HP ProLiant SL6000 G6

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© 2009 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. HP ProLiant SL6000 G6 Technology for better business outcome Doug Tucker June 2009

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HP ProLiant SL6000 G6. Doug Tucker June 2009. Technology for better business outcomes. HP ProLiant SL6000 Scalable System Product Overview. - PowerPoint PPT Presentation

Transcript of HP ProLiant SL6000 G6

Page 1: HP ProLiant SL6000 G6

© 2009 Hewlett-Packard Development Company, L.P.The information contained herein is subject to change without notice.

HP ProLiant SL6000 G6

Technology for better business outcomes

Doug TuckerJune 2009

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HP ProLiant SL6000 Scalable SystemProduct Overview

The HP ProLiant SL6000 Scalable System uses a highly efficient and modular power & cooling infrastructure that enables a suite of pluggable server modules optimized

around a standard 19” rack

Key Benefits

More affordable compute power

Double the compute density over traditional rack servers

Greater levels of efficiency with shared power and thermals

Highly configurable for different application requirements

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SL Product Line Naming

System HP ProLiant SL6000 Scalable System

Chassis HP ProLiant z6000 G6 Chassis

ServersHP ProLiant SL160z G6 Server

HP ProLiant SL170z G6 Server

HP ProLiant SL2x170z G6 Server

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Modular – Designed for Max Efficiency Multi-node, Shared Power & Cooling ArchitectureHigher• ROI• Power efficiency• DensityLower• TCO• Acquisition cost• Pwr/cooling cost

Multi-node, Shared Power & Cooling ArchitectureHigher• ROI• Power efficiency• DensityLower• TCO• Acquisition cost• Pwr/cooling cost

• Energy efficient fans (2U), optional N+1

• Energy efficient fans (2U), optional N+1

• Variety of optimized Node Modules

• Variety of optimized Node Modules

• Reduced weight (shipping cost)

• Reduced weight (shipping cost)

• Unrestricted airflow (no mid-plane or I/O connectors)

• Unrestricted airflow (no mid-plane or I/O connectors)

• Shared Power & Fans

• Shared Power & Fans

• Optional Hot-Plug Redundant PSU

• Optional Hot-Plug Redundant PSU

1 or 2 HP Standard PSUs

1 or 2 HP Standard PSUs

• 3 PSU options

• 3 PSU options

• Standard 19” racks, with front I/O cabling• Standard 19” racks, with front I/O cabling

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HP ProLiant SL6000 Components

10U bulk rail optimized for HP

Racks

Pluggable Server Tray (up to 2 x 2S Servers)

2U Chassis

DL100 series Rail for HP & 3rd Party Racks

HP or 3rd Party Rack

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HP ProLiant z6000 ChassisFeatures:

• Support for (2) 2P (socket) server trays

• Shared Fans, High Efficiency, N+1 Redundancy

• 2U Shared Power−Support for 460W, 750W, or 1200W

AC configurations

−Full Hot Plug RPS, or ebrake RPS support

• Multi-node Efficiency−Shared fan control

−Power capping & measurement

−Optional interface to Rack Control Module

• HP 10k G2 rack optimization−Bulk 10U rail system for lowest cost

• 3rd Party rack support−Supports common DL100 rail

• Front I/O Cabling−Easy serviceability

High efficiency (92%) common slot power

supplies

High efficiency N+1 Redundant Fans

Server Trays

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HP ProLiant SL160z HP ProLiant SL170z HP ProLiant SL2x170z

Maximum expansion with 18 DIMM slots and up to 2 PCIe slots

Maximum storage capacity with up to 6 LFF SATA or SAS hard drives

Maximum compute density with two servers per tray (1U)

Ideal Application Ideal Application Ideal Application

HPC database tierWeb memory-cache

Web SearchWeb database

HPC compute intensiveWeb front end

Target Markets− Scale-out: Web Farms, ISPs, ASPs, Etc…− Web 2.0: Social networking, Shared Content, Blogs, Etc …− HPC: Oil & Gas, Financial, Entertainment, Scientific, Government,

Etc...

HP ProLiant SL6000 Ideal Environment

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HP ProLiant SL160z

HP ProLiant SL160z

ProcessorChipset

• 2P Intel 5500 series• Intel® 5520 Chipset

Memory • 18 DDR3 DIMM Sockets

Storage• HP Embedded SATA controller w/sw

RAID• Up to 2 NHP LFF HDDs

Networking • Embedded Dual Port 1GbE NICs

I/O Expansion

• 1 x16 FH PCIe Gen 2 slot

Management• Standards based DCMI & IPMI • Basic Functionality, node-level power on/off

Additional Features

• High efficiency(>90%) @ 50%+ load• Hot Plug, N+1 PSU (optional)

Density• 2 server nodes in 2U • 1 EATX nodes in 1U tray

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HP ProLiant SL160z – Front View in z6000 Chassis

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VideoPort

(2) USBPorts

SerialPort

UIDPowerButton

Low Profile

PCI Slot

(2) 1Gbit NIC

Health LED

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HP ProLiant SL160z – Inside View

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Low Profile x16PCIe

Slot

18 DIMM Slots

Up to 2 Intel 5500 series processors

OptionalX4

internal PCIe slot

2 LFF SATA or SAS Hard Drives using quick release drive carrier

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HP ProLiant SL170z

HP ProLiant SL170z

ProcessorChipset

• 2P Intel 5500 series• Intel® 5520 Chipset

Memory • 16 DDR3 DIMM Sockets

Storage• HP Embedded SATA controller w/sw RAID• Up to 6 NHP LFF HDDs

Networking • Embedded Dual Port 1GbE NICs

I/O Expansion • 1 x16 LP PCIe Gen 2 slot

Management• Standards based DCMI & IPMI• Basic Functionality, node-level power on/off

Additional Features

• High efficiency(>90%) @ 50%+ load• Hot Plug, N+1 PSU (optional)

Density• 2 server nodes in 2U chassis• 1 ea, EATX PCAs in 1U module

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HP ProLiant SL170z - Front View in z6000 Chassis

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VideoPort

(2) USBPorts

SerialPort

UID

Low Profile

PCI Slot

(2) 1Gbit NIC

Health LED

OptionalLO100

dedicated Management

Port

PowerButton

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HP ProLiant SL170z – Inside view

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Low Profile x16PCIe

Slot16 DIMM Slots

Up to 2 Intel 5500

series processors

6 LFF SATA or SAS Hard Drives using Quick Release

drive carrier

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HP ProLiant SL2x170z

HP ProLiant SL2x170z (per each SL170 system board)

ProcessorChipset

• 2P Intel 5500 series• Intel® 5520 Chipset

Memory • 16 DDR3 DIMM Sockets

Storage• HP Embedded SATA controller w/sw RAID• 1 NHP LFF HDDs (2 in tray, 1 per node)

Networking • Embedded Dual Port 1GbE NICs

I/O Expansion •1 x16 LP PCIe Gen 2 slot

Management• Standards based DCMI & IPMI• Basic Functionality, node-level power on/off

Additional Features

• High efficiency(>90%) @ 50%+ load• Hot Plug, N+1 PSU (optional)

Density• 4 server nodes in 2U• 2 half-EATX nodes in 1U tray

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HP ProLiant SL2x170z - Front View in z6000 Chassis

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VideoPort

(2) USBPorts

SerialPort

UID

Low Profile

PCI Slot(2)

1Gbit NIC

Health LED

OptionalLO100

dedicated Management

Port

PowerButton

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HP ProLiant SL2x170z – Inside view

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Low Profile x16PCIe

Slot

16 DIMM Slots per system

board

Up to 2 Intel 5500 series processorsper SL170z

system board

2 LFF (1 per server) SATA or SAS Hard Drives using Quick Release

drive carrier

Low Profile x16PCIe

Slot

(2) SL170z system boards

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Power Strategy

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Power Redundancy• Supports Common Slot power supply

− Common slot – 1200W, 750W, 460W options− Allows you to choose right sized power supply for your configuration and run

higher up the efficiency curve.

• Three implementations available for shared power supplies:− No Redundancy

• Run entire z6000 chassis with 1 power supply• Combination of both trays need to fit in the power envelop of the power supply

− Full AC/DC redundancy • Using 2 power supplies to run z6000 chassis• If one power supply fails and the servers fit in the remaining power supply’s power envelop, servers

will continue to run with no interruption

− AC redundancy w/ throttling• Using 2 Power supplies to run z6000 chassis• If one power supply fails and the total power used by the server trays is greater than the remaining

power supply, the servers will throttle down to fit in the remaining power supply’s power envelop

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Full Rack Pictures

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Front View

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Technology for better business outcomes

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HP Datacenter Environmental Edge

Brandon FearsJune 2009

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On The Road to Energy Efficiency…• Why the concern about energy?• How Energy Efficiency can affect your

business?• Today’s Power and Cooling Challenges

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How energy efficiency can affectyour businessBusiness impact related to power and cooling issues

Server or system

downtime

Increased operational

costs

Datacenter outage

Inability to add capacity

Increased operational

costs

Fail to support business growth

Loss of revenue Increased operational

costs

Lowered customer

satisfaction

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•Portfolio

•HP Insight Environmental Observer visualization

•HP Datacenter Environmental Edge Benefits

•Standard recommended configuration

•HP Datacenter Environmental Edge FAQ

HP Datacenter Environmental Edge Solution Portfolio

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HP Environmental Edge HP Insight Environmental Observer

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Monitoring Points

Racks:Temp

Humidity

Subfloor:Pressure Differential

CRAH:Temp

HumidityPowerChilled Water:

FlowTemp

PDU:KWH Usage

Visualization

Real-time Insight from rack level data center environmental sensors

Energy Avg. data center savings 12% to 18%

Cooling

Up to 30% increase in cooling capacity,

delays additional cooling infrastructure

purchases / build new datacenter

Increase subfloor differential pressure

up to 40%

Installation Simplicity

No data center pre-requisites, non-

invasive installation

HP Technical Services

Installed in 1 day per 500 m2 /5000 ft.2

Notification Real-time notification / Alarming

Cost Typical break even 9 to 14 months

Insight Environmental Observer

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HP Insight Environmental Observer S/W Datacenter Visualization

HP Confidential

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HP Environmental Edge Benefits: Air / Cooling Management Based on Solid Data not Intuition

28 * See “Edge ROI” slide for more details.

Remediation NotificationChange Management

•Fix inefficiencies: air flow / mgmt, CRAH over provisioning, humidity control optimization, rack overcooling, floor tile placement•Reduce power consumption up to18%*•Track environmental trends up to 180 days

•Reduce downtime•Visualize how datacenter changes impact air flow, temperature, etc.•Optimize rack air mixing / bypass•Benchmark key datacenter infrastructure metrics

•Every 60 seconds on critical changes based on user defined parameters•Alerts via text, email, SNMP•Communicate alerts to other systems via SNMP

Reduce Fan Energy / Improve AC Efficiency / Increase Cooling Capacity

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HP Datacenter Environmental Edge Continuous Improvement Process

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3. Analyze Detailed data:•Rack and CRAC/CRAH view•Air pressure, humidity, temp, power•Historical trending/graphing

1. Visualize Temp & Humidity

2. Visualize Air Pressure

4. Implement Changes

5. Visualize Change Results

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HP CONFIDENTIAL - DO NOT DISTRIBUTE30 April 22, 2023

Edge ROI: Energy Savings and Increased Cooling Capacity

Company Utility Fortune 100 technology Financial services

PUE Initial 1.7, projected 1.5 Initial 1.9, projected 1.7 Initial 1.7, projected 1.5

Energy savings 13% 18% 12%

Carbon savings 59 metric tons 2032 metric tons 513 metric tons

Datacenter Size

2,900 ft2 / 290 m2 25,900 ft2 / 260 m2 13,000 ft2 / 130 m2

Capacity increase

22% 33% 8%

Objectives Visibility and alarms

ID risks

Optimize DC ops

Energy Capacity

24 x 7 visibility, alerts, and so on

ID risks

Baseline & optional DC ops

Energy Capacity

24 x 7 visibility, alerts, and so on

ID risksBaseline & optional

DC ops

Energy Capacity

Findings Identified:

•Poor tile placement

•Benefits of blanks

•Remediation will result in the ability to turn off 2 CRACs

Identified:

•Low sub-floor pressure

•Bad tile placement

Remediation:

•Resulted in 2–3 times pressure increase

•Allowed for 13 of 28 CRACs to be turned off

•Goal: Reduce bypass and recirculated air

•104 racks over-cooled 76% of the time

•Improved airflow management and enabled manual VFD control

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HP Datacenter Environmental Edge Components• Core solution

− Wireless rack temperature and humidity sensors

− Air pressure sensors every 500 ft2/50 m2

− Insight Environmental Observer S/W

− Hardware and Software installation

• Additional sensors and services− KWH Meters− Chilled water flow− Rack door position− Water leak detection

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Why HP Datacenter Environmental Edge?

• Fast and simple to deploy− Approx. 20 hours per 5K ft.2

− Wireless battery powered base stations• Wireless network security features

− Wireless gateway isolated from LAN via serial interface − 128 bit AES encryption

• Can be deployed in any data center− Rack and CRAH vendor agnostic

• Cost-effective solution• Enable rapid decision-making based on 2-D visualization• Easy reconfiguration as data center layout or infrastructure

changes− Customer self-repair and maintenance − 24X7X365 WW HP Support− Global availability− Available direct from HP or from channel partner

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Contacts

USUS

EMEAEMEA [email protected]@hp.com

APJAPJ

[email protected]@hp.com

[email protected]@hp.com

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Thank you!