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Jerry Blazey May 31, 2007 LCWS07
1
http://www-sid.slac.stanford.edu/
SiD Overview & OpportunitiesSiD Overview & Opportunities
Jerry BlazeyJerry BlazeyNorthern Illinois UniversityNorthern Illinois University
LCWS07-HamburgLCWS07-HamburgJune 1, 2007June 1, 2007
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
The Challenge: Discovery & The Challenge: Discovery & Precision MeasurementsPrecision Measurements
• Higgs & Recoil Higgs & Recoil Mass Mass Reconstruction (ie Reconstruction (ie ZH) ZH) – excellent excellent
momentum momentum resolutionresolution
• Higgs Decays Higgs Decays – efficient b and c efficient b and c
jet tagsjet tags– precision di-jet precision di-jet
mass (PFAs) to mass (PFAs) to separate Ws and separate Ws and ZsZs
• SUSY Searches SUSY Searches – hermiticityhermiticity
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
• VTX TrackerVTX Tracker at minimum at minimum possible radius with max possible radius with max solid angle:solid angle:
rr~~rzrz= 5 = 5 10/p(sin 10/p(sin3/23/2) ) mm
• Silicon strip trackerSilicon strip tracker for for excellent momentum excellent momentum resolution and robust resolution and robust performance performance pptt/p/ptt
22 ≤≤ 5 x 10 5 x 10-5-5 GeVGeV-1-1
• Dense, highly Dense, highly segmented, segmented, Si-W Ecal and Si-W Ecal and Hcal with a goal ofHcal with a goal of
mjjmjj=3-4%=3-4%
• Instrumented flux returnInstrumented flux return for muon identificationfor muon identification
The SiD ResponseThe SiD Response
Effort required to meet these ambitious goals …
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
SiD Details & SiD Details & DimensionsDimensions
Vertex detector: Vertex detector: 5 barrels, 4 disks; R5 barrels, 4 disks; Rinin= 1.4 cm= 1.4 cm
Si tracking: 5 layers; RSi tracking: 5 layers; Rinin= 18 cm= 18 cm
HCAL Fe: 34 layers; RHCAL Fe: 34 layers; Rinin= 138 cm= 138 cm
Solenoid: 5 T; RSolenoid: 5 T; Rinin= 250 cm= 250 cm
EMCAL Si/W: 30 layers REMCAL Si/W: 30 layers Rinin= 125 cm= 125 cm
Flux return/muonFlux return/muonRRinin= 333 cm= 333 cmRRoutout= 645 cm= 645 cm
SiSi
PFAPFA
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
Integrated Tracking: Pixel Integrated Tracking: Pixel Vertex Detector & the TrackerVertex Detector & the Tracker
• VXD: standalone trackerVXD: standalone tracker– Space-point resolution < Space-point resolution <
44mm– Superb impact parameter Superb impact parameter
resolutionresolution• Five barrel layersFive barrel layers• Four forward layersFour forward layers• Transparency (~0.1% XTransparency (~0.1% X00 per per
layer)layer)• 14 mm from beam pipe14 mm from beam pipe
• Tracker: RTracker: Rii=0.22 m, R=0.22 m, Roo=1.23 =1.23 m, L= 3.3 mm, L= 3.3 m
• Five cylinders Five cylinders – tiled with 10x10cmtiled with 10x10cm22 single single
sided microstrip sensorssided microstrip sensors
– Material budget 0.8% XMaterial budget 0.8% X00/layer/layer
• Five (x2) endcap disksFive (x2) endcap disks– tiled with R, tiled with R, microstrip microstrip
sensorssensors
– Material budget 1.3% XMaterial budget 1.3% X00/layer/layer
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
Tracking Tracking PerformancePerformance
• Full simulationFull simulation• Vertex detector seeded Vertex detector seeded
pattern recognition (3 hit pattern recognition (3 hit combinations)combinations)
• Event SampleEvent Sample– ttbar-eventsttbar-events– √√s = 500 GeVs = 500 GeV– background includedbackground included
Black: VXD basedRed: VXD + tracker
)(
1
2
GeV
pp T
T
)(GeVpT
EfficiencyEfficiency
Central Central ResolutionResolution
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
EM CalorimeterEM Calorimeter• StatisticsStatistics
– 20/10 layers, 2.5/5 mm W 20/10 layers, 2.5/5 mm W – ~ 1mm Si detector gaps~ 1mm Si detector gaps– Tile with hexagonal 6” Tile with hexagonal 6”
waferswafers– 5x5 mm5x5 mm22 pads pads– ~ 1300 m~ 1300 m22 of Si of Si
• Readout with KPIX chipReadout with KPIX chip– 1024 channels, bump-bonded 1024 channels, bump-bonded – 4-deep buffer (low 4-deep buffer (low
occupancy) occupancy) – Bunch crossing time stamp Bunch crossing time stamp
for each hit for each hit
CAD overview
R 1.27 m
-> +o
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
HCAL ConsiderationsHCAL Considerations
• BaselineBaseline– Gap size <~10mmGap size <~10mm– Barrel: 34 20-mm SS Barrel: 34 20-mm SS
absorbers absorbers 4 4oo
– Two endcapsTwo endcaps– Resistive Plate ChambersResistive Plate Chambers– Considering alternate Considering alternate
technologiestechnologies
Resistive paint
Resistive paint
Mylar
1.2mm gas gap
Mylar
Aluminum foil
1.1mm glass
1.1mm glass
-HV
Signal pads-2100V
∆V ~400V
∆V ~400V
0V
GEMs & MicromegasScintillator/Solid StateScintillator/Solid State
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
SolenoidSolenoid
• Statistics: Statistics: – IR 2.5 m, OR 3.3 mIR 2.5 m, OR 3.3 m– Length=5.4mLength=5.4m– Stored Energy: Stored Energy:
1.2GJ1.2GJ• CMS-based feasibility CMS-based feasibility
study:study:– Same conductor Same conductor – CMS (4 layer)CMS (4 layer) SiD SiD
(6 layer)(6 layer)– CMS 5 modules 2.5 CMS 5 modules 2.5
m long m long SiD 2 SiD 2 modules 2.6 m longmodules 2.6 m long
HEP Detector Superconducting Solenoids
0
2
4
6
8
10
12
14
1 10 100 1000 10000Stored Energy [MJ]
Sto
red
En
erg
y/C
old
Ma
ss
[M
J/M
T]
Operating Forseen
CMS
TeslaSiD
GEM
SDC
Aleph
SDC Proto
H1
Delphi
D0
ISR Zeus
Venus
Topaz
AMY
Babar
Atlas
Cleo II
CDF
CMS 3.5
Uniformity good,Uniformity good,stresses acceptablestresses acceptable
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
Muon Muon SystemSystem • Muon System Baseline Muon System Baseline
Configuration Configuration – Octagon: 48 layers, 5 cm Octagon: 48 layers, 5 cm
thick steel absorber platesthick steel absorber plates– Six-Eight planes of x, y or u, Six-Eight planes of x, y or u,
v upstream of Fe flux return v upstream of Fe flux return for xyz and direction of for xyz and direction of charged particles that enter charged particles that enter muon system.muon system.
• Muon ID studies Muon ID studies – 12 RPC- instrumented gaps12 RPC- instrumented gaps– ~1cm spatial resolution~1cm spatial resolution
• IssuesIssues– Technology: RPC, Technology: RPC,
Scin/SiPMs, GEMS, Wire Scin/SiPMs, GEMS, Wire chamberschambers
– Is the muon system needed Is the muon system needed as a tail catcher?as a tail catcher?
– How many layers are How many layers are needed (0-23)? Use HCAL ?needed (0-23)? Use HCAL ?
– Position resolution needed?Position resolution needed?
Muon
Coil
Hcal
trackers
Ecal
Eff. & Purity vs. Interaction Lengths
0
0.2
0.4
0.6
0.8
1
0 2 4 6 8Interaction Lengths
Eff
icie
nc
y/P
uri
ty
Eff
Purity
End of HCal
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
Rewind: Technical StrengthsRewind: Technical Strengths• Generally: compact, highly integrated, hermetic detectorGenerally: compact, highly integrated, hermetic detector• Tracking: Tracking:
– VTD: small radius ( 5T helps)VTD: small radius ( 5T helps)– Tracker: excellent dp/p; minimized material all cos(Tracker: excellent dp/p; minimized material all cos())– Demonstrated pattern recognitionDemonstrated pattern recognition– Solenoid: 5T (difficult but not unprecedented)Solenoid: 5T (difficult but not unprecedented)
• Calorimetry: imaging, hermeticCalorimetry: imaging, hermetic
– ECAL: excellent segmentation=4x4 mmECAL: excellent segmentation=4x4 mm22, R, RMoliereMoliere=13mm=13mm
– HCAL: excellent segmentation: ~1x1 to 3x3 cmHCAL: excellent segmentation: ~1x1 to 3x3 cm22
• Excellent Excellent ID: Instrumented flux return & imaging HCAL ID: Instrumented flux return & imaging HCAL
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
OpportunitiesOpportunities• TrackingTracking
– VTD technologyVTD technology– Forward SystemForward System
• Calorimetry Calorimetry – Choice of HCAL technology Choice of HCAL technology
requires study, PFA evaluation. requires study, PFA evaluation. Overall Optimization: Overall Optimization:
• Inner RadiusInner Radius• Depth and Length?Depth and Length?• B field?B field?
– Forward systems challengingForward systems challenging• MuonMuon
– Technology?Technology?– Layers? (Boost HCAL)Layers? (Boost HCAL)
• Simulation & algorithmic toolsSimulation & algorithmic tools– Little mentionLittle mention– BUT there has been tremendous effort and many BUT there has been tremendous effort and many
tools are in place) tools are in place) • Detector studies and MC benchmarking can be pursued!Detector studies and MC benchmarking can be pursued!• Overall integration studies neededOverall integration studies needed
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
Looking Back a Bit &Looking Back a Bit &The Way ForwardThe Way Forward
• Silicon Detector Design StudySilicon Detector Design StudyInitiated Victoria ALCPG Meeting 2004Initiated Victoria ALCPG Meeting 2004
• Organization Fall-Winter ’04-’05Organization Fall-Winter ’04-’05• Progress on Technology, Simulation, Progress on Technology, Simulation,
Benchmarking, Cost ‘06Benchmarking, Cost ‘06• Tools all in place for a workshop on Tools all in place for a workshop on
optimization and choices, new ideas optimization and choices, new ideas welcome – Fall ‘07.welcome – Fall ‘07.
• Final choices – Spring ’08Final choices – Spring ’08• Letter of Intent – Summer ’08Letter of Intent – Summer ’08
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
Closing CommentsClosing Comments
• A silicon-centric design offeringA silicon-centric design offering– unprecedented tracking precisionunprecedented tracking precision– new potential in calorimetrynew potential in calorimetry– good muon identificationgood muon identification
• Complementary to other conceptsComplementary to other concepts• Many opportunities for new effort and expertise. Many opportunities for new effort and expertise. • Tools and organization in place to support Tools and organization in place to support
efficient development and to get started.efficient development and to get started.• Great opportunity to explore ILC detector/physics. Great opportunity to explore ILC detector/physics. • Open to new ideas, collaborators, increased Open to new ideas, collaborators, increased
internationalization internationalization
• Rich Partridge will discuss interplay between Rich Partridge will discuss interplay between physics/detector projects and avenues for physics/detector projects and avenues for involvement on SiD.involvement on SiD.
Jerry Blazey May 31, 2007 LCWS07
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http://www-sid.slac.stanford.edu/
OrganizatioOrganizationn
SiD DESIGN STUDY COORDINATORSJ.Jaros, H.Weerts,H.Aihara & J.Karyotakis
SILICON TRACKERM.DemarteauR.Partridge
Mech: W. Cooper
EXECUTIVE COMMITTEEH.Aihara, J.Brau, M.Breidenbach, M.Demarteau,
J.Jaros, J.Karyotakis, H.Weerts & A.White
SOLENOIDFLUX RET
K.Krempetz
VERY FORWARDW.Morse
SIMULATIONN.Graf
MDIP.Burrows
T.MarkiewiczT.Tauchi
VERTEXINGSu Dong
Ron LiptonMech: W. Cooper
CALORIMETERSA.White
ECAL:R.Frey/D.StromHCAL:G.Blazey/H.Weerts
PFA:N.Graf/S.Magill
MUONH.BandH.E.Fisk
BENCHMARKINGT.Barklow
A.Juste
COSTM.Breidenbach
R& D COORDINATORA. White
ADVISORY COMMITTEEAll group leaders