High Speed Characterization...

Samtec Inc. WWW.SAMTEC.COM Phone: 812-944-6733 520 Park East Blvd. 1-800-SAMTEC-9 (US & Canada) Fax: 812-948-5047 New Albany IN 47151-1147 USA [email protected] Report Revision: 9/28/2017 ©Samtec, Inc. 2005 All Rights Reserved

High Speed Characterization Report

EBTM-4-10-2.0-S-VT-1

Mates with

EBTF-4-10-2.0-S-RA-1

Description: ExaMAX® 2.00 mm Vertical Header

to Right-Angle Receptacle, 4 Pairs per Column


Series: EBTM/EBTF-RA Series Description: ExaMAX® 2.00 mm Vertical Header to Right-Angle Receptacle, 4 Pair per Column

Samtec Inc. WWW.SAMTEC.COM Phone: 812-944-6733 520 Park East Blvd. 1-800-SAMTEC-9 (US & Canada) Fax: 812-948-5047 New Albany IN 47151-1147 USA [email protected] Report Revision: 9/28/2017 ©Samtec, Inc. 2005 Page:ii All Rights Reserved

Table of Contents Connector Overview ................................................................................................................................................ 1 Frequency Domain Data Summary ......................................................................................................................... 2

Table 1 - Differential Connector System Performance ....................................................................................... 2 Bandwidth Charts – Differential Insertion Loss ................................................................................................... 7

Time Domain Data Summary .................................................................................................................................. 9 Table 2 – Differential Impedance ( Ω) ................................................................................................................ 9 Table 3 - Differential Crosstalk (%) ................................................................................................................... 12 Table 4 - Propagation Delay (Mated Connector) .............................................................................................. 15

Characterization Details ........................................................................................................................................ 16 Differential and Single-Ended Data .................................................................................................................. 16 Connector Signal to Ground Ratio .................................................................................................................... 16 Frequency Domain Data ................................................................................................................................... 19 Time Domain Data ............................................................................................................................................ 19

Appendix A – Frequency Domain Response Graphs ........................................................................................... 21 Differential Application – Insertion Loss ........................................................................................................... 21 Differential Application – Return Loss .............................................................................................................. 23 Differential Application – NEXT, EBTM_B2,C2 to EBTM_C3,D3+E2,F2+F3,G3 ............................................. 25 Differential Application – NEXT, EBTM_C3,D3 to EBTM_E2,F2+F3,G3+H2,I2 .............................................. 25 Differential Application – NEXT, EBTM_E2,F2 to EBTM_F3,G3+H2,I2+I3,J3 ................................................. 26 Differential Application – NEXT, EBTM_F3,G3 to EBTM_H2,I2+I3,J3+K2,L2 ................................................. 26 Differential Application – NEXT, EBTM_H2,I2 to EBTM_I3,J3+K2,L2+L3,M3 ................................................. 27 Differential Application – NEXT, EBTM_I3,J3 to EBTM_K2,L2+L3,M3 ............................................................ 27 Differential Application – NEXT, EBTM_K2,L2 to EBTM_M3, L3 ..................................................................... 28 Differential Application – NEXT, EBTF-RA_B2,C2 to EBTF-RA_C3,D3+E2,F2+F3,G3 .................................. 28 Differential Application – NEXT, EBTF-RA_C3,D3 to EBTF-RA_E2,F2+F3,G3+H2,I2 ................................... 29 Differential Application – NEXT, EBTF-RA_E2,F2 to EBTF-RA_F3,G3+H2,I2+I3,J3 ...................................... 29 Differential Application – NEXT, EBTF-RA_F3,G3 to EBTF-RA_H2,I2+I3,J3+K2,L2 ...................................... 30 Differential Application – NEXT, EBTF-RA_H2,I2 to EBTF-RA_I3,J3+K2,L2+L3,M3 ...................................... 30 Differential Application – NEXT, EBTF-RA_I3,J3 to EBTF-RA_K2,L2+L3,M3 ................................................. 31 Differential Application – NEXT, EBTF-RA_K2,L2 to EBTF-RA_M3,L3 ........................................................... 31 Differential Application – FEXT, EBTM_B2,C2 to EBTF-RA_C3,D3+E2,F2+F3,G3 ........................................ 32 Differential Application – FEXT, EBTM_C3,D3 to EBTF-RA_B2,C2+E2,F2+F3,G3+H2,I2 ............................. 32 Differential Application – FEXT, EBTM_E2,F2 to EBTF-RA_B2,C2+C3,D3+F3,G3+H2,I2+I3,J3 ................... 33 Differential Application – FEXT, EBTM_F3,G3 to EBTF-RA_B2,C2+C3,D3+E2,F2 +H2,I2+I3,J3+K2,L2 ...... 33 Differential Application – FEXT, EBTM_H2,I2 to EBTF-RA_C3,D3+E2,F2+F3,G3+I3,J3+K2,L2+L3,M3 ....... 34 Differential Application – FEXT, EBTM_I3,J3 to EBTF-RA_F3,G3+H2,I2+K2,L2+L3,M3 ................................ 34 Differential Application – FEXT, EBTM_K2,L2 to EBTF-RA_F3,G3+H2,I2+I3,J3+L3,M3 ................................ 35 Differential Application – FEXT, EBTM_L3,M3 to EBTF-RA_H2,I2+I3,J3+K2,L2 ............................................ 35

Appendix B – Time Domain Response Graphs .................................................................................................... 36 Differential Application – Input Pulse ................................................................................................................ 36 Differential Application – Impedance ................................................................................................................ 37 Differential Application – Propagation Delay .................................................................................................... 41 Differential Application – NEXT, EBTM_B2,C2_EBTM_C3,D3 ........................................................................ 45 Differential Application – NEXT, EBTM_B2,C2_EBTM_E2,F2 ........................................................................ 45 Differential Application – NEXT, EBTM_B2,C2_EBTM_F3,G3 ........................................................................ 46 Differential Application – NEXT, EBTM_C3,D3_EBTM_E2,F2 ........................................................................ 46 Differential Application – NEXT, EBTM_C3,D3_EBTM_F3,G3 ........................................................................ 47



Samtec Inc. WWW.SAMTEC.COM Phone: 812-944-6733 520 Park East Blvd. 1-800-SAMTEC-9 (US & Canada) Fax: 812-948-5047 New Albany IN 47151-1147 USA [email protected] Report Revision: 9/28/2017 ©Samtec, Inc. 2005 Page:iii All Rights Reserved

Differential Application – NEXT, EBTM_C3,D3_EBTM_H2,I2 ......................................................................... 47 Differential Application – NEXT, EBTM_E2,F2_EBTM_F3,G3 ........................................................................ 48 Differential Application – NEXT, EBTM_E2,F2_EBTM_H2,I2 .......................................................................... 48 Differential Application – NEXT, EBTM_E2,F2_EBTM_I3,J3 ........................................................................... 49 Differential Application – NEXT, EBTM_F3,G3_EBTM_H2,I2 ......................................................................... 49 Differential Application – NEXT, EBTM_F3,G3_EBTM_I3,J3 .......................................................................... 50 Differential Application – NEXT, EBTM_F3,G3_EBTM_K2,L2 ......................................................................... 50 Differential Application – NEXT, EBTM_H2,I2_EBTM_I3,J3 ............................................................................ 51 Differential Application – NEXT, EBTM_H2,I2_EBTM_K2,L2 .......................................................................... 51 Differential Application – NEXT, EBTM_H2,I2_EBTM_L3,M3 ......................................................................... 52 Differential Application – NEXT, EBTM_I3,J3_EBTM_K2,L2 ........................................................................... 52 Differential Application – NEXT, EBTM_I3,J3_EBTM_L3,M3 .......................................................................... 53 Differential Application – NEXT, EBTM_K2,L2_EBTM_M3,L3 ......................................................................... 53 Differential Application – NEXT, EBTF-RA_B2,C2_EBTF-RA_C3,D3 ............................................................. 54 Differential Application – NEXT, EBTF-RA_B2,C2_EBTF-RA_E2,F2 .............................................................. 54 Differential Application – NEXT, EBTF-RA_B2,C2_EBTF-RA_F3,G3 ............................................................. 55 Differential Application – NEXT, EBTF-RA_C3,D3_EBTF-RA_E2,F2 ............................................................. 55 Differential Application – NEXT, EBTF-RA_C3,D3_EBTF-RA_F3,G3 ............................................................. 56 Differential Application – NEXT, EBTF-RA_C3,D3_EBTF-RA_H2,I2 .............................................................. 56 Differential Application – NEXT, EBTF-RA_E2,F2_EBTF-RA_F3,G3.............................................................. 57 Differential Application – NEXT, EBTF-RA_E2,F2_EBTF-RA_H2,I2 ............................................................... 57 Differential Application – NEXT, EBTF-RA_E2,F2_EBTF-RA_I3,J3 ................................................................ 58 Differential Application – NEXT, EBTF-RA_F3,G3_EBTF-RA_H2,I2 ............................................................... 58 Differential Application – NEXT, EBTF-RA_F3,G3_EBTF-RA_I3,J3 ............................................................... 59 Differential Application – NEXT, EBTF-RA_F3,G3_EBTF-RA_K2,L2 .............................................................. 59 Differential Application – NEXT, EBTF-RA_H2,I2_EBTF-RA_I3,J3 ................................................................. 60 Differential Application – NEXT, EBTF-RA_H2,I2_EBTF-RA_K2,L2 ............................................................... 60 Differential Application – NEXT, EBTF-RA_H2,I2_EBTF-RA_L3,M3 ............................................................... 61 Differential Application – NEXT, EBTF-RA_I3,J3_EBTF-RA_K2,L2 ................................................................ 61 Differential Application – NEXT, EBTF-RA_I3,J3_EBTF-RA_L3,M3 ............................................................... 62 Differential Application – NEXT, EBTF-RA_K2,L2_EBTF-RA_M3,L3 .............................................................. 62 Differential Application – FEXT, EBTM_B2,C2_EBTF-RA_C3,D3 ................................................................... 63 Differential Application – FEXT, EBTM_B2,C2_EBTF-RA_E2,F2 ................................................................... 63 Differential Application – FEXT, EBTM_B2,C2_EBTF-RA_F3,G3 ................................................................... 64 Differential Application – FEXT, EBTM_C3,D3_EBTF-RA_B2,C2 ................................................................... 64 Differential Application – FEXT, EBTM_C3,D3_EBTF-RA_E2,F2 ................................................................... 65 Differential Application – FEXT, EBTM_C3,D3_EBTF-RA_F3,G3 ................................................................... 65 Differential Application – FEXT, EBTM_C3,D3_EBTF-RA_H2,I2 .................................................................... 66 Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_B2,C2 ................................................................... 66 Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_C3,D3 ................................................................... 67 Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_F3,G3 ................................................................... 67 Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_H2,I2 ..................................................................... 68 Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_I3,J3 ...................................................................... 68 Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_B2,C2 ................................................................... 69 Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_C3,D3 ................................................................... 69 Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_E2,F2 ................................................................... 70 Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_H2,I2 .................................................................... 70 Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_I3,J3 ..................................................................... 71 Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_K2,L2 .................................................................... 71 Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_C3,D3 .................................................................... 72



Samtec Inc. WWW.SAMTEC.COM Phone: 812-944-6733 520 Park East Blvd. 1-800-SAMTEC-9 (US & Canada) Fax: 812-948-5047 New Albany IN 47151-1147 USA [email protected] Report Revision: 9/28/2017 ©Samtec, Inc. 2005 Page:iv All Rights Reserved

Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_E2,F2 ..................................................................... 72 Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_F3,G3 .................................................................... 73 Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_I3,J3 ....................................................................... 73 Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_K2,L2 ..................................................................... 74 Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_L3,M3 .................................................................... 74 Differential Application – FEXT, EBTM_I3,J3_EBTF-RA_F3,G3 ..................................................................... 75 Differential Application – FEXT, EBTM_I3,J3_EBTF-RA_H2,I2 ....................................................................... 75 Differential Application – FEXT, EBTM_I3,J3_EBTF-RA_K2,L2 ...................................................................... 76 Differential Application – FEXT, EBTM_I3,J3_EBTF-RA_L3,M3 ..................................................................... 76 Differential Application – FEXT, EBTM_K2,L2_EBTF-RA _F3,G3 ................................................................... 77 Differential Application – FEXT, EBTM_K2,L2_EBTF-RA_H2,I2 ..................................................................... 77 Differential Application – FEXT, EBTM_K2,L2_EBTF-RA_I3,J3 ...................................................................... 78 Differential Application – FEXT, EBTM_K2,L2_EBTF-RA_L3,M3 .................................................................... 78 Differential Application – FEXT, EBTM_L3,M3_EBTF-RA_H2,I2 .................................................................... 79 Differential Application – FEXT, EBTM_L3,M3_EBTF-RA_I3,J3 ..................................................................... 79 Differential Application – FEXT, EBTM_L3,M3_EBTF-RA_K2,L2 .................................................................... 80

Appendix C – Product and Test System Descriptions .......................................................................................... 81 Product Description .......................................................................................................................................... 81 Test System Description ................................................................................................................................... 81 PCB1299-XXX Test Fixtures ............................................................................................................................ 81 PCB1299-XXX PCB Layout Panel ................................................................................................................... 82 PCB Fixtures ..................................................................................................................................................... 83 Calibration Board .............................................................................................................................................. 84

Appendix D – Test and Measurement Setup ........................................................................................................ 85 N5227A Measurement Setup ........................................................................................................................... 85 Test Instruments ............................................................................................................................................... 85 Test Cables & Adapters .................................................................................................................................... 85

Appendix E - Frequency and Time Domain Measurements ................................................................................. 86 Frequency (S-Parameter) Domain Procedures ................................................................................................ 86 Time Domain Procedures ................................................................................................................................. 86

Propagation Delay (TDT) ............................................................................................................................. 86 Near-End Crosstalk (TDT) & Far End Crosstalk (TDT) ................................................................................ 86 Impedance (TDR) ......................................................................................................................................... 87

Appendix F – Glossary of Terms .......................................................................................................................... 88



Samtec Inc. WWW.SAMTEC.COM Phone: 812-944-6733 520 Park East Blvd. 1-800-SAMTEC-9 (US & Canada) Fax: 812-948-5047 New Albany IN 47151-1147 USA [email protected] Report Revision: 9/28/2017 ©Samtec, Inc. 2005 Page:1 All Rights Reserved

Connector Overview EBTM/EBTF_RA series is 2.0mm column pitch, include 4 or 6 pairs per column, with Press fit termination. The data in this report is applicable only to 4 pair per column EBTM vertical header mated to EBTF-RA receptacle. More information about the Samtec ExaMAX® product family can be found @ https://www.samtec.com/connectors/backplane/high-speed-backplane-systems/examax




Frequency Domain Data Summary

Table 1 - Differential Connector System Performance Test Parameter Driver Receiver

Insertion Loss

EBTM_B2,C2 EBTF-RA_B2,C2 10dB to 16.1 GHz




Test Parameter Driver Receiver

Near-End Crosstalk (From EBTM side)

EBTM_B2,C2

EBTM C3,D3





Near-End Crosstalk (From EBTF-RA side)

EBTF-RA_B2,C2

EBTF-RA C3,D3





Far-End Crosstalk (From EBTM side)

EBTM_B2,C2

EBTF-RA C3,D3





Far-End Crosstalk (From EBTM side)

EBTM_I3,J3

EBTF-RA F3,G3




Bandwidth Charts – Differential Insertion Loss EBTM/EBTF-RA Series

5 10 15 200 25

-8

-6

-4

-2

-10

0

Frequency (GHz)

Differential Application - Insertion Loss




5 10 15 200 25

-8

-6

-4

-2

-10

0

Frequency (GHz)





Time Domain Data Summary

Table 2 – Differential Impedance ( Ω) Driver Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps

EBTM_B2,C2

Maximum Impedance 104.3 104.1 103.6 102.6 101.8 Minimum Impedance 90.1 92.2 94.4 96.0 98.2

EBTM_C3,D3


EBTM_E2,F2


EBTM_F3,G3


EBTM_H2,I2


EBTM_I3,J3





Driver Signal Risetime 30 ps 50 ps 100 ps 250 ps 500 ps

EBTM_K2,L2


EBTM_L3,M3


50 100 150 200 250 300 350 400 4500 500

85

90

95

100

105

80

110

Risetime (psec)

Differential Application - Impedance vs. Risetime

50 100 150 200 250 300 350 400 4500 500

90

95

100

105

85

110

Risetime (psec)


50 100 150 200 250 300 350 400 4500 500

85

90

95

100

105

80

110

Risetime (psec)


50 100 150 200 250 300 350 400 4500 500

85

90

95

100

105

80

110

Risetime (psec)


EBTM_B2,C2 EBTM_C3,D3

EBTM_E2,F2 EBTM_F3,G3




50 100 150 200 250 300 350 400 4500 500

85

90

95

100

105

80

110

Risetime (psec)


50 100 150 200 250 300 350 400 4500 500

85

90

95

100

105

80

110

Risetime (psec)


50 100 150 200 250 300 350 400 4500 500

85

90

95

100

105

80

110

Risetime (psec)


50 100 150 200 250 300 350 400 4500 500

85

90

95

100

105

80

110

Risetime (psec)


EBTM_H2,I2 EBTM_I3,J3

EBTM_K2,L2 EBTM_L3,M3




Table 3 - Differential Crosstalk (%) Input(tr) Driver Receiver 30ps 50 ps 100 ps 250 ps 500 ps

NEXT (From EBTM side)

EBTM B2,C2 EBTM C3,D3 0.13




Input(tr) Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps

NEXT (From EBTF-RA side)

EBTF-RA B2,C2 EBTF-RA C3,D3




Differential Crosstalk (%) Input(tr) Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps

FEXT (From EBTM side)

EBTM B2,C2 EBTF-RA C3,D3 0.20 0.11




Table 4 - Propagation Delay (Mated Connector) B2,C2 106 ps C3,D3 115 ps E2,F2 128 ps F3,G3 140 ps H2,I2 156 ps I3,J3 166 ps K2, L2 183 ps L3,M3 194 ps

Differential Crosstalk (%) Input(tr) Driver Receiver 30 ps 50 ps 100 ps 250 ps 500 ps

FEXT (From EBTM side)

EBTM I3,J3 EBTF-RA F3,G3




Characterization Details This report presents data that characterizes the signal integrity response of a connector pair in a controlled printed circuit board (PCB) environment. All efforts are made to reveal typical best-case responses inherent to the system under test (SUT). In this report, the SUT includes the connector pair and footprint effects on a typical multi-layer PCB. PCB effects (trace loss) are de-embedded from test data. Board related effects, such as pad-to-ground capacitance, are included in the data presented in this report. Additionally, intermediate test signal connections can mask the connector’s true perform-ance. Such connection effects are minimized by using high performance test cables and adapters. Where appropriate, calibration and de-embedding routines are also used to re-duce residual effects. Differential and Single-Ended Data Most Samtec connectors can be used successfully in both differential and single-ended ap-plications. However, electrical performance will differ depending on the signal drive type. In this report, data is presented for both differential and single-ended drive scenarios. Connector Signal to Ground Ratio Samtec connectors are most often designed for generic applications and can be imple-mented using various signal and ground pin assignments. In high speed systems, provi-sions must be made in the interconnect for signal return currents. Such paths are often re-ferred to as “ground”. In some connectors, a ground plane or blade, or an outer shield, is used as the signal return, while in others, connector pins are used as signal returns. Vari-ous combinations of signal pins, ground blades, and shields can also be utilized. Electrical performance can vary significantly depending upon the number and location of ground pins. In general, the more pins dedicated to ground, the better electrical performance will be. But dedicating pins to ground reduces signal density of a connector. Therefore, care must be taken when choosing signal/ground ratios in cost or density-sensitive applications.




For this connector, the following configurations are evaluated:

TSRQPONMLKJIHG G3F F2 F3E E2D D3C C2 C3B B2A

1 2 3 4 5 6 7 8 9 10 11 12

TSRQPONMLKJI I2H H2G G3F F2 F3E E2D D3C C2 C3B B2A

1 2 3 4 5 6 7 8 9 10 11 12

TSRQPONMLKJ J3I I2 I3H H2G G3F F2 F3E E2D D3C C2 C3B B2A

1 2 3 4 5 6 7 8 9 10 11 12

TSRQPONML L2K K2J J3I I2 I3H H2G G3F F2 F3E E2D D3C C2 C3B B2A

1 2 3 4 5 6 7 8 9 10 11 12

TSRQPONM M3L L2 L3K K2J J3I I2 I3H H2G G3F F2 F3E E2D D3C C3BA

1 2 3 4 5 6 7 8 9 10 11 12

TSRQPONM M3L L2 L3K K2J J3I I2 I3H H2G G3F F3EDCBA

1 2 3 4 5 6 7 8 9 10 11 12




Differential Impedance (denoted by green circles) Differential Crosstalk (denoted by red circles) Other configurations can be evaluated upon request. Please contact [email protected] for more information. In a real system environment, active signals might be located at the outer edges of the sig-nal contacts of concern, as opposed to the ground signals utilized in laboratory testing. For example, in a single-ended system, a pin-out of “SSSS”, or four adjacent single ended sig-nals might be encountered as opposed to the “GSG” and “GSSG” configurations tested in the laboratory. Electrical characteristics in such applications could vary slightly from labora-tory results. But in most applications, performance can safely be considered equivalent. Signal Edge Speed (Rise Time): In pulse signaling applications, the perceived performance of the interconnect can vary sig-nificantly depending on the edge rate or rise time of the exciting signal. For this report, the fastest rise time used was 30 ps. Generally, this should demonstrate worst-case perfor-mance.

TSRQPONM M3L L2 L3K K2J J3I I2 I3H H2G G3F F3EDCBA

1 2 3 4 5 6 7 8 9 10 11 12

TSRQPONM M3L L2 L3K K2J J3I I2 I3H H2GFEDCBA

1 2 3 4 5 6 7 8 9 10 11 12




In many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. To estimate interconnect performance at other edge rates, data is provided for several rise times between 30ps and 500ps. For this report, measured rise times were at 10%-90% signal levels. Frequency Domain Data Frequency Domain parameters are helpful in evaluating the connector system’s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. In this report, pa-rameters presented in the Frequency Domain are Insertion Loss, Return Loss, and Near-End and Far-End Crosstalk. Other parameters or formats, such as VSWR or S-Parameters, may be available upon request. Please contact our Signal Integrity Group at [email protected] for more information. Frequency performance characteristics for the SUT are generated directly from network an-alyzer measurements. Time Domain Data Time Domain parameters indicate Impedance mismatch versus length, signal propagation time, and crosstalk in a pulsed signal environment. The measured S-Parameters from the network analyzer are post-processed using Agilent Advanced Design System to obtain the time domain response. Time Domain procedure is provided in Appendix E of this report. Pa-rameters or formats not included in this report may be available upon request. Please con-tact our Signal Integrity Group at [email protected] for more information. In this report, propagation delay is defined as the signal propagation time through the con-nector and connector footprint. It includes 1.25 mm of PCB trace on each end of the con-nector. Delay is measured at 100 picoseconds signal rise-time. Delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses. Crosstalk or coupled noise data is provided for various signal configurations. All measure-ments are single disturber. Crosstalk is calculated as a ratio of the input line voltage to the coupled line voltage. The input line is sometimes described as the active or drive line. The coupled line is sometimes described as the quiet or victim line. Crosstalk ratio is tabulated in this report as a percentage. Measurements are made at both the near-end and far-end of the SUT.




Data for other configurations may be available. Please contact our Signal Integrity Group at [email protected] for further information. As a rule of thumb, 10% crosstalk levels are often used as a general first pass limit for de-termining acceptable interconnect performance. But modern system crosstalk tolerance can vary greatly. For advice on connector suitability for specific applications, please contact our Signal Integrity Group at [email protected]. Additional information concerning test conditions and procedures is located in the appen-dices of this report. Further information may be obtained by contacting our Signal Integrity Group at [email protected].




Appendix A – Frequency Domain Response Graphs Differential Application – Insertion Loss

5 10 15 200 25

-8

-6

-4

-2

-10

0

Frequency (GHz)





5 10 15 200 25

-8

-6

-4

-2

-10

0

Frequency (GHz)





Differential Application – Return Loss




5 10 15 200 25

-60

-40

-20

-80

0

Frequency (GHz)

Differential Application - Return Loss

5 10 15 200 25

-60

-50

-40

-30

-20

-10

-70

0

Frequency (GHz)

Differential Application - Return Loss




Differential Application – NEXT, EBTM_B2,C2 to EBTM_C3,D3+E2,F2+F3,G3

Differential Application – NEXT, EBTM_C3,D3 to EBTM_E2,F2+F3,G3+H2,I2




Differential Application – NEXT, EBTM_E2,F2 to EBTM_F3,G3+H2,I2+I3,J3

Differential Application – NEXT, EBTM_F3,G3 to EBTM_H2,I2+I3,J3+K2,L2




Differential Application – NEXT, EBTM_H2,I2 to EBTM_I3,J3+K2,L2+L3,M3

Differential Application – NEXT, EBTM_I3,J3 to EBTM_K2,L2+L3,M3

5 10 15 200 25

-80

-60

-40

-20

-100

0

Frequency (GHz)

Differential Application - NEXT




Differential Application – NEXT, EBTM_K2,L2 to EBTM_M3, L3

Differential Application – NEXT, EBTF-RA_B2,C2 to EBTF-RA_C3,D3+E2,F2+F3,G3

5 10 15 200 25

-80

-60

-40

-20

-100

0

Frequency (GHz)


5 10 15 200 25

-80

-60

-40

-20

-100

0

Frequency (GHz)





Differential Application – NEXT, EBTF-RA_C3,D3 to EBTF-RA_E2,F2+F3,G3+H2,I2

Differential Application – NEXT, EBTF-RA_E2,F2 to EBTF-RA_F3,G3+H2,I2+I3,J3

5 10 15 200 25

-80

-60

-40

-20

-100

0

Frequency (GHz)


5 10 15 200 25

-70

-60

-50

-40

-30

-80

-20

Frequency (dB)





Differential Application – NEXT, EBTF-RA_F3,G3 to EBTF-RA_H2,I2+I3,J3+K2,L2

Differential Application – NEXT, EBTF-RA_H2,I2 to EBTF-RA_I3,J3+K2,L2+L3,M3

5 10 15 200 25

-70

-60

-50

-40

-30

-80

-20

Frequency (dB)


5 10 15 200 25

-80

-60

-40

-20

-100

0

Frequency (GHz)





Differential Application – NEXT, EBTF-RA_I3,J3 to EBTF-RA_K2,L2+L3,M3

Differential Application – NEXT, EBTF-RA_K2,L2 to EBTF-RA_M3,L3

5 10 15 200 25

-80

-60

-40

-20

-100

0

Frequency (GHz)


5 10 15 200 25

-80

-60

-40

-20

-100

0

Frequency (GHz)





Differential Application – FEXT, EBTM_B2,C2 to EBTF-RA_C3,D3+E2,F2+F3,G3

Differential Application – FEXT, EBTM_C3,D3 to EBTF-RA_B2,C2+E2,F2+F3,G3+H2,I2

Far-

End

Cro

ssta

lk (d

B)

Far-

End

Cro

ssta

lk (d

B)




Differential Application – FEXT, EBTM_E2,F2 to EBTF-RA_B2,C2+C3,D3+F3,G3+H2,I2+I3,J3

Differential Application – FEXT, EBTM_F3,G3 to EBTF-RA_B2,C2+C3,D3+E2,F2 +H2,I2+I3,J3+K2,L2

Far

-End

Cro

ssta

lk (d

B)




Differential Application – FEXT, EBTM_H2,I2 to EBTF-RA_C3,D3+E2,F2+F3,G3+I3,J3+K2,L2+L3,M3

Differential Application – FEXT, EBTM_I3,J3 to EBTF-RA_F3,G3+H2,I2+K2,L2+L3,M3

Far-

End

Cro

ssta

lk (d

B)

Far-

End

Cro

ssta

lk (d

B)




Differential Application – FEXT, EBTM_K2,L2 to EBTF-RA_F3,G3+H2,I2+I3,J3+L3,M3

Differential Application – FEXT, EBTM_L3,M3 to EBTF-RA_H2,I2+I3,J3+K2,L2

Far-

End

Cro

ssta

lk (d

B)

Far-

End

Cro

ssta

lk (d

B)




Appendix B – Time Domain Response Graphs Differential Application – Input Pulse




Differential Application – Impedance

1.5 2.0 2.51.0 3.0

70

80

90

100

110

60

120

Time (nsec)

Differential Application - ImpedanceIm

peda

nce

(ohm

s)




Impe

danc

e (o

hms)

Impe

danc

e (o

hms)




Impe

danc

e (o

hms)

Impe

danc

e (o

hms)

EBTM_I3,J3_EBTF-RA_I3,J3




Impe

danc

e (o

hms)

Impe

danc

e (o

hms)




Differential Application – Propagation Delay

1.6 1.7 1.8 1.9 2.0 2.1 2.21.5 2.3

0.0

0.2

0.4

0.6

0.8

1.0

-0.2

1.2

Time (nsec)

Differential Application - Propagation Delay

1.6 1.7 1.8 1.9 2.0 2.1 2.21.5 2.3

0.0

0.2

0.4

0.6

0.8

1.0

-0.2

1.2

Time (nsec)





1.6 1.7 1.8 1.9 2.0 2.1 2.21.5 2.3

0.0

0.2

0.4

0.6

0.8

1.0

-0.2

1.2

Time (nsec)


1.6 1.7 1.8 1.9 2.0 2.1 2.21.5 2.3

0.0

0.2

0.4

0.6

0.8

1.0

-0.2

1.2

Time (nsec)





1.6 1.7 1.8 1.9 2.0 2.1 2.21.5 2.3

0.0

0.2

0.4

0.6

0.8

1.0

-0.2

1.2

Time (nsec)

Am

plitu

de (V

olts

)


1.6 1.7 1.8 1.9 2.0 2.1 2.21.5 2.3

0.0

0.2

0.4

0.6

0.8

1.0

-0.2

1.2

Time (nsec)





1.6 1.7 1.8 1.9 2.0 2.1 2.21.5 2.3

0.0

0.2

0.4

0.6

0.8

1.0

-0.2

1.2

Time (nsec)


1.6 1.7 1.8 1.9 2.0 2.1 2.21.5 2.3

0.0

0.2

0.4

0.6

0.8

1.0

-0.2

1.2

Time (nsec)





Differential Application – NEXT, EBTM_B2,C2_EBTM_C3,D3

Differential Application – NEXT, EBTM_B2,C2_EBTM_E2,F2

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.10

-0.05

0.00

0.05

0.10

-0.15

0.15

Time (nsec)





Differential Application – NEXT, EBTM_B2,C2_EBTM_F3,G3

Differential Application – NEXT, EBTM_C3,D3_EBTM_E2,F2

Cro

ssta

lk (%

)




Differential Application – NEXT, EBTM_C3,D3_EBTM_F3,G3

Differential Application – NEXT, EBTM_C3,D3_EBTM_H2,I2




Differential Application – NEXT, EBTM_E2,F2_EBTM_F3,G3

Differential Application – NEXT, EBTM_E2,F2_EBTM_H2,I2

Cro

ssta

lk (%

)




Differential Application – NEXT, EBTM_E2,F2_EBTM_I3,J3

Differential Application – NEXT, EBTM_F3,G3_EBTM_H2,I2

Cro

ssta

lk (%

)




Differential Application – NEXT, EBTM_F3,G3_EBTM_I3,J3

Differential Application – NEXT, EBTM_F3,G3_EBTM_K2,L2




Differential Application – NEXT, EBTM_H2,I2_EBTM_I3,J3

Differential Application – NEXT, EBTM_H2,I2_EBTM_K2,L2

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

0.00

0.05

0.10

-0.05

0.15

Time (nsec)





Differential Application – NEXT, EBTM_H2,I2_EBTM_L3,M3

Differential Application – NEXT, EBTM_I3,J3_EBTM_K2,L2




Differential Application – NEXT, EBTM_I3,J3_EBTM_L3,M3

Differential Application – NEXT, EBTM_K2,L2_EBTM_M3,L3




Differential Application – NEXT, EBTF-RA_B2,C2_EBTF-RA_C3,D3

Differential Application – NEXT, EBTF-RA_B2,C2_EBTF-RA_E2,F2




Differential Application – NEXT, EBTF-RA_B2,C2_EBTF-RA_F3,G3

Differential Application – NEXT, EBTF-RA_C3,D3_EBTF-RA_E2,F2




Differential Application – NEXT, EBTF-RA_C3,D3_EBTF-RA_F3,G3

Differential Application – NEXT, EBTF-RA_C3,D3_EBTF-RA_H2,I2




Differential Application – NEXT, EBTF-RA_E2,F2_EBTF-RA_F3,G3

Differential Application – NEXT, EBTF-RA_E2,F2_EBTF-RA_H2,I2

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.05

0.00

0.05

0.10

0.15

-0.10

0.20

Time (nsec)





Differential Application – NEXT, EBTF-RA_E2,F2_EBTF-RA_I3,J3

Differential Application – NEXT, EBTF-RA_F3,G3_EBTF-RA_H2,I2




Differential Application – NEXT, EBTF-RA_F3,G3_EBTF-RA_I3,J3

Differential Application – NEXT, EBTF-RA_F3,G3_EBTF-RA_K2,L2




Differential Application – NEXT, EBTF-RA_H2,I2_EBTF-RA_I3,J3

Differential Application – NEXT, EBTF-RA_H2,I2_EBTF-RA_K2,L2




Differential Application – NEXT, EBTF-RA_H2,I2_EBTF-RA_L3,M3

Differential Application – NEXT, EBTF-RA_I3,J3_EBTF-RA_K2,L2




Differential Application – NEXT, EBTF-RA_I3,J3_EBTF-RA_L3,M3

Differential Application – NEXT, EBTF-RA_K2,L2_EBTF-RA_M3,L3




Differential Application – FEXT, EBTM_B2,C2_EBTF-RA_C3,D3

Differential Application – FEXT, EBTM_B2,C2_EBTF-RA_E2,F2

Cro

ssta

lk (%

)




Differential Application – FEXT, EBTM_B2,C2_EBTF-RA_F3,G3

Differential Application – FEXT, EBTM_C3,D3_EBTF-RA_B2,C2

Cro

ssta

lk (%

)C

ross

talk

(%)




Differential Application – FEXT, EBTM_C3,D3_EBTF-RA_E2,F2

Differential Application – FEXT, EBTM_C3,D3_EBTF-RA_F3,G3

Cro

ssta

lk (%

)C

ross

talk

(%)




Differential Application – FEXT, EBTM_C3,D3_EBTF-RA_H2,I2

Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_B2,C2

Cro

ssta

lk (%

)C

ross

talk

(%)




Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_C3,D3

Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_F3,G3

Cro

ssta

lk (%

)C

ross

talk

(%)




Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_H2,I2

Differential Application – FEXT, EBTM_E2,F2_EBTF-RA_I3,J3

Cro

ssta

lk (%

)C

ross

talk

(%)




Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_B2,C2

Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_C3,D3




Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_E2,F2

Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_H2,I2

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

0.00

0.05

0.10

0.15

-0.05

0.20

Time (nsec)

Differential Application - FEXT




Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_I3,J3

Differential Application – FEXT, EBTM_F3,G3_EBTF-RA_K2,L2

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.08

-0.06

-0.04

-0.02

-0.00

0.02

-0.10

0.04

Time (nsec)


1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.02

-0.01

0.00

0.01

0.02

-0.03

0.03

Time (nsec)





Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_C3,D3

Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_E2,F2

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.02

-0.01

0.00

0.01

0.02

-0.03

0.03

Time (nsec)


1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.10

-0.05

0.00

-0.15

0.05

Time (nsec)





Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_F3,G3

Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_I3,J3

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

0.00

0.05

0.10

-0.05

0.15

Time (nsec)


1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.10

-0.05

0.00

0.05

0.10

-0.15

0.15

Time (nsec)





Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_K2,L2

Differential Application – FEXT, EBTM_H2,I2_EBTF-RA_L3,M3

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.05

0.00

0.05

0.10

-0.10

0.15

Time (nsec)


1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.02

-0.01

0.00

0.01

0.02

0.03

0.04

-0.03

0.05

Time (nsec)





Differential Application – FEXT, EBTM_I3,J3_EBTF-RA_F3,G3

Differential Application – FEXT, EBTM_I3,J3_EBTF-RA_H2,I2

1 2 3 4 5 6 70 8

-0.06

-0.04

-0.02

0.00

0.02

-0.08

0.04

Time (nsec)


1 2 3 4 5 6 70 8

-0.15

-0.10

-0.05

0.00

-0.20

0.05

Time (nsec)





Differential Application – FEXT, EBTM_I3,J3_EBTF-RA_K2,L2

Differential Application – FEXT, EBTM_I3,J3_EBTF-RA_L3,M3

1 2 3 4 5 6 70 8

0.00

0.05

0.10

0.15

0.20

-0.05

0.25

Time (nsec)


1 2 3 4 5 6 70 8

-0.15

-0.10

-0.05

0.00

-0.20

0.05

Time (nsec)





Differential Application – FEXT, EBTM_K2,L2_EBTF-RA _F3,G3

Differential Application – FEXT, EBTM_K2,L2_EBTF-RA_H2,I2

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.02

-0.00

0.02

0.04

0.06

0.08

-0.04

0.10

Time (nsec)

Cro

ssta

lk (%

)





Differential Application – FEXT, EBTM_K2,L2_EBTF-RA_I3,J3

Differential Application – FEXT, EBTM_K2,L2_EBTF-RA_L3,M3

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.15

-0.10

-0.05

0.00

0.05

-0.20

0.10

Time (nsec)

Cro

ssta

lk (%

)Differential Application - FEXT

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.10

-0.05

0.00

0.05

-0.15

0.10

Time (nsec)

Cro

ssta

lk (%

)





Differential Application – FEXT, EBTM_L3,M3_EBTF-RA_H2,I2

Differential Application – FEXT, EBTM_L3,M3_EBTF-RA_I3,J3

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.02

-0.01

0.00

0.01

-0.03

0.02

Time (nsec)

Cro

ssta

lk (%


1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.08

-0.06

-0.04

-0.02

0.00

-0.10

0.02

Time (nsec)

Cro

ssta

lk (%

)





Differential Application – FEXT, EBTM_L3,M3_EBTF-RA_K2,L2

1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.51.0 6.0

-0.15

-0.10

-0.05

0.00

-0.20

0.05

Time (nsec)

Cro

ssta

lk (%





Appendix C – Product and Test System Descriptions Product Description Product test samples are EBTM/EBTF-RA Series connectors. The part numbers are EBTM-4-10-2.0-S-VT-1 and EBTF-4-10-2.0-S-RA-1. A photo of the test articles mounted to SI test boards is shown below. Test System Description The test fixtures are composed of four-layer FR-4 material with 50Ω signal trace and pad configurations designed for the electrical characterization of Samtec high speed connector products. A PCB mount SMA connector is used to interface the VNA test cables to the test fixtures. Optimization of the SMA launch was performed using full wave simulation tools to minimize reflections. One test fixture is specific to the EBTM/EBTF-RA Series connector set and identified by part numbers PCB1299-001 and PCB1299-002. Calibration standards specific to the EBTM/EBTF-RA Series are located on PCB1299-003. PCB1299-XXX Test Fixtures Shown below is a photograph of test board sets.




PCB1299-XXX PCB Layout Panel Artwork of the PCB design is shown below.




PCB Fixtures The test fixtures used are as follows:

PCB1299-001 – EBTM/EBTF-RA Series Test Board Right-Angle Receptacle PCB1299-002 – EBTM/EBTF-RA Series Test Board Vertical Header PCB1299-003 – EBTM/EBTF-RA Series Calibration Board




Calibration Board Test fixture losses and test point reflections were removed from the data by use of Automat-ic Fixture Removal (AFR) application. The calibration standard is on the calibration board and shown below. The measurements were performed under SOLT calibration and the test board effects were included in the measurements. AFR application extracts fixture S-parameters from 2X THRU measurement and performs de-embedding on the DUT+Fixture measurement to characterize only the DUT.

Thru line – 160 mm All traces on the test boards are length matched to 81.25 mm measured from the edge of the pad to the SMA. The AFR calibration effectively removes 80 mm of test board trace ef-fects. This means that 1.25 mm of test board trace length effects are included in the meas-urement. The S-Parameter measurement includes:

A- The EBTM/EBTF-RA Series connector set B- Test board vias, pads (footprint effects) C- 1.25 mm of 8 mil wide microstrip trace

The figure below shows the location of the measurement reference plane.

Measurement reference plane

B

C




Appendix D – Test and Measurement Setup The test instrument is the Agilent N5227A PNA-L network analyzer. Frequency domain data and graphs are obtained directly from the instrument. Post-processed time domain data and graphs are generated using convolution algorithms within Agilent ADS. The network ana-lyzer is configured as follows: Start Frequency – 10 MHz Stop Frequency – 40 GHz Number of points – 4000 IFBW – 1 KHz With these settings, the measurement time is approximately 20 seconds. N5227A Measurement Setup

Test Instruments QTY Description

1 Keysight N5227A PNA Network Analyzer (10 MHz to 67 GHz) 1 Keysight N4694-60003 ECAL Module (10 MHz to 67 GHz)

Test Cables & Adapters QTY Description

4 Gore 0F0CACB036.0-LF (DC-67 GHz)




Appendix E - Frequency and Time Domain Measurements Frequency (S-Parameter) Domain Procedures The quality of any data taken with a network analyzer is directly related to the quality of the calibration standards and the use of proper test procedures. For this reason, extreme care is taken in the design of the through calibration standards, the SI test boards, and the selec-tion of the PCB vendor. A coaxial SOLT calibration is performed using a N4694-60003 ECAL module. Then DUT measurements are performed under SOLT calibration. The measurements include the ef-fect of test fixture. The measurements of the 2X THRU line standards are required in order to remove the test fixture effect. Time Domain Procedures Mathematically, Frequency Domain data can be transformed to obtain a Time Domain re-sponse. Perfect transformation requires Frequency Domain data from DC to infinity Hz. For-tunately, a very accurate Time Domain response can be obtained with ban

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