IMU for OIS · 2016-12-07 · ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple...

©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple iPhone 7 Plus 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

InvenSense 6-Axis OIS IMU & STMicroelectronics LSM6DSM

IMU for OISMEMS report by Stéphane ELISABETHNovember 2016

mailto:[email protected]

mailto:[email protected]

http://www.systemplus.fr/

http://www.systemplus.fr/


Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 7

o InvenSense

o iPhone 7 Plus Teardown

Physical Analysis 13

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Package 16

Package Views & Dimensions

Package Pin Out

Package Opening

Wire Bonding Process

Package Cross-Section

o ASIC Die 27

View, Dimensions & Marking

Delayering

Main Blocks Identification

Cross-Section

Process Characteristics

o MEMS Die 37

View, Dimensions & Marking

Cap Removed & Cap Details

Sensing Areas Details

Cross-Section (Sensor, Cap & Sealing)

Process Characteristics

Manufacturing Process Flow 57

o Global Overview

o ASIC Front-End Process

o ASIC Wafer Fabrication Unit

o MEMS Process Flow

o MEMS Wafer Fabrication Unit

o Packaging Process Flow

o Package Assembly Unit

Cost Analysis 76

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses

o ASIC Die 81

ASIC Front-End Cost

ASIC Back-End 0 : Probe Test & Dicing

ASIC Wafer & Die Cost

o MEMS Die 84

MEMS Front-End Cost

MEMS Back-End 0 : Probe Test & Dicing

MEMS Front-End Cost per process steps

MEMS Wafer & Die Cost

o Component 90

Back-End : Packaging Cost

Back-End : Packaging Cost per Process Steps

Back-End : Final Test Cost

6-Axis OIS IMU Component Cost

Estimated Price Analysis 95

Company services 99


Overview / Introductiono Executive Summaryo Reverse Costing

Methodologyo Glossary

Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data,manufacturing cost and selling price of the 6-Axis IMU supplied by InvenSense and found inthe Apple iPhone 7 Plus.

• The IMU is a custom version of InvenSense 6-Axis device (3-Axis gyroscope + 3-Axis Accelerometer) madefor Apple and integrated in the iPhone 7 Plus. It’s an high performance 6-Axis motion tracking optimized foroptical image stabilization with enhanced Electronic Image stabilization support.

• With dimensions of 3.0 x 3.0 x 0.75 mm, it can be applied to mobile, IOT, Drone, Wearable or imaging.

• It uses the same process as InvenSense’s previous generation generation 6-axis device found in the iPhone6 and iPhone 6 Plus.





Physical Analysis


Cost Analysis


About System Plus

Executive Summary

• This full reverse costing study has been conducted to provide insight on technology data,manufacturing cost and selling price of the LSM6DSM 6-Axis IMU supplied by STMicro.

• By keeping the same footprint and decreasing considerably the power consumption compared to ST’sprevious generation IMU, the LSM6DSM is ready to attack the mobile market where the competition onprice is stronger than ever.

• The IMU is the most advanced of STMicroelectronics 6-Axis port-folio device (3-Axis gyroscope + 3-AxisAccelerometer) made for motion tracking and optimized for optical image stabilization with enhancedElectronic Image stabilization support.

• It’s directly targeting the market of the OIS IMU from InvenSense found in the iPhone 7 Plus.

• But with dimensions of 3.0 x 2.5 x 0.82 mm, it can be applied to mobile, IOT, Drone, Wearable or imaging.

• The report includes a detailed technology and cost comparison with ST’s previous generation LSM6DS3,the latest ST’s IMU LSM6DSL and with leading edge 6-Axis OIS IMU from InvenSense found in the iPhone 7Plus.





Physical Analysis


Cost Analysis


About System Plus

The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price

Reverse Costing Methodology


Overview / Introduction


Physical Analysis o Synthesiso Packageo ASIC Dieo MEMS Die


Cost Analysis


About System Plus

Synthesis of the Physical Analysis






Cost Analysis


About System Plus

Synthesis of the Physical Analysis






Cost Analysis


About System Plus

Package View & Dimensions

Package Top View Package Bottom View

Package Side View

3.0 mm

3.0

mm

0.7

5 m

m

• Package: LGA 16-pin

• Dimensions: 3.0 x 3.0 x 0.75 mm

• Pin Pitch: 0.5 mm

• Marking:

E

7944

CE7






Cost Analysis


About System Plus

Package View & Dimensions

Package Top View Package Bottom View

Package Side View

3.0 mm

2.5

mm

0.8

2 m

m

• Package: LGA 14-pin

• Dimensions: 3.0 x 2.5 x 0.82 mm

• Pin Pitch: 0.5 mm

• Marking:

SF

627






Cost Analysis


About System Plus







Cost Analysis


About System Plus

MEMS Sensing Area – Gyroscope






Cost Analysis


About System Plus

Comparison with MP67B & ICM-30630






Cost Analysis


About System Plus

Comparison with LSM6DS3 & LSM6DSL




Physical Analysis

Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo MEMS Front-End Processo Packaging Process

Cost Analysis


About System Plus

MEMS Front-End Process Flow




Physical Analysis

Manufacturing Process Flowo Global Overviewo ASIC Front-End Processo MEMS Front-End Processo Packaging Process

Cost Analysis


About System Plus

MEMS – Sensor Process Flow 1/2




Physical Analysis


Cost Analysiso Synthesiso Supply Chaino Yieldso ASIC Wafer & Die Costo MEMS Wafer & Die Costo Back-End Costo Component Cost


About System Plus

ASIC Front-End Cost




Physical Analysis




About System Plus

MEMS Wafer & Die Cost




Physical Analysis




About System Plus

Component Cost




Physical Analysis


Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

About System Plus

Comparison with the OIS IMU from InvenSense


COMPANYSERVICES




Physical Analysis


Cost Analysis


About System Pluso Company serviceso Feedbackso Contacto Legal

Business Models a Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis


Cost Analysis



Feedbacks

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Physical Analysis


Cost Analysis



Contact

Headquarters21 rue La Noue Bras de Fer44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

America Sales OfficeSteve [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

NANTESHeadquarter

FRANKFURT/MAINEuropa Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.




Physical Analysis


Cost Analysis



Legal

DISCLAIMER

System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic componentsand systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in thereport. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of thisreport. The quoted trademarks are property of their owners.

Reverse Costing® is a deposed brand, by System Plus Consulting.

SERVICES

Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed byindustry experts.

These results are open for discussion. We can reevaluate this circuit with your information.

IMU for OIS · 2016-12-07 · ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple...

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Transcript of IMU for OIS · 2016-12-07 · ©2016 System Plus Consulting | InvenSense 6-Axis-IMU OIS in Apple...