III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA...

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1 dzt Copyright 2019 California Institute of Technology. III-V Semiconductor Unipolar Barrier Infrared Detectors for Earth Science Applications David Z. Ting , Alexander Soibel, Arezou Khoshakhlagh, Sam A. Keo, Sir B. Rafol, Cory J. Hill, Anita M. Fisher, Edward M. Luong, Brian J. Pepper, Sarath D. Gunapala Center for Infrared Photodetectors NASA Jet Propulsion Laboratory California Institute of Technology NASA ESTO 2019 Earth Science Technology Forum (ESTF2019) June 11, 2019 - NASA Ames Conference Center, Mountain View, California. Jet Propulsion Laboratory California Institute of Technology Government sponsorship acknowledged

Transcript of III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA...

Page 1: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

1dzt Copyright 2019 California Institute of Technology.

III-V Semiconductor Unipolar Barrier Infrared Detectors

for Earth Science Applications

David Z. Ting, Alexander Soibel, Arezou Khoshakhlagh, Sam A. Keo, Sir B. Rafol, Cory J. Hill, Anita M. Fisher,

Edward M. Luong, Brian J. Pepper, Sarath D. Gunapala

Center for Infrared PhotodetectorsNASA Jet Propulsion Laboratory

California Institute of Technology

NASA ESTO 2019 Earth Science Technology Forum (ESTF2019)June 11, 2019 - NASA Ames Conference Center, Mountain View, California. Jet Propulsion Laboratory

California Institute of Technology

Government sponsorship acknowledged

Page 2: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

2dzt Copyright 2019 California Institute of Technology.

Outline

• Background

• Recent advances in III-V infrared detectors – Absorber material – type-II superlattice– Unipolar barrier device architecture

• Type-II superlattice unipolar barrier infrared detectors

• Summary

Page 3: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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Background

Traditional Bulk II-VI semiconductor (HgCdTe) and

III-V semiconductor IR detectors

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Traditional Bulk Infrared Material Cutoff Wavelength Coverage

• HgCdTe alloy (MCT) is the most successful infrared material to date– High-performance detector. Varying alloy composition provides continuously adjustable

cutoff wavelength coverage, ranging from NIR to VLWIR

– Soft and brittle. Requires expert handling in growth, fabrication, storage. Costly.– Weak Hg-Te bond. Longer λcutoff , higher Hg fraction, progressively more challenging

• FPAs based on (near) lattice-matched bulk III-V semiconductor photodiodes are highly successful, but only in a few cases where suitable substrates are available.– SWIR InGaAs performs at near theoretical limit

• Single color, limited cutoff wavelength adjustability

– InSb dominates MWIR market, despite lower operating temperature than MCT• Fixed cutoff wavelength, single color

– Lacking the continuous cutoff wavelength adjustability of MCT

2 4 6 8 10 12 14 16 [ µm ]Wavelength λ

Bulk II-VISemiconductors

Bulk III-VSemiconductors

HgCdTe (MCT) Cutoff Wavelength λc

InSbInGaAs

Atmospheric Transm. Windows LWIR / VLWIRMWIRSWIRNIR

III-V FPA ‘-ility’ advantages: high operability, uniformity, large-format capability, producibility, affordability

SWIR leader

MWIR market volume leader;Low operating T

Higher Hg fraction; more challenging

Page 5: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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III-V Infrared Detector with adjustable λCutoff ?2 4 6 8 10 12 14 16 [ µm ]

Wavelength λ

Bulk II-VISemiconductors

[MCT since 1958]

Bulk III-VSemiconductors

HgCdTe (MCT) λCutoff

InSbInGaAs

III-V semiconductor λCutoff

Atmospheric Transm. Windows

III-V FPA ‘-ility’ advantages: high operability, uniformity, large-format capability, producibility, affordability

LWIRMWIRSWIRNIR

MWIR market volume leader;Low operating T

SWIR leader

Can we achieve continuously adjustable λCutoff , covering SWIR to VLWIR,

using III-V semiconductors ?

III-V Robustness + MCT Versatility ??

III-VSemiconductors

Higher Hg fraction; more challenging

Page 6: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

6dzt Copyright 2019 California Institute of Technology.

Recent advances in III-V infrared detectors

Absorber material – Type-II superlatticeUnipolar barrier device architecture

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Semiconductor Superlattices

• Type-II superlattice (T2SL) of particular interest for infrared detectors– Energy band gap can be made smaller than the constituent semiconductors– Also: type-II strained-layer superlattice (T2SLS)

• Examples of infrared T2SL that can be grown on GaSb substrate– InAs/GaSb, InAs/GaInSb, InAs/InAsSb, InAs/InSb, InAsSb/InSb

• Artificial crystalline material grown atomic layer by layer

• Periodic structure, usually made from two alternating semiconductors– E.g., InAs/GaSb

• “Band structure engineered material”: Electric, transport, and optical properties can be adjusted by design

Cross-sectional scanning tunneling microscope (XSTM) image, InAs/GaSb SL.M. Weimer Group, Texas A & M. [J. Vac. Sci. Technol. B 23�3�, 1-5 (2005).]

InAs

GaSb

Page 8: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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Antimonide Type-II Superlattices:Features and Advantages

• Type-II broken-gap band alignment between InAs & GaSb– Electron wave functions localized in InAs; hole wave functions in GaSb layers (type-II)– GaSb Ev is higher than InAs Ec (Broken gap)

• Band gap can be made smaller than constituent bulk semiconductors– Suitable for IR detection

• Sufficiently large absorption coefficient to achieve ample QE• Continuously adjustable band gap / λcutoff by varying layer widths

– Covering SWIR, MWIR, LWIR, and VLWIR• Dark current reduction in superlattice

– Can be engineered for Auger suppression – Less susceptible to tunneling

Adjustable λcutoff

Review Book Chapter: “Type-II Superlattice Infrared Detectors”, D. Z. Ting, A. Soibel, L. Höglund, J. Nguyen, C. J. Hill, A. Khoshakhlagh, and S. D. Gunapala, Semiconductors and Semimetals 84, pp.1-57 (2011).

Page 9: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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The nBn detector

• The nBn– Maimon & Wicks, Appl Phys Lett (2006)

• 351 citations as of May 2019 (Web of Science)– Barrier blocks electrons but not holes– SRH processes are drastically reduced in

wide-band-gap barrier region– Suppresses G-R dark current – Photocurrent flows un-impeded – Resulting in higher operating

temperature / sensitivity– Also suppressed surface leakage current

Ec

Ev

n

Top Contact

Absorber

Electron Barrier

ThermalThermal SRH

n B

Optical

Ec

Ev

p

n

Space charge region

SRH

Thermal

Thermal

Quasi-Neutral region Quasi-

Neutral region

D. Z. Ting 2008

Energy

Distance

nBnp-n diode

Klipstein, Proc. of SPIE Vol. 6940, 69402U, (2008)

( )~ exp / ( )g BE k T-

( )~ exp / 2( )g BE k T-

Diffusion dark current

Depletion (G-R) dark current

Page 10: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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Unipolar Barrier Device Architecture

• A variety of unipolar barrier architectures for single- and dual-band devices• The challenge is in finding heterostructures with

– Matching absorber and barrier conduction or valence band edges– Both absorber and barrier should be closely lattice-matched to the substrate

• Barrier layers tend to be thin; lattice-matching requirement less stringent

• The antimonides (InAs, GaSb, AlSb and their alloys) provide an ideal material system for implementing unipolar barrier infrared detectors

Contact

Unipolar electron barrier

n-type Absorber

B

n nB

Contact

Unipolar hole barrier

p-type Absorberp p

B

Contact

Unipolar electron barrier

n-type Absorberp

n

B

Contact

Unipolar hole barrier

n- or p-type Absorber

B

pn

Unipolar electron barrier

B

nBn pBn

pBpCBIRD

Page 11: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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Type-II superlattice (T2SL) unipolar barrier infrared detectors

LWIR InAs/GaSb T2SL CBIRDMWIR InAs/InAsSb T2SLS nBn

MWIR FPA for CubeSat Spectral ImagingVLWIR FPA for SLI-T

Page 12: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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LWIR InAs/GaSb Type-II SuperlatticeComplementary Barrier Infrared Detector (CBIRD)

• Complementary Barrier Infrared Detector– p-type LWIR type-II superlattice absorber – unipolar hole barrier (hB)– unipolar electron barrier (eB)

• LWIR detector– 9.8 µm cutoff (50% peak QE)– QE=40% (λ=8.5 µm, no AR coating)– Zero-bias turn-on– Jd( 0.1V, 77K) = 0.8x10-5 A/cm2 (~4.2x Rule’07)

• FPA with high uniformity and operability

Ting et al., Appl. Phys. Lett. 95, 023508 (2009) (236 citations as of May 2019); Appl. Phys. Lett. 102, 121109 (2013); U. S. Patent No. 8,368,051 (2013)

!ISC 0903 DI, 320x256, 30 µm pitchNEDT – 18.6 mK (f/2, 300K)[ Rafol et al., JQE 48, 878 (2012) ]

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MWIR InAs/InAsSb Type-II Strained-Layer Superlattice High Operating Temperature Barrier IR Detector (HOT-BIRD)

• MWIR InAs/InAsSb T2SLS nBn detector and FPA– Cutoff wavelength: 5.37 µm (160 K); QE(4.3 µm, 150K)=52% (No A/R coating) – Jdark(-0.2V, 157K)=9.6´10-5 A/cm2 (~4.5X Rule’07)– D*=3 ´10-11 cm-Hz½/W at 150K operating temperature (f/2 optics, 300 K background) – FPA: 160K NEDT=18.7 mK, operability =99.7%; 170K NEDT=26.6 mK, operability =99.6%

• Designed for same λcutoff , operates at much higher temperature than InSb– Planar InSb (ion implant) ~ 80K. MBE epi InSb ~ 95-100K (can image up to 110-120K)– Reduced cryo-cooler Size, Weight, and Power - SWaP advantages– Retains benefits of III-V semiconductor robustness (“ility” advantages)– InSb is a major incumbent technology

• InSb FPAs account for >50% of all photodetector FPAs sold in 2018 (G. Fulop, Maxtech International, Inc.)

Ting et al. Appl. Phys. Lett. 113, 021101 (2018); IEEE Photonics J. 10(6), 6804106 (2018); U. S. Patent No. 8,217,480 (2012)

170 Kλc=5.47 µm

f/2 optics, 300K background

Page 14: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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• NASA CubeSat Infrared Atmospheric Sounder (CIRAS): Spectral imaging (intermediate background) requires good low-T dark current characteristics

• Detectors specifically designed to meet the requirement for this application– λcutoff ~ 5.4 µm at 120K. Jdark(-0.2V,111K)=1.8x10-8 A/cm2 (~3x Rule’07). – Nearly diffusion-limited dark current to below 110K

• FPA– Mean Jdark(115K)=1.6x10-7 A/cm2 ; mean QE ~55% in 3 – 5 µm band at 120K– Mean NEDT (115K) = 20.1 mK (σ= 3mK), 300K background, F/7.8– NEDT operability: 99.99%

MWIR T2SL Detectors & FPAs for Earth Science Imaging Spectrometer Applications

λc= 5.4 µm115 K

Ting et al., SPIE Proc. 10624, 1062410 (2018).

CIRAS: Pagano et al., SPIE Proc. 10402, 1040209 (2017); SPIE Proc. 10769, 1076906 (2018)

Mounted focal plane array (FPA) and integrated dewar cooler assembly (IDCA).

Page 15: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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VLWIR T2SL Detectors & FPAs for SLI-T

• Developing T2SL-based LWIR detectors for NASA Sustainable Land Imaging Technology (SLI-T) Program

• Unipolar barrier infrared detector architecture, T2SL absorber– High quality λcutoff ~ 11.2 µm T2SL absorber material– 240 ns minority carrier lifetime– Jdark(60K)~10-5 A/cm2 ; QE ~ 37% without A/R coating.– Very good FPA operability

• λcutoff ~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing. • Collaborating with industry to demonstrate compact camera core

T=60 K

λc= 11.2 µm

No A/R coating

99.7% operability (17SLL03)

λc = 12.6 µm

T= 65 K

99.98% operability (18SLL03)

Ting et al., SPIE Proc. 10624, 1062410 (2018).

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Summary

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Antimonide Unipolar Barrier Infrared Detectors2 4 6 8 10 12 14 16 [ µm ]Wavelength λ

Bulk II-VISemiconductors

[MCT since 1958]

Bulk III-VSemiconductors

HgCdTe (MCT) λCutoff

InSb

Antimonide bulk/T2SL barrier IR detectors λCutoff

Atmospheric Transm. Windows

III-V FPA ‘-ility’ advantages: high uniformity, operability, large-format capability, producibility, affordability

LWIRMWIRSWIRNIR

MWIR market volume leader;Low operating T

All can be grown lattice-matched to, or pseudomorphically on, GaSb substrates

III-VSemiconductors:

Antimonide Alloys &

Superlattices

Higher Hg fraction; more challenging

InGaAsSWIR leader

2 4 6 8 10 12 14 16 [ µm ]

Page 18: III-V Semiconductor Unipolar Barrier Infrared Detectors ...Jun 11, 2019  · –Very good FPA operability •λcutoff~ 12.6 µm detectors/FPAs also demonstrated. Optimization ongoing.

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Summary

• Significant advances in III-V semiconductor infrared detector development in the past decade– Infrared absorber material – e.g. type-II superlattices– Detector architecture – unipolar barriers– The antimonides provides an excellent platform for implementing

III-V unipolar barrier infrared detectors and focal plane arrays

• MWIR InAs/InAsSb T2SL FPAs operate at significantly higher temperature than market leading InSb FPAs

• Low dark current MWIR T2SL FPAs suitable for spectral imaging applications

• VLWIR T2SL FPAs being developed for land imaging applications under SLI-T