to come to market with Enterprise IoT solutions, and I think 2015 is going to be the year that starts to happen. The big IT vendors will select and assemble the component parts into comprehensive IIoT platforms and get their acts together over the next year, and then you’re going to start seeing the fight over billions of IoT dollars globally. We’ll also see Asian and European players get-ting seriously into the game as well, such as some of the German OEMs who are as advanced as anyone in the IIoT market.

So when the major vendors eventually come to market with their soup-to-nuts enterprise IoT platforms, with software functionality that does everything you need so you can just build your analyt-ical apps, share data system-wide, and deploy within weeks – and, by the way, also interface with every other part of your enterprise so you can liberate data as and when you’re ready and manage security because you can partition the

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data – there will be all sorts of IIoT options available to you as an enterprise customer. And, at that point, enterprise executives will say, “If my vendor has this IIoT platform for me I better be doing something with it since the board of directors has asked for my plan to exploit the IoT in the last four board meetings.” IES

References:[1] The Harvard Business Review. “HBR on GE’s Revolutionary Evolution.”

https://www.gesoftware.com/blog/hbr-ge%E2%80%99s-revolutionary-evolution.

PrismTech • www.prismtech.com

@prismtech

www.linkedin.com/groups/PrismTech-Community-1864983?mostPopular=&gid=1864983

www.facebook.com/pages/PrismTech/140964365933471

www.slideshare.net/PrismTech1


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Industrial Internet

engine oil sensor can provide information so that maintenance can be scheduled based on need and optimal performance instead of a “suggested maintenance interval.” Automation replaces manual processes to improve efficiency, and this allows more information to be easily tied into the data collection process.

Does all this “stuff” just natively communicate to each other or in the same “language?” Of course not! Different media (serial, Ethernet, wireless, and proprietary networks, for example) and even different protocols on the same media are common. Even as industrial control products have embraced open architectures and standards, there are still a lot of options available. Sensor and equipment vendors select which commu-nication methods to support based on a variety of factors, including cost, complexity, and in some cases, a desire to protect intellectual property (IP). Different parts of the world embrace different standards.

So how can a manufacturer who wants to optimize their process get the data from the machines to a central database most effectively? Gateways are the answer.

A gateway, sometimes referred to as a protocol converter, is a device that can com-municate on multiple networks, passing the information from one to another. Using a mix of gateways, it’s possible to connect all the diverse equipment in a facility to a common network, and from there to a data acquisition system and/or database. As shown in Figures 1, 2, and 5, gateways can transfer data over multiple communication media options.

Gateways can be dedicated hardware, or the function can be embedded in the firm-ware or software of an intelligent device such as a programmable logic controller (PLC), human-machine interface (HMI), or computer. Examples are shown in Figure 2.

Embedded into most gateway products are the hardware interface and low-level pro-tocol details of their supported protocols. Configuring the gateway for a specific

By Cindy Hollenbeck, SoftPLC Corporation

Having complete and current data

about any process can result in better

decision making. One of the primary

benefits of the Internet of Things

(IoT), sometimes called the Industrial

Internet, is that companies can make

improvements in production processes,

end products, and logistics that reduce

costs and energy usage. By capturing

and centralizing information from all the

pieces/parts of production and doing

so in a timely, automatic, non-intrusive

manner, analytics programs can find

places for these improvements.

Whether it be a factory, a processing plant, or a remote stand-alone location such as a well site, a typical manufac-turing operation contains a mixed bag of sensors, instruments, PLCs, drives, RFID/barcode readers, energy man-agement systems, and other intelligent devices that don’t all communicate on the same network.

Over time, sensors and automation are purchased from multiple OEMs, who in turn purchase equipment from multiple vendors, and these purchases occur at different points in time and stages in the development of automation technology. Companies merge and move equipment between plants, and upgrades to equip-ment are made at staggered intervals for many reasons including funding, scheduling downtime, changes to the end product, or breakdowns and obso-lescence of parts.

Additionally, more and more sensors are being added to equipment new and old so that more data can be gathered for analytics applications. For example, an

Protocol gateways make IoT efficient, accurate, and low cost

Image courtesy Siemens AG, Munich/Berlin.



application is normally accomplished through a simple mapping process, which identifies the source/target addresses for each protocol as well as network-specific information such as baud rates, node addresses, and so on.

Gateway products that pass data from one communication protocol to another are available from dozens of vendors, and you can find a dual-protocol gateway to convert between almost any two protocols. Many PLCs today include both Ethernet and serial interfaces (and/or support added protocols via com-munication modules), and thus could potentially be used for protocol gateway functions. Most modern HMI products have multiple ports (for example, serial, Ethernet, and USB) and support more than one driver simultaneously, and therefore can be used as a gateway for the most popular industrial protocols.

Some gateway products are even more flexible. They include a host of hard-ware interfaces with user-selectable I/O drivers so a single product can serve a wide variety of communication needs. One example is SoftPLC Corporation’s Smart Gateway, which has an embedded 4-port managed Ethernet router and six serial ports, each of which can be configured for different protocols such as ASCII, Modbus, DF1, CAN/J1939, Modbus TCP, and many others (Figure 3). SoftPLC Gateways also pro-vide hardware options to add support

ModbusTCP

WirelessHART

2a

2b

Figure 1 | Depicted here is a dedicated two-protocol hardwired gateway.

2c

Figure 2a and 2b and 2c | Gateway functionality can embedded in hardware such as a dedicated WirelessHART to Modbus TCP gateway (Figure 2a), or implemented in the software or firmware of intelligent devices like a multi-protocol PLC that supports ASCII, remote I/O, and EtherNet/IP, and DeviceNet (Figure 2b), or HMI supporting Modbus, Modbus TCP, and a TCP/IEthernet/IP local area network (LAN) (Figure 2c).

Figure 3 | SoftPLC Corporation’s Smart Gateway includes a 4-port managed Ethernet router and six serial ports that can be configured for protocols ranging from ASCII, Modbus/Modbus TCP, DFI, CAN/J1939, and others.



Industrial Internet for a wide variety of fieldbus networks (for example DH+, Profibus, DeviceNet) and remote access (for example wireless, cell modem). In fact, SoftPLC Gateways can support up to 16 networks simulta-neously with no data limits.

Appropriate use and selection of gate-ways provides connectivity to all devices, whether they are single sensors or con-trollers with thousands of data values. Gateways can make the IoT a practical reality. IES

Cindy Hollenbeck is Vice President of SoftPLC Corporation. For over 34 years she has been actively involved in PLC and industrial communications hardware and software specifications and marketing, with a career starting at Rockwell Automation and continuing as one of the founders of SoftPLC Corporation.

SoftPLC Corporation www.softplc.com [email protected]

Distributed assets data acquisitionA company that provides chemicals used at oil well pumping sites was able to improve delivery logistics, which reduced their customer’s downtime while reducing fuel and labor costs. At each well site, level sensors were added to chemical tanks, and a gateway was used at each site to log the tank levels and send them over cel-lular/satellite connections to a virtual private network (VPN) in the cloud. A logistics application used this data to optimize truck driver routes.

To reduce communication costs, where wells were clustered together, a local mesh network connected multiple sensor gateways to a master gateway, which connected to the Internet cloud (Figure 4).

Multi-vendor automotive parts lineAn automotive manufacturer needed to upgrade an outer body parts stamping/forming machine due to new OSHA safety regulations and the desire to enhance performance. The original machine controls consisted of an Allen-Bradley PLC-5/80 con-nected via an obsolete Ethernet sidecar module to an obsolete Mitsubishi PLC Ethernet interface module. It was decided that replacing the PLC-5 was beyond the scope of this upgrade.

The new design required the addition of a number of Siemens safety PLCs, providing a non-obsolete Ethernet connection to the Mitsubishi PLC and implementing a high-speed serial interface to an upgraded OmniLink press controller.

To tie all the equipment together seamlessly at the high data transmission speed required, protocol gateways were required (Figure 5). Many of the gateway products evaluated supported only two protocols at a time, which would require multiple gate-ways on the machine. Instead, they used a single SoftPLC Smart Gateway, which provides the following in a single module:

› Modbus TCP to/from the Mitsubishi PLC › Profibus to/from the Siemens safety PLCs › Modbus serial to/from the press controller for low-priority

data › Custom serial protocol from the press controller for the

high-speed data › Allen-Bradley remote I/O (RIO) slave to the PLC-5 › Modbus TCP to/from the HMI, which is tied into the plant

manufacturing execution system (MES)

Figure 4 | A mesh of gateways at multi-well cluster communicate with a master gateway that connects to the cloud via cellular network. Cloud data is then forwarded on to a logistics application at headquarters.

Figure 5 | Gateway connections to stamping line equipment.



TechCon®

Embedded TechCon®, designed to educate today’s design engineers in the most critical embedded products and technologies, will be held at the Moscone Center in San Francisco, Calif., on June 8-10, 2015. The live event extends OpenSystems Media’s current online educational program, Embedded University. The classes, which will be taught by leading industry experts, cover key embedded topics like IoT, automotive, and security, while drawing from the industry’s roots with sessions on firmware development, debugging, and open-source hardware and software.

Classes, speakers, schedules, and more at :

embeddedtechcon.com

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Co-located with the Design Automation Conference

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Embedded TechCon FP AD 05-2015.indd 1 5/11/15 1:39 PM

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Sensors

For GE, where do sensors fit into the Industrial Internet?DHILLON: The fundamental building block of the Internet of Things (IoT)/Industrial Internet is, of course, the communica-tions infrastructure. Attached to that are increasingly smart, brilliant machines with substantial data acquisition, processing, and storage capability built into them. For the Industrial Internet and for the Connected Battlefield, those very smart machines need to be incredibly rugged, able to operate in the harshest, most challenging environments.

Sensors are a critical element within the IoT, Industrial Internet, and Connected Battlefield because they acquire the data necessary to effect huge improvements in efficiency and reli-ability – with minimal human intervention. GE has a long history of dealing with sensor-acquired data through our work with the military – radar, sonar, video, and so on. We’re now finding that that expertise and experience plays out well in the Industrial Internet space.

Given the resource constraints of industrial devices, what innovation is occurring at the sensor level to realize the full potential of the Industrial Internet?DHILLON: The key here is that the proliferation of sensors is producing a fire hose of data, and that situation is exacerbated by the resolution of the data that is being captured. Video sensors, for example, now commonly acquire and transmit high-definition data rather than standard definition, with huge implications for the numbers of pixels being captured, pro-cessed, transmitted, and stored. That in turn has huge implica-tions for both processing power and network bandwidth. The trick, of course, is to be able to process that data in real time and extract only the meaningful data to deliver to the network.

Here, GE believes that one answer is GPGPU technology – using the graphics processors designed for high-end video gaming and so on, and leveraging their hugely parallel archi-tectures to process vast amounts of data at incredible speeds. We’re working closely with NVIDIA, and an outcome of that relationship has been products like the recently announced rugged mCOM10-K1, which is based on NVIDIA’s Tegra K1

technology (Figure 1). That’s an incredibly appropriate solu-tion for Industrial Internet applications. First, it’s based on the COM Express architecture, which means that it is very small and can be deployed in very tight spaces. Second, it delivers 326 GFLOPS of processing power. And third, it consumes less than 10 watts of power, meaning that it can be used in environ-ments where power availability is at a premium.

We’re also working very closely with AMD, as a result of which we’ve just announced the bCOM6-L1700 (Figure 2). That also is a COM Express architecture product, featuring AMD’s latest SoC technology, and, like the mCOM10-K1, it is small, rugged, and consumes minimal power.

As the Industrial Internet demands more out of resource-constrained industrial data acquisition systems, sensor processing

platforms are required to add performance while reducing size, weight, and power (SWaP). Rubin Dhillon, Marketing Director of

the Embedded Systems division at GE Intelligent Platforms discusses his company’s approach to developing “brilliant machines,”

and how off-the-shelf hardware is enabling these sensor platforms for the Industrial Internet.

Sensor processing platforms add performance, cut SWaP for the Industrial InternetInterview with Rubin Dhillon, GE Intelligent Platforms

Figure 1 | The mCOM10-K1 is a COM Express-based sensor processing platform that leverages the NVIDIA Tegra K1 SoC to deliver 326 GFLOPS of processing performance.

“... the proliferation of sensors is

producing a fire hose of data, and that

situation is exacerbated by the resolution

of the data that is being captured.”



It’s going to be devices of that level of processing perfor-mance, ruggedness, size, and power consumption that we’ll see increasingly drive the Industrial Internet because of their ability to help make sense of the huge amounts of data that sensors are capable of collecting.

What other trends do you see arising in Industrial Internet sensor networks, and how is GE addressing them?DHILLON: As I noted previously, if we’re to avoid dragging the communications network to a halt with the sheer burden of sensor-acquired data, that data needs to be processed locally in the machine attached to the network. That has important implications not just for processing power, but for size, weight, and power – so-called SWaP. That processing power has to be built into small spaces in harsh environments that are subject to extremes of temperature, shock, vibration, contaminant ingress, and so on. That means it also has to be rugged. That’s a real strength for GE. It’s what our customers know and value us for.

The other key area where the Industrial Internet can make a real, valuable difference is in improving efficiency, asset utiliza-tion, reliability, and availability. It’s one thing to have all those machines generating huge amounts of sensor-derived data about themselves – but what to do with all that data?

GE is investing hugely in software, especially the software that will drive the Industrial Internet by making everything hang together in a way that will deliver benefits to businesses. An example of that, and a rapidly growing business for GE, is our predictive analytics business. We at GE believe that the basis for real transformation here lies in the shift from reacting to equipment failures or current condition indicators to becoming truly predictive and proactive. Answers about the future health of equipment or locomotives or whatever are already there in data that is being collected from sensors onboard those plat-forms today. It’s a matter of leveraging an analytics solution with

the proven ability to find the signal in the noise. SmartSignal from GE is that proven solution, with over ten years of proven experience across a broad range of asset-intensive industries.

What predictions do you have for the IoT?DHILLON: For many companies and organizations, the Industrial Internet is already a functioning reality – it’s real, it’s here, it’s today. Many people don’t realize how much progress it’s already made. There’s no doubt in our minds at GE that the Industrial Internet will become pervasive across all industries, and the day is not too far in the future when we’ll wonder how industry ever managed without it. IES

Rubin Dhillon is Marketing Director, Embedded Systems at GE Intelligent Platforms.

GE Intelligent Platforms www.geautomation.com

@GE_IP

www.linkedin.com/company/geintelligentplatforms?trk=nmp_rec_act_company_photo

https://plus.google.com/104351744833235375053/about

www.youtube.com/user/GEIPTV

Figure 2 | The bCOM6L1700 is another rugged COM Express module, and is based on AMD R-series APUs for power-efficient sensor processing.

E-CAST

October 21, 2015

GO TO E-CAST: ECAST.OPENSYSTEMSMEDIA.COM/549

IoT and M2M safety and security Presented by Echelon, Freescale, GrammaTech, and RTI

The proliferation of connected devices coupled with network infrastructure advances have ushered in a new era of communication and machine-to-machine (M2M) automation in all industries. These advances bring significant risk – attacks on systems have become “purpose-built” – targeting specific machines in order to access unauthorized information or cause system failures. IoT and M2M systems require a combination of silicon and software solutions designed to mitigate these purpose-built attacks. Join us as silicon and software security experts come together to discuss M2M and IoT security requirements and threat identification and mitigation options using silicon and/or software approaches.


http://www.geautomation.com

https://twitter.com/GE_IP

www.linkedin.com/company/geintelligentplatforms?trk=nmp_rec_act_company_photo

https://ecast.opensystemsmedia.com/549


Industrial Software

into a multicore world and you’ve started seeing ARM work it’s way into this market,” says Warren Kurisu, Director of Product Management, Runtime Solutions at Mentor Graphics (www.mentor.com). “We went from homogenous multicore to heterogeneous multicore, and now you’re starting to see soft-core FPGAs work into the multicore architectures.

“With the convergence of heterogeneous SoC architectures, customers are asking how they can leverage heterogeneous systems architectures (HSAs) to enable dif-ferentiation and downstream CAPEX and OPEX,” Kurisu continues. “So, ‘How do we leverage multicore to get the power savings, reduced BOM costs, and all of that?’ With this comes a complex problem – how do I manage them across different cores, manage them across different channels, etc.? Our solution allows you to bring multiple different operating environments on a single architecture.”

Kurisu refers to the company’s Mentor Embedded multi-platform solution, a software stack for the industrial automation market based on an IEC 61508-certifiable version of the Nucleus RTOS that includes multicore support, Mentor Embedded Linux with inte-grated industrial protocols, the Sourcery CodeBench and Analyzer, and Qt graphics, among other features (Figure 1). Yet, the key to this and other emerging industrial software products is advanced hypervisor technology, which facilitates the separation of critical functions and allows manufacturers to realize the benefits of consolidation on the factory floor.

The safety-certified hypervisorAs mentioned, hypervisors in today’s industrial automation devices are often used to separate an OS running safety- and mission-critical applications (such as motor control) on one processor core from an OS running another application (such as the user interface) on a different core. Thanks to the advent of multicore and hypervisor

By Brandon Lewis, Asst. Managing Editor

Rather than the discrete,

single-function platforms of the past,

today’s industrial systems are built

around multicore processors that are

increasingly packing performance into

compute equipment. Now, software

developers are taking advantage of

these multicore architectures with

RTOS and hypervisor solutions that

enable multifunction, safety-certifiable

industrial systems that still retain their

deterministic nature.

Industrial systems aren’t what they used to be. Trends in mobile technology and touch screen GUIs inspired by the consumer market have steadily broken down traditional notions of the industrial embedded system, with new designs continually looking to exploit features and functionality rooted in the bring your own device (BYOD) and Industrial IoT (IIoT) movements.

However, while following suit with macro trends in the electronics industry allows for differentiation in an otherwise slug-gish industrial market, integrating new technologies into resource-constrained machines that have historically relied on closed control loops also invites a range of challenges for developers, principally in the areas of performance, security, and software footprint. But now, given consistent advances in multicore pro-cessor technology over the last decade, embedded software vendors are rolling out safety-certifiable solutions that pro-mote platform differentiation and meet the requirements of demanding indus-trial settings.

“Six or seven years ago it was all PowerPC, but what’s happened is that we’ve gone

Safety-certified software shrinks to new lows on multicore SoCs


technology, these virtual machines (VMs) can operate nearly independently of each other as if they were the only OS or application running on a chip.

Recently, however, traditional hypervisor models have begun to reveal perfor-mance and certification limitations for the developer of safety-critical systems. The reason for this is that typically when consolidating a system onto a single SoC platform, hypervisors share system resources wherein a memory scan is bitmapped from one OS to the other. While the performance bottleneck and complexity of this architecture is accept-able for certain applications, for others it is not, and this model also requires that custom drivers be developed for certain types of resource sharing (such as I/O devices, network connections, and file systems); each time a custom driver is developed for a particular system, or an OS or application is modified, these sys-tems must be retested and recertified.

To mitigate these development chal-lenges for industrial embedded sys-tems engineers, QNX Software Systems has announced the Hypervisor 1.0, an IEC 61508-compliant hypervisor that looks to eliminate the performance losses and certification headaches asso-ciated with custom drivers by circum-venting them altogether. According to Chris Ault, Senior Product Manager at QNX (www.qnx.com), rather than uti-lizing low-level drivers, the type 1 hyper-visor facilitates higher level commands between VMs so that certain system components can be shared between OSs while keeping them securely partitioned.

“The job of the hypervisor is to run the image right after board startup, and there’s a flat text file that describes what machines need to be created, what memory ranges need to be applied to each VM, and so on,” says Ault. “Then each VM reads its own subconfiguration VM file and says what resources it needs.

“On the surface this looks like what competitors are doing with a client/server relationship, but instead of using a shared device driver, we’re marshal-ling the high-level commands from one VM to another so that the performance, simplicity of the device driver, and sim-plicity of the architecture are improved,”

he continues (Figure 2). “Yes, the GPU and device driver need to be owned by the safety-critical OS, but we have tools in place so that the non-safety OS cannot impact the OS resources.

“This is embedded virtualization versus IT virtualization because the real-time nature of access to the hardware is so important,” Ault says. “So rather than a broad suite of emulators or device drivers without traction in the field, we’re binding hardware to the VM and also leveraging assets that are already present in the OS to reduce testing when using these types of devices.”

In addition, the QNX Hypervisor 1.0 includes support for QNX Neutrino and Linux- and Android-based OSs, and pairs especially well with those that support a built-in scheduler for adaptive partitioning, Ault says. Through adaptive partitions systems architects are able to specify the amount of resources that are made available for particular tasks, providing a mechanism by which safety-critical designers can manage platform resources without having to develop custom resource management schemes (Figure 3, page 20).


Figure 1 | The IEC 61508 SIL3-certifiable Mentor Embedded multi-platform solution provides support for both heterogeneous and homogeneous multicore SoCs, as well as integrated runtime tools that enable legacy code reuse.

Figure 2 | They QNX Hypervisor 1.0 allows common resources and components to be shared across VMs while remaining securely partitioned and certified.

http://www.qnx.com




Industrial Software Multiple levels of criticalityAs use of the aforementioned technolo-gies has enabled the development of higher end, more feature-rich indus-trial embedded systems, another soft-ware paradigm that has persisted for decades – the microkernel OS – is now being paired with multicore and virtual-ization to meet the needs of the broader industrial market. For devices in most automation and control environments where software footprint and resource constraints are top of mind, microkernel OSs are now being paired with fuller RTOS solutions to provide scalability across the full spectrum of industrial devices, from small sensor systems to full-blown, feature-rich designs.

For instance, Wind River recently an - nounced a microkernel profile for its VxWorks OS that eases certification efforts because of its small code base, and is an efficient option for both single-core systems or platforms built

Figure 3 | Adaptive partitioning allows the OS to allocate system resources by function, ensuring that critical application consistently receive the processor bandwidth necessary to carry out specific tasks.


http://www.toradex.com



on a big core/little core processor par-adigm, says Prashant Dubal, Director of Product Management at Wind River (www.wind river.com).

“Where in the past you might use MCUs, today it has become plausible to apply multicore SoCs even in lower end devices,” Dubal says. “We are seeing a trend in the industrial market where they are moving from 16-bit MCUs to 32-bit MCUs, and also some processes that have an memory management unit (MMU). Part of the reason this is hap-pening is consolidation and the price point of processors with an MMU, so things are evolving and people are trying to take advantage.”

“Either you could run VxWorks in a mul-ticore or unicore symmetric multipro-cessing (SMP) situation, but then there’s also a small processor core where you can run a microkernel core,” he con-tinues (Figure 4). “The two then work together, with the micokernel core run-ning power management. It can go all the way down to 2 KB to do something very specific on a sensor, but normally it’s around 10 KB to 20 KB.

“The other combination is that you could run two instances of VxWorks and do multiple criticialities,” Dubal says. “If you need certification, there’s a safety profile on top that enables quick certification to IEC 61508 for the microkernel, then the three play together to form a solution within the VxWorks family. To complete the spectrum, if you go to a very high-end CPU, now you can take advantage of virtualization on VxWorks and run multiple OSs or instances of OSs on top of it. So you scale from a microkernel alone to a microkernel and VxWorks, then multiple instances of VxWorks. The beauty of all of these profiles is that they all work with each other, so you can mix

Figure 4 | The Wind River Microkernel Profile for VxWorks is an extremely small footprint (10 KB – 20 KB) OS for resource constrained systems.

and match depending on what kind of solution you’re working on.”

Utilizing virtualization with VxWorks as previously mentioned also allows engi-neers to take advantage of time and space partitioning to reach IEC 61508 certification so that certified and uncer-tified applications can execute securely on the same system; one OS instance could be running uncertified Linux applications while another is certified up to safety integrity level (SIL) 3 to give developers maximum design flexibility.

Safety-certified software for advancing in the IIoTAs features and connectivity are continu-ally added to keep pace with the advances of the IIoT, the embedded industry must continue to innovate software that will serve as the basis of secure and efficient industrial devices. By taking advantage of the possibilities now afforded by mul-ticore silicon, embedded software ven-dors are already laying that foundation for safety-critical systems. IES

No one in embedded computing offers as many products and services as Elma. Our packaging, thermal and I/O interface expertise, plus years of expert embedded sub-system designs gives our customers a serious advantage.

We are an extension of your team -- we fill in where you need us most, and we’re there every step of the way.

Find out why Elma is truly Your Solution Partner.

Reduce, Save, Improve. Elma’s Rugged Platforms Do All That - And More.“ “

ECD-May_Elma-Cisco_Ad.indd 1 4/17/2015 1:50:48 PM


http://www.windriver.com

http://www.elma.com


Industrial Hardware

of system design and deployment where they must consider everything from manu-facturer support, lead times, and features that maintain long-term system viability.

Key trends affecting data acquisition technologyPreviously inaccessible and unconventional sources of oil and gas present a new set of challenges for offshore service companies. Computing solutions must step up to meet more demanding data acquisition requirements from emerging growth areas in chal-lenging environments. These solutions must also provide the high-performance com-puting resources that ensure state-of-the-art connectivity for the complex labyrinth of exploration, equipment management, control, and analysis applications currently in operation. Therefore, it is wise to seek out decidedly experienced suppliers that have an understanding of the safety certifications and global support needs unique to offshore providers.

Along with highly integrated computing solutions that can help streamline processes by delivering optimized performance and connectivity, these systems must also meet the growing dependency on automated applications that can remotely monitor an increasing variety of equipment deployed at drilling sites; data collection and analysis are crucial to a rig acting as a small, self-contained city that operates nonstop.

There are also 24/7 uptime requirements to contend with. While avoiding downtime is an ongoing need in most embedded applications, it is critical to maintain max-imum and sustained operations in offshore installations. Downtime due to system failure affects overall production, which can significantly impact costs that can run in the hundreds of thousands of dollars daily. Because offshore drill sites are inherently remote, they add to operational complexity and compound potential losses consid-ering the extended time and resources that required to get a system up and running after failure. Consequently, data acquisition computing solutions must stand up to the rigors of shock and vibration, temperature, dust, and other environmental conditions common to offshore installations.

Service providers must carefully

evaluate available computing options to

find the optimal intelligent system.

Similar to other industrial markets, oil and gas operations are realizing the powerful results of harnessing data to improve processes, make more-informed business decisions, and manage safety, maintenance, and costs. The information that can be collected and managed from the broad range of disparate sources is growing at such a fast pace, many service providers see the need to upgrade their data acqui-sition capabilities. With almost every aspect of industrial oil and gas opera-tions being digitized, embedded com-puting solutions play a significant role in advancing and streamlining oil and gas data acquisition. Using the computing performance and features available in today’s systems enables offshore opera-tions to keep pace in a world where data collection and analysis never stops. This industry calls for computing solutions to be “rugged by design,” comprised completely of components that have demonstrated reliability in order to meet mandated uptime goals, regardless of the environment.

Previously, computing challenges were met with proprietary systems. Oil and gas service providers also struggled to compensate for systems that often lacked the level of ruggedized reliability essential for this harsh environment. Today, computing solutions manufac-turers offer systems that promise to reduce both operating and mainte-nance costs, and deliver robust tech-nologies that ensure long-term system performance. However, to find the right solution necessitates that important considerations, which can maximize and differentiate their offerings based on performance, value, and reliability, are taken into account. Oil and gas system developers are evaluating every aspect

Best practices in meeting oil and gas data acquisition needsBy Maria Hansson, Kontron



Best practices also must include a spec-trum of design features such as delivering the highest mean time between failure (MTBF), experience with ruggedized enclosures, and thermal management, as well as worldwide technical support.

Evaluating industrial computing systemsRugged performance:Oil and gas settings are unlike any other kind of work environment on earth. Attention to shock and vibration and atmospheric contaminants such as dust, water, and corrosion are vital concerns.

Best practices in specifying data acqui-sition systems need to address these types of environmental demands with features and capabilities specifically tuned to oil and gas requirements, such as removable dust filters that elimi-nate the impact of dirt entering the system. Cable tie-downs and hold-down brackets for expansion cards brace computing systems against shock and vibration; shock-mounted drive bays add stiffness in the chassis design, pro-tecting systems during transport and while operating on or near the source of heavy vibrations.

When evaluating industrial computing systems, reliable extended life and guaranteed long-term availability of components must be supported for performance over continued offshore deployments. The most desirable sys-tems are revision controlled for ease of in-field maintenance. For example, Kontron’s KISS Oil & Gas 2U, a rugged rackmount computer, is based on Kontron’s extensive experience deliv-ering deployable computing solutions such as its KTQ77/Flex motherboard. Components are sourced consistently from the same manufacturer, main-taining performance and features even when there may be years between system deployments (Figure 1).

Assembling compared to developing technologyThe quality and reliability of computing solutions are obviously a result of the components, materials, processes, and development expertise that go into the design and manufacture of the product. Many data acquisition suppliers

assemble third-party components to build their products rather than actually owning the core computing technology.

Developers of technology provide unique value for oil and gas operators, giving them more product life control and the ability to integrate the tech-nologies necessary to minimize down-time. With an oil and gas system actually developed by the supplier, customers benefit from strategic partnerships that assure access to the latest proces-sors, chipsets, and memory. Technology developers typically provide additional customization capabilities based on standards methodologies to enable faster and more cost-effective custom design options. Furthermore, devel-opers are able to fully manage the bill of materials (BoMs), along with revision control and long-term availability so that performance and features can be con-trolled even over course of long dura-tions between system deployments.

Global technical support:The complexity of data acquisition may require extended service, training, and technical support to match uptime goals. Embedded computing suppliers must readily provide a global service organization to more easily facilitate local technical support, as well as more difficult maintenance or upgrades.

Unfortunately, many of today’s oil and gas computing suppliers are either large firms with a single hub, or smaller regional firms without a global organiza-tion. Therefore, it should be an impor-tant criterion that system support is available in the region where the system is deployed.

Enhancing productivity and growth potential:Providing the increased ability to collect and analyze data, new computing tech-nology is enabling drilling in regions once considered undrillable. At the same time, oil exploration and extrac-tion processes generate tremendous amounts of data. As new devices track a wider array of performance informa-tion related to reserves and equipment, industry analysts such as oilprice.com are predicting a doubling of oil and gas data within just two years[1].

Managing such large amounts of data requires sourcing technologies already proven to handle the workload. These solutions must provide connectivity to the critical equipment at drilling sites across the globe, and enable remote access to data from the drill site. Used for applications such as gathering sensor data and the monitoring of an exhaus-tive variety of instrumentation, explo-ration, and wellhead equipment, these systems are expected to strengthen pro-ductivity. By connecting field staff with industry experts, oil producers can make better critical decisions based on easily accessible, real-time data.

This ability to access real-time data increases safety operations, for example, by means of ultra-reliable sensors and monitors that are capable of shutting down systems at the first sign of trouble. The near future will see more sophisti-cated smart monitors, predicting failures and providing solutions that execute automatically in advance of problems. Data acquisition solutions are designed to help producers find and main-tain new and untapped resources to realize anticipated growth potential. According to industry analyst oilprice.com, subsea technology developers forecast spending to increase as much as five times (to $130 billion annually) by 2020, where some of this budget will need to be made in data analytics and computing support[2].

Employing advanced data acquisition computing technology provides the data processing, storage, and connec-tivity to move massive amounts of data, for example, in high-definition seismic

Figure 1 | Kontron’s KISS Oil and Gas 2U rackmount server is optimized for high MTBF, and based on the Kontron KTQ77/Flex motherboard that integrates the 3rd Generation Intel Core processor. The data acquisition platform offers extended temperature and efficient cooling, as well as rugged by design features that enable it to be used in harsh offshore environments.


FEATURES

ĄĄ 4.3" WQVGA 480 x 272 TFT LCDĄĄ Analog Resistive TouchscreenĄĄ ARM9 400Mhz Fanless ProcessorĄĄ Up to 1 GB Flash & 256 MB RAMĄĄ 10/100 Base-T EthernetĄĄ 3 RS232 & 1 RS232/422/485 PortĄĄ 1 USB 2.0 (High Speed) Host portĄĄ 1 USB 2.0 (High Speed) OTG portĄĄ 2 Micro SD Flash Card SocketsĄĄ SPI & I2C, 4 ADC, Audio BeeperĄĄ Battery Backed Real Time ClockĄĄ Operating Voltage: 5V DC or 8 to 35V DCĄĄ Optional Power Over Ethernet (POE)ĄĄ Optional Audio with Line-in/out

Designed and Manufactured in the USA by EMAC, the PPC-E4+ is an ultra compact Embedded Panel PC that comes ready to run with EMAC OE Linux installed on Flash. The dimensions of the PPC-E4+ are 4.8" by 3.0", about the same as that of popular touch cell phones. The PPC-E4+ is small enough to fit in a 2U rack enclosure. Everything works out of the box, allowing you to concentrate on your application rather than building and config-uring device drivers.

EMAC can even be contracted to develop your application.

Pricing starts at $375 for Qty 1.

PPC-E4+ – ARM Panel PC

Human Interface

industrial.embedded-computing.com/p372771

EMAC, Inc.www.emacinc.com/products/panel_pcs_and_lcds

[email protected] 618-529-4525 www.linkedin.com/company/emac-inc-

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Industrial Hardware enable oil and gas service providers to achieve leadership by sourcing computing systems optimized for oil and gas environments.

Oil and gas exploration and production has always been complex, but today’s competitive landscape dictates even greater attention to computing performance. By capturing sophisticated data for field use and analysis, selecting the right data acquisition system helps take advantage of the growing use of sensors and networks. Ultimately, more intelligent systems will make an important difference in oil produc-tion worldwide by connecting decision makers with critical data and improving the safety and productivity of drilling operations. IESReferences:[1] OilPrice.com. “The Most Lucrative Investment in American History.” http://oilprice.com/

Energy/Energy-General/5-Trends-that-are-Set-to-Transform-the-Energy-Sector.html

Maria Hansson works as a Product Manager for the Medical & Industrial Business Unit at Kontron. She holds a Master of Science in Engineering from Lund University, Sweden.

Kontron www.kontron.com • [email protected]

@Kontron

www.linkedin.com/company/164627

www.facebook.com/kontron

https://plus.google.com/+kontron/posts

www.youtube.com/channel/UCXkp_1gJbG0Um1vzdowlqww

imaging. Information that once took decades to analyze and understand is now adding production value in a matter of weeks, guiding exploration and streamlining processes. It appears that combined with enhanced oil recovery (EOR) techniques that re-invigorate existing wells, offshore producers are poised for growth.

Business intelligence from valuable data assetsOil producers are seeing the value of data collection and analysis gained from high-performance and robust technology solutions. Knowledgeable embedded computing providers can be indispensable engineering resources – from full control of the mother board and technology revision control to enabling faster, longer, and more reliable data acquisition system deployments. These same suppliers can also lend a hand in maximizing essential operational uptime through global technical support teams. These important considerations also


http://oilprice.com/Energy/Energy-General/5-Trends-that-are-Set-to-Transform-the-Energy-Sector.html


www.linkedin.com/company/kontron

http://www.kontron.com

http://www.linkedin.com/company/emac-inc-

http://industrial.embedded-computing.com/p372771

http://www.emacinc.com/products/panel_pcs_and_lcds


http://www.linkedin.com/company/164627

http://www.facebook.com/kontron

https://plus.google.com/+kontron/posts

http://www.youtube.com/channel/UCXkp_1gJbG0Um1vzdowlqww

ACCES I/O Products is pleased to announce the release of a new family of mini PCI Express (mPCIe) multi-port serial communication cards. These small, low-priced, PCI Express Mini cards feature a selection of 4 or 2-ports of software selectable RS-232/422/485 asynchronous serial protocols on a port by port basis. These cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale sys-tems, kiosk design, retail, hospitality, automation, gaming and more. The small size (just 50.95mm x30mm) allows for maximum performance in applications where space is a valuable resource.Each RS-232 port is simultaneously capable of supporting data communication rates up to 921.6 kbps. RS-422/485 modes support data communication speeds up to 3 Mbps. The cards provide ±15kV ESD protection on all signal pins to protect against costly damage due to electrostatic discharge. Existing serial peripherals can connect directly to industry standard DB9M connectors on the optional breakout cable accessory kits.The mPCIe-COM cards were designed using type 16C950 UARTs and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI and PCI Express 16550 type UART applications and allow users to maintain backward compatibility.

mPCIe-COM Family PCI Express Mini Cards

Industrial Hardware


ACCES I/O Products, Inc.www.accesio.com

[email protected] 1-858-550-9559 linkedin.com/company/acces-i-o-products-inc. twitter.com/accesio

FEATURES

ĄĄ PCI Express Mini Card form-factor (mPCIe) type F1, with latching I/O con-nectorsĄĄ 4 or 2-port serial communication cards with optional DB9M connectivityĄĄ Software selectable RS-232, RS-422, and RS-485 protocols, per port

stored in EEPROMĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each TX

and RXĄĄ Port-by-port field selectable termination for RS-422/485 applicationsĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standardĄĄ Supports data communication rates up to 3Mbps simultaneously, (RS-232

up to 921.6 kbps)ĄĄ Custom baud rates easily configuredĄĄ ±15kV ESD protection on all signal pinsĄĄ CTS, RTS, 9-bit data mode, and RS-485 full-duplex (4 wire) fully supportedĄĄ RS-232 only and RS-422/485 versions available

FEATURES

ĄĄ For LCD TFT panels from 7" to 15", full HDĄĄ Dual-channel LVDS or two single channels, with two independent screen

contentsĄĄ Freescale ARM i.MX 6 SeriesĄĄ Multi-stream-capable HD video engine, OpenCL supportĄĄ Maximum resolution 1920 x 1200 pixelsĄĄ Up to 4 GB DDR3 SDRAM, eMMC multimedia cardĄĄ Ports: One Gigabit Ethernet, two USB 2.0, one UART-to-USBĄĄ Two UART or CAN bus interfacesĄĄ -40°C to +85°C operating temperature

MEN Micro now offers the robust CC10S, a multi-display controller board based on a Freescale ARM i.MX 6 Series processor.Providing full HD resolution to LCD TFT panel PCs from 7 to 15 inches, the CC10S combines powerful graphics and a compact form factor that make the board ideal for driver desk displays or in-seat infotainment in trains or public buses as well as for medical devices and HMIs in automotive applications.The CC10S module is widely scalable from low-end to high-end graphics require-ments, depending on an application’s needs. Its Cortex-A9 architecture supports different types of the i.MX 6Solo, 6DualLite, 6Dual and 6Quad processor families. The board provides dual-channel LVDS with a maximum resolution of 1920 x 1200 pixels, regardless of whether the controller module employs a single-, dual-core or a quad-core processor.Onboard memory of up to 4 GB DDR3 SDRAM and a soldered eMMC provide ample storage for video data and Linux or VxWorks operating systems. Although it employs a compact design, the CC10S is a multi-stream-capable HD video engine that delivers up to 1080p60 decode, 1080p30 encode and 3D video playback in HD and enables the control of two independent screens.The CC10S offers a wide range of interfaces required for a typical panel PC, including one Gigabit Ethernet interface (1000BASE-T), two USB 2.0 ports, and two UARTs for flexible RS232, RS422 or RS485 configuration supporting up to 4 Mbit/s.

CC10S Multi-display Controller Board

Human Interface


MEN Micro Inc.www.menmicro.com

[email protected] 215-542-9575 www.linkedin.com/company/men-micro-inc- twitter.com/MENMicro

Industrial Embedded System

s Resource Guide





http://www.menmicro.com

www.linkedin.com/company/men-micro-inc-

http://www.twitter.com/menmicro


http://www.twitter.com/accesio


http://linkedin.com/company/acces-i-o-products-inc.

http://accesio.com

FEATURES

ĄĄ IP65 rated flat front bezelĄĄ 7 inch 1024 x 600 TFT LCD monitorĄĄ Projected capacitive multi-touch screenĄĄ Celeron N2807 Dual Core 1.58GHz embedded computerĄĄ 500-nits high brightness LCD panelĄĄ -20ºC to 50ºC wide range working temperatureĄĄ 9~30V DC power input with external AC power adapter

Acnodes announces the release of the PC5070, a compact multi-touch Panel PC. Based on the Intel Celeron N2807 1.58GHz Dual Core processor, this new indus-trial panel PC boasts a powerful 7-inch flat panel LCD that incorporates a 1024 x 600 resolutions, 500-nit high brightness, projected capacitive touch screen with multi-touch function. The PC5070 comes standard with one on board DDR3 SO-DIMM socket with 2GB system memory and one 30GB mSATA SSD along with dual Ethernet, two COM ports, two USB ports, and an audio (Line-out) port to accommodate a wide range of connectivity requirements.The PC5070 has built-in 802.11a/b/g/n/ac wireless LAN to facilitate access to wireless networks. Acnodes has also kept in mind the industrial aspect of the Panel PC. The PC5070 adopts a rugged IP65 rated front bezel and its touch screen monitor supports anti-scratch design that can resist up to 6H to ensure operation stability. This rugged panel computer has an operating temperature range of 32°F to 122°F (0°C to +50°C). Furthermore, this new panel pc system supports wide voltage power input from 9V to 30VDC, with external AC power adapter, to meet the requirements of unstable electricity environments.In addition to panel mounting, the PC5070 is available for wall, rack, stand and v-stand mounting. Flexible mounting options enable the PC5070 to smoothly blend into any working environment, ideal for small-size operator interface appli-cation, such as factory HMI, home automation terminal and digital signage.

PC5070

Industrial Hardware


Acnodes Corporationwww.acnodes.com/pc5070.htm

[email protected] 909-597-7588 www.linkedin.com/company/acnodes-corporation twitter.com/acnodescorp

The mPCIe-ICM Series isolated serial communication cards measure just 30 x 51 mm and feature a selection of 4 or 2 ports of isolated RS232 serial communica-tions. 1.5kV isolation is provided port-to-computer and 500V isolation port-to-port on ALL signals at the I/O connectors. The mPCIe-ICM cards have been designed for use in harsh and rugged environments such as military and defense along with applications such as health and medical, point of sale systems, kiosk design, retail, hospitality, automation, and gaming.The RS232 ports provided by the card are 100% compatible with every other industry-standard serial COM device, supporting TX, RX, RTS, and CTS. The card provides ±15kV ESD protection on all signal pins to protect against costly dam-age to sensitive electronic devices due to electrostatic discharge. In addition, they provide Tru-Iso™ port-to-port and port-to-PC isolation. The serial ports on the device are accessed using a low-profile, latching, 5-pin Hirose connector. Optional breakout cables are available, and bring each port connection to a panel-mountable DB9-M with an industry compatible RS232 pin-out.The mPCIe-ICM cards were designed using type 16C950 UARTS and use 128-byte transmit/receive FIFO buffers to decrease CPU loading and protect against lost data in multitasking systems. New systems can continue to interface with legacy serial peripherals, yet benefit from the use of the high performance PCI Express bus. The cards are fully software compatible with current PCI 16550 type UART applications and allow for users to maintain backward compatibility.

mPCIe-ICM Family PCI Express Mini Cards

Industrial Hardware


ACCES I/O Products, Inc.www.accesio.com

[email protected] 1-858-550-9559 linkedin.com/company/acces-i-o-products-inc. twitter.com/accesio

FEATURES

ĄĄ PCI Express Mini Card (mPCIe) type F1, with latching I/O connectorsĄĄ 4 or 2-port mPCIe RS232 serial communication cardsĄĄ Tru-Iso™ 1500V isolation port-to-computer and 500V isolation

port-to-port on ALL signalsĄĄ High performance 16C950 class UARTs with 128-byte FIFO for each

TX and RXĄĄ Industrial operating temperature (-40°C to +85°C) and RoHS standardĄĄ Supports data communication speeds up to 1 Mbps simultaneouslyĄĄ Custom baud rates easily configuredĄĄ ±15kV ESD protection on all signal pinsĄĄ 9-bit data mode fully supportedĄĄ Supports CTS and RTS handshaking

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http://www.twitter.com/accesio

http://accesio.com


http://linkedin.com/company/acces-i-o-products-inc.


http://www.acnodes.com/pc5070.htm


http://www.linkedin.com/company/acnodes-corporation

http://www.twitter.com/acnodescorp


FEATURES

Ai-VM163S Key Technical Features:ĄĄ i7-4700EQ 4th Gen Intel® Core™ i7

• Quad-Core Dual-Thread @ 2.4 GHz • HD Graphics 4600ĄĄ 8 GB DDR3L with ECCĄĄ 32 GB On-Board Flash DiskĄĄ 1 PMC Slot + 1 XMC SlotĄĄ WDT, IPMI, RTC, Temp. SensorsĄĄ Versatile Board I/O

• USB • Discrete • SATA • RGBHV Out • Serial • HDMI/DVI Out • GbEĄĄ Windows®, VxWorks®, Linux® SupportĄĄ Air-Cooled VME Board

Ai-VM111S Key Technical Features:ĄĄ T4080 QorIQ™ SoC Processor

• Quad e6500 Dual-Thread Cores @ 1.5 GHz • Altivec UnitĄĄ 4 GB DDR3L with ECCĄĄ 128 MB NOR FlashĄĄ 1 PMC Slot + 1 XMC SlotĄĄ WDT, ETR, RTC, Temp. SensorsĄĄ Versatile Board I/O

• USB • Serial • SATA • Discrete • GbEĄĄ VxWorks®, Linux®, INTEGRITY® SupportĄĄ Air-Cooled VME Board

Aitech Defense Systems Inc. is bringing its expertise in rugged, high performance embedded boards and systems to the indus-trial market. The new industrial line-up includes two 6U VME SBCs, one based on the Intel Haswell processor and one that is Freescale QorIQ-based.

Aitech’s new rugged, industrial SBCs offer a wide range of memory storage options and I/O, making them ideal for a vari-ety of embedded commercial, industrial and Naval applications. Operating temperature for the boards is up to -20°C to +60°C.

The Ai-VM163S, with an Intel 4th gen Core i7 quad core proces-sor running at 2.4 GHz, is a high-performance board with 32 GB of onboard SATA flash to efficiently process video and graphics.

Geared more for real-time control system applications, the Ai-VM111S incorporates Freescale’s newest QorlQ T4 quad core, dual-threaded, Altivec-enabled T4080 processer with a speed of up to 1.5 GHz. It includes 128 MB of NOR Flash for mass data and code storage operations.

For higher reliability, the two boards each provide ECC-protected SDRAM memory and come with two standard mezzanine slots, one PMC and one XMC. The addition of these two mezzanine sites offers added design flexibility as well as onboard resources to ensure reliable, real-time operation. To support real-time process control, the boards also include eight counters/timers, a multi-function watchdog timer, temperature sensors and a real-time clock with on-board power back-up.

Supported software for both includes VxWorks and Linux, with the Ai-VM163S supporting Windows and the Ai-VM111S supporting INTEGRITY, as well. The 6U VME SBCs are air-cooled per IEEE 1101.10-1996.

Ai-VM163S and Ai-VM111S 6U VME SBCs

Aitech Defense Systems, Inc.www.rugged.com

[email protected] 888-Aitech-8 https://www.linkedin.com/company/Aitech http://twitter.com/AitechDefense

Industrial Hardware



s Resource Guide



http://www.rugged.com


https://www.linkedin.com/company/Aitech

http://twitter.com/AitechDefense


FEATURES

ĄĄ 4U High with Front Mounted Horizontal OpenVPX Card Cage

ĄĄ 4 Slot OpenVPX High Speed Mesh Backplane with RTM Support

ĄĄ 1184 Watt Power Supply

ĄĄ Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1

ĄĄ Backplane Profile: BKP6-DIS04-11.2.22-n

The Wild40 Four Slot OpenVPX 6U Chassis is an OpenVPX- compatible chassis capable of accepting up to four 6U tall by 160mm OpenVPX Front Plug-in Modules (FPMs) and up to four 6U tall by 80mm Rear Transition Modules (RTMs). Plug-in Module slot spacing is 1 except for Slot 4 which can accept Modules that are 2″ wide.

The Wild40 Four Slot OpenVPX 6U Chassis is equipped with a very high performance backplane which is capable of Serial I/O signal-ing at rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expansion Plane. The Data Plane of the backplane is arranged as a mesh between the four slots.

The Expansion Plane is a chain connecting adjacent slots. The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.

The card cage is recessed from the front of the chassis so that cabling can be used between Plug-in Modules and be contained within the frame of the chassis.

Wild40 4-Slot OpenVPX 6U Chassis

Annapolis Micro Systems, Inc.www.annapmicro.com

[email protected] 410-841-2514

Industrial Hardware


Annapolis is famous for the high quality of our products and for our unparalleled

dedication to ensuring that the customer’s applications succeed.

We offer training and exceptional special application development support, as well as

more conventional support.

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http://www.annapmicro.com



FEATURES

ĄĄ 6U High with Front Mounted OpenVPX Card Cage

ĄĄ 7 Slot OpenVPX 40Gb+ Mesh Backplane with RTM Support

ĄĄ 1534 Watt Power Supply

ĄĄ Radial clocking for AUXCLK and REFCLK with chassis input SMAs

ĄĄ Payload Profile: SLT3-PAY-2F1F2U-14.2.1 and SLT3-PAY-2F4F2U-14.2.11

ĄĄ Switch Profile: SLT3-SWH-2F24U-14.4.3 or SLT3-SWH-2F4T16U-14.4.11

The Wild40 Seven Slot OpenVPX 3U Chassis is an OpenVPX- compatible chassis capable of accepting up to six 3U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and one 3U tall by 160mm OpenVPX Switch FPM and up to seven 3U tall by 80mm Rear Transition Modules (RTMs). Plug-in Module slot spacing is 1″.

This chassis is equipped with a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data and Expansion Planes. The Data Plane of the backplane is connected to adjacent slots with one Fat Pipe connection. The Expansion Plane is a 3 slot star with two Fat Pipes connecting slots.

The Wild40 Seven Slot OpenVPX 3U Chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.


Wild40 Seven Slot OpenVPX 3U Chassis



Industrial Hardware







s Resource Guide






FEATURES

ĄĄ 10U High with Front Mounted OpenVPX Card Cage

ĄĄ Primary 12 Slot OpenVPX High Speed Switched Backplane with RTM Support

ĄĄ Optional Secondary 5 Slot VME/VXS or 4 slot VPX Backplane for Power Only Payload Cards

ĄĄ Up to 3200 Watt Power Supply

ĄĄ Backplane Profile: BKP6-CEN12-11.2.X

ĄĄ Payload Profile: SLT6-PAY-4F1Q2U2T-10.2.1

ĄĄ Switch Profile: SLT6-SWH-16U20F-10.4.2

11U Rack mountable, 12-slot OpenVPX chassis with OpenVPX switched topology backplane capable of 10Gbps+ signalling com-promising of 2 switch and 10 payload 1" slots. Option of additional secondary 4-slot OpenVPX power-only (Shown) or 5-slot VME/VXS backplane.

The Wild40 12-Slot OpenVPX 6U Chassis is an OpenVPX-compatible (VITA 65) chassis capable of accepting up to ten 6U tall by 160mm OpenVPX Payload Front Plug-in Modules (FPMs) and two 6U tall by 160mm OpenVPX Switch FPMs and up to twelve 6U tall by 80mm Rear Transition Modules (RTMs) in its Primary Backplane. Plug-in Module slot spacing is 1″ VITA 48.1.

The Wild40 12-Slot OpenVPX 6U Chassis’ Primary Backplane is a very high performance backplane which is capable of Serial I/O signaling at rates up to 10Gbps on the Data Plane and up to 8Gbps on the Expan-sion Plane. The Data Plane of the backplane is arranged in a dual-star configuration with two Fat Pipe connections from each Switch Slot to each Payload Slot. The Expansion Plane is a chain connecting adjacent Payload Slots.

In addition to the Primary Backplane there is also an option for a Sec-ondary 4-Slot VPX Power-Only or 5-slot VME/VXS Backplane. The 4-slot VPX backplane supports four OpenVPX VITA65 slots with a 1″ VITA 48.1 slot spacing. These slots are not connected to each other on the Data or Expansion Planes, instead all of their connections go straight through the backplane to the RTM backplane connectors. These slots are ideally suited for Clock Distribution boards, Tuners or other non-IO intensive FPMs.

The chassis includes a Chassis Monitoring system which displays DC voltages, slot temperatures and fan Revolutions Per Minute (RPMs) on the front panel of the chassis and can be used to set fan speed. The Chassis Monitor can be accessed and controlled remotely via the Serial or Ethernet interfaces.


Wild40 12-Slot OpenVPX 6U Chassis



Industrial Hardware






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FEATURES

ĄĄ MultiProtocol Switch • 1/10/40/56 Gb Ethernet and SDR/DDR/QDR/FDR Infiniband • Up to Four Tb/s Non-Blocking Switching Capacity with up to Eight

Switch Partitions

ĄĄ Backplane & Front panel I/O • Backplane Ports: Twenty High Speed Four Lane Data Plane

Connections, Sixteen 1Gb Ethernet Lanes • Front Panel Ports: Eight QSFP+, Two SFP+, RJ45 Management

Port, USB UART, Status LEDs • Each Backplane and Front Panel Port can be Configured for either

Infiniband or Ethernet • Infiniband and IP Routing • Ethernet Gateways

ĄĄ System Management • System Management using Intelligent Platform Management

Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)

ĄĄ Mechanical and Environmental • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Slot Profile: SLT6-SWH-16U20F-10.4.2-n • Integrated Heat Sink and Board Stiffener

The WILD OpenVPX 14Gbit Switch Card supports 1GbE, XAUI, 10GbE, 40GbE, 56GbE, and SDR/DDR/QDR/FDR Infiniband. It has dual 1/10GbE SFP+ front panel control plane uplinks and eight front panel data plane QSFPs. It supports up to 20 1GbE backplane control plane connections and 20 XAUI/40GbE/Infiniband data plane connections.

The WILD OpenVPX 14Gbit Switch Card is extremely versatile since it is capable of switching both Infiniband (SDR, DDR, QDR, FDR) and Ethernet (1Gb, 10Gb, 40Gb, 56Gb) traffic with up to 4 Tb/s of non-blocking switching capacity. The WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch also supports chassis management and can act as a Chassis Manager (ChMC). The 1Gb Ethernet control plane supports up to 20 backplane ports and two front panel SFP+ which can run at 1GbE or 10GbE. The data and control planes are located on different virtual networks to ensure best performance on each.

Basic configuration is streamlined where all required features are selected by DIP switches. A front panel USB serial port allows con-figuration of management Ethernet interfaces if needed (DHCP is the default configuration). Software updates, if needed, are completed via a simple web interface which can also be disabled via USB serial con-sole. Front panel status LEDs show the status of every switch port (link/activity) as well as overall status and health of the WILD Open-VPX 40 Gb Ethernet and FDR Infiniband Switch.

The front panel RJ45 10/100/1000 BASE-T Ethernet port is used for switch management and is connected directly to the on-board Pow-erPC. There is also an optional “in band” Ethernet connection from the PowerPC to the control plane. Note that not all switch configurations support the “in-band” management connection.

WILD OpenVPX 40 Gb Ethernet and FDR Infiniband Switch



Industrial Hardware



s Resource Guide






FEATURES

ĄĄ One or Two XILINX VIRTEX 7 FPGAS • VX690T or VX980T • Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth

• PCIe Gen3 8x from each FPGA to on-board PCIe switchĄĄ Backplane I/O

• 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full Duplex Bandwidth

• 16x High Speed Serial FPGA connections to P5 • 8x High Speed Serial IO lanes to P4 • Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2) • 24 LVDS and 8 Single Ended lines to P3 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols

ĄĄ Front Panel I/O • Accepts Standard Annapolis WILDSTAR Mezzanine Cards, including a wide variety of WILDSTAR ADC and DAC Mezzanine Cards

• Three or six optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth

• 1 Gb Ethernet RJ45 connector for Remote Host Access • External clock and IRIG-B Support via Front Panel SMA • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet,

SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocolsĄĄ Dual Core Processor APM86290

• Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to on-board PCIe SwitchĄĄ Application Development

• Full CoreFire Next™ Board Support Package for Fast and Easy Application Development

• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTMĄĄ System Management

• System Management using Intelligent Platform Management Interface (IPMI) • Diagnostic monitoring and configuration • Current, Voltage and Temperature Monitoring Sensors • Hot Swappable (exclusive to WILDSTAR OpenVPX EcoSystem)ĄĄ Mechanical and Environmental

• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O

WILDSTAR 7 Conduction Cooled for OpenVPX 6U boards provide up to two Xilinx Virtex 7 FPGAs per board with VX690T or VX980T FPGAs, up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth or up to 64 MB of QDRII+ SRAM for 32 GB/s of SRAM bandwidth. Up to 1.9 million logic cells and 3.3 million multiplier bits per board. Air or Conduction Cooled.These FPGA boards include two Xilinx Virtex 7 FPGAs with 64 High Speed Serial connections performing up to 13.1 Gbps. The IO Pro-cessing Element (IOPE) FPGA has a choice of QDRII+ SRAM or DDR3 DRAM. The DRAM option has four 32-bit DDR3 DRAM ports clocked at up to 800 MHz while the SRAM option has two 72-bit QDRII+ SRAM interfaces clocked up to 500 MHz.With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 20 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on back-plane topology. In addition, there is 16 GB/s of PCI Express Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3 connec-tion to each FPGA through a non-blocking PCIe switch. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 6U card has 2 mezzanine IO sites which can support up to four WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for six QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC. This also has a connection to PCIe infrastructure (which includes FPGAs) and can be used by customers for application require-ments. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE.There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps sig-nalling and supports multiple channels of 40GbE.

WILDSTAR 7 Conduction Cooled for OpenVPX 6U



Industrial Hardware


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FEATURES

ĄĄ General Features • One Xilinx Virtex 7 VX690T or VX980T FPGA • Up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth • Up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidthĄĄ Backplane I/O

• 24x High Speed Serial IO lanes to VPX Backplane (P1/P2) for 30 GB/s of Full Duplex Bandwidth

• Two PCIe Gen3 8x Connections to VPX Backplane (P1) • Eight LVDS lines to P2 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols

• External clock and IRIG-B Support via Backplane • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK

– Allows points-to-point, very high quality backplane connections to payload cards – Allows 10MHz clock and trigger from backplane to synchronize and clock compatible ADC/DAC mezzanine cards without front panel connections needed – Allows 1000s of analog channels across many backplanes/chassis to be synchronized via backplane


• Three optional built-in Front Panel QSFP+ Transceivers running at up to 52.4 Gbps each for 39 GB/s of Full Duplex Bandwidth

• Simultaneous QSFP and Mezzanine Card use • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and userdesigned protocols

ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to Virtex 7 FPGAĄĄ Application Development


• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • Chipscope Access through RTMĄĄ System Management


• 3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD3-PAY-2F4F2U-16.2.10-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O

The WILDSTAR 7 for OpenVPX 3U contains one VX690T or VX980T Virtex 7 FPGA per board with up to 2 GB of DDR3 DRAM for 12.8 GB/s of DRAM bandwidth and up to 32 MB of QDRII+ SRAM for 8 GB/s of SRAM bandwidth. It has up to 1 million logic cells and 1.6 million multiplier bits per board.

These FPGA boards include a Xilinx Virtex 7 FPGA with 64 High Speed Serial connections performing up to 13.1 Gbps. There is two 36-bit QDRII+ SRAM interfaces clocked up to 500 MHz and two 32-bit DDR3 DRAM ports clocked at up to 800 MHz.

With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 10 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depend-ing on backplane topology. In addition, there is up to 20 GB/s of bandwidth on the VPX Expansion Place. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 3U card has 1 mezzanine IO sites which can support up to 2 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 3 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for exam-ple the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC with direct FPGA 4x PCIe connection which can be used by customers for application requirements. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE.

There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signalling and supports multiple channels of 40GbE.

WILDSTAR 7 for OpenVPX 3U



Industrial Hardware



s Resource Guide






FEATURES

ĄĄ One, Two or Three ALTERA STRATIX® V FPGAS • Up to three Altera Stratix® V FPGA Processing Elements: 5SGSD6, 5SGSD8, 5SGXA7, 5SGXA9, 5SGXAB

• Up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth • Up to 96 MB of QDRII+ SRAM for 48 GB/s of SRAM bandwidth • PCIe Gen3 8x from each FPGA to on-board PCIe switchĄĄ Backplane I/O

• 16x High Speed Serial IO lanes to VPX Data Plane (P1) for 20 GB/s of Full Duplex Bandwidth

• Up to 16x High Speed Serial FPGA connections to P5 • 8x High Speed Serial IO lanes to P4 • Two PCIe Gen3 8x Connections to VPX Expansion Plane (P2) • 32 LVDS and 8 Single Ended lines to P3 • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user designed protocols


• Three or six optional built-in Front Panel QSFP+ Transceivers running at up to 56.4 Gbps each for 42.3 GB/s of Full Duplex Bandwidth

• 1 Gb Ethernet RJ45 connector for Remote Host Access • External clock and IRIG-B Support via Front Panel SMA • QSFP+ Protocol Agnostic connections support 10/40Gb Ethernet, SDR/DDR/QDR Infiniband, AnnapMicro protocol and user-designed protocols

ĄĄ Dual Core Processor APM86290 • Host Software: Linux API and Device Drivers • Each core runs up to 1.2 GHz • 2 GB of DDR3 DRAM • 4 GB SATA SSD and 16MB NOR Boot Flash • 4x PCIe Gen2 connection to on-board PCIe SwitchĄĄ Application Development


• 10/40Gb Ethernet and AnnapMicro Protocol Cores Included • Open VHDL Model including Source Code for Hardware Interfaces • Open VHDL IP Package for Communication Interfaces • SignalTap Access through RTMĄĄ System Management


• 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX payload profile: MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink and Board Stiffener • Available in Extended Temperature Grades • Air Cooled with Conduction Cooled path • RTM available for additional I/O

WILDSTAR A5 for OpenVPX 6U boards provide up to three Altera Stratix® V FPGAs per board with choice of GX parts up to 5SGXAB or GS parts up to 5SGSD8, up to 96 MB of QDRII+ SRAM for 59 GB/s of SRAM band-width and up to 8 GB of DDR3 DRAM for 51.2 GB/s of DRAM bandwidth. Up to 2.8 million logic elements and 4.3 million multiplier bits per board. Air Cooled Only.

These FPGA boards include 3 Altera Stratix V FPGAs with 48 High Speed Serial connections performing up to 14.1 Gbps. On each Compute Processing Element (CPE) FPGA there is six 72-bit QDRII+ SRAM inter-faces clocked up to 550 MHz. The IO Processing Element (IOPE) FPGA has four 32-bit DDR3 DRAM ports clocked at up to 800 MHz.

With included High Speed Serial (HSS) FPGA cores (including 40GBASE-KR), there is up 20 GB/s of bandwidth on the VPX data plane which can go directly to other VPX cards or to a switch, depending on backplane topology. In addition, there is 16 GB/s of PCI Express Gen 3 bandwidth on the VPX Expansion Plane with an 8x Gen3 connection to each FPGA through a non-blocking PCIe switch. When using 40GBASE-KR, there is the added reliability of Forward Error Correction (FEC) to achieve a much lower Bit Error Rate (BER).

If IO is required, Annapolis offers extraordinary density, bandwidth and analog conversion choices. Each 6U card has 2 mezzanine IO sites which can support up to 4 WILDSTAR Mezzanine cards as well as a QSFP+ option (on WS7 and WS A5 board) that allows for 6 QSFP+ transceivers per slot. These options can be mix and matched to meet customer needs. Some configurations utilize a second slot (for example the QSFP+ option and WILDSTAR Mezzanine card used in a single IO Site).

WILDSTAR A5 and V7 FPGA boards are hot swappable allowing for more system reliability. This feature is unique to Annapolis and was developed because our experience with OpenVPX systems has shown it invaluable so a whole chassis does not need to be shutdown to remove a single board.

Annapolis OpenVPX FPGA cards include an on-board dual core 1.2 GHz PowerPC. This also has a connection to PCIe infrastructure (which includes FPGAs) and can be used by customers for application require-ments. It is also used query board health like FPGA temperature and power. It is connected to the OpenVPX control plane via 1GbE.

There are also plenty of user backplane signals available on the Annapolis 6U Rear Transition Module (RTM) such as LVDS, FPGA HSS, IRIG, Ethernet and clocking. RTM HSS is also capable of 10Gbps signal-ling and supports multiple channels of 40GbE.

WILDSTAR A5 for OpenVPX 6U



Industrial Hardware


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FEATURES

ĄĄ InterRail® products meet tough physical demands and vibration proofs used for railway engineering, traffic engineering, and power station engineering.

ĄĄ 19" subracks and housings with flexible internal layout.

ĄĄ EMI- and RFI-shielded protection using stable stainless steel contact springs ensuring permanent and reliable bonding.

ĄĄ Connectors and wiring accessories.

ĄĄ Customization available.

Intermas develops electronic enclosure systems:Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.

Intermas has an extensive product range of more than 10,000 separate components and more than 30 years’ experience.

Go towww.Intermas-US.com

for our new catalog.

Intermas – InterRail

Industrial Hardware


Intermas US LLCwww.Intermas-US.com


The MitySOM-5CSx combines the Altera Cyclone V SoC, memory sub-systems and onboard power supplies into a highly-configurable, small form-factor System on Module (SOM). All products in the MitySOM-5CSx family are pin-for-pin compatible, allowing development teams room to grow and the flexibility to quickly and cost-effectively meet customers’ ever-changing needs.

The MitySOM-5CSx family offers a wide range of processing densities, speed grades, and temperature options at competitive costs. Critical Link designed the SOM family with rigorous industrial, medical, and defense applications in mind, ensuring long-term production and professional support for our customers.

Standard SOMs and development kits are available today from numerous major distributors. If a standard variant does not meet your specification, contact Critical Link to discuss developing a custom solution.

MitySOM-5CSx: Altera Cyclone V SoC-based SOM

Industrial Hardware


Critical Linkwww.criticallink.com/product/mitysom-5csx/

[email protected] 315-425-4045 www.linkedin.com/company/critical-link-llc twitter.com/Critical_Link

MitySOM-5CSx features a Hard Processor System (HPS) providing up to 4,000 MIPS at speeds of up to 925MHz per core and is com-bined with a NEON coprocessor with double-precision FPU. The MitySOM-5CSx combines a Cyclone V with up to 2GB of DDR3 CPU/FPGA RAM with ECC, 512MB of dedicated DDR3 FPGA RAM (optional) and up to 48MB of QSPI NOR Flash creating a high- bandwidth system for embedded applications. The ARM architecture supports several high level operating systems, including Embedded Linux, Micrium uC/OS, Android, QNX, and Windows Embedded Compact.

By combining six 3.125Gbps transceivers, one PCIe hard core, up to 133 user I/O, and dual Gigabit Ethernet interfaces, the system can simultaneously acquire and efficiently process large amounts of data.


s Resource Guide



http://www.Intermas-US.com

http://www.Intermas-US.com


http://www.criticallink.com/product/mitysom-5csx/


http://www.linkedin.com/company/critical-link-llc


https://twitter.com/critical_link


FEATURES

ĄĄ Multi-Core Intel® Atom™ E3800 ProcessorsĄĄ Up to two independent displays (VGA, LVDS and DisplayPort)ĄĄ Two Ethernet Controllers with IEEE 1588 time stampingĄĄ Two RS-232/422/485 Serial portsĄĄ Bus Expansion (Two MiniPCIe and IO60)ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0)ĄĄ Bootable SATA, CFAST, and mSATAĄĄ Wide range 10 to 50V DC inputĄĄ Fanless -40° to +85°C operational temperature

The SBC35-CC405 series of small form factor computers utilizes the Intel® Atom™ E3800 family of processors in a standard 3.5-inch SBC format. The COM Express based solution includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels, USB 3.0, and +10 to +50V DC input.

Engineered for rugged applications, the low-profile thermal solu-tion creates a sturdy base that protects the PCB assembly, provides convenient mounting, and enables fanless extended temperature operation.

Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.

SBC35-CC405 – Industrial Small Form Factor Computers

Industrial Hardware


WinSystemswww.winsystems.com

[email protected] 817-274-7553 www.linkedin.com/company/winsystems-inc- twitter.com/WinSystemsInc

FEATURES

ĄĄ Freescale® i.MX 6™ Quad-core ARM® Cortex™-A9 ProcessorsĄĄ Fanless -40° to +85°C operational temperatureĄĄ Powered by PoE or +10-50VDC InputĄĄ 10/100/1000 Ethernet with IEEE-1588™

ĄĄ USB 2.0 and USB On-The-Go PortsĄĄ FlexCAN and RS-232/422/485 Serial PortsĄĄ 24 GPIO tolerant up to 30VDCĄĄ Mini-PCIe and IO60 (I2C, SPI, TTL, and PWM) expansion

Designed for industrial applications and long-term availability, WinSystems’ SBC35-C398Q SBC features a quad-core ARM® proces-sor with options for expansion and customization. The combination of processing power and industrial I/O provides a flexible solution for a number of applications including security, industrial control, medical, transportation and MIL/COTS. This low-power design operates from -40° to +85°C without a fan or heatsink for improved reliability.

Kick-start development with our SD Cards, available preloaded with our newly released real-time Linux distribution or Android™. Our factory engineers offer technical support from pre-sales through production.

SBC35-C398Q – Industrial ARM® SBC with Real-Time Linux

Industrial Hardware




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http://www.winsystems.com


http://www.linkedin.com/company/winsystems-inc-




https://twitter.com/winsystemsinc




FEATURES

ĄĄ Intel® Atom™ SoC processor E3845/3826ĄĄ Industrial grade EMI/EMS certified (EN61000-6-4,61000-6-2)ĄĄ Built-in ADLINK SEMA Cloud solutionĄĄ Versatile and reliable I/O maximizes industrial connectivityĄĄ Rugged design for -20°C to 70°C fanless operation (w/ industrial

grade SD/mSATA)ĄĄ Full support for Intel® IoT Gateway platform, with pre-loaded Wind

River® IDP XT 2.0 (MXE-200i only)ĄĄ Extremely compact: 120 (W) x 100 (D) x 55 (H) mmĄĄ Optional DIN-Rail/Wall mounting

ADLINK’s MXE-200/200i ultra-compact fanless embedded platform, based on Intel® Atom™ SoC E3845/E3826 processors, delivers proven versatile connectivity and seamless interconnection for guaranteed interoperability between systems. The MXE-200/200i’s hardy aluminum housing withstands industrial grade certified EMI/EMS (EN 61000-6-4, 61000-6-2) for proven rugged construction, assuring operability under harsh conditions. The intelligent gateway features shock tolerance up to 100 G and an extended operating temperature range of up to -20°C to 70°C (optional). Meeting a wide variety of specific industrial needs, the MXE-200/200i combines controller and gateway functions in one unit, significantly reducing installation/wiring and device costs.

The MXE-200 delivers maximum performance with quad-core Intel Atom Processors, and the MXE-200i adds pre-verified IoT functionality to embedded control capability, with full Intel® IoT Gateway platform support.

MXE-200/200i Intel® Atom™ Processor-based IoT Gateway Platform

Industrial Internet/IoT


ADLINKwww.adlinktech.com • http://bit.ly/1F50yMg


FEATURES

ĄĄ Multi-Core Intel® Atom™ E3800 ProcessorsĄĄ Up to two independent displays (VGA and DisplayPort)ĄĄ Two Ethernet Controllers with IEEE 1588 time stampingĄĄ Two RS-232/422/485 Serial portsĄĄ Internal Bus Expansion (Two MiniPCIe and IO60)ĄĄ Four USB ports (1xUSB 3.0 and 3xUSB 2.0)ĄĄ Bootable SATA, CFAST, and mSATAĄĄ Wide range 10 to 50V DC inputĄĄ Fanless -40° to +85°C operational temperature

The SYS-405 series of industrial computers utilizes the Intel® Atom™ E3800 family of processors in a tough aluminum enclosure. The solutions includes two Gigabit Ethernet controllers with IEEE 1588 time-stamping, two serial channels (RS-232/485/422), four USB, audio, and +10 to +50V DC input.

The rigid enclosure base is engineered for rugged applications and provides the thermal solution for the processor. The 5052 aluminum alloy enclosure protects the PCB assembly and includes access to the CFAST connector.

Linux, Windows, and other x86 operating systems can be booted from the CFAST, mSATA, or USB interfaces, providing flexible data storage options. WinSystems provides driver for Linux and Windows 7/8, as well as pre-configured operating systems.

SYS-405 – Rugged Industrial Computers

Industrial Hardware





s Resource Guide



http://bit.ly/1F50yMg






http://www.adlinktech.com


FEATURES

ĄĄ Atmel ARM9 AT91SAM9X25 400Mhz ProcessorĄĄ Up to 128MB of DDR2 RAMĄĄ Up to 64MB of Serial Data FlashĄĄ Up to 512MB of NAND FlashĄĄ SD/MMC Flash Card InterfaceĄĄ 6 Serial ports (3 with handshake) & SDIO PortĄĄ Ethernet, A/D, SPI, I2C, PWM, GPIOĄĄ High Speed USB 2.0 Host & Device portsĄĄ I2S Audio Line In/Out PortsĄĄ EMAC OE5 LinuxĄĄ 5 Channel, 10-bit Analog-to-Digital converterĄĄ Typical power requirement less than 1 WattĄĄ Small, 144 pin SODIMM form factor (2.66" x 1.5")

EMAC, inc. introduces the SoM-9G25M; a versatile System on Module (SoM) targeting applications that require low power, low cost, and embedded longevity. Designed and Manufactured in the USA, the SoM-9G25M is the ideal choice for Industrial IoT solutions. This module has a temperature range of -40 to +85C, onboard DDR2 RAM, Serial Data Flash, optional NAND, GPIO, Serial Ports, SDIO, Ethernet, A/D, SPI, I2C, PWM, USB Host & Device Ports and I2S Audio Line In/Out Ports. The SoM-9G25M is designed to plug into a carrier board that contains all the con-nectors and any additional I/O required for the application. This approach allows the you or EMAC to design a custom carrier board that meets the I/O, dimen-sional, and connector requirements without having to worry about the processor, memory, and standard I/O functionality. With the System on Module approach, a semi-custom hardware platform can be developed in as little as a month.In addition to the option of the developing a custom carrier board, one can be purchased off-the-shelf. The recommended off-the-shelf Carrier Board for the SoM-9G25M is the SoM-150ES. The SoM approach provides the flexibility of a fully customized product at a greatly reduced cost.Quantity 1 price for the SoM-9G25 is $99.

SoM-9G25M – Low Power Consumption



EMAC, Inc.www.emacinc.com/products/system_on_module

[email protected] 618-529-4525 www.linkedin.com/company/emac-inc-

FEATURES

ĄĄ Linux 2.6.38 computing platform with file systemĄĄ ATMEL 400MHz ARM9 AT91SAM9G45 CPUĄĄ 128MB DDR2 SDRAM and 256MB NAND FlashĄĄ 2 x 10/100Mbps Ethernet portsĄĄ 2 x high-speed USB hosts, up to 480MbpsĄĄ 1 x full size miniPCIe socket inside (USB signal)ĄĄ 1 x half size miniPCIe socket inside (USB signal)ĄĄ 4 x RS-232/422/485 serial ports

Artila’s Matrix-513 is designed for applications of remote device manage-ment which require a reliable wired and wireless communications and low power but powerful computing platform. Matrix-513 comes with two mini-PCIe slots which can accept COTS Wireless LAN, Bluetooth, GPS and cellular 3G miniPCIe cards. The dual independent 10/100Mbps Ethernet ports of Matrix-513 provide a flexible and reliable wired communication, and the four RS-232/422/485 serial ports are ready for connecting to the serial devices. In addition, Matrix-513 is equipped with two isolated digital inputs and one relay output which can be used for device status monitoring and alarm.

Matrix-513 is powered by 400MHz ATMEL AT91SAM9G45 ARM9 SoC and 128MB DDR2 SDRAM and 256MB NAND Flash. A 2MB DataFlash is used as backup file system and it provides users an easy way to perform system update or recovery at the service site.

Applications: Building Automation, Energy Management, Factory Automa-tion, Intelligent Traffic System, Web-based Remote I/O, etc.

Matrix-513, Intelligent IoT Gateway



Artila Electronics Co., Ltd.www.artila.com

[email protected] +886-2-8667-2340

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http://www.linkedin.com/company/emac-inc-



http://www.artila.com


http://www.emacinc.com/products/system_on_module


FEATURES

ĄĄ Intel® I210 Ethernet ControllersĄĄ Two Fully Independent Ethernet ConnectionsĄĄ Small Form Factor Pluggable (SFP) InterfaceĄĄ Accepts the Wide Range of SFP Ethernet ModulesĄĄ Fanless -40° to +85°C operational temperatureĄĄ PC/104-Plus Form FactorĄĄ IEEE 1588 Precision Time Synchronization over EthernetĄĄ Robust Communication over Long DistancesĄĄ Supports Linux, Windows, and DOS Operating Systems

The PPM-N409-2 PC/104-Plus Dual Ethernet module features Small Form Factor Pluggable (SFP) transceivers, controlled by dual Intel® I210 Ethernet Controllers, bringing the latest in technology to your legacy design. Both module housings are compatible with the large variety of SFP trans-ceivers that range from optical single mode, optical dual mode, and GbE twisted pair copper. The small form factor and negligible heat signature of the PPM-N409-2 makes it ideal for installation in confined spaces. Combined with its excep-tional range of operational temperatures, low physical profile, and rugged design, the PPM-N409-2 can be deployed in even the most demanding environments. Give your systems the advantage of compact design, low power con-sumption, and high precision time synchronization of the PPM-N409-2 Ethernet controller from WinSystems. Custom design options are available upon request.

PPM-N409 – Dual PC/104-Plus Ethernet with SFP Interface





FEATURES

ĄĄ Dk: 3.02 | Df: 0.0021 | Tg: 200°C | Td: 380°C ĄĄ Engineered to improve insertion loss on the most demanding high speed

digital designsĄĄ Tachyon 100G is recommended for 100 Gbps backplane & line card

applicationsĄĄ Optimized constructions to improve CAF & lead-free assembly performanceĄĄ Complete line of laminates & prepregs with spread glass weaves to

minimize micro-Dk effects of glass fabrics & to mitigate skewĄĄ HDI design friendlyĄĄ Can be used in hybrid builds as prepregs & laminates because of the

low-cure lamination cycle

Tachyon® 100G laminates and prepregs for printed circuit board fabrication are engineered to reduce insertion loss on high-speed digital line cards and backplane designs. These materials offer a complete line of laminates and prepregs with spread-glass weaves to minimize micro-Dk effects of glass fabrics and to mitigate minimize differential signal skew. Tachyon 100G laminates and prepregs enable high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers that are required to transmit 100GbE at data rates in excess of 25 Gb/s per channel. The materials minimize skew, which lim-its the bandwidth of these links, adds data-dependent jitter, and limits the possibility of equalizing links to compensate for high-frequency skin effect and dielectric losses.Tachyon 100G materials provide a thermosetting matrix that exhibits dielectric per-formance on par with PTFE, thermal performance exceeding most high-reliability resin systems, and processing similar to standard FR-4-type products. The lami-nation cycle for Tachyon 100G offers a 50% increase in press productivity. Tachyon 100G also does not require plasma desmearing. Fabricators can use a wet desmear process instead which provides a major reduction in throughput and cycle time. Tachyon 100G is also HDI friendly and can be processed as a hybrid with other Isola products. These attributes reduce the total cost of manufacturing of a printed cir-cuit board and enables a broader range of PCB fabricators (versus specialized board shops) to process the materials and enter markets that may have been previously unattainable due to manufacturing and cost limitations.

Tachyon 100G



Isolawww.isola-group.com/products/tachyon-100g/

[email protected] 800-537-7656 www.linkedin.com/company/isola-group twitter.com/IsolaGroup


s Resource Guide






http://www.linkedin.com/company/isola-group


https://twitter.com/isolagroup

http://www.isola-group.com/products/tachyon-100g/




FEATURES

ĄĄ SAFEXchange has been certified to IEC 61508, ISO 26262, and IEC 61784-3 by TÜV SÜD. It guards against Incorrect Addressing, Corruption, Delay, Repetition, Incorrect Sequence, Loss and Masquerade of messages.ĄĄ SAFEXchange is based on a Producer and Consumer model, where

Producers publish data onto the network and Consumers can register to access the data. Consumers are not aware of how or where the data is produced - the only information they share is the unique identifier for the stream of data items. ĄĄ New Producers and Consumers can be added to the system without

affecting the safety case, providing the bandwidth of the black channel is adequate.

SAFEXchange™ allows you to securely share safety critical data between multiple processors and cores across any black channel communication systems. A fusion of a Data Distribution Service and an integrity layer, SAFEXchange maintains flexibility and isolation between Producers and Consumers of data by protecting the data shared rather than the commu-nication channel itself. This allows SAFEXchange to be used in conjunc-tion with black channel communication mediums.

• SAFEXchange is ideal for use in projects working across multiple cores and processors, or in any situation where data integrity must be protected.

• SAFEXchange is supplied as an add-on component for all RTOS products supplied by WITTENSTEIN high integrity systems.

Visit www.highintegritysystems.com to find out more.

SAFEXchange™: Secure Multi-processor Communications

Industrial Software


WITTENSTEIN high integrity systemswww.highintegritysystems.com

[email protected] +44 1275 395 600 WITTENSTEIN high integrity systems @WITTENSTEIN_HIS

FEATURES

ĄĄ Combines an industry-standard COM Express CPU with dual XMC I/O modulesĄĄ Small form factor: 3.3" H x 7.7" W x 9.8" DĄĄ Stand-alone operation: Able to operate diskless and headlessĄĄ Windows, Linux and RTOS supportĄĄ Dual PCI Express XMC I/O module sites. Add anything from RF receivers to

industrial control modules. Features for private data channels, triggering and synchronous timing ĄĄ PCI Express I/O sites (VITA 42.3) deliver >3400MB/s to CPU memory**ĄĄ Integrated timing and triggering support for I/O includes optional GPS,

IEEE-1588 or IRIG-disciplined clockĄĄ USB3, 10 Gb Ethernet, SATA3 x4, DisplayPort, optional LCD displayĄĄ Network communication supported with dual 10 GbE ethernet links

**Data rate dependent on the COM Express module capabilities.

The ePC-Duo is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assort-ment of ultimate-performance XMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the ePC-Duo reduces time-to-market while providing the performance you need.Distributed Data Acquisition – Put the ePC-Duo at the data source and reduce system errors and complexity. Optional GPS-synchronized timing, triggering and sample control is available for remote I/O. Uniquely customizable – Dual XMC sites for I/O, user-programmable Xilinx FPGA for I/O interfaces, triggering and timing control, USB ports.Remote or Local Operation – Continuous data streaming up to 2000MB/s (quad local SSDs or dual 10 GbE LAN).

Download data sheets now!

ePC-Duo

Industrial Systems


Innovative Integrationwww.innovative-dsp.com/products.php?product=ePC-Duo


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http://www.highintegritysystems.com



http://www.highintegritysystems.com

https://www.linkedin.com/company/wittenstein-us


https://twitter.com/wittenstein_his


http://www.innovative-dsp.com/products.php?product=ePC-Duo

FEATURES

ĄĄ General Features • 9.3 TB of Storage Per Each 6U VITA 65 Compliant OpenVPX Slot • Up to 4.5 GB/s Write and Up to 5 GB/s Read Bandwidth (write

bandwidth determined by system environmentals) • Scalable Depth and Bandwidth • Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot

Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem)

ĄĄ Backplane I/O • Up to 40Gb Ethernet on each of Four Fat Pipes on P1, for a total of

20GB/s on P1 • 1 Additional Fat Pipe on P4 providing QSFP+ connection via RTM • 1Gb Ethernet Connection on P4

ĄĄ System Management • Client/Server Interface for WILDSTAR FPGA Boards and Linux and

Windows-based CPU systems • Extensive System and Drive Diagnostic Monitoring and

Configuration over 1 Gb Ethernet via P1 and P4 Ethernet • Standard Intelligent Platform Management Interface (IPMI) to

Monitor Current, Voltage and Temperature • Front Panel Status LEDs for all 12 SSDs and all Backplane Control

and Data Plane Connections

ĄĄ Physical Features • 6U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing • Supports OpenVPX Payload Profile:

MOD6-PAY-4F1Q2U2T-12.2.1-n • Integrated Heat Sink • Air Cooled with Product Path to Conduction Cooling

When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market with up to 9.3 TB of capacity in a single 1" slot with up to 4.5 GB/s of write band-width. It also features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Data Storage Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication).

The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot, the “storage canister” which holds up to 12 1.8" SATA disks, and the “Storage Carrier” that plugs into the VPX backplane and holds the disk canister.

The Storage Carrier/Canister is specifically designed to sup-port 10,000+ insertion cycles of the disk canister for frequent drive removal. Both the canister and the entire assembly (Storage Canister + Storage Carrier) are also hot swappable for minimum system down time and highest reliability. This OpenVPX compliant payload card supports 40Gb serial I/O on the VPX Data Plane on P1 to support four channels of 40GbE (proper backplane required for faster rates).

To ensure safe and reliable processing, WILD Data Storage Solution boards come equipped with a proactive thermal management system. Sensors across the board monitor power and temperature, with auto-matic shutdown capability to prevent excessive heat buildup. WILD Data Storage Solution boards are built with a rugged, durable design. Sensors can be accessed with a chassis manager (ChMC).

New heatsinks have been tested with great success on WILD Data Storage Solution boards. These larger heatsinks also act as stiffeners for the boards, making them sturdier.

WILD Data Storage Solution



Industrial Storage



s Resource Guide






FEATURES

ATP DRAM ProductsĄĄ JEDEC compliantĄĄ Extensive support on DDR4,DDR3, DDR2, DDR1, and PC133

SDRAM generation memory modulesĄĄ Industrial Grade temperature range (-40°C to 85°C)ĄĄ Conformal coating for environmentally rugged applicationsĄĄ Long-term supply chain commitment upon module

qualificationĄĄ ATP patented TDBI System – the next generation test during

burn-in

Industrial-Grade Flash ProductsĄĄ SLC NAND Flash ComponentsĄĄ ATP patented PowerProtector Technology – Data integrity

during a sudden power downĄĄ SMART Life Monitor Technology – Flash health status

feedback to hostĄĄ Integrated Secure Erase TechnologyĄĄ Industrial Grade temperature range (-40°C to 85°C)ĄĄ Supply chain road maps by BOM upon product qualificationĄĄ Onboard AES Encryption (SSD Products)

New SATA III Products • 2.5" SSD SII Pro • CFast • 2.5" SSD MV • mSATA • M.2 2260/2242 • SlimSATA

ATP DRAM ProductsATP DRAM Modules are designed for high-performance, mission-critical applications such as Industrial PC and Networking/Telecom, where high levels of technical support, operating consistency, and wide operating temperature ranges are required. Built with high quality IC components and 100% tested, the ATP DRAM module family includes a full spectrum of form factors including VLP, ULP, UDIMM, RDIMM, SODIMM, and MINI-DIMM, as well as multiple generations of DRAM technologies.

ATP has a long history of providing long-term support and addressing specific requirements of OEM customers.

The new ATP Manufacturing, Testing and Validation facility offers enhanced manufacturing quality and TDBI/ATE testing capabilities on all DRAM product lines.

ATP Industrial Grade NAND Flash ProductsFlash Product Line Summary: Memory Cards (microSD/SD), Embedded Modules (SATA, USB, eUSB), and HDD Replacement SSD (2.5" SATAII/III).

ATP Industrial Grade NAND Flash Products are designed for high-performance, mission-critical applications such as Auto- motive, Healthcare, Networking/Telecom, Military, etc, where high levels of durability, operating consistency, and wide oper-ating temperature ranges are required. All ATP Industrial Grade NAND Flash products implement ECC and wear-leveling algorithms to maximize NAND Flash component utilization and long-term data integrity. The product line is also built using SLC (Single Level Cell)-type NAND Flash components, which are specified to at least 20 times greater the rating for program/erase cycles (lifetime) compared to commercial and consumer level MLC-type NAND Flash.

ATP is a true manufacturer with over twenty years of experi-ence in the production of NAND Flash memory solutions and DRAM memory modules. ATP offers in-house design, testing and product tuning, as well as extensive supply chain support with controlled/fixed BOMs and long product life cycles.

ATP DRAM and NAND Flash Products

ATP Electronicswww.atpinc.com


Industrial Storage


www.atpinc.com

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http://www.atpinc.com


FEATURES

ĄĄ Two 1 GSPS, 16-bit DAC channels and Two 1 GSPS, 12-bit A/D channelsĄĄ +/-0.5V, AC or DC -Coupled, 50 ohm, SSMC inputs and outputsĄĄ Xilinx Virtex-6 SX315T/SX475T or LX240TĄĄ 4 Banks of 1GB DRAM (4 GB total)ĄĄ Ultra-low jitter programmable clockĄĄ Arbitrary Waveform Generation MemoryĄĄ Controller for DACsĄĄ Gen2 x8 PCI Express providing 2 GB/s sustained transfer ratesĄĄ PCI 32-bit, 66 MHz with P4 to Host cardĄĄ PMC/XMC Module (75x150 mm)ĄĄ 20-25W typicalĄĄ Conduction Cooling per VITA 20 Ruggedization Levels for Wide Temperature

OperationĄĄ Adapters for VPX, Compact PCI, desktop PCI and cabled PCI Express system

X6-1000M integrates high-speed digitizing and signal generation with signal processing on a PMC/XMC IO module for demanding DSP applications. The tight coupling of the digitizing to the Virtex6 FPGA core realizes architectures for SDR, RADAR, and LIDAR front end sensor digitizing and processing. The PCI Express system interface sustains transfer rates over 2 GB/s for data recording and integration as part of a high performance realtime system.

The X6-1000M features two, 12-bit 1 GSPS A/Ds and two 1 GSPS 16-bit DACs. Analog input bandwidth of over 2 GHz supports wide-band applications and undersampling. The DACs have features for interpolation and coarse mixing for upconversion. The sample clock is from either a low-jitter PLL or external input.


X6-1000

Small Form Factor Modules


Innovative Integrationwww.innovative-dsp.com/products.php?product=X6-1000M


FEATURES

ĄĄ Combines an industry-standard COM Express CPU with dual XMC I/O modulesĄĄ Small form factor: 3.3" H x 7.7" W x 9.8" DĄĄ Stand-alone operation: Able to operate diskless and headlessĄĄ Windows, Linux and RTOS supportĄĄ Dual PCI Express XMC I/O module sites. Add anything from RF receivers to

industrial control modules. Features for private data channels, triggering and synchronous timing ĄĄ PCI Express I/O sites (VITA 42.3) deliver >3400MB/s to CPU memory**ĄĄ Integrated timing and triggering support for I/O includes optional GPS,

IEEE-1588 or IRIG-disciplined clockĄĄ USB3, 10 Gb Ethernet, SATA3 x4, DisplayPort, optional LCD displayĄĄ Network communication supported with dual 10 GbE ethernet links

**Data rate dependent on the COM Express module capabilities.

The ePC-Duo is a user-customizable, turnkey embedded instrument that includes a full Windows/Linux PC and supports a wide assort-ment of ultimate-performance XMC modules. With its modular I/O, scalable performance, and easy to use PC architecture, the ePC-Duo reduces time-to-market while providing the performance you need.Distributed Data Acquisition – Put the ePC-Duo at the data source and reduce system errors and complexity. Optional GPS-synchronized timing, triggering and sample control is available for remote I/O. Uniquely customizable – Dual XMC sites for I/O, user-programmable Xilinx FPGA for I/O interfaces, triggering and timing control, USB ports.Remote or Local Operation – Continuous data streaming up to 2000MB/s (quad local SSDs or dual 10 GbE LAN).


ePC-Duo

Sensors and Control


Innovative Integrationwww.innovative-dsp.com/products.php?product=ePC-Duo



s Resource Guide






http://www.innovative-dsp.com/products.php?product=ePC-Duo

http://www.innovative-dsp.com/products.php?product=x6-1000M


http://www.annapmicro.co


Industrial Embedded Systems 2015 Resource Guide

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