H8-Z80-64K CPU / Memory / GIDE Card Assembly, Conﬁguration...

H8-Z80-64K CPU / Memory / GIDE Card

Assembly, Configuration and Installation Guide

Board Revision 2.6

Gerber File Revision 32

David Troendle

Document Revision 4

August 25th, 2017

Contents

1 Disclaimer of Liability 1

2 Introduction 1

3 Technical Assistance 1

4 Ordering the Card 2

5 Board Views 2

6 Getting Ready 26.1 Bill of Material (BOM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6.2 GALs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6.3 EPROMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.4 Identifying Resistor Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.5 Polarized Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.6 Mounting the Voltage Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.7 About ICs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

6.8 Handling Electrostatic Sensitive Devices . . . . . . . . . . . . . . . . . . . . . . . 7

6.9 H8 Mounting Bracket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

6.10 Tools and Mechanical Considerations . . . . . . . . . . . . . . . . . . . . . . . . 7

6.11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

6.12 Headers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

6.13 Clocking And Speed Considerations . . . . . . . . . . . . . . . . . . . . . . . . . 10

6.13.1 Gary Kaufman’s Daughter Board . . . . . . . . . . . . . . . . . . . . . . . 10

6.13.2 Half-Can Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6.13.3 Post a Question to the SEBHC Group . . . . . . . . . . . . . . . . . . . . 11

7 Assembly and Bill of Material (BOM) 117.1 Axial vs Radial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

7.2 Headers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

7.3 Resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

7.4 Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.5 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

7.6 Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.7 Tantalum Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

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7.8 Sockets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

7.9 Intergrated Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

7.10 Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

7.11 Voltage Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

7.12 Heatsinks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7.13 Electrolytic Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7.14 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7.15 Brackets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

8 Configuration 26

9 Final Assembly 29

10 Installation 30

11 Acknowledgements 31

A Resistor Identification 32

B Polarized Devices 33B.1 Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

B.2 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

B.3 Tantalum Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

B.4 Electrolytic Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

C Connector Pinouts 35C.1 P201 - Front Panel Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

C.2 H8 Backplane Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

D IC Pinouts 37

E Attachments 41

List of Figures

4.1 X-Ray View (Red=Bottom, Green=Top and White=Silk Screen) . . . . . . . . . . 3

4.2 Fully Assembled Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.1 Placing a Regulator on its Heatsink . . . . . . . . . . . . . . . . . . . . . . . . . . 6

6.2 Pin 1 Shown in Red . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

ii

6.3 Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

6.4 Soldering Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

6.5 Solder Bridges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

6.6 Half-Can 2.0MHz Oscillator Option for ECS-300CX . . . . . . . . . . . . . . . . 11

6.7 Gary Kaufman’s ECS-300CX Replacement Board . . . . . . . . . . . . . . . . . . 12

7.1 Axial vs Radial Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

7.2 ORG 0 Extended Configuration Settings . . . . . . . . . . . . . . . . . . . . . . . 27

9.1 H37 Interrupt Ribbon Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

B.1 Diode in a DO-35 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

B.2 LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

B.3 Tantalum Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

B.4 Electrolytic Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

List of Tables

A.1 Resistor Color Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

List of Attachments

444-70-XCON-8.hex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

444-70-XCON-8-Checksum.txt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

444-140-PAM-37.hex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

444-140-PAM-37-Checksum.txt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

GIDE-GAL-16V8.pds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

GIDE-GAL-20V8.pds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

GIDE-GAL-22V10.pds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

iii

1 Disclaimer of Liability

THIS DOCUMENT IS PROVIDED BY THE AUTHOR(S) “AS IS” AND ANY EXPRESSOR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIEDWARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PUR-POSE ARE DISCLAIMED. IN NO EVENT SHALL THE AUTHOR(S) BE LIABLE FORANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUEN-TIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUB-STITUTE/REPLACEMENT GOODS OR SERVICES; LOSS OF USE, DATA, OR PROF-ITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OFLIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT INCLUDINGNEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THISDOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.

2 Introduction

The H8-Z80-64K V2.6 is a replacement board for the Heathkit H8 computer that replaces the CPU

and memory boards for the Heathkit H8 personal computer. The board provides on-board ORG 0

functionality, and contains an optional GIDE interface. This documentation is for board revision

2.6 (Gerber file revision 32).

3 Technical Assistance

The best way to obtain technical assistance and ask questions is via the SEBHC Google group

located here: https://groups.google.com/forum/#!forum/sebhc.

There are many experts that hang out in this group and willing to help.

The SEBHC main website is loaded with helpful documentation on vintage Heathkit comput-

ers. That site is here: http://sebhc.lesbird.com/.

Norberto Collado’s website has many replacement cards for those who are restoring vintage

Heathkit computers. This includes the H8-Z80-64K V2.6 board. Norberto’s website is here:

http://koyado.com/.

1

https://groups.google.com/forum/#!forum/sebhchttp://sebhc.lesbird.com/http://koyado.com

4 Ordering the Card

The H8-Z80-64K V2.6 card can be ordered from OurPCB. To order a board, email [email protected]

requesting a re-run of order 15122576. Specify the color of the solder mask (green, blue or red).

You will be charged the re-order rate rather than full price.

To be worthwhile you will probably have to order a minimum of 5 boards. It is customary for

members of the SEBHC group to post their intent to order and/or offer extra boards to the group at

cost.

5 Board Views

Figure 4.1 on page 3 shows an X-Ray view of the board. It is a high resolution photo that can

be zoomed for more detail. As assembly progresses, the component designators (e.g. U1) will

gradually be covered. This view can serve as a handy reference for locating parts.

Figure 4.2 on page 4 shows a fully assembled boards with all options. This can help clarify any

ambiguities related to the mechanical aspects of the assembly.

6 Getting Ready

6.1 Bill of Material (BOM)

§7 (Assembly and Bill of Material (BOM)) details the board assembly process. It contains adescription and quantity for each part. If a part is optional, that is noted. The BOM is constructed

by reducing the part count for any unused options. For example, §7.7 on page 19 calls for 10 2.2µftantalum capacitors, but 4 are associated with the optional 12V and -12V regulators. (These are

rarely used.) So, only 6 2.2µf Tantilum capacitors should be ordered when not using the optional

12V and -12V regulators.

In this way, the assembly list serves as a BOM, ordered by type and component. This helps

searching sites for the desired components.

6.2 GALs

When the GIDE option is installed, the H8-Z80-64K V2.6 board requires two GALs. These should

be programmed before assembling the board.

One GAL is a 16V8, which is installed at U301. The other is either 20V8 or 22V10. Either

will work, but each has its unique “pds” programming file. All three “pds” files are attached to

2

Figure 4.1: X-Ray View (Red=Bottom, Green=Top and White=Silk Screen)3

Figure 4.2: Fully Assembled Board4

this PDF (while only two are used depending on whether a 20V8 or 22V10 GAL is used). See

Appendix E (Attachments) on page 41.

6.3 EPROMs

The H8-Z80-64K V2.6 board uses two 2732 EPROMs. These should be programmed before as-

sembling the board.

One should be a clone of Heathkit part number 444-40 (XCON-8). The other should be a clone

of Heathkit part number 444-140 (PAM-37). All Heath/Zenith H8 monitor ROMs are available

at the SEBHC website (http://sebhc.lesbird.com/software/Roms/H8Roms.zip). The XCON-8 and

PAM-37 “hex” programming files are attached to this PDF. See Appendix E (Attachments) on

page 41.

6.4 Identifying Resistor Values

Resistors are color coded. See Appendix A on page 32 (Resistor Identification) for the codes and

an example.

The resistors on this board are metal film 5% axial mount resistors.

6.5 Polarized Components

Tantilum capacitors, electrolytic capacitors, LEDs and diodes are polarized devices. I.E., the “+”

and “-” leads must be install correctly. Diodes have a black band that must align white line on the

board. For the other devices the “+” lead is longer than the “-” lead. Often they are also marked

with a “+”. Ensure these devices are installed with the correct polarity.

Appendix B (Polarized Devices) details identifying the polarity of these devices.

6.6 Mounting the Voltage Regulators

Voltage regulators are installed with a regulator, heat sink, screw, nut and thermal paste. The best

screw is a 3/8” panhead M3 screw and corresponding nut. These are not included in the assembly

section, but need to be ordered.

Figure 6.1 on page 6 shows how to position a regulator on its heatsink. Thermal compound is

placed between the regulator and heatsink. Before placing the regulator and heatsink on the board,

the three leads exiting the regulator must be bent down 90◦ where the leads narrow. The M3 screw

is placed through the holes on the regulator, heatsink and board and affixed to the bottom of the

5

http://sebhc.lesbird.com/software/Roms/H8Roms.zip

Figure 6.1: Placing a Regulator on its Heatsink

board using a nut. The three leads go through the hole on the board. (See Figure 4.2 on page 4) for

a view of the final assembly.

If you install the 7912 -12V regulator, note that the heatsink may touch the Tantilum capacitor

above the regulator. To avoid this, use a nibbling tool to remove the heatsink fin nearest the

capacitor. See figure 4.2, on page 4 for details.

If you install the 7812 12V regulator notice the heatsink slightly overlaps area used by the 47µf

electrolytic capacitor. The capacitor will fit, but must be installed after the heatsink is installed.

Alternatively, a 47µf Tantilum capacitor will fit slightly better. Note either capacitor is polarized.

Figure 6.2: Pin 1 Shown in Red

6

6.7 About ICs

When placing ICs in their socket, orienting pin 1 correctly is important. There are three ways to

do this. In order, they are:

1. Most ICs have a dot or circular indentation over pin 1.

2. If a dot is not present, there is usually a notch. The notchis the top of the IC. Pin 1 is to the

left of the notch. Beware, some ICs have two notches. Use the larger notch.

3. If all else fails, you can use the text on the IC. Pin 1 will be the leftmost pin below the text.

Refer to Figure 6.2 on page 6. Here, any of the three methods will work.

6.8 Handling Electrostatic Sensitive Devices

CMOS devices such as EPROMs, SRAMs and CPUs are electrostatic sensitive devices. A static

charge buildup can damage these devices. (The 74LSxxx ICs are not electrostatic sensitive de-

vices.)

Here are some tips for handling electrostatic sensitive devices:

• Limit your movement while handling these devices. Movement can cause static electricityto build up around you.

• Just before removing the device from it protective package, touch the package against theboard. This will help dissipate any static charge.

• After touching the board, immediately remove the device and install it in its socket. Thishelps prevent building up a static charge.

6.9 H8 Mounting Bracket

The H8 mounting bracket is no longer available. However, the H8-Z80-64K V2.6 board replaces

the existing CPU board and other memory boards in the system. The mounting bracket from one

of those boards can be removed and used on the H8-Z80-64K V2.6 board.

6.10 Tools and Mechanical Considerations

Part mounted in holes on the board must be soldered into place. To avoid cold joints and solder

bridges, a temperature controlled soldering station is highly recommended.

Figure 6.3 on page 8 shows tools frequently used in assembling boards:

7

Figure 6.3: Tools

6.11 Soldering

Figure 6.4 on page 9 shows how to make a good solder connection. For best results, the soldering

iron should touch both the component lead and board at a 45◦ angle so that both are properly heated

and will accept the solder. If you notice a buildup of old solder and rosin, you should clean the

soldering iron tip.

This is best done by brushing the tip on a wet sponge using a swiping motion.

Two common soldering problems are cold joints and bridges. A cold joint occurs when the

lead and board are not heated evenly. Figure 6.4 shows the two ways this can happen – either the

soldering iron is placed on the lead or board (but not both).

The other problem is a solder bridge. Figure 6.5 on page 10 shows this. (The H8-Z80-64K

V2.6 has a solder mask that helps reduce the chance for a solder bridge.)

A solder bridge between two adjacent foils is shown in Figure 6.5(A). Figure 6.5(B) shows how

the connection should appear. A solder bridge may occur if you accidentally touch an adjacent

previously soldered connection, if you use too much solder, or if you “drag” the soldering iron

across other foils as you remove it from the connection. A good rule to follow is: always take

a good look at the foil area around each lead before you solder it. Then, when you solder the

connection, make sure the solder remains in this area and does not bridge to another foil. This is

8

Figure 6.4: Soldering Hints

especially important when the foils are small and close together. NOTE: It is alright for solder to

bridge two connections on the same foil. Use only enough solder to make a good connection, and

lift the soldering iron straight up from the circuit board. If a solder bridge should develop, reheat

the bridge and use the desoldering braid or suction device to remove the solder.

6.12 Headers

The assembly instructions in §7 (Assembly and Bill of Material (BOM)) details each individualheader. However, for ordering, it is more practical to cut the headers from 1xn and 2xn header

strips. The headers can be consolidated and ordered as 1xn and 2xn header strips.

The holes on the board are a tight fit for the headers. The headers can be inserted by gently

rocking the header into the holes while applying downward pressure. Because of the tight fit and

to avoid mechanical interference from other parts, the headers are installed first.

9

Figure 6.5: Solder Bridges

6.13 Clocking And Speed Considerations

If you plan on pushing the clock speed as fast as possible, consider ordering fast 2732 EPROMs,

AS6C1008 SRAM, and Z80 CPU. 10MHz Z80 CPUs are readily available. There is no fixed

formula to use, but the faster the component the faster the clock speed the board will likely support.

The ECS-300CX-163.8 oscillator at U11 is very difficult to find. There are several good alter-

natives:

6.13.1 Gary Kaufman’s Daughter Board

This is the most flexible option. It is the best option if you plan to push the clock frequency on

your system. It duplicates the ECS-300-CX functionality. However, you have to order and build

a small PCB that installs directly in the ECS-300CX holes on the H8-Z80-64K V2.6 (no socket is

used). You also have to proficient enough with a soldering iron to mount SMD components.

Figure 6.7 on page 12 shows Gary Kaufman’s ECS-300CX replacement board installed on a

H8-Z80-64K V2.6. It is jumpered for divide by 8 output. (Divide by 2 and divide by 4 outputs are

available.) Note the position of the jumper on the H8-Z80-64K V2.6.

The Gerber files and ordering info are available here: https://oshpark.com/shared projects/sLL7Xix2.

10

https://oshpark.com/shared_projects/sLL7Xix2

Figure 6.6: Half-Can 2.0MHz Oscillator Option for ECS-300CX

The oscillator is a CB3-3I-16M3840 (or 774-CB3-3I-16M3840) and is available from Mouser elec-

tronics here. The SMD mounted 74LS93 is available from Mouser here. The only other parts are

the jumper pins, header socket and a 0.1µf capacitor readily available from Mouser, DigiKey,

Jameco and other vendors.

6.13.2 Half-Can Oscillator

The ECS-300CX-163.8 extends the functionality and pin-out of standard half-can oscillators.

Thus, it is possible to use a half-can oscillator in place of the ECS-300CX. Figure 6.6 on page 11

shows a half-can 2.0MHz oscillator (and jumper configuration) replacement for the ECS-300CX.

The only frequency available is the frequency of the oscillator. So, it is less flexible than Gary’s

option but it simpler.

A 2.0MHz half-can oscillator is available from DigiKey here.

If you plan on using only a single clock frequency, this is the best option.

6.13.3 Post a Question to the SEBHC Group

For other options that may be available at the time you build your board ask for advice at

https://groups.google.com/forum/#!forum/sebhc (See §3 (Technical Assistance) on page 1.)

7 Assembly and Bill of Material (BOM)

11

https://www.mouser.com/Search/ProductDetail.aspx?R=CB3-3I-16M3840virtualkey67110000virtualkey774-CB3-3I-16M3840https://www.mouser.com/Search/ProductDetail.aspx?R=SN74LS93Dvirtualkey59500000virtualkey595-SN74LS93Dhttps://www.digikey.com/product-detail/en/ecs-inc/ECS-2100A-020/XC232-ND/38372https://groups.google.com/forum/#!forum/sebhc

Figure 6.7: Gary Kaufman’s ECS-300CX Replacement Board

If you have not read §6 (Getting Ready), at least follow the stepsbelow in order.

This section documents the parts ordering and assembly process.

Following the instructions in sequence helps minimize mechanical

interference and assembly errors. Parts are grouped into part types

(e.g., resistors, capacitors, etc.). These form the assembly sections

below.

Within each assembly section, parts of that type are listed as bullet

items. For each part, the number of parts required along with a full

description of the part are included. Beneath each item, the locations

12

where that part is used are listed. Note that some parts are optional.

Installing all instances of a part at a time helps reduces assembly

errors and eases pulling parts. The order of assembly helps reduce

mechanical problems. As each component is installed, check it off.

Figure 7.1: Axial vs Radial Components

7.1 Axial vs Radial

Some components are available in either axial or radial packages.

This terminology refers to how the leads exit the component. When

the leads exit the component on either side through the center axis,

the package is said to be axial. When the leads exit the component

on one side, the package is said to be radial. For instance, a 47µf

radial capacitor is mounted at step 7.13. If you were to order the

axial version, it would not fit properly on the board.

Figure 7.1 on page 13 shows a 47µf 25V radial capacitor on top,

and a 1KΩ axial resistor on the bottom. (Both are used during the

assembly process.)

13

7.2 Headers

( ) • Install 1 1x1 Straight Male Pin Header (0.025” square posts) atY.

• Install 10 1x2 Straight Male Pin Header (0.025” square posts) asfollows:

( ) 1. at X.

( ) 2. at Y.

( ) 3. below and to the right of U15.


( ) 5. below and to the left of U16.

( ) 6. below U4.

( ) 7. below U3.

( ) 8. below U2.

( ) 9. below U2.

( ) 10. below U2.

• Install 12 1x3 Straight Male Pin Header (0.025” square posts) asfollows:

( ) 1. at Z.


( ) 3. to the right of U9.


( ) 5. to the left of U14.

14




( ) 9. below U2.

( ) 10. below and to the left of U1.



( ) • Install 1 1x5 Straight Male Pin Header (0.025” square posts) tothe left of U12.

( ) • Install 1 2x4 Straight Male Pin Header (0.025” square posts)below U302.

( ) • Install 1 3x3 Straight Male Pin Header (0.025” square posts) tothe right of U11.

7.3 Resistors

( ) • Install 1 100Ω (carbon/metal film, 5%, 1/4W, axial, 0.25”) belowU11.

• Install 2 220Ω (carbon/metal film, 5%, 1/4W, axial, 0.25”) asfollows:

( ) 1. below U206.

( ) 2. below U206.

15

( ) • Install 1 330Ω (carbon/metal film, 5%, 1/4W, axial, 0.25”) to theright of the GIDE connector (used with GIDE option).

( ) • Install 1 470Ω (carbon/metal film, 5%, 1/4W, axial, 0.25”) aboveU24.

• Install 11 1KΩ (carbon/metal film, 5%, 1/4W, axial, 0.25”) asfollows:

( ) 1. above U7.




( ) 5. below U23.

( ) 6. below U23.

( ) 7. below U23.



( ) 10. to the lower right of the GIDE connector (used with

GIDE option).

( ) 11. to the lower right of the GIDE connector (used with

GIDE option).

( ) • Install 1 10KΩ (carbon/metal film, 5%, 1/4W, axial, 0.25”) tothe left of the GIDE connector (used with GIDE option).

( ) • Install 1 47KΩ (carbon/metal film, 5%, 1/4W, axial, 0.25”) to

16

the left of U304 (used with GIDE option).

( ) • Install 1 68KΩ (carbon/metal film, 5%, 1/4W, axial, 0.25”) aboveU11.

( ) • Install 1 100KΩ (carbon/metal film, 5%, 1/4W, axial, 0.25”) be-low U111.

• Install 4 1KΩ bussed (SIP-9) as follows:



( ) 3. below U1.

( ) 4. below U302 (use when GIDE option installed).

( ) • Install 1 10KΩ bussed (SIP-9) to the right of the DIP switch.

7.4 Diodes

• Install 2 1N4149 (DO-35) as follows:

( ) 1. above U11.

( ) 2. below U11.

7.5 LEDs

( ) • Install 1 LED (radial, green, 0.1”) to the left of the GIDE con-nector.

( ) • Install 1 LED (radial, yellow, 0.1”) to the right of the GIDEconnector at HD (use when GIDE option installed).

17

7.6 Capacitors

( ) • Install 1 22pf (ceramic, radial, 0.1”) to the lower right of U9.

• Install 31 0.01µf (ceramic, radial, 0.1”) as follows:


( ) 2. above U10.

( ) 3. above U15.

( ) 4. above U6.

( ) 5. above U12.

( ) 6. above U13.




( ) 10. below U17.

( ) 11. above U8.

( ) 12. above U9.









18



( ) 23. above U202.

( ) 24. above U203.





( ) 29. to the left of U303 (use when GIDE option installed).

( ) 30. to the left of U304 (use when GIDE option installed).

( ) 31. to the right of U301 (use when GIDE option installed).

7.7 Tantalum Capacitors

• Install 10 2.2µf (tantalum, 25V, radial, 0.1”) as follows:


( ) 2. to the left and below U11.

( ) 3. above U24.

( ) 4. above U24.

( ) 5. below U25 (use when 12V regulator installed).

( ) 6. below U25 (use when 12V regulator installed).

( ) 7. above U26 (use when -12V regulator installed).

( ) 8. above U26 (use when -12V regulator installed).

( ) 9. below U27.

19

( ) 10. below U27.

7.8 Sockets

• Install 2 8-Pin (DIP, 0.3”) as follows:

( ) 1. at U11 (Do not install if you use Gary Kaufman’s re-

placement board.) (See §6.13.).( ) 2. at U305 (use when GIDE option installed).


( ) 1. at U7.

( ) 2. at U12.

( ) 3. at U8.

( ) 4. at U9.

( ) 5. at U18.

( ) 6. at U19.

( ) 7. at U20.

( ) 8. at U21.

( ) 9. at U22.

( ) 10. at U204.

( ) 11. at U205.

( ) 12. at U206.

( ) 13. at U207.

( ) • Install 1 16-Pin (DIP, 0.3”) at U16.

20


( ) 1. at U6.

( ) 2. at U10.

( ) 3. at U13.

( ) 4. at U15.

( ) 5. at U17.

( ) 6. at U301 (use when GIDE option installed).




( ) • Install 1 40-Pin (DIP, 0.6”) at U303 (use when GIDE optioninstalled).

7.9 Intergrated Circuits

( ) • Install 1 LM555 (Timer, DIP-8, 0.3”) at U11.

( ) • Install 1 7705A (Single Supply Voltage Supervisor for 5V Sys-tems, DIP-8, 0.3”) at U305.

( ) • Install 1 7757 (Supply-Voltage Supervisor, TO-92) to the rightof U1.

• Install 2 74LS00 (Quad 2-input NAND gates, DIP-14, 0.3”) asfollows:

21

( ) 1. at U9.

( ) 2. at U19.

( ) • Install 1 74LS02 (Quad 2-input NOR gates, DIP-14, 0.3”) atU207.

• Install 2 74LS04 (Hex inverters, DIP-14, 0.3”) as follows:

( ) 1. at U20.

( ) 2. at U204.

• Install 2 74LS10 (Triple 3-input NAND gates, DIP-14, 0.3”) asfollows:

( ) 1. at U5.

( ) 2. at U8.

• Install 3 74LS30 (8-input NAND gate, DIP-14, 0.3”) as follows:

( ) 1. at U7.

( ) 2. at U22.

( ) 3. at U205.

• Install 3 74LS32 (Quad 2-input OR gates, DIP-14, 0.3”) as fol-lows:

( ) 1. at U12.

( ) 2. at U14.

( ) 3. at U21.

22

( ) • Install 1 74LS38 (Quad 2-input NAND buffer with open-collectoroutputs, DIP-14, 0.3”) at U206.

• Install 2 74LS74 (Dual positive-edge-triggered D flipflops, DIP-14, 0.3”) as follows:

( ) 1. at U18.

( ) 2. at U203.

( ) • Install 1 74LS148 (8-line to 3-line priority encoder, DIP-16,0.3”) at U16.

( ) • Install 1 74LS245 (Octal Bus Transceiver, DIP-20, 0.3”) at U202.

• Install 4 74LS540 (Octal buffer/line driver with 3-state outputs,DIP-20, 0.3”) as follows:

( ) 1. at U6.

( ) 2. at U10.

( ) 3. at U13.

( ) 4. at U17.

( ) • Install 1 74LS640 (Octal bus transceivers, DIP-20, 0.3”) at U15.

• Install 2 74HCT646 (Octal bus transceivers and registers with3-state output, DIP-24, 0.3”) as follows:



23

( ) • Install 1 GAL 20V8/22V10 (DIP-24, 0.3”) at U302 (use whenGIDE option installed, see §6.2, page 2).

( ) • Install 1 GAL 16V8 (DIP-20, 0.3”) at U301 (use when GIDEoption installed, see §6.2, page 2).

• Install 2 2732 EPROM (DIP-24, DIP-32, 0.6”) (See §6.13.) asfollows:

( ) 1. at U4 (program with PAM-37, 444-140, see §6.3, page2).

( ) 2. at U3 (program with XCON-8, 444-70, see §6.3, page2).

( ) • Install 1 AS6C1008 (128Kx8 SRAM, DIP-32, 0.6”) (See §6.13.)at U2.

( ) • Install 1 Z80A CPU (4MHz, DIP-40, 0.6”) (See §6.13.) at U1.

( ) • Install 1 ECS-300CX-163.8 Dual Output CMOS Clock Oscilla-tor, 16.384MHz (See §6.13.) at U23.

7.10 Switches

( ) • Install 1 8 position DIP switch (DIP-16, 0.3”) at SWDIP8.

7.11 Voltage Regulators

• Install 2 7805 5V Voltage regulator (TO-220) (See §6.6, page 5.)as follows:

24

( ) 1. at U24.

( ) 2. at U27.

( ) • Install 1 7812 12V Voltage regulator (TO-220) (See §6.6, page5.) at U25 (Used only if 12V power needed.).

( ) • Install 1 7912 -12V Voltage regulator (TO-220) (See §6.6, page5.) at U26 (Used only if -12V power needed.).

7.12 Heatsinks

• Install 4 Heatsink (TO-220, compact, 0.5” width) (See §6.6,page 5.) as follows:

( ) 1. at U24.

( ) 2. at U27.

( ) 3. at U25 (Used only if 12V power needed.).

( ) 4. at U26 (Used only if -12V power needed. Fin may

need to be removed.).

7.13 Electrolytic Capacitors

( ) • Install 1 47µf (electrolytic, 25V, radial, 0.1”) to the right of U25.(See §6.6, page 5 for mechanical considerations.).

7.14 Connectors

• Install 2 25 Position Receptacle Connector 0.100” right anglegold (Samtec BCS-125-L-S-HE, Digi-Key SAM1009-25-ND)

25

as follows:

( ) 1. along right side of board at top.

( ) 2. along right side of board at bottom.

( ) • Install 1 IDE connector, male, 2X20 Box Header Straight, 0.1”spacing, shrouded top left edge of board at IDE (use when GIDE

option installed).

7.15 Brackets

( ) • Install 1 H8 Mounting Bracket (See §6.9, page 7.) along left sideof board.

8 Configuration

1. Install a jumper at X.

2. Install a jumper across 1-2 at Y.

3. Install a jumper across 1-2 at Z.

4. If an AS6C1008 is installed at U2, install jumper at PCB-center

at RAM CONFIG. Otherwise install jumper at BUSS-center.

5. H37 Configuration: If an H37 soft sector controller is installed:

• Install a jumper at H37-center at H37 INT.

• Install a jumper at H37 (1x2 header beneath U16).

26

Figure 7.2: ORG 0 Extended Configuration Settings

27

• Install a jumper at H37 from left-center (1x3 header beneathU16).

• Remove 74LS148 from U16 and plug in interrupt ribbon ca-ble from H37 board. (Ensure pin 1 is correctly positioned.)

If no H37 soft sector controller is installed:

• Install a jumper at center-NO H37 at H37 INT.

• Ensure no jumper at H37 (1x2 header beneath U16).

• Install a jumper at H37 from center-right (1x3 header be-neath U16).

• Ensure 74LS148 is installed at U16 .

6. Install jumper below U4.

7. Install jumper below U3.

8. At 2x3 header below and to the right of U4, install a jumper

between 1-center on U4 and a jumper between center-2 on U3.

9. If you are using the ECS-300CX-160 chip, following the con-

figuration instructions on the silkscreen. If you are using an al-

ternative, follow the instructions for that alternative.

10. Install jumper between 18-center on the Side Select configura-

tion header.

11. Install jumpers at A4, A5, A6 beneath U302.

28

12. Refer to Figure 7.2 on page 27 to set the Extended Configura-

tion 8-position DIP switch. Note the numbering on the switch

may not match the numbering on the silkscreen. Always use the

number on the silkscreen. Also, the mechanism for closing the

switch varies with the switch. Always use the documentation on

the switch to determine the on/off position.

9 Final Assembly

There is a gap between the edge connectors on the right side of the

board. On Heathkit boards there is a solid nylon spacer. The spacer

ensures the board is aligned properly when plugged into the back-

plane. Similar provisions should be made for this board. One easy

solution is to glue a jumper header into gap using Gorilla glue.

The last step is a visual inspection of the board looking for:

• Unsoldered connections• Cold solder joints• Solder bridges• The correct ICs are inserted into their sockets• The ICs are oriented in their socket correctly and there are no

bent pins

• Jumpers are installed correctly

29

Figure 9.1: H37 Interrupt Ribbon Cable

10 Installation

• If the system contains an HA8-8 Extended Configuration Card(commonly known as an ORG 0 board), remove it.

• If you are using the H8-Z80-64K V2.6 for memory (AS6C1008at U2 installed), remove all other memory boards from the sys-

tem.

• On the existing CPU board, unplug the cable at P201. If youare using an H37, also remove the interrupt ribbon cable (see

Figure 9.1 on page 30). Remove the old CPU board.

• Position the H8-Z80-64K V2.6 close to P2 on the backplane.

• If you are using an H37 card, plug the interrupt ribbon cableinto U16. (Ensure pin 1 of the cable is correctly aligned, see

Figure 9.1 on page 30.)

30

• Plug the cable into P201 on the H8-Z80-64K V2.6 board.

• Install the H8-Z80-64K V2.6 at P2 on the backplane. Ensure theedge connectors properly align with the backplane pins.

11 Acknowledgements

The author is grateful for the input and assistance of Norberto Col-

lado, Gary Kaufman and Terry Terry Gulczynski.

31

Appendices

A Resistor Identification

Color Digit Multiplier Tolerance %

Black 0 100

Brown 1 101 1%

Red 2 102 2%

Orange 3 103

Yellow 4 104

Green 5 105 0.5%

Blue 6 106 0.25%

Violet 7 107 0.1%

Grey 8 108

White 9 109

Gold 10−1 5%

Silver 10−2 10%

(none) 20%

Table A.1: Resistor Color Codes

32

Example: The resistor below colored Orange-Orange-Black-Brown-

Violet would be 3.3 kΩ with a tolerance of +/- 0.1%.

B Polarized Devices

A polarized device has positive (anode) and negative (cathode) leads.

Polarized devices must be inserted into the holes that match the

lead’s polarity.

On the H8-Z80-64K V2.6 four polarized devices are used: diodes,

LEDS, tantalum capacitors, and electrolytic capacitors.

B.1 Diodes

Figure B.1: Diode in a DO-35 Package

Figure B.1 on page 33 shows a diode in a DO-35 package. Notice

the black band on the left side of the glass bead. This is the cathode

(“-” lead). This should be aligned with the bar on the silkscreen.

B.2 LEDs

Figure B.2 on page 34 shows a LED. Notice one lead is longer than

the other. The longer lead is the anode (“+”).

33

Figure B.2: LED

B.3 Tantalum Capacitors

Figure B.3: Tantalum Capacitor

Figure B.3 on page 34 shows a tantalum capacitor. Notice one

lead is longer than the other. The longer lead is the anode (“+”).

B.4 Electrolytic Capacitors

Figure B.4: Electrolytic Capacitor

Figure B.4 on page 34 shows a radial electrolytic capacitor. Notice

one lead is longer than the other. The longer lead is the anode (“+”).

34

C Connector Pinouts

C.1 P201 - Front Panel Connector

Pin Dir Description

1 GND

2 In INT20

3 Out EI

4 In INT10

5 In RESET

35

C.2 H8 Backplane Connector

36

D IC Pinouts

74LS00Quad 2-input

NAND gate

74LS02Quad 2-input

NOR gate

74LS04 Hex inverter

74LS10Triple 3-input

NAND

74LS30 8-input NAND

37

74LS32Quad 2-input

OR

74LS38

Quad 2-input

NAND open

collector

outputs

74LS74 Dual D-flop

74LS148

8-line to 3-line

priority

encoder

74LS245Octal Bus

Transceiver

38

74LS540

Octal

buffer/line

driver with

3-state outputs

74LS640Octal bus

transceivers

74HCT646Octal bus

transceivers

273232Kx8

EEPROM

AS6C1008128KBx8

SRAM

39

16V8 GAL

20V8 GAL

22V10 GAL

Z80 CPU

40

E Attachments

The following files are attached. Most PDF viewers allow saving an

attached file by clicking on its pin icon:

444-70-XCON-8.hex: Programming file for XCON-8.

444-70-XCON-8-Checksum.txt: Checksum for XCON-8

444-140-PAM-37.hex: Programming file for PAM-37

444-140-PAM-37-Checksum.txt: Checksum for PAM-37

GIDE-GAL-16V8.pds: Programming file for GAL-16V81.



1Two GALs are required when installing the GIDE option. One is a 16V8. For the other, choose between eithera 20V8 or 22V10 – either will work equally well, but use different programming files. When programming a GAL,ensure you use the pds file designed for that GAL.

41

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3FF7

TITLE Generic IDE GAL IC1PATTERN 01REVISION 02AUTHOR Tilmann RehCOMPANY AutoMeterDATE 26.09.1995

CHIP GIDE1 PALCE16V8

TOG1 A0 CLK A1 /WR A2 A3 /RD /SELQ GND/OE /IORD /RDQ /ENLO LH /IOWR /ENHI /RCLK TOG VCC

STRING CS1ADR '(/A3 * A2 * A1)' ; CS1 Addr. x6..x7STRING DATADR '(A3 * /A2 * /A1 * /A0)' ; CS0/Data Addr. x8STRING TFRADR '(A3 * (A2 + A1 + A0))' ; CS0/Task Addr. x9..xF

SIGNATURE TR-GIDE1

EQUATIONS

LH := /LH * /TFRADR ; FlipFlop: LSB/MSB toggle, ; reset at Task File accesses

/TOG = (DATADR+TFRADR) * SELQ * (RD+WR) ; LH-Clock: Data & Task File

RDQ = RD * /SELQ ; accesses to host peripherals

RCLK = DATADR * SELQ * (RD+WR) * /LH * CLK ; reg. Clock at R/W of data LSB

IORD = (TFRADR+CS1ADR+ DATADR*/LH) * SELQ * RD ; read accesses to drive

IOWR = (TFRADR+CS1ADR+ DATADR*LH) * SELQ * WR ; write accesses to drive

ENHI = DATADR * LH * SELQ * (RD+WR) ; en. MSB output to drive/Bus

ENLO = (TFRADR+CS1ADR) * (RD+WR) * SELQ ; LSB direct transfer (TFR/CS1) + DATADR * (/LH*RD + LH*WR) * SELQ ; LSB transfer (Data)



a7 a6 a0 a4 a1 a2 a3 ja7 a5 ja6 ja5 gndja4 /exp /sel /selq /cs0 /cs1 ia0 ia2 ia1 /rtc /iorq vcc

SIGNATURE TR-GIDE2

EQUATIONS

sel = (a4*ja4+/a4*/ja4)*(a5*ja5+/a5*/ja5) *(a6*ja6+/a6*/ja6)*(a7*ja7+/a7*/ja7) ; address comparator

selq = sel * iorq * (a3+a2) ; interface access x4..xF

ia0 = a0ia1 = a1ia2 = a2 ; signal buffering

; exp = sel * iorq * /a3 * a2 * /a1 * /a0 ; x4 (22V10 only)rtc = sel * iorq * /a3 * a2 * /a1 * a0 ; x5cs1 = sel * /a3 * a2 * a1 ; x6, x7cs0 = sel * a3 ; x8..xF



a7 a6 a0 a4 a1 a2 a3 ja7 a5 ja6 ja5 gndja4 /exp /sel /selq /cs0 /cs1 ia0 ia2 ia1 /rtc /iorq vcc

SIGNATURE TR-GIDE2

EQUATIONS

sel = (a4*ja4+/a4*/ja4)*(a5*ja5+/a5*/ja5) *(a6*ja6+/a6*/ja6)*(a7*ja7+/a7*/ja7) ; address comparator

selq = sel * iorq * (a3+a2) ; interface access x4..xF

ia0 = a0ia1 = a1ia2 = a2 ; signal buffering

exp = sel * iorq * /a3 * a2 * /a1 * /a0 ; x4 (22V10 only)rtc = sel * iorq * /a3 * a2 * /a1 * a0 ; x5cs1 = sel * /a3 * a2 * a1 ; x6, x7cs0 = sel * a3 ; x8..xF

1 Disclaimer of Liability2 Introduction3 Technical Assistance4 Ordering the Card5 Board Views6 Getting Ready6.1 Bill of Material (BOM)6.2 GALs6.3 EPROMs6.4 Identifying Resistor Values6.5 Polarized Components6.6 Mounting the Voltage Regulators6.7 About ICs6.8 Handling Electrostatic Sensitive Devices6.9 H8 Mounting Bracket6.10 Tools and Mechanical Considerations6.11 Soldering6.12 Headers6.13 Clocking And Speed Considerations6.13.1 Gary Kaufman's Daughter Board6.13.2 Half-Can Oscillator6.13.3 Post a Question to the SEBHC Group

7 Assembly and Bill of Material (BOM)7.1 Axial vs Radial7.2 Headers7.3 Resistors7.4 Diodes7.5 LEDs7.6 Capacitors7.7 Tantalum Capacitors7.8 Sockets7.9 Intergrated Circuits7.10 Switches7.11 Voltage Regulators7.12 Heatsinks7.13 Electrolytic Capacitors7.14 Connectors7.15 Brackets

8 Configuration9 Final Assembly10 Installation11 AcknowledgementsA Resistor IdentificationB Polarized DevicesB.1 DiodesB.2 LEDsB.3 Tantalum CapacitorsB.4 Electrolytic Capacitors

C Connector PinoutsC.1 P201 - Front Panel ConnectorC.2 H8 Backplane Connector

D IC PinoutsE Attachments

H8-Z80-64K CPU / Memory / GIDE Card Assembly, Conﬁguration...

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Transcript of H8-Z80-64K CPU / Memory / GIDE Card Assembly, Conﬁguration...