HiSOLProbe System Productshisol.jp/en/wp-content/uploads/2014/09/prober-english.pdf* Items with...
Transcript of HiSOLProbe System Productshisol.jp/en/wp-content/uploads/2014/09/prober-english.pdf* Items with...
HiSOL Probe System Products
●Wafer size 2” to 12”
●Manual and Semi‐automatic
●Ultra low current measurement in fA level
● Low capacitance measurement in fF level
●High frequencymeasurement up to 67GHz
● Thermal test from ‐65゜C to +400゜C (Atmospheric)
● Thermal test from 4k to +500゜C (Vacuum)
● 1/f noise, RTN measurement
● Pulse I‐V test, Ultra high speed I‐V test
●High current measurement (~200A pulse)
●High voltage measurement (~10kV)
● Electro static discharge (ESD) evaluation
● Failure analysis
●Magnetic stimulationmeasurement
●Optoelectronics (VCSEL,PD etc.) measurement
●Wafer level reliability test (EM/TDDB/HCI/NBTI/BT)
From From Ultra LowUltra Low Signal to High PowerSignal to High Power testtest,,From DCFrom DC,,II‐‐VV,,CC‐‐V V mmeasurementeasurement
to RF to RF mmeasurementeasurement
Our Probing Solutions
We offer you analysis probe systems for semiconductor and FPD (Flat‐panel display ).We can provide various probe systems from affordable compact manual probers for R&D to high‐end 300mm semi‐automatic probe system for ‐65゜C to +300゜C thermal test. We can customize the most suitable probing solution that matches to your measurement application.
Our probe systems correspond to wide variety of application from ultra low signal test to high power device test, from DC parametric measurement to RF measurement, wafer level reliability test, magnetic field impression measurement, and optical device measurement.We support your development of R&D and technical improvement.
HiSOL,Inc. is a certified solution partner company of KEYSIGHT Technologies
Manual P
roberSem
i‐Autom
atic Prober
Probe System
for FPD
Vacuum
probe systemSpecialty
Probe system
Accessories
Applications
2
3
4inch 6inch
Model HMP-400 / HMP-600
・ Model HMP-400 is for 4" wafers. ・ Model HMP-600 is for 6" wafers.
Bestselling Compact Manual Prober
This is a compact manual prober for R&D that supports wafer measurements ranging from small chip up to 4” or 6” wafers.Prober is capable of measuring ultra low currents on the fA level or low capacitance on the pF level by selecting appropriate options.High temperature tests can be also made by incorporating a hot chuck that supports a temperature range from room temperature to +300°C.
‐Ultra low signal I‐V measurements (fA level)
‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV)
‐ 4‐terminal resistance measurements
‐ Temperature characteristics tests in range from room temperature to+200°C or +300°C‐Mounts in glove box‐ Probe card support‐ RF measurements (up to 67 GHz)‐Ultra high‐speed I‐V measurements‐ High‐power device measurements(100A pulse, ±3kV triaxial, ±10kV coaxial)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)
Extended applications
Applications
■ MANUAL PROBER
Wafer Size
X‐Y coarse travel
X‐Y fine travel
θ travel
Platen Z axis action
Unit dimension(W×D×H)*
Weight*
Platen Z axis adjustment
HMP‐400 HMP‐600
up toφ100 mm up toφ150 mm
X:105mm,Y:150mm X:155mm,Y:200mm
350×390×450mm 390×450×450mm
28kg 36kg
XY:13mm / Micro meter head
coarse ±30°, fine ±2.5°
0 ‐ 20mm free
0~15mm
* Items with asterisk vary depending on system configuration.
Manual P
rober
4
8inch 12inch
Model HMP-800 / HMP-1200
This is a standard manual prober that supports 8” or 12” wafers.
・ Model HMP-800 is for 8" wafers.・ Model HMP-1200 is for 12" wafers.
This prober supports reliable on‐wafer measurements with a simple yet high‐accuracy mechanism that is easy to operate.This standard manual prober model is scalable to support a wide range of applications such as hot chuck systems(from room temperature to +200°C or +300°C), submicron resolution stages, and laser cutters.
Applications
‐ Temperature characteristics tests in range from +20°C to +300°C
‐Ultra low signal I‐V measurements (fA level)
‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV, and RF‐CV)
‐ RF measurements (up to 67 GHz)
‐Ultra high‐speed I‐V measurements
Extended applications
‐ Probe card support (can support Multisite WLR)‐ Built‐in laser cutter (Point marking, Exfoliation of protection layer,Metal layer cutting)‐ Probing with submicron accuracy achieved by a built‐in metallograph, active vibration isolator, and ultra high‐accuracy stage‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)
■ MANUAL PROBER
Wafer Size
X‐Y coarse travel
X‐Y fine travel
θ travel
Platen Z axis action
Unit dimension(W×D×H)*
Weight*
Platen Z axis adjustment
HMP‐800 HMP‐1200
~φ200 mm ~φ300 mm
X:205mm,Y:300mm X:305mm,Y:400mm
550×650×450mm 690×780×450mm
60kg 80kg
XY:13mm/Micro meter head
coarse ±30°, fine ±2.5°
0 / 0.3 / 10mm
0~13mm
* Items with asterisk vary depending on system configuration.
Manual P
rober
8inch 12inch■ MANUAL PROBER
Model HMP-810SC / HMP-1210SC
・ Model HMP-800SC is for 8" wafers. ・ Model HMP-1200SC is for 12" wafers.
Manual Prober for High / Low Temperature Tests
This is a manual probe system for next‐generation semiconductor devices designed for low noise and low leakage.In this system, a shielded chamber structure contains the probe and chuck in a totally EMI shielded environment. The system supports measurements such as ultra low signal measurement in the threshold regions, 1/f noise measurement, S parameter acquisition, and high‐speed I‐V measurement in a temperature control range from ‐60°C to +300°C(or +400°C when using the special option).This probe system can optionally support high‐current and high‐voltage power device applications.* The HMP‐610SC for 6” wafers is also available.
Applications
‐ Temperature characteristics tests in range from +25°C to +300°C or from ‐60°C to +300°C‐Ultra low signal I‐V measurements (fA level)‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV, and RF‐CV) [sub pF level]‐ 1/f noise evaluation‐ RTN (random telegraph noise) evaluation‐High‐frequency noise evaluation (up to 800 MHz)‐ RF measurements (up to 67 GHz) / S parameter acquisition‐Ultra high‐speed I‐V measurements
Extended applications
‐ Probe card support (can support Multisite WLR)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)* 8” model‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)
Wafer Size
X‐Y coarse travel
X‐Y fine travel
θ travel
Platen Z axis action
Unit dimension(W×D×H)*
Weight*
Platen Z axis adjustment
HMP‐810SC HMP‐1210SC
~φ200 mm ~φ300 mm
X:205mm,Y:205mm X:310mm,Y:310mm
1020×1000×1550mm 1150×1100×1550mm
750kg 1000kg
±7.5°
0 / 0.3mm
0~13mm
X:205mm,Y:205mm X:310mm,Y:310mm
* Items with asterisk vary depending on system configuration.
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Manual P
rober
4inch 6inch■ SEMI-AUTOMATIC PROBER
・ Model HSP-100 is for 4" wafers. ・ Model HSP-150 is for 6" wafers.
Semi‐Automatic Probe System for Small‐Diameter Wafers
This is a semi‐automatic probe system that supports 4” or 6” small diameter wafers.Equipped with a high‐accuracy X‐Y‐Z‐θ quadraxial closed loop stage having excellent positioning accuracy and repeatability, this probe system ensures reliable probe contact.This probe system can incorporate a hot chuck that supports a temperature range from +20°C to +300°C.This probe system can optionally support high‐current and high‐voltage power device applications.
Applications
Extended applications
‐ Temperature characteristics tests in range from +20°C to +300°C
‐Ultra low signal I‐V measurements (fA level)
‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV, and RF‐CV)
‐ RF measurements (up to 67 GHz)
‐Ultra high‐speed I‐V measurements
‐ Probe card support (can support Multisite WLR)‐ Built‐in laser cutter (Point marking, Exfoliation of protection layer, Metal layer cutting)‐ Active vibration isolator and ultra high‐accuracy probing through image processing pattern recognition (accuracy: ± 1 um or finer)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)
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Wafer Size
X‐Y travel
X‐Y repeatability
X‐Y accuracy
Z travel
Unit dimension(W×D×H)*
Weight*
Z repeatability
HSP‐100 HSP‐150
~φ100 mm ~φ150 mm
X:105mm,Y:200mm X:160mm,Y:250mm
1200×900×1550mm 1250×900×1550mm
650kg 700kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
* Items with asterisk vary depending on system configuration.
Model HSP-100 / HSP-150
Semi‐A
utomatic P
rober
■ SEMI-AUTOMATIC PROBER
・ Model HSP-200 is for 8" wafers. ・ Model HSP-300 is for 12" wafers.
8inch 12inch
Standard Semi‐Automatic Prober Model
This is a standard semi‐automatic probe system that supports 8” or 12” wafers.Equipped with a high‐accuracy X‐Y‐Z‐θ quadraxial closed loop stage having excellent positioning accuracy and repeatability, this probe system ensures reliable probe contact.This probe system can incorporate a hot chuck that supports a temperature range from +20°C to +300°C.This probe system can optionally support high‐current and high‐voltage power device applications.
Applications
Extended applications
‐ Temperature characteristics tests in range from +20°C to +300°C
‐Ultra low signal I‐V measurements (fA level)
‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV, and RF‐CV)
‐ RF measurements (up to 67 GHz)
‐Ultra high‐speed I‐V measurements
‐ Probe card support (can support Multisite WLR)‐ Built‐in laser cutter ( Point marking, Exfoliation of protection layer, Metal layer cutting )‐ Active vibration isolator and ultra high‐accuracy probing through image processing pattern recognition (accuracy: ± 1 um or finer)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)
Wafer Size
X‐Y travel
X‐Y repeatability
X‐Y accuracy
Z travel
Unit dimension(W×D×H)*
Weight*
Z repeatability
HSP‐200 HSP‐300
~φ200 mm ~φ300 mm
X:205mm,Y:300mm X:310mm,Y:450mm
1300×1000×1550mm 1400×1050×1600mm
750kg 950kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
* Items with asterisk vary depending on system configuration.
Model HSP-200 / HSP-300
7
Semi‐A
utomatic P
rober
・ Model HSP-200SC is for 8" wafers. ・ Model HSP-300SC is for 12" wafers.
8inch 12inch■ SEMI-AUTOMATIC PROBER
Semi‐Automatic Prober for High / Low Temperature Tests
Applications
‐ Temperature characteristics tests in range from +25°C to +300°C or from ‐60°C to +300°C‐Ultra low signal I‐V measurements (fA level)‐ Various C‐V measurements (quasi‐static C‐V, HF‐CV, and RF‐CV) [sub pF level]‐ 1/f noise evaluation‐ RTN (random telegraph noise) evaluation‐High‐frequency noise evaluation (up to 800 MHz)‐ RF measurements (up to 67 GHz) / S parameter acquisition‐Ultra high‐speed I‐V measurements
This is a semi‐automatic probe system for next‐generation semiconductor devices designed for low noise and low leakage.In this system, a shielded chamber structure contains the probe and chuck in a totally EMI shielded environment. The system supports in‐plane automatic measurements such as ultra low signal I‐V / C‐V measurement in threshold regions, 1/f noise measurement, S parameter acquisition, RTN (random telegraph noise) measurement, and high‐speed I‐V measurement in a temperature control range from ‐65°C to +300°C (or +400°C when using the special option).This probe system can optionally support high‐current and high‐voltage power device applications.* The HSP‐150SC for 6” wafers is also available.
Extended applications
‐ Probe card support (can support Multisite WLR)‐ Active vibration isolator and ultra high‐accuracy probing through image processing pattern recognition (accuracy: ±1 um or finer)‐ Light‐receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)‐ Common gate pad contacts of flat‐panel display devices‐ High‐power device measurements(400A pulse, ±3kV triaxial, ±10kV coaxial) * 8” model‐Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)
Wafer Size
X‐Y travel
X‐Y repeatability
X‐Y accuracy
Z travel
Unit dimension(W×D×H)*
Weight*
Z repeatability
HSP‐200SC HSP‐300SC
~φ200 mm ~φ300 mm
X:205mm,Y:205mm X:310mm,Y:310mm
1350×1000×1450mm 1450×1150×1450mm
1050kg 1250kg
<±3μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
* Items with asterisk vary depending on system configuration.
Model HSP-200SC / HSP-300SC
Semi‐A
utomatic P
rober
8
HiSOL Semi‐Automatic Prober Control Software
Manual operation
BIN mappingWafer Map setting
Seals feature
Supported automatic measurement software
KEYSIGHT technologies‐EasyEXPERT‐Desktop EasyEXPERT‐WaferPro Express
TFF / KEITHLEY instruments ‐4200‐SCS KITE (Keithley Interactive Test Environment)‐ACS
Proplus design solution ‐Noisepro
Other GP‐IB communication‐enabled software
‐User‐friendly multifunctional semi‐automatic probing software.‐ Supports Windows 8 as its operating system. (Windows 7 is also supported.)‐ Also available as a manual prober with a software GUI or joystick controller.‐ Receiving BIN information from a higher‐level measuring instrument, it is possible to display BIN mapping.‐ Supports wafer thermal expansion compensation function for Thermal test.‐ Possible to control the semi‐automatic prober using the GP‐IB command sent from a higher‐level measuring instrument or PC.
‐ Possible to provide software for making a database of and extracting parameters of raw data obtained from eachmeasuring instrument in order to analyze the data. (Optional)‐ The self‐developed software allows users to incorporate customized requirements.
■ SEMI-AUTOMATIC PROBER
Semi‐A
utomatic P
rober
9
■ PROBE SYSTEM FOR FPDFPD
Manual Prober for Flat‐Panel Display
We custom‐make manual probers that support FPDs (flat‐panel display) ranging from small to large glass substrates.A microscope and probing area with a wide range of motion allow stable probing across the panel surface.A heating type (up to +200°C) or thermal type (‐40°C to +200°C) can be selected for the rectangle panel chuck andultra low current measurements on the fA level and C‐V measurements on the sub pF level are supported for all temperature zones.This prober also supports light irradiation on the panel surface by the solar simulator or other device and light irradiation onthe bottom side of panel (backlight) by super‐high luminance white LED.
Light irradiation on the bottom side of panel by ultra high luminosity LED (up to 40, 000 cd/cm2) * Sub‐stage
Light irradiation on the panel surface by the solar simulator or other device
Built‐in laser cutter (laser wavelength: 1064, 532, 355, 266 nm)
Ultra high‐accuracy model for stable probing of submicron patterns
Function examples of systems for small to medium-sized panels
Model HMP-FPD series
Wide range probing area that enables layoutof FPD devices.
Probe System
for FPD
10
FPD■ PROBE SYSTEM FOR FPD
Model HSP-FPD series
Semi‐Automatic Prober for Flat‐Panel Display
Function examples of systems for small to medium-sized panels
Common gate pad probing (on sub‐platen)
‐Wide range microscope X‐Y travel‐Wide range probing area‐ Programmable X‐Y‐Z positioner (manipulator)
We custom‐make Semi‐automatic probers that support FPDs (flat‐panel display) ranging from small to large glass substrates.A microscope and probing area with a wide range of motion allow stable probing across the panel surface.A heating type (up to +200°C) or thermal type (‐40°C to +200°C) can be selected for the rectangle panel chuck andultra low current measurements on the fA level and C‐V measurements on the sub pF level are supported for all temperature zones.
Probe System
for FPD
11
High / Low temperature model (‐60゜C ~ +200゜C)
25mm sq.
Model HMP-V80 series
Compact Vacuum Prober for R&D (at Ultra Low to Ultra High Temperatures)
This is a compact vacuum prober for R&D that supports I‐V / C‐V / RF measurements on 5‐mm to 25‐mm samples.There are a variety of models available such as one that supports temperature tests at ultra low temperatures on the 4k level and one that supports the temperature tests at up to +500°C.
Substrate Size
General
Ultimate vacuum*
Number of measurement channels
Measurement feed‐through connector*
Probe X‐Y‐Z travel
Magnification*
Illuminating apparatus for microscopes*
Probe Adjustment sensitivity
5mm ~ 20 mm square
1 x 10E ‐4 Pa
40x ~ 240x (on monitor)
LED ring lighting
2 ~ 7 ( 6 ‐ probe maximum,1‐ chuck)
Hermetically triaxial (Jack) standard
X 30mm, Y 50mm, Z 15mm
<0.01mm
Microscope movement*
Microscope type
3 joint horizontal swing arm
CCD mono‐scope with LCD monitor
* Items with asterisk vary depending on system configuration.
Movements
Microscope
Room temperature or ultra low temperature modelModel Temperature range Heating method Cooling method
HMP‐V80 Ambient None None
HMP‐V80‐LH 4.2 k to 298 k (+25°C) Heater Liquid helium transfer
HMP‐V80‐LHM 8k level to 473 k (+200°C) Heater Liquid helium transfer
HMP‐V80‐LHH 10k level to 573 k (+300°C) Heater Liquid helium transfer
HMP‐V80‐LN 80 k to 298 k (+25°C) Heater Liquid nitrogen cryostat
HMP‐V80‐LNM 80 k to 473 k (+200°C) Heater Liquid nitrogen cryostat
HMP‐V80‐LNH 80 k to 573 k (+300°C) Heater Liquid nitrogen cryostat
HMP‐V80‐PS 80 k to 298 k (+25°C) Heater Free Piston Stirling cooler
Ultra high temperature modelModel Temperature range Heating method Cooling method
HMP‐V80 R.T. to +300 °C Heater Compressed air
HMP‐V80‐LH R.T. to +400 °C Heater Compressed air
HMP‐V80‐LHM R.T. to +500 °C Heater Compressed air
Common specification
■ VACUUM PROBE SYSTEM
Vacuum
probe system
12
6inch 8inch
Model HSP-V150 / HSP-V200
On‐wafer Characteristics Evaluation of MEMS Devices at High / Low Temperatures in an Ultra High Vacuum Environment
■ VACUUM PROBE SYSTEM
・ Model HSP-V150 is for 6" wafers. ・ Model HSP-V200 is for 8" wafers.
This prober supports on‐wafer measurements at high / low temperatures (‐60°C to +300°C) on MEMS devices that must operate in a vacuum environment such as RF MEMS devices or crystal oscillator MEMS devices.The cost of packaging which is a very expensive process can be reduced by implementing this system.MEMS device characteristics such as the equivalence constant, transmission characteristics simulation, or S parameter can be automatically acquired on the wafer by combining the prober with the impedance analyzer, RF network analyzer or other tester.
Wafer Size
X‐Y travel
X‐Y repeatability
X‐Y accuracy
Z travel
Unit dimension(W×D×H)*
Weight*
Z repeatability*
HSP‐V150 HSP‐V200
~φ150 mm ~φ200 mm
X:160mm,Y:160mm X:310mm,Y:310mm
2500×1800×1900mm 2700×2000×1900mm
1300kg 1600kg
<±2μm
<±5μm
20mm
<±1μm
θ travel
θ repeatability
±7.5°
0.002°
* Items with asterisk vary depending on system configuration.
Ultimate vacuum 1 x 10E ‐3Pa (1 x 10E‐5 Pa optional)
At the stage of research and development of organic semiconductor device such as OFET,OTFT,OEL,and OLED, it is necessary to perform evaluation under high‐purity inert gas to avoid characteristic degradation caused by moisture or oxygen in the atmosphere. Once this system is implemented, organic semiconductor devices can be measured at a high or low temperature (‐60°C to +300°C) in the highly‐pure inert gas (N2 or Ar) environment achieved by vacuuming and gas displacement.This system supports ultra low signal measurements and meets demand for high‐accuracy I‐V / C‐V measurements in various organic semiconductor devices.
MEMS
Organic semiconductor
13
Vacuum
probe system
Magnetic Stimulation Probe System
■ SPECIALTY PROBE SYSTEM
Semi‐automatic Vertical magnetic field prober( ± 1500 Oe , ‐60゜C to +200゜C )
We offer design and manufacturing of probe systems to apply magnetic fields for evaluating all types of spintronics devices (MR sensor, MRAM, Fram, FeRam) and Hall devices.
‐Highly advanced nonmagnetic structure‐ Excellent magnetic field hysteresis characteristics‐ Supports super low residual field electromagnets.‐ Supports in‐plane magnetic fields and vertical magnetic fields.‐ Provision of magnetic field application and measurement application software‐ Provision of traceable magnetic field calibration tool and correction software‐ Temperature characteristic evaluation in range from ‐65°C to +200°C‐ Low resistance measurements, RF measurements (up to 67 GHz)‐ Supports manual prober and Semi‐automatic prober
Elemental technologies
Patent technology of Toei Scientific Industrial Co.,Ltd. is used for our probe system mounted with vertical magnetic field electromagnets ( Japan Patent Application Laid‐Open Disclosure Number 2010‐212453 )
Manual In‐planemagnetic field prober( ‐3000 Oe to +3000 Oe)
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SpecialtyProbe system
Probe systems for Optoelectronics
We offer design and manufacturing of systems that measure optical and electrical characteristics of the various optoelectronics( light‐emitting and light‐receiving ) devices on wafers.
Semi‐Automatic Probe System with Built‐in Microscopic Photometric Tube For VCSEL, PD/ APD evaluation (for diameter of 2 inches)
Manual Optical Fiber Direct Connection Type ProberFor VCSEL evaluation (for diameter of 3 inches)
Applications
‐Optical and electrical characteristics evaluation of VCSEL, LED or other light‐emitting devices on wafer level‐Optical and electrical characteristics evaluation of photodiode, avalanche photodiode or other light‐receiving devices on wafer level
■ SPECIALTY PROBE SYSTEM
‐ I‐L‐V
‐ C‐V
‐ Pulsed I‐V
‐Wavelength
‐NFP
‐ FFP
‐Modulation frequency
‐ RIN
‐Dark current
‐ I‐V
‐ C‐V
‐ Conversion efficiency
‐Wavelength‐conversion efficiency
‐ Cut‐off frequency
‐Modulation frequency
‐ Transient response
VCSEL・LD・LED characteristic PD・APD characteristic
Manual 4 point resistivity prober
This manual measuring system is to measure Si wafers, solar cell, sheet resistance such as LCD, and resistivity by usingfour‐point probe method. We provide manual four‐point prober and Keithley’s source meter model 2401 as a standard measuring system. By using accessory measuring software for Keithley 2401, automatic calculation of sheet resistance and resistivity become possible.
4‐point probe
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SpecialtyProbe system
Various light source Single MonochromatorIntegrating sphere PMT
■ APPLICATIONS
Ultra Low Signal I‐V / C‐V Measurement
High‐frequency / RF measurement
The following plot is a result of measuring the current value while impressing the sweep voltage to the probe and the chuck that are in the open state. The result shows the noise and leak current of the probe is less than ±10fA. With 300 mm‐thermal chuck, it shows the noise and leak current is less than ±20fA in all the temperature ranges :‐60゜C to +300゜C. It proves that our probe system corresponds to ultra low signal measurement application that requires measurement precision of 1pA or less.
The plot on the right is measured data of reverse voltage and capacitance measurement of diode device. By correcting OPEN / SHORT / LOAD, it enables to do stable C‐V measurement of “fF” level.
C300‐60UL High/Low temperature chuck ( ‐60゜C~+300゜C )Voltage sweep range:‐10V ~ +10V
Model A74CJ 1tip‐Kelvin Coaxial ProbeVoltage sweep range: ‐200V ~ +200V
Note) The above measurement value is actual measurement value in our measurement environment and not guaranteed value
<±3fA
Our probe station can cover measuring frequency band of DC to 67GHz due to its high rigidity and stable mechanism.System integration with Vector network analyzer (VNA), RF probe, RF cable, calibration substrate etc., will support high frequency /RF measurement which is high resolution and excels in repeatability. It supports from 2‐port to multi‐port measurement, temperature range from 10 k to + 250 ゜C, and characterization under ultra‐high vacuum (10e‐6Pa) environment.
Ultra low current I‐V measurement
Ultra low capacitance C‐V measurement
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Applications
‐65゜C ~+200゜C :<±10fA+300゜C:<±20fA
■ APPLICATIONS
Wafer‐Level Reliability Test
Noise Characterization
Organic Semiconductor Device EvaluationAt the stage of research and development of organic semiconductor device such as OFET,OTFT,OEL,and OLED, it is necessary to perform evaluation under high‐purity inert gas to avoid characteristic degradation caused by moisture or oxygen in the atmosphere. We offer small‐footprint manual prober and semi‐auto prober that are specially designed for the usage inside of a glove box. They are suitable for operation by gloved hand.
Manual prober for glove box Semi‐automatic prober for glove box
+300゜C High temperature multi‐site probe cardAn oxygen meter inside of a chamber and a mass flow controller (MFC) enable probing with a low residual oxygen concentration of less than 100ppm
We offer probe systems that support wafer‐level reliability test such as EM, TDDB, HCI, NBTI, BT, etc.,.Our probe system support various tasks required in wafer‐level reliability test such as high temperature up to +300゜C, long‐term testing over weeks, stable contact under high temperature environment, mounting multi‐site probe card, anti‐oxidation environment by nitrogen gas purge, etc.,.
Our probe system with shield chamber ( HMP‐810SC/1210SC,HSP‐200SC/300SC ) has option setting of ultra low floor noise (‐UL). By choosing this “–UL” option, it can support on‐wafer noise characterization such as 1/f noise, random telegraph noise, (RTN), and RF noise in the wide temperature range from ‐65゜C to +200゜C.
17
Applications
■ APPLICATIONS
High‐Power Device Measurement
Safety
High Voltage Measurement ( ~ 10kV),High Current Measurement (~ 200A pulse )
In high‐power device evaluation where dangerous high voltage and high current are required, safety measures against human have to be taken in anticipation of various cases. Our probe system for high‐power device measurement is equipped with interlock system that is standard. Each interlock system will prevent from electric shock, a burn, and oxygen shortage
Interlock that interrupts applied high voltage with safety light curtain. Interlock that prevents oxygen shortage with open air oxygen monitor.( Applied to a system with gas purge function. )
High Voltage Probing High Current Probing
We offer probe accessories that support maximum 10kV 200A pulse as well as chucks that support maximum 5kV 40A pulse.It supports device characterization in the temperature range from ‐60゜C to +300゜C in order to support operation test in wide temperaturerange for devices such as in‐vehicle devices.
Chucks for Power Devices
High voltage probe unit( ±3kV,‐60゜C to +300゜C )
Insulation liquid immersion trayto prevent electric discharge
High current probe unit( Maximum 200A pulse,‐60゜C to +300゜C )
+300゜C High Temperature Test, Antioxidant Environment
When evaluating GaN or SiC high power device, high temperature test at +300゜C is required. Our product with shield chamber makes it possible to do non‐oxidation probing with a low residual oxygen concentration of less than 100ppm by purging nitrogen gas into the chamber.
We offer chuck units specially designed for high power devices.
・ Room temperature chuck and high temperature chuck ( RT ~ +200゜C / +300゜C ),high/low temperature chuck ( ‐40゜C / ‐60゜C ~ +200゜C / +300゜C )
・ 5kV 40A pulse・ Thin wafer handling
Feed‐through Connectors and Measurement Cables
We offer measurement cables and feed‐through connectors that connect various high power device testers with our probe system.
・ Kelvin connection・ TAIKO process wafer
Keysight technologiesB1505A HV‐TRIAX
TFF / Keithley Instruments2600‐PCT / 4200‐PCTHV‐TRIAX
SHV connector & cable( ~ 10kV )
IWATSUCS‐3000 / 5000
It supports closed loop control by using oxygen meter inside of a chamber and mass flow controller ( MFC ).
18
Applications
Failure Analysis, Fail Die Marking
Mounting a laser cutter
Fragile In‐Circuit probing
Emission analysis・OBIRCH / TIVA
All of our probe systems can be mounted with laser micro cutter. Our probe system with laser micro cutter support applications such as point marking of FIB or SEM before observation, exfoliation of protection layer, cut metal circuit pattern etc., .Laser wavelength can be chosen from 1064 / 532 / 355 / 266 nm ( Multiple wavelength is possible )
Point marking Exfoliation of protection layer
Pattern cutting TFT panel cut
We offer options and accessories to support probing to fine pattern of submicron order that is required for failure analysis andtesting flat panel display. By combining with metallurgical microscope, positioner with submicron positioning precision, whisker probe for circuit probing, and active vibration isolating table, it can perform stable probing to a submicron hole whose protective film is exfoliated with a laser cutter without a damage to the circuit.
Active vibration isolating UnitActive vibration isolating Controller
metallurgical microscope Submicron precision positioner
Whisker probe (left) for In‐circuit probing*Standard probe on the right
Active vibration isolating table
Fail die marking ( Inker )
We offer probe stations that can be mounted on emission microscope and OBIRCH system.
It can mark defective die with the minimum dot size ranging fromminimum 125μmφ to maximum 2150μmφ.It can be mounted on our semi‐auto probers HSP‐100/150/200/300.
■ APPLICATIONS
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Applications
Inker head Ink Cartridge
ModelHP50/R ( right hand model)HP50/L ( left hand model)
Travel range ( X,Y,Z ) 5 / 5 / 5 mm
Screw resolution ( X,Y,Z ) 0.5mm / rev.
Feature resolution 10μm
Mounting On/Off switching magnet base (standard)
Dimensions W36×D85×H56 mm
Weight approx. 200 grams
Positioners (Manipulators)
HP50 Compact positioner
Compact lead screw feed positioner.The special guide mechanism allows for stable contact on 50μm or larger PAD.
CorrespondenceProbe station
‐HMP‐400/600‐HMP‐800/1200‐HMP‐FPD series
HP65 Compact high‐accuracy positioner
Compact micrometer feed type high‐accuracy positioner.Easily accesses 10μm or larger circuit pattern or PAD without backlash.
Model HP65
Travel range ( X,Y,Z ) 6.5 / 6.5 / 6.5 mm
Screw resolution ( X,Y,Z ) 0.5mm / rev.
Feature resolution 3μm
Mounting On/Off switching magnet base (standard)
Dimensions W38×D93×H68 mm
Weight approx. 320 grams
CorrespondenceProbe station
‐HMP‐400/600‐HMP‐800/1200‐HMP‐FPD series
◆ Physical dimensions ( unit : mm)
◆ Physical dimensions ( unit : mm)
Accessories
■ ACCESSORIES
20
Accessories
■ ACCESSORIES
Accessories
Positioners (Manipulators)
HP80 Compact positioner
General‐purpose positioner designed for low cost. ( HP80/L・R‐M )Stable contact on 70μm or larger PAD with minimal backlash.
ModelHP80/R ( right hand model)HP80/L ( left hand model)
Travel range ( X,Y,Z ) 12 / 8 / 12 mm
Screw resolution ( X,Y,Z ) 0.635mm / rev.
Feature resolution 15μm
Mounting[ ‐M ] Rubber magnet base[ ‐E ] On/Off switching magnet base
Dimensions[ ‐M ] W46×D74×H55 mm[ ‐E ] W41×D83×H69 mm
Weight[ ‐M ] approx. 160 grams [ ‐E ] approx. 240 grams
CorrespondenceProbe station
‐HMP‐400/600‐HMP‐800/1200‐HMP‐FPD series
HP80/L‐MRubber magnet base model
HP80/R‐EOn/Off switching magnet base model
HP80/L・R‐M Rubber magnet base model
HP80/L・R‐E On/Off switching magnet base model
◆ Physical dimensions ( unit : mm)
21
Accessories
Accessories
Positioners (Manipulators)
■ ACCESSORIES
HP120 High‐accuracy positioner
Model HP120
Travel range ( X,Y,Z ) 12 / 12 / 12 mm
Screw resolution ( X,Y,Z ) 0.254mm / rev.
Feature resolution 2μm
Mounting On/Off switching magnet base (standard)
Dimensions W52×D107×H91 mm
Weight approx. 690 grams
CorrespondenceProbe station
‐HMP‐400/600‐HMP‐800/1200‐HMP‐FPD series‐HSP‐100/150‐HSP‐200/300‐HSP‐FPD series
Precision lead screw feed high‐accuracy positioner.Stable contact on 10μm or larger circuit pattern or PAD without backlash.
◆ Physical dimensions ( unit : mm)
HP130A High‐accuracy positioner
Fine‐pitch micrometer feed high‐accuracy positioner.Stable contact on internal devices of several micrometers and small PAD.
ModelHP130A / R ( right hand model)HP130A / L ( left hand model)
Travel range ( X,Y,Z ) 13 / 13 / 13 mm
Screw resolution ( X,Y,Z ) 0.25mm / rev.
Feature resolution 1μm
CorrespondenceProbe station
‐HMP‐800/1200‐HMP‐FPD series‐HSP‐100/150‐HSP‐200/300‐HSP‐FPD series
Mounting[ ‐M ] On/Off switching magnet base[ ‐V ] Vacuum base
Dimensions[ ‐M ] W71×D159×H124 mm[ ‐V ] W66×D159×H124 mm
Weight[ ‐M ] approx. 1230 grams [ ‐V ] approx. 1190 grams
◆ Physical dimensions ( unit : mm)
22
Accessories
Accessories
Positioners (Manipulators)
■ ACCESSORIES
HP130S Sub‐micron accuracy positioner
ModelHP130S / R ( right hand model)HP130S / L ( left hand model)
Travel range ( X,Y,Z )13 / 13 / 13 mm ( Standard )6.5 / 6.5 / 6.5 mm ( HR option )
Screw resolution ( X,Y,Z ) 0.25mm / rev. ( Standard )0.1 mm / rev. ( HR option )
Feature resolution <0.5μm
CorrespondenceProbe station
‐HMP‐800/1200‐HMP‐FPD series‐HSP‐100/150‐HSP‐200/300‐HSP‐FPD series
Mounting[ ‐M ] On/Off switching magnet base[ ‐V ] Vacuum base
Dimensions[ ‐M ] W71×D159×H124 mm[ ‐V ] W66×D159×H124 mm
Weight[ ‐M ] approx. 3200 grams [ ‐V ] approx. 3160 grams
Steel ultra high‐accuracy positioner.Contact on submicron internal devices is possible with excellent rigidity and feed accuracy.
HP130S/L・R‐M On/Off switching magnet base model
HP130S/L・R‐V Vacuum base model
◆ Physical dimensions ( unit : mm)
HP130S/R‐MOn/Off switching magnet base model
HP130S/L‐VVacuum base model
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Accessories
Accessories
Positioners (Manipulators)
■ ACCESSORIES
HP130-SC Positioner for shield chamber
Positioner specially designed for systems with shield chamber.
ModelHP130‐SC/R ( right hand model)HP130‐SC/L ( left hand model)
Travel range ( X,Y,Z ) 13 / 13 / 13 mm
Screw resolution ( X,Y,Z ) 0.25mm / rev.
Feature resolution 5μm
Mounting[ ‐M ] On/Off switching magnet base[ ‐V ] Vacuum base
CorrespondenceProbe station
‐HMP‐810SC/1210SC‐HSP‐200SC/300SC
HAP300 Programmable positioner
ModelHAP300/R ( right hand model)HAP300/L ( left hand model)
Travel range ( X,Y,Z ) 30 / 30 / 10 mm
Screw resolution ( X,Y,Z ) 0.25mm / rev.
Programmable resolution 0.1μm
X‐Y‐Z repeatability ±1.5μm
X‐Y‐Z accuracy±10μm ( uncompensated over 10 mm )±5μm ( with compensation)
X‐Y‐Z maximum speed 5mm / sec
Typical cycle time 0.5 sec ( X‐Y 500 μm , Z 30μm )
Mounting[ ‐M ] On/Off switching magnet base[ ‐V ] Vacuum base[ ‐B ] Mechanic bolt down
Dimensions W157×D264×H183 mm
Weight approx. 6100 grams
CorrespondenceProbe station
‐HSP‐100/150‐HSP‐200/300‐HSP‐FPD series
Stepping motor drive‐type positioner. With HiSOL's semi‐automaticprober control software, it enables fully programmable hands‐off probeplacement. It supports I‐V/C‐V and RF applications.
24
Accessories
◆ Physical dimensions ( unit : mm)
25
Accessories
Accessories
■ ACCESSORIES
Probe & probe arm
DC Probe
Kelvin probe
Specialty probe
HP40Standard probe
HP40SSuspension probe
HCP40High‐performance probe
HCP40LPLow profileHigh‐performance probe
A74CJ1tip/Kelvin probe
A74‐KS1tip/Kelvin probe
A73‐TKTrue Kelvin probe
Coaxial ・ Triaxial probe
RF probe ・ Active probe Probe for High‐power devices
HCP40‐HVHigh‐voltage probe
HCP‐SHCHigh‐current probe
GGB Picoprobe( Active probe )
Various RF probe
HCP40UFree angle probe( Universal probe )
HCP40NMNon‐magnetic probe
A73‐ULHigh‐performance probefor Noise measurement
We offer optimal probe for your required measurement application from our abundant lineup.We also offer customized probes according to your required specification.
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Accessories
Accessories
■ ACCESSORIES
Probes and Probe Arms
Model Maximum voltage(DC ±)*1
Frequency band(3dB)*1
Temperature range
Note
HP40 500VDC ~ 30 kHz ‐65℃~+300℃ noncoaxial
Support disposable probe
●
HP40S 500VDC ~ 30 kHz ‐65℃~+250℃ noncoaxial,soft contact●
HCP40 Coax 500V,Triax 1.2kVDC ~ 10 MHz 4k~+300℃ Ultra low current measurement(fA level)●
HCP40LP Coax 500V,Triax 1.2kVDC ~ 10 MHz 4k~+300℃ Ultra low current measurement(fA level),low profile●
A74CJ 500VDC ~ 100 MHz 10k~+200℃ Ultra low signal I‐V・C‐Vmeasurement,1tip/kelvin△*2
A74KS 500VDC ~ 10 MHz 4k~+300℃ 1tip/Kelvin,I‐V・C‐Vmeasurement,support disposable probes●
A73TK 500VDC ~ 100 MHz 10k~+200℃ True kelvin,ultra low signal I‐V・C‐V,LCR-
HCP40‐HV Coax 10kV,Triax 3kVDC ~ 10 MHz 4k~+300℃ High voltage,support disposable probes●
HCP‐SHC 200VDC ~ 30 kHz 50k~+300℃ Supports maximum current of DC20A,200A pulse-
HCP40‐NM 500VDC ~ 10 MHz 4k~+300℃ Non‐magnetic,prober for applying magnetic fields●
A73‐UL 500VDC ~ 300 MHz 10k~+200℃ 1/f noise, RTN, TLP-
Typical specifications
Note *1 Frequency band and maximum voltage varies depending on a type of cable connected to a probe.*2 Only special coaxial semirigid probe at the tip is replaceable.
Replaceable Probe Tips (Disposable probes)
HiSOL’s probe tip lineup
Tungsten (W)Excels in electrical characteristics, elastic modulus, mechanical strength, and also cost effective. Tungsten is widely used probe material.Different from other probe materials, it can do shape machining at the tip with etching. It can do extra‐fine tip processing that machine cannot do. Also, there are varieties of tip shapes. Especially compatible with aluminum pad.
Tungsten with Au platingGold plated on the surface of tungsten probe. Special method is used for higher adhesive strength with tungsten.Low contact resistance against gold pad and copper pad. Excels in ohmic features. Non‐magnetic since Ni coat is not used in underlayer
25mm ( standard ) ・ 0.5mm
0.6 / 1.2 / 2.4 / 5 / 7 / 12 / 25
Straight or 45°bend
25mm ( standard ) ・ 0.5mm
5 / 7 / 10 / 12.5 / 20 / 25
Straight or 45°bend
Paliney® 7
Palladium based noble metal alloy developed for probes. ( Pd 35 / Ag 30 / Pt 10 / Au 10 / Cu 14 / Zn1 % )Contact resistance is small and also stable. Very little surface oxidation in atmosphere and high temperature. Suitable for applying high current andcontinuous test application under high temperature. Need to be cautious when handling thinner probes since they get bend easier compare to tungsten probes. ( Tip radius of more than 20μm is recommended. )
25mm ( standard ) ・ 0.5mm
5 / 7 / 10 / 12.5 / 20 / 25 / 50 / 100
Straight or 45°bend
Beryllium Copper (Be‐Cu)
Probe material is copper alloy that excels in electric character and elastic modulus. ( Cu 98 / Be 2 % )Smaller contact resistance compare to tungsten, and stable. Suitable for contacting to gold pad and copper pad. Damage to pads by scrubbingcan be reduced. Not recommended for continuous test under high temperature.
25mm ( standard ) ・ 0.5mm
5 / 7 / 10 / 12.5 / 20 / 25
Straight or 45°bend
Paliney® 7 is a trademark of Deringer‐Ney
Overall length・shank diameter ( mm )
Tip radius ( μm )
Shape
Overall length・shank diameter ( mm )
Tip radius ( μm )
Shape
Overall length・shank diameter ( mm )
Tip radius ( μm )
Shape
Overall length・shank diameter ( mm )
Tip radius ( μm )
Shape
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Accessories
Accessories
■ ACCESSORIES
Probes and Probe Arms
Tungsten Carbide ( TC )Highly rigid and abrasion‐resistant probe material. To utilize the characteristic, it can be used for scribe, exfoliation of oxide layer, cutting metal pattern, and touchdown sensor besides electrical measurement. Shank cannot be bent.
Whisker ProbeProbe with minuscule tip radius to contact internal circuit. Ultra thin tungsten wire is spliced at the tip of φ0.5mm nickel shank.Elasticity of tungsten wire has appropriate spring pressure. It reduces damage to circuit during probing.φ0.5mm shank can be bent or cut freely. Wire diameter is available in 127μm, 76μm, and 25μm.
25mm ( standard ) ・ 0.5mm
5 / 7 / 10 / 12.5 / 20 / 25
Straight only
Overall length・shank diameter ( mm ) 34mm ・ 0.5mm
Wire diameter・Tip radius ( μm )Diameter 127μm : 0.35 / 0.75 / 1Diameter 76μm : 0.1 / 0.35 / 0.5Diameter 25μm : 0.25 / 0.5 / 0.75
Shape Straight only ( Shank can be bent or cut )
Wire length ( mm ) 5mm
Replaceable Coaxial Probe Tip for A74CJ
Replaceable semirigid coaxial probe specially for A74CJ. Except about 2.5 mm of tips which the needle point is exposed, it has 50Ω coaxial geometry and excels in high frequency property. Material of the tip is tungsten ( W ). Various radius is available.
Probe conductor dia.・shield dia. 0.2mm ・ 0.86mm
Tip radius ( μm ) 0.5 / 1.5 / 5 / 10 / 12.5 / 15 / 20 / 25 / 35 / 50
Shape Low profile double‐bend
Probe Card・Probe Card Adaptor
Standard probe card adaptorfor 4.5” probe card
Probe card adaptor for circular probe card
Probe card adaptor for Shield chamber ( SC )
Adaptor for large diameter WLR probe card
Various Probe Card Adaptor
Probe Card for +300゜C High Temperature
We customize probe card adaptor according to your required specification.
We offer probe cards manufactured by Celadon Systems in USA. They support low noise and low leak measurement in thetemperature range of ‐65゜C ~ +350゜C.
Overall length・shank diameter ( mm )
Tip radius ( μm )
Shape
Accessories
■ ACCESSORIES
Accessories
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Various Wafer Chucks
Chuck ‐ Ambient
Standard Chucks (Coaxial)Model Wafer sizeHC20 2 inch
HC40 4 inchHC60 6 inch
HC80 8 inchHC120 12 inch
Triaxial ChucksModel Wafer sizeHTC20 2 inch
HTC40 4 inch
HTC60 6 inchHTC80 8 inch
HTC120 12 inch
General Purpose Hot chuck・Calefaction/Endothermic Chuck
High performance hot chuck and thermal chuck system. High performance hot chuck and thermal chuck system with advanced temperature control technique and low noise / low leakage technology.Because of their features of high‐speed temperature rise / fall, superior chuck top planarity and temperature uniformity, they can support high precision temperature characteristics test or wafer level reliability test.
High‐Performance Hot chuck, Thermal chuck
ModelHA40HA60HA80HA40HHA60HHA80H
Wafer size4 inch6 inch8 inch4 inch6 inch8 inch
Temperature Range
R.T. ~ +200゜C
R.T. ~ +300゜C
Heating method
Heater
Cooling method
N / Aor
Compressed air
HA40HA60HA80
4 inch6 inch8 inch
‐10゜C ~ +85゜C Peltier element Peltier element
Hot Chuck
Calefaction/Endothermic Chuck
We offer optimal chuck for your required measurement application from our abundant lineup.We also offer square chucks for glass substrate, chuck for pressure sensor, chuck for high frequency, chuck for power device, chuck for print circuit board etc.,. Please contact us for details.
RT chuck for wafer. Standard ( Coaxial ) model and triaxial model are available.
General purpose hot chuck and Calefaction/Endothermic Chucks. Standard ( Coaxial ) type and triaxial type available. In addition to the following chucks, we customize chuck according to your applications.
Standard chuck sizeφ 155mm ( 6 inch ) ,φ205mm ( 8 inch ) ,φ305mm ( 12inch )
Temperature Range Heating methodR.T. ~ +200℃ Heater
Cooling methodCompressed air
+20℃~ +200℃ HeaterR.T. ~ +300℃ Heater
Compressed air Compressed air
+20℃~ +300℃ Heater Compressed air ‐40℃~ +200℃ Heater Refrigerator & compressed air ‐60℃~ +200℃ Heater‐40℃~ +300℃ Heater
Refrigerator & compressed airRefrigerator & compressed air
‐60℃~ +300℃ Heater Refrigerator & compressed air‐40℃~ +200℃ Heater Fluorinated liquid circulation ‐65℃~ +200℃ Heater‐40℃~ +300℃ Heater
Fluorinated liquid circulation Fluorinated liquid circulation
‐65℃~ +300℃ Heater Fluorinated liquid circulation +30℃~ +400℃ Heater Compressed air
Model‐A‐AC‐AH‐ACH‐C‐CL‐CH‐CLH‐M‐ML‐MH‐MLH‐HH
Specifications
Ultra low noise, low leakage, and short settling model ”‐UL” series is also available.
Model Wafer size Temperature Range Heating method Cooling method
Accessories
■ ACCESSORIES
Accessories
29
Microscopes, Optics, Cameras & Monitors
Shield Dark Boxes ( for open type manual probers )
We offer best suited observation optical systems such as stereomicroscope, high‐power metallurgical microscope unit, camera, display etc. according to your application.
Shield dark box for open type manual prober that is required for ultra low current measurement below pA* level.Hatchback door‐type and double swing door‐type are available. Inner walls of all the models are painted black and shading Level below 0.01 Lx is guaranteed. They also support opening / shutting of a door and linkage of the interlock function of a tester.
HEB5565
HDBB6070
HDBB8080H
HDBA6070H
HDBA6070H
*During triaxial connection
Bench‐top modelModel
HEB5565
Door type
Hatchback *1Dimensions(W x D x H mm)*3
560×670×670
Correspondence Probe station
HMP‐200 / 400
HEB6070 Hatchback *1 600×720×720 HMP‐400 / 600
HDBA6070 Hatchback *2 610×720×780 HMP‐400 / 600
HEBB6070 Double swing 600×700×1020 HMP‐400 / 600
HDBA8080 Hatchback *2 810×820×850 HMP‐800
HEBB8080 Double swing 810×820×1020 HMP‐800
HDBA9595 Hatchback *2 950×950×850 HMP‐1200
HEBB9595 Double swing 950×960×1020 HMP‐1200
Standalone model ( Without vibration isolation table )
HDBA6070H Hatchback *2 610×720×1510 HMP‐400 / 600
HEBB6070H Double swing 600×700×1750 HMP‐400 / 600
HDBA8080H Hatchback *2 810×820×1580 HMP‐800
HEBB8080H Double swing 810×820×1750 HMP‐800
HDBA9595H Hatchback *2 950×950×1580 HMP‐1200
HEBB9595H Double swing 950×960×1750 HMP‐1200
Model with air suspension typemicro‐vibration isolator
HSA850S Hatchback *2 850×850×1690 HMP‐800
HSB850S Double swing 860×870×1850 HMP‐800
HSA1000S Hatchback *2 1050×1050×1690 HMP‐1200
HSB1000S Double swing 1000×1000×1850 HMP‐1200
Options・ Add‐on cable duct enlargement with shading tube・ Add‐on connector panel・ Tester interlock linked with door switch・ Side desk
*1 Counterbalance, folding hatchback*2 Gas damper support hatchback*3 Dimensions when a door is closed. Protuberances are not included.
・ Shelf board inside of a box・Quakeproof fixing bracket・ Load dispersion board, etc.
Model Door type Dimensions(W x D x H mm)*3 Correspondence Probe station
Model Door type Dimensions(W x D x H mm)*3 Correspondence Probe station
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Accessories
■ ACCESSORIES
Measurement Cables, Feedthrough Connectors, Conversion adaptors
Other Accessories and Options
We offer best suited measurement cables, feedthrough connectors, and conversion adaptors according to your application.
Standard ConnectorsTriaxial, BNC, SMA, SMB, SSMC, QLA, Micro coax, N 50Ω,K ( 2.92mm ), V ( 1.85mm ), 1.0mm, HV‐Triaxial, SHV, MHV, Banana, FC for optical fiber
Laser Oscillator Simplified Blackout Curtain
Desktop Micro‐Vibration Isolator
Air Compressor ・ Vacuum pump
Forced‐air cooling system Water cooling system
Rubber vibration‐isolator Automatic level controlvibration‐isolator
Active vibration isolator ( Desktop type )
Silent compact air compressor
Compact vacuum pump
HiSOL,Inc. is a certified solution partner company of KEYSIGHT Technologies
System integration
B1500ASemiconductor Device Analyzer
B1500A WGFMUWaveform Generator /Fast Measurement Unit
B1505APower Device Analyzer / Curve Tracer
B2200A/01ALow Leakage Switch
B2900A seriesPrecision Source / Measure Unit ( SMU )
B2961A / 2962A6.5 digits Low Noise Power Source
E4980APrecision LCR Meter
E4990A20Hz ~ 10/20/30/50/120MHzImpedance Analyzer
E4991B1MHz ~ 500MHz/1GHz/3GHzImpedance Analyzer
ENA SeriesNetwork Analyzers
PNA FamilyMicrowave Network Analyzers
KEYSIGHT Technologies' Products ( Extracts selection )
We provide a complete solution by integrating HiSOL probe stations and KEYSIGHT Technologies' products.We offer optimized systems including a variety of measurement products, software, and cables according to your applications.
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Copyright (C) 2014 HiSOL.incCAT.No.2014-1623871-GPG-EN001
1-17-6 Ueno, Taito-ku Tokyo 110-0005 JAPANPhone:+81-3-3836-2800 FAX:+81-3-3836-2266
URL:http://www.HiSOL.jpThe content of this catalogue might be changed without a previous notice.