IDO-EVB6Y09 Hardware User Manual

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IDO-EVB6Y09 Hardware User Manual 1 Wireless-Tag Technology Co., Limited http://www.wireless-tag.com Shenzhen Tactile Intelligent Technology Co., Ltd. http://www.industio.com IDO-EVB6Y09 Hardware User Manual Revise History Version Date Log V1.0 2020/05/22 Create

Transcript of IDO-EVB6Y09 Hardware User Manual

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IDO-EVB6Y09 Hardware User Manual

Revise History

Version Date Log

V1.0 2020/05/22 Create

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Content

IDO-EVB6Y09 Hardware User Manual .........................................................................................................1

1. Overview ...............................................................................................................................................3

1.1 Hardware features .....................................................................................................................3

1.2 Applications .................................................................................................................................4

2. Specification .........................................................................................................................................4

2.1 Hardware specifications ...........................................................................................................4

2.2 Electrical parameters .................................................................................................................5

2.3 Use environmental parameters .............................................................................................6

3. Interface description ........................................................................................................................6

3.1 Schematic diagram of motherboard interface ..........................................................6

3.2 Power interface ...........................................................................................................................7

3.3 RS485/RS232/CAN interface ..................................................................................................7

3.4 50Pin RGB interface ...................................................................................................................8

3.5 LVDS interface and LVDS backlight interface ................................................................ 10

3.6 RTP interface ............................................................................................................................. 11

3.7 CTP interface ............................................................................................................................ 13

3.8 HP headset ................................................................................................................................ 13

3.9 Speaker interface .................................................................................................................... 13

3.10 TF card interface ................................................................................................................... 14

3.11 USB ............................................................................................................................................ 14

3.12 Ethernet interface ................................................................................................................. 15

3.13 Mini PCIe ................................................................................................................................. 15

3.14 SIM card holder ..................................................................................................................... 15

3.15 4G/WIFI antenna ................................................................................................................... 16

3.16 LED indicator .......................................................................................................................... 17

3.17 Debug serial port .................................................................................................................. 17

3.18 Extension port ........................................................................................................................ 18

3.19 Keys ........................................................................................................................................... 19

3.20 PCBA mechanical dimensions .......................................................................................... 20

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1. Overview

IDO-EVB6Y09 is a development board for NXP i.MX6ULL . It is developed based on the IDO-

SOM6Y08 core board. It is equipped with NXP IMX6ULLIEC processor and the maximum

frequency can reach 800MHz. Support WIFI Bluetooth module and 4G full Netcom module

wireless communication mode, provide dual Ethernet interface, CAN, RS-485, RS-232, USB

OTG, TF card, SIM card, LVDS, RGB, TP and audio and other functional interfaces . It can be

used as an evaluation board or widely used in various industrial Internet of Things gateways

and industrial control equipment.

Figure 1. IDO-EVB6Y09 product schematic

1.1 Hardware features

CPU

⚫ Standard equipped with IDO-SOM6Y08 series Cortex ™ -A7 SOM: IDO-SOM6Y08-

D256N256 or IDO-SOM6Y08-D512E8G

⚫ Main frequency 800M Hz, 256MByte DDR3, 256MByte NandFlash

⚫ Equipped with 128 KB L2 cache

⚫ The integrated power management module reduces the complexity of the external

power supply and simplifies the power-on sequence

Audio/video interface

⚫ Parallel LCD display with resolution up to WXGA (1366x768)

⚫ 2 audio interfaces (including recording and playback), left channel, right channel

⚫ 1 LVDS

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⚫ 2 RGB,24bit RGB

Communication Interface

⚫ 2 10/100 adaptive ethernet

⚫ 5 UART,UART1 for debug

⚫ 2 RS232

⚫ 2 RS485

⚫ 3 USB2.0

⚫ 1 Can-bus signal interface

⚫ 2 wireless module interfaces, 1 4G module interface (MINI-PCIE), 1 WIFI/BT interface

Others

⚫ 1 TF card

⚫ 1 SDIO

⚫ 2 I2C

⚫ 1 SPI

⚫ Multiple IO expansion interfaces

1.2 Applications

⚫ Car telematics

⚫ IOT gateway

⚫ Human-machine interface

⚫ Home energy management system

⚫ Intelligent energy information concentrator

⚫ Intelligent industrial control system

⚫ Electronic POS equipment

⚫ Portable medical equipment

⚫ Printers and 2D scanners, etc.

2. Specification

2.1 Hardware specifications

Table 1. Hardware parameters

Specifications Definition

CPU NXP i.MX6ULL ARM 800MHZ,40~105℃ Industrial grade

DDR3 256MB/512MB optional,256 default

FLASH/eMMC Support NAND FLASH from 256MB to 1GB

Or eMMC 4GB~32GB

256MB NAND FLASH default

LAN 2 10M/100Mbps adaptive

USB 3 USB 2.0 Host

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4G LTE B1/B3/B38/B39/B 40/B41;

3G B1/B34/39/BC0 GSM/EDGE;

B3/8

Support main/diversity antenna, GPS antenna;

Standard drawable SIM card holder, eSIM optional

SIM card holder 1, Support standard SIM card

Reserve eSIM card position, support eSIM

RS485 2 channels with interface protection, isolated RS485 transceiver

RS232 2 channels with interface protection, isolated RS232 transceiver

CAN 1 channel with interface protection, isolated CAN transceiver

TF card Micro SD card standard

Audio output 1 channel 4 section OMTP standard 3.5mm headphone jack, support

voice input;

1 dual channel 8ohm 1W speaker (PH2.0 4Pin);

LCD Support a variety of commonly used LCD screens, up to 1366 * 768

resolution;

One 50Pin 0.5mm FPC seat, support universal 7 and 10.1 inch LCD

One 24bit LVDS interface, support larger size LVDS interface LCD.

LVDS screen

backlight interface

1, support 5V or 12 LVDS backlight power supply, PWM dimming

output;

Resistance touch

screen interface

4-wire resistive touch, expanded through PH-4P connector and

4Pin 1.0mm FPC seat;

Capacitive touch

screen interface

I2C communication, external expansion through 6Pin 0.5mm FPC

seat;

Keys 1 RESET button, 1 ON/OFF button (long press to turn off, short

press to turn on), 1 firmware upgrade button (MODE0)

WIFI/BT Support RT8723BU/ATBM6032I WIFI/BT module;

Extension port 3 channel, expand 46 CPU IO, can be configured as

GPIO/I2C/SPI/SDIO/UART/CAN;

RTC Independent RTC clock chip, 1220 button battery, easy

maintenance;

LED indicator 1 4G indicator, 1 system indicator, 1 power indicator, 1 custom

indicator;

Power input 9 ~ 30V DC @ 1A power supply;

Standard DC block 5.5 * 2.1 interface.

2.2 Electrical parameters

Table 2. Electrical parameters

Power supply range 9V ~ 28V DC voltage, rated voltage 12V DC

rated power <5W (without screen)

Power protection Lightning surge ± 2KV, EFT ± 2KV

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Interface protection

(RS485, RS232, CAN)

Lightning surge ± 2KV, EFT ± 2KV, ESD air 12KV, contact

8KV

EMC standards EN61000-6-2-2005

EN61000-6-4:2007

Environmental protection RoHS

2.3 Use environmental parameters

Table 3. Use environment parameter table

Working temperature -40~70℃(Industrial version)

storage temperature -40~85℃

environment humidity 10~90%RH(Non-condensing)

Shock resistance 10~25HZ(X/Y/Z direction 2G/30 minutes)

3. Interface description

3.1 Schematic diagram of motherboard interface

RS232 X 2 | RS485 X 2 | CAN X 1 ETH0 | ETH1 USB OTG Power input

Extension port

Debug TTL

USB

Speaker

ON/OFF key

RESET key

LVDS power supply

options

IO key

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Figure 2. Front interface diagram of the motherboard

Figure 3. Interface diagram on the back of the motherboard

3.2 Power interface

The default power supply voltage is 12V @ 2A, and the standard 5.5x2.1mm standard DC

socket J1 is used by default.

If the LVDS backlight needs to supply 12V power, the power interface should provide DC 12V.

In other cases, the power supply voltage range is DC 9V ~ 30V.

3.3 RS485/RS232/CAN interface

RS485/RS232/CAN interface uses 14PIN 3.81mm 15DGE terminal J24, the pin definition is

shown in Table 4:

Figure 4. Schematic diagram of RS485/RS232/CAN interface pins

RTP RGB SIM card holder CTP Upgrade key

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Table 4. RS485/RS232/CAN/DI interface pin definition table

Pin num Pin definition Explanation

1 S2-TXD RS232-2 isolated transceiver, support up to

115200bps baud rate 2 S2-RXD

3 G RS485/RS232/CAN isolated power ground

4 S3-TXD RS232-3 isolated transceiver, support up to

115200bps baud rate 5 S3-RXD

6 G RS485/RS232/CAN isolated power ground

7 RS485-1A RS485-1 isolated transceiver, support up to

115200bps baud rate 8 RS485-1B

9 G RS485/RS232/CAN isolated power ground

10 RS485-2A RS485-2 isolated transceiver, support up to

115200bps baud rate 11 RS485-2B

12 GND RS485/RS232/CAN isolated power ground

13 CAN-H CAN isolated transceiver

14 CAN-L

3.4 50Pin RGB interface

The 50Pin RGB interface adopts FPC 0.5mm lower socket J8. The interface details are shown

in Figure 5 and Figure 6:

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Figure 5. Schematic diagram of the 50Pin RGB interface pins

Figure 6. Schematic diagram of the 50Pin RGB interface pins

The 50Pin LCD FPC connector is suitable for most 7 inch and 10.1 inch RGB interface LCD

screens. The backlight brightness of different screens can be adapted by modifying the

resistance of R165 and R168. The circuit diagram of the backlight part is shown in Figure 7;

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Figure 7. Schematic diagram of RGB backlight current

3.5 LVDS interface and LVDS backlight interface

The LVDS signal interface uses 2X10 pitch 2.0mm through-hole bent-pin double-row single-

plastic pin J12, and the interface pins are shown in Figure 8; use 14-24AWG cable and connect

according to the following instructions. The interface definition is shown in Table 5:

Figure 8. Schematic diagram of the LVDS signal interface pins

Table 5. LVDS signal interface pin definition table

Pin num Pin definition Explanation

1 LVDS_PWR LVDS screen power supply (3.3V/5V can be

selected by jumper) 2 LVDS_PWR

3 LVDS_PWR

4 NC NC

5 GND Power ground

6 GND

7 LVDS0_TX0_N LVDS0_TX0 Signal pair

8 LVDS0_TX0_P

9 LVDS0_TX1_N LVDS0_TX1 Signal pair

10 LVDS0_TX1_P

11 LVDS0_TX2_N LVDS0_TX2 Signal pair

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12 LVDS0_TX2_P

13 GND Power ground

14 GND

15 LVDS0_TXC_N LVDS0_TXC Signal pair

16 LVDS0_TXC_P

17 LVDS0_TX3_N LVDS0_TX3 Signal pair

18 LVDS0_TX3_P

19 NC NC

20 NC

The LVDS backlight interface uses 6Pin through-hole 90 ° PH2.0 socket, the interface

definition is shown in Table 6:

Figure 9. LVDS backlight interface pin schematic

Table 6. LVDS backlight interface pin definition list

Pin num Pin definition Explanation

1 GND Power ground

2 GND

3 LVDS_PWM Backlight adjustment control signal, 3.3V/

5V level can be selected by jumper

4 LVDS_ON Backlight enable output , 3.3V/5V level can

be selected by jumper

5 LVDS_VBLP LVDS screen backlight voltage, 5V/12V can

be selected by jumper; if 12V backlight

voltage is selected, the DC power supply

should provide 12V input.

6 LVDS_VBLP

3.6 RTP interface

Provides a 1-way RTP (Resistive Touch Panel) interface, and the signal is externally connected

through the 4Pin through hole 90 ° PH2.0 socket J25 and 4Pin FPC 1.0mm to the socket J29;

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J25 and J29 interface definitions are shown in Table 7 and Table 8 As shown:

Figure 10. RTP (J25) pin schematic

Table 7. RTP (J25) interface definition list

Pin num Pin definition Explanation

1 RTP_YT Resistor TP Y-direction upper side sampling

signal

2 RTP_XL Resistor TP X direction left side sampling

signal

3 RTP_YB Resistor TP Y-direction underside sampling

signal

4 RTP_XR Resistor TP X direction right side sampling

signal

Figure 11. RTP interface (J29) pin diagram

Table 8. RTP interface (J29) definition list

Pin num Pin definition Explanation

1 RTP_YT Resistor TP Y-direction upper side sampling

signal

2 RTP_XL Resistor TP X direction left side sampling

signal

3 RTP_YB Resistor TP Y-direction underside sampling

signal

4 RTP_XR Resistor TP X direction right side sampling

signal

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3.7 CTP interface

Provide a CTP (Capacitive Touch Panel) interface, the signal is connected through the way of

6Pin FPC 0.5mm under the socket J10;

Figure 12. CTP pin schematic

Table 9. CTP interface definition list

Pin num Pin definition Explanation

1 TP_3V3 VOUT_3.3V

2 TP_RST# TP reset signal

3 TP_INTn TP interrupt signal

4 TP_SCL I2C signal

5 TP_SDA

6 GND Power ground

3.8 HP headset

The earphone base adapts to the OMTP standard (national standard) 4 section 3.5mm

headphone connector (CTIA standard earphones can also be changed). The definition of the

OMTP standard headphone connector is shown in Figure 13:

Figure 13. Schematic diagram of 3.5mm headphones

3.9 Speaker interface

The motherboard connects to the two-channel speaker interface through the 4Pin through

hole 180 ° PH2.0 socket J15, and each channel supports 8ohm 1W speakers. The pin

definition of the speaker interface is shown in Table 10:

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Figure 14. Schematic diagram of the speaker interface

Table 10. List of speaker interface definitions

Pin num Pin definition Explanation

1 SPKR+ Right channel speaker driver output

2 SPKR-

3 SPKL- Left channel speaker driver output

4 SPKL+

3.10 TF card interface

Support standard MicroSD memory card, support FAT, EXT and other file systems, maximum

32GB; i.MX6ULL will start from SD / TF card by default when there is no bootable program on

the core board NAND FLASH / EMMC.

3.11 USB

Provide 3 USB2.0, can support standard USB storage disk and other devices, and provide 5V

@ 1A power supply capability. The USB OTG1 signal of the core board is connected to an

external USB plug-and-play device through the USB HOST socket, and the system firmware

can be burned through this interface; the USB OTG2 signal of the core board is expanded to

four channels through the USB2514 USB HUB chip, two of which are used for connection 4G

module and WIFI / BT module, the other two channels are expanded through PH2.0-4

socket J6 and 2.0 pitch pin J38; J6 interface definition is shown in Table 11:

Figure 15. J6 pin schematic

Table 11. J6 interface definition

Pin num Pin definition Explanation

1 USB_5V USB power supply 5V

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2 USB_D- USB signal

3 USB_D+

4 GND Power ground

3.12 Ethernet interface

Provides 2-way Ethernet interface J55, 100M / 10Mbps adaptive. The core board is connected

to the KSZ8081RNAIA-TR through the ENET1 RMII interface to expand one network, and the

bottom board is connected to the KSZ8081RNAIA-TR through the ENET2 interface to another

network.

3.13 Mini PCIe

The Mini PCIe interface J12 is reserved on the motherboard, which is adapted to the 4G

mobile communication module of the Mini PCIe interface. The 4G mobile communication

module of the Mini PCIe interface is shown in Figure 16.

Figure 16. Schematic diagram of 4G mobile communication module

The 4G module supports full coverage of various network formats, and the antenna uses

MIMO technology to meet the data rate and connection reliability requirements of the

wireless communication system.

3.14 SIM card holder

The SIM card holder is located on the back of the motherboard, under the TF card slot,

press the yellow spring twist, you can remove the card slot, the card slot fits the standard

size SIM card, as shown below:

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Figure 17. Schematic diagram of the SIM card

If you want to adapt Micro SIM card or Nano SIM card, you need to adapt the corresponding

card sleeve. As shown below:

Figure 18. Schematic diagram of the ferrule

The SIM card installation direction is as shown in the figure below, just insert the card holder.

Figure 19. Schematic diagram of SIM card placement

3.15 4G/WIFI antenna

The circuit board adopts SMA outer screw inner hole antenna base, which is suitable for inner

screw inner needle 4G antenna / WIFI antenna. Generally, it is a sucker antenna, and the 4G

antenna is connected to the main antenna by default. The main set antenna and WIFI antenna

of the 4G module inside the motherboard are connected to the SMA outer screw inner hole

antenna base using the IPEX generation antenna base antenna. The antenna is shown in

Figure 20:

Figure 20. Antenna diagram

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3.16 LED indicator

Figure 21. LED indicator illustration

Table 12. LED indicator definition description list

Pin num Pin definition Explanation

LED1 POWER System 3.3V power indicator

LED2 SYSTEM System running status indicator, frequency

indicates current CPU load

LED3 USR_LED_IO IO controllable LED lights, custom application

LED4 4G Status 4G status:

Slow flashing (200ms high/1800 ms low)

Searching mode

Slow flashing (1800ms high / 200ms low)

Standby

Fast flashing (125ms high / 125ms low) Data

transmission mode

High level calling mode

3.17 Debug serial port

Two types of debugging serial ports are supported:

UART1 (TTL level), the interface leads to UART1 RX, TX and GND through PH2.0-3 socket J16,

the pin definition is shown in Table 13;

UART1 to USB, onboard UART1-> USB conversion chip, can be directly connected to the PC

USB port through J17 MicroUSB interface, Windows system can be recognized as a serial

device without driver. Using software like minicom, hyperterminal, developers can access the

embedded Linux console.

Figure 22. J16 pin schematic

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Table 13. List of J16 definition descriptions

Pin num Pin definition Explanation

1 UART1-RXD Connect directly to CPU pin, 3.3V level

2 UART1-TXD Connect directly to CPU pin, 3.3V level

3 GND Power ground

3.18 Extension port

The expansion interface adopts 2.0 pitch 2*15 double-row pin J38. The interface definition is

shown in Table 14:

Figure 23. Schematic diagram of the expansion interface 2 interface pins

Table 14. Extension interface definition description list

Pin num Pin definition Explanation

1 CSI_DATA07/SPI1_MISO SPI1_MISO

2 CSI_DATA06/SPI1_MOSI SPI1_MOSI

3 CSI_DATA05/SPI1_SS0 SPI1_SS0

4 CSI_DATA04/SPI1_SCLK SPI1_SCLK

5 CSI_DATA03/UART5_RTS/SPI2_MISO SPI2_MISO

6 CSI_DATA02/UART5_RTS/SPI2_MOSI SPI2_MOSI

7 CSI_DATA01/UART5_RX/SPI2_SS0 SPI2_SS0

8 CSI_DATA00/UART5_TX/SPI2_SLK SPI2_SLK

9 GND Power ground

10 GND Power ground

11 CSI_HSYNC/I2C_SCL/UART6_CTS/PWM8 I2C_SCL

12 CSI_VSYNC/I2C_SDA/UART6_RTS/PWM7 I2C_SDA

13 CSI_PIXCLK/I2C1_SCL/UART6_RX I2C1_SCL

14 CSI_MCLK/I2C1_SDA/UART6_TX I2C1_SDA

15 GND Power ground

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16 GND Power ground

17 USB_A4_DP USB signal

18 USB_A4_DN

19 GND Power ground

20 GND Power ground

21 UART2_CTS/CAN2_TX CAN2_TX

22 UART2_RTS/CAN2_RX CAN2_RX

23 GND Power ground

24 SYS_3V3 3.3V_OUT

25 GND Power ground

26 VCC5V 5V_OUT

27 GND Power ground

28 DC12V_IN 12V_OUT

29 ISO_GND Isolated power ground

30 ISO_5V Isolated power 5V_OUT

3.19 Keys

IO custom keys, use the SNVS_TAMPER5 pin, the circuit principle is shown in Figure 24:

Figure 24. IO button circuit schematic

Upgrade button, used to burn system firmware via USB. In the case of power failure, connect

the motherboard's USB OTG interface through the computer, press the MODE button and

then power on the motherboard, the motherboard enters the USB burning mode, and use

the burning tool to burn the system;

RESET button, press the button to reset the power, the system restarts;

ON/OFF button, press and hold the system to shut down, and short press to power on when

the system is off.

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3.20 PCBA mechanical dimensions