IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 o

IBL Project Cost

V1.13 G. Darbo & H. Pernegger

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 2

Credits for the Costs   Partial list of people consulted and contributing to the cost evaluation:

•  J.Joseph: ROD •  C.Meroni: cables, PP2 •  S.Kersten: DCS. HV/LV PS •  N.Wermes: Modules, Bump-Bonding, Sensors (planar) •  M.Garcia-Scivers: internal services, flex-hybrid •  T.Flick, G.Lenzen, KK Gan: opto components •  D.Giugni: stave mechanics •  M.Battistin: cooling plant •  N.Hartman, G.Mornacchi, M.Nessi, H.Pernegger, R.Veness, R.Vuillermet: beam-pipe, installation, ALARA, global supports •  F.Faccio & K.Kloukinas: chip design in 0.13 µm technology •  Xxx: forgotten credits…

  Comments: •  Cost incertitude is still large and not uniformly evaluated for all the components. This because early

phase of the project has still many technical solution undecided. •  Costs which are not included:

•  Contingency is not put in – should be of the order of 25% for this kind of project – who takes the deliverable as in kind contribution need to consider an “hidden contingency”.

•  Subsistence at CERN (manpower is only for installation) – support to manpower at CERN must be shared between home institutes and subsistence funds accessible to the project.

•  Manpower at the institutes

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 3

Cost Profile   Payments for construction is peaked in 2012

  Total cost (M&O-A – M&O-B/New project): 9630k   Subsistence not included (~500÷700k needed):

•  2 FTE 2010 & 2011 •  4 FTE 2012, 2013, 2014 •  + Same amount of FTEʼs from Institutes

  Support to stay at CERN for IBL management: •  IBL PL, ENG Coordinators

  SR1/IBL operation: •  30k – 2010 •  50k – 2011, 2012, 2013, 2014

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 4

Cost Profile – WBS

  Some large orders as FE-I4, sensor, bump-bonding and beam pipe are “quantised” and could significantly change the profile

•  FE-I4 v1 (500k) submission foreseen by the end of this year. Payment put in 2010.

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 5

Costs Breakdown – Prototype, Construction, Jigs…

  Prototype cost is 1.0 MCH •  FE-I4, sensor, stave, bump-bonding need substantial prototyping

  Many jig for integrating the detector and for insertion/extraction   Manpower considered in the IBL cost only for installation

•  Need to add subsistence + support for IBL management members.

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 6

WBS-1: Sensors

  Only a fraction of the prototyping cost is included for sensor prototyping with FE-I4: •  Motivation was that cost is shared with sLHC R&D – in particular 3D sensors are underestimated

since we want to proceed the development of the 3 sensor flavours: CNM (Barcellona), FBK (Trento), Stanford/SINTEF (SLAC/OSLO)

•  Feedback needed from NCP if this model works: IBL & sLHC sharing of cost. •  Diamonds are not in the WBS – under investigation engineering and system impact to

keep diamond option open for the prototyping phase   Production cost

•  Cost considers a 40% yield from produced tiles to accepted bare modules and 20% lost in all other assembly steps (~125 wafer) – the cost is tight for 3D – should have good contingency for planar, while diamonds are a factor 3 too low.

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WBS-2: Electronics

  FE-I4 contribute to 1.3 MCH •  Schedule strongly depend on them •  Payment are 80% at “tape-out”, 20% on chip delivery (~3 months after)

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WBS-3: Hybridisation

  Bump-bonding contributes for 90% of this package •  Bump-bonding development for both 3D and Planar sensors. •  We want two bump-bonding vendors brought to qualification before

production tender •  Only one vendor used for production – pixel used two vendors for production

of a much larger system

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 9

WBS-4: Local Supports

  This package has: •  Bare stave prototype •  Bare stave production •  Loaded stave with modules

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 10

WBS-5: Internal Services

  This package has: •  Signals from EoS (was PP0 in Pixel) to PP1 •  Power from EoS to PP1 •  HV from EoS to PP1 •  Cooling pipes from EoS to PP1 •  PP1 patch pannel

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WBS-6: Beam Pipe & Interfaces

  This package has: •  Beam-pipe extraction / insertion tooling, mock-up •  New Be beam-pipe •  IBL Support tube (IST): WBS-6.3.1 •  Global support to link the IBL to present pixel detector •  Support and alignment of beam-pipe

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WBS-7: Surface Integration

  Integration of beam-pipe with staves in SR1 •  Partial reuse of ITT (Pixel IntegrationTransport Tool)

  Qualification in SR1 of Integrated IBL •  Electrical test, optical test, cooling

  Portable CO2 system included

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WBS-8: External Services

  “Standard cables” and cooling pipes •  Service installation in WBS-10

  Box on IDEP for optoboard •  Include heating/cooling for the optoboards

  PP2 regulator box •  PP2 boards are in the WBS-2 (Electronics)

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WBS-9: External Cooling

  Cooling plant •  CO2 or C3F8 (also look at mixture of C2F6 and C3F8) •  Cooling distribution system (pipes to IBL in WBS-8)

  Cooling design qualification •  Test setup to perform measurement of thermal parameters (HTC, …)

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WBS-10: Installation in the Pit

  This package include: •  ALARA requirements and consultation with specialised firms •  Manpower form specialised firms •  Installation of services (foreseen ~2 years before IBL package) •  Testing after connection of services to IBL •  Endoscope, considered an indispensable tool, is in the package.

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 16

WBS-11: DAQ, DCS, Interlock,…

  Off-detector and mainly “off-shelf” electronics •  Crates, Racks (need to find space, but not in the cost) •  S-link cards (on ROS side) •  DCS standard or Pixel hardware •  Power supply (LV same of Pixel, HV need to push higher voltage for planar

sensor option) •  ROS and S-link destination card responsibility of TDAQ, but quoted in IBL.

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 17

WBS-12: Test beam & Irradiation

  Irradiation and test beam we want to bring control inside IBL project •  It was considered not to include in the project cost •  Specific activity for IBL need to be recognized in some way

IBL Project Cost - V1.13 G. Darbo – INFN / Genova 8 July 2009 18

Common Orders & Cash

  Cash needed in: •  WBS1 – sensors / WBS3 – hybridisation : deliverables for Institutes & common orders •  WBS2 – electronics (10%): more than 50% are FE-I4 cost. Most in-kind deliverables •  WBS4 - local supports / WBS 5 – internal services / WBS 6 – beam-pipe and interfaces

(20%) : many parts, need flexibility •  WBS7 – surface integration / WBS11 – DAQ, DCS, PS, Interlock (50%) ; integration

and system test   Total: 5.6 MCH M&O-B/Project / Common orders 2.5 MCH / Cash 0.7 MCH

•  Adding subsistence would bring ~22% the cash for the not M&O-A part of the project

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Conclusions   IBL cost evaluated for the whole project:

•  4.0 MCH (M&O-A) + •  5.6 MCH M&O-B/New project •  0.5÷0.7 MCH subsistence at CERN •  Contingency (to add) : 25%

  Payment profile made on 2014/15 installation

  Use the present costing at “interim” to work on MoU •  Refine the cost when TDR and MoU will be ready