1

GENERAL OVERVIEW

Emmanuel LEROUX

Chief Application Engineer

Application Domain

• Signal Integrity investigation – efficient handling of huge number of transmission lines

– simultaneous analysis of transmission, crosstalk and switching noise issues

• High-speed and complex system design&validation

• MCM, PCB, Backplane, Interconnection layout check

• EMC/EMI analysis

• Hardware quality verification

Application Market

• Telecom

• Computer

• Automotive

• Aerospace

• Automatic Test Equipment

• Measurement

• Biomedical

• Consumer Electronics

Technologies supported

• PCB

• MCM

• Hybrid

Interconnect levels • multiboards

• backplane

• LANS

• entire apparatus

Platforms supported

• HP 9000/700 Series

• Sun SPARC , ULTRA

Series

• PC Windows NT 4.0

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THE CONCEPT

PRESTO

1 2 3 4 5 6

7 8 9

FILE_TYPE=HDT_PLIB;

TIME=Thu Dec 10 10:45:33 1992

COMPONENT=AC04, 74AC04;

FAMILY=FACT;

PACKAGE=DEFAULT, DIP14, SOIC14;

FACTORY=DEFAULT;

TYPE=IC;

NPINS=14;

BEGIN_PIN

FACT_DR24_P=2,4,6,8,10,12;

FACT_RC_P=1,3,5,9,11,13;

FACT_GND_P=7;

FACT_VCC_P=14;

END_PIN;

BEGIN_FUNCTION

DRIVER=2,4,6,8,10,12;

RECEIVER=1,3,5,9,11,13;

POWER_FACT=14;

GROUND_FACT=7;

END_FUNCTION;

END.

Driver

Receiver

SSN report

Compliance

analysis

report

Overshoots

undershoots

rise and fall

time

report

398.00 399.00 400.00 401.00 402.00 403.00 404.00404.40

TIME[nS]

-2.00 V

-1.75 V

-1.50 V

-1.25 V

-1.00 V

-0.75 V

-0.50 VV(116)

70.00 80.00 90.00 100.00 110.00 120.00 130.00 140.00 150.00 160.00 170.00 180.00

-5.00V

-4.00V

-3.00V

-2.00V

-1.00V

0.00V

1.00V

2.00V

3.00V

4.00V

5.00V

6.00V

7.00V

8.00V

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The HDT line: “The Backbone”

SPRINT

– Simulation Program of Response of

Integrated Network Transients

SIGHTS

– Standard Interface for Graphic

Handling of Transient Signals

Mod-env

– Modeling environment

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The HDT line: “Signal Integrity”

PRESTO

– Post-layout Rapid Exhaustive Simulation and Test of Operation

TEMPO

– Tool for Electrical Multiple Performance Optimization

XTALK

– CrossTALK

SSN

– Simultaneous Switching Noise

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The HDT line: “EMC”

PRESTO_CNT

– Post-layout simulation to evaluate

Conducted Noise Transmission

EMIR

– EMIssion Radiated

EMIR-Cable

– Cable attached PCB emission &

conducted noise transmission analysis

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The differentiators: “Fast”

Remember this:

approx 0.3 secs for single net simulation!

• Comparison between

simulation and

measures

of high-speed

multiboard

system (155Mbit/s)

• 50000 elements

• 32 simultaneous input

sequence

• 16000 time points

• 60 min. simulation time

on a HP 750

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Simultaneous simulation of all nets of a

complex PCB is available

Presto can simulate signal integrity,

crosstalk but also simultaneous switching

noise on vcc/gnd nets or planes

Many benchmark results are available to

demonstrate a good comparison with

measurement

The differentiators: “Accurate”

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The differentiators: “User friendly”

70.00 80.00 100.00 120.00 140.00 160.00 180.00TIME[nS]

-4.00V

-2.00V

0.00V

2.00V

4.00V

6.00V

8.00V#U4_1

#IC23_4

lower and upper masks

mask violations

Net CLK1 upper and lower masks v iolation Error f igure: 8.12

Net DAT1 upper and lower masks v iolation Error f igure: 6.01

Net ADD1 lower mask v iolation Error f igure: 0.21

Net ADD2 upper mask v iolation Error f igure: 0.11

Net ADD3 upper mask v iolation Error f igure: 0.11Net RD no v iolation Error f igure: -

Net RDN no v iolation Error f igure: -

70.00 80.00 100.00 120.00 140.00 160.00 180.00TIME[nS]

-4V

-2V

0V

2V

4V

6V

8V

Eye-diagram opening

Jitter

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It is possible to predict results of

precompliance tests for:

– RADIATED EMISSIONS

– CONDUCTED NOISE SUSCEPTIBILITY

– CONDUCTED EMISSIONS

The differentiators: “A complete solution”

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320

10

0

10

20

30

40

50

60

70

80

Frequency in MHz

|E| in dBV/m

EN 55022

Emissions from PCB +

cable: measurement

Emissions from PCB +

cable: simulation

Emissions from PCB:

simulation

Emissions from the

cable: simulation

The differentiators: “Advanced”

Collaborations

• Research centers:

»CSELT inside of THRIS product

(telecom market)

»COREP

»ITALTEL in EMC/EMI

• University research&thesis:

»Politecnico di Torino (Prof. Canavero),

»Università di Ancona (Prof. De leo),

»Università di L’Aquila (Prof. Orlandi),

»University of Belgrade (Prof.

Djordjeviz),

»University of Lille (Prof. Demoulin)

Collaborations

• EUROPRACTICE Training Courses:

»EMC/EMI design for Printed Circuit

Boards

• ESPRIT ESD:

»EMCLO (Magneti Marelli)

»OMEGA (Aerospatiale)

»MERITA (Bull)

»RISIP (GEA)

Collaborations