GSM Platform Flexibility - Universal Instruments … in Electronic Assembly Surface Mount Division...

Automation in Electronic AssemblySurface Mount Division of Universal Instruments

GSM® PlatformFlexibility

Component Placement, Adhesive Dispensing,and Vision/Inspection Solutions

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Universal Instruments is a global provider ofinnovative electronic circuit assembly technol-ogy and equipment, integrated systems solutions, and process expertise. Universalserves the top manufacturers in every cate-gory of the electronics industry worldwidethrough more than 65 sales, service, producttraining, and parts distribution centers inmore than 30 countries.

Universal has an installed base of more than18,000 machines worldwide — including sur-face mount, through hole, odd form, advancedsemiconductor assembly, and board handlingequipment — and certification to the ISO 9001and the QS-9000/TE quality standards.Universal is well positioned to offer the serviceand expertise that only a truly innovative andglobal organization can support.

About Universal Instruments

Universal Instrumentswww.uic.comE-Mail: [email protected]

USA Corporate Headquarters

Tel: +1-800-432-2607+1-607-786-8104

Total Support 17

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Contents

The flexible Universal GSM Platform may beconfigured with a variety of heads for component placement and/or adhesive dispensing, and features a number of visionsystems for component inspection. This catalog includes descriptions and specifica-tions for various heads and cameras to helpyou make the optimal choices for your needs.

Doing It All: Placement, Dispensing, Inspection 2

Adhesive Dispensing SolutionsArchimedes Metering Valve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Positive Displacement Pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Dot Inspection Station . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Component Placement SolutionsFlexJet® Head. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4Flex Head. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6High Force Head . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8UFP 300+ Head . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Vision/Inspection SolutionsFlexJet On-the-Head Camera Optics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Upward Looking Cameras Using Vision-on-the-Fly Technology . . . . . . . . . . . . . . . . . . . . . . . . . 14

Standard and Circular Upward-Looking Cameras . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14On-Axis Lighting Camera . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Odd Form Camera . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Standard Pattern Error Correction Camera . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16UniversaLight® Illumination Module: Advanced Pattern Error Correction

Lighting System (APECS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

The use of standard interfaces for all heads (aswell as feeders and cameras) maximizesequipment utilization and provides anupgrade path for future growth, ensuring protection for your capital investment. Thiscommonality enables Universal todevelop new options to enhancespeed, accuracy, and flexibility, significantly improving theperformance of the GSMPlatform with minimalimpact on the investment inthe basic machine.

Component PlacementThe key to the great flexibility of the GSMPlatform is the easy interchangeability of thevarious component placement heads. Thismodular design allows the GSM Platform tohandle the full range of components andquickly respond to changing product mixes.The ability to use different heads simplifiesline balancing and enables true mixed technology applications, expanding theprocess range of your entire line.

Doing It All: Placement, Dispensing, Inspection

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Vision/InspectionVision recognition and processing is criticalfor accurately placing leaded and areaarray components, from small chips tolarge connectors, as well as chipscale packages (CSPs) and flipchips. With such a broad range ofcomponents available for use ontoday’s board designs, machinevision capabilities are more impor-tant than ever.

The GSM Platform supports twoupward-looking cameras, as well as on-the-head camera inspection with certain heads,reducing travel distances tocamera stations and thereby allowing theGSM Platform to handle a wider range ofcomponents at faster speeds. Multiple cameras enable you to combine differentmagnifications on the same machine, seamlessly handling everything from chips toCSPs to connectors.

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Adhesive DispensingA Universal GSM Platform machine equippedwith dispensing heads works well with bothmixed-vendor and dedicated Universal lines toboost speed and increase versatility—aspects vital to success in high-speed, high changeover assembly environments.

Dedicated dispensers can suffer utilization levels as low as 20%. In contrast, the GSM Platform can easily be retooled to combine component placement with dispensing capability. Dispensing heads can be exchanged quickly to meet a variety of assembly demands and offer maximum performance. For example, a GSM Platformconfigured with a placement head and a dispensing head becomes a true mixed technology machine, presenting a wide arrayof manufacturing options that increase overallline utilization and throughput. This reducescycle times, generating a return on investmentin as little as three months.

Universal’s newest head technology, theFlexJet Head offers the best mix of flexibilityand speed for most surface mount applica-tions. The head accommodates high speedchip placement and fine pitch componentplacement of 0402 chips to 50 mm squarecomponents. It uses seven on-the-head camera CCDs to inspect components up to 25mm square during travel to the PC board, thuseliminating the need for a separate Upward-Looking Camera inspection step.Larger components up to 50mm square areinspected using an Upward-Looking Camerato perform “vision-on-the-fly.” Seven spindlesare arranged in 20 mm spacing for full gangpicking from 8 mm and 12 mm feeders.

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FlexJet Head

FlexJet Head on GSM Platform: Placement SpecificationsComponent placement force range 150 - 1000 g in 10 g incrementsFinal placement performance1 75% lead to pad @ 4 σ by placement (≤ 50 dpm)Intrinsic availability ≤ 98%

1 Assumes: lead width = pitch x 0.5; pad width = lead width x 1.25; span = 38.1 mm (1.5").

Specifications Component Placement

FlexJet Head on GSM Platform: Placement Performance Specifications1

Component Type Axes Upward-Looking Camera On-the-Head InspectionInspection

Leaded and arraycomponents X, Y ±62 µm with Cpk ±62 µm with Cpk

≥ 1.33 (Cp ≥ 1.67) ≥ 1.33 (Cp ≥ 1.67)θ ±0.2° with Cpk ±0.2° with Cpk

≥ 1.33 (Cp ≥ 1.67) ≥ 1.33 (Cp ≥ 1.67) Chips X, Y ±100 µm with Cpk ±100 µm with Cpk

≥ 1.33 (Cp ≥ 1.67) ≥ 1.33 (Cp ≥ 1.67)

1 Verified with all components of variation included: all spindles at all rotations over entire placement area formultiple boards, and for each head and camera combination. Glass slugs placed on glass plate. Data analyzedby placement site. Components of 0.5 mm lead pitch or finer should be placed using the Upward-LookingCamera.

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FlexJet Head on GSM Platform: Selected Throughput SpecificationsTact Time Cph

Single-Beam GSM Platformwith 1 FlexJet Head

1 Components ≤12 mm square 0.36 second 10000 cph2 Components >12 mm – ≤25 mm square 0.51 second 7000 cph3 Components >25 mm – ≤32 mm square 1.00 second 3600 cph4 Components >32 mm Application dependent

Dual-Beam GSM Platformwith 2 FlexJet Heads

1 Components ≤12 mm square 0.18 second 20000 cph2 Components >12 mm – ≤25 mm square 0.36 second 10000 cph3 Components >25 mm – ≤32 mm square 0.80 second 4500 cph4 Components >32 mm square Application dependent

GSM throughput specifications have been achieved by running benchmark products with the following significant characteristics. All throughput specifications exclude board transfer, fiducial inspection, and badboard sense times. Actual product throughput may vary with each application.1 Based on 1206-chip component placements from 8 mm tape feeders on a 457.2 mm x 406.4 mm (18" x 16")board with feeder duplication, gang picking, and On-The-Head Centering (FlexJet Head) or 4.0 mil/pixel UpwardLooking Camera Station (Flex or High Force Heads). Can be verified using 1206 Speed Verification Kit, part number 48884501.2 Based on (42) PLCC 44 component placements from 32 mm Multi-Pitch Tape Feeders on a 254.0 mm x 203.2 mm(10" x 8") board with feeder duplication, gang picking, and On-The-Head Centering (FlexJet Head) or 4.0 mil/pixelUpward Looking Camera Station (Flex or High Force Heads). Can be verified using PLCC 44 Speed Verification Kit,part number 48884601.3 Based on (36) PLCC 84 component placements from 44 mm Multi-Pitch Tape Feeders on a 254.0 mm x 203.2 mm (10" x 8") board with feeder duplication and 4.0 mil/pixel Upward Looking Camera. Can be verifiedusing PLCC 84 Speed Verification Kit, part number 48884701.4 Application dependency is related to component type and size, feeder packaging, accessory feeders such as PTF or shuttle, component features programmed, and any requirements for special nozzles.

FlexJet Head on GSM Platform: Component Handling CapabilitiesUpward-Looking Camera On-the-HeadInspection Inspection

Component Dimension Minimum Maximum Minimum Maximum Maximum(without (with theta rotation) theta rotation)

Length 0.500 mm 50.8 mm 0.500 mm 25.4 mm 17.960 mm (0.020") (2.000") (0.020") (1.000") (0.707")

Width 1.000 mm 50.8 mm 1.000 mm 25.4 mm 17.960 mm (0.040") (2.000") (0.040") (1.000") (0.707")

Height 0.150 mm 12.700 mm 0.150 mm 11.68 mm 11.68 mm (0.006") (0.500")1 (0.006") (0.460") (0.460")

Lead width 0.001 mm 0.007 mm(0.00004") (0.00028")

Lead pitch 0.002 mm 0.013 mm(0.000079") (0.0005")

Bump pitch 0.004 mm 0.026 mm(0.00016") (0.001")

Bump diameter 0.002 mm 0.013 mm(0.000079") (0.0005")

Maximum component weight2 35 g

1 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM Platform has placed a 25.4 mm (1.0") tall electrolytic capacitor with special considerations.2 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM Platform has placed a 56 g CCGA using a specific vacuum nozzle.

The GSM 4-Spindle Flexible Pick and PlaceHead accommodates the full range of surfacemount components from 0402 chips to large304-pin fine pitch Quad Flat Pack componentsto large CCGA and BGA area array devices. Fourspindles are arranged in 40 mm spacing forfull gang picking from 8, 12, 16, 24, and 32 mmfeeders. Each spindle accepts a wide variety ofplacement nozzles, including grippers, toaccommodate the broadest range of compo-nents and applications. Vision inspectionrequires an Upward-Looking Camera station.

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Flex Head

Flex Head on GSM Platform: Placement SpecificationsComponent placement force range 150 - 450 g – in 100 gram incrementsFinal placement performance1 75% lead to pad @ 6 σ by placement (≤ 50 dpm)Intrinsic availability ≤ 98%

1 Assumes: lead width = pitch x 0.5; pad width = lead width x 1.25; span = 38.1 mm (1.5").

Flex Head on GSM Platform: Placement Performance Specifications1

Axes Accuracy RepeatabilityX, Y ±50 µm @ ±5 σ (Cp≥ 1.67), Cpk ≥ 1.5 ≤ 10 µm θ ±0.2° @ ±5 σ (Cp ≥ 1.67), Cpk ≥ 1.5 ≤ 0.04°

1 Verified with all components of variation included: all spindles at all rotations over entire placement area formultiple boards, and for each head and camera combination. Glass slugs placed on glass plate.


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Flex Head on GSM Platform: Selected Throughput SpecificationsTact Time Cph

Single-Beam GSM Platformwith 2 Flex Heads

1 Components ≤12 mm square 0.67 second 5400 cph2 Components >12 mm – ≤25 mm square 0.90 second 4000 cph

3 Components >25 mm – ≤32 mm square 1.64 seconds 2200 cph

4 Components >32 mm square Application dependent

Dual-Beam GSM Platformwith 2 Flex Heads

1 Components ≤12 mm square 0.36 second 10000 cph2 Components >12 mm – ≤25 mm square 0.60 second 6000 cph

3 Components >25 mm – ≤32 mm square 0.90 second 4000 cph


GSM throughput specifications have been achieved by running benchmark products with the following significant characteristics. All throughput specifications exclude board transfer, fiducial inspection, and badboard sense times. Actual product throughput may vary with each application.1 Based on 1206-chip component placements from 8 mm tape feeders on a 457.2 mm x 406.4 mm (18" x 16")board with feeder duplication, gang picking, and On-The-Head Centering (FlexJet Head) or 4.0 mil/pixel UpwardLooking Camera Station (Flex or High Force Heads). Can be verified using 1206 Speed Verification Kit, part number 48884501.2 Based on (42) PLCC 44 component placements from 32 mm Multi-Pitch Tape Feeders on a 254.0 mm x 203.2 mm(10" x 8") board with feeder duplication, gang picking, and On-The-Head Centering (FlexJet Head) or 4.0 mil/pixelUpward Looking Camera Station (Flex or High Force Heads). Can be verified using PLCC 44 Speed Verification Kit,part number 48884601.3 Based on (36) PLCC 84 component placements from 44 mm Multi-Pitch Tape Feeders on a 254.0 mm x 203.2 mm (10" x 8") board with feeder duplication and 4.0 mil/pixel Upward Looking Camera Station. Can be verified using PLCC 84 Speed Verification Kit, part number 48884701.4 Application dependency is related to component type and size, feeder packaging, accessory feeders such as PTF or shuttle, component features programmed, and any requirements for special nozzles.


Flex Head on GSM Platform: Component Handling CapabilitiesComponent Dimension Minimum MaximumLength 0.500 mm (0.020") 50.8 mm (2.000")Width 1.000 mm (0.040") 50.8 mm (2.000")Height 0.150 mm (0.006") 12.700 mm (0.500")Maximum component weight1 35 g

1 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM Platform has placed a 56 g CCGA using a specific vacuum nozzle.

The High Force version of the GSM 4-SpindleFlexible Pick and Place Head accommodatesthe broadest range of components on theGSM Platform. The higher placement forcerange of 175 g to 2500 g accommodates placement of flip-chip (C4) and odd form components (axial, radial, headers, connectors,snap-in devices, etc.), as well as the full rangeof standard surface mount devices. Low placement force applications down to 50 g arealso available with the High Force Head usingspecial software and nozzles.

Four spindles are arranged in 40 mm spacingfor full gang picking from 8, 12, 16, 24 mm, and32 mm feeders. Each spindle accepts a widevariety of placement nozzles, including grippers, to accommodate the broadest rangeof components and applications. Visioninspection requires an Upward-LookingCamera station.

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High Force Head

High Force Head on GSM Platform: Placement SpecificationsComponent placement force range1 175 - 2500 gFinal placement performance2 75% lead-to-pad @ 6 σ by placement (≤ 50 dpm)Intrinsic availability ≤ 98%

1 Requires the optional Pressure Enhancement Kit and Transducer Readout Assembly for calibration and maintenance.2 Assumes: lead width = pitch x 0.5; pad width = lead width x 1.25; span = 38.1 mm (1.5").

High Force Head on GSM Platform: Placement Performance Specifications1

Axes Accuracy RepeatabilityX, Y ±50 µm @ ±5 σ (Cp≥ 1.67), Cpk ≥ 1.5 ≤ 10 µm θ ±0.2° @ ±5 σ (Cp ≥ 1.67), Cpk ≥ 1.5 ≤ 0.04°



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High Force Head on GSM Platform: Selected Throughput SpecificationsTact Time Cph

Single-Beam GSM Platformwith High Force Head

1 Components ≤12 mm square 0.080 second 4500 cph2 Components >12 mm – ≤25 mm square 1.03 seconds 3500 cph

3 Components >25 mm – ≤32 mm square 1.80 seconds 2000 cph


GSM throughput specifications have been achieved by running benchmark products with the following significant characteristics. All throughput specifications exclude board transfer, fiducial inspection, and badboard sense times. Actual product throughput may vary with each application.1 Based on 1206-chip component placements from 8 mm tape feeders on a 457.2 mm x 406.4 mm (18" x 16")board with feeder duplication, gang picking, and On-The-Head Centering (FlexJet Head) or 4.0 mil/pixel UpwardLooking Camera Station (Flex or High Force Heads). Can be verified using 1206 Speed Verification Kit, part number 48884501.2 Based on (42) PLCC 44 component placements from 32 mm Multi-Pitch Tape Feeders on a 254.0 mm x 203.2 mm(10" x 8") board with feeder duplication, gang picking, and On-The-Head Centering (FlexJet Head) or 4.0 mil/pixelUpward Looking Camera Station (Flex or High Force Heads). Can be verified using PLCC 44 Speed Verification Kit,part number 48884601.3 Based on (36) PLCC 84 component placements from 44 mm Multi-Pitch Tape Feeders on a 254.0 mm x 203.2 mm (10" x 8") board with feeder duplication and 4.0 mil/pixel Upward Looking Camera Station. Can be verified using PLCC 84 Speed Verification Kit, part number 48884701.4 Application dependency is related to component type and size, feeder packaging, accessory feeders such as PTF or shuttle, component features programmed, and any requirements for special nozzles.


High Force Head on GSM Platform: Component Handling CapabilitiesComponent Dimension Minimum MaximumLength 0.500 mm (0.020") 50.8 mm (2.000")Width 1.000 mm (0.040") 50.8 mm (2.000")Height 0.150 mm (0.006") 12.700 mm (0.500")Maximum component weight1 35 g


The single-spindle UFP 300+ Head providesultra fine pitch placement accuracy andrepeatability best suited for lab, prototype,and research environments. The head providesplacement force capabilities of up to 10,000 gfor ultra high force applications such as snap-in Mictor® connectors. Ultra fine pitchapplications include 304-pin and larger QuadFlat Packs, and other applications with leadpitch sizes less than 0.010" and rotationalincrements as small as 0.001°.

The head accepts Flex Head nozzles to accommodate the broadest range of compo-nents and applications. Vision inspectionrequires an Upward-Looking Camera station.

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UFP 300+ Head

UFP 300+ Head on GSM Platform: Placement SpecificationsComponent placement force range 150 - 10000 gFinal placement performance 50 defects per million (dpm)Intrinsic availability ≤ 98%

UFP 300+ Head on GSM Platform: Placement Performance Specifications1

Axes Accuracy RepeatabilityX, Y ±38 µm @ ±5 σ (Cp≥ 1.67), Cpk ≥ 1.5 ≤ 7.6 µm θ ±0.1° @ ±5 σ (Cp ≥ 1.67), Cpk ≥ 1.5 ≤ 0.02°


UFP 300+ Head on GSM Platform: Selected Throughput SpecificationsPlacement rate1 800 components per hour (cph)

1 Based on picking 304-pin glass slugs from a matrix tray using a high magnification (1.0 mil/pixel) camera.


UFP 300+ Head on GSM Platform: Component Handling CapabilitiesComponent Dimension Minimum MaximumLength 0.500 mm (0.020") 50.8 mm (2.000")Width 1.000 mm (0.040") 50.8 mm (2.000")Height 0.150 mm (0.006") 12.700 mm (0.500")Maximum component weight1 35 g


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The Archimedes Metering Valve (AMV) dis-pensing head features direct drive technology,which effectively eliminates uneven clutchapplication times resulting in dot diametervariations. It is based on encoder-driven rotaryscrew technology with a closed loop servocontrol, offering precise control that enablesmultiple dot sizes with one spindle. This sig-nificantly decreases downtime related to dotdiameter setup.

It is an ideal choice for SMT glue, solder paste,silver-filled epoxies, and other particle suspensions. Offering excellent flexibility indot size and material range, the AMV head isparticularly well-suited to high-mix/high-changeover production lines where maximumflexibility of dot size is required.

Archimedes Metering Valve

Specifications Adhesive Dispensing

Archimedes Metering Valve: Dispensing SpecificationsCartridges 10 cc and 30 cc, customer suppliedIntrinsic availability 98%

Nominal1 Verified1

X, Y accuracy ±0.020 mm (±0.0008") ±0.076 mm (±0.003")X, Y repeatability (σ) ≤0.018 mm (≤0.0007") ≤0.051 mm (≤0.002")Diameter repeatability (σ) ≤0.013 mm (≤0.0005") ≤0.038 mm (≤0.0015")

1 Based on 0.508 mm (0.020") dot at 2.54 mm (0.100") X, Y, and Z.

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The Dot Inspection Station provides all the necessary tools to perform material dotinspection. This feature automatically calibrates adhesive deposition and verifies dotdiameter and placement during production. It can be utilized during production mode or prior to production mode to assist the operator with the setup of a particular dot size.

This feature allows the machine to move the dispense head to an inspection area and dispense a pre-determined row of dots.Once the dots are dispensed, the beam positions the PEC camera over the dots so they can be inspected. Automating this function dramatically reduces applicationproduct errors.

The material dot inspection feature is includedin the UPS 4.2.1 software release and encom-passes the following software functions:• Dot Setup Assist• Dot Inspection• Production Dot/Head Calibration• Production Dot Purge• Component Dot Check• Component Dot Purge

Two Dot Inspection Kits are available:48752902 Dot Inspection Kit: For single-beamGSM Platform machines with existing feederbanks. Includes special backlit Dot InspectionFeeder Station and all necessary materials anddocumentation.

48754601 Dot Inspection Kit: For single-beamGSM Platform machines already equippedwith dispense head(s) but no feeder banks.Includes special backlit Dot Inspection FeederStation, 8-Slot Feeder Bank, and all necessarymaterials and documentation.

Dot Inspection Station

Dot Inspection Station SpecificationsNominal1 Verified1

X, Y accuracy ±0.020 mm (±0.0008") ±0.076 mm (±0.003")X, Y repeatability (σ) ≤0.018 mm (≤0.0007") ≤0.051 mm (≤0.002")Diameter repeatability (σ) ≤0.013 mm (≤0.0005") ≤0.038 mm (≤0.0015")

1 Based on 0.508 mm (0.020") dot at 2.54 mm (0.100") X, Y, and Z.

Specifications Adhesive Dispensing

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The FlexJet head includes a 2.6 mil per pixelOn-the-Head (OTH) camera that incorporatesfront (45°), side (5°), and on-axis lighting, pro-grammable on a spindle-specific basis. Duringcomponent inspection, the mirror cycles intoposition and illumination is applied. Sevenindividual spindle CCDs capture componentinspection images through a series of mirrorsand send them to the ESI® vision engine forprocessing, while the FlexJet head travels tothe placement sites on the PC board.

FlexJet On-the-Head Camera Optics

Specifications Vision/Inspection

FlexJet On-the-Head Vision Specifications1

Magnification 2.6 mil per pixelMaximum field of view2 25.4 mm (1.0")Leadless components

minimum length 0.838 mm (0.033")minimum length 0.419 mm (0.017")

Leaded componentsminimum lead pitch3 0.335 mm (0.013")minimum lead width (without inspection) 0.168 mm (0.007")minimum lead width (with inspection) 0.210 mm (0.008")

Multi-pattern componentsminimum feature length 2.096 mm (0.083")minimum feature width 0.210 mm (0.008")

BGA & C4 componentsminimum bump pitch4 0.671 mm (0.026")minimum bump diameter4 0.335 mm (0.013")

1 Actual component dimensions will vary depending on pick tolerance applied.2 Assumes a default ±1.905 mm (0.075") pick tolerance.3 Assumes a 2.0 pixel minimum separation distance between leads.4 Maximum number of bumps is 2,500.

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Upward-Looking Cameras accommodate frontand back lighting for component inspection.For front lighting, the inner LED banks arestrobed as the vision system captures thefront image of the component. For back lighting, the back light towers strobe the twoouter LED banks, illuminating the special backlighting nozzle. The vision system captures thesilhouette of the component. Back lightingcannot be used with components that requiremultiple fields of view.

The circular lighting camera provides a 360°low angle lighting scheme for optimal illumination of component features, such asPLCC socket leads, BGA bumps, and standardthrough hole leads. Circular lighting applications should be reviewed by theUniversal GSM Platform ApplicationsEngineering Group due to the elimination ofcomponent back lighting capability and theelimination of two extra feeder slots (one oneach side of the camera).

Standard and Circular Upward-Looking Cameras

For components up to 32 mm square (1.25"),the GSM Platform performs vision inspectionwith Upward-Looking Cameras in a singlefiled of view using “vision-on-the-fly” technol-ogy. It can pick components and pass over an Upward-Looking Camera at 20" per second.While the head passes over the camera, the vision system captures componentimages. The head then places the componentsat the vision-adjusted coordinates.

For components that do not fit into a single field of view, the head stops over theUpward-Looking Camera, then captures multiple fields of view to acquire the entirecomponent image.

Upward Looking Cameras UsingVision-on-the-Fly Technology

The GSM Platform supports two Upward-Looking Cameras, one in the front feeder areaand one in the rear. Two cameras reduce thetravel distance to the camera and allow theGSM Platform to efficiently handle a greaterrange of components.

Vision Specifications*Magnification 1.0 mil per pixel 2.6 mil per pixel 4.0 mil per pixelMaximum field of view1 8.270 mm (0.326") 20.348 mm (0.326") 33.358 mm (1.313")Leadless components

minimum length 0.330 mm (0.013") 0.660 mm (0.026") 1.016 mm (0.040")minimum length 0.165 mm (0.007") 0.330 mm (0.013") 0.508 mm (0.020")

Leaded components minimum lead pitch2 0.132 mm (0.005") 0.264 mm (0.010") 0.406 mm (0.016")minimum lead width

(without inspection) 0.083 mm (0.003") 0.132 mm (0.005") 0.203 mm (0.008")minimum lead width

(with inspection) 0.083 mm (0.003") 1.651 mm (0.065") 0.254 mm (0.010")Multi-pattern components

minimum feature length 0.826 mm (0.033") 1.651 mm (0.065") 2.540 mm (0.100")minimum feature width 0.083 mm (0.003") 1.651 mm (0.065") 0.254 mm (0.010")

BGA & C4 componentsminimum bump pitch3 0.264 mm (0.010") 0.528 mm (0.021") 0.813 mm (0.032")minimum bump diameter3 0.132 mm (0.005") 0.264 mm (0.010") 0.406 mm (0.016")

1 Assumes a default ±1.905 mm (0.075") pick tolerance.2 Assumes a 2.0 pixel minimum separation distance between leads.3 Maximum number of bumps is 2,500.*Note: Specifications apply to Flex, HIgh Force, and UFP 300+ heads. Further limitations apply to FlexJet head. Refer to Component Handling Capabilities table in the FlexJet section.


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The On-Axis Lighting (OAL) camera buildsupon the capabilities of existing front and circular lighting cameras by incorporating illumination and software specificallydesigned to enhance the imaging of highlyspecular packages, such as BGAs, CCGAs, andpalladium-leaded components.

From a hardware standpoint, the OAL camera provides on-axis illumination toobtain crisp images. From a software standpoint, three enhancements aid in processing CCGA components:• Missing column inspection: inspects various

area-array packages for missing columns.• Pitch inspection: verifies the distance

between component columns or bumps.• “Sweet spot” lighting: provides maximum

illumination of the component area being inspected.

On-Axis Lighting Camera

This camera offers vision-assisted placementof odd form and light electromechanicalassembly components. Available in a standardmagnification of 4 mils per pixel, it employs aspecial “cone” cover. The cone helps direct thelight in such a way that the ends of odd formcomponents can be seen. The cone opening isonly 1-1/8" wide.

Odd Form Camera

On-Axis Lighting Camera: Vision Specifications*Magnification 2.6 mil per pixel 4.0 mil per pixelMaximum field of view1 33.358 mm (1.313") 33.358 mm (1.313")Leadless components

minimum length 1.016 mm (0.040") 1.016 mm (0.040")minimum length 0.508 mm (0.020") 0.508 mm (0.020")

Leaded componentsminimum lead pitch2 0.406 mm (0.016") 0.406 mm (0.016")minimumlead width

(without inspection) 0.203 mm (0.008") 0.203 mm (0.008")minimumlead width

(with inspection) 0.254 mm (0.010") 0.254 mm (0.010")Multi-pattern components

minimum feature length 2.540 mm (0.100") 2.540 mm (0.100")minimum feature width 0.254 mm (0.010") 0.254 mm (0.010")

BGA & C4 componentsminimum bump pitch3 0.813 mm (0.032") 0.813 mm (0.032")minimum bump diameter3 0.406 mm (0.016") 0.406 mm (0.016")

1 Assumes a default ±1.905 mm (0.075") pick tolerance.2 Assumes a 2.0 pixel minimum separation distance between leads.3 Maximum number of bumps is 2,500.*Note: Specifications apply to Flex, HIgh Force, and UFP 300+ heads. Further limitations apply to FlexJet head. Refer to Component Handling Capabilities table in the FlexJet section.

Odd Form Camera: Vision Specifications*Magnification 4.0 mil per pixel with High Force HeadMaximum field of view1 20.193 mm (0.795")Leadless components

minimum length 1.016 mm (0.040")minimum length 0.508 mm (0.020")

Leaded componentsminimum lead pitch2 0.406 mm (0.016")minimum lead width

without inspection) 0.203 mm (0.008")minimum lead width

(with inspection) 0.254 mm (0.010")Multi-pattern components

minimum feature length 2.540 mm (0.100")minimum feature width 0.254 mm (0.010")

BGA & C4 componentsminimum bump pitch3 0.813 mm (0.032")minimum bump diameter3 0.406 mm (0.016")

1 Assumes a default ±1.905 mm (0.075") pick tolerance.2 Assumes a 2.0 pixel minimum separation distance between leads.3 Maximum number of bumps is 2,500.* Note: Specifications apply to Flex, HIgh Force, and UFP 300+ heads. Further limitations apply to FlexJet head. Refer to Component Handling Capabilities table in the FlexJet section.

16

The PEC Camera is used to inspect fiducials,pad sites, and bad sense marks on the PC board prior to component placement.Fiducial inspection information is then used tocorrect component placement locations for X, Y, and θ shifts related to board location, aswell as linear board distortions such as stretch,shrink, and non-orthogonality.

The PEC Camera is mounted under the beamin the GSM Platform overhead gantry positioning system: under the one beam in theGSM1 (Single Beam) Platform, and under bothbeams in the GSM2 (Dual Beam) Platform.

Standard Pattern ErrorCorrection (PEC) Camera

This advanced system is an innovative lightingsolution that provides high-contrast imagingof a wide variety of ceramic and polyimide flexsubstrates. It is uniquely capable of distinguishing features from the substratebackground, by providing the flexibility to easily select wavelength; polarized, unpolar-ized, or cross-polarized lighting; and an innerlighting ring for higher-angle illumination.

The UniversaLight module’s symmetric illumination creates sharp edges and goodcontrast, reducing “noise,” and its use of blue,rather than red, light provides large differences in light absorption characteristics– resulting in high contrast imaging.

UniversaLight Illumination Module: AdvancedPattern Correction Lighting System (APECS)


Universal backs all its high-quality productswith extensive full-service product support,including: field engineering services; tele-phone consultation with technical specialists;applications engineering; integration and systems consulting; training; compatible soft-ware; worldwide spare parts; innovativefinancing options; and process expertise fromUniversal’s Advanced Process/Surface MountTechnology Laboratory (SMT Lab).

Specifically, Universal offers “total solution”support for all component feeding solutions:

Application Engineering: Based on your specific product and production requirements,Universal engineers develop the optimal GSMPlatform configuration to meet your needs.

Technological Leadership: The SMT Lab provides unsurpassed research and processexpertise, to solve specific process-relatedproblems quickly.

Systems Integration: Universal engineerswork with you to optimize board designs,ensure the integrity of assembly processdesign, integrate multi-vendor equipment,and provide system modeling and simulationfor maximum throughput. In addition,Universal can provide turnkey solutions forspecific products.

Process and Product Support: Universal alsooffers around-the-clock parts service, customer training on three continents, and aglobal network of more than 300 direct fieldengineers. In addition, you can access a number of Web-based support tools and partsordering 24 hours a day.

Total Support

European HeadquartersGermany Tel: +49-621-845-5158

Asian HeadquartersHong Kong Tel: +852-2723-2800

UNIVERSAL, the Circle “U”, the UniversalLogo, GSM, FlexJet, and UniversaLight areRegistered Trademarks for Products andServices of Universal InstrumentsCorporation.

©2001 Universal Instruments Corporation.All Rights Reserved. All Specificationsare Subject to Change Without Notice.

MC-3131 7/01

Universal Instrumentswww.uic.comE-Mail: [email protected]

USA Corporate Headquarters

Tel: +1-800-432-2607+1-607-786-8104

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